JP2858551B2 - Wiring inspection data creation method - Google Patents
Wiring inspection data creation methodInfo
- Publication number
- JP2858551B2 JP2858551B2 JP8014073A JP1407396A JP2858551B2 JP 2858551 B2 JP2858551 B2 JP 2858551B2 JP 8014073 A JP8014073 A JP 8014073A JP 1407396 A JP1407396 A JP 1407396A JP 2858551 B2 JP2858551 B2 JP 2858551B2
- Authority
- JP
- Japan
- Prior art keywords
- inspection
- conductor
- width
- contour
- point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は布線検査データ作成
方法に関し、特に計算機支援設計(CAD)により印刷
配線板検査治具製造用の布線検査データを生成するため
の布線検査データ作成方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring inspection data generating method, and more particularly to a wiring inspection data generating method for generating wiring inspection data for manufacturing a printed wiring board inspection jig by computer aided design (CAD). About.
【0002】[0002]
【従来の技術】一般的な印刷配線板のパターンのショー
ト・オープン等を検査する布線検査は、測定プローブ支
持板上に等間隔で格子状に配列した測定プローブ群を有
する布線検査装置を用いており、被検査印刷配線板の検
査対象点(以下検査点)の選択機構、例えば、検査点対
応の穴を有する絶縁板すなわち印刷配線板検査治具(以
下検査治具)を用いて上記測定プローブ群のうち検査対
象パターン対応のプローブを選択し検査を行う。2. Description of the Related Art In general, a wiring inspection for inspecting a printed circuit board for short / open of a pattern is performed by a wiring inspection apparatus having a group of measurement probes arranged at regular intervals in a grid pattern on a measurement probe support plate. A mechanism for selecting an inspection target point (hereinafter referred to as an inspection point) of a printed wiring board to be inspected, for example, an insulating plate having holes corresponding to the inspection points, that is, a printed wiring board inspection jig (hereinafter referred to as an inspection jig) is used. A probe corresponding to the pattern to be inspected is selected from the group of measurement probes, and the inspection is performed.
【0003】印刷配線板には予め検査対象パターンに布
線検査のための検査点を設定しておきこの検査点に上記
プローブの接触接続用の導体パターンである検査点を設
ける。これらの検査点は例えば部品実装孔やリードレス
部品の半田付け用導体すなわちパッドに対応する。検査
治具にはこの検査点対応の位置にプローブ選択用の穴を
設ける。Inspection points for wiring inspection are set in advance on a printed wiring board in a pattern to be inspected, and inspection points, which are conductor patterns for contact connection of the probe, are provided at the inspection points. These inspection points correspond to, for example, component mounting holes or soldering conductors or pads of leadless components. The inspection jig is provided with a hole for selecting a probe at a position corresponding to the inspection point.
【0004】一般に、上記検査点を設定するため、CA
Dにより印刷配線板の設計データを用いて上記検査点を
設定するためのデータすなわち布線検査データを作成す
る。しかし、印刷配線板には検査点と類似の導体パター
ン(以下検査点候補)が多数含まれている。例えば、複
数の配線の接続点すなわち中継点やスルーホール等であ
る。これらは必ずしも検査を必要とする検査点ではな
い。一方、検査治具の製造コストおよび検査装置の誤り
率はほぼ検査点数に比例する。したがって、不必要な検
査点をできるだけ削除する必要がある。Generally, to set the inspection point, CA
In step D, data for setting the inspection points, that is, wiring inspection data, is created using the design data of the printed wiring board. However, the printed wiring board includes a large number of conductor patterns similar to the inspection points (hereinafter, inspection point candidates). For example, it is a connection point of a plurality of wirings, that is, a relay point, a through hole, or the like. These are not necessarily inspection points that require inspection. On the other hand, the manufacturing cost of the inspection jig and the error rate of the inspection device are almost proportional to the number of inspection points. Therefore, it is necessary to delete unnecessary inspection points as much as possible.
【0005】従来この種の布線検査データの作成方法で
は、パターンデータ上の検査点候補のうち、複数のベク
トルで接続されている検査点候補を中継点とし、1本の
みのベクトルで接続されている検査点候補を検査点とす
る判別方法を行なっていた。Conventionally, in this type of wiring inspection data creating method, among inspection point candidates on pattern data, inspection point candidates connected by a plurality of vectors are used as relay points and connected by only one vector. The method of discriminating a candidate inspection point as an inspection point has been performed.
