JP2811884B2 - Integrated circuit cooling device - Google Patents
Integrated circuit cooling deviceInfo
- Publication number
- JP2811884B2 JP2811884B2 JP2072455A JP7245590A JP2811884B2 JP 2811884 B2 JP2811884 B2 JP 2811884B2 JP 2072455 A JP2072455 A JP 2072455A JP 7245590 A JP7245590 A JP 7245590A JP 2811884 B2 JP2811884 B2 JP 2811884B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- cooling
- cooling device
- conductive compound
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、情報処理装置等の電子機器に使用される集
積回路の冷却装置に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for an integrated circuit used in an electronic device such as an information processing device.
最近の電子回路は増々高密度化する傾向にあり、それ
に伴って消費する電力も大きくなり、従って素子の性能
を十分に発揮させるには素子を十分に冷却する必要があ
る。Recent electronic circuits tend to have higher densities, and accordingly consume more power. Therefore, it is necessary to sufficiently cool the elements in order to achieve the full performance of the elements.
その一例として、アイ・ビー・エム，テクニカル デ
ィスクロージャ ブルテン（IBM Technical Disclosure
Bulletin）に報告された「サーマル コンパウンド
フォア セミコンダクタ パッケージ」（THERMAL COM
POUND FOR SEMICONDUCTOR PACKAGES）（vol.25,No.7
B,December 1982,PP.4035〜4036）がある。第２図はこ
の論文に発表された冷却装置の断面図である。回路基板
13上に複数の集積回路14が実装され、集積回路14を冷却
するために冷却用フィン16が設置されている。集積回路
14と冷却用フィン16とは各部品の公差のために約200μ
ｍの間隙が生じており、この間隙は回路基板13の反り等
によって一定になっていない。For example, IBM Technical Disclosure
Bulletin) "Thermal Compound
Fore Semiconductor Package "(THERMAL COM
POUND FOR SEMICONDUCTOR PACKAGES) (vol.25, No.7
B, December 1982, PP. 4035-4036). FIG. 2 is a sectional view of the cooling device disclosed in this paper. Circuit board
A plurality of integrated circuits 14 are mounted on 13, and cooling fins 16 are provided for cooling the integrated circuits 14. Integrated circuit
14 and cooling fin 16 are about 200μ due to tolerance of each part
m, which is not constant due to the warpage of the circuit board 13 or the like.
そこで集積回路14と冷却用フィン16との間隙に、粒径
１〜２μｍの窒化ホウ素粒子が50〜60重量％、鉱油40〜
60重量％から成る熱伝導性のコンパウンド15を充填する
ことによって、間隙のばらつきを吸収し、熱抵抗値を低
くすることを可能にしている。Therefore, in the gap between the integrated circuit 14 and the cooling fin 16, boron nitride particles having a particle size of 1 to 2 μm are 50 to 60% by weight, mineral oil 40 to 60% by weight.
By filling the thermally conductive compound 15 of 60% by weight, it is possible to absorb the variation in the gap and to lower the thermal resistance value.
さらに集積回路14の修正、あるいは故障時には冷却用
フィン16を取はずし、集積回路14の修正・修理が容易に
行えるようになっている。修復前後の集積回路14と冷却
用フィン16との間隙の変化も熱伝導性コンパウンド15が
吸収するので、修復後の装置の信頼性は保証される。Further, when the integrated circuit 14 is repaired or a failure occurs, the cooling fin 16 is removed so that the integrated circuit 14 can be easily repaired and repaired. The change in the gap between the integrated circuit 14 and the cooling fin 16 before and after the repair is absorbed by the heat conductive compound 15, so that the reliability of the device after the repair is guaranteed.
しかしながら、この熱伝導性コンパウンド15はペース
ト状であるため流動性があり、また集積回路を集合した
電子回路装置は、高密度実装のために配線基板が垂直と
なる状態で実装されているため、熱伝導性コンパウンド
15が集積回路14の上面から移動・落下して熱抵抗が大き
くなるという問題がある。さらに、集積回路14の動作時
・非動作時の温度差による部品の膨張・収縮の反復によ
っても、熱伝導性コンパウンド15が集積回路14の上面よ
り移動・落下してしまうという欠点がある。However, since the heat conductive compound 15 is in a paste state, it has fluidity, and since the electronic circuit device in which the integrated circuits are assembled is mounted in a state where the wiring board is vertical for high-density mounting, Thermal conductive compound
15 moves and falls from the upper surface of the integrated circuit 14 to increase the thermal resistance. Further, there is a drawback that the thermal conductive compound 15 moves and drops from the upper surface of the integrated circuit 14 due to repetition of expansion and contraction of components due to a temperature difference between the operation and the non-operation of the integrated circuit 14.
