JP2840318B2 - Magnetic card - Google Patents
Magnetic cardInfo
- Publication number
- JP2840318B2 JP2840318B2 JP1231510A JP23151089A JP2840318B2 JP 2840318 B2 JP2840318 B2 JP 2840318B2 JP 1231510 A JP1231510 A JP 1231510A JP 23151089 A JP23151089 A JP 23151089A JP 2840318 B2 JP2840318 B2 JP 2840318B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- weight
- styrene
- poly
- magnetic card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920000642 polymer Polymers 0.000 claims description 31
- 239000010954 inorganic particle Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 48
- 238000000034 method Methods 0.000 description 17
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 239000010410 layer Substances 0.000 description 12
- -1 ethylene, propylene, butene Chemical class 0.000 description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 230000008018 melting Effects 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 239000000178 monomer Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- PBKONEOXTCPAFI-UHFFFAOYSA-N 1,2,4-trichlorobenzene Chemical compound ClC1=CC=C(Cl)C(Cl)=C1 PBKONEOXTCPAFI-UHFFFAOYSA-N 0.000 description 3
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000004313 glare Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000009998 heat setting Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920003197 poly( p-chlorostyrene) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- ZXVVIKMMTCNHIH-UHFFFAOYSA-N 1,2,3,4,5-pentamethylcyclopentane Chemical compound CC1C(C)C(C)C(C)C1C ZXVVIKMMTCNHIH-UHFFFAOYSA-N 0.000 description 1
- BOVQCIDBZXNFEJ-UHFFFAOYSA-N 1-chloro-3-ethenylbenzene Chemical compound ClC1=CC=CC(C=C)=C1 BOVQCIDBZXNFEJ-UHFFFAOYSA-N 0.000 description 1
- JWVTWJNGILGLAT-UHFFFAOYSA-N 1-ethenyl-4-fluorobenzene Chemical compound FC1=CC=C(C=C)C=C1 JWVTWJNGILGLAT-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- FZHNODDFDJBMAS-UHFFFAOYSA-N 2-ethoxyethenylbenzene Chemical compound CCOC=CC1=CC=CC=C1 FZHNODDFDJBMAS-UHFFFAOYSA-N 0.000 description 1
- CBECDWUDYQOTSW-UHFFFAOYSA-N 2-ethylbut-3-enal Chemical compound CCC(C=C)C=O CBECDWUDYQOTSW-UHFFFAOYSA-N 0.000 description 1
- KBKNKFIRGXQLDB-UHFFFAOYSA-N 2-fluoroethenylbenzene Chemical compound FC=CC1=CC=CC=C1 KBKNKFIRGXQLDB-UHFFFAOYSA-N 0.000 description 1
- CTHJQRHPNQEPAB-UHFFFAOYSA-N 2-methoxyethenylbenzene Chemical compound COC=CC1=CC=CC=C1 CTHJQRHPNQEPAB-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910020630 Co Ni Inorganic materials 0.000 description 1
- 229910020647 Co-O Inorganic materials 0.000 description 1
- 229910002440 Co–Ni Inorganic materials 0.000 description 1
- 229910020704 Co—O Inorganic materials 0.000 description 1
- 229910020516 Co—V Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910017061 Fe Co Inorganic materials 0.000 description 1
- 229910017135 Fe—O Inorganic materials 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- YMOONIIMQBGTDU-VOTSOKGWSA-N [(e)-2-bromoethenyl]benzene Chemical compound Br\C=C\C1=CC=CC=C1 YMOONIIMQBGTDU-VOTSOKGWSA-N 0.000 description 1
- 125000004054 acenaphthylenyl group Chemical group C1(=CC2=CC=CC3=CC=CC1=C23)* 0.000 description 1
- HXGDTGSAIMULJN-UHFFFAOYSA-N acetnaphthylene Natural products C1=CC(C=C2)=C3C2=CC=CC3=C1 HXGDTGSAIMULJN-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910001566 austenite Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- GRFFKYTUNTWAGG-UHFFFAOYSA-N chloroethene;prop-2-enenitrile Chemical compound ClC=C.C=CC#N GRFFKYTUNTWAGG-UHFFFAOYSA-N 0.000 description 1
- 229910000424 chromium(II) oxide Inorganic materials 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- KETWBQOXTBGBBN-UHFFFAOYSA-N hex-1-enylbenzene Chemical compound CCCCC=CC1=CC=CC=C1 KETWBQOXTBGBBN-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 238000001646 magnetic resonance method Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JTHNLKXLWOXOQK-UHFFFAOYSA-N n-propyl vinyl ketone Natural products CCCC(=O)C=C JTHNLKXLWOXOQK-UHFFFAOYSA-N 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- KHMYONNPZWOTKW-UHFFFAOYSA-N pent-1-enylbenzene Chemical compound CCCC=CC1=CC=CC=C1 KHMYONNPZWOTKW-UHFFFAOYSA-N 0.000 description 1
- FPVKHBSQESCIEP-JQCXWYLXSA-N pentostatin Chemical compound C1[C@H](O)[C@@H](CO)O[C@H]1N1C(N=CNC[C@H]2O)=C2N=C1 FPVKHBSQESCIEP-JQCXWYLXSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001596 poly (chlorostyrenes) Polymers 0.000 description 1
- 229920001620 poly(3-methyl styrene) Polymers 0.000 description 1
- 229920001627 poly(4-methyl styrene) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001608 poly(methyl styrenes) Polymers 0.000 description 1
- 229920002627 poly(phosphazenes) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 229920006249 styrenic copolymer Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Paints Or Removers (AREA)
- Magnetic Record Carriers (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は磁気カードに関し、詳しくは熱に対する寸法
安定性及び外観にすぐれるとともに、腰の強い磁気カー
ドに関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic card, and more particularly, to a magnetic card which is excellent in dimensional stability against heat and appearance and which is strong.
〔従来の技術及び発明が解決しようとする課題〕 従来から、磁気カードの基材フィルムとしては、ポリ
塩化ビニル系のものとポリエステル系のものが知られて
いる。しかし、ポリ塩化ビニル系の基材フィルムは耐熱
性が低く、また腰が弱い。一方、ポリエステル系の基材
フィルムは、白色度が充分でなく、光沢が高すぎる等の
実用上の問題点がある。[Prior Art and Problems to be Solved by the Invention] Conventionally, as a substrate film of a magnetic card, a polyvinyl chloride-based film and a polyester-based film have been known. However, a polyvinyl chloride-based base film has low heat resistance and low stiffness. On the other hand, polyester base films have practical problems such as insufficient whiteness and too high gloss.