【0006】ベクトル情報で表した印刷配線板のパター
ンデータの一例を示す図7(A)〜(D)を参照して従
来の布線検査データ作成方法について説明すると、ま
ず、(A)に示すようにパターンデータが検査点A1〜
A6の6点とベクトル情報a1〜a5の5本で構成され
る場合は、接続ベクトルがa4,a5の2本の検査点検
査点候補A5とベクトルa2,a3,a4の3本の検査
点A3とを中継点とし、接続ベクトルがそれぞれ1本の
検査点検査点候補A1,A4,A6を検査点とする判別
を行なっていた。A conventional wiring inspection data creating method will be described with reference to FIGS. 7A to 7D which show an example of pattern data of a printed wiring board represented by vector information. First, FIG. As shown in FIG.
In a case where the connection vector is composed of six points A6 and five pieces of vector information a1 to a5, the connection vectors are two inspection point candidates A5 of a4 and a5 and three inspection points A3 of vectors a2, a3 and a4. Are determined as relay points, and the connection vector is determined to be one inspection point inspection point candidate A1, A4, A6 as an inspection point.
【0007】次に、図7(B)を参照すると、この図に
示すパターンデータは複数ベクトルb1〜b7を用いて
導体情報を生成している例を示す。一般に印刷配線板の
ベクトル情報が表す導体幅は数mmまでというような制
限があるため、それ以上の太幅の回路パターンを表現す
る場合は図示のように複数のベクトルを重ねて表現す
る。この場合、導体パターン中の検査点候補B1〜B3
の各々にはベクトルb3〜b5の3本が接続するため中
継点と判定される。(B)のように断線が考えられない
十分な幅(数ミリ程)以上の導体で接続されている場合
は、この判定すなわち検査点候補B1〜B3が検査不要
の中継点として支障ないが、(C)のように、検査点候
補C1〜C2が断線の可能性のある細幅導体パターンで
接続している場合も3本のベクトルc1,c2,c3の
接続があるので実際にはオープン検査対象の検査点とす
べきなのに中継点と判別してしまう。また、一般にティ
アドロップと呼ばれる接続の行なっている場合(D)
も、検査点候補D1,D2の各々には3本のベクトル
d,d1,d2とd,d3,d4の接続があるため同様
に中継点と見なしてしまう。Next, referring to FIG. 7B, an example is shown in which the pattern data shown in FIG. 7 generates conductor information using a plurality of vectors b1 to b7. Generally, the conductor width represented by the vector information of the printed wiring board is limited to several millimeters. Therefore, when expressing a circuit pattern having a larger width, a plurality of vectors are superimposed as shown. In this case, inspection point candidates B1 to B3 in the conductor pattern
Are connected to each of the three vectors b3 to b5, and are determined as relay points. When the conductors are connected by a conductor having a width (about several millimeters) or more that is not likely to be disconnected as in (B), this determination, that is, the inspection point candidates B1 to B3 does not hinder as a relay point that does not require inspection. As shown in (C), even when the inspection point candidates C1 and C2 are connected by a narrow conductor pattern that may be disconnected, there is actually an open inspection because there are connections of three vectors c1, c2 and c3. Although it should be a target inspection point, it is determined to be a relay point. In addition, when a connection generally called teardrop is made (D)
Also, since each of the test point candidates D1 and D2 has a connection between three vectors d, d1 and d2 and d, d3 and d4, the test point candidates are similarly regarded as relay points.
【0008】検査対象である接続信頼性は、ベクトル本
数ではなく、導体の幅などの情報で判断されるべきもの
であるので、上記のような誤判別が起こる。[0008] The connection reliability to be inspected is to be determined not by the number of vectors but by information such as the width of the conductor, so that the above erroneous determination occurs.
【0009】また、図8に示すように、ベクトル情報を
減らすため輪郭情報のみで導体を表現する場合もある。
この場合、ベクトル数のみで検査点/中継点を判別する
ことは不可能であり、従来の方法では検査点候補E1〜
E4をすべて検査点としていた。Further, as shown in FIG. 8, a conductor may be represented only by contour information in order to reduce vector information.
In this case, it is impossible to determine the inspection point / relay point only by the number of vectors.
All E4s were used as inspection points.
