JP2793204B2 - Integrated circuit cooling structure - Google Patents
Integrated circuit cooling structureInfo
- Publication number
- JP2793204B2 JP2793204B2 JP63253540A JP25354088A JP2793204B2 JP 2793204 B2 JP2793204 B2 JP 2793204B2 JP 63253540 A JP63253540 A JP 63253540A JP 25354088 A JP25354088 A JP 25354088A JP 2793204 B2 JP2793204 B2 JP 2793204B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- counterbore
- cooling
- liquid refrigerant
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は情報処理装置等の電子機器を構成する集積回
路素子の冷却構造に関し、特に水などの液体冷媒を集積
回路素子の近傍に循環させ、集積回路素子で発生した熱
を液体冷媒へ伝播させ冷却する構造に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an integrated circuit element constituting an electronic apparatus such as an information processing apparatus, and more particularly, to circulating a liquid refrigerant such as water near the integrated circuit element. In addition, the present invention relates to a structure in which heat generated in an integrated circuit element is transmitted to a liquid refrigerant and cooled.
従来、この種の冷却構造としては第２図に示す例（S.
Oktay,H.C.Kammerer"A Conduction−Cooled Module for
High−Performance LSI Devices"IBM J.RES.DEVELOP.V
ol.26 No.1 Jan.1982による）のように、集積回路201に
ばね205によりピストン204を押し付けて熱を奪い、その
熱をヘリウムガス210を充填した空間を通してハット20
6,介在層207を経て冷却板208へ伝え、冷媒209へ放熱す
る方法をはじめとして、いくつかのものが考案され実用
化されている。また特開昭60−160150には液体冷媒の衝
突憤流を利用した冷却装置の例が示されている。すなわ
ち第３図に示すようにチップ301で発生した熱を伝熱基
板303,可変形性伝熱体304,伝熱板305へと伝え、伝熱板3
05をノズル306から液体冷媒を噴出させて冷却するよう
になっている。Conventionally, as a cooling structure of this type, an example shown in FIG.
Oktay, HCKammerer "A Conduction-Cooled Module for
High-Performance LSI Devices "IBM J.RES.DEVELOP.V
ol.26 No.1 Jan.1982), the piston 204 is pressed against the integrated circuit 201 by the spring 205 to take heat, and the heat is passed through the space filled with the helium gas 210.
6, several methods have been devised and put into practical use, including a method of transmitting heat to the cooling plate 208 via the intervening layer 207 and releasing heat to the refrigerant 209. Further, Japanese Patent Application Laid-Open No. 60-160150 discloses an example of a cooling device utilizing a collision flow of a liquid refrigerant. That is, as shown in FIG. 3, the heat generated by the chip 301 is transmitted to the heat transfer board 303, the deformable heat transfer body 304, and the heat transfer plate 305, and the heat transfer plate 3
05 is cooled by ejecting a liquid refrigerant from a nozzle 306.
上述した従来の冷却構造のうち、第２図の例ではピス
トンをばねを用いて集積回路に接触させているため、集
積回路には常時力が加わった状態にあり、集積回路と配
線基板との接続部分が信頼性に悪影響を及ぼす恐れがあ
る。また集積回路を配線基板に取付けたときに生じる高
さや傾きのばらつきに追従させるため、ピストンと集積
回路との接触面を球面とし、ハットとピストンとの間に
すきまを設けているが、これは有効伝熱面積を減少させ
冷却能力の低下をもたらす。また冷却板内の冷媒流路は
強制対流による熱伝達を目的として形成されており、得
られる熱伝達係数は0.1〜0.5W/cm2℃程度であって集積
回路の高集積化が進み消費電力が増大すると冷却能力が
不足する。In the conventional cooling structure described above, in the example of FIG. 2, since the piston is in contact with the integrated circuit using a spring, a force is constantly applied to the integrated circuit, and the integrated circuit and the wiring board are connected to each other. The connection may adversely affect reliability. Also, in order to follow variations in height and inclination that occur when the integrated circuit is mounted on the wiring board, the contact surface between the piston and the integrated circuit is made spherical, and a gap is provided between the hat and the piston. The effective heat transfer area is reduced and the cooling capacity is reduced. In addition, the coolant passage in the cooling plate is formed for the purpose of heat transfer by forced convection, and the obtained heat transfer coefficient is about 0.1 to 0.5 W / cm 2 ℃. Increases, the cooling capacity becomes insufficient.
特開昭60−160150の例（第３図）では薄肉のベローズ
を用いているため、腐蝕が発生してベローズに穴があき
液体冷媒が漏出することが考えられる。In the example of Japanese Patent Application Laid-Open No. 60-160150 (FIG. 3), since a thin bellows is used, it is conceivable that corrosion occurs and a hole is formed in the bellows, and the liquid refrigerant leaks.