ところで、本発明者らが先端開発したシンジオタクチ
ック構造を有するスチンレン系重合体からなる延伸フィ
ルムは、耐熱性,耐薬品性,電気絶縁性にすぐれたもの
である。しかしながら、この延伸フィルムを基材フィル
ムとして磁気カードを作製しても、白色度が不充分であ
るとともに、光沢が高すぎるなどの不都合があり、実用
に耐えるものではない。By the way, a stretched film made of a stinlen-based polymer having a syndiotactic structure, developed by the present inventors, has excellent heat resistance, chemical resistance, and electrical insulation. However, even if a magnetic card is produced using this stretched film as a base film, the whiteness is insufficient and the gloss is too high.
そこで、本発明者らは、上記シンジオタクチック構造
を有するスチレン系重合体を用いて、充分に実用に耐え
うる磁気カードを開発すべく鋭意研究を重ねた。Therefore, the present inventors have conducted intensive studies to develop a magnetic card that can sufficiently withstand practical use by using the styrene-based polymer having the syndiotactic structure.
その結果、上記シンジオタクチック構造を有するスチ
レン系重合体に白色無機粒子を一定割合で配合した組成
物からなるとともに、線膨張係数,白色度及び厚さが一
定範囲にある基材フィルムに磁性層を設けたものが、上
記目的に適う磁気カードになることを見出した。本発明
はかかる知見に基いて完成したものである。As a result, a magnetic layer is formed on a base film having a linear expansion coefficient, whiteness, and thickness within a certain range, in addition to a composition in which white inorganic particles are mixed in a certain ratio with the styrene polymer having the syndiotactic structure. Has been found to be a magnetic card suitable for the above purpose. The present invention has been completed based on such findings.
すなわち本発明は、シンジオタクチック構造を有する
スチレン系重合体40〜99重量%及び白色無機粒子60〜1
重量%からなる組成物のフィルムあるいは該フィルムを
含む積層フィルムであって、線膨張係数7×10-5/℃以
下,白色度80以上,厚さ50〜1000μmである基材フィル
ムの少なくとも片面に磁性層を有る磁気カードを提供す
るものである。That is, the present invention provides 40 to 99% by weight of a styrenic polymer having a syndiotactic structure and 60 to 1% of white inorganic particles.
% Of a base film having a coefficient of linear expansion of 7 × 10 −5 / ° C. or less, a whiteness of 80 or more, and a thickness of 50 to 1000 μm. An object of the present invention is to provide a magnetic card having a magnetic layer.
本発明では磁気カードの基材フィルムとして、上述し
た組成物のフィルムからなる単層フィルムあるいは該フ
ィルムを含む積層フィルムが用いられる。また、この基
材フィルムは、線膨張係数が7×10-5/℃以下、白色度
が75以上、好ましくは80以上であり、またその厚さ50〜
1000μm、好ましくは75〜800μmである。ここで基材
フィルムの線膨張係数が、7×10-5/℃を超えると記録
再生状態の温度変化が目立し好ましくない。また、白色
度が75未満になると、鮮明な文字や絵が得られなくな
り、実用上好ましくない。厚さについては、50μmより
薄いと強度や耐久性,保持性が不足し、一方厚すぎると
加工性,ハンドリング性,可撓性が低下し好ましくな
い。In the present invention, a single-layer film composed of a film of the above-described composition or a laminated film containing the film is used as the base film of the magnetic card. The base film has a linear expansion coefficient of 7 × 10 −5 / ° C. or less, a whiteness of 75 or more, preferably 80 or more, and a thickness of 50 to 50 ° C.
It is 1000 μm, preferably 75-800 μm. Here, if the coefficient of linear expansion of the base film exceeds 7 × 10 −5 / ° C., the temperature change in the recording / reproducing state is conspicuous, which is not preferable. On the other hand, if the whiteness is less than 75, clear characters and pictures cannot be obtained, which is not preferable for practical use. Regarding the thickness, if the thickness is less than 50 μm, the strength, durability and holding properties are insufficient, while if it is too thick, the workability, handling properties and flexibility are undesirably reduced.
なお、上記基材フィルムは、加工時及び使用時の変形
を抑制するために、その熱収縮率が200℃で2%以下も
のが一層好ましい。In addition, in order to suppress deformation during processing and use, it is more preferable that the base film has a heat shrinkage of 2% or less at 200 ° C.
また、磁性層,接着層等との接着性を考慮して、フィ
ルムの表面にコロナ処理等を施してもよい。Further, the surface of the film may be subjected to a corona treatment or the like in consideration of the adhesiveness with the magnetic layer, the adhesive layer, and the like.
上記基材フィルムを得るためには、シンジオタクチッ
ク構造のスチレン系重合体に、白色無機粒子を添加して
なる組成物をフィルムとするか、あるいはこの組成物
を、別のフィルム表面に積層,コーティングなどでフィ
ルム状に設けるかあるいはこれらの組み合わせによれば
よい。最も好ましくは、白色無機粒子を添加したシンジ
オタクチック構造のスチレン系重合体組成物を、二軸延
伸したものであり、ここで白色無機粒子を添加するに際
しては、重合時の任意の過程で添加する方法,重合後の
ブレンドによる方法,マスターバッチをブレンドする方
法等が有効に適用される。In order to obtain the above-mentioned base film, a composition obtained by adding white inorganic particles to a styrene polymer having a syndiotactic structure is used as a film, or this composition is laminated on another film surface. It may be provided in the form of a film by coating or the like, or a combination thereof. Most preferably, the styrene-based polymer composition having a syndiotactic structure to which white inorganic particles are added is biaxially stretched.When adding the white inorganic particles, the white inorganic particles may be added in any process during the polymerization. A method of blending, a method of blending after polymerization, and a method of blending a master batch are effectively applied.
また、本発明の基材フィルムの素材として使用される
組成物は、シンジオタクチック構造を有するスチレン系
重合体40〜99重量%及び白色無機粒子60〜1重量%から
なるものである。白色無機粒子の配合量が60重量%を超
えると、得られる磁気カードの弾性率は高いものの、も
ろくて使用に耐えない。さらに60重量%を超える組成物
では延伸が困難で延伸による靭性の改良は望めない。ま
た1重量%未満では、磁気カードに所望する白色度を発
現することができない。The composition used as the material of the base film of the present invention comprises 40 to 99% by weight of a styrene polymer having a syndiotactic structure and 60 to 1% by weight of white inorganic particles. When the amount of the white inorganic particles exceeds 60% by weight, the obtained magnetic card has a high elastic modulus, but is brittle and cannot be used. Further, if the composition exceeds 60% by weight, stretching is difficult, and improvement in toughness by stretching cannot be expected. If the content is less than 1% by weight, the desired whiteness of the magnetic card cannot be exhibited.