【0010】すなわち従来の方法では、すべての検査点
同士の接続は、図7(A)のように1本のベクトル情報
で行なわれているという前提で考えられている。したが
って図7(B)〜(D),図8のように複数ベクトルで
接続されている場合や、輪郭情報で接続されている場合
は、検査点候補の判別を間違えてしまうという問題を有
していた。That is, in the conventional method, it is assumed that the connection between all the inspection points is made by one vector information as shown in FIG. Therefore, as shown in FIGS. 7B to 7D and FIG. 8, when the connection is made by a plurality of vectors or when the connection is made by the outline information, there is a problem that the inspection point candidate is erroneously determined. I was
【0011】[0011]
【発明が解決しようとする課題】上述した従来の布線検
査データ作成方法は、検査点候補同士の接続が1本のベ
クトル情報のみで行なっているという前提でアルゴリズ
ムが考えられているため、パターンデータの作成方法に
よっては検査対象パターン上の検査点候補の中継点と検
査点の判別を間違えてしまい、不要な検査点を設定した
り、必要な検査点を削除したりするという欠点があっ
た。In the above-described conventional wiring inspection data creating method, an algorithm is considered on the premise that the connection between inspection point candidates is performed using only one vector information. Depending on the method of creating the data, the determination of the relay point and the inspection point of the inspection point candidate on the inspection target pattern is erroneously made, and there is a disadvantage that an unnecessary inspection point is set or a necessary inspection point is deleted. .
【0012】また、不要な検査点の設定による検査点数
の増加により、検査治具のプローブの接触圧力が低下
し、接触不良による検査誤り率の増加要因となるという
欠点があった。In addition, an increase in the number of inspection points due to the setting of unnecessary inspection points causes a decrease in the contact pressure of the probe of the inspection jig, resulting in an increase in the inspection error rate due to poor contact.
【0013】[0013]
【課題を解決するための手段】本発明の布線検査データ
作成方法は、印刷配線板の導体パターンの形状と大きさ
と始点と終点の座標ととを含むベクトル情報と導体の輪
郭情報とを含む導体情報から前記導体パターンの断線お
よび短絡の検出を含む布線検査用の検査点を設定する布
線検査データ作成方法において、前記導体情報から前記
検査点の候補である複数の検査点候補間を接続する前記
導体パターンの輪郭対応の輪郭ベクトル情報を生成する
輪郭化ステップと、前記輪郭ベクトル情報で示す導体幅
が前記印刷配線板の製造時の断線の非発生を保障する予
め定めた前記導体パターンの幅である接続保障幅に対し
て大きいか小さいかを判定する導体幅判定ステップと、
前記導体幅が前記接続保障幅に対して小さい場合に前記
導体パターンで接続される前記検査点候補を前記検査点
と設定する検査点設定ステップとを含むことを特徴とす
るものである。According to the present invention, there is provided a wiring inspection data creating method including vector information including the shape and size of a conductor pattern of a printed wiring board, coordinates of a start point and an end point, and contour information of a conductor. In the wiring inspection data creating method for setting inspection points for wiring inspection including detection of disconnection and short circuit of the conductor pattern from the conductor information, a plurality of inspection point candidates that are candidates for the inspection point are determined from the conductor information. A contouring step of generating contour vector information corresponding to the contour of the conductor pattern to be connected, and the conductor pattern indicated by the contour vector information, wherein the conductor pattern is determined in advance so that disconnection does not occur during manufacture of the printed wiring board. Conductor width determination step of determining whether the width is larger or smaller than the connection guarantee width that is the width of
An inspection point setting step of setting the inspection point candidate connected by the conductor pattern as the inspection point when the conductor width is smaller than the connection assurance width.
【0014】[0014]
【発明の実施の形態】次に、本発明の実施の形態をフロ
ーチャートで示す図1を参照すると、この図に示す本実
施の形態の布線検査データ作成方法は、導体情報1を入
力する導体情報入力ステップS1と、輪郭化を行う輪郭
化ステップS2と、正規化を行う正規化ステップS3
と、データ終了判定ステップS4と、接続関係を登録す
る接続関係登録ステップS4と、補正ステップS6と、
接続関係を登録する接続関係登録ステップS7と、中継
点抽出ステップS8とを有する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring now to FIG. 1, which is a flowchart showing an embodiment of the present invention, a wiring inspection data creating method according to this embodiment shown in FIG. Information input step S1, contouring step S2 for contouring, and normalizing step S3 for normalization
A data end determination step S4, a connection relation registration step S4 for registering a connection relation, a correction step S6,
It has a connection relation registration step S7 for registering a connection relation and a relay point extraction step S8.
【0015】次に、本実施の形態の動作について説明す
る。Next, the operation of this embodiment will be described.
