JP2914795B2 - Double-sided flexible printed wiring board - Google Patents
Double-sided flexible printed wiring boardInfo
- Publication number
- JP2914795B2 JP2914795B2 JP3221719A JP22171991A JP2914795B2 JP 2914795 B2 JP2914795 B2 JP 2914795B2 JP 3221719 A JP3221719 A JP 3221719A JP 22171991 A JP22171991 A JP 22171991A JP 2914795 B2 JP2914795 B2 JP 2914795B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- printed wiring
- wiring board
- double
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Combinations Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、両面フレキシブルプリ
ント配線板に関するもので、詳しくは、フレキシブルプ
リント配線板の圧接によるコネクタ部の圧接力を高め、
信頼性を向上させ、かつ、配線板スペースを有効的に利
用したパターン配線を有するプリント配線板に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided flexible printed wiring board, and more particularly, to increasing a pressing force of a connector portion by pressing a flexible printed wiring board.
The present invention relates to a printed wiring board having a pattern wiring which improves reliability and effectively uses a wiring board space.
【０００２】[0002]
【従来の技術】従来、フレキシブルプリント配線板を他
のプリント配線板に接続する場合、接続すべき信号配線
をプリント配線板表面のカバーフィルムを除去し、パタ
ーン表面に金メッキ等をほどこし、互いの表面どうしを
面接触させ、弾性ゴム等を圧接させて、２枚のプリント
配線板の信号を接続させる手段がとられていた。2. Description of the Related Art Conventionally, when a flexible printed wiring board is connected to another printed wiring board, a signal wiring to be connected is removed by removing a cover film on the surface of the printed wiring board, applying gold plating or the like to a pattern surface, and applying a wiring to each other. Means have been adopted in which the two printed wiring boards are connected by surface-to-surface contact, elastic rubber or the like being pressed into contact with each other.
【０００３】このとき、両面フレキシブルプリント基板
を使用する場合、図７のように、接続するカバーフィル
ム４３を除去し、表面に金メッキされたコネクトパター
ン４２のベース部４１に対する裏側は銅箔を除去し、両
面フレキシブルプリント配線板自体の剛性を少なくして
弾性ゴムの圧接力を適確に伝えられるようになされてい
た。At this time, when a double-sided flexible printed board is used, as shown in FIG. 7, the cover film 43 to be connected is removed, and the copper foil is removed from the back side of the base portion 41 of the gold-plated connect pattern 42. In addition, the rigidity of the double-sided flexible printed wiring board itself is reduced so that the pressing force of the elastic rubber can be transmitted accurately.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、図７に
示した従来例のように、両面フレキシブルプリント配線
基板において、接続する金メッキされたコネクトパター
ン４２の裏側を、完全にパターンを除去してしまうと、
コネクトパターン４２の本数がふえるほど、パターン配
線ができない面積が大きくなり、配線に制約ができる。
また基板上の配線できる面積が少なくなるため、基板面
積を広げなければならないという問題点があった。However, as in the conventional example shown in FIG. 7, if the pattern is completely removed from the back side of the gold-plated connect pattern 42 to be connected in the double-sided flexible printed circuit board. ,
As the number of connect patterns 42 increases, the area where pattern wiring cannot be performed increases, and wiring can be restricted.
In addition, there is a problem that the area of the substrate must be increased because the area on the substrate that can be wired is reduced.
【０００５】また図８のように、コネクトパターンのベ
ース部５１の裏側に表面側のカバーフィルム５３を除去
したコネクトパターン５２を横断するよう配線５５も実
施されているが、表面側のコネクトパターン以外の部分
の裏側にもパターンが通るため、フレキシブルプリント
配線板がコネクトパターンと直交方向に剛性が増し、コ
ネクトパターンの裏側にコネクトパターンを横切る配線
パターンがない図７の従来例に比べ、コネクト部分の圧
接力が低下してしまうという問題点があった。As shown in FIG. 8, wiring 55 is also provided on the back side of the base portion 51 of the connect pattern so as to cross the connect pattern 52 from which the cover film 53 on the front side has been removed. 7, the rigidity of the flexible printed wiring board increases in the direction orthogonal to the connect pattern, and there is no wiring pattern crossing the connect pattern on the back side of the connect pattern. There is a problem that the pressing force is reduced.
