JP2876690B2 - Resin composition for shielding electromagnetic waves - Google Patents
Resin composition for shielding electromagnetic wavesInfo
- Publication number
- JP2876690B2 JP2876690B2 JP2062131A JP6213190A JP2876690B2 JP 2876690 B2 JP2876690 B2 JP 2876690B2 JP 2062131 A JP2062131 A JP 2062131A JP 6213190 A JP6213190 A JP 6213190A JP 2876690 B2 JP2876690 B2 JP 2876690B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- compound
- resin composition
- monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title claims description 30
- -1 aromatic vinyl compound Chemical class 0.000 claims description 51
- 239000000178 monomer Substances 0.000 claims description 32
- 229920002554 vinyl polymer Polymers 0.000 claims description 32
- 239000003063 flame retardant Substances 0.000 claims description 30
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 26
- 239000011231 conductive filler Substances 0.000 claims description 25
- 229920000515 polycarbonate Polymers 0.000 claims description 16
- 239000004417 polycarbonate Substances 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 15
- 229920001971 elastomer Polymers 0.000 claims description 14
- 150000001463 antimony compounds Chemical class 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- 229920000728 polyester Polymers 0.000 claims description 7
- 229920001169 thermoplastic Polymers 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 239000004416 thermosoftening plastic Substances 0.000 claims description 7
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims 5
- 150000003440 styrenes Chemical class 0.000 description 22
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 20
- 239000000835 fiber Substances 0.000 description 17
- 238000000465 moulding Methods 0.000 description 15
- 239000000126 substance Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 239000005060 rubber Substances 0.000 description 6
- CYLVUSZHVURAOY-UHFFFAOYSA-N 2,2-dibromoethenylbenzene Chemical compound BrC(Br)=CC1=CC=CC=C1 CYLVUSZHVURAOY-UHFFFAOYSA-N 0.000 description 5
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- JHJUYGMZIWDHMO-UHFFFAOYSA-N 2,6-dibromo-4-(3,5-dibromo-4-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(Br)C(O)=C(Br)C=C1S(=O)(=O)C1=CC(Br)=C(O)C(Br)=C1 JHJUYGMZIWDHMO-UHFFFAOYSA-N 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002366 halogen compounds Chemical class 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- YMOONIIMQBGTDU-VOTSOKGWSA-N [(e)-2-bromoethenyl]benzene Chemical compound Br\C=C\C1=CC=CC=C1 YMOONIIMQBGTDU-VOTSOKGWSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 229920003244 diene elastomer Polymers 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 description 2
- LJDGJCNHVGGOFW-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-(2-bromophenoxy)benzene Chemical compound BrC1=CC=CC=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br LJDGJCNHVGGOFW-UHFFFAOYSA-N 0.000 description 1
- ORYGKUIDIMIRNN-UHFFFAOYSA-N 1,2,3,4-tetrabromo-5-(2,3,4,5-tetrabromophenoxy)benzene Chemical compound BrC1=C(Br)C(Br)=CC(OC=2C(=C(Br)C(Br)=C(Br)C=2)Br)=C1Br ORYGKUIDIMIRNN-UHFFFAOYSA-N 0.000 description 1
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- AHBGXHAWSHTPOM-UHFFFAOYSA-N 1,3,2$l^{4},4$l^{4}-dioxadis***e 2,4-dioxide Chemical compound O=[Sb]O[Sb](=O)=O AHBGXHAWSHTPOM-UHFFFAOYSA-N 0.000 description 1
- YATIGPZCMOYEGE-UHFFFAOYSA-N 1,3,5-tribromo-2-[2-(2,4,6-tribromophenoxy)ethoxy]benzene Chemical compound BrC1=CC(Br)=CC(Br)=C1OCCOC1=C(Br)C=C(Br)C=C1Br YATIGPZCMOYEGE-UHFFFAOYSA-N 0.000 description 1
- LXIZRZRTWSDLKK-UHFFFAOYSA-N 1,3-dibromo-5-[2-[3,5-dibromo-4-(2,3-dibromopropoxy)phenyl]propan-2-yl]-2-(2,3-dibromopropoxy)benzene Chemical compound C=1C(Br)=C(OCC(Br)CBr)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OCC(Br)CBr)C(Br)=C1 LXIZRZRTWSDLKK-UHFFFAOYSA-N 0.000 description 1
- KCFXNGDHQPMIAQ-UHFFFAOYSA-N 1-(4-methylphenyl)pyrrole-2,5-dione Chemical compound C1=CC(C)=CC=C1N1C(=O)C=CC1=O KCFXNGDHQPMIAQ-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 1
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- AACBVWDCZOZKLK-UHFFFAOYSA-N 2-(3,3-dibromopropyl)phenol Chemical compound OC1=CC=CC=C1CCC(Br)Br AACBVWDCZOZKLK-UHFFFAOYSA-N 0.000 description 1
- IXDMCRDIEUXFAU-UHFFFAOYSA-N 2-(tribromomethyl)phenol Chemical compound OC1=CC=CC=C1C(Br)(Br)Br IXDMCRDIEUXFAU-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- YMOONIIMQBGTDU-UHFFFAOYSA-N 2-bromoethenylbenzene Chemical compound BrC=CC1=CC=CC=C1 YMOONIIMQBGTDU-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- KBKNKFIRGXQLDB-UHFFFAOYSA-N 2-fluoroethenylbenzene Chemical compound FC=CC1=CC=CC=C1 KBKNKFIRGXQLDB-UHFFFAOYSA-N 0.000 description 1
- FAVWXKQADKRESO-UHFFFAOYSA-N 2-methylprop-2-enoic acid;prop-1-ene Chemical compound CC=C.CC(=C)C(O)=O FAVWXKQADKRESO-UHFFFAOYSA-N 0.000 description 1
- XFDQYYUJIBWHQS-UHFFFAOYSA-N 3,10-dioxabicyclo[10.2.2]hexadeca-1(14),12,15-triene-2,11-dione Chemical compound O=C1OCCCCCCOC(=O)C2=CC=C1C=C2 XFDQYYUJIBWHQS-UHFFFAOYSA-N 0.000 description 1
- UMCJBTSSUZACCQ-UHFFFAOYSA-N 3,9-dioxabicyclo[9.2.2]pentadeca-1(13),11,14-triene-2,10-dione Chemical compound O=C1OCCCCCOC(=O)C2=CC=C1C=C2 UMCJBTSSUZACCQ-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- GZFGOTFRPZRKDS-UHFFFAOYSA-N 4-bromophenol Chemical compound OC1=CC=C(Br)C=C1 GZFGOTFRPZRKDS-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 101000825841 Homo sapiens Vacuolar-sorting protein SNF8 Proteins 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 102100022787 Vacuolar-sorting protein SNF8 Human genes 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 229910000411 antimony tetroxide Inorganic materials 0.000 description 1
- KIQKNTIOWITBBA-UHFFFAOYSA-K antimony(3+);phosphate Chemical compound [Sb+3].[O-]P([O-])([O-])=O KIQKNTIOWITBBA-UHFFFAOYSA-K 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- WXCZUWHSJWOTRV-UHFFFAOYSA-N but-1-ene;ethene Chemical compound C=C.CCC=C WXCZUWHSJWOTRV-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
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- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
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- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- MGNCLNQXLYJVJD-UHFFFAOYSA-N cyanuric chloride Chemical compound ClC1=NC(Cl)=NC(Cl)=N1 MGNCLNQXLYJVJD-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 229910000830 fernico Inorganic materials 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- SVHOVVJFOWGYJO-UHFFFAOYSA-N pentabromophenol Chemical compound OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br SVHOVVJFOWGYJO-UHFFFAOYSA-N 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- QVKOLZOAOSNSHQ-UHFFFAOYSA-N prop-1-ene;prop-2-enoic acid Chemical compound CC=C.OC(=O)C=C QVKOLZOAOSNSHQ-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、耐衝撃性、成形加工性、耐薬品性、塗装
性、成形品の表面外観、耐熱性に優れた電磁波遮蔽用樹
脂組成物、ならびに耐衝撃性、成形加工性、耐熱性かつ
難燃性に優れた難燃性電磁波遮蔽用樹脂組成物に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a resin composition for electromagnetic wave shielding excellent in impact resistance, molding workability, chemical resistance, paintability, surface appearance of molded articles, and heat resistance. And a flame-retardant electromagnetic wave shielding resin composition having excellent impact resistance, moldability, heat resistance and flame retardancy.