【0016】まず、図1,導体情報1の例を示す図2お
よび図2の導体情報の加工されていく状態を示す図3を
参照して、まず導体情報入力ステップS1,輪郭化ステ
ップS2,正規化ステップS3の3つのステップについ
て説明すると、一般に印刷配線板の導体情報は、図2
(A)に示すように始点と終点の座標とそのベクトルの
形状・大きさを持つ情報と、図2(B)に示すように導
体の輪郭の座標情報群を持つ情報とによって構成され
る。ここで、図2(A)に示す導体情報1は3つのベク
トルf1〜f3から成る。First, referring to FIG. 1, FIG. 2 showing an example of the conductor information 1, and FIG. 3 showing the state in which the conductor information is being processed in FIG. 2, first, a conductor information input step S1, a contouring step S2, The three steps of the normalization step S3 will be described. Generally, the conductor information of a printed wiring board is represented by FIG.
As shown in FIG. 2A, the information includes the coordinates of the start point and the end point, the information having the shape and size of the vector thereof, and the information having the coordinate information group of the outline of the conductor as shown in FIG. 2B. Here, the conductor information 1 shown in FIG. 2A includes three vectors f1 to f3.
【0017】まず、導体情報入力ステップS1は、1つ
目のベクトルf1を読み込む(図3(A))。次に輪郭
化ステップS2は、このベクトルf1の形状(円)の大
きさから図3(B)のような輪郭情報を生成する。正規
化ステップS3は、この輪郭情報を輪郭情報3に書き込
む(図3(C))。次に導体情報入力ステップS1は2
つ目のベクトルf2を読み込み(図3(D))、輪郭化
ステップS2は、図3(E)のような輪郭情報を生成す
る。ここで正規化ステップS3は、1つ目の輪郭情報
(図3(C))を輪郭情報3から読み出して、2つ目の
輪郭情報(図3(E))と合成して輪郭を再生成して図
3(F)のような情報を輪郭情報3に書き込む。同様に
3つ目のベクトルf3についてもステップS1〜S3の
処理を行ない、図3(I)のような輪郭を生成する。ま
た、輪郭化ステップS2および正規化ステップS3は、
輪郭の外側ループを右廻り,内側ループを左廻りにする
機能も要する。輪郭ベクトルの右廻り,左廻りを判別す
る方法は、数多く存在するが、ここでは、面積を用いた
判定方法を説明する。First, the conductor information input step S1 reads the first vector f1 (FIG. 3A). Next, in the contouring step S2, contour information as shown in FIG. 3B is generated from the size of the shape (circle) of the vector f1. In the normalization step S3, this contour information is written into the contour information 3 (FIG. 3C). Next, the conductor information input step S1 is 2
The second vector f2 is read (FIG. 3D), and the contouring step S2 generates contour information as shown in FIG. 3E. Here, in the normalization step S3, the first contour information (FIG. 3C) is read from the contour information 3, and is synthesized with the second contour information (FIG. 3E) to regenerate the contour. Then, information as shown in FIG. Similarly, the processing of steps S1 to S3 is performed for the third vector f3, and a contour as shown in FIG. Further, the contouring step S2 and the normalizing step S3 include:
A function to turn the outer loop of the contour clockwise and the inner loop counterclockwise is also required. There are many methods for determining whether the contour vector is clockwise or counterclockwise. Here, a determination method using the area will be described.
【0018】図形の面積により輪郭ベクトルの右廻り,
左廻りを判別する方法を示す図4を参照すると、この図
に示す4つの頂点l〜oの多角形すなわち四辺形11の
面積Sは次式で求められる。The clockwise rotation of the contour vector depends on the area of the figure.
Referring to FIG. 4 showing a method of determining the left-handed rotation, the area S of the polygon, that is, the quadrilateral 11 of the four vertices l to o shown in FIG.
【0019】 [0019]
【0020】ただし(xn ,Yn )=(x0 ,y0 )
n=4とする。Where (x n , Y n ) = (x 0 , y 0 )
Let n = 4.
【0021】このとき、これらのベクトルが図4のよう
に右廻りであった場合、四辺形11の面積Sは負とな
り、左廻りの場合は正となる。したがって面積Sの符号
を求めることにより右廻りと左廻りの判別を行なう。At this time, if these vectors are clockwise as shown in FIG. 4, the area S of the quadrilateral 11 is negative, and if they are counterclockwise, they are positive. Therefore, by determining the sign of the area S, it is possible to discriminate between clockwise and counterclockwise.