本発明の集積回路の冷却構造は、配線基板に複数個搭
載された集積回路と、前記配線基板を保持する基板枠
と、前記集積回路の上面と微小間隙を保ち対向し、かつ
前記集積回路に対向する反対側の面にざぐり穴を有する
冷却板と、この冷却板と前記集積回路の上面との微小間
隙に充填される熱伝導性コンパウンドと、前記冷却板に
密着し、液体冷媒の入口および出口を有し、かつ液体冷
媒を複数の系統へ分配するためのヘッダ部を前記入口お
よび出口に接して設け、このヘッダ部の底部に保持され
前記冷却板のざぐり穴へ直行させた複数個のノズルを設
けた冷却容器とを有することにより構成される。また請
求項（１）の前記冷却容器は前記配線基板上で液体冷媒
の複数個ある系統の各々において最も入口に近い位置に
搭載された集積回路に対応するざぐり穴へ液体冷媒を噴
出させる第１のノズルと、このざぐり穴からの冷媒排出
口と、次のざぐり穴へ直行する第２のノズルと、前記冷
媒排出口と第２のノズルとを直結するざぐり溝とを有す
ることにより構成される。A cooling structure for an integrated circuit according to the present invention includes a plurality of integrated circuits mounted on a wiring substrate, a substrate frame holding the wiring substrate, and facing a top surface of the integrated circuit with a small gap therebetween, and facing the integrated circuit. A cooling plate having a counterbore on the opposing opposite surface, a heat conductive compound filled in a minute gap between the cooling plate and the upper surface of the integrated circuit, and a liquid refrigerant inlet and a liquid refrigerant which are in close contact with the cooling plate and A header portion having an outlet, and for distributing the liquid refrigerant to a plurality of systems, is provided in contact with the inlet and the outlet, and a plurality of headers held at the bottom of the header portion and directed straight to the counterbore of the cooling plate. And a cooling vessel provided with a nozzle. The cooling container according to claim 1, wherein the cooling container ejects the liquid refrigerant to a counterbore corresponding to an integrated circuit mounted at a position closest to an inlet in each of a plurality of systems of the liquid refrigerant on the wiring board. Nozzle, a refrigerant outlet from this counterbore, a second nozzle that goes directly to the next counterbore, and a counterbore that directly connects the refrigerant outlet with the second nozzle. .
次に、本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す縦断面図である。１
は集積回路、２は集積回路１を複数個マトリクス状に配
列し搭載した配線基板で、その外縁部を囲むよう基板枠
３が固着されている。４は冷却板で集積回路１の上面と
微小間隙を保って対向し、かつ集積回路１に対向する反
対の面にざぐり穴５を具備している。集積回路１と冷却
板４との微小間隙には、熱伝導性コンパウンド６が充填
されている。この熱伝導性コンパウンド６はシリコーン
オイル等の基材に、金属酸化物，窒化ホウ素などの絶縁
性熱伝導性材料をフィラーとして混入したものである。
冷却板４の上には液体冷媒入口７、液体冷媒出口８およ
び液体冷媒を複数の系統へ分配するための入口側ヘッダ
９、出口側ヘッダ10を設けたヘッダ部11を有する。さら
に、このヘッダ部11には、その底部に保持され、冷却板
４の各系統別に設けられたざぐり穴５へ直向させた第１
のノズル12と冷媒排出口13と、次のざくり穴５に直向し
冷媒排出口13とざぐり溝14で直結されている第２のノズ
ル15とを有する冷却容器16が密着されている。FIG. 1 is a longitudinal sectional view showing one embodiment of the present invention. 1
Is an integrated circuit, and 2 is a wiring board on which a plurality of integrated circuits 1 are arranged in a matrix and mounted, and a substrate frame 3 is fixed so as to surround an outer edge portion thereof. Reference numeral 4 denotes a cooling plate which faces the upper surface of the integrated circuit 1 with a small gap therebetween, and has a counterbore 5 on the opposite surface facing the integrated circuit 1. A minute gap between the integrated circuit 1 and the cooling plate 4 is filled with a heat conductive compound 6. The heat conductive compound 6 is obtained by mixing an insulating heat conductive material such as metal oxide or boron nitride as a filler into a base material such as silicone oil.
On the cooling plate 4, a liquid refrigerant inlet 7, a liquid refrigerant outlet 8, and a header section 11 provided with an inlet header 9 for distributing the liquid refrigerant to a plurality of systems and an outlet header 10 are provided. Further, the header portion 11 has a first portion which is held at the bottom thereof and is directed directly to a counterbore 5 provided in each system of the cooling plate 4.
A cooling vessel 16 having a nozzle 12 and a refrigerant outlet 13 and a second nozzle 15 directly facing the next counterbore 5 and directly connected to the refrigerant outlet 13 by a counterbore 14 is in close contact.