ところで、上記シンジオタクチック構造を有するスチ
レン系重合体とは、立体化学構造がシンジオタクチック
構造、即ち炭素−炭素結合から形成される主鎖に対して
側鎖であるフェニル基や置換フェニル基が交互に反応方
向に位置する立体構造を有するものであり、そのタクテ
ィシティーは同位体炭素による該磁気共鳴法(13C−NMR
法)により定量される。13C−NMR法により測定されるタ
クティシティーは、連続する複数個の構成単位の存在割
合、例えば2個の場合はダイアッド,3個の場合はトリア
ッド,5個の場合はペンタッドによって示すことができる
が、本発明に言うシンジオタクチック構造を有するスチ
レン系重合体とは、通常はラセミダイアッドで75%以
上、好ましくは85%以上、若しくはラセミペンタッドで
30%以上、好ましくは50%以上のシンジオタクティシテ
ィーを有するポリスチレン,ポリ(アルキルスチレ
ン),ポリ(ハロゲン化スチレン),ポリ(アルコキシ
スチレン),ポリ(ビニル安息香酸エステル),これら
の水素化重合体およびこれらの混合物、あるいはこれら
の構造単位を含む共重合体を指称する。なお、ここでポ
リ(アルキルスチレン)としては、ポリ(メチルスチレ
ン),ポリ(エチルスチレン),ポリ(プロピルスチレ
ン),ポリ(ブチルスチレン,ポリ(フェニルスチレ
ン),ポリ(ビニルナフタレン),ポリ(ビニルスチレ
ン),ポリ(アセナフチレン)などがあり、ポリ(ハロ
ゲン化スチレン)としては、ポリ(クロロスチレン),
ポリ(ブロモスチレン),ポリ(フルオロスチレン)な
どがある。また、ポリ(アルコキシスチレン)として
は、ポリ(メトキシスチレン),ポリ(エトキシスチレ
ン)などがある。これらのうち特に好ましいスチレン系
重合体としては、ポリスチレン,ポリ(p−メチルスチ
レン),ポリ(m−メチルスチレン),ポリ(p−ター
シャリーブチルスチレン),ポリ(p−クロロスチレ
ン),ポリ(m−クロロスチレン),ポリ(p−フルオ
ロスチレン)、またスチレンとp−メチルスチレンとの
共重合体をあげることができる(特開昭62−187708号公
報)。By the way, the styrene-based polymer having a syndiotactic structure is a syndiotactic structure having a stereochemical structure, that is, a phenyl group or a substituted phenyl group which is a side chain with respect to a main chain formed from carbon-carbon bonds. It has a three-dimensional structure alternately positioned in the reaction direction, and its tacticity is determined by the magnetic resonance method ( 13 C-NMR) using isotope carbon.
Method). Tacticity measured by the 13 C-NMR method can be represented by the abundance ratio of a plurality of continuous structural units, for example, a dyad for two, a triad for three, and a pentad for five. However, the styrenic polymer having a syndiotactic structure referred to in the present invention is usually 75% or more, preferably 85% or more in a racemic diad, or a racemic pentad.
Polystyrene, poly (alkylstyrene), poly (halogenated styrene), poly (alkoxystyrene), poly (vinylbenzoate) having a syndiotacticity of 30% or more, preferably 50% or more, A coalescent and a mixture thereof, or a copolymer containing these structural units is referred to. Here, poly (alkylstyrene) includes poly (methylstyrene), poly (ethylstyrene), poly (propylstyrene), poly (butylstyrene, poly (phenylstyrene), poly (vinylnaphthalene), and poly (vinyl). Styrene), poly (acenaphthylene) and the like. Poly (halogenated styrene) includes poly (chlorostyrene),
Examples include poly (bromostyrene) and poly (fluorostyrene). Examples of poly (alkoxystyrene) include poly (methoxystyrene) and poly (ethoxystyrene). Of these, particularly preferred styrene polymers include polystyrene, poly (p-methylstyrene), poly (m-methylstyrene), poly (p-tert-butylstyrene), poly (p-chlorostyrene), and poly (p-chlorostyrene). m-chlorostyrene), poly (p-fluorostyrene), and a copolymer of styrene and p-methylstyrene (JP-A-62-187708).
更に、スチレン系共重合体におけるコモノマーとして
は、上述の如きスチレン系重合体のモノマーのほか、エ
チレン,プロピレン,ブテン,ヘキセン,オクテン等の
オレフィンモノマー、ブタジエン,イソプレン等のジエ
ンモノマー、環状ジエンモノマーやメタクリル酸メチ
ル,無水マレイン酸,アクリロニトリル等の極性ビニル
モノマー等をあげることができる。Further, as the comonomer in the styrenic copolymer, in addition to the styrenic polymer monomer as described above, olefin monomers such as ethylene, propylene, butene, hexene, and octene; diene monomers such as butadiene and isoprene; and cyclic diene monomers. Examples include polar vinyl monomers such as methyl methacrylate, maleic anhydride, and acrylonitrile.
またこのスチレン系重合体は、分子量について特に制
限はないが、重量平均分子量が10,000以上3,000,000以
下のものが好ましく、とりわけ50,000以上1,500,000以
下のものが最適である。ここで重量平均分子量が10,000
未満であると、延伸が充分にできない。さらに、分子量
分布についてもその広狭は制約がなく、様々なものを充
当することが可能であるが、重量平均分子量(Mw)/数
平均分子量(Mn)が1.5以上8以下が好ましい。なお、
この主としてシンジオタクチック構造を有するスチレン
系重合体は、従来のアタクチック構造のスチレン系重合
体に比べて耐熱性が格段に優れている。The molecular weight of the styrenic polymer is not particularly limited, but is preferably 10,000 to 3,000,000, more preferably 50,000 to 1,500,000. Where the weight average molecular weight is 10,000
If it is less than 100%, stretching cannot be performed sufficiently. Further, the molecular weight distribution is not limited in its width and may be any of various types. However, the weight average molecular weight (Mw) / number average molecular weight (Mn) is preferably 1.5 or more and 8 or less. In addition,
The styrene-based polymer mainly having a syndiotactic structure has much better heat resistance than a conventional styrene-based polymer having an atactic structure.