［従来の技術］ 近年、電子機器、OA事務機器、家電機器などのハウジ
ング分野では製品の合成樹脂化が進行している。しかし
ながら、合成樹脂は電子機器などから放出される電磁波
を透過するために、ノイズの発生、素子などの誤動作な
ど電磁波障害が発生してくる。[Related Art] In recent years, in the field of housing of electronic equipment, office automation equipment, home electric appliances, and the like, products are being converted to synthetic resins. However, since synthetic resins transmit electromagnetic waves emitted from electronic devices and the like, electromagnetic waves such as noise generation and malfunction of elements occur.
この電磁波障害を防止する方法として、材料である樹
脂中に導電性繊維などを配合することにより、導電性を
備えた樹脂組成物を形成し、この導電性樹脂組成物でハ
ウジングを作ることが知られている。As a method for preventing this electromagnetic wave interference, it is known that a resin composition having conductivity is formed by blending conductive fibers and the like into a resin, which is a material, and a housing is made of the conductive resin composition. Have been.
［本発明が解決しようとする課題］ これらの導電性樹脂組成物の用途は、大型成形品ある
いは複雑な形状の成形品などの成形材料として用いられ
ることが多く、そのためには優れた成形加工性、耐衝撃
性、耐薬品性、塗装性、成形品の表面外観、耐熱性を有
することが必要である。[Problems to be Solved by the Present Invention] These conductive resin compositions are often used as molding materials such as large molded products or molded products having complicated shapes, and therefore, excellent molding processability is required. It is necessary to have impact resistance, chemical resistance, paintability, surface appearance of a molded product, and heat resistance.
そこで、耐衝撃性の優れた電磁波遮蔽用樹脂組成物を
得るために、ゴム強化熱可塑性樹脂に導電性充填剤など
を配合した樹脂組成物が知られている。しかし、導電性
充填剤が金属の粉体あるいは繊維であることから、成形
加工性、耐衝撃性に満足するものが得られない。Therefore, in order to obtain an electromagnetic wave shielding resin composition having excellent impact resistance, a resin composition in which a conductive filler and the like are mixed with a rubber-reinforced thermoplastic resin is known. However, since the conductive filler is a metal powder or fiber, a material satisfying the moldability and impact resistance cannot be obtained.
本発明は、ゴム強化樹脂と導電性充填剤からなる組成
物において、成形加工性および耐衝撃性が低下するとい
う欠点を改良し、成形加工性と耐衝撃性の物性バランス
に優れ、かつ耐薬品性、塗装性、成形品の表面外観、耐
熱性の優れた電磁波遮蔽用樹脂組成物ならびに、さらに
難燃性を有する難燃性電磁波遮蔽用樹脂組成物を目的と
する。The present invention improves the drawback that molding processability and impact resistance are reduced in a composition comprising a rubber-reinforced resin and a conductive filler, has an excellent balance between molding processability and impact resistance, and has chemical resistance. It is intended to provide an electromagnetic wave shielding resin composition having excellent properties, paintability, surface appearance of a molded article, and heat resistance, and a flame retardant electromagnetic wave shielding resin composition having further flame retardancy.
［課題を解決するための手段］ すなわち本発明は、 （１）下記の（Ａ）／（Ｂ）／（Ｃ）／（Ｄ）＝10〜98
/0〜70/1〜80/1〜70重量％からなる熱可塑性樹脂（Ｉ）
100重量部に対し、導電性充填剤（II）１〜20重量部を
含有することを特徴とする電磁波遮蔽用樹脂組成物。[Means for Solving the Problems] That is, the present invention provides: (1) the following (A) / (B) / (C) / (D) = 10 to 98
/ 0-70 / 1-80 / 1-70% by weight of thermoplastic resin (I)
A resin composition for shielding electromagnetic waves, comprising 1 to 20 parts by weight of a conductive filler (II) based on 100 parts by weight.
（Ａ）ゴム状重合体（ａ）５〜70重量部の存在下、芳
香族ビニル化合物／その他の単量体＝10〜100/0〜90重
量％からなる単量体化合物（ｂ）30〜95重量部（ａ＋ｂ
＝100重量部）を重合して得られるゴム強化樹脂。(A) In the presence of rubbery polymer (a) 5 to 70 parts by weight, aromatic vinyl compound / other monomer = 10 to 100/0 to 90% by weight monomer compound (b) 30 to 95 parts by weight (a + b
= 100 parts by weight).
（Ｂ）芳香族ビニル化合物／その他の単量体＝10〜10
0/0〜90重量％を重合して得られる重合体。(B) aromatic vinyl compound / other monomer = 10 to 10
A polymer obtained by polymerizing 0/0 to 90% by weight.
（Ｃ）ポリカーボネート （Ｄ）熱可塑性ポリエステル （２）請求項（１）記載の（Ｉ）／請求項（１）記載の
（II）／難燃剤／アンチモン化合物＝100/1〜20/1〜20/
1〜10重量部を含有することを特徴とする難燃性電磁波
遮蔽用樹脂組成物。(C) polycarbonate (D) thermoplastic polyester (2) (I) according to claim (1) / (II) according to claim (1) / flame retardant / antimony compound = 100 / 1-20 / 1-20 /
A flame-retardant electromagnetic wave shielding resin composition comprising 1 to 10 parts by weight.
（３）下記の（Ａ）／（Ｂ）／（Ｃ）／（Ｄ）＝10〜98
/0〜70/1〜80/1〜70重量％からなり、かつ（Ａ）および
／または（Ｂ）中のハロゲン化スチレン含有量が５〜50
重量％である熱可塑性樹脂（III）100重量部に対し、導
電性充填剤（II）１〜20重量部、難燃剤０〜20重量部お
よびアンチモン化合物０〜10重量部を含有することを特
徴とする難燃性電磁波遮蔽用樹脂組成物。(3) The following (A) / (B) / (C) / (D) = 10-98
/ 0 to 70/1 to 80/1 to 70% by weight, and the halogenated styrene content in (A) and / or (B) is 5 to 50.
It is characterized by containing 1 to 20 parts by weight of a conductive filler (II), 0 to 20 parts by weight of a flame retardant and 0 to 10 parts by weight of an antimony compound with respect to 100 parts by weight of a thermoplastic resin (III) which is a weight%. Flame retardant resin composition for shielding electromagnetic waves.
（Ａ）ゴム状重合体（ａ）５〜70重量部の存在下、ハロ
ゲン化スチレンおよび／またはハロゲン化スチレン以外
の芳香族ビニル化合物／その他の単量体＝10〜100/0〜9
0重量％からなる単量体化合物（ｂ）30〜95重量部（ａ
＋ｂ＝100重量部）を重合して得られるゴム強化樹脂。(A) In the presence of 5 to 70 parts by weight of a rubbery polymer (a), halogenated styrene and / or an aromatic vinyl compound other than halogenated styrene / other monomers = 10 to 100/0 to 9
30 to 95 parts by weight of a monomer compound (b) consisting of 0% by weight (a
+ B = 100 parts by weight).
（Ｂ）ハロゲン化スチレンおよび／またはハロゲン化ス
チレン以外の芳香族ビニル化合物／その他の単量体＝10
〜100/0〜90重量％を重合して得られる重合体。(B) halogenated styrene and / or aromatic vinyl compound other than halogenated styrene / other monomer = 10
To 100/0 to 90% by weight.
（Ｃ）ポリカーボネート （Ｄ）熱可塑性ポリエステル を提供するものである。(C) Polycarbonate (D) Thermoplastic polyester
以下、本発明について詳細に説明する。 Hereinafter, the present invention will be described in detail.
（１）請求項（１）、（２）、（３）の（Ａ）成分のゴ
ム強化樹脂 請求項（１）、（２）の（Ａ）成分のゴム強化樹脂
は、ゴム状重合体（ａ）５〜70重量部の存在下に、芳香
族ビニル化合物／その他の単量体＝10〜100/0〜90重量
％からなる単量体化合物（ｂ）30〜95重量部（ａ＋ｂ＝
100重量部）を含有して得られる。(1) The rubber-reinforced resin of the component (A) in claims (1), (2) and (3) is a rubber-like polymer (A). a) In the presence of 5 to 70 parts by weight, an aromatic vinyl compound / other monomer = 10 to 100/0 to 90% by weight of a monomer compound (b) 30 to 95 parts by weight (a + b =
100 parts by weight).
