JP2877158B2 - Spherical polishing device and spherical polishing method - Google Patents
Spherical polishing device and spherical polishing methodInfo
- Publication number
- JP2877158B2 JP2877158B2 JP7063854A JP6385495A JP2877158B2 JP 2877158 B2 JP2877158 B2 JP 2877158B2 JP 7063854 A JP7063854 A JP 7063854A JP 6385495 A JP6385495 A JP 6385495A JP 2877158 B2 JP2877158 B2 JP 2877158B2
- Authority
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- Japan
- Prior art keywords
- polishing
- axis
- machine
- workpiece
- polishing machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、被加工物の先端を球面
又は斜め球面に研磨する球面研磨装置及びこれを用いた
球面研磨方法に係り、特に光ファイバのコネクタ（光コ
ネクタ）の接合部に取り付けられるフェルール（接合用
補強円筒棒材）の先端を研磨するために好適な球面研磨
装置及び方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spherical polishing device for polishing the tip of a workpiece to a spherical surface or an oblique spherical surface and a spherical polishing method using the same, and particularly to a joint portion of an optical fiber connector (optical connector). BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spherical polishing apparatus and method suitable for polishing the tip of a ferrule (reinforcement cylindrical rod for joining) attached to a surface.
【０００２】[0002]
【従来の技術】従来より光ファイバ同士を着脱可能に接
続するために、各種の光コネクタが使用されている。単
芯用の光コネクタとしては、例えば、軸ずれや角度ずれ
の少ない接合（例えば、コア径１０μｍのシングルモー
ド光ファイバにおいては軸ずれ１μｍ以下）を可能にす
る必要がある。2. Description of the Related Art Conventionally, various optical connectors have been used to detachably connect optical fibers. For a single-core optical connector, for example, it is necessary to enable bonding with small axis shift and angle shift (for example, an axis shift of 1 μm or less in a single mode optical fiber having a core diameter of 10 μm).
【０００３】そこで、光コネクタには、光ファイバをセ
ラミックス製のフェルールの中心に挿入して接着固定し
た後、この光コネクタフェルールを精密な内径を有する
割スリーブに挿入して、当該フェルールの先端同士を突
き当てて締結した構造のものがある。かかる光コネクタ
は優れた接続特性を有するので、特に光通信の分野では
広く・大量に使用されている。[0003] Therefore, in the optical connector, an optical fiber is inserted into the center of a ferrule made of ceramics and bonded and fixed. Then, the optical connector ferrule is inserted into a split sleeve having a precise inner diameter, and the ends of the ferrule are connected to each other. There is a structure of which is fastened by abutting the butt. Such optical connectors have excellent connection characteristics, and are widely and widely used, especially in the field of optical communication.
【０００４】図５（ａ）及び（ｂ）は、それぞれ光コネ
クタの接続状態を示している。割スリーブ１に挿入され
た光コネクタフェルール２ａ、２ｂは、光の接続特性を
良くするために、その先端が凸球面形状になっている。FIGS. 5A and 5B show a connection state of an optical connector. The ends of the optical connector ferrules 2a and 2b inserted into the split sleeve 1 have a convex spherical shape in order to improve light connection characteristics.
【０００５】光コネクタのフェルールの球面形状には、
図５（ａ）に示すように光軸に対して直角な端面をもと
に凸球面形状に研磨したもの（以下、ＰＣ−Phsical co
ntact −接続、或はＰＣ研磨という）、図５（ｂ）に示
すように光軸に対して傾き角８°前後傾けて凸球面形状
に研磨したもの（以下、斜めＰＣ接続、あるいは斜めＰ
Ｃ研磨という）がある。The spherical shape of the ferrule of the optical connector includes:
As shown in FIG. 5 (a), a surface polished into a convex spherical shape based on an end surface perpendicular to the optical axis (hereinafter, PC-Phsical co.)
ntact-connection or PC polishing), as shown in FIG. 5 (b), polished into a convex spherical shape with an inclination angle of about 8 ° with respect to the optical axis (hereinafter, oblique PC connection or oblique P connection).
C polishing).
【０００６】特に、後者の斜めＰＣ研磨のフェルール２
ｂを備えた光コネクタでは、コネクタ端面の反射光が傾
き角の２倍で反射され、接続部における光の反射が６０
ｄＢ以下となる。これらの値は、前者のＰＣ研磨のフェ
ルール２ａを備えた光コネクタに比べて１〜２桁小さ
い。したがって、斜めＰＣ研磨のフェルール２ｂを備え
た光コネクタは、反射戻り光によるノイズの影響を抑え
ることができるので、高速ディジタル伝送又はアナログ
伝送等の光通信技術においては不可欠となっている。In particular, the latter ferrule 2 for oblique PC polishing
b, the reflected light from the end face of the connector is reflected at twice the tilt angle, and the
dB or less. These values are smaller by one or two orders of magnitude than the former optical connector having the PC-polished ferrule 2a. Therefore, the optical connector provided with the ferrule 2b of oblique PC polishing can suppress the influence of noise due to reflected return light, and is indispensable in optical communication technology such as high-speed digital transmission or analog transmission.
【０００７】ところで、光コネクタのフェルール２ａ、
２ｂの端面の凸球面形状は、研磨によって形成される
が、例えば、球の頂点とファイバ中心とのズレは５０μ
ｍ以下というように、高精度の研磨が要求される。した
がって、研磨に際しての作業性、操作性の向上が課題に
なっている。By the way, the ferrule 2a of the optical connector,
The convex spherical shape of the end face of 2b is formed by polishing. For example, the deviation between the vertex of the sphere and the center of the fiber is 50 μm.
High precision polishing is required, such as less than m. Therefore, improvement of workability and operability in polishing has been an issue.
【０００８】次に従来例の研磨装置を使用したフェルー
ルの研磨方法について説明する。図６は第１の従来例の
研磨装置の外観構成を、図７（ａ）は同装置を用いたＰ
Ｃ研磨の場合のフェルールの保持方法を、図７（ｂ）は
同装置を用いた斜めＰＣ研磨の場合のフェルールの保持
方法を、それぞれ示している。Next, a method of polishing a ferrule using a conventional polishing apparatus will be described. FIG. 6 shows an external configuration of a polishing apparatus according to a first conventional example, and FIG.
FIG. 7B shows a method of holding a ferrule in the case of C polishing, and FIG. 7B shows a method of holding a ferrule in the case of oblique PC polishing using the same apparatus.
【０００９】ＰＣ研磨の場合は、図７（ａ）に示すよう
に、フェルール２の軸心を研磨盤面３に対して垂直にし
て取り付け金具４ａにて固定し、複数本のフェルール２
を同時に研磨する。In the case of the PC polishing, as shown in FIG. 7 (a), the ferrule 2 is fixed with a mounting bracket 4a so that the axis of the ferrule 2 is perpendicular to the surface 3 of the polishing platen.
Are simultaneously polished.
【００１０】斜めＰＣ研磨の場合は、図７（ｂ）に示す
ように、フェルール２の軸心を研磨盤面３に対して規定
量傾けて取り付け金具４ｂにて固定し、複数本のフェル
ール２を同時に研磨する。In the case of oblique PC polishing, as shown in FIG. 7B, the ferrule 2 is fixed at a mounting bracket 4b with the axis of the ferrule 2 tilted by a predetermined amount with respect to the polishing platen surface 3, and a plurality of ferrules 2 are fixed. Polish at the same time.
【００１１】第１の従来例の研磨装置では、研磨する際
にフェルール２が取り付け金具４ａ、４ｂにて固定され
ているので、回転・揺動しないようになっている。ま
た、研磨盤５はゴム等の弾性体６の上面に研磨シート７
等を張り付けた構成をしている。本従来例の装置は、Ｐ
Ｃ研磨の際、回転する研磨シート７の上面に研摩液８を
供給しつつ、フェルール２の先端を押圧してフェルール
端面の研磨を行うようにしている。In the first conventional polishing apparatus, the ferrule 2 is fixed by the fittings 4a and 4b during polishing, so that it does not rotate or swing. The polishing plate 5 has a polishing sheet 7 on the upper surface of an elastic body 6 such as rubber.
And so on. The device of this conventional example has a P
At the time of the C polishing, the tip of the ferrule 2 is pressed while the polishing liquid 8 is supplied to the upper surface of the rotating polishing sheet 7 to polish the ferrule end face.
