JP2910155B2 - Wiring board and method of manufacturing the same - Google Patents
Wiring board and method of manufacturing the sameInfo
- Publication number
- JP2910155B2 JP2910155B2 JP2130920A JP13092090A JP2910155B2 JP 2910155 B2 JP2910155 B2 JP 2910155B2 JP 2130920 A JP2130920 A JP 2130920A JP 13092090 A JP13092090 A JP 13092090A JP 2910155 B2 JP2910155 B2 JP 2910155B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- metal
- component
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は配線板及びその製造方法に関し、特に高密度
実装用の配線板及びその製造方法に関する。The present invention relates to a wiring board and a method for manufacturing the same, and more particularly, to a wiring board for high-density mounting and a method for manufacturing the same.
従来、この種の配線板及びその製造方法は、平面状の
板材に部品実装面より垂直方向のスルーホールと、前記
スルーホール間及び部品実装用パットを結ぶパターンと
から構成されている。2. Description of the Related Art Conventionally, this type of wiring board and a method of manufacturing the same are composed of a planar plate material having through holes perpendicular to a component mounting surface and a pattern connecting the through holes and a component mounting pad.
上述した従来の配線板及びその製造方法は、外部の配
線板との信号等の電気的接続を行うために、部品実装面
にコネクタを実装しなくてはならない。従って、配線板
の一部分はコネクタに占有されるので、その部分は回路
部品を搭載することができないという欠点がある。ま
た、搭載される回路部品は配線板の表面に搭載されるた
め、実質的な厚さが増大し、配線板間の距離をあける必
要があり、高密度実装をすることができないという欠点
がある。In the above-described conventional wiring board and its manufacturing method, a connector must be mounted on a component mounting surface in order to electrically connect signals and the like to an external wiring board. Therefore, since a part of the wiring board is occupied by the connector, there is a drawback that the circuit part cannot be mounted on the part. Further, since the circuit components to be mounted are mounted on the surface of the wiring board, the thickness is substantially increased, the distance between the wiring boards needs to be increased, and there is a disadvantage that high-density mounting cannot be performed. .
本発明の目的は、かかる部品搭載面のコネクタを廃止
し、高密度実装を実現するとともに、小形且つ軽量の配
線板及びその製造方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a compact and lightweight wiring board and a method for manufacturing the same, while eliminating such a connector on the component mounting surface, realizing high-density mounting.
本発明の配線板は、部品を搭載する面に垂直に伸び且
つ内側を金属めっき或いは金属を蒸着した第一のスルー
ホールと、前記第一のスルーホールに対してほぼ垂直に
交差し且つ内側を金属めっき或いは金属を蒸着した第二
のスルーホールとを有し、前記第二のスルーホールが側
面まで達するように構成される。The wiring board of the present invention extends vertically to the surface on which the component is mounted and has a first through-hole in which metal plating or metal is deposited on the inner side, and intersects substantially perpendicularly with the first through-hole and has an inner side. A second through-hole on which metal plating or metal is deposited, wherein the second through-hole reaches a side surface.
また、本発明の配線板の製造方法は、第一のスルーホ
ールおよび前記第一のスルーホールにほぼ垂直な第二の
スルーホールをインジェクションモールドにより一体形
成する工程と、印刷めっきあるいは金属の蒸着により、
前記第一および第二のスルーホールの内側に金属被膜を
形成し且つ部品搭載面上のパターンを形成する工程とを
含んで構成される。Further, the method for manufacturing a wiring board of the present invention includes a step of integrally forming a first through hole and a second through hole substantially perpendicular to the first through hole by injection molding, and printing plating or metal deposition. ,
Forming a metal coating inside the first and second through holes and forming a pattern on the component mounting surface.
次に、本発明の実施例について図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ），（ｂ）はそれぞれ本発明の第一の実施
例を説明するための配線板の斜視図およびハウジングの
斜視図であり、また第２図は第１図（ａ），（ｂ）にお
けるA-A線およびコンタクトピンの断面図である。FIGS. 1A and 1B are a perspective view of a wiring board and a perspective view of a housing, respectively, for explaining a first embodiment of the present invention, and FIG. 2 is a perspective view of FIG. It is sectional drawing of the AA line and a contact pin in (b).
第１図（ａ），（ｂ）および第２図に示すように、本
実施例は配線板１の部品搭載面に回路部品２をピン７を
介して実装し、第一のスルーホール３間はパターン６に
より接続している。また、配線板１の側面５には第二の
スルーホール４が形成される。As shown in FIGS. 1 (a), (b) and FIG. 2, in the present embodiment, the circuit component 2 is mounted on the component mounting surface of the wiring board 1 via the pin 7, and the first through hole 3 is provided. Are connected by a pattern 6. Further, a second through hole 4 is formed in the side surface 5 of the wiring board 1.