請求項（３）の（Ａ）成分のゴム強化樹脂は、ゴム状
重合体（ａ）５〜70重量部の存在下に、ハロゲン化スチ
レンおよび／またはハロゲン化スチレン以外の芳香族ビ
ニル化合物／その他の単量体＝10〜100/0〜90重量％か
らなる単量体化合物（ｂ）30〜95重量部（ａ＋ｂ＝100
重量部）を重合して得られる。なお、上記ハロゲン化ス
チレンの使用量は、（Ａ）成分および／または後述の
（Ｂ）成分中のハロゲン化スチレン含有量が５〜50重量
％になるように選ぶ。The rubber-reinforced resin as the component (A) according to claim (3) may be a halogenated styrene and / or an aromatic vinyl compound other than the halogenated styrene / other in the presence of 5 to 70 parts by weight of the rubbery polymer (a). Monomer = 10 to 100/0 to 90% by weight of a monomer compound (b) 30 to 95 parts by weight (a + b = 100
Parts by weight). The amount of the halogenated styrene to be used is selected so that the content of the halogenated styrene in the component (A) and / or the component (B) described later is 5 to 50% by weight.
上記のゴム状重合体（ａ）としては、例えばポリブタ
ジエン系ゴム、スチレン−ブタジエン系ゴム、アクリロ
ニトリル−ブタジエン系ゴムなどのジエンゴム系、該ジ
エン系ゴムの水素添加物、EPM、EPDM、エチレン−ブテ
ン系共重合体などのオレフィン系ゴム、アクリル系ゴ
ム、芳香族ビニル（好ましくはスチレン）−共役ジエン
（好ましくはブタジエン）ブロック共重合体（好ましい
共役ジエン含有量は50〜90重量％）、該ブロック共重合
体の水素添加物などが挙げられる。Examples of the rubbery polymer (a) include diene rubbers such as polybutadiene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, hydrogenated diene rubbers, EPM, EPDM, and ethylene-butene rubber. Olefin rubber such as copolymer, acrylic rubber, aromatic vinyl (preferably styrene) -conjugated diene (preferably butadiene) block copolymer (preferable conjugated diene content is 50 to 90% by weight), And hydrogenated polymers.
上記芳香族ビニル化合物としては、スチレン、α−メ
チルスチレン、メチルスチレン、ｐ−メチルスチレンな
どの非ハロゲン化スチレン、モノクロルスチレン、ジク
ロルスチレン、モノブロモスチレン、ジブロモスチレ
ン、フルオロスチレンなどのハロゲン化スチレンが挙げ
られる。Examples of the aromatic vinyl compound include non-halogenated styrenes such as styrene, α-methylstyrene, methylstyrene, and p-methylstyrene; halogenated styrenes such as monochlorostyrene, dichlorostyrene, monobromostyrene, dibromostyrene, and fluorostyrene. Is mentioned.
請求項（１）、（２）、（３）の芳香族ビニル化合物
として、好ましくはスチレン、α−メチルスチレンであ
る。The aromatic vinyl compound according to claims (1), (2) and (3) is preferably styrene or α-methylstyrene.
請求項（３）のハロゲン化スチレンとしては、好まし
くはブロモスチレン、ジブロモスチレンである。The halogenated styrene of claim (3) is preferably bromostyrene or dibromostyrene.
上記のその他の単量体としては、例えばメチルアクリ
レート、エチルアクリレート、プロピレンアクリレー
ト、ブチルアクリレート、アミルアクリレート、ヘキシ
ルアクリレート、オクチルアクリレート、２−エチルヘ
キシルアクリレート、シクロヘキシルアクリレート、ド
デシルアクリレート、オクタデシルアクリレート、フェ
ニルアクリレート、ベンジルアクリレートなどのアクリ
ル酸アルキルエステル；メチルメタクリレート、エチル
メタクリレート、プロピレンメタクリレート、ブチルメ
タクリレート、アミルメタクリレート、ヘキシルメタク
リレート、オクチルメタクリレート、２−エチルヘキシ
ルメタクリレート、シクロヘキシルメタクリレート、ド
デシルメタクリレート、オクタデシルメタクリレート、
フェニルメタクリレート、ベンジルメタクリレートなど
のメタクリル酸アルキルエステル、アクリロニトリル、
メタクリロニトリルなどのシアン化ビニル化合物、無水
マレイン酸、無水イタコン酸、無水シトラコン酸などの
不飽和酸無水物、アクリル酸、メタクリル酸などの不飽
和酸、マレイミド、Ｎ−メチルマレイミド、Ｎ−ブチル
マレイミド、Ｎ−（ｐ−メチルフェニル）マレイミド、
Ｎ−フェニルマレイミド、Ｎ−シクロヘキシルマレイミ
ドなどのα−またはβ−不飽和ジカルボン酸のイミド化
合物などが挙げられ、これらは（難燃）電磁波遮蔽用樹
脂組成物の品質改良を目的に、支障のない範囲で１種ま
たは２種以上で使用される。Examples of the other monomers include methyl acrylate, ethyl acrylate, propylene acrylate, butyl acrylate, amyl acrylate, hexyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate, dodecyl acrylate, octadecyl acrylate, phenyl acrylate, and benzyl Acrylic alkyl esters such as acrylate; methyl methacrylate, ethyl methacrylate, propylene methacrylate, butyl methacrylate, amyl methacrylate, hexyl methacrylate, octyl methacrylate, 2-ethylhexyl methacrylate, cyclohexyl methacrylate, dodecyl methacrylate, octadecyl methacrylate,
Alkyl methacrylates such as phenyl methacrylate and benzyl methacrylate, acrylonitrile,
Vinyl cyanide compounds such as methacrylonitrile, unsaturated acid anhydrides such as maleic anhydride, itaconic anhydride and citraconic anhydride, unsaturated acids such as acrylic acid and methacrylic acid, maleimide, N-methylmaleimide, N-butyl Maleimide, N- (p-methylphenyl) maleimide,
Examples include imide compounds of α- or β-unsaturated dicarboxylic acids such as N-phenylmaleimide and N-cyclohexylmaleimide, which are not problematic for the purpose of improving the quality of the (flame-retardant) electromagnetic wave shielding resin composition. One or more kinds are used in the range.
上記の単量体化合物（ｂ）の芳香族ビニル化合物（請
求項（３）では、ハロゲン化スチレンおよび／またはハ
ロゲン化スチレン以外の芳香族ビニル化合物）／その他
の単量体の組成割合は、10〜100/0〜90重量％、好まし
くは40〜100/0〜60重量％である。芳香族ビニル化合物
が10重量％未満であると、成形加工性が劣り好ましくな
い。The composition ratio of the aromatic vinyl compound of the monomer compound (b) (in claim (3), halogenated styrene and / or an aromatic vinyl compound other than halogenated styrene) / other monomer is 10%. -100 / 0-90% by weight, preferably 40-100 / 0-60% by weight. If the amount of the aromatic vinyl compound is less than 10% by weight, the moldability is poor, which is not preferable.
好ましい単量体化合物（ｂ）を以下に列挙する。 Preferred monomer compounds (b) are listed below.
なお、請求項（３）の「ハロゲン化スチレンおよび／
またはハロゲン化スチレン以外の芳香族ビニル化合物」
の表現を、以下単に「（Ｈ−ST）芳香族ビニル化合物」
と表現する。It should be noted that, in claim (3), “halogenated styrene and / or
Or aromatic vinyl compounds other than halogenated styrene "
Is simply referred to as “(H-ST) aromatic vinyl compound”
Is expressed as
請求項（１）、（２）の好ましい単量体化合物（ｂ） 芳香族ビニル化合物／シアン化ビニル化合物＝40〜
95/5〜60重量％ 芳香族ビニル化合物／（メタ）アクリル酸アルキル
エステル／シアン化ビニル化合物＝10〜90/10〜90/0〜6
0重量％ 請求項（３）の好ましい単量体化合物（ｂ） （Ｈ−ST）芳香族ビニル化合物／シアン化ビニル化
合物＝40〜95/5〜60重量％ （Ｈ−ST）芳香族ビニル化合物／（メタ）アクリル
酸アルキルエステル／シアン化ビニル＝10〜90/10〜90/
0〜60重量％ 請求項（３）でハロゲン化スチレンを用いることで、
難燃性を付与することができる。Claims (1) and (2) of the preferred monomer compound (b): aromatic vinyl compound / vinyl cyanide compound = 40 to
95 / 5-60% by weight Aromatic vinyl compound / alkyl (meth) acrylate / vinyl cyanide compound = 10-90 / 10-90 / 0-6
0% by weight Preferred monomer compound (b) of claim (3) (H-ST) aromatic vinyl compound / vinyl cyanide compound = 40-95 / 5-60% by weight (H-ST) aromatic vinyl compound / (Meth) acrylic acid alkyl ester / vinyl cyanide = 10-90 / 10-90 /
0 to 60% by weight By using the halogenated styrene in claim (3),
Flame retardancy can be imparted.