本発明の集積回路の冷却装置は、複数個の集積回路を
面上に搭載した回路基板と、この回路基板を保持する枠
と、前記集積回路の全ての表面に亘って一定の微小間隙
を有するように加工された冷却部材とを有し、この冷却
部材と前記集積回路との微小間隙に熱伝導性コンパウン
ドを充填した集積回路の冷却装置において、前記冷却部
材の集積回路との対向面と前記集積回路の上面とに微小
の凹凸を設けたことにより構成される。The integrated circuit cooling device of the present invention has a circuit board on which a plurality of integrated circuits are mounted on a surface, a frame for holding the circuit board, and a fixed minute gap over the entire surface of the integrated circuit. A cooling member processed as described above, and a cooling device for an integrated circuit in which a minute gap between the cooling member and the integrated circuit is filled with a heat conductive compound. It is constituted by providing minute irregularities on the upper surface of the integrated circuit.
次に、本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す縦断面図である。第
１図において１はパッケージに収容された集積回路、２
は集積回路１を複数個搭載する回路基板、３は回路基板
２を保持するための枠、４は集積回路１と寸法ｈの微小
間隙を設けて基板保持枠３に取付けられた冷却板であ
る。冷却板４は冷媒の流れる冷却器９にねじ11によって
固定・密着されている。冷媒は冷媒入口12から入って冷
媒流路10を循環し、冷媒入口12の反対側に設けられた冷
媒出口から排出される。冷却板４の集積回路１との対向
面７および集積回路１の上面８とにはサンドブラスト等
によって凹凸を施し、冷却板４と集積回路１との微小間
隙に熱伝導性コンパウンド５を充填している。FIG. 1 is a longitudinal sectional view showing one embodiment of the present invention. In FIG. 1, reference numeral 1 denotes an integrated circuit housed in a package;
Denotes a circuit board on which a plurality of integrated circuits 1 are mounted, 3 denotes a frame for holding the circuit board 2, and 4 denotes a cooling plate provided on the substrate holding frame 3 with a small gap of a dimension h from the integrated circuit 1. . The cooling plate 4 is fixed and adhered to a cooler 9 through which a refrigerant flows by screws 11. The refrigerant enters through the refrigerant inlet 12 and circulates through the refrigerant flow path 10, and is discharged from the refrigerant outlet provided on the opposite side of the refrigerant inlet 12. The surface of the cooling plate 4 facing the integrated circuit 1 and the upper surface 8 of the integrated circuit 1 are made uneven by sandblasting or the like, and the minute gap between the cooling plate 4 and the integrated circuit 1 is filled with the heat conductive compound 5. I have.
集積回路１で発生した熱は集積回路１の上面８から熱
伝導性コンパウンド５を介して冷却板４に伝わり、さら
に冷却器９の冷媒流路10を流れる冷媒へ伝導される。The heat generated in the integrated circuit 1 is transmitted from the upper surface 8 of the integrated circuit 1 to the cooling plate 4 via the heat conductive compound 5 and further to the refrigerant flowing through the refrigerant passage 10 of the cooler 9.
以上、冷却板４に液冷の冷却器９を設置した一実施例
を述べたが、冷却器９を空冷用フィンに置換えることも
可能である。In the above, one embodiment in which the liquid-cooled cooler 9 is installed on the cooling plate 4 has been described. However, the cooler 9 can be replaced with an air-cooling fin.
上述したように、冷却板４の集積回路との対向面７と
集積回路の上面８には凹凸を施してあるが、この凹凸の
大きさは幅が熱伝導性コンパウンド５を構成する粒子よ
り大きく、深さは間隙の10％〜20％程度となるようにす
ることにより、熱伝導性コンパウンド５の粒子が冷却板
４の対向面７と集積回路の上面８に施した凹凸にひっか
かり、熱伝導性コンパウンド５の集積回路の上面８から
の移動・落下を防ぐことができ、装置の熱抵抗の上昇の
防止が可能となる。As described above, the surface 7 of the cooling plate 4 facing the integrated circuit and the upper surface 8 of the integrated circuit are provided with irregularities, and the size of the irregularities is larger than that of the particles constituting the heat conductive compound 5. By setting the depth to be about 10% to 20% of the gap, the particles of the heat conductive compound 5 are caught by the irregularities formed on the opposing surface 7 of the cooling plate 4 and the upper surface 8 of the integrated circuit. The compound 5 can be prevented from moving and dropping from the upper surface 8 of the integrated circuit, and the thermal resistance of the device can be prevented from rising.