【００１２】図９は第２の従来例の研磨装置の要部構成
を示している。第２の従来例の研磨装置は、回転駆動す
る弾性研磨盤９の上面に樹脂系フィルム１０を一定張力
を付して張設した構成になっている。本従来例の装置
は、ＰＣ研磨の際、回転する樹脂系フィルム１０の上面
に研摩液８を供給しながらフェルール２の先端を一定距
離だけ樹脂系フィルム１０に押し込み、かつフェルール
２をその軸心回りに正逆回転させて研磨を行う。FIG. 9 shows a main configuration of a polishing apparatus according to a second conventional example. The polishing apparatus of the second conventional example has a structure in which a resin film 10 is stretched on the upper surface of a revolving elastic polishing board 9 with a constant tension. In the apparatus of this conventional example, the tip of the ferrule 2 is pushed into the resin-based film 10 by a certain distance while the polishing liquid 8 is supplied to the upper surface of the rotating resin-based film 10 during the polishing of the PC. Polishing is performed by rotating it forward and backward.
【００１３】[0013]
【発明が解決しようとする課題】ところで、前記した従
来例の研磨装置には、以下のような問題がある。第１の
従来例の前記研磨装置は、複数本のフェルールを一括し
て研磨するためにフェルール自体を回転させることがで
きない。これでは、表面粗さ、面形状の対象性等におけ
る加工面精度が悪くなるという問題が生じる。そこで、
各フェルールの研磨軌跡が、図８に示す太い実線Ｌの螺
旋状になるように研磨盤５に回転と揺動を与えて加工面
精度を高める試みがなされている。However, the above-described conventional polishing apparatus has the following problems. In the polishing apparatus of the first conventional example, the ferrule itself cannot be rotated in order to collectively polish a plurality of ferrules. In this case, there arises a problem that the machining surface accuracy in terms of the surface roughness, the symmetry of the surface shape, and the like deteriorates. Therefore,
Attempts have been made to increase the precision of the machined surface by rotating and oscillating the polishing machine 5 so that the polishing locus of each ferrule has a spiral shape indicated by a thick solid line L shown in FIG.
【００１４】しかし、研磨盤に回転と揺動を与える構成
の前記研磨装置は、研磨盤の駆動機構の揺動による振動
が発生するので、駆動速度を早めることができず、研磨
速度の高速化に困難を来すという問題がある。However, in the above-mentioned polishing apparatus having a structure in which the polishing disk is rotated and oscillated, since the vibration of the driving mechanism of the polishing disk is generated, the driving speed cannot be increased, and the polishing speed is increased. There is a problem that comes with difficulty.
【００１５】また、かかる研磨装置は、フェルールを弾
性体研磨盤に押し付ける時に発生する略球面形状にフェ
ルール先端形状に従わして加工するので、複数本のフェ
ルールの長さに違いが生じたり、研磨圧力によりフェル
ール取付板の保持腕が倒れたりして研磨加工の精度にバ
ラツキが生じるという問題がある。In addition, since such a polishing apparatus processes the ferrule into a substantially spherical shape which is generated when the ferrule is pressed against the elastic body polishing plate, the length of the plurality of ferrules may be different or the polishing may be performed. There is a problem in that the pressure may cause the holding arm of the ferrule mounting plate to fall down, causing variations in polishing accuracy.
【００１６】さらに、同装置１台を用いてＰＣ研磨と斜
めＰＣ研磨を行う場合、フェルールの取付金具の交換及
び装置の設定条件の変更等が面倒であるため、作業性に
難があるという問題がある。Further, when PC polishing and oblique PC polishing are performed by using one apparatus, it is troublesome to replace ferrule mounting brackets, change setting conditions of the apparatus, and the like. There is.
【００１７】第２の従来例の前記研磨装置は、フェルー
ルを一本ずつ研磨するためにフェルール自体を回転させ
ることができる。したがって、一般の研磨方式に準じた
研磨を実現することができ、研磨盤の回転速度を高速化
することが可能である。The polishing apparatus of the second prior art can rotate the ferrule itself to polish the ferrules one by one. Therefore, polishing according to a general polishing method can be realized, and the rotation speed of the polishing machine can be increased.
【００１８】ここで、一般の研磨方式とは、研磨盤の一
方向の回転に対して、被加工物にも回転を与え、かつ被
加工物の研磨の目（筋）の方向を移動させることによ
り、加工面精度を高める研磨方式をいう。Here, a general polishing method is to apply a rotation to a workpiece and to move a direction of a line (streak) of polishing of the workpiece with respect to the rotation of the polishing machine in one direction. Means a polishing method that improves the accuracy of the machined surface.
【００１９】しかし、第２の従来例の前記研磨装置は、
フェルールの後方に長尺の光コードが付いているので、
１方向に回転させ続けることができず、研磨の際にフェ
ルールを約１回転の範囲で正逆回転させる繁雑な回転駆
動制御が必要となる。かかる正逆回転による研磨加工は
光コードの破断原因となり、結果的に歩留まりを悪くす
るという問題がある。However, the polishing apparatus of the second conventional example is
Since there is a long light cord behind the ferrule,
Rotation in one direction cannot be continued, and complicated rotation drive control for rotating the ferrule forward and reverse within a range of about one rotation during polishing is required. Polishing by such forward / reverse rotation causes breakage of the optical cord, resulting in a problem that the yield is deteriorated.
【００２０】また、研磨盤の回転速度を高速化させて研
磨時間を短縮する場合には、正逆回転の反転時における
回転の停止時間の影響によって研磨の目の方向が不均等
になり、形状精度にバラツキが生じる等の問題がある。In the case where the polishing time is reduced by increasing the rotation speed of the polishing machine, the direction of the polishing eyes becomes uneven due to the effect of the rotation stop time when reversing the forward and reverse rotations, and the There are problems such as variations in accuracy.
【００２１】さらに、第２の従来例の研磨装置は、ＰＣ
研磨を目的としているが、斜めＰＣ研磨を可能にするに
は複雑化したフェルールの取り付け金具が必要になると
ともに、研磨作業を行う者に大変な熟練度が要求される
という問題がある。Further, a polishing apparatus according to a second conventional example is a PC.
Although it is intended for polishing, there is a problem that a complicated ferrule mounting bracket is required to enable oblique PC polishing, and a great skill is required for a person who performs the polishing operation.
【００２２】ここにおいて本発明の解決すべき主要な目
的は、次の通りである。本発明の第１の目的は、光コネ
クタの接合部に取り付けられるフェルールの先端を研磨
するために好適な球面研磨装置及びこれを用いた球面研
磨方法を提供せんとするものである。Here, the main objects to be solved by the present invention are as follows. A first object of the present invention is to provide a spherical polishing device suitable for polishing the tip of a ferrule attached to a joint of an optical connector and a spherical polishing method using the same.
【００２３】本発明の第２の目的は、高精度に再現性良
く、しかも高速に球面研磨することができる球面研磨装
置及びこれを用いた球面研磨方法を提供せんとするもの
である。A second object of the present invention is to provide a spherical polishing apparatus capable of polishing a spherical surface with high precision and good reproducibility and at a high speed, and a spherical polishing method using the same.
【００２４】本発明の第３の目的は、簡易な傾き調整手
段にてフェルールの取付角度を変更することにより、Ｐ
Ｃ研磨、斜めＰＣ研磨の変更が容易にでき、作業性の良
い球面研磨装置及びこれを用いた球面研磨方法を提供せ
んとするものである。A third object of the present invention is to change the mounting angle of the ferrule by using a simple inclination adjusting means, so that the angle of the ferrule can be reduced.
It is an object of the present invention to provide a spherical polishing apparatus and a spherical polishing method using the same, which can easily change the C polishing and the oblique PC polishing and have good workability.
【００２５】本発明のその他の目的は、明細書、図面、
特に特許請求の範囲の記載から自ずと明らかとなろう。Other objects of the present invention are as follows:
In particular, it will be obvious from the description of the appended claims.