請求項（１）、（２）、（３）の（Ａ）成分のゴム強
化樹脂は、ゴム状重合体（ａ）５〜70重量部、好ましく
は10〜70重量部の存在下に単量体化合物（ｂ）30〜95重
量部、好ましくは30〜90重量部を重合して得られる。
（ａ）が５重量部未満であると十分な耐衝撃性が得られ
ず、一方70重量部を超えると成形加工性が劣り好ましく
ない。The rubber-reinforced resin as the component (A) according to any one of claims (1), (2) and (3) may be used in the amount of 5 to 70 parts by weight, preferably 10 to 70 parts by weight, of the rubbery polymer (a). It is obtained by polymerizing 30 to 95 parts by weight, preferably 30 to 90 parts by weight of the body compound (b).
If (a) is less than 5 parts by weight, sufficient impact resistance cannot be obtained, while if it exceeds 70 parts by weight, molding processability is poor, which is not preferable.
（Ａ）成分の（ａ）のグラフト率は、好ましくは５〜
150重量％、さらに好ましくは10〜120重量％であり、こ
の範囲において、耐衝撃性、成形品の表面外観、耐薬品
性の一段と優れたものが得られる。The graft ratio of component (A) (a) is preferably 5 to 5.
The content is 150% by weight, more preferably 10 to 120% by weight, and in this range, more excellent impact resistance, surface appearance of a molded product, and chemical resistance can be obtained.
（Ａ）成分の製造方法としては、乳化重合法、サスペ
ンション重合法、溶液重合法、バルク重合法、およびこ
れらの重合法を組み合わせた重合法が挙げられる。Examples of the method for producing the component (A) include an emulsion polymerization method, a suspension polymerization method, a solution polymerization method, a bulk polymerization method, and a polymerization method combining these polymerization methods.
（２）請求項（１）、（２）、（３）の（Ｂ）成分の重
合体の説明 請求項（１）、（２）の（Ｂ）成分は、芳香族ビニル
化合物／その他の単量体＝10〜100/0〜90重量％、好ま
しくは40〜100/0〜60重量％からなる重合体である。(2) Description of the polymer of the component (B) in claims (1), (2) and (3) The component (B) in claims (1) and (2) is an aromatic vinyl compound / other monomer. Polymer = 10-100 / 0-90% by weight, preferably 40-100 / 0-60% by weight.
請求項（３）の（Ｂ）成分は、（Ｈ−ST）芳香族ビニ
ル化合物／その他の単量体＝10〜100/0〜90重量％、好
ましくは40〜100/0〜60重量％である。The component (B) of claim (3) is (H-ST) aromatic vinyl compound / other monomer = 10 to 100/0 to 90% by weight, preferably 40 to 100/0 to 60% by weight. is there.
上記の芳香族ビニル化合物ならびに（Ｈ−ST）芳香族
ビニル化合物が10重量％未満であると、成形加工性に劣
る。When the content of the aromatic vinyl compound and the (H-ST) aromatic vinyl compound is less than 10% by weight, the moldability is poor.
請求項（３）の（Ｈ−ST）芳香族ビニル化合物で使用
されるハロゲン化スチレンの使用量は、（Ａ）成分およ
び／または（Ｂ）成分中のハロゲン含有量が５〜50重量
％になるように選ぶ。The amount of the halogenated styrene used in the (H-ST) aromatic vinyl compound according to claim (3) is such that the halogen content in the component (A) and / or the component (B) is 5 to 50% by weight. Choose to be.
上記の芳香族ビニル化合物、ハロゲン化スチレンおよ
びその他の単量体は、前記の単量体化合物（ｂ）で示し
たものと同じである。芳香族ビニル化合物としては好ま
しくはスチレン、α−メチルスチレン、ハロゲン化スチ
レンとしては好ましくはブロモスチレン、特に好ましく
はジブロモスチレン、その他の単量体としてはアクリロ
ニトリル、メタクリル酸メチルなどが挙げられる。The aromatic vinyl compound, halogenated styrene and other monomers are the same as those described for the monomer compound (b). Preferred examples of the aromatic vinyl compound include styrene and α-methylstyrene, preferred examples of the halogenated styrene include bromostyrene, particularly preferred are dibromostyrene, and examples of the other monomer include acrylonitrile and methyl methacrylate.
請求項（１）、（２）の（Ｂ）成分の好ましい単量体
成分 芳香族ビニル化合物／シアン化ビニル化合物＝40〜
95/5〜60重量％ 芳香族ビニル化合物／（メタ）アクリル酸アルキル
エステル／シアン化ビニル化合物＝10〜90/10〜90/0〜6
0重量％ 請求項（３）の（Ｂ）成分の好ましい単量体成分 （Ｈ−ST）芳香族ビニル化合物／シアン化ビニル化
合物＝40〜95/5〜60重量％ （Ｈ−ST）芳香族ビニル化合物／（メタ）アクリル
酸アルキルエステル／シアン化ビニル＝10〜90/10〜90/
0〜60重量％ （Ｂ）成分で用いる単量体は、（Ａ）成分の単量体化
合物（ｂ）と同じ種類の単量体を用いると、一段と優れ
た本発明の目的とするものが得られる。Claims (1) and (2) Preferred monomer component of component (B): Aromatic vinyl compound / vinyl cyanide compound = 40 to
95 / 5-60% by weight Aromatic vinyl compound / alkyl (meth) acrylate / vinyl cyanide compound = 10-90 / 10-90 / 0-6
0% by weight Preferred monomer component of component (B) in claim (3) (H-ST) aromatic vinyl compound / vinyl cyanide compound = 40 to 95/5 to 60% by weight (H-ST) aromatic Vinyl compound / (meth) acrylic acid alkyl ester / vinyl cyanide = 10-90 / 10-90 /
0 to 60% by weight As the monomer used in the component (B), when the same type of monomer as the monomer compound (b) of the component (A) is used, a more excellent object of the present invention is obtained. can get.
（３）請求項（１）、（２）、（３）の（Ｃ）成分のポ
リカーボネートの説明 （Ｃ）成分のポリカーボネートとしては、芳香族ポリ
カーボネート、脂肪族ポリカーボネート、脂肪族−芳香
族ポリカーボネートなどを挙げることができる。一般に
は、2,2−ビス（４−オキシフェニル）アルカン系、ビ
ス（４−オキシフェニル）エーテル系、ビス（４−オキ
シフェニル）スルホンスルフィドまたはスルホキサイド
系などのビスフェノール類からなる重合体もしくは共重
合体であり、目的に応じてハロゲンで置換されたビスフ
ェノール類を用いた重合体である。ポリカーボネートの
種類、製造法などについは、日刊工業新聞社発行（昭和
44年９月30日発行）の“ポリカーボネート樹脂”に詳し
く記載されている。(3) Description of Polycarbonate of Component (C) in Claims (1), (2) and (3) Examples of the polycarbonate of component (C) include aromatic polycarbonate, aliphatic polycarbonate, and aliphatic-aromatic polycarbonate. Can be mentioned. In general, a polymer or copolymer of bisphenols such as 2,2-bis (4-oxyphenyl) alkane, bis (4-oxyphenyl) ether, bis (4-oxyphenyl) sulfone sulfide or sulfoxide is used. It is a polymer using bisphenols substituted with halogen depending on the purpose. For information on the types and manufacturing methods of polycarbonate, see Nikkan Kogyo Shimbun (Showa
It is described in detail in "Polycarbonate resin" of September 30, 44).