以上説明したように本発明は、集積回路の上面と、冷
却板の集積回路に向う面とにそれぞれ凹凸を施したの
で、熱伝導性コンパウンドは電子回路装置を縦置きの配
線ボードに実装したり、あるいは集積回路の動作・非動
作の温度差による部分の膨張収縮がおかったりしても、
本発明による凹凸に捕えられて、冷却板と集積回路との
間隙から移動せず残留するので、電子回路装置の冷却能
力を低下させず、装置の信頼性を高めることができる効
果がある。また、冷却板と集積回路の対向面に凹凸を施
すことによって、熱伝導性コンパウンドとの接触面積、
すなわち熱伝導面が広がり、熱抵抗値を従来よりも低下
することが可能となる効果がある。As described above, according to the present invention, since the upper surface of the integrated circuit and the surface of the cooling plate facing the integrated circuit are each provided with irregularities, the heat conductive compound allows the electronic circuit device to be mounted on a vertically arranged wiring board. Or expansion and contraction of the part due to the temperature difference between the operation and non-operation of the integrated circuit,
Since the semiconductor device is caught by the unevenness according to the present invention and remains without moving from the gap between the cooling plate and the integrated circuit, there is an effect that the cooling performance of the electronic circuit device is not reduced and the reliability of the device can be improved. In addition, by making the cooling plate and the opposing surface of the integrated circuit uneven, the contact area with the heat conductive compound,
That is, there is an effect that the heat conduction surface is widened and the thermal resistance value can be reduced as compared with the conventional case.
第１図は本発明の一実施例の断面図、第２図は従来の集
積回路の冷却装置の断面図である。 1,14……集積回路、2,13……回路基板、３……枠、４…
…冷却板、5,15……熱伝導性コンパウンド、７……対向
面、８……上面、９……冷却器、16……冷却用フィン。FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional cooling device for an integrated circuit. 1,14 …… Integrated circuit, 2,13 …… Circuit board, 3 …… Frame, 4…
... cooling plate, 5,15 ... thermal conductive compound, 7 ... opposed surface, 8 ... upper surface, 9 ... cooler, 16 ... cooling fin.
Claims (1)
板と、この回路基板を保持する枠と、前記集積回路の全
ての表面に亘って一定の微小間隙を有するように加工さ
れた冷却部材とを有して、この冷却部材と前記集積回路
との微小間隙に熱伝導性コンパウンドを充填した集積回
路の冷却装置において、前記冷却部材の集積回路との対
向面と前記集積回路の上面とに微小の凹凸を設けたこと
を特徴とする集積回路の冷却装置。1. A circuit board having a plurality of integrated circuits mounted on a surface, a frame holding the circuit board, and a processing machine having a constant minute gap over the entire surface of the integrated circuit. An integrated circuit cooling device having a cooling member, wherein a heat conductive compound is filled in a minute gap between the cooling member and the integrated circuit; and a surface of the cooling member opposed to the integrated circuit and an upper surface of the integrated circuit. A cooling device for an integrated circuit, characterized in that minute irregularities are provided on the cooling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2072455A JP2811884B2 (en) | 1990-03-20 | 1990-03-20 | Integrated circuit cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2072455A JP2811884B2 (en) | 1990-03-20 | 1990-03-20 | Integrated circuit cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03270259A JPH03270259A (en) | 1991-12-02 |
| JP2811884B2 true JP2811884B2 (en) | 1998-10-15 |
Family
ID=13489798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2072455A Expired - Lifetime JP2811884B2 (en) | 1990-03-20 | 1990-03-20 | Integrated circuit cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2811884B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2088821C (en) * | 1992-02-05 | 1999-09-07 | Hironobu Ikeda | Cooling structure for integrated circuit |
| WO1999016128A1 (en) * | 1997-09-19 | 1999-04-01 | Hitachi, Ltd. | Semiconductor module |
| JP2003289191A (en) * | 2002-03-28 | 2003-10-10 | Denso Corp | Electronic control device |
| JP2010258474A (en) * | 2010-08-02 | 2010-11-11 | Denso Corp | Electronic control device |
-
1990
- 1990-03-20 JP JP2072455A patent/JP2811884B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03270259A (en) | 1991-12-02 |
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