【0022】次に図5を参照して、接続関係登録ステッ
プS4の動作について説明すると、ここで正規化ステッ
プS3までのステップで全ての導体情報は2つの輪郭1
2,13の情報として輪郭情報3に記憶されており、ま
た、これら輪郭12,13の内部の7つの検査点候補g
1〜g7が検査点候補情報2に記憶されている。Next, the operation of the connection relation registration step S4 will be described with reference to FIG. 5. Here, in the steps up to the normalization step S3, all the conductor information is represented by two outlines 1
2 and 13 are stored in the contour information 3, and seven inspection point candidates g inside the contours 12 and 13 are stored.
1 to g7 are stored in the inspection point candidate information 2.
【0023】まず、検査点候補g1〜g7に関して輪郭
12,13のどちらの内側に存在するか判別を行なう。
ある座標が多角形の内部または外部のいずれにあるかの
判別方法は数多く存在するが、ここでは一つの方法につ
いて説明する。便宜上検査点候補g5の場合を例にとっ
て説明すると、まず、判別対象の輪郭ループの外側に任
意の基準点αを定める。この基準点αは例えば基板外の
点であれば良い。この基準点αと検査点候補g5とを結
ぶ線分を線分14とし、この線分14と各輪郭12,1
3との交点を求めると、輪郭12は1ポイント、輪郭1
3は交点がないすなち0ポイントとなる。このポイント
数が偶数であれば外側、奇数であれば内側と判別を行な
い、検査点候補g5は輪郭12の内側に存在すると判別
する。このような判別方法により、検査点候補g1〜g
5は輪郭12の内部に、検査点候補g6,g7は輪郭1
3の内部にそれぞれ存在し、それぞれ同電位である。接
続関係登録ステップS4は、このような接続関係を輪郭
情報3に加えて、輪郭情報4に出力する。First, it is determined which of the contours 12 and 13 exists inside the inspection point candidates g1 to g7.
There are many methods for determining whether a certain coordinate is inside or outside a polygon, but one method will be described here. For convenience, the case of the inspection point candidate g5 will be described as an example. First, an arbitrary reference point α is determined outside the contour loop to be determined. The reference point α may be, for example, a point outside the substrate. A line segment connecting the reference point α and the inspection point candidate g5 is referred to as a line segment 14, and the line segment 14 and each of the contours 12, 1
3, the outline 12 is one point and the outline 1
3 has no intersection, that is, 0 points. If the number of points is even, it is determined that the point is outside, and if the number of points is odd, it is determined that the point is inside. According to such a determination method, the inspection point candidates g1 to g
5 is inside the contour 12, and the test point candidates g6 and g7 are the contour 1
3 and have the same potential. The connection relation registration step S4 outputs such connection relation to the outline information 4 in addition to the outline information 3.
【0024】補正ステップS5によって、図5の輪郭情
報4を補正した補正輪郭情報の一例を示す図6を併せて
参照すると、この補正ステップS5は、まず、輪郭情報
4から図5のような輪郭12,14の輪郭情報を読み込
む。次に、この輪郭情報をプリント配線板の製造時の断
線がないと保障する導体幅である接続保障幅(例えば5
00μm)分だけ細くする細幅化処理を行う。この細幅
化処理は、輪郭情報4が上述のように輪郭の外側ループ
が右廻り,内側ループが左廻りに統一されているので、
各々のベクトルを左に接続保障幅の半分だけシフトさせ
ることによって実現する。この補正処理によって図6に
示すような輪郭G1〜G6が生成され、輪郭情報4に書
き込まれる。Referring to FIG. 6 showing an example of the corrected contour information obtained by correcting the contour information 4 of FIG. 5 in the correction step S5, the correction step S5 is performed first from the contour information 4 to the contour as shown in FIG. 12 and 14 are read. Next, a connection guarantee width (for example, 5), which is a conductor width that guarantees that the contour information is free from disconnection at the time of manufacturing the printed wiring board.
(00 μm). In this narrowing processing, the contour information 4 is unified so that the outer loop of the contour is clockwise and the inner loop is counterclockwise as described above.
This is realized by shifting each vector to the left by half of the connection guarantee width. By this correction processing, contours G1 to G6 as shown in FIG.