いま液体冷媒17が冷却容器16の液体冷媒入口７から流
入すると、入口側ヘッダ９を満たし、第１のノズル12か
ら冷却板４のざぐり穴５へ衝突する。衝突した冷媒は冷
媒排出口13,ざぐり溝14を通り、第２のノズル15へと順
次流れ、最後に出口側ヘッダ10へ集まり、液体冷媒出口
８から外部へ排出される。Now, when the liquid refrigerant 17 flows from the liquid refrigerant inlet 7 of the cooling container 16, the liquid refrigerant 17 fills the inlet side header 9 and collides with the counterbore 5 of the cooling plate 4 from the first nozzle 12. The colliding refrigerant passes through the refrigerant discharge port 13 and the counterbore 14 and sequentially flows to the second nozzle 15, finally gathers at the outlet side header 10, and is discharged from the liquid refrigerant outlet 8 to the outside.
集積回路１で発生した熱は、熱伝導性コンパウンド６
を通過して冷却板４へと伝わる。冷却板４の集積回路１
に対向する反対の面のざぐり穴５には液体冷媒が衝突し
ており、ここで熱伝達が行われる。実験によればノズル
からの噴出速度を0.5〜3.0m/sで変化させたところ、１
〜3W/cm2℃の熱伝達率が得られた。したがって本発明の
冷却構造において、冷却板と集積回路の上面との間隙を
十分小さく保つことにより。集積回路のPNジャンクショ
ンから液体冷媒までの熱抵抗値を１℃/Wあるいはそれ以
下に抑えることが可能である。さらに集積回路を配線基
板に取り付けた際に生じる高さや傾きのばらつきに対し
ても熱伝導性コンパウンドが追従するため、集積回路に
力を加えることがなく、集積回路と配線基板との接続部
に悪影響を与えない。また冷却板に銅合金など熱伝導率
の高い金属を材料として用いれば、肉厚を大きくとって
も熱抵抗値の増加は無視できることから、腐蝕により穴
があき液体冷媒が外部へ漏出することを防止できる。The heat generated in the integrated circuit 1 is transferred to the heat conductive compound 6.
Through the cooling plate 4. Integrated circuit 1 of cooling plate 4
The liquid refrigerant collides with the counterbore 5 on the opposite surface facing the, and heat transfer is performed here. According to the experiment, when the ejection speed from the nozzle was changed at 0.5 to 3.0 m / s,
A heat transfer coefficient of 33 W / cm 2 ℃ was obtained. Therefore, in the cooling structure of the present invention, by keeping the gap between the cooling plate and the upper surface of the integrated circuit sufficiently small. The thermal resistance from the PN junction of the integrated circuit to the liquid refrigerant can be suppressed to 1 ° C./W or less. Furthermore, since the heat conductive compound follows variations in height and inclination that occur when the integrated circuit is mounted on the wiring board, no force is applied to the integrated circuit, and the connection between the integrated circuit and the wiring board is Has no adverse effect. Also, if a metal having high thermal conductivity such as a copper alloy is used as the material for the cooling plate, the increase in the thermal resistance value can be ignored even if the wall thickness is increased, so that the perforation due to corrosion and leakage of the liquid refrigerant to the outside can be prevented. .
以上説明したように本発明は、集積回路を複数個搭載
した配線基板に基板枠を固着し、集積回路の上面と微小
間隙を保って対向し、集積回路と反対方向にざぐり穴を
有する冷却板を基板枠に取り付け、微小間隙に熱伝導性
コンパウンドを充填し、冷却板の集積回路に対向する反
対側の面のざぐり穴に、ノズルにより液体冷媒を衝突さ
せるよう流路を形成した冷却容器を冷却板に密着させ、
冷却板と液体冷媒との熱伝導率を高くする構造としたこ
とにより、熱抵抗が小さく腐蝕に対する信頼性の高い冷
却構造を提供することができる効果がある。As described above, the present invention provides a cooling plate in which a substrate frame is fixed to a wiring board on which a plurality of integrated circuits are mounted, opposed to the upper surface of the integrated circuit with a small gap therebetween, and has a counterbore in a direction opposite to the integrated circuit. Is mounted on the substrate frame, the minute gap is filled with a heat conductive compound, and a cooling container having a flow path formed so that a liquid refrigerant collides with a counterbore hole on the opposite side of the cooling plate facing the integrated circuit by a nozzle. Adhere to the cooling plate,
By adopting a structure in which the thermal conductivity between the cooling plate and the liquid refrigerant is increased, there is an effect that a cooling structure having small thermal resistance and high reliability against corrosion can be provided.