【００２６】[0026]
【課題を解決するための手段】前記した課題の解決は、
本発明が次に列挙する新規な特徴的構成手段及び手法を
採用することにより達成される。すなわち、本発明装置
の第１の特徴は、研磨盤面が同心円状に複数の研磨帯領
域に分割された研磨盤と、前記研磨盤の研磨帯領域を当
該研磨盤の軸心回りに回転させる研磨盤自転手段と、前
記研磨盤の軸心自体をある軸心回りに回転させる研磨盤
公転手段と、前記研磨盤の各研磨盤面に被加工物の端面
中心を位置付けて、当該被加工物を保持する保持手段
と、前記保持手段に保持された被加工物の端面を前記研
磨盤の研磨盤面に押し付ける直線案内手段とを有する球
面研磨装置において、前記研磨盤公転手段は、前記研磨
盤の軸心自体を各研磨帯領域に相当する半径で回転させ
る球面研磨装置である。Means for Solving the Problems The above-mentioned problems can be solved by:
The present invention is achieved by adopting the following novel characteristic constitution means and methods. That is, a first feature of the apparatus of the present invention is that a polishing disk surface is divided concentrically into a plurality of polishing band regions, and a polishing device that rotates the polishing band region of the polishing disk around the axis of the polishing disk. Plate rotating means, polishing machine revolving means for rotating the axis of the polishing machine itself around a certain axis, and positioning the center of the end face of the work on each polishing machine surface of the polishing machine to hold the work. And a linear guide means for pressing an end face of the workpiece held by the holding means against the polishing surface of the polishing machine, wherein the polishing machine revolving means comprises an axis of the polishing machine. This is a spherical polishing apparatus that rotates itself at a radius corresponding to each polishing band region.
【００２７】本発明装置の第２の特徴は、研磨盤と、前
記研磨盤を当該研磨盤の軸心回りに回転させる研磨盤自
転手段と、前記研磨盤の軸心自体をある軸心回りに回転
させる研磨盤公転手段と、前記研磨盤の研磨盤面に被加
工物の端面中心を位置付けて、当該被加工物を保持する
保持手段と、前記保持手段に保持された被加工物の端面
を前記研磨盤の研磨盤面に押し付ける直線案内手段とを
有する球面研磨装置において、前記直線案内手段と前記
保持手段との間に、さらに、前記研磨盤の研磨盤面に対
して被加工物の軸心の傾きを調整する傾き調整手段を備
えてなる球面研磨装置である。A second feature of the apparatus of the present invention is that a polishing disk, a polishing disk rotating means for rotating the polishing disk about the axis of the polishing disk, and an axis of the polishing disk itself around a certain axis. Polishing machine revolving means for rotating, the center of the end face of the workpiece on the polishing board surface of the polishing machine, holding means for holding the workpiece, and the end face of the workpiece held by the holding means, In a spherical polishing apparatus having linear guide means for pressing against a polishing surface of a polishing machine, between the linear guide means and the holding means, further, the inclination of the axis of the workpiece with respect to the polishing surface of the polishing machine. This is a spherical polishing apparatus provided with a tilt adjusting means for adjusting the angle.
【００２８】本発明装置の第３の特徴は、研磨盤面が同
心円状に複数の研磨帯領域に分割された研磨盤と、前記
研磨盤の研磨帯領域を当該研磨盤の軸心回りに回転させ
る研磨盤自転手段と、前記研磨盤の軸心自体をある軸心
回りに回転させる研磨盤公転手段と、前記研磨盤の各研
磨盤面に被加工物の端面中心を位置付けて、当該被加工
物を保持する保持手段と、前記保持手段に保持された被
加工物の端面を前記研磨盤の研磨盤面に押し付ける直線
案内手段とを有する球面研磨装置において、前記直線案
内手段と前記保持手段との間に、さらに、前記研磨盤の
研磨盤面に対して被加工物の軸心の傾きを調整する傾き
調整手段を備えてなる球面研磨装置である。A third feature of the apparatus of the present invention is that a polishing disk surface is divided concentrically into a plurality of polishing band regions, and the polishing band region of the polishing disk is rotated about the axis of the polishing disk. Polishing machine rotation means, polishing machine revolving means for rotating the axis of the polishing machine itself around a certain axis, and positioning the center of the end face of the work on each polishing machine surface of the polishing machine, In a spherical polishing apparatus having holding means for holding, and linear guide means for pressing an end face of a workpiece held by the holding means against a polishing surface of the polishing machine, between the linear guide means and the holding means Further, there is provided a spherical polishing apparatus further comprising a tilt adjusting means for adjusting a tilt of an axis of the workpiece with respect to a polishing surface of the polishing plate.
【００２９】本発明装置の第４の特徴は、本発明装置の
第１の特徴における前記直線案内手段と前記保持手段と
の間に、さらに、前記研磨盤の研磨盤面に対して被加工
物の軸心の傾きを調整する傾き調整手段を備えてなる球
面研磨装置である。A fourth feature of the apparatus of the present invention resides in that, between the linear guide means and the holding means in the first feature of the apparatus of the present invention, a workpiece to be processed with respect to the polishing surface of the polishing plate is further provided. This is a spherical polishing apparatus provided with a tilt adjusting means for adjusting the tilt of the axis.
【００３０】本発明装置の第５の特徴は、本発明装置の
第１、第２、第３又は第４の特徴における前記研磨盤公
転手段による研磨盤の公転中心を、被加工物の先端の中
心よりも数mm程度離隔することにより、研磨盤面を広く
使用できるように設定してなる球面研磨装置である。A fifth feature of the apparatus according to the present invention is that the center of revolution of the polishing machine by the polishing machine revolving means in the first, second, third or fourth feature of the apparatus according to the present invention is set at the tip of the workpiece. This is a spherical polishing apparatus which is set so that it can be used widely by being spaced from the center by several mm.
【００３１】本発明装置の第６の特徴は、本発明装置の
第１、第２、第３、第４又は第５の特徴における前記被
加工物が、光コネクタフェルール（接合用補強円筒棒
材）である球面研磨装置である。A sixth feature of the device of the present invention resides in that, in the first, second, third, fourth or fifth feature of the device of the present invention, the workpiece is an optical connector ferrule (a reinforcing cylindrical rod material for joining). ).
【００３２】本発明方法の第１の特徴は、研磨盤面が同
心円状に複数の研磨帯領域に分割されてなる研磨盤と、
前記研磨盤を当該研磨盤の軸心回りに回転させる研磨盤
自転手段と、前記研磨盤の軸心自体をある軸心回りに回
転させる研磨盤公転手段と、前記研磨盤の研磨盤面に被
加工物の端面中心を位置付けて、当該被加工物を保持す
る保持手段と、前記保持手段にて保持された被加工物の
端面を前記研磨盤の研磨盤面に押し付ける直線案内手段
とを有する球面研磨装置において、前記研磨盤の研磨盤
面に研磨液を供給しながら、前記被加工物の端面を前記
研磨盤の公転中心に押し付けた状態にし、前記研磨盤自
転手段にて研磨盤面を回転させつつ、前記研磨盤公転手
段にて前記研磨盤の軸心自体をある軸心回りに回転させ
て前記被加工物の端面を球面状に研磨する球面研磨方法
において、前記研磨盤公転手段は、前記研磨盤の軸心自
体を各研磨帯領域に相当する半径で回転させる球面研磨
方法である。The first feature of the method of the present invention is that a polishing disk surface is divided concentrically into a plurality of polishing band regions,
Polishing machine rotating means for rotating the polishing machine around the axis of the polishing machine, polishing machine revolving means for rotating the axis of the polishing machine itself around a certain axis, and processing on the polishing surface of the polishing machine A spherical polishing apparatus comprising: holding means for positioning the center of the end face of the workpiece to hold the workpiece; and linear guide means for pressing the end face of the workpiece held by the holding means against the polishing surface of the polishing machine. In, while supplying the polishing liquid to the polishing surface of the polishing plate, while the end face of the workpiece is pressed against the center of revolution of the polishing disk, while rotating the polishing disk surface by the polishing disk rotation means, In a spherical polishing method for polishing the end face of the workpiece to a spherical shape by rotating the axis itself of the polishing disk around a certain axis by polishing disk revolving means, the polishing disk revolving means includes a The axis itself is in each polishing zone area A spherical polishing method of rotating with the corresponding radii.