【0025】次に、図5,図6を再度参照して接続関係
登録ステップS6の処理について説明すると、図5にお
いて同一の輪郭内にあった検査点候補が、補正ステップ
S5の処理の結果別の輪郭内になった検査点候補、例え
ば図6の検査点候補g2とg4等に注目する。Next, the processing of the connection relation registration step S6 will be described with reference to FIGS. 5 and 6 again. In FIG. 5, the inspection point candidates which were within the same contour are classified according to the result of the processing of the correction step S5. Attention is paid to the inspection point candidates within the outline of the inspection, for example, the inspection point candidates g2 and g4 in FIG.
【0026】補正ステップS5の処理の過程について、
互いに同電位であるという接続関係Qを登録する。同様
に輪郭G2については輪郭G1との接続関係O,輪郭G
3との接続関係Pと登録してゆく。この時輪郭G1の場
合は補正ステップS5の過程で分離した輪郭はG2のみ
であるので元々同電位であった輪郭G3やG6について
は接続関係登録を行なわない。これらの処理の結果、接
続関係登録ステップS6は輪郭G1〜G6に対して、接
続関係O〜Rの情報を付加して、輪郭情報4に書き込
む。Regarding the process of the correction step S5,
The connection relation Q that the potentials are the same is registered. Similarly, for the contour G2, the connection relationship O with the contour G1 and the contour G
The connection relationship P with No. 3 is registered. At this time, in the case of the contour G1, only the contour separated in the course of the correction step S5 is G2, so that the connection relation is not registered for the contours G3 and G6 which originally had the same potential. As a result of these processes, the connection relation registration step S6 adds the information of the connection relations O to R to the outlines G1 to G6 and writes the information in the outline information 4.
【0027】次に、図6を参照して中継点抽出ステップ
S7の処理について説明すると、まず輪郭G2のよう
な、他輪郭との接続関係が2つ以上ある輪郭(輪郭G2
の場合、接続関係O,P,Qの3つ)はその輪郭内の検
査点候補を検査しなくても他の輪郭内の検査点候補での
検査でその接続が保障される中継輪郭となる。輪郭G2
の場合、輪郭G1,G6と輪郭G3,G6との導通検査
を行なうことにより、それぞれ接続関係O,QとP,Q
の導通が確認されるため、輪郭G2の接続関係O,P,
Qはすべて接続保障される。接続関係O〜Qは、補正ス
テップS5の処理により接続保障幅以下で接続されてい
る部分であるので、この接続関係O〜Qの導通が確認さ
れれば、輪郭G2内の検査点候補g2は、検査の必要が
なく中継点とする。このように中継輪郭内の検査点候補
は、中継点として、中継点情報5に書き込む。Next, the processing of the relay point extraction step S7 will be described with reference to FIG. 6. First, a contour (contour G2) having two or more connection relations with another contour, such as contour G2.
In the case of (3), the connection relations O, P, and Q) are relay contours whose connections are guaranteed by inspection with inspection point candidates in other outlines without inspecting inspection point candidates in the outline. . Contour G2
In the case of, the continuity test between the contours G1 and G6 and the contours G3 and G6 is performed so that the connection relations O and Q and P and Q respectively.
Are confirmed, the connection relations O, P, and
Q is all connected. Since the connection relations O to Q are parts connected by the processing of the correction step S5 below the connection security width, if the continuity of the connection relations O to Q is confirmed, the inspection point candidate g2 in the outline G2 becomes It is a relay point without the need for inspection. In this way, the inspection point candidate in the relay contour is written in the relay point information 5 as a relay point.
【0028】中継輪郭以外の輪郭を端輪郭として、端輪
郭の内部に1つの検査点候補しか持たない輪郭(輪郭G
1,G3,G4,G5)の内部の検査点候補は、検査点
情報Fに書き込む(検査点候補g1,g3,g7,g
6)。次に端輪郭のうち複数の検査点候補を持つ輪郭、
例えば輪郭G6の中の検査点候補g4,g5の場合は、
どちらか一方を中継点情報5に、もう一方を検査点情報
6に書き込む。この検査点候補g4,g5は、補正ステ
ップS5で接続保障幅分の細幅化処理しても、なおかつ
接続があるということは、接続保障幅以上の導体で接続
されていると云える。したがってこれら検査点候補g
4,g5d,e間の導通検査は必要なく、接続関係Qの
検査のためにどちらか1点だけを検査点とする。An outline other than the relay outline is set as an end outline, and an outline having only one inspection point candidate inside the end outline (the outline G)
Inspection point candidates inside (1, G3, G4, G5) are written in inspection point information F (inspection point candidates g1, g3, g7, g
6). Next, a contour having a plurality of inspection point candidates among end contours,
For example, in the case of inspection point candidates g4 and g5 in the outline G6,
One of them is written in the relay point information 5 and the other is written in the inspection point information 6. Even if the inspection point candidates g4 and g5 are narrowed by the connection guarantee width in the correction step S5, the fact that there is a connection means that they are connected by a conductor larger than the connection guarantee width. Therefore, these inspection point candidates g
No continuity test between 4, g5d and e is required, and only one of them is used as a test point for testing the connection relationship Q.