一方、上記スチレン系重合体とともに、基材フィルム
の素材である組成物を形成する白色無機粒子としては、
各種のものがあるが、好ましくは周期律表II a,II b,II
I b,IV a,IV b,V b,VI a,VII aから選ばれた少なくとも
一種以上の元素からなる化合物、例えば、酸化マグネシ
ウム,酸化アルミニウム,酸化ケイ素,酸化チタン,炭
酸カルシウム,硫酸バリウム,炭酸マグネシウム,ケイ
酸カルシウム,タルクなど、あるいはこれ等の混合物が
挙げられる。白色無機粒子の平均粒径は特に限定されな
いが、0.03μ〜5μが好ましい。配合量は前述した通り
であるが、特に単層フィルムの場合は1〜40重量%が好
ましく、より好ましくは3〜30重量%である。また積層
やコーティングの場合は5〜60重量%が好ましく、より
好ましくは8〜55重量%である。ただし、スチレン系重
合体がp−メチルスチレンホモポリマーの如く延伸時に
白化し、白色フィルムが得られるものは添加量は少量で
よく、1〜20重量%で充分である。On the other hand, together with the styrene-based polymer, as the white inorganic particles forming the composition that is the material of the base film,
Although there are various types, preferably, the periodic table IIa, IIb, II
A compound comprising at least one element selected from the group consisting of Ib, IVa, IVb, Vb, VIa and VIIa, for example, magnesium oxide, aluminum oxide, silicon oxide, titanium oxide, calcium carbonate, barium sulfate, Examples include magnesium carbonate, calcium silicate, talc, and the like, and mixtures thereof. The average particle size of the white inorganic particles is not particularly limited, but is preferably from 0.03 μm to 5 μm. The compounding amount is as described above, but in particular, in the case of a single-layer film, it is preferably 1 to 40% by weight, more preferably 3 to 30% by weight. In the case of lamination or coating, the content is preferably 5 to 60% by weight, more preferably 8 to 55% by weight. However, if the styrene-based polymer is whitened during stretching like a p-methylstyrene homopolymer and a white film is obtained, the addition amount may be small and 1 to 20% by weight is sufficient.
本発明の基材フィルムを構成する組成物の樹脂成分
は、基本的には上述のシンジオタクチック構造を有する
スチレン系重合体であるが、さらに成形性,力学物性,
表面性等を考慮して、本発明の目的を阻害しない範囲
で、他の樹脂などを適宜配合することもできる。The resin component of the composition constituting the base film of the present invention is basically a styrene-based polymer having the above-mentioned syndiotactic structure.
In consideration of surface properties and the like, other resins and the like can be appropriately compounded as long as the object of the present invention is not impaired.
ここで他の樹脂としては、各種のものがあるが、例え
ば、アタクチック構造のスチレン系重合体,アイソタク
チック構造のスチレン系重合体,ポリフェニレンエーテ
ル等は、前述のシンジオタクチック構造のスチレン系重
合体と相溶になりやすく、延伸用予備成形体を作成する
ときの結晶化の制御に有効で、その後の延伸性が向上
し、延伸条件の制御が容易で、且つ力学物性に優れたフ
ィルムを得ることができる。このうち、アタクチック構
造および/またはアイソタクチック構造のスチレン系重
合体を含有させる場合、シンジオタクチック構造のスチ
レン系重合体と同様のモノマーからなるものが好まし
い。また、これら相溶性樹脂成分の含有割合は70〜1重
量%、特に好ましくは50〜2重量%とすればよい。ここ
で相溶性樹脂成分の含有割合が70重量%を超えると、シ
ンジオタクチック構造のスチレン系重合体の長所である
耐熱性等が損なわれるため好ましくない。また、非相溶
性樹脂としては、例えば、ポリエチレン,ポリプロピレ
ン,ポリブテン,ポリペンテン等のポリオレフィン、ポ
リエチレンテレフタレート,ポリブチレンテレフタレー
ト,ホリエチレンナフタレート等のポリエステル、ナイ
ロン−6やナイロン6,6等のポリアミド、ポリフェニレ
ンスルフィド等のポリチオエーテル、ポリカーボネー
ト,ポリアリレート,ポリスルホン,ポリエーテルエー
テルケトン,ポリエーテルスルホン,ポリイミド,テフ
ロン等のハロゲン化ビニル系重合体、ポリメタクリル酸
メチル等のアクリル系重合体、ポリビニルアルコール
等、上記相溶性の樹脂以外はすべて相当し、さらに、上
記相溶性の樹脂を含む架橋樹脂が挙げられる。これらの
樹脂は、本発明のシンジオタクチック構造のスチレン系
重合体と非相溶であるため、少量含有する場合、シンジ
オタクチック構造のスチレン系重合体中に島のように分
散させることができ、延伸後に程良い光沢を与えたり、
表面のすべり性を改良するのに有効である。これら非相
溶性樹脂成分を含有割合は、光沢を目的とする場合は50
〜2重量%、表面性の制御を目的とする場合、0.001〜
5重量%が好ましい。また、製品として使用する温度が
高い場合は、比較的耐熱性のある非相溶性樹脂を用いる
ことが好ましい。ここで非相溶性樹脂を用いると、白色
無機粒子の添加量を比較的少量に抑えることができる。Here, there are various resins as the other resin. For example, the styrene-based polymer having an atactic structure, the styrene-based polymer having an isotactic structure, and polyphenylene ether are the styrene-based polymers having a syndiotactic structure. It is easy to be compatible with coalescence, is effective in controlling crystallization when preparing a preform for stretching, improves stretchability thereafter, easily controls stretching conditions, and provides a film with excellent mechanical properties. Obtainable. Among them, when a styrenic polymer having an atactic structure and / or an isotactic structure is contained, a styrene-based polymer having a syndiotactic structure is preferably used. The content ratio of these compatible resin components may be 70 to 1% by weight, particularly preferably 50 to 2% by weight. Here, when the content ratio of the compatible resin component is more than 70% by weight, heat resistance and the like, which are advantages of the styrene-based polymer having a syndiotactic structure, are not preferable. Examples of the incompatible resin include polyolefins such as polyethylene, polypropylene, polybutene, and polypentene; polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polyamides such as nylon-6 and nylon 6,6; and polyphenylene. Polythioethers such as sulfide, polycarbonate, polyarylate, polysulfone, polyetheretherketone, polyethersulfone, polyimides, halogenated vinyl polymers such as Teflon, acrylic polymers such as polymethylmethacrylate, polyvinyl alcohol, etc. All correspond except for the compatible resin, and further include a crosslinked resin containing the above compatible resin. Since these resins are incompatible with the syndiotactic-structured styrene-based polymer of the present invention, if they are contained in small amounts, they can be dispersed like islands in the syndiotactic-structured styrene-based polymer. , Give a good gloss after stretching,
It is effective for improving the surface slip property. The content ratio of these incompatible resin components is 50 for the purpose of gloss.
~ 2% by weight, 0.001 ~
5% by weight is preferred. When the temperature used as a product is high, it is preferable to use a relatively heat-resistant incompatible resin. Here, when the incompatible resin is used, the addition amount of the white inorganic particles can be suppressed to a relatively small amount.
また、本発明ではさらに上記組成物に、必要に応じて
安定剤,酸化防止剤,滑剤,増白剤,紫外線吸収剤,マ
ット化剤,その他種々の添加剤を加えることもできる。Further, in the present invention, a stabilizer, an antioxidant, a lubricant, a whitening agent, an ultraviolet absorber, a matting agent, and other various additives can be added to the composition as required.