【００３３】本発明方法の第２の特徴は、研磨盤と、前
記研磨盤を当該研磨盤の軸心回りに回転させる研磨盤自
転手段と、前記研磨盤の軸心自体をある軸心回りに回転
させる研磨盤公転手段と、前記研磨盤の研磨盤面に被加
工物の端面中心を位置付けて、当該被加工物を保持する
保持手段と、前記保持手段にて保持された被加工物の端
面を前記研磨盤の研磨盤面に押し付ける直線案内手段と
を有する球面研磨装置において、前記研磨盤の研磨盤面
に研磨液を供給しながら、前記被加工物の端面を前記研
磨盤の公転中心に押し付けた状態にし、前記研磨盤自転
手段にて研磨盤面を回転させつつ、前記研磨盤公転手段
にて前記研磨盤の軸心自体をある軸心回りに回転させて
前記被加工物の端面を球面状に研磨する球面研磨方法に
おいて、前記研磨盤公転手段による研磨盤の公転中心
を、被加工物の先端の中心よりも数mm程度離隔すること
により、研磨盤面を広く使用してなる球面研磨方法であ
る。A second feature of the method of the present invention is that a polishing disk, a polishing disk rotating means for rotating the polishing disk around the axis of the polishing disk, and an axis itself of the polishing disk around a certain axis. Polishing machine revolving means for rotating, the center of the end face of the workpiece on the polishing surface of the polishing machine, holding means for holding the workpiece, and the end face of the workpiece held by the holding means. In a spherical polishing apparatus having linear guide means for pressing against the polishing surface of the polishing plate, a state in which the end surface of the workpiece is pressed against the revolving center of the polishing plate while supplying a polishing liquid to the polishing surface of the polishing plate. Then, while rotating the polishing plate surface by the polishing plate rotating means, the polishing plate revolving means rotates the axis of the polishing plate itself around a certain axis to polish the end face of the workpiece into a spherical shape. The spherical polishing method, The revolution center of the polishing plate by revolving means, by spaced about several mm from the center of the tip of the workpiece is a spherical polishing method comprising using the polishing board wide.
【００３４】本発明方法の第１の特徴は、本発明方法の
第１の特徴における前記研磨盤公転手段による研磨盤の
公転中心を、被加工物の先端の中心よりも数mm程度離隔
することにより、研磨盤面を広く使用してなる球面研磨
方法である。A first feature of the method of the present invention is that the center of revolution of the polishing machine by the polishing machine revolving means in the first feature of the method of the present invention is separated by about several mm from the center of the tip of the workpiece. Is a spherical polishing method in which the polishing surface is widely used.
【００３５】本発明方法の第１の特徴は、本発明方法の
第１、第２、第３の特徴における前記被加工物が、光コ
ネクタフェルール（接合用補強円筒棒材）である球面研
磨方法である。A first feature of the method of the present invention is that the workpiece in the first, second, and third features of the method of the present invention is a spherical polishing method in which the workpiece is an optical connector ferrule (reinforcement cylindrical rod for joining). It is.
【００３６】[0036]
【作用】本発明は、前記のような新規な手段及び手法を
講じているので、以下のような作用をなす。The present invention employs the above-described new means and techniques, and thus has the following effects.
【００３７】本発明によれば、被加工物を回転させずに
固定しても、研磨盤の公転によって、研磨の目の方向が
順次移動するので、被加工物に回転を与えたと同じ作用
が生じる。したがって、高精度の研磨形状を得ることが
できる。According to the present invention, even if the workpiece is fixed without being rotated, the direction of the polished eyes is sequentially moved by the revolution of the polishing machine, so that the same effect as when the workpiece is rotated is obtained. Occurs. Therefore, a highly accurate polished shape can be obtained.
【００３８】本発明では、被加工物を回転させないの
で、被加工物の保持機構（把持機構）を簡易な構造にで
き、しかも被加工物の軸心の傾き調整機構をも簡易に実
現することができる。なお、 ＰＣ研磨又は斜めＰＣ研
磨は、研磨盤面に対して被加工物の軸心を垂直に押し当
てて研磨するか、又は斜めに押し当てて研磨するかによ
って行う。In the present invention, since the workpiece is not rotated, the mechanism for holding the workpiece (gripping mechanism) can be simplified, and the mechanism for adjusting the inclination of the axis of the workpiece can be easily realized. Can be. Note that the PC polishing or the oblique PC polishing is performed depending on whether the polishing is performed by pressing the axis of the workpiece perpendicularly to the surface of the polishing board, or by pressing obliquely.
【００３９】さらに、本発明は、研磨盤を正逆回転させ
る繁雑な回転駆動制御が不要なので、研磨盤の回転数の
高速化により研磨能率を向上させることができる。特
に、光コネクタの接合部に取り付けられるフェルールの
先端を球面状に研磨する場合に好適である。Further, according to the present invention, since complicated rotation drive control for rotating the polishing disk in the normal and reverse directions is unnecessary, the polishing efficiency can be improved by increasing the rotation speed of the polishing disk. In particular, it is suitable when the tip of the ferrule attached to the joint of the optical connector is polished into a spherical shape.
【００４０】[0040]
【実施例】以下、添付図面を参照し、本発明をその装置
例及び方法例に基づいて、より詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail below with reference to the accompanying drawings based on an example of an apparatus and an example of a method.
【００４１】本装置例及び方法例では、研磨対象の被加
工物を光ファイバのコネクタ（光コネクタ）の接合部に
取り付けるフェルール（接合用補強円筒棒材）とした
が、本発明装置及び方法は、その他の被加工物にも適用
できるものである。In this example of the apparatus and the method, the work to be polished is a ferrule (reinforcement cylindrical rod for joining) to be attached to the joint of the optical fiber connector (optical connector). And other workpieces.
【００４２】（装置例） 図１は本装置例の球面研磨装置Ａの全体構成を、図２は
本装置例で使用する研磨盤の構成を、図３は同球面研磨
装置の研磨盤の公転方法を、図４（ａ）及び（ｂ）はフ
ェルールの保持部の構成を、それぞれ示している。(Example of Apparatus) FIG. 1 shows the overall configuration of a spherical polishing apparatus A of the present apparatus example, FIG. 2 shows the configuration of a polishing disk used in this example of the apparatus, and FIG. FIGS. 4A and 4B show the structure of the ferrule holding unit, respectively.
【００４３】図１に示すように、本装置例の球面研磨装
置２０は、研磨盤１１、スピンドルモータ１２、Ｚステ
ージ１３、Ｘステージ１４、フェルール２を保持する保
持部１５を備えている。As shown in FIG. 1, the spherical polishing apparatus 20 of the present example includes a polishing table 11, a spindle motor 12, a Z stage 13, an X stage 14, and a holding section 15 for holding the ferrule 2.
【００４４】研磨盤１１は、外周側から内周側に向かっ
て設けられたダイヤモンド砥石１１ａ、粗研磨砥石１１
ｂ、仕上げ研磨砥石１１ｃを組合わせた構成をしてい
る。The polishing machine 11 includes a diamond grindstone 11a and a rough polishing grindstone 11a provided from the outer peripheral side toward the inner peripheral side.
b, a configuration in which the finish polishing grindstone 11c is combined.
【００４５】粗研磨砥石１１ｂ及び仕上げ研磨砥石１１
ｃには、１枚の太鼓状に張り上げた弾性研磨フィルムが
用いられ、分割リング１１ｄにて粗研磨帯域と仕上げ研
磨帯域とが分割されている。Rough grinding wheel 11b and finish grinding wheel 11
For c, an elastic polishing film stretched in a drum shape is used, and a rough polishing zone and a finish polishing zone are divided by a split ring 11d.
【００４６】ダイヤモンド砥石１１ａはフェルール２の
端面の接着剤除去及び平面形成のための研削帯域を構成
し、粗研磨砥石１１ｂはフェルール２の端面を凸球面に
形成する研磨帯域を構成し、仕上げ研磨砥石１１ｃはフ
ェルール２の凸球面を無擾乱鏡面研磨する研磨帯域を構
成している。The diamond grindstone 11a constitutes a grinding zone for removing the adhesive from the end face of the ferrule 2 and forms a flat surface, and the rough polishing grindstone 11b constitutes a polishing zone for forming the end face of the ferrule 2 to a convex spherical surface. The grindstone 11c constitutes a polishing zone for non-disturbing mirror polishing of the convex spherical surface of the ferrule 2.
【００４７】なお、研磨盤１１を用いて実際に研磨する
場合には、フェルール２を外周側から中心に向かい各研
磨帯域の半径ｒ１、ｒ２、ｒ３の位置に順次押し当てて
研磨する。When the polishing is actually performed using the polishing disk 11, the ferrule 2 is pressed from the outer peripheral side toward the center to the positions of the radii r1, r2, and r3 of the respective polishing zones in order to perform polishing.
【００４８】スピンドルモータ１２は、その駆動軸に研
磨盤１１の軸心が同一に直結され、研磨盤１１を回転駆
動させる機構（研磨盤自転手段）になっている。The spindle motor 12 has a drive shaft that is directly connected to the axis of the polishing disk 11 in the same manner, and serves as a mechanism for driving the polishing disk 11 to rotate (polishing disk rotating means).