【0029】以上の処理により、図5のような導体情報
と検査点候補情報の場合は、検査点g1,g3,g4,
g7,g6と中継点g2,g5とに判別される。With the above processing, in the case of the conductor information and the inspection point candidate information as shown in FIG. 5, the inspection points g1, g3, g4,
g7, g6 and relay points g2, g5.
【0030】[0030]
【発明の効果】以上説明したように、本発明の布線検査
データ作成方法は、導体情報から複数の検査点候補間を
接続する導体パターンの輪郭対応の輪郭ベクトル情報を
生成する輪郭化ステップと、輪郭ベクトル情報で示す導
体幅が接続保障幅に対して大きいか小さいかを判定する
導体幅判定ステップと、導体幅が接続保障幅に対して小
さい場合にこの導体パターンで接続される検査点候補を
検査点と設定する検査点設定ステップとを含み、検査対
象の検査点候補を高確度で検査点と検査不要の中継点と
に区別できるので、検査点の数を必要最小限に低減で
き、布線検査治具の製造コストを削減できるという効果
がある。As described above, the method for preparing wiring inspection data according to the present invention comprises a contouring step of generating contour vector information corresponding to the contour of a conductor pattern connecting a plurality of test point candidates from conductor information. A conductor width determining step of determining whether the conductor width indicated by the contour vector information is larger or smaller than the connection assurance width; and a test point candidate connected by this conductor pattern when the conductor width is smaller than the connection assurance width. Inspection point setting step of setting the inspection points as inspection points, the inspection point candidates to be inspected can be distinguished into inspection points and relay points that do not require inspection with high accuracy, so that the number of inspection points can be reduced to the minimum necessary, There is an effect that the manufacturing cost of the wiring inspection jig can be reduced.
【0031】また、検査点数の低減による検査プローブ
の接触圧力の増加ににより接触不良による布線検査の誤
り率を抑圧できるという効果がある。In addition, an increase in the contact pressure of the inspection probe due to a reduction in the number of inspection points has the effect of suppressing the error rate of the wiring inspection due to poor contact.
【0032】また、検査点数の低減により、検査対象の
印刷配線板の配線密度を大幅に向上できるという効果が
ある。Further, the reduction in the number of inspection points has the effect that the wiring density of the printed wiring board to be inspected can be greatly improved.
【0033】さらに、接続保障幅が簡単に変更可能であ
り、この接続保障幅以下の導体で接続している部分のみ
の検査用データを生成できるので、印刷配線板の製造方
法等に依存して接続保障幅が変わる場合、その印刷配線
板に最適な検査治具の情報を容易に生成できるという効
果がある。Further, the connection guarantee width can be easily changed, and the inspection data can be generated only for the portions connected by the conductors smaller than the connection guarantee width. Therefore, depending on the manufacturing method of the printed wiring board, etc. When the connection assurance width changes, there is an effect that information on an inspection jig optimal for the printed wiring board can be easily generated.
【図1】本発明の布線検査データ作成方法の一実施の形
態を示すフローチャートである。FIG. 1 is a flowchart illustrating an embodiment of a wiring inspection data creation method according to the present invention.
【図2】本実施の形態の布線検査データ作成方法におけ
る導体情報の一例を示す説明図である。FIG. 2 is an explanatory diagram showing an example of conductor information in the wiring inspection data creation method according to the present embodiment.
【図3】図2の導体情報を輪郭化する処理過程を模式的
に示す説明図である。FIG. 3 is an explanatory diagram schematically showing a process of contouring the conductor information of FIG. 2;
【図4】ベクトルの向きを判別する方法を説明する説明
図である。FIG. 4 is an explanatory diagram illustrating a method of determining the direction of a vector.