（４）請求項（１）、（２）、（３）の（Ｄ）成分の熱
可塑性ポリエステルの説明 熱可塑性ポリエステルとしては、例えばポリエチレン
テレフタレート、ポリブチレンテレフタレート、ポリプ
ロピレンテレフタレート、ポリペンタメチレンテレフタ
レート、ポリヘキサメチレンテレフタレートなどが挙げ
られ、好ましくはポリエチレンテレフタレート、ポリブ
チレンテレフタレート、さらに好ましくはポリブチレン
テレフタレートである。(4) Description of thermoplastic polyester of component (D) in claims (1), (2) and (3) Examples of the thermoplastic polyester include polyethylene terephthalate, polybutylene terephthalate, polypropylene terephthalate, polypentamethylene terephthalate, and poly (pentamethylene terephthalate). Hexamethylene terephthalate and the like can be mentioned, preferably polyethylene terephthalate, polybutylene terephthalate, and more preferably polybutylene terephthalate.
（５）請求項（１）、（２）、（３）の導電性充填剤
（II）の説明 導電性充填剤としては、繊維状、フレーク状、粉末状
などが挙げられるが、繊維状が好ましい。(5) Description of the conductive filler (II) of claims (1), (2), and (3) Examples of the conductive filler include fibrous, flake, and powder forms. preferable.
繊維状のものとしては、ステンレス繊維、アルミニウ
ム繊維、銅繊維、普通鋼繊維、黄銅繊維、金属塗布グラ
スファイバーまたはカーボンファイバー、ニッケル繊
維、ケイ素繊維、すず青銅繊維、フェルニコ繊維、バー
マロイ繊維、炭素繊維などがあり、これらの繊維状の中
でステンレス繊維が好ましい。Examples of fibrous materials include stainless steel fiber, aluminum fiber, copper fiber, ordinary steel fiber, brass fiber, metal coated glass fiber or carbon fiber, nickel fiber, silicon fiber, tin bronze fiber, fernico fiber, vermalloy fiber, carbon fiber, etc. Among these fibrous materials, stainless steel fibers are preferable.
フレーク状とものとしては、アルミフレークがある。 Aluminum flakes can be used as flakes.
粉末状のものとしては、アルミニウム（合金）粉末、
導電性カーボンブラック、ニッケル粉末、スズ粉末、亜
鉛粉末、グラファイト、銅粉末、フェライト粉末が挙げ
られる。Aluminum (alloy) powder,
Examples include conductive carbon black, nickel powder, tin powder, zinc powder, graphite, copper powder, and ferrite powder.
上記の繊維、フレーク状、粉末状の導電性充填剤は、
各種シランカップリング剤、各種重合体などで表面処
理、表面被覆、繊維にあっては収束したものであっても
よい。The above fibers, flakes, powdered conductive fillers,
Surface treatment with various silane coupling agents, various polymers, etc., surface coating, and fibers may be converged.
（６）請求項（２）、（３）の難燃剤の説明 難燃剤としては、一般ゴム、樹脂などのポリマーに使
用される難燃剤を使用することができる。(6) Description of Flame Retardants of Claims (2) and (3) As the flame retardant, flame retardants used for polymers such as general rubber and resin can be used.
難燃剤としては、ハロゲン含有化合物、リン含有化合
物、窒素含有化合物、ケイ素含有化合物などが挙げられ
る。これらの難燃剤について、例えば以下に列挙する。Examples of the flame retardant include a halogen-containing compound, a phosphorus-containing compound, a nitrogen-containing compound, and a silicon-containing compound. These flame retardants are listed below, for example.
テトラブロモビスフェノールＡあるいはテトラブロモ
ビスフェノールＡ−ビス（２−ヒドロキシエチルエーテ
ル）、テトラブロモビスフェノールＡ−ビス（2,3−ジ
ブロモプロビルエーテル）などのテトラブロモビスフェ
ノールＡ誘導体、ヘキサブロモジフェニルエーテル、オ
クタブロモジフェニルエーテル、デカブロモジフェニル
エーテル、ビス（トリブロモフェノキシ）エタン、ヘキ
サブロモシクロドデカンなどが使用できる。Tetrabromobisphenol A or tetrabromobisphenol A derivatives such as tetrabromobisphenol A-bis (2-hydroxyethyl ether), tetrabromobisphenol A-bis (2,3-dibromopropyl ether), hexabromodiphenyl ether, octabromodiphenyl ether , Decabromodiphenyl ether, bis (tribromophenoxy) ethane, hexabromocyclododecane and the like can be used.
さらに、例えばモノブロモフェノール、トリブロモフ
ェノール、ペンタブロモフェノール、トリブロモクレゾ
ール、ジブロモプロビルフェノール、テトラブロモビス
フェノールＳ、塩化シアヌルなどを重合により、あるい
はこれらと上記ハロゲン化合物の群から選ばれた１種以
上のハロゲン化合物との共重合により得られたオリゴマ
ー型ハロゲン化合物が使用できる。Further, for example, monobromophenol, tribromophenol, pentabromophenol, tribromocresol, dibromopropylphenol, tetrabromobisphenol S, cyanuric chloride, or the like may be polymerized, or may be one selected from the group consisting of these and the above-mentioned halogen compounds. An oligomer type halogen compound obtained by copolymerization with the above halogen compound can be used.
また、テトラブロモビスフェノールＡのポリカーボネ
ートオリゴマー、テトラブロモビスフェノールＡとビス
フェノールＡとのポリカーボネートオリゴマー、テトラ
ブロモビスフェノールＳのポリカーボネートオリゴマ
ー、テトラブロモビスフェノールＳとビスフェノールＳ
とのポリカーボネートオリゴマーがある。Also, a polycarbonate oligomer of tetrabromobisphenol A, a polycarbonate oligomer of tetrabromobisphenol A and bisphenol A, a polycarbonate oligomer of tetrabromobisphenol S, tetrabromobisphenol S and bisphenol S
And polycarbonate oligomers.
〔式中、ｎは平均重合度で１〜100であり、Ｘは独立
に水素、塩素または臭素を示し、ｉ、ｊ、ｋおよびｌは
それぞれ１〜４の整数であり、ＲおよびＲ′はそれぞれ
独立に水素、メチル基、エポキシプロビル基、フエニル
基または （ただし、ｍは０、１、２または３を示す）である。〕 のハロゲン化エポキシオリゴマーなどが使用できる。 [Wherein, n is an average degree of polymerization of 1 to 100, X independently represents hydrogen, chlorine or bromine, i, j, k and l are each an integer of 1 to 4, and R and R ′ are Each independently represents hydrogen, methyl, epoxypropyl, phenyl or (Where m represents 0, 1, 2 or 3). ] Halogenated epoxy oligomers can be used.
難燃助剤としては、酸化鉄、ほう砂、メタホウ酸バリ
ウム、酸化ジルコニウムなどを１種または２種以上用い
ることができる。As the flame retardant aid, one or more of iron oxide, borax, barium metaborate, zirconium oxide and the like can be used.
（７）請求項（２）、（３）のアンチモン化合物の説明 アンチモン化合物としては、例えば三酸化アンチモ
ン、四酸化アンチモン、五酸化アンチモン、アンチモン
酸ナトリウム、リン酸アンチモンなどが挙げられ、好ま
しくは三酸化アンチモン、アンチモン酸ナトリウムであ
る。(7) Description of Antimony Compounds of Claims (2) and (3) Examples of the antimony compound include antimony trioxide, antimony tetroxide, antimony pentoxide, sodium antimonate, antimony phosphate and the like. Antimony oxide and sodium antimonate.
次に、請求項（１）、（２）、（３）の（難燃性）電
磁波遮蔽用樹脂組成物について説明する。Next, the (flame-retardant) electromagnetic wave shielding resin composition of claims (1), (2) and (3) will be described.
（１）請求項（１）の電磁波遮蔽用樹脂組成物 請求項（１）の電磁波遮蔽用樹脂組成物は、前記の
（Ａ）／（Ｂ）／（Ｃ）／（Ｄ）＝10〜98/0〜70/1〜80
/1〜70重量％、好ましくは20〜80/0〜50/2〜50/2〜60重
量％、さらに好ましくは25〜75/1〜45/3〜30/5〜50重量
％からなる熱可塑性樹脂（Ｉ）100重量部に対し、前記
の導電性充填剤１〜20重量部、好ましくは１〜10重量部
含有する組成物である。(1) The resin composition for shielding electromagnetic waves of claim (1) The resin composition for shielding electromagnetic waves of claim (1) is (A) / (B) / (C) / (D) = 10 to 98. / 0-70 / 1-80
/ 1 to 70% by weight, preferably 20 to 80/0 to 50/2 to 50/2 to 60% by weight, more preferably 25 to 75/1 to 45/3 to 30/5 to 50% by weight. The composition contains 1 to 20 parts by weight, preferably 1 to 10 parts by weight of the above-mentioned conductive filler based on 100 parts by weight of the plastic resin (I).