すなわち、配線板１は部品搭載面より垂直に伸び且つ
内側に銅めっきを施した第一のスルーホール３と、配線
板１の内部で第一のスルーホール３に直交するとともに
側面５へ伸び且つ内側に銅めっきを施した第二のスルー
ホール４とを有している。この配線板１は第二のスルー
ホール４にばね性を持つコンタクトピン９が挿入される
ことにより、外部と電気的接続を行なうことができる。
また、第二のスルーホール４の内側は、銅めっきを行っ
た後、ニッケルめっきおよび金めっきを施し、コンタク
トピン９との接触安定性を保つ。さらに、スルーホール
４と回路部品２との信号のやりとりは、回路部品２のピ
ン７が挿入されたスルーホール３あるいはピン７が挿入
されたスルーホール３とパターン６を通して行われる。
この回路部品２はコンタクトハウジング８に接触しない
かぎり、側面５の近くに搭載することができる。That is, the wiring board 1 extends vertically from the component mounting surface and is plated with copper on the inside. The first through hole 3 extends inside the wiring board 1 at right angles to the first through hole 3 and extends to the side surface 5. And a second through hole 4 plated with copper on the inside. The wiring board 1 can be electrically connected to the outside by inserting the contact pins 9 having a spring property into the second through holes 4.
The inside of the second through hole 4 is plated with nickel and then with gold and gold to keep the contact stability with the contact pin 9. Further, signals are exchanged between the through-hole 4 and the circuit component 2 through the through-hole 3 in which the pin 7 of the circuit component 2 is inserted or the through-hole 3 in which the pin 7 is inserted and the pattern 6.
This circuit component 2 can be mounted near the side surface 5 as long as it does not contact the contact housing 8.
第３図は本発明の第二の実施例を示す配線板の斜視図
であり、また第４図は第３図におけるB-B線断面図であ
る。FIG. 3 is a perspective view of a wiring board showing a second embodiment of the present invention, and FIG. 4 is a sectional view taken along the line BB in FIG.
第３図および第４図に示すように、本実施例は配線板
１が回路部品２を収容できる凹部10を形成した点が前述
した第一の実施例と異っている。この凹部10の側面には
パターン６を有しており、回路部品２を表面実装するこ
とができる。As shown in FIGS. 3 and 4, the present embodiment is different from the first embodiment in that the wiring board 1 has a recess 10 in which the circuit component 2 can be accommodated. The side surface of the concave portion 10 has a pattern 6, and the circuit component 2 can be surface-mounted.
本実施例によれば、部品実装面のコネクタを省略でき
るだけでなく、小型且つ軽量化と高密度実装を実現する
ことができる。According to this embodiment, not only the connector on the component mounting surface can be omitted, but also a small size, light weight, and high density mounting can be realized.
第５図（ａ），（ｂ）はそれぞれ本発明の第三の実施
例を示す配線板の斜視図及びその断面図である。FIGS. 5 (a) and 5 (b) are a perspective view and a sectional view of a wiring board showing a third embodiment of the present invention, respectively.
第５図（ａ），（ｂ）に示すように、本実施例の配線
板１は回路部品２を収容する凹部10を有するので、回路
部品２が実装されても、その部品搭載面はフラットな面
あるいはへこみがあるだけである。従って、数枚の配線
板１を重ねることができ、更に位置の共通する第一のス
ルーホール３に電気接触ピン11を挿入することにより、
各々の配線板１が電気的に接続されることになる。ま
た、第二のスルーホール４にコンタクトピン９を挿入す
ることにより、外部との電気的接続を持たせることがで
きる。As shown in FIGS. 5 (a) and 5 (b), since the wiring board 1 of the present embodiment has the concave portion 10 for accommodating the circuit component 2, even if the circuit component 2 is mounted, the component mounting surface is flat. It just has a surface or dent. Therefore, several wiring boards 1 can be stacked, and furthermore, by inserting the electric contact pins 11 into the first through holes 3 having a common position,
Each wiring board 1 is electrically connected. Further, by inserting the contact pin 9 into the second through hole 4, an electrical connection with the outside can be provided.
一方、本実施例の配線板の製造方法は、配線板１をイ
ンジェクションモールドで一体成形する工程と、パター
ン６及び第一のスルーホール３と第二のスルーホール４
の内側を一括してめっきもしくは蒸着する工程とを有す
ることにより安価に生産することができる。On the other hand, in the method of manufacturing a wiring board according to the present embodiment, the steps of integrally forming the wiring board 1 by injection molding, the pattern 6, the first through hole 3, and the second through hole 4 are performed.
Can be produced at a low cost by having a step of plating or vapor-depositing the inside of the substrate at once.