本発明の磁気カードの基材フィルムを成形するには、
前述した如き方法によればよいが、この際に行う加熱溶
融から熱固定までの操作を具体的に説明すれば、次の通
りである。To mold the base film of the magnetic card of the present invention,
According to the method as described above, the operation from the heat melting to the heat fixing performed at this time is specifically described as follows.
まず、上述の如き成形素材を通常は押出成形(あるい
は共押出成形)して、延伸用予備成形体(フィルム,シ
ートまたはチューブ)とする。この成形にあっては、上
記成形素材の加熱溶融したものを押出成形機にて所定形
状に成形するのが一般的であるが、成形素材を加熱溶融
させずに、軟化した状態を成形してもよい。ここで用い
る押出成形機は、一軸押出成形機,二軸押出成形機のい
ずれでもよく、またベント付き,ベント無しのいずれで
もよいが、一軸の直列タンデム型が好ましい。なお、押
圧機には適当なメッシュを使用すれば、夾雑物や異物を
除去することができる。特に平滑面を有する延伸フィル
ムを作成する場合にはメッシュは、100メッシュ以上が
好ましく、とりわけ400メッシュ以上が最適である。こ
こでこれらのメッシュを用いる際には、メッシュそのも
のの耐圧,強度を考慮して、上記以下の番手を前後に入
れても良い。またメッシュの形状は、平板状,円筒状等
適当に選定して使用することができる。First, a molding material as described above is usually extruded (or co-extruded) to obtain a preform for stretching (film, sheet or tube). In this molding, it is common to heat-melt the above-mentioned molding material into a predetermined shape using an extruder, but without heating and melting the molding material, molding the softened state. Is also good. The extruder used here may be either a single-screw extruder or a twin-screw extruder, and may or may not have a vent, but a single-screw in-line tandem type is preferred. In addition, if an appropriate mesh is used for the pressing machine, impurities and foreign substances can be removed. In particular, when preparing a stretched film having a smooth surface, the mesh is preferably 100 mesh or more, and most preferably 400 mesh or more. Here, when these meshes are used, the following counts may be added before and after considering the pressure resistance and strength of the mesh itself. The shape of the mesh can be appropriately selected and used, such as a flat plate shape or a cylindrical shape.
またここで押出条件は、特に制限はなく、様々な状況
に応じて適宜選定すればよいが、好ましくは温度を形成
素材の融点〜分解温度より50℃高い温度の範囲で選定
し、剪断応力を5×106dyne/cm2以下とする。用いるダ
イはT−ダイ,円環ダイ等をあげることができる。The extrusion conditions are not particularly limited and may be appropriately selected according to various situations.Preferably, the temperature is selected in a range of from the melting point of the forming material to a temperature 50 ° C. higher than the decomposition temperature, and the shear stress is adjusted. 5 × 10 6 dyne / cm 2 or less. The die to be used includes a T-die, a ring die and the like.
上記押出成形後、得られた延伸用予備成形体を冷却固
化する。この際の冷媒は、気体,液体,金属ロール等各
種のものを使用することができる。金属ロール等を用い
る場合、エアナイフ,エアチャンバー,タッチロール,
静電印加等の方法によると厚みムラや波うち防止に効果
的である。After the extrusion molding, the obtained preform for stretching is cooled and solidified. Various refrigerants such as gas, liquid, and metal roll can be used as the refrigerant at this time. When using metal rolls, air knives, air chambers, touch rolls,
According to the method of applying static electricity or the like, it is effective for preventing thickness unevenness and waviness.
冷却固化の温度は、通常は0℃〜延伸用予備成形体の
ガラス転移温度より30℃高い温度の範囲、好ましくは20
℃〜ガラス転移温度の範囲である。また冷却速度は200
〜3℃/秒の範囲で適宜選択する。The temperature of cooling and solidification is usually in the range of 0 ° C. to a temperature 30 ° C. higher than the glass transition temperature of the preform for stretching, preferably 20 ° C.
C to the glass transition temperature. The cooling rate is 200
33 ° C./sec.
次に、この冷却,固化した予備成形体を一軸あるいは
二軸に延伸する。二軸延伸の場合は縦方向及び横方向に
同時に延伸してもよいが、任意の順序で逐次延伸しても
よい。また延伸は一段で行ってもよく、多段で行っても
よい。Next, the cooled and solidified preform is uniaxially or biaxially stretched. In the case of biaxial stretching, the film may be stretched simultaneously in the machine direction and the transverse direction, but may be sequentially stretched in any order. The stretching may be performed in one step or may be performed in multiple steps.
ここで延伸方法としては、テンターによる方法,ロー
ル間で延伸する方法,気体圧力を利用してバブリングに
よる方法,圧延による方法など様々であり、これらを適
当に選定あるいは組み合わせて適用すればよい。延伸温
度は、一般には予備成形体のガラス転移温度と融点の間
で設定すればよい。また延伸速度は、通常は1×10〜1
×105%/分、好ましくは1×103〜1×105%/分であ
る。上述の如き条件で延伸して得られた延伸フィルム
に、さらに高温時に寸法安定性,耐熱性,フィルム面内
の強度バランスが要求される場合などには、さらに熱固
定を行うことが好ましい。熱固定は、通常行われている
方法で行うことができるが、この延伸フィルムを緊張状
態,弛緩状態あるいは制限収縮状態の下で、該フィルム
のガラス転移温度〜融点、好ましくは融点より100℃低
い温度〜融点直前の温度範囲にて、0.5〜120秒間保持す
ることによって行えばよい。なお、この熱固定は、上記
範囲内で条件を変えて二回以上行うことも可能である。
また、この熱固定はアルゴンガス,窒素ガスなどの不活
性ガス雰囲気下で行っても良い。Here, there are various stretching methods, such as a tenter method, a method of stretching between rolls, a method of bubbling using gas pressure, and a method of rolling, and these may be appropriately selected or combined and applied. The stretching temperature may generally be set between the glass transition temperature and the melting point of the preform. The stretching speed is usually 1 × 10 to 1
× 10 5 % / min, preferably 1 × 10 3 to 1 × 10 5 % / min. When a stretched film obtained by stretching under the above-mentioned conditions requires dimensional stability, heat resistance, and strength balance in the film plane at higher temperatures, it is preferable to further heat-fix. The heat setting can be carried out by a commonly used method. However, the stretched film is stretched, relaxed or restricted in a contracted state, and has a glass transition temperature to a melting point of the film, preferably 100 ° C. lower than the melting point. What is necessary is just to hold | maintain in the temperature range just before a melting point from the temperature for 0.5 to 120 seconds. The heat setting can be performed twice or more with the conditions changed within the above range.