【０００６】本発明は、上記のような問題点を解決しよ
うとするものである。すなわち、本発明は、コネクトパ
ターンの圧接力を増加させ、コネクトパターンの裏側に
も、パターン配線を可能とし、プリント基板上の配線を
より有効に行なうことができる両面フレキシブルプリン
ト配線板を提供することを目的とするものである。[0006] The present invention is intended to solve the above problems. That is, the present invention provides a double-sided flexible printed wiring board that increases the pressure contact force of a connect pattern, enables pattern wiring also on the back side of the connect pattern, and can more effectively perform wiring on a printed circuit board. It is intended for.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、両面フレキシブルプリント配線板の表面
側のパターン露出部を他のプリント配線板のパターン表
面に対し、弾性圧力を利用した圧接により、２枚のプリ
ント配線板間の電気的信号接続を行うものにおいて、前
記両面フレキシブルプリント配線板の表面側のカバーフ
ィルムを除去した前記パターン露出部であるコネクトパ
ターン部の裏面側に、コネクトパターン部と同一位置に
して同一ピッチ及び同一幅で且つ前記表面側のカバーフ
ィルム除去部分より両側に長い信号配線用パターンがカ
バーフィルムで覆われて設けられているものとした。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention utilizes an elastic pressure between a pattern exposed portion on the front surface of a double-sided flexible printed wiring board and a pattern surface of another printed wiring board. In a method for performing electrical signal connection between two printed wiring boards by pressure welding, a connect pattern is formed on a back side of a connect pattern portion which is the pattern exposed portion from which a cover film on a front surface side of the double-sided flexible printed wiring board is removed. The cover has the same pitch and the same width and the same
A signal wiring pattern longer on both sides than the film removal portion is provided so as to be covered with a cover film.
【０００８】[0008]
【作用】本発明によれば、両面フレキシブルプリント配
線板の金メッキコネクトパターンのベース材を挟んで裏
側に、コネクトパターンと同一位置、同一ピッチ、同一
幅の配線パターンを有するので、コネクトパターンの圧
接力が増加し、コネクトパターンの裏面側にも、パター
ン配線を可能とし、プリント基板上の配線をより有効に
行なうことができる。According to the present invention, since the wiring pattern having the same position, the same pitch and the same width as the connect pattern is provided on the back side of the base material of the gold-plated connect pattern of the double-sided flexible printed wiring board, the pressing force of the connect pattern is obtained. And the pattern wiring can be performed also on the back surface side of the connect pattern, and the wiring on the printed circuit board can be more effectively performed.
【０００９】[0009]
【実施例】図１ないし図３は本発明の第１実施例を示し
ている。1 to 3 show a first embodiment of the present invention.
【００１０】同図において、１１は両面フレキシブルプ
リント配線板のベース材、１２はカバーフィルム除去部
１６内の表面に金メッキされたコネクトパターン、１３
は表面側カバーフィルム、１４は裏面側カバーフィル
ム、１５は裏面側の配線パターンである。In FIG. 1, reference numeral 11 denotes a base material of a double-sided flexible printed wiring board; 12, a connect pattern in which the surface inside a cover film removing portion 16 is gold-plated;
Denotes a front side cover film, 14 denotes a back side cover film, and 15 denotes a back side wiring pattern.
【００１１】図４ないし図６は本発明の第２実施例を示
している。FIGS. 4 to 6 show a second embodiment of the present invention.