（Ａ）成分が10重量％未満であると十分な耐衝撃性、
成形加工性が得られず、一方、99重量％を超えると
（Ｃ）成分が範囲未満となり、下記の理由により好まし
くない。(A) If the component is less than 10% by weight, sufficient impact resistance,
On the other hand, if the molding processability is not obtained, on the other hand, if it exceeds 99% by weight, the component (C) becomes less than the range, which is not preferable for the following reasons.
（Ｂ）成分が70重量％を超えると、耐衝撃性、耐熱性
が低下する。When the component (B) exceeds 70% by weight, impact resistance and heat resistance are reduced.
（Ｃ）成分は、導電性充填剤による耐衝撃性、成形加
工性の低下を押え、その結果、耐衝撃性と成形加工性の
物性バランスを向上させるという、従来の知見から余く
予想のできない効果を付与するものであり、１重量％未
満であると耐衝撃性、成形加工性の物性バランスが低下
し、さらに耐熱性も低下する。一方、90重量％を超える
と耐薬品性、成形加工性が劣る。The component (C) suppresses a decrease in impact resistance and molding workability due to the conductive filler, and as a result, improves the balance between the impact resistance and the molding processability. When the content is less than 1% by weight, the balance between physical properties of impact resistance and moldability is reduced, and heat resistance is also reduced. On the other hand, if it exceeds 90% by weight, chemical resistance and molding processability are inferior.
（Ｄ）成分は、成形加工性、耐薬品性、塗装性、成形
品の表面外観を向上させる効果を有するものであり、そ
の使用量が１重量％未満であると成形加工性、耐薬品
性、塗装性、成形品の表面外観の改良が十分でなく、一
方、80重量％を超えると耐熱性が劣り好ましくない。The component (D) has the effect of improving the formability, chemical resistance, paintability, and surface appearance of the molded article. If the amount used is less than 1% by weight, the formability and chemical resistance are improved. On the other hand, the paintability and the surface appearance of the molded article are not sufficiently improved.
導電性充填剤の使用量が１重量部未満であると十分な
電磁波遮蔽性が得られず、一方、20重量部を超えると耐
衝撃性、成形加工性が劣る。If the amount of the conductive filler is less than 1 part by weight, sufficient electromagnetic wave shielding properties cannot be obtained, while if it exceeds 20 parts by weight, impact resistance and molding workability are poor.
（２）請求項（２）の難燃性電磁波遮蔽用樹脂組成物 請求項（２）の難燃性電磁波遮蔽用樹脂組成物は、前
記の（Ａ）／（Ｂ）／（Ｃ）／（Ｄ）＝10〜98/0〜70/1
〜80/1〜70重量％、好ましくは20〜80/0〜50/2〜50/2〜
60重量％、さらに好ましくは25〜75/1〜45/3〜30/5〜50
重量％からなる熱可塑性樹脂（Ｉ）100重量部に対し、
前記の導電性充填剤１〜20重量部、好ましくは１〜10重
量部、前記の難燃剤１〜20重量部、好ましくは１〜15重
量部、前記のアンチモン化合物１〜10重量部、好ましく
は１〜８重量部を含有してなる組成物である。(2) The flame-retardant electromagnetic wave shielding resin composition according to claim (2) The flame-retardant electromagnetic wave shielding resin composition according to claim (2) is characterized by the above (A) / (B) / (C) / ( D) = 10-98 / 0-70 / 1
~ 80/1 ~ 70% by weight, preferably 20 ~ 80/0 ~ 50/2 ~ 50/2 ~
60% by weight, more preferably 25-75 / 1-45 / 3-30 / 5-50
% By weight of the thermoplastic resin (I)
1 to 20 parts by weight of the conductive filler, preferably 1 to 10 parts by weight, 1 to 20 parts by weight of the flame retardant, preferably 1 to 15 parts by weight, 1 to 10 parts by weight of the antimony compound, preferably It is a composition containing 1 to 8 parts by weight.
上記の（Ａ）、（Ｂ）、（Ｃ）、（Ｄ）および導電性
充填剤の各成分の数値限定理由は、前記の請求項（１）
のそれと同じである。The reasons for limiting the numerical values of the components (A), (B), (C), (D) and the conductive filler are as described in claim (1).
It is the same as that of
難燃剤が１重量部未満であると十分な難燃性が得られ
ず、一方、20重量部を超えると成形加工性、耐衝撃性が
低下するので好ましくない。If the amount of the flame retardant is less than 1 part by weight, sufficient flame retardancy cannot be obtained.
アンチモン化合物が１重量部未満であると十分な難燃
性が得られず、一方、10重量部を超えると耐衝撃性、成
形加工性が低下する。When the amount of the antimony compound is less than 1 part by weight, sufficient flame retardancy cannot be obtained. On the other hand, when the amount exceeds 10 parts by weight, the impact resistance and the moldability deteriorate.
（３）請求項（３）の難燃性電磁波遮蔽用樹脂組成物 請求項（３）の難燃性電磁波遮蔽用樹脂組成物は、前
記の（Ａ）／（Ｂ）／（Ｃ）／（Ｄ）＝10〜98/0〜70/1
〜80/1〜70重量％、好ましくは20〜80/0〜50/2〜50/2〜
60重量％、さらに好ましくは25〜75/1〜45/3〜30/5〜50
重量％からなり、かつ（Ａ）および／または（Ｃ）成分
中のハロゲン化スチレンの含有量が５〜50重量％、好ま
しくは５〜40重量％である熱可塑性樹脂100重量部に対
し、導電性充填剤１〜20重量部、好ましくは１〜10重量
部、前記の難燃剤０〜20重量部、好ましくは０〜15重量
部、さらに好ましくは１〜15重量部、アンチモン化合物
０〜10重量部、好ましくは０〜８重量部、さらに好まし
くは１〜８重量部である。(3) The flame-retardant electromagnetic wave shielding resin composition according to claim (3) The flame-retardant electromagnetic wave shielding resin composition according to claim (3) is characterized by the above (A) / (B) / (C) / ( D) = 10-98 / 0-70 / 1
~ 80/1 ~ 70% by weight, preferably 20 ~ 80/0 ~ 50/2 ~ 50/2 ~
60% by weight, more preferably 25-75 / 1-45 / 3-30 / 5-50
% By weight of a thermoplastic resin having a halogenated styrene content of 5 to 50% by weight, preferably 5 to 40% by weight in the component (A) and / or (C). 1 to 20 parts by weight, preferably 1 to 10 parts by weight, 0 to 20 parts by weight of the above-mentioned flame retardant, preferably 0 to 15 parts by weight, more preferably 1 to 15 parts by weight, 0 to 10 parts by weight of an antimony compound Parts, preferably 0 to 8 parts by weight, more preferably 1 to 8 parts by weight.
上記の（Ａ）、（Ｂ）、（Ｃ）、（Ｄ）導電性充填剤
の各成分の数値限定理由は、前記の請求項（１）のそれ
と同じある。The reasons for limiting the numerical values of the components (A), (B), (C), and (D) of the conductive filler are the same as those in claim (1).
（Ａ）および／または（Ｂ）中のハロゲン化スチレン
の含有量が５重量％未満であると十分な難燃性が得られ
ず、一方、50重量％を超えると成形加工性、耐衝撃性が
劣る。If the halogenated styrene content in (A) and / or (B) is less than 5% by weight, sufficient flame retardancy cannot be obtained, while if it exceeds 50% by weight, moldability and impact resistance Is inferior.
上記の難燃剤、アンチモン化合物の上限の数値限定理
由は、前記の請求項（２）のそれと同じである。The reasons for limiting the upper limits of the flame retardant and the antimony compound are the same as those of the above-mentioned claim (2).
本発明の請求項（１）、（２）、（３）の（難燃性）
電磁波遮蔽用樹脂組成物中のゴム状重合体（ａ）の含有
量は、好ましくは５〜40重量％、さらに好ましくは５〜
30重量％である。Claims (1), (2) and (3) of the present invention (flame retardancy)
The content of the rubbery polymer (a) in the electromagnetic wave shielding resin composition is preferably 5 to 40% by weight, more preferably 5 to 40% by weight.