以上説明したように、本発明の配線板及びその製造方
法は、部品搭載面から垂直にのびるスルーホールと、こ
のスルーホールに直交し且つ側面へ伸びるスルーホール
とを有することにより、外部からの信号等の電気的接続
を行うために搭載されていたコネクタを省略することが
でき、また配線板部品搭載面の凹部に回路部品を実装す
ることにより実質的な配線板の厚さを小さくすることが
できる上、配線板の軽量化と回路部品の増加した高密度
実装を実現できるという効果がある。As described above, the wiring board and the method of manufacturing the same according to the present invention have a through hole extending vertically from the component mounting surface and a through hole orthogonal to the through hole and extending to the side surface, so that an external signal can be obtained. It is possible to omit the connector mounted for making an electrical connection, etc., and to reduce the substantial thickness of the wiring board by mounting the circuit component in the concave portion of the wiring board component mounting surface. In addition, there is an effect that the wiring board can be reduced in weight and high-density mounting with increased circuit components can be realized.
第１図（ａ），（ｂ）はそれぞれ本発明の第一の実施例
を説明するための配線板の斜視図およびハウジングの斜
視図、第２図は第１図（ａ），（ｂ）におけるA-A線お
よびコンタクトピンの断面図、第３図は本発明の第二の
実施例を示す配線板の斜視図、第４図は第３図におるB-
B線断面図、第５図（ａ），（ｂ）はそれぞれ本発明の
第三の実施例を示す配線板の斜視図及びその断面図であ
る。 １……配線板、２……回路部品、3,4……スルーホー
ル、５……側面、６……パターン、７……ピン、８……
ハウジング、９……コンタクトピン、10……凹部、11…
…電気接触ピン。FIGS. 1 (a) and 1 (b) are perspective views of a wiring board and a housing, respectively, for explaining a first embodiment of the present invention, and FIGS. 1 (a) and 1 (b) are diagrams. 3 is a cross-sectional view of the AA line and the contact pin in FIG. 3, FIG. 3 is a perspective view of a wiring board showing a second embodiment of the present invention, and FIG.
FIGS. 5 (a) and 5 (b) are a perspective view and a sectional view of a wiring board according to a third embodiment of the present invention, respectively. 1 ... wiring board, 2 ... circuit parts, 3,4 ... through hole, 5 ... side surface, 6 ... pattern, 7 ... pin, 8 ...
Housing 9 Contact pin 10 Concave 11
... Electrical contact pins.
Claims (6)
金属めっき或いは金属を蒸着した第一のスルーホール
と、前記第一のスルーホールに対してほぼ垂直に交差し
且つ内側を金属めっき或いは金属を蒸着した第二のスル
ーホールとを有し、前記第二のスルーホールが側面まで
達していることを特徴とする配線板。1. A first through hole extending perpendicular to a surface on which a component is mounted and having a metal plating or a metal deposited on the inside, and a metal plating that intersects the first through hole substantially perpendicularly and has a metal plating on the inside. Alternatively, a wiring board having a second through-hole on which metal is deposited, wherein the second through-hole reaches a side surface.
面に部品接続用パッドおよび前記パッド間を接続するパ
ターンを金属めっきあるいは金属の蒸着により形成した
ことを特徴とする配線板。2. The wiring board according to claim 1, wherein the component connection pads and the pattern connecting the pads are formed on the component mounting surface by metal plating or metal evaporation.
る第一のスルーホールが部品端子と半田付けできること
を特徴とする配線板。3. A wiring board wherein a first through hole extending vertically from the component mounting surface according to claim 1 can be soldered to a component terminal.
ルーホールは外部から弾性をもつ端子を圧入し電気的接
続を行なうことを特徴とする配線板。4. The wiring board according to claim 1, wherein the second through hole reaching the side surface is electrically connected by press-fitting an elastic terminal from the outside.
るための凹部を形成していることを特徴とする配線板。5. The wiring board according to claim 1, wherein the component mounting surface has a recess for accommodating the component.
ーホールにほぼ垂直な第二のスルーホールをインジェク
ションモールドにより一体形成する工程と、印刷めっき
あるいは金属の蒸着により、前記第一および第二のスル
ーホールの内側に金属被膜を形成し且つ部品搭載面上の
パターンを形成する工程とを含むことを特徴とする配線
板の製造方法。6. A step of integrally forming a first through-hole and a second through-hole substantially perpendicular to the first through-hole by injection molding, and the first and second through-holes by printing plating or metal deposition. Forming a metal film inside the through hole and forming a pattern on the component mounting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2130920A JP2910155B2 (en) | 1990-05-21 | 1990-05-21 | Wiring board and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2130920A JP2910155B2 (en) | 1990-05-21 | 1990-05-21 | Wiring board and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0426193A JPH0426193A (en) | 1992-01-29 |
| JP2910155B2 true JP2910155B2 (en) | 1999-06-23 |
Family
ID=15045830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2130920A Expired - Lifetime JP2910155B2 (en) | 1990-05-21 | 1990-05-21 | Wiring board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2910155B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100386005C (en) * | 2002-01-24 | 2008-04-30 | 三菱麻铁里亚尔株式会社 | Printed-circuit board, electronic part having shield structure, and radio communication apparatus |
-
1990
- 1990-05-21 JP JP2130920A patent/JP2910155B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0426193A (en) | 1992-01-29 |
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