【００１２】同図において、１１〜１６は第１実施例と
同様な部分または同一部材である。そして、１７は裏面
側第２配線パターンで、配線パターン１５がコネクトパ
ターン１２のベース材をはさんだ表裏同一位置、同一
幅、同一ピッチで配線されているのに対し、コネクトパ
ターン１２間の、コネクトパターンの存在しないコネク
トパターン間に、コネクトパターン１２とに入れ違いに
平行に配線されている。In FIG. 1, reference numerals 11 to 16 denote the same parts or members as in the first embodiment. Reference numeral 17 denotes a second wiring pattern on the back surface, and the wiring pattern 15 is wired at the same position, the same width, and the same pitch on the front and back sides of the base material of the connect pattern 12. The wiring is connected in parallel with the connecting pattern 12 between the connecting patterns having no pattern.
【００１３】図１ないし図３に示した構成において、両
面フレキシブルプリント配線基板の表面配線のうち、表
面側カバーフィルム１３の除去部１６内に金メッキをほ
どこしたコネクトパターン１２はパターン幅Ａ、パター
ン間隔Ｂで同一ピッチで設定されている。これに対し、
ベース材１１をはさんだ裏面側の配線パターン１５はコ
ネクトパターン１２と表裏同一配置で、ほぼ同一幅、同
一ピッチで形成してある。In the configuration shown in FIGS. 1 to 3, of the surface wiring of the double-sided flexible printed wiring board, the connect pattern 12 in which the gold plating is applied in the removed portion 16 of the front cover film 13 has a pattern width A and a pattern interval. B are set at the same pitch. In contrast,
The wiring pattern 15 on the back side sandwiching the base material 11 has the same arrangement as the front and back sides of the connect pattern 12, and is formed with substantially the same width and the same pitch.
【００１４】また配線パターン１５のコネクトパターン
１２と同一幅、同一ピッチである長さＣは表面側コネク
トパターン１２のカバーフィルム除去部１６の長さＤよ
り長くしておく。The length C of the wiring pattern 15 having the same width and the same pitch as the connect pattern 12 is longer than the length D of the cover film removing portion 16 of the front-side connect pattern 12.
【００１５】これにより、両面フレキシブルプリント配
線板を図示されていない他のプリント配線板に対し、配
線パターン１５側から、弾性ゴム等で圧接すると、コネ
クトパターン１２は、裏面側同一幅、同一ピッチの配線
パターン１５と重ねられて両面フレキシブルプリント配
線板のコネクト圧接部でコネクトパターン１２と配線パ
ターン１５以外のパターンの存在しない部分との厚み差
が大きくなる。Thus, when the double-sided flexible printed wiring board is pressed against another printed wiring board (not shown) from the wiring pattern 15 side with elastic rubber or the like, the connecting pattern 12 has the same width and the same pitch on the back side. The thickness difference between the connection pattern 12 and a portion where no pattern other than the wiring pattern 15 is present at the connection press contact portion of the double-sided flexible printed wiring board being superimposed on the wiring pattern 15 increases.
【００１６】したがって、コネクトパターン１２と配線
パターン１５の部分が、最も弾性ゴムによる圧力を強く
受けることができ、すなわち、接触圧力を最も高くでき
る。図４ないし図６に示した構成において、前述した第
１実施例と同様に、コネクトパターン１２と表裏同一位
置、同一幅、同一ピッチで配線パターン１５が配線され
ている。Therefore, the connection pattern 12 and the wiring pattern 15 can receive the strongest pressure from the elastic rubber, that is, the highest contact pressure. In the configuration shown in FIGS. 4 to 6, the wiring pattern 15 is wired at the same position, the same width, and the same pitch as the front and back surfaces of the connect pattern 12, as in the first embodiment described above.
【００１７】さらに、表面側コネクトパターン１２のパ
ターン間の銅箔の存在しない部分の裏面側に、２本のコ
ネクトパターン１２の内側端面より、両面フレキシブル
プリント配線板の作製時に生ずる両面のパターン銅箔の
位置ずれ量以上のずれ量をもって配線される第２配線パ
ターン１７を有する。すなわち配線パターン１５と第２
配線パターン１７の間はベース材１１の表裏で表側コネ
クトパターン１２と第２配線パターン１７が重ならない
ような間隔Ｅを設けている。Further, on the back side of the portion where the copper foil does not exist between the patterns of the front-side connect pattern 12, the double-sided pattern copper foil generated at the time of manufacturing the double-sided flexible printed wiring board from the inner end faces of the two connect patterns 12. And a second wiring pattern 17 that is wired with a shift amount equal to or greater than the positional shift amount. That is, the wiring pattern 15 and the second
A space E is provided between the wiring patterns 17 so that the front-side connect pattern 12 and the second wiring pattern 17 do not overlap on the front and back of the base material 11.