30% by weight.
本発明の電磁波遮蔽用樹脂組成物ならびに難燃性電磁
波遮蔽用樹脂組成物の製造方法に関しては、特に制限は
なく、通常の公知の方法を採用することができる。例え
ば、該組成物の全成分を混合機で混合し、それを成形材
料として供する方法、あるいは導電性充填剤成分以外の
成分を予め混合した混合物、あるいは該混合物のペレッ
ト化物に導電性充填剤を添加したものを成形材料として
供する方法がある。The method for producing the resin composition for shielding electromagnetic waves and the resin composition for shielding electromagnetic waves according to the present invention is not particularly limited, and ordinary known methods can be employed. For example, a method in which all the components of the composition are mixed with a mixer and used as a molding material, or a mixture in which components other than the conductive filler component are previously mixed, or a conductive filler in a pelletized product of the mixture, There is a method of providing the added material as a molding material.
また、目的に応じて顔料、染料、熱安定剤、酸化防止
剤、紫外線吸収剤、光安定剤、滑剤、可塑剤、帯電防止
剤および難燃剤などを添加することができる。Further, pigments, dyes, heat stabilizers, antioxidants, ultraviolet absorbers, light stabilizers, lubricants, plasticizers, antistatic agents, flame retardants and the like can be added according to the purpose.
［実施例］ 本発明をさらに具体的に説明するために、以下実施例
および比較例を挙げて説明する。なお、最終的に得られ
た樹脂組成物は射出成形法によって成形した後、次の試
験法により諸物性を測定した。[Examples] In order to more specifically describe the present invention, examples and comparative examples will be described below. In addition, after the resin composition finally obtained was molded by an injection molding method, various physical properties were measured by the following test methods.
耐衝撃性の評価として、1/2″アイゾット衝撃強さをA
STM D−256に従って測定した。To evaluate the impact resistance, a 1/2 ″ Izod impact strength
Measured according to STM D-256.
成形加工性の評価として、メルトフローレートをJIS
K−7210に従って評価した。As an evaluation of the formability, the melt flow rate is set to JIS
It was evaluated according to K-7210.
電磁波遮蔽性評価として、体積抵抗率をデジタルマル
チメーターTR6824（（株）アドバンテスト社製）を用い
て測定した。As the evaluation of the electromagnetic wave shielding property, the volume resistivity was measured using a digital multimeter TR6824 (manufactured by Advantest Corporation).
成形品の表面外観の評価は、試験片の表面を目視によ
り評価した。The surface appearance of the molded article was evaluated by visually observing the surface of the test piece.
◎：光沢が均一で、かつ表面が平滑である。A: The gloss is uniform and the surface is smooth.
○：光沢があり、やや平滑である。：: glossy and slightly smooth
×：光沢ムラがあり、平滑にかける。X: There is uneven gloss and the image is applied smoothly.
難燃性の評価は、UL−94（テストビース厚1/16″）に
従って測定した。Evaluation of flame retardancy was measured according to UL-94 (test bead thickness 1/16 ″).
耐薬品性は下記の方法で評価した。 Chemical resistance was evaluated by the following method.
ASTM1号ダンベルを、歪み0.5％となるように曲げ、治
具に固定し、イソプロピルアルコール（薬品Ａ）または
ブレーキ液（DOT3、薬品Ｂ）を塗布し、室温化で24時間
放置し、クラックの発生状況を目視評価した（耐薬品性
に優れているものは塗装性に優れる）。ASTM No. 1 dumbbell is bent to a strain of 0.5%, fixed to a jig, coated with isopropyl alcohol (chemical A) or brake fluid (DOT3, chemical B), left at room temperature for 24 hours, and cracks are generated The situation was visually evaluated (things excellent in chemical resistance are excellent in paintability).
◎：クラック発生せず ○：ミクロクラック少数発生 ×：ミクロクラック多数発生 表−１で用いられる各配合成分の説明 Ａ成分 Ａ−1:ポリブタジエン20％、スチレン60％、アクリロニ
トリル20％からなるゴム強化樹脂。グラフト率45％。◎: No cracks generated ○: Microcracks generated in small numbers ×: Microcracks generated in large numbers Description of each compounding component used in Table-1 A component A-1: Rubber reinforced consisting of 20% polybutadiene, 60% styrene, and 20% acrylonitrile resin. Graft rate 45%.
Ａ−2:ポリブタジエン60％、スチレン30％、アクリロニ
トクル10％からなるゴム強化樹脂。グラフト率35％。A-2: A rubber-reinforced resin composed of 60% polybutadiene, 30% styrene, and 10% acrylonitrile. Graft rate 35%.
Ａ−3:ポリブタジエン20％、ジブロモスチレン20％、ス
チレン40％、アクリロニトリル20％からなるゴム強化樹
脂。グラフト率40％。A-3: Rubber reinforced resin composed of 20% polybutadiene, 20% dibromostyrene, 40% styrene, and 20% acrylonitrile. Graft rate 40%.
Ｂ成分 Ｂ−1:スチレン70％、アクリロニトリル30％からなる共
重合体。B component B-1: a copolymer composed of 70% styrene and 30% acrylonitrile.
Ｂ−2:スチレン５％、α−メチルスチレン70％、アクリ
ロニトリル25％からなる共重合体。B-2: A copolymer comprising 5% of styrene, 70% of α-methylstyrene, and 25% of acrylonitrile.
Ｂ−3:スチレン50％、ジブロモスチレン30％、アクリロ
ニトリル20％からなる共重合体。B-3: a copolymer composed of 50% styrene, 30% dibromostyrene, and 20% acrylonitrile.
Ｃ成分 Ｃ−1:ポリカーボネート （タフロンA2200、出光石油化学（株）製） Ｄ成分 Ｄ−1:ポリブチレンテレフタレート Ｄ−2:ポリエチレンテレフタレート 導電性充填剤 Ｅ−1:ステンレス繊維 （ベキシールド、ベカルト社製） Ｅ−2:ステンレス繊維 （ナスロン、日本精線（株）製） 難燃剤 Ｆ−1:ブロム化エポキシオリゴマー （EC−20、大日本インキ（株）製） Ｆ−2:デカブロモジフェンルエーテル Ｆ−3:テトラブロモビスフェノールＡオリゴマー 実施例１〜９、比較例１〜４ 表−１の導電性充填剤以外の成分を予めヘンシェルミ
キサーで混合し、240℃の温度条件の押出機でペレット
を作製した。次いで、該ペレットと導電性充填剤を混合
し、この混合物を用いて射出成形機で各種の試験片を成
形した。C component C-1: Polycarbonate (Taflon A2200, manufactured by Idemitsu Petrochemical Co., Ltd.) D component D-1: Polybutylene terephthalate D-2: Polyethylene terephthalate Conductive filler E-1: Stainless steel fiber (Vexshield, manufactured by Bekaert Co.) E-2: Stainless steel fiber (Naslon, manufactured by Nippon Seisen Co., Ltd.) Flame retardant F-1: Brominated epoxy oligomer (EC-20, manufactured by Dainippon Ink Co., Ltd.) F-2: Decabromodifenle ether F-3: Tetrabromobisphenol A oligomer Examples 1 to 9, Comparative Examples 1 to 4 The components other than the conductive fillers in Table 1 were mixed in advance with a Henschel mixer, and pellets were formed with an extruder at a temperature of 240 ° C. Produced. Next, the pellets and the conductive filler were mixed, and various test pieces were molded using the mixture with an injection molding machine.
実施例１〜９は、本発明の範囲（難燃性）の電磁波遮
蔽用組成物であり、本発明の目的とする効果が得られ
る。Examples 1 to 9 are compositions for shielding electromagnetic waves within the scope (flame retardancy) of the present invention, and the effects intended by the present invention can be obtained.
比較例１は、Ｃ成分が本発明の範囲未満であり、成形
加工性、耐衝撃性の物性バランスが劣る。In Comparative Example 1, the component C is less than the range of the present invention, and the balance of physical properties of molding processability and impact resistance is poor.
比較例２は、Ｄ成分が本発明の範囲未満の例であり、
成形加工性、耐薬品性、成形品の表面外観性が劣る。Comparative Example 2 is an example in which the D component is less than the range of the present invention,
Poor moldability, chemical resistance, and surface appearance of molded products.