The heat fixing may be performed in an atmosphere of an inert gas such as an argon gas or a nitrogen gas.
また、さらに必要に応じて、フィルム中に無機粒子や
有機粒子等の添加,粗面化フィルムの積層,サンドマッ
ド処理,コーティングマット処理,エンボス加工などの
操作を適宜適用してもよい。Further, if necessary, operations such as addition of inorganic particles and organic particles to the film, lamination of a roughened film, sand mud treatment, coating mat treatment and embossing may be appropriately applied.
このようにして得られる本発明の基材フィルムは、線
膨張係数7×10-5/℃以下,白色度80以上,厚さ50〜100
0μmのものとなる。The thus obtained base film of the present invention has a linear expansion coefficient of 7 × 10 −5 / ° C. or less, a whiteness of 80 or more, and a thickness of 50 to 100.
It is 0 μm.
本発明の磁気カードは、上記基材フィルムに少なくと
も一層の磁性層を形成してなるが、アンダーコート層あ
るいはトップコート層を形成することもできる。これら
の各層は、基材フィルムを中心に両面あるいは片面の全
部あるいは一部に形成される。The magnetic card of the present invention has at least one magnetic layer formed on the base film, but may have an undercoat layer or a topcoat layer. Each of these layers is formed on all or a part of both surfaces or one surface with the base film as the center.
また、磁性層の素材となる磁性体は、各種のものがあ
り、例えばCo,Co−O,Co−Cr,Co−V,Co−Ni,Co−P,Co−
γFe2O3,Co−Ni−P,Co−Ni−N,Co−Ni−W,Co−Ni−Pt,C
oNi(Cr)/Cr,Fe,Fe−O,Fe−Ag,γFe2O3,Fe−Co,Ni,CrO
2などを列挙することができる。Further, there are various kinds of magnetic materials as a material of the magnetic layer, for example, Co, Co-O, Co-Cr, Co-V, Co-Ni, Co-P, Co-.
γFe 2 O 3 , Co-Ni-P, Co-Ni-N, Co-Ni-W, Co-Ni-Pt, C
oNi (Cr) / Cr, Fe, Fe-O, Fe-Ag, γFe 2 O 3 , Fe-Co, Ni, CrO
2 and the like can be listed.
この磁性体を用いて磁性層を基材フィルムに形成する
には、塗布,蒸着,スパッタリング,メッキ等の各種の
方法によればよく、その操作条件等は常法にしたがっ
て、適宜選択すればよい。In order to form a magnetic layer on a substrate film using this magnetic material, various methods such as coating, vapor deposition, sputtering, and plating may be used, and operating conditions and the like may be appropriately selected according to a conventional method. .
なお、磁性層の厚みは特に制限はないが、一般には0.
01〜10μmであり、特に塗布の場合は0.5〜10μm、蒸
着やスパッタリングの場合は0.01〜1μm、メッキの場
合は0.1〜5μmである。The thickness of the magnetic layer is not particularly limited, but is generally 0.
The thickness is from 0.01 to 10 μm, especially from 0.5 to 10 μm for coating, from 0.01 to 1 μm for vapor deposition or sputtering, and from 0.1 to 5 μm for plating.
なお、塗布にあたって使用するバインダー用の樹脂と
しては、例えば塩化ビニル−酢酸ビニル共重合体,塩化
ビニル−酢酸ビニル部分ケン化共重合体,塩化ビニル−
塩化ビニリデン共重合体,塩化ビニル−アクリロニトリ
ル,ビニルブチラール,ビニルホルマール等のビニル共
重合体、ニトロセルロース,セルロースアセトブチレー
ト等の繊維素系、飽和ポリエステル,ポリウレタンポリ
アミド、エポキシ等の縮重合系、ブタジエン・アクリロ
ニトリル共重合体の合成ゴム系、ポリホスファゼン等の
無機高分子系があげられ、イソシアネート化合物等の架
橋剤を用いてもよい。Examples of the resin for the binder used in the coating include a vinyl chloride-vinyl acetate copolymer, a vinyl chloride-vinyl acetate partially saponified copolymer, and a vinyl chloride-vinyl acetate copolymer.
Vinylidene chloride copolymer, vinyl copolymers such as vinyl chloride-acrylonitrile, vinyl butyral, and vinyl formal; fibrous systems such as nitrocellulose and cellulose acetobutyrate; polycondensation systems such as saturated polyester, polyurethane polyamide and epoxy; butadiene -Synthetic rubber based on acrylonitrile copolymer, inorganic polymer based such as polyphosphazene, etc., and a crosslinking agent such as isocyanate compound may be used.
このようにして得られた本発明の磁気カードは、磁気
ヘッド摩耗防止等のため表面を研磨しても良い。The surface of the magnetic card of the present invention thus obtained may be polished to prevent wear of the magnetic head.
次に本発明を実施例に基いてさらに詳しく説明する。 Next, the present invention will be described in more detail based on examples.
参考例1 (1)トリメチルアルミニウムと水との接触生成物の調
製 アルゴン置換した内容積500mlのガラス製容器に、硫
酸銅5水塩(CuSO4・5H2O)17.8g(71ミリモル),トル
エン200ml及びトリメチルアルミニウム24ml(250ミリモ
ル)を入れ、40℃で8時間反応させた。その後、固体部
分を除去して得られた溶液から、更に、トルエンを室温
下で減圧留去して接触生成物6.7gを得た。この接触生成
物の分子量を凝固点降下法によって測定したところ610
であった。Glass container of Reference Example 1 (1) trimethylaluminum with an inner volume of 500ml was prepared argon substitution of contact product of water, copper sulfate pentahydrate (CuSO 4 · 5H 2 O) 17.8g (71 mmol), toluene 200 ml and trimethylaluminum 24 ml (250 mmol) were added and reacted at 40 ° C. for 8 hours. Thereafter, toluene was further distilled off from the solution obtained by removing the solid portion under reduced pressure at room temperature to obtain 6.7 g of a contact product. When the molecular weight of this contact product was measured by freezing point depression method, it was 610
Met.