【００１８】これにより、前述の第１実施例と同様に、
この両面フレキシブルプリント配線板を他のプリント配
線板に配線パターン１５側から弾性ゴムで圧接すると、
コネクトパターン１２は裏面側の配線パターン１５と重
なって、最も弾性ゴムによる圧力を強く受けることがで
き、接触圧力が最も高くなり、接触信頼性が向上する。As a result, similar to the first embodiment,
When this double-sided flexible printed wiring board is pressed against another printed wiring board from the wiring pattern 15 side with elastic rubber,
The connect pattern 12 overlaps with the wiring pattern 15 on the rear surface side, and can receive the strongest pressure from the elastic rubber, the contact pressure becomes the highest, and the contact reliability is improved.
【００１９】そして、裏面側の配線パターン１５に対
し、第２配線パターン１７により、裏面側での信号配線
密度が飛躍的に向上している。Then, the signal wiring density on the rear surface side is dramatically improved by the second wiring pattern 17 with respect to the wiring pattern 15 on the rear surface side.
【００２０】なお裏面側に表面側コネクトパターン１２
と、該パターン１２間の銅箔の存在しない部分の両方に
またがった信号配線パターン用銅箔が、コネクトパター
ン１２の直交方向、平行方向とも、存在しないため、コ
ネクトパターン１２の接触圧力を低下させることもな
い。The front-side connect pattern 12 is formed on the rear side.
And the copper foil for the signal wiring pattern which straddles both the portion where the copper foil does not exist between the patterns 12 does not exist in the orthogonal direction or the parallel direction of the connect pattern 12, so that the contact pressure of the connect pattern 12 is reduced. Not even.
【００２１】[0021]
【発明の効果】以上説明したように、本発明によれば、
両面フレキシブルプリント配線板のコネクトパターン部
の裏面側にも信号配線のための信号配線用パターンを設
けることができるので、両面フレキシブルプリント配線
板の配線パターンの実装密度を向上させることが可能と
なる。As described above, according to the present invention,
Connect pattern of double-sided flexible printed wiring board
A signal wiring pattern for signal wiring is also provided on the back side of
Can be installed on both sides, flexible printed wiring on both sides
It is possible to improve the mounting density of board wiring patterns
Become .
【００２２】また、コネクトパターン部における両面フ
レキシブルプリント配線板の厚さ方向における厚みを、
コネクトパターン部間の厚みよりも厚くすることができ
るので、弾性ゴム等による圧接時に圧接力を最も大きく
することができ、より信頼性の高い配線板間の圧接が可
能となる。さらに、コネクトパターン部の裏面側の信号
配線用パターンは、表面側のカバーフィルム除去部分よ
り両側に長いので、弾性圧力を該カバーフィルム除去部
分を越えて余分に付与することができ、この余分の圧力
付与部分に連なるカバーフィルム除去部分で露出するパ
ターン露出部の全面に対して他のプリント配線板のパタ
ーン表面を圧接させることができ、確実な電気的接触が
可能となる。 Further , the double-sided flap in the connect pattern portion is provided.
The thickness in the thickness direction of the flexible printed wiring board,
It can be thicker than the thickness between the connect pattern parts
Therefore, when pressing with elastic rubber, etc., maximize the pressing force.
And more reliable pressure welding between circuit boards is possible.
It works . Furthermore, the signal on the back side of the connect pattern
The wiring pattern is on the front side where the cover film is removed.
Resilient pressure is applied to the cover film removal part.