【００４９】Ｚステージ１３は、図３に示すように、上
下方向（垂直方向）に移動する可動部１３ａが設けら
れ、この可動部１３ａにはスピンドルモータ１２が載置
されて固定されている。As shown in FIG. 3, the Z stage 13 is provided with a movable portion 13a that moves in a vertical direction (vertical direction), and the spindle motor 12 is mounted and fixed on the movable portion 13a.
【００５０】Ｘステージ１４は、横方向（水平方向）に
移動する可動部１４ａが設けられ、この可動部１４ａに
はＺステージ１３が載置されて固定されている。The X stage 14 is provided with a movable portion 14a that moves in the horizontal direction (horizontal direction), and the Z stage 13 is mounted and fixed on the movable portion 14a.
【００５１】Ｚステージ１３及びＸステージ１４の駆動
制御（研磨盤公転手段）により、図２に示すように、フ
ェルール２の軸心を中心にそれぞれの半径ｒ１、ｒ２、
ｒ３で円運動するように研磨盤１１が公転する。By controlling the driving of the Z stage 13 and the X stage 14 (revolving means of the polishing machine), as shown in FIG.
The polishing disk 11 revolves to make a circular motion at r3.
【００５２】保持部１５は、図４（ｂ）に示すように、
研磨盤１１に対向させた位置にフェルール２を保持する
保持手段と、研磨盤１１にフェルール２の先端を押し付
けたり、退避させたりする直線案内手段と、研磨盤１１
の面に対してフェルール２の軸心の傾きを調整する傾き
調整手段とを備えている。[0052] As shown in FIG.
Holding means for holding the ferrule 2 at a position opposed to the polishing disk 11; linear guide means for pressing the tip of the ferrule 2 against the polishing disk 11 or retracting the same;
And a tilt adjusting means for adjusting the tilt of the axis of the ferrule 2 with respect to the surface.
【００５３】さらに詳細に説明すると、保持部１５は、
チャック１５ａ、直線案内機構１５ｂ、ボイスコイルモ
ータ１５ｃ、可動部１５ｄ、可動ボビン１５ｅ及び傾き
調整機構１５ｆから構成されている。More specifically, the holding unit 15
It comprises a chuck 15a, a linear guide mechanism 15b, a voice coil motor 15c, a movable section 15d, a movable bobbin 15e, and a tilt adjustment mechanism 15f.
【００５４】チャック１５ａは、フェルール２を把持し
て固定できる構造になっており、可動ボビン１５ｅと連
動する可動部１５ｄに取り付けられている。したがっ
て、ボイスコイルモータ１５ｃへの印加電流の極性を変
えることにより、直線案内機構１５ｂの可動部１５ｄが
往復運動するので、チャック１５ａに把持されたフェル
ール２の先端を研磨盤１１に押し付けたり、退避させた
りすることができる。The chuck 15a has a structure capable of gripping and fixing the ferrule 2 and is attached to a movable portion 15d which is interlocked with a movable bobbin 15e. Therefore, by changing the polarity of the current applied to the voice coil motor 15c, the movable portion 15d of the linear guide mechanism 15b reciprocates, so that the tip of the ferrule 2 gripped by the chuck 15a is pressed against the polishing disk 11 or retracted. Or can be.
【００５５】傾き調整機構１５ｆは、水平面上で軸回転
させて研磨盤１１の研磨面に対するフェルール２の軸心
の傾きを調整する働きをする。なお、斜めＰＣ研磨の場
合には、図４（ａ）に示すようにθ傾けて、研磨盤１１
に研磨剤を供給しながら研磨することとなる。The tilt adjusting mechanism 15f functions to adjust the tilt of the axis of the ferrule 2 with respect to the polishing surface of the polishing disk 11 by rotating the shaft on a horizontal plane. In the case of oblique PC polishing, as shown in FIG.
The polishing is performed while the abrasive is supplied to the polishing pad.
【００５６】（方法例） 次に、上述した本装置例の装置を用いてＰＣ研磨する場
合の研磨工程（研削工程、粗研磨工程、仕上げ研磨工
程）について説明する。なお、本方法例では、公転速度
が１００ｒｐｍ前後、自転速度が数千ｒｐｍの範囲で、
それぞれ任意の回転速度が得られる装置を使用すること
とした。(Method Example) Next, a description will be given of a polishing step (grinding step, rough polishing step, finish polishing step) in the case of performing PC polishing using the above-described apparatus of the present apparatus example. In this method example, when the revolution speed is around 100 rpm and the rotation speed is several thousand rpm,
A device capable of obtaining an arbitrary rotation speed was used.
【００５７】［研削工程］ 先ず、退避しているチャック１５ａにフェルール２を取
り付けて固定する。次に、研磨盤１１を回転速度Ｎで自
転させるとともに、Ｚステージ１３及びＸステージ１４
の運動により研磨盤１１の軸心がフェルール２の軸心を
中心にして半径ｒ１、回転速度ｎで公転するように駆動
制御する。[Grinding Step] First, the ferrule 2 is attached and fixed to the retracted chuck 15a. Next, the polishing table 11 is rotated at the rotation speed N, and the Z stage 13 and the X stage 14 are rotated.
Is controlled so that the axis of the polishing machine 11 revolves around the axis of the ferrule 2 at a radius r1 and a rotation speed n.
【００５８】続いて、ボイスコイルモータ１５ｃに徐々
に（＋）電流を印加してチャック１５ａを移動させると
ともに、研磨盤１１のダイヤモンド砥石１１ａに研磨液
を流しながらフェルール２をダイヤモンド砥石１１ａに
押し当てて、押し付け力Ｆで一定時間保持して研削す
る。Subsequently, a (+) current is gradually applied to the voice coil motor 15c to move the chuck 15a, and at the same time, the ferrule 2 is pressed against the diamond grindstone 11a while flowing the polishing liquid to the diamond grindstone 11a of the polishing plate 11. Then, grinding is performed with the pressing force F held for a certain period of time.
【００５９】そして、所定時間の研削が終了した後、ボ
イスコイルモータ１５ｃの印加電流の極性を切り替え、
（−）電流を印可してチャック１５ａを移動させてフェ
ルール２を退避させる。After the grinding for a predetermined time is completed, the polarity of the current applied to the voice coil motor 15c is switched.
(-) The electric current is applied to move the chuck 15a to retract the ferrule 2.
【００６０】［粗研磨工程］ まず、研磨盤１１を回転速度Ｎで自転させるとともに、
Ｚステージ１３及びＸステージ１４の運動により研磨盤
１１の軸心がフェルール２の軸心を中心にして半径ｒ
２、回転速度ｎで公転するように駆動制御する。[Rough Polishing Step] First, the polishing disk 11 is rotated at a rotation speed N,
The movement of the Z stage 13 and the X stage 14 causes the axis of the polishing machine 11 to have a radius r around the axis of the ferrule 2.
2. Drive control to revolve at the rotation speed n.
【００６１】次にボイスコイルモータ１５ｃに徐々に
（＋）電流を印加してチャック１５ａを移動させるとと
もに、研磨盤１１の粗研磨砥石１１ｂに研磨液を流しな
がらフェルール２を粗研磨砥石１１ｂに押し当てて、押
し付け力Ｆで一定時間保持して研磨する。Next, a (+) current is gradually applied to the voice coil motor 15c to move the chuck 15a, and at the same time, the ferrule 2 is pressed against the coarse polishing grindstone 11b while flowing the polishing liquid through the coarse polishing grindstone 11b of the polishing board 11. Then, polishing is performed while holding the pressing force F for a certain period of time.
【００６２】そして、所定時間の研磨が終了した後、ボ
イスコイルモータ１５ｃの印加電流の極性を切り替え、
（−）電流を印可してチャック１５ａを移動させてフェ
ルール２を退避させる。After the polishing for a predetermined time is completed, the polarity of the current applied to the voice coil motor 15c is switched.
(-) The electric current is applied to move the chuck 15a to retract the ferrule 2.
【００６３】［仕上げ研磨工程］ まず、研磨盤１１を回転速度Ｎで自転させるとともに、
Ｚステージ１３及びＸステージ１４の運動により研磨盤
１１の軸心がフェルール２の軸心を中心にして半径ｒ
３、回転速度ｎで公転するように駆動制御する。[Finish Polishing Step] First, the polishing board 11 is rotated at a rotation speed N,
The movement of the Z stage 13 and the X stage 14 causes the axis of the polishing machine 11 to have a radius r around the axis of the ferrule 2.
3. Drive control to revolve at the rotation speed n.
【００６４】次にボイスコイルモータ１５ｃに徐々に
（＋）電流を印加してチャック１５ａを移動させるとと
もに、研磨盤１１の仕上げ砥石１１ｃ研磨液を流しなが
らフェルール２を仕上げ砥石１１ｃに押し当てて、押し
付け力Ｆで一定時間保持して研磨する。Next, a (+) current is gradually applied to the voice coil motor 15c to move the chuck 15a, and at the same time, the ferrule 2 is pressed against the finishing whetstone 11c while the polishing liquid of the finishing whetstone 11c of the polishing board 11 is flowing. Polishing is performed with the pressing force F held for a certain period of time.
【００６５】そして、所定時間の研磨が終了した後、ボ
イスコイルモータ１５ｃの印加電流の極性を切り替え、
（−）電流を印可してチャック１５ａを移動させてフェ
ルール２を退避させる。最後にチャック１５ａからフェ
ルール２を外すことにより一連の研磨工程が終了する。After the polishing for a predetermined time is completed, the polarity of the current applied to the voice coil motor 15c is switched.
(-) The electric current is applied to move the chuck 15a to retract the ferrule 2. Finally, by removing the ferrule 2 from the chuck 15a, a series of polishing steps is completed.
【００６６】なお、斜めＰＣ研磨の場合は、ＰＣ研磨と
同様の研磨工程にて研磨するが、傾き調整機構１５ｆに
よりフェルール２の軸心をθ傾けて、フェルール２の先
端の位置を移動量Ｄだけ移動させ、公転位置の制御量を
修正すれば良い。In the case of the oblique PC polishing, the polishing is performed in the same polishing step as the PC polishing, but the axis of the ferrule 2 is tilted by θ by the tilt adjusting mechanism 15f, and the position of the tip of the ferrule 2 is moved by the moving distance D. , And the control amount of the revolution position may be corrected.
【００６７】以上説明した装置例及び方法例によれば、
研磨盤１１の自転と公転は独立して制御されるので、研
磨盤１１の自転をより高速化することが可能となり、研
磨工程の所要時間の短縮化が図れる。また、各工程に適
した速度を選定することにより高能率な研磨ができる。According to the above-described apparatus example and method example,
Since the rotation and revolution of the polishing disk 11 are controlled independently, the rotation of the polishing disk 11 can be further accelerated, and the time required for the polishing step can be reduced. Further, by selecting a speed suitable for each step, highly efficient polishing can be performed.
【００６８】なお、本装置例の装置を用いた本方法例に
おける上記研磨工程の正味研磨時間を測定したところ、
約３０秒程度であった。従来の技術の欄で説明した第１
及び第２の従来例の研磨装置と比較すると、例えば、第
１の従来例の装置では１２本一活して研磨するが、その
一本当たりの研磨時間に換算すると１分強となり、第２
の従来例では２分強となる。When the net polishing time of the above polishing step in this example of the method using the apparatus of the present example was measured,
It took about 30 seconds. The first described in the section of the prior art
In comparison with the polishing apparatus according to the second conventional example, for example, the polishing apparatus according to the first conventional example performs polishing using 12 polishing heads, but when converted into the polishing time per polishing head, the polishing time is slightly over one minute,
In the prior art example, it is slightly more than two minutes.
【００６９】したがって、本装置例の球面研磨装置を使
用すれば、光コネクタのフェルール先端の研磨時間を従
来の装置と比較して１／２〜１／４に短縮することが可
能となる。Therefore, the use of the spherical polishing apparatus of this embodiment makes it possible to reduce the polishing time of the tip of the ferrule of the optical connector to 1/2 to 1/4 compared to the conventional apparatus.
【００７０】また、本装置例及び方法例によれば、公転
方向を１方向に設定できるので、被加工物であるフェル
ール２を回転させなくても、研磨盤１１の公転によっ
て、研磨の目の方向が順次移動し、あたかもフェルール
２に回転を与えたと同じ作用が生じて、高精度の研磨面
形状を得ることができる。Further, according to the present example of the apparatus and the example of the method, since the revolving direction can be set to one direction, the revolving of the polishing disk 11 can be performed without revolving the ferrule 2 which is a workpiece. The direction sequentially moves, and the same operation as if the ferrule 2 is rotated occurs, so that a highly accurate polished surface shape can be obtained.
【００７１】形状精度の比較の１例として、光ファイバ
の中心と凸球面頂点のずれ（頂点ずれ）は、従来では最
大５０μｍであったものが、本装置例の球面研磨装置で
は３０μｍ以下になり研磨精度の向上を確認することが
できた。As an example of the comparison of the shape accuracy, the deviation (vertex deviation) between the center of the optical fiber and the apex of the convex spherical surface is 50 μm at the maximum in the related art, but is 30 μm or less in the spherical polishing device of the present example. The improvement of the polishing accuracy was confirmed.
【００７２】上記装置例及び方法例の説明では、研磨盤
１１の公転中心とフェルール２の先端の中心とは合致し
ているが、研磨盤１１の公転中心とフェルール２先端の
中心とを僅かの量、例えば、Ｈmm程度Ｚ方向（垂直方
向）あるいはＸ方向（水平方向）にずらすことにより２
Ｈmmだけ研磨盤１１の研磨に使用する範囲を広げ、研磨
盤１１の耐久性を高めるようにしても良い。In the description of the example of the apparatus and the example of the method, the center of revolution of the polishing disc 11 and the center of the tip of the ferrule 2 coincide with each other, but the center of revolution of the polishing disc 11 and the center of the tip of the ferrule 2 are slightly different. By shifting in the Z direction (vertical direction) or the X direction (horizontal direction) by about Hmm, for example.
The range used for polishing the polishing plate 11 may be expanded by Hmm to increase the durability of the polishing plate 11.
【００７３】また、上記装置例及び方法例では数工程を
１個の研磨盤１１で処理する分割研磨盤を使用したが、
研磨盤１１に第１及び第２の従来例の装置のような１工
程のみを処理する研磨盤を用いて研磨しても同様に高速
・高精度の研磨が可能となる。Further, in the above-described apparatus example and method example, a divided polishing machine in which several steps are processed by one polishing machine 11 is used.
Similarly, high-speed and high-precision polishing can be performed even if the polishing is performed using a polishing disk that processes only one process, such as the first and second conventional apparatuses.
【００７４】さらに、本装置例では、研磨盤１１の研磨
面を横向き（垂直）に構成したが、研磨盤面を水平にし
た装置構成にしても良い。Further, in this example of the apparatus, the polishing surface of the polishing board 11 is configured to be horizontal (vertical). However, the apparatus may be configured so that the polishing board surface is horizontal.
【００７５】以上本発明の代表的な装置例及び方法例に
ついて説明したが、本発明は必ずしもこれらの装置例の
手段及び方法例の手法だけに限定されるものではなく、
本発明にいう目的を達成し、後述する効果を有する範囲
内において適宜変更して実施することができるものであ
る。Although the typical apparatus and method of the present invention have been described above, the present invention is not necessarily limited to only the means of the apparatus and the method of the method.
The present invention achieves the object of the present invention and can be carried out with appropriate modifications within a range having the effects described below.
【００７６】[0076]
【発明の効果】以上説明したように本発明によれば、研
磨盤の自転と公転は独立して制御することができるの
で、研磨盤の自転を高速化することができ、研磨工程の
所要時間の短縮化が図れるとともに、各工程に適した速
度を選定することにより高能率な研磨ができるという効
果を奏する。As described above, according to the present invention, the rotation and revolution of the polishing disk can be controlled independently, so that the rotation of the polishing disk can be sped up and the time required for the polishing process can be increased. In addition to the reduction of the polishing speed, there is an effect that a highly efficient polishing can be performed by selecting a speed suitable for each process.
【００７７】特に、光コネクタの接合部に取り付けられ
るフェルールの先端を研磨するのに好適な球面研磨装置
及び方法を提供することができる。In particular, it is possible to provide a spherical polishing apparatus and method suitable for polishing the tip of a ferrule attached to a joint of an optical connector.