(2)スチレン系重合体の製造 内容積2の反応容器に、精製スチレン1,上記
(1)で得られた接触生成物をアルミニウム原子として
5ミリモル,トリイソブチルアルミニウムを5ミリモル
およびペンタメチルシクロペンタジエニルチタントリメ
トキシド0.025ミリモルを入れて90℃で5時間重合反応
を行った。反応終了後、生成物を水酸化ナトリウムのメ
タノール溶液で触媒成分を分解後、メタノールで繰り返
し洗浄後、乾燥して重合体308gを得た。1,2,4−トリク
ロベンゼンを溶媒として、135℃でゲルパーミエーショ
ンクロマトグラフィーにて測定したところ、この重合体
の重量平均分子量は389,000、重量平均分子量/数平均
分子量は、2,64であった。また、融点及び13C−NMR測定
によりこの重合体はシンジオタクチック構造のポリスチ
レンであることを確認した。(2) Production of styrene-based polymer In a reaction vessel having an inner volume of 2 were placed purified styrene 1, 5 mmol of the contact product obtained in (1) above as an aluminum atom, 5 mmol of triisobutylaluminum, and pentamethylcyclopentane. 0.025 mmol of dienyltitanium trimethoxide was added and a polymerization reaction was carried out at 90 ° C. for 5 hours. After the completion of the reaction, the product was decomposed with a methanol solution of sodium hydroxide to decompose the catalyst component, washed repeatedly with methanol, and dried to obtain 308 g of a polymer. When measured by gel permeation chromatography at 135 ° C. using 1,2,4-trichlorobenzene as a solvent, the weight average molecular weight of this polymer was 389,000, and the weight average molecular weight / number average molecular weight was 2,64. Was. Further, the polymer was confirmed to be a polystyrene having a syndiotactic structure by melting point and 13 C-NMR measurements.
実施例1 参考例1で得られたスチレン系重合体を充分に減圧乾
燥したもの100重量部に対して、蛍光増白剤(イースト
マン社製,OB−1)0.03重量部および平均粒径0.9μmの
微粒子状炭酸カルシウム(天然品,ステアリン酸表面処
理)12重量部をスーパーミキサーで1分間混合し、二軸
押出機の先端にキャピラリーダイを設けた装置で押出
し、カットしてペレットとした。Example 1 0.03 parts by weight of an optical brightener (OB-1 manufactured by Eastman Co.) and an average particle diameter of 0.9 were added to 100 parts by weight of the styrene-based polymer obtained in Reference Example 1 which was sufficiently dried under reduced pressure. 12 parts by weight of micronized particulate calcium carbonate (natural product, stearic acid surface treatment) was mixed for 1 minute with a super mixer, extruded with a device provided with a capillary die at the tip of a twin screw extruder, and cut into pellets.
このペレットを120℃の乾燥熱風下で撹拌した。この
ペレットを一軸押出機の先端にT−ダイを設けた装置
で、320℃で押出した。押出した溶融シートをタッチロ
ールタイプの冷却金属ロールを通して巻き取った。この
金属ロールの温度は70℃で平均冷却速度は約50℃/秒で
あった。得られた厚さ1000μmの予備成形体を115℃に
加熱しながら周速の異なるニップロール間で3倍に延伸
した。この時の延伸速度は6000%/分であった。続いて
このフィルムをテンターを用いて120℃,3000%/分で3
倍に延伸し、引き続き緊張下で250℃,20秒間熱処理し
た。The pellet was stirred under dry hot air at 120 ° C. These pellets were extruded at 320 ° C. using a device provided with a T-die at the tip of a single screw extruder. The extruded molten sheet was wound up through a touch roll type cooling metal roll. The temperature of the metal roll was 70 ° C and the average cooling rate was about 50 ° C / sec. The obtained preformed body having a thickness of 1000 μm was stretched three times between nip rolls having different peripheral speeds while being heated to 115 ° C. The stretching speed at this time was 6000% / min. Subsequently, the film was cured using a tenter at 120 ° C. and 3000% / min.
The film was stretched twice and subsequently heat-treated under tension at 250 ° C. for 20 seconds.
このフィルムの厚さは120μmであり、JIS L−1074に
従って測定した白色度は85であった。またサーマルメカ
ニカルアナリシスにより測定した0〜90の線膨張係数
は、5×10-5/℃で、200℃,30分後の熱収縮率は0.5%で
あった。また弾性率は45000kg/cm2であった。The thickness of this film was 120 μm, and the whiteness measured according to JIS L-1074 was 85. The coefficient of linear expansion from 0 to 90 measured by thermal mechanical analysis was 5 × 10 −5 / ° C., and the thermal shrinkage after 30 minutes at 200 ° C. was 0.5%. The elastic modulus was 45000 kg / cm 2 .
この様にして得られた基材フィルムの片面に、コロナ
放電処理を施し、磁性塗料を塗布した。なおこの磁性塗
料の組成は、γ−Fe3O3磁性粉末45重量部,塩化ビニル
−酢酸ビニル共重合体(U.C.C.社製,VAGH)17重量部,
アクリロニトリル−ブタジエン共重合体(日本ゼオン社
製,N1432J)3.5重量部,ポリイソシアネート(日本ポリ
ウレタン社製,コロネートL)1.5重量部,メチルイソ
ブチルケトン50重量部,トルエン50重量部,カーボンブ
ラック4重量部である。乾燥後の磁性層の厚みは3μm
であった。One surface of the base film thus obtained was subjected to a corona discharge treatment, and a magnetic paint was applied. The composition of this magnetic paint was 45 parts by weight of γ-Fe 3 O 3 magnetic powder, 17 parts by weight of vinyl chloride-vinyl acetate copolymer (VAGH, manufactured by UCC),
3.5 parts by weight of acrylonitrile-butadiene copolymer (N1432J, manufactured by Zeon Corporation), 1.5 parts by weight of polyisocyanate (Coronate L, manufactured by Nippon Polyurethanes), 50 parts by weight of methyl isobutyl ketone, 50 parts by weight of toluene, 4 parts by weight of carbon black It is. The thickness of the dried magnetic layer is 3 μm
Met.
この磁性層の反対面に絵柄を印刷し、情報の入出力を
試みたところ良好であった。また。表面のギラツキがな
く、印刷面は鮮明で好ましい外観を呈していた。さらに
カードの腰(弾力性)は充分で、0〜100℃の温度変化
においても、その外観,性能に影響はなかった。A pattern was printed on the opposite surface of the magnetic layer, and input and output of information were tried. Also. There was no glare on the surface, and the printed surface had a clear and favorable appearance. Furthermore, the card had sufficient waist (elasticity), and even a temperature change of 0 to 100 ° C. did not affect its appearance and performance.
実施例2 白色無機粒子として平均粒径0.2μmの酸化チタン
(タイペークA−100)を42重量部用いたこと以外は、
実施例1と同様にして磁気カードを得た。このカードの
弾性率は、52000kg/cm2であった。Example 2 Except that 42 parts by weight of titanium oxide (Taipek A-100) having an average particle size of 0.2 μm was used as white inorganic particles,
A magnetic card was obtained in the same manner as in Example 1. The elastic modulus of this card was 52000 kg / cm 2 .