This extra pressure can be applied over minutes
The exposed part of the cover film removal part connected to the application part
Turn the pattern of another printed circuit board over the entire
Surface can be pressed against each other to ensure reliable electrical contact.
It becomes possible.
【図１】本発明の第１実施例を示した一部切欠正面図で
ある。FIG. 1 is a partially cutaway front view showing a first embodiment of the present invention.
【図２】同じく一部切欠斜視図である。FIG. 2 is a partially cutaway perspective view.
【図３】同じく一部切欠断面図である。FIG. 3 is a partially cutaway sectional view of the same.
【図４】本発明の第２実施例を示した一部切欠正面図で
ある。FIG. 4 is a partially cutaway front view showing a second embodiment of the present invention.
【図５】同じく一部切欠斜視図である。FIG. 5 is a partially cutaway perspective view.
【図６】同じく一部切欠断面図である。FIG. 6 is a partially cutaway sectional view of the same.
【図７】従来の技術の１つの例を示した一部切欠断面図
である。FIG. 7 is a partially cutaway sectional view showing one example of a conventional technique.
【図８】同じくもう１つの例を示した一部切欠断面図で
ある。FIG. 8 is a partially cutaway sectional view showing another example.
１１…ベース材 １２…コネクトパ
ターン １３…表面側カバーフイルム １４…裏面側カバ
ーフィルム １５…配線パターン １６…カバーフィ
ルム除去部 １７…第２配線パターンDESCRIPTION OF SYMBOLS 11 ... Base material 12 ... Connect pattern 13 ... Front side cover film 14 ... Back side cover film 15 ... Wiring pattern 16 ... Cover film removal part 17 ... Second wiring pattern
Claims (2)
側のパターン露出部を他のプリント配線板のパターン表
面に対し、弾性圧力を利用した圧接により、２枚のプリ
ント配線板間の電気的信号接続を行うものにおいて、前
記両面フレキシブルプリント配線板の表面側のカバーフ
ィルムを除去した前記パターン露出部であるコネクトパ
ターン部の裏面側に、コネクトパターン部と同一位置に
して同一ピッチ及び同一幅で且つ前記表面側のカバーフ
ィルム除去部分より両側に長い信号配線用パターンがカ
バーフィルムで覆われて設けられていることを特徴とす
る両面フレキシブルプリント配線板。An electric signal connection between two printed wiring boards is performed by pressing a pattern exposed portion on a front surface side of a double-sided flexible printed wiring board against a pattern surface of another printed wiring board using elastic pressure. In the process, the cover pattern on the front side of the double-sided flexible printed wiring board is removed. On the back side of the connect pattern section, which is the pattern exposed section, the same pitch and the same width and the same surface as the connect pattern section are formed. Side cover
A double-sided flexible printed wiring board, wherein a signal wiring pattern longer on both sides than a film removal portion is provided so as to be covered with a cover film.
ネクトパターンとは表裏重ならないだけずらした第２信
号パターンを有している請求項１記載の両面フレキシブ
ルプリント配線板。2. The double-sided flexible printed wiring board according to claim 1, further comprising a second signal pattern which is shifted between the rear-side signal wiring patterns so as not to overlap the front-side connect pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3221719A JP2914795B2 (en) | 1991-09-02 | 1991-09-02 | Double-sided flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3221719A JP2914795B2 (en) | 1991-09-02 | 1991-09-02 | Double-sided flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0563328A JPH0563328A (en) | 1993-03-12 |
| JP2914795B2 true JP2914795B2 (en) | 1999-07-05 |
Family
ID=16771195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3221719A Expired - Fee Related JP2914795B2 (en) | 1991-09-02 | 1991-09-02 | Double-sided flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2914795B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4584006B2 (en) * | 2005-04-12 | 2010-11-17 | 日本メクトロン株式会社 | Flexible circuit board |
| JP5035519B2 (en) * | 2007-02-22 | 2012-09-26 | ブラザー工業株式会社 | Circuit element mounting flexible wiring material |
-
1991
- 1991-09-02 JP JP3221719A patent/JP2914795B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563328A (en) | 1993-03-12 |
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