【００７８】本発明の構成に、傾き調整手段を設けた場
合は、同手段でフェルールの取付角度を容易に調整でき
るので、ＰＣ研磨と斜めＰＣ研磨との変更を容易にする
ことができる。When the tilt adjusting means is provided in the structure of the present invention, the mounting angle of the ferrule can be easily adjusted by the means, so that it is possible to easily change between PC polishing and oblique PC polishing.
【図１】本発明に係る本装置例の球面研磨装置の全体構
成を示す平面図である。FIG. 1 is a plan view showing an overall configuration of a spherical polishing apparatus of an example of the present apparatus according to the present invention.
【図２】本装置例で使用する研磨盤の構成を示す斜視図
である。FIG. 2 is a perspective view showing a configuration of a polishing machine used in the present apparatus example.
【図３】本装置例の研磨盤の公転方法を示した説明図で
あるFIG. 3 is an explanatory diagram showing a method of revolving the polishing machine of the present example of the apparatus.
【図４】（ａ）は本装置例の保持部の構成を示した平面
図、（ｂ）は本装置例の保持部の構成を示した側面図で
ある。FIG. 4A is a plan view illustrating a configuration of a holding unit of the present device example, and FIG. 4B is a side view illustrating a configuration of a holding unit of the present device example.
【図５】（ａ）は光コネクタの接続状態を示した要部拡
大断面図、（ｂ）は別例の光コネクタの接続状態を示し
た要部拡大断面図である。5A is an enlarged sectional view of a main part showing a connection state of an optical connector, and FIG. 5B is an enlarged sectional view of a main part showing a connection state of another example of an optical connector.
【図６】第１の従来例の研磨装置の外観構成を示した斜
視図である。FIG. 6 is a perspective view showing an external configuration of a polishing apparatus according to a first conventional example.
【図７】（ａ）はＰＣ研磨の場合のフェルールの保持方
法を示した断面図、（ｂ）は斜めＰＣ研磨の場合のフェ
ルールの保持方法を示した断面図である。7A is a cross-sectional view illustrating a method of holding a ferrule in the case of PC polishing, and FIG. 7B is a cross-sectional view illustrating a method of holding a ferrule in the case of oblique PC polishing.
【図８】従来例のフェルール端面の研磨方法を示した図
である。FIG. 8 is a diagram showing a conventional ferrule end surface polishing method.
【図９】第２の従来例の研磨装置の要部構成を示した断
面図である。FIG. 9 is a cross-sectional view showing a main configuration of a polishing apparatus according to a second conventional example.
１…割スリーブ ２、２ａ、２ｂ…フェルール（光コネクタフェルール） ３…研磨盤面 ４ａ、４ｂ…取り付け金具 ５…研磨盤 ６…弾性体 ７…研磨シート ８…研磨液 ９…弾性研磨盤 １０…樹脂系フィルム １１…研磨盤 １１ａ…ダイヤモンド砥石 １１ｂ…粗研磨砥石 １１ｃ…仕上げ研磨砥石 １１ｄ…分割リング １２…スピンドルモータ １３…Ｚステージ １３ａ、１４ａ…可動部 １４…Ｘステージ １５…保持部 １５ａ…チャック １５ｂ…直線案内機構 １５ｃ…ボイスコイルモータ １５ｄ…可動部 １５ｅ…可動ボビン １５ｆ…傾き調整機構 Ａ…球面研磨装置 DESCRIPTION OF SYMBOLS 1 ... Split sleeve 2, 2a, 2b ... Ferrule (optical connector ferrule) 3 ... Polishing board surface 4a, 4b ... Mounting bracket 5 ... Polishing board 6 ... Elastic body 7 ... Polishing sheet 8 ... Polishing liquid 9 ... Elastic polishing board 10 ... Resin System film 11 Polishing machine 11a Diamond grindstone 11b Coarse polishing grindstone 11c Finish polishing grindstone 11d Split ring 12 Spindle motor 13 Z stage 13a, 14a Movable part 14 X stage 15 Holding part 15a Chuck 15b ... Linear guide mechanism 15c ... Voice coil motor 15d ... Movable part 15e ... Movable bobbin 15f ... Tilt adjusting mechanism A ... Spherical polishing device
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−22263（ＪＰ，Ａ) 特開 平１−121160（ＪＰ，Ａ) 特開 昭55−28058（ＪＰ，Ａ) 特開 昭63−207552（ＪＰ，Ａ) 特開 昭64−71659（ＪＰ，Ａ) 特開 昭63−278759（ＪＰ，Ａ) 特開 平７−27923（ＪＰ，Ａ) 実開 昭59−109452（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) B24B 19/00 603 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-22263 (JP, A) JP-A-1-121160 (JP, A) JP-A 55-28058 (JP, A) JP-A 63-263 207552 (JP, A) JP-A-64-71659 (JP, A) JP-A-63-278759 (JP, A) JP-A-7-27923 (JP, A) Japanese Utility Model Laid-Open No. 59-109452 (JP, U) (58) Field surveyed (Int. Cl. 6 , DB name) B24B 19/00 603
Claims (10)
分割された研磨盤と、 前記研磨盤の研磨帯領域を当該研磨盤の軸心回りに回転
させる研磨盤自転手段と、前記研磨盤の軸心自体をある
軸心回りに回転させる研磨盤公転手段と、前記研磨盤の
各研磨盤面に被加工物の端面中心を位置付けて、当該被
加工物を保持する保持手段と、前記保持手段に保持され
た被加工物の端面を前記研磨盤の研磨盤面に押し付ける
直線案内手段とを有する球面研磨装置において、 前記研磨盤公転手段は、前記研磨盤の軸心自体を各研磨
帯領域に相当する半径で回転させる、 ことを特徴とする球面研磨装置。1. A polishing machine having a polishing surface divided into a plurality of polishing bands in a concentric manner, a polishing disk rotating means for rotating the polishing band of the polishing disk about an axis of the polishing disk, and the polishing machine. Polishing machine revolving means for rotating the axis of the board itself about a certain axis, holding means for holding the work piece by positioning the center of the end face of the work piece on each polishing face of the polishing machine, and Linear polishing means for pressing the end face of the workpiece held by the means against the polishing surface of the polishing machine, wherein the polishing machine revolving means moves the axis of the polishing machine itself to each polishing band region. A spherical polishing apparatus characterized by rotating by a corresponding radius.
回りに回転させる研磨盤自転手段と、前記研磨盤の軸心
自体をある軸心回りに回転させる研磨盤公転手段と、前
記研磨盤の研磨盤面に被加工物の端面中心を位置付け
て、当該被加工物を保持する保持手段と、前記保持手段
に保持された被加工物の端面を前記研磨盤の研磨盤面に
押し付ける直線案内手段とを有する球面研磨装置におい
て、 前記直線案内手段と前記保持手段との間に、さらに、 前記研磨盤の研磨盤面に対して被加工物の軸心の傾きを
調整する傾き調整手段を備えた、 ことを特徴とする球面研磨装置。2. A polishing machine, a polishing machine rotating means for rotating the polishing machine about an axis of the polishing machine, a polishing machine revolving means for rotating an axis of the polishing machine itself around a certain axis. Holding means for holding the work piece by positioning the center of the end face of the work piece on the polishing face of the polishing disc, and a straight line for pressing the end face of the work piece held by the holding means against the polishing face of the polishing disc. A spherical polishing apparatus having a guide means, between the linear guide means and the holding means, further comprising a tilt adjusting means for adjusting a tilt of an axis of the workpiece with respect to a polishing surface of the polishing plate. A spherical polishing device characterized by the above-mentioned.
分割された研磨盤と、 前記研磨盤の研磨帯領域を当該研磨盤の軸心回りに回転
させる研磨盤自転手段と、前記研磨盤の軸心自体をある
軸心回りに回転させる研磨盤公転手段と、前記研磨盤の
各研磨盤面に被加工物の端面中心を位置付けて、当該被
加工物を保持する保持手段と、前記保持手段に保持され
た被加工物の端面を前記研磨盤の研磨盤面に押し付ける
直線案内手段とを有する球面研磨装置において、 前記直線案内手段と前記保持手段との間に、さらに、 前記研磨盤の研磨盤面に対して被加工物の軸心の傾きを
調整する傾き調整手段を備えた、 ことを特徴とする球面研磨装置。3. A polishing machine in which the surface of a polishing machine is concentrically divided into a plurality of polishing band regions; a polishing machine rotating means for rotating the polishing band region of the polishing machine around the axis of the polishing machine; Polishing machine revolving means for rotating the axis of the board itself about a certain axis, holding means for holding the work piece by positioning the center of the end face of the work piece on each polishing face of the polishing machine, and A spherical polishing device having linear guide means for pressing an end face of a workpiece held by a means against a polishing surface of the polishing plate, wherein between the linear guide means and the holding means, further polishing of the polishing plate. A spherical polishing apparatus comprising: a tilt adjusting means for adjusting a tilt of an axis of a workpiece with respect to a board surface.