比較例1 白色無機粒子を用いなかったことの他は、実施例1と
同様にした。得られた磁気カードは性能上、実施例1と
同様であったが、すべり性が悪く、使用を繰り返すと一
部印刷はがれが起こった。また外観はギラツキがあり、
手触りも悪くベタつき、好ましい外観ではなかった。Comparative Example 1 The procedure of Example 1 was repeated except that the white inorganic particles were not used. The performance of the obtained magnetic card was the same as that of Example 1, but the slip property was poor, and printing was partially peeled off after repeated use. In addition, the appearance has glare,
The touch was poor and sticky, and the appearance was not favorable.
比較例2 白色無機粒子を70重量%含有させて実施例1と同様に
試みところ、延伸中に破断して、基材フィルムが得られ
なかった。Comparative Example 2 An attempt was made in the same manner as in Example 1 except that 70% by weight of white inorganic particles was contained, but the film was broken during stretching, and no base film was obtained.
比較例3 TiO2で30重量%含有した厚さ100μmの塩化ビニルフ
ィルムを得、このフィルムを用いて実施例1と同様にし
た。得られた磁気カードは耐熱性,寸法安定性が不充分
であった。Comparative Example 3 A 100 μm thick vinyl chloride film containing 30% by weight of TiO 2 was obtained, and this film was used in the same manner as in Example 1. The obtained magnetic card had insufficient heat resistance and dimensional stability.
比較例4 35℃のo−クロロフェノール容液で測定した固有粘度
0.61のポリエチレンテレフタレートを用いたこと以外
は、実施例1と同様にした。得られた磁気カードは耐熱
性,外観が不良であり、特に表面にギラツキがあり、美
観上好ましくなかった。またこのカードの弾性率は4000
0kg/cm2であった。Comparative Example 4 Intrinsic viscosity measured with o-chlorophenol solution at 35 ° C
Example 1 was repeated except that 0.61 polyethylene terephthalate was used. The obtained magnetic card had poor heat resistance and poor appearance, and particularly had glare on the surface, which was not preferable in terms of aesthetics. The elastic modulus of this card is 4000
It was 0 kg / cm 2 .
以上まとめて表に示す。 The above is summarized in the table.
〔発明の効果〕 叙上の如く、本発明の磁気カードは必要な白色度を有
するとともに、熱寸法安定性及び外観にすぐれ、また腰
の強いカードであり、長期の使用に耐えるものである。 [Effects of the Invention] As described above, the magnetic card of the present invention has necessary whiteness, is excellent in thermal dimensional stability and appearance, and is strong, and can withstand long-term use.
したがって、本発明の磁気カードは、プリペイドカー
ド,キップ,カードキー等各種各様の磁気カードとして
有効に利用される。Therefore, the magnetic card of the present invention can be effectively used as various kinds of magnetic cards such as a prepaid card, a ticket, and a card key.
フロントページの続き (58)調査した分野(Int.Cl.6,DB名) G11B 5/704 G11B 5/80 B42D 15/10Continuation of the front page (58) Field surveyed (Int.Cl. 6 , DB name) G11B 5/704 G11B 5/80 B42D 15/10
Claims (2)
系重合体40〜99重量%及び白色無機粒子60〜1重量%か
らなる組成物のフィルムあるいは該フィルムを含む積層
フィルムであって、線膨張係数7×10-5/℃以下,白色
度75以上,厚さ50〜1000μmである基材フィルムの少な
くとも片面に磁性層を有する磁気カード。1. A film of a composition comprising 40 to 99% by weight of a styrenic polymer having a syndiotactic structure and 60 to 1% by weight of white inorganic particles, or a laminated film containing the film, having a coefficient of linear expansion of 7 A magnetic card having a magnetic layer on at least one side of a base film having a density of not more than × 10 -5 / ° C, a whiteness of not less than 75 and a thickness of 50 to 1000 µm.
磁気カード。2. The magnetic card according to claim 1, wherein the film is a stretched film.
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1231510A JP2840318B2 (en) | 1989-09-08 | 1989-09-08 | Magnetic card |
EP95109896A EP0682340B1 (en) | 1989-08-31 | 1990-08-30 | Magnetic recording medium |
DE69032926T DE69032926T2 (en) | 1989-08-31 | 1990-08-30 | Magnetic recording medium |
PCT/JP1990/001104 WO1991003810A1 (en) | 1989-08-31 | 1990-08-30 | Magnetic recording medium |
US07/651,262 US5374462A (en) | 1989-08-31 | 1990-08-30 | Magnetic recording medium |
EP19900912858 EP0440817B1 (en) | 1989-08-31 | 1990-08-30 | Magnetic recording medium |
DE69027763T DE69027763T2 (en) | 1989-08-31 | 1990-08-30 | MAGNETIC RECORDING MEDIUM |
CA002039161A CA2039161A1 (en) | 1989-08-31 | 1990-08-30 | Magnetic recording medium |
AT90912858T ATE140334T1 (en) | 1989-08-31 | 1990-08-30 | MAGNETIC RECORDING MEDIUM |
AT95109896T ATE176354T1 (en) | 1989-08-31 | 1990-08-30 | MAGNETIC RECORDING MEDIUM |
KR1019910700426A KR960005449B1 (en) | 1989-08-31 | 1991-04-29 | Magnetic recording medium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1231510A JP2840318B2 (en) | 1989-09-08 | 1989-09-08 | Magnetic card |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0395723A JPH0395723A (en) | 1991-04-22 |
JP2840318B2 true JP2840318B2 (en) | 1998-12-24 |
Family
ID=16924620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1231510A Expired - Fee Related JP2840318B2 (en) | 1989-08-31 | 1989-09-08 | Magnetic card |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2840318B2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0691750A (en) * | 1992-09-11 | 1994-04-05 | Toyobo Co Ltd | Syndiotactic polystyrene biaxially drawn film |
JPH0699485A (en) * | 1992-09-21 | 1994-04-12 | Toyobo Co Ltd | Syndiotactic polystyrenic biaxially stretched film |
JPH06100711A (en) * | 1992-09-21 | 1994-04-12 | Toyobo Co Ltd | Syndiotactic polystyrenic biaxially oriented film |
JPH06107812A (en) * | 1992-09-28 | 1994-04-19 | Toyobo Co Ltd | Biaxially oriented syndiotactic polystyrene film |
JPH06107813A (en) * | 1992-09-28 | 1994-04-19 | Toyobo Co Ltd | Biaxially oriented syndiotactic polystyrene film |
JPH06106616A (en) * | 1992-09-28 | 1994-04-19 | Toyobo Co Ltd | Syndiotactic polystyrenr biaxially oriented film |
JPH0724911A (en) * | 1993-07-08 | 1995-01-27 | Toyobo Co Ltd | Syndyotactic polystyrene film |
-
1989
- 1989-09-08 JP JP1231510A patent/JP2840318B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0395723A (en) | 1991-04-22 |
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Legal Events
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LAPS | Cancellation because of no payment of annual fees |