【図5】図1の接続関係登録ステップの動作を説明する
説明図である。FIG. 5 is an explanatory diagram illustrating an operation of a connection relation registration step in FIG. 1;
【図6】図1の補正ステップから中継点抽出ステップま
での動作を説明する説明図である。FIG. 6 is an explanatory diagram illustrating an operation from a correction step to a relay point extraction step in FIG. 1;
【図7】従来の布線検査データ作成方法を説明する説明
図である。FIG. 7 is an explanatory diagram illustrating a conventional wiring inspection data creation method.
【図8】導体情報を輪郭情報で表した例を示す説明図で
ある。FIG. 8 is an explanatory diagram showing an example in which conductor information is represented by contour information.
1 導体情報 2 検査点候補情報 3,4 輪郭情報 5 中継点情報 6 検査点情報 11 四辺形 12,13 輪郭 14 線分 REFERENCE SIGNS LIST 1 conductor information 2 inspection point candidate information 3, 4 outline information 5 relay point information 6 inspection point information 11 quadrilateral 12, 13 outline 14 line segment
Claims (2)
さと始点と終点の座標ととを含むベクトル情報と導体の
輪郭情報とを含む導体情報から前記導体パターンの断線
および短絡の検出を含む布線検査用の検査点を設定する
布線検査データ作成方法において、 前記導体情報から前記検査点の候補である複数の検査点
候補間を接続する前記導体パターンの輪郭対応の輪郭ベ
クトル情報を生成する輪郭化ステップと、 前記輪郭ベクトル情報で示す導体幅が前記印刷配線板の
製造時の断線の非発生を保障する予め定めた前記導体パ
ターンの幅である接続保障幅に対して大きいか小さいか
を判定する導体幅判定ステップと、 前記導体幅が前記接続保障幅に対して小さい場合に前記
導体パターンで接続される前記検査点候補を前記検査点
と設定する検査点設定ステップとを含むことを特徴とす
る布線検査データ作成方法。1. A cloth including detection of disconnection and short-circuit of a conductor pattern from vector information including the shape and size of a conductor pattern of a printed wiring board, coordinates of a start point and an end point, and conductor information including contour information of the conductor. In a wiring inspection data creating method for setting inspection points for line inspection, contour vector information corresponding to the outline of the conductor pattern connecting between a plurality of inspection point candidates that are candidates for the inspection point is generated from the conductor information. Contouring step, and determining whether the conductor width indicated by the contour vector information is larger or smaller than a connection assurance width which is a predetermined width of the conductor pattern that guarantees no occurrence of disconnection at the time of manufacturing the printed wiring board. A conductor width determining step for determining; and an inspection for setting the inspection point candidate connected by the conductor pattern as the inspection point when the conductor width is smaller than the connection assurance width. And a point setting step.
トル情報を前記輪郭の外側ループを右廻り,内側ループ
を左廻りにそれぞれ設定する機能を含み、 前記導体幅判定ステップが、前記導体幅を前記接続保障
幅分だけ細くする細幅化ステップを含み、 前記細幅化ステップが、前記輪郭ベクトル情報を左回り
に接続保障幅の半分だけシフトさせることを特徴とする
請求項1記載の布線検査データ作成方法。2. The contouring step includes a function of setting the contour vector information clockwise on an outer loop of the contour and clockwise setting an inner loop on the contour, and the conductor width determining step sets the conductor width to the conductor width. 2. The wiring inspection according to claim 1, further comprising a narrowing step of narrowing by a connection guarantee width, wherein the narrowing step shifts the contour vector information counterclockwise by half of the connection guarantee width. Data creation method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8014073A JP2858551B2 (en) | 1996-01-30 | 1996-01-30 | Wiring inspection data creation method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8014073A JP2858551B2 (en) | 1996-01-30 | 1996-01-30 | Wiring inspection data creation method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09211053A JPH09211053A (en) | 1997-08-15 |
JP2858551B2 true JP2858551B2 (en) | 1999-02-17 |
Family
ID=11850941
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8014073A Expired - Lifetime JP2858551B2 (en) | 1996-01-30 | 1996-01-30 | Wiring inspection data creation method |
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JP (1) | JP2858551B2 (en) |
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JP6175296B2 (en) * | 2013-06-28 | 2017-08-02 | 日置電機株式会社 | Inspection point setting device and program |
JP6214251B2 (en) * | 2013-07-10 | 2017-10-18 | 日置電機株式会社 | Inspection point setting device and program |
JP6385668B2 (en) * | 2013-11-07 | 2018-09-05 | 日置電機株式会社 | Inspection point selection device and program |
-
1996
- 1996-01-30 JP JP8014073A patent/JP2858551B2/en not_active Expired - Lifetime
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