に、さらに、 前記研磨盤の研磨盤面に対して被加工物の軸心の傾きを
調整する傾き調整手段を備えた、 ことを特徴とする請求項１に記載の球面研磨装置。4. The apparatus according to claim 1, further comprising a tilt adjusting means for adjusting a tilt of an axis of the workpiece with respect to a polishing surface of the polishing machine, between the linear guide means and the holding means. The spherical polishing apparatus according to claim 1, wherein
心を、 被加工物の先端の中心よりも数mm程度離隔することによ
り、研磨盤面を広く使用できるように設定した、 ことを特徴とする請求項１、２、３又は４に記載の球面
研磨装置。5. The polishing machine is characterized in that the center of revolution of the polishing machine by the polishing machine revolving means is separated from the center of the tip of the workpiece by about several mm so that the surface of the polishing machine can be widely used. The spherical polishing device according to claim 1, 2, 3, or 4, which performs the polishing.
球面研磨装置。6. The spherical polishing apparatus according to claim 1, wherein the workpiece is an optical connector ferrule (reinforcement cylindrical rod for joining).
分割されてなる研磨盤と、前記研磨盤を当該研磨盤の軸
心回りに回転させる研磨盤自転手段と、前記研磨盤の軸
心自体をある軸心回りに回転させる研磨盤公転手段と、
前記研磨盤の研磨盤面に被加工物の端面中心を位置付け
て、当該被加工物を保持する保持手段と、前記保持手段
にて保持された被加工物の端面を前記研磨盤の研磨盤面
に押し付ける直線案内手段とを有する球面研磨装置にお
いて、 前記研磨盤の研磨盤面に研磨液を供給しながら、前記被
加工物の端面を前記研磨盤の公転中心に押し付けた状態
にし、前記研磨盤自転手段にて研磨盤面を回転させつ
つ、前記研磨盤公転手段にて前記研磨盤の軸心自体をあ
る軸心回りに回転させて前記被加工物の端面を球面状に
研磨する球面研磨方法において、 前記研磨盤公転手段は、前記研磨盤の軸心自体を各研磨
帯領域に相当する半径で回転させる、 ことを特徴とする球面研磨方法。7. A polishing machine in which a polishing machine surface is concentrically divided into a plurality of polishing belt regions, a polishing machine rotating means for rotating the polishing machine about an axis of the polishing machine, and an axis of the polishing machine. Polishing machine revolving means for rotating the core itself around a certain axis,
Positioning the center of the end face of the workpiece on the polishing surface of the polishing machine, holding means for holding the workpiece, and pressing the end face of the workpiece held by the holding means against the polishing surface of the polishing machine In a spherical polishing apparatus having linear guide means, while supplying a polishing liquid to the polishing surface of the polishing plate, the end surface of the workpiece is pressed against the center of revolution of the polishing disk, and the polishing disk rotation means A spherical polishing method for rotating the axis of the polishing disk itself around a certain axis by the polishing disk revolving means while rotating the polishing disk surface, thereby polishing the end surface of the workpiece to a spherical shape. The ball revolving means rotates the axis of the polishing disk itself at a radius corresponding to each polishing band region.
回りに回転させる研磨盤自転手段と、前記研磨盤の軸心
自体をある軸心回りに回転させる研磨盤公転手段と、前
記研磨盤の研磨盤面に被加工物の端面中心を位置付け
て、当該被加工物を保持する保持手段と、前記保持手段
にて保持された被加工物の端面を前記研磨盤の研磨盤面
に押し付ける直線案内手段とを有する球面研磨装置にお
いて、 前記研磨盤の研磨盤面に研磨液を供給しながら、前記被
加工物の端面を前記研磨盤の公転中心に押し付けた状態
にし、前記研磨盤自転手段にて研磨盤面を回転させつ
つ、前記研磨盤公転手段にて前記研磨盤の軸心自体をあ
る軸心回りに回転させて前記被加工物の端面を球面状に
研磨する球面研磨方法において、 前記研磨盤公転手段による研磨盤の公転中心を、被加工
物の先端の中心よりも数mm程度離隔することにより、研
磨盤面を広く使用した、 ことを特徴とする球面研磨方法。8. A polishing machine, polishing machine rotating means for rotating the polishing machine about an axis of the polishing machine, polishing machine revolving means for rotating the axis of the polishing machine itself around a certain axis. Positioning the center of the end face of the workpiece on the polishing surface of the polishing machine, holding means for holding the workpiece, and pressing the end face of the workpiece held by the holding means against the polishing surface of the polishing machine In a spherical polishing apparatus having linear guide means, while supplying a polishing liquid to the polishing surface of the polishing plate, the end surface of the workpiece is pressed against the center of revolution of the polishing disk, and the polishing disk rotation means A spherical polishing method for rotating the axis of the polishing disk itself around a certain axis by the polishing disk revolving means while rotating the polishing disk surface, thereby polishing the end surface of the workpiece to a spherical shape. Of polishing machine by means of board revolution The rolling center, by spaced about several mm from the center of the tip of the workpiece, using a polishing board wide, spherical polishing method characterized by.
心を、 被加工物の先端の中心よりも数mm程度離隔することによ
り、研磨盤面を広く使用した、 ことを特徴とする請求項７に記載の球面研磨方法。9. The polishing disk surface is widely used by separating the center of revolution of the polishing disk by the polishing disk revolving means by about several mm from the center of the front end of the workpiece. The spherical polishing method according to 1.
方法。10. The spherical polishing method according to claim 7, wherein the workpiece is an optical connector ferrule (reinforced cylindrical rod for joining).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7063854A JP2877158B2 (en) | 1995-03-23 | 1995-03-23 | Spherical polishing device and spherical polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7063854A JP2877158B2 (en) | 1995-03-23 | 1995-03-23 | Spherical polishing device and spherical polishing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08257887A JPH08257887A (en) | 1996-10-08 |
| JP2877158B2 true JP2877158B2 (en) | 1999-03-31 |
Family
ID=13241349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7063854A Expired - Fee Related JP2877158B2 (en) | 1995-03-23 | 1995-03-23 | Spherical polishing device and spherical polishing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2877158B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2991090B2 (en) * | 1995-07-21 | 1999-12-20 | 日本電気株式会社 | Spherical surface processing method and apparatus |
| JP2001322061A (en) * | 2000-05-16 | 2001-11-20 | Nippon Telegraph & Telephone East Corp | Device and method for polishing end face of optical fiber |
| JP5906178B2 (en) * | 2012-12-20 | 2016-04-20 | 日本電信電話株式会社 | Optical fiber polishing sheet, optical fiber tip processing apparatus and polishing processing method |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5528058A (en) * | 1978-08-22 | 1980-02-28 | Nippon Telegr & Teleph Corp <Ntt> | End face forming device of connector for optical fiber connection |
| JPS59109452U (en) * | 1983-01-11 | 1984-07-24 | 株式会社デイスコ | Electroplated whetstone |
| JPS6322263A (en) * | 1986-07-10 | 1988-01-29 | Nippon Telegr & Teleph Corp <Ntt> | Tip machining device for optical connector part |
| JPS63207552A (en) * | 1987-02-23 | 1988-08-26 | Nippon Telegr & Teleph Corp <Ntt> | Face polishing device for bar stock |
| JPS63278759A (en) * | 1987-05-08 | 1988-11-16 | Toyo Shinku Kako Kk | Polishing device for curved surface of cylindrical member |
| US4818263A (en) * | 1987-06-11 | 1989-04-04 | Tektronix, Inc. | Method and apparatus for precisely positioning microlenses on optical fibers |
| JPH01121160A (en) * | 1987-11-04 | 1989-05-12 | Nakamuratome Seimitsu Kogyo Kk | Spherical surface grinding attachment for ferrule tip |
| JP3137219B2 (en) * | 1993-07-06 | 2001-02-19 | 本多通信工業株式会社 | Ferrule end grinding machine |
-
1995
- 1995-03-23 JP JP7063854A patent/JP2877158B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08257887A (en) | 1996-10-08 |
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