比較例３は、導電性充填剤が本発明の範囲未満の例で
あり、電磁波遮蔽性に劣る。Comparative Example 3 is an example in which the conductive filler is less than the range of the present invention, and is inferior in electromagnetic wave shielding properties.
比較例４は、導電性充填剤が本発明の範囲を超えた例
であり、成形加工性、耐衝撃性、成形品の外観性が劣
る。Comparative Example 4 is an example in which the conductive filler exceeded the range of the present invention, and was inferior in moldability, impact resistance, and appearance of the molded article.
比較例５は、難燃剤が本発明の範囲を超えた例であ
り、成形加工性、耐衝撃性に劣る。Comparative Example 5 is an example in which the flame retardant exceeds the range of the present invention, and is inferior in moldability and impact resistance.
［発明の効果］ 従来、耐衝撃性、成形加工性の優れたゴム強化樹脂に
導電性充填剤を添加すると、耐衝撃性、成形加工性が大
幅に低下し、耐衝撃性、成形加工性の優れた電磁波遮蔽
用樹脂組成物が得られなかったが、本発明はゴム強化樹
脂に導電性充填剤を添加し、さらにポリカーボネートお
よび熱可塑性ポリエステルを添加することで、耐衝撃性
の低下する欠点を改善し、耐衝撃性、成形加工性の物性
バランスに優れ、かつ耐薬品性、塗装性、成形品の外観
性、耐熱性の優れた電磁波遮蔽用樹脂組成物ならびに、
さらに優れた難燃性を有する難燃性電磁波遮蔽用樹脂組
成物である。 [Effects of the Invention] Conventionally, when a conductive filler is added to a rubber-reinforced resin having excellent impact resistance and molding processability, the impact resistance and molding processability are greatly reduced, and the impact resistance and molding processability are reduced. Although an excellent electromagnetic wave shielding resin composition could not be obtained, the present invention adds a conductive filler to a rubber reinforced resin, and further adds a polycarbonate and a thermoplastic polyester, thereby reducing the impact resistance. Improve impact resistance, excellent balance of physical properties of molding processability, and chemical resistance, paintability, appearance of molded products, excellent heat resistance resin for electromagnetic wave shielding, and
It is a flame-retardant electromagnetic wave shielding resin composition having more excellent flame retardancy.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ //(Ｃ０８Ｋ 13/02 3:08 5:04 3:22） (58)調査した分野(Int.Cl.6，ＤＢ名) C08L 51/04 C08L 25/00 - 25/18 C08L 69/00 C08L 67/02 C08K 3/00 C08K 5/00 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 identification symbol FI // (C08K 13/02 3:08 5:04 3:22) (58) Investigated field (Int.Cl. 6 , DB name) ) C08L 51/04 C08L 25/00-25/18 C08L 69/00 C08L 67/02 C08K 3/00 C08K 5/00
Claims (3)
10〜98/0〜70/1〜80/1〜70重量％からなる熱可塑性樹脂
（Ｉ）100重量部に対し、導電性充填剤（II）１〜20重
量部を含有することを特徴とする電磁波遮蔽用樹脂組成
物。 （Ａ）ゴム状重合体（ａ）５〜70重量部の存在下、芳香
族ビニル化合物／その他の単量体＝10〜100/0〜90重量
％からなる単量体化合物（ｂ）30〜95重量部（ａ＋ｂ＝
100重量部）を重合して得られるゴム強化樹脂。 （Ｂ）芳香族ビニル化合物／その他の単量体＝10〜100/
0〜90重量％を重合して得られる重合体。 （Ｃ）ポリカーボネート （Ｄ）熱可塑性ポリエステル(1) The following (A) / (B) / (C) / (D) =
It is characterized by containing 1 to 20 parts by weight of a conductive filler (II) per 100 parts by weight of a thermoplastic resin (I) consisting of 10 to 98/0 to 70/1 to 80/1 to 70% by weight. And a resin composition for shielding electromagnetic waves. (A) In the presence of rubbery polymer (a) 5 to 70 parts by weight, aromatic vinyl compound / other monomer = 10 to 100/0 to 90% by weight monomer compound (b) 30 to 95 parts by weight (a + b =
(100 parts by weight). (B) aromatic vinyl compound / other monomer = 10-100 /
A polymer obtained by polymerizing 0 to 90% by weight. (C) Polycarbonate (D) Thermoplastic polyester
記載の（II）／難燃剤／アンチモン化合物＝100/1〜20/
1〜20/1〜10重量部を含有することを特徴とする難燃性
電磁波遮蔽用樹脂組成物。(2) Claim (1) / (1)
(II) / flame retardant / antimony compound = 100 / 1-20 /
A flame-retardant electromagnetic wave shielding resin composition comprising 1 to 20/1 to 10 parts by weight.
10〜98/0〜70/1〜80/1〜70重量％からなり、かつ（Ａ）
および／または（Ｂ）中のハロゲン化スチレン含有量が
５〜50重量％である熱可塑性樹脂（III）100重量部に対
し、導電性充填剤（II）１〜20重量部、難燃剤０〜20重
量部およびアンチモン化合物０〜10重量部を含有するこ
とを特徴とする難燃性電磁波遮蔽用樹脂組成物。 （Ａ）ゴム状重合体（ａ）５〜70重量部の存在下、ハロ
ゲン化スチレンおよび／またはハロゲン化スチレン以外
の芳香族ビニル化合物／その他の単量体＝10〜100/0〜9
0重量％からなる単量体化合物（ｂ）30〜95重量部（ａ
＋ｂ＝100重量部）を重合して得られるゴム強化樹脂。 （Ｂ）ハロゲン化スチレンおよび／またはハロゲン化ス
チレン以外の芳香族ビニル化合物／その他の単量体＝10
〜100/0〜90重量％を重合して得られる重合体。 （Ｃ）ポリカーボネート （Ｄ）熱可塑性ポリエステル3. The following (A) / (B) / (C) / (D) =
10-98 / 0-70 / 1-80 / 1-70% by weight, and (A)
And / or 100 parts by weight of the thermoplastic resin (III) having a halogenated styrene content of 5 to 50% by weight in (B), 1 to 20 parts by weight of the conductive filler (II), and 0 to 5 parts of the flame retardant. A flame-retardant electromagnetic wave shielding resin composition comprising 20 parts by weight and 0 to 10 parts by weight of an antimony compound. (A) Rubbery polymer (a) In the presence of 5 to 70 parts by weight, halogenated styrene and / or aromatic vinyl compound other than halogenated styrene / other monomer = 10 to 100/0 to 9
30 to 95 parts by weight of a monomer compound (b) consisting of 0% by weight (a
+ B = 100 parts by weight). (B) halogenated styrene and / or aromatic vinyl compound other than halogenated styrene / other monomer = 10
To 100/0 to 90% by weight. (C) Polycarbonate (D) Thermoplastic polyester
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2062131A JP2876690B2 (en) | 1990-03-13 | 1990-03-13 | Resin composition for shielding electromagnetic waves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2062131A JP2876690B2 (en) | 1990-03-13 | 1990-03-13 | Resin composition for shielding electromagnetic waves |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03263453A JPH03263453A (en) | 1991-11-22 |
| JP2876690B2 true JP2876690B2 (en) | 1999-03-31 |
Family
ID=13191217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2062131A Expired - Fee Related JP2876690B2 (en) | 1990-03-13 | 1990-03-13 | Resin composition for shielding electromagnetic waves |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2876690B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19903073A1 (en) | 1999-01-27 | 2000-08-10 | Basf Ag | Molding compounds for automotive interior applications |
| US6268408B1 (en) * | 1999-10-22 | 2001-07-31 | Lucent Technologies Inc. | Conductive fire-retardant thermoplastic elastomer mixture |
| US6673864B2 (en) * | 2000-11-30 | 2004-01-06 | General Electric Company | Conductive polyester/polycarbonate blends, methods for preparation thereof, and articles derived therefrom |
| JP5847623B2 (en) * | 2012-03-23 | 2016-01-27 | ダイセルポリマー株式会社 | Thermally conductive and flame retardant thermoplastic resin composition |
| KR20220045768A (en) * | 2020-10-06 | 2022-04-13 | 주식회사 엘지화학 | Thermoplastic resin composition, method for preparing the same and molded article therefrom |
-
1990
- 1990-03-13 JP JP2062131A patent/JP2876690B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03263453A (en) | 1991-11-22 |
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