第１図は本発明の一実施例を示す縦断面図、第２図およ
び第３図はそれぞれ従来の集積回路の冷却構造の例を示
す縦断面図である。 1,101……集積回路、2,202……配線基板、３……基板
枠、4,208……冷却板、５……ざぐり穴、６……熱伝導
性コンパウンド、７……液体冷媒入口、８……液体冷媒
出口、９……入口側ヘッダ、10……出口側ヘッダ、11…
…ヘッダ部、12……第１のノズル、13……冷媒排出口、
14……ざぐり溝、15……第２のノズル、16……冷却容
器、17……液体冷媒、203……I/Oピン、204……ピスト
ン、205……ばね、206……ハット、207……介在層、209
……冷媒、301……チップ、302……プリント基板、303
……伝熱基板、304……可変形性伝熱体、305……伝熱
板、306……ノズル、307……ベローズ、308……クーリ
ングヘッダ。FIG. 1 is a longitudinal sectional view showing one embodiment of the present invention, and FIGS. 2 and 3 are longitudinal sectional views respectively showing examples of a conventional cooling structure of an integrated circuit. 1,101 integrated circuit, 2,202 wiring board, 3 board frame, 4,208 cooling plate, 5 counterbore hole, 6 thermally conductive compound, 7 liquid refrigerant inlet, 8 liquid refrigerant Outlet, 9 ... Inlet header, 10 ... Outlet header, 11 ...
... header part, 12 ... first nozzle, 13 ... refrigerant outlet,
14 ... counterbore, 15 ... second nozzle, 16 ... cooling container, 17 ... liquid refrigerant, 203 ... I / O pin, 204 ... piston, 205 ... spring, 206 ... hat, 207 ...... Interposed layer, 209
... refrigerant, 301 ... chip, 302 ... printed circuit board, 303
... heat transfer board, 304 ... deformable heat transfer body, 305 ... heat transfer plate, 306 ... nozzle, 307 ... bellows, 308 ... cooling header.
フロントページの続き (72)発明者 久保川 潤 山梨県甲府市丸の内１丁目17番14号 甲 府日本電気株式会社内 (56)参考文献 実開 昭62−87452（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 23/46Continuation of the front page (72) Inventor Jun Kubogawa 1-17-114 Marunouchi, Kofu City, Yamanashi Prefecture Inside Kofu NEC Corporation (56) References Real Opening Sho 62-87452 (JP, U) (58) Field (Int.Cl. 6 , DB name) H01L 23/46
Claims (2)
集積回路に対向する反対側の面にざぐり穴を有する冷却
板と、 この冷却板と前記集積回路の上面との微小間隔に充填さ
れる熱伝導性コンパウンドと、 前記冷却板に密着し、液体冷媒の入口および出口を有
し、かつ液体冷媒を複数の系統へ分配するためのヘッダ
部を前記入口および出口に接して設け、このヘッダ部の
底部に保持され前記冷却板のざぐり穴へ直行させた複数
個のノズルを設けた冷却容器とを含むことを特徴とする
集積回路の冷却構造。A plurality of integrated circuits mounted on a wiring board; a substrate frame for holding the wiring board; and an opposite side facing the upper side of the integrated circuit with a small distance therebetween and facing the integrated circuit. A cooling plate having a counterbore in the surface, a thermally conductive compound filled in a minute space between the cooling plate and the upper surface of the integrated circuit, and an inlet and an outlet for a liquid refrigerant which are in close contact with the cooling plate, A cooling part provided with a header part for distributing the liquid refrigerant to a plurality of systems is provided in contact with the inlet and the outlet, and provided with a plurality of nozzles held at the bottom of the header part and made to go straight to the counterbore of the cooling plate. A cooling structure for an integrated circuit, comprising: a container;
いて最も入口に近い位置に搭載された集積回路に対応す
るざぐり穴へ液体冷媒を噴出させる第１のノズルと、 この第１のノズルが液体冷媒を噴出させたざぐり穴から
の冷媒排出口と、 次のざぐり穴へ直行する第２のノズルと、 前記冷媒排出口と前記第２のノズルとを直結するざぐり
溝とを含むことを特徴とする請求項（１）記載の集積回
路の冷却構造。2. The cooling container according to claim 1, wherein the cooling container is configured to eject the liquid refrigerant to a counterbore corresponding to an integrated circuit mounted at a position closest to an inlet in each of a plurality of systems of the liquid refrigerant on the wiring board. A nozzle, a refrigerant outlet from a counterbore from which the first nozzle ejected liquid refrigerant, a second nozzle that goes straight to the next counterbore, and a direct connection between the refrigerant outlet and the second nozzle The cooling structure for an integrated circuit according to claim 1, further comprising a counterbore.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63253540A JP2793204B2 (en) | 1988-10-06 | 1988-10-06 | Integrated circuit cooling structure |
| US07/349,411 US5023695A (en) | 1988-05-09 | 1989-05-08 | Flat cooling structure of integrated circuit |
| DE68918156T DE68918156T2 