JP2844828B2 - Electronic component mounting device - Google Patents
Electronic component mounting deviceInfo
- Publication number
- JP2844828B2 JP2844828B2 JP2101965A JP10196590A JP2844828B2 JP 2844828 B2 JP2844828 B2 JP 2844828B2 JP 2101965 A JP2101965 A JP 2101965A JP 10196590 A JP10196590 A JP 10196590A JP 2844828 B2 JP2844828 B2 JP 2844828B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- substrate
- transfer robot
- electronic
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はコンデンサや抵抗部品等の電子部品を回路形
成された基板上の所定の位置に載置する電子部品装着装
置に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components such as capacitors and resistance components at predetermined positions on a circuit-formed substrate.
従来の技術 近年、電子部品の基板への装着は作業時間短縮のため
の単位時間当り装着個数の増加が強く要望されている。2. Description of the Related Art In recent years, there has been a strong demand for mounting electronic components on a substrate by increasing the number of mounted electronic devices per unit time to reduce work time.
従来の電子部品装着装置の一例について第３図を参照
しながら説明する。An example of a conventional electronic component mounting apparatus will be described with reference to FIG.
第３図において、７は電子部品が装着される基板、８
は基板７を搬送するコンベア、９はコンベア８上の基板
７の位置を規正する基板規正装置である。10は電子部品
を保持するチャック、11はチャック10をコンベア８の流
れ方向（図中Ｘ軸方向）とコンベア８に直角な方向（Ｙ
軸方向）と上下方向（Ｚ軸方向）に移動する３軸の部品
移載ロボット、12は部品移載ロボット11のチャック位置
まで電子部品を順次供給する電子部品供給装置である。In FIG. 3, reference numeral 7 denotes a substrate on which electronic components are mounted;
Reference numeral 9 denotes a conveyor for transporting the substrate 7, and 9 denotes a substrate setting device for setting the position of the substrate 7 on the conveyor 8. Reference numeral 10 denotes a chuck for holding the electronic component, and 11 denotes a chuck 10 which moves the chuck 10 in a direction (Y-axis direction in the drawing) perpendicular to the conveyor 8 (Y direction).
A three-axis component transfer robot 12 that moves in the axial direction and the vertical direction (Z-axis direction), and an electronic component supply device 12 that sequentially supplies electronic components to the chuck position of the component transfer robot 11.
以上のように構成した電子部品装着装置の作用につい
て説明する。コンベア８上を搬送された基板７は基板規
正装置９によって位置規正される。The operation of the electronic component mounting apparatus configured as described above will be described. The position of the substrate 7 conveyed on the conveyor 8 is adjusted by the substrate adjusting device 9.
一方、部品移載ロボット11は部品供給装置12の部品供
給位置まで移動し、チャック10で電子部品を保持する。
次に基板７の部品挿入位置データに従い、部品移載ロボ
ット11がX,Y及びＺ軸方向に移動し、電子部品を基板７
上の所定位置に装着する。１枚の基板７に複数の電子部
品を装着する場合、部品移載ロボット11がその都度部品
供給装置12の部品供給位置まで移動し、上記の動作を繰
り返す。On the other hand, the component transfer robot 11 moves to the component supply position of the component supply device 12, and holds the electronic component with the chuck 10.
Next, the component transfer robot 11 moves in the X, Y, and Z-axis directions according to the component insertion position data of the
Attach to the upper predetermined position. When mounting a plurality of electronic components on one substrate 7, the component transfer robot 11 moves to the component supply position of the component supply device 12 each time and repeats the above operation.
発明が解決しようとする課題 しかしながら上記の構成では、部品移載ロボットを複
数設けて単位時間当り装着個数を増加させようとして
も、各部品移載ロボットが部品を保持する際や部品を装
着する際に互いに干渉し易いため、装着効率が向上しな
いという問題点を有していた。However, in the above configuration, even if a plurality of component transfer robots are provided and the number of components to be mounted per unit time is increased, when each component transfer robot holds a component or mounts a component, However, there is a problem in that the mounting efficiency is not improved because they easily interfere with each other.
本発明は上記問題点に鑑み、装着効率が向上する電子
部品装着装置を提供するものである。The present invention has been made in view of the above problems, and provides an electronic component mounting apparatus that improves mounting efficiency.
課題を解決するための手段 上記問題点を解消するために本発明の電子部品装着装
置は、基板を搬送するコンベアと、基板を規正しコンベ
アの流れ方向に基板を移動する１軸基板移載ロボット
と、電子部品を保持するための部品保持部をコンベアに
直角な水平方向と上下方向に移動する個別に動作可能な
複数の２軸部品移載ロボットと、部品移載ロボットのチ
ャック位置に電子部品を順次供給する複数の電子部品供
給装置とを備え、前記複数の２軸部品移載ロボットのそ
れぞれによる前記基板の部品装着位置への電子部品装着
完了に引続き、前記１軸基板移載ロボットが前記基板を
移動，規正するとともに、他の２軸部品移載ロボット
が、前記電子部品供給装置から供給され、前記部品保持
部により予め保持された電子部品を、移動、規正された
前記基板の部品装着位置に装着するための水平移動を、
電子部品装着完了後の前記２軸部品移載ロボットの前記
部品供給位置までの水平移動と重複して行わせる構成と
したものである。Means for Solving the Problems In order to solve the above problems, an electronic component mounting apparatus according to the present invention includes a conveyor for transporting a substrate, and a one-axis substrate transfer robot for regulating the substrate and moving the substrate in the flow direction of the conveyor. A plurality of individually operable two-axis component transfer robots for moving a component holding portion for holding electronic components in a horizontal direction and a vertical direction perpendicular to the conveyor, and electronic components at chuck positions of the component transfer robot And a plurality of electronic component supply devices that sequentially supply the electronic components to the component mounting position on the substrate by each of the plurality of two-axis component transfer robots. While moving and correcting the substrate, another two-axis component transfer robot moves and corrects the electronic component supplied from the electronic component supply device and held in advance by the component holding unit. Horizontal movement for mounting at the component mounting position of the substrate,
The horizontal movement of the two-axis component transfer robot to the component supply position after the completion of the mounting of the electronic component is performed in an overlapping manner.
作用 本発明は上記構成によって、コンベアの流れ方向につ
いては基板移載ロボットにより基板が移動するため、複
数の部品移載ロボットが互いに干渉することなく部品供
給装置と基板の間を交互に往復することが可能となり、
電子部品の単位時間当り装着個数を増加することができ
る。Effect of the Invention According to the present invention, since the substrate is moved by the substrate transfer robot in the flow direction of the conveyor, the plurality of component transfer robots alternately reciprocate between the component supply device and the substrate without interfering with each other. Becomes possible,
The number of electronic components mounted per unit time can be increased.
実 施 例 以下本発明の一実施例の電子部品装着装置について、
図面を参照しながら説明する。Embodiments Hereinafter, an electronic component mounting apparatus according to one embodiment of the present invention will be described.
This will be described with reference to the drawings.
第１図は電子部品装着装置の全体構成を示すものであ
る。同図において、１は電子部品が装着される基板、２
は基板１を搬送するコンベア、３は基板１の位置を規正
するとともにコンベアの流れ方向（図中Ｘ軸方向）に基
板を移動する１軸基板移載ロボットである。4a,4bは電
子部品を保持するチャック、5a,5bはチャック4a,4bをコ
ンベアに直角な方向（図中Ｙ軸方向）と上下方向（Ｚ軸
方向）に移動する２軸の部品移載ロボット、6a,6bは部
品移載ロボット5a,5bのチャック位置まで電子部品を順
次供給する電子部品供給装置である。FIG. 1 shows the overall configuration of the electronic component mounting apparatus. In FIG. 1, reference numeral 1 denotes a substrate on which electronic components are mounted;
Reference numeral 3 denotes a conveyer for transporting the substrate 1; and 3, a single-axis substrate transfer robot for regulating the position of the substrate 1 and moving the substrate in the direction of flow of the conveyor (the X-axis direction in the figure). 4a and 4b are chucks for holding electronic components, and 5a and 5b are two-axis component transfer robots that move the chucks 4a and 4b in directions perpendicular to the conveyor (Y-axis direction in the figure) and up and down (Z-axis direction). Reference numerals 6a and 6b denote electronic component supply devices for sequentially supplying electronic components to the chuck positions of the component transfer robots 5a and 5b.
以上のように構成した電子部品装着装置の作用につい
て説明する。コンベア２上を搬送された基板１は基板移
載ロボット３により位置規正される。一方、部品移載ロ
ボット5a,5bは部品供給装置6a,6bの部品供給位置まで移
動し、それぞれチャック4a,4bで電子部品を保持する。
次に第１の部品装着位置データに従い部品移載ロボット
5aがY,Z軸方向に移動するとともに、基板移載ロボット
３はＸ軸方向を移動し、基板１の第１点が部品移載ロボ
ット5aの装着線上の位置に基板１を移載する。このよう
にして第１電子部品の装着が完了すると、部品移載ロボ
ット5aが再度部品供給装置6aの部品供給位置まで移動す
る。同時に、部品移載ロボット5bは第２の部品装着位置
データに従い、Ｙ及びＺ軸方向に移動するとともに、基
板移載ロボット３がＸ軸方向に基板１を移載して第２電
子部分を挿入する。以下部品移載ロボット5a,5bは交互
に基板１と電子部品供給装置6a,6bの間を往復して所定
数の電子部品の装着を完了する。The operation of the electronic component mounting apparatus configured as described above will be described. The position of the substrate 1 transported on the conveyor 2 is adjusted by the substrate transfer robot 3. On the other hand, the component transfer robots 5a and 5b move to the component supply positions of the component supply devices 6a and 6b, and hold the electronic components by the chucks 4a and 4b, respectively.
Next, a component transfer robot according to the first component mounting position data
5a moves in the Y- and Z-axis directions, and the substrate transfer robot 3 moves in the X-axis direction. The first point of the substrate 1 transfers the substrate 1 to a position on the mounting line of the component transfer robot 5a. When the mounting of the first electronic component is completed in this way, the component transfer robot 5a moves to the component supply position of the component supply device 6a again. At the same time, the component transfer robot 5b moves in the Y and Z axes according to the second component mounting position data, and the substrate transfer robot 3 transfers the substrate 1 in the X axis direction and inserts the second electronic part. I do. Hereinafter, the component transfer robots 5a and 5b alternately reciprocate between the board 1 and the electronic component supply devices 6a and 6b to complete the mounting of a predetermined number of electronic components.
第３図（ａ），（ｂ）にそれぞれ従来の電子部品装着
装置（同図（ａ））と本発明の一実施例における電子部
品装着装置（同図（ｂ））にて電子部分２点を挿入する
場合のタイミングチャートを示す。この場合の部品２点
当たりの作業時間はT2＜T1となり、装着効率が向上する
こととなる。FIGS. 3 (a) and 3 (b) show two points of an electronic part in a conventional electronic component mounting apparatus (FIG. 3 (a)) and an electronic component mounting apparatus in one embodiment of the present invention (FIG. 3 (b)). 4 shows a timing chart in the case of inserting a symbol. In this case, the work time per two parts is T 2 <T 1 , and the mounting efficiency is improved.
発明の効果 以上のように本発明は、基板を搬送するコンベアと、
基板を規正しコンベアの流れ方向に基板を移動する１軸
基板移載ロボットと、電子部品を保持するための部品保
持部をコンベアに直角な方向と上下方向に移動する複数
の２軸部品移載ロボットと、部品移載ロボットのチャッ
ク位置に電子部品を順次供給する複数の電子部品供給装
置を設けることにより複数の２軸部品移載ロボットが互
いに干渉することなく、部品供給位置と部品装着位置と
の間を重複したタイミングで往復移動できることとなる
ため、電子部品の単位時間当りの装着個数を増加させる
ことができ、また基板の進行方向に沿った装着位置の変
更に対してもコンベアの流れに沿った１軸基板移載ロボ
ットによる基板の移送で対応できるため、それぞれの動
作を分担できることとなり、装置の動作速度を速くする
ことが可能になるとともに、装置全体として構成がコン
パクトになる。Effects of the Invention As described above, the present invention provides a conveyor for transporting a board,
A one-axis substrate transfer robot that sets a substrate and moves the substrate in the flow direction of the conveyor, and a plurality of two-axis component transfer that moves a component holding unit for holding electronic components in a direction perpendicular to the conveyor and in a vertical direction. By providing a robot and a plurality of electronic component supply devices for sequentially supplying electronic components to the chuck position of the component transfer robot, a plurality of two-axis component transfer robots do not interfere with each other, and a component supply position and a component mounting position can be set. Can be reciprocated at the same timing, so that the number of mounted electronic components per unit time can be increased. Since it is possible to cope with the transfer of the substrate by the uniaxial substrate transfer robot along, the respective operations can be shared, and the operation speed of the apparatus can be increased. Both configurations can be made compact as a whole unit.
第１図は本発明の一実施例における電子部品装着装置の
全体斜視図、第２図（ａ）は本発明の一実施例における
電子部品装着装置のタイミングチャート、第２図（ｂ）
は従来の電子部品装着装置のタイミングチャート、第３
図は従来の電子部品装着装置の全体斜視図である。 １……基板、２……コンベア、３……１軸基板移載ロボ
ット、4a,4b……チャック、5a,5b……部品移載ロボッ
ト、6a,6b……電子部品供給装置。FIG. 1 is an overall perspective view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 (a) is a timing chart of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. 2 (b).
Is a timing chart of a conventional electronic component mounting apparatus,
FIG. 1 is an overall perspective view of a conventional electronic component mounting apparatus. 1 ... board, 2 ... conveyor, 3 ... single-axis board transfer robot, 4a, 4b ... chuck, 5a, 5b ... component transfer robot, 6a, 6b ... electronic component supply device.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 13/00──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. 6 , DB name) H05K 13/00
Claims (1)
コンベアの流れ方向に基板を移動する１軸基板移載ロボ
ットと、電子部品を保持するための部品保持部をコンベ
アに直角な水平方向と上下方向に移動する個別に動作可
能な複数の２軸部品移載ロボットと、部品移載ロボット
のチャック位置に電子部品を順次供給する複数の電子部
品供給装置とを備え、前記複数の２軸部品移載ロボット
のそれぞれによる前記基板の部品装着位置への電子部品
装着完了に引続き、前記１軸基板移載ロボットが前記基
板を移動、規正するとともに、他の２軸部品移載ロボッ
トが、前記電子部品供給装置から供給され、前記部品保
持部により予め保持された電子部品を、移動，規正され
た前記基板の部品装着位置に装着するための水平移動
を、電子部品装着完了後の前記２軸部品移載ロボットの
前記部品供給位置までの水平移動と重複して行わせる構
成とした電子部品装着装置。1. A conveyor for transporting a substrate, a uniaxial substrate transfer robot for repositioning the substrate and moving the substrate in the flow direction of the conveyor, and a component holder for holding electronic components in a horizontal direction perpendicular to the conveyor. A plurality of individually movable two-axis component transfer robots moving vertically, and a plurality of electronic component supply devices for sequentially supplying electronic components to chuck positions of the component transfer robot; Following completion of the mounting of the electronic components to the component mounting position of the substrate by each of the component transfer robots, the one-axis substrate transfer robot moves and corrects the substrate, and the other two-axis component transfer robot performs The horizontal movement for mounting the electronic component supplied from the electronic component supply device and held in advance by the component holding unit to the specified component mounting position of the board is completed by the electronic component mounting completion. After the two-axis component electronic component mounting system of the horizontal movement and the overlapping causes construction of the up component supply position transfer robot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2101965A JP2844828B2 (en) | 1990-04-18 | 1990-04-18 | Electronic component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2101965A JP2844828B2 (en) | 1990-04-18 | 1990-04-18 | Electronic component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04796A JPH04796A (en) | 1992-01-06 |
| JP2844828B2 true JP2844828B2 (en) | 1999-01-13 |
Family
ID=14314584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2101965A Expired - Fee Related JP2844828B2 (en) | 1990-04-18 | 1990-04-18 | Electronic component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2844828B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6691400B1 (en) * | 1995-12-15 | 2004-02-17 | Matsushita Electric Industrial Co., Ltd. | High speed electronic parts mounting apparatus having mounting heads which alternately mount components on a printed circuit board |
-
1990
- 1990-04-18 JP JP2101965A patent/JP2844828B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04796A (en) | 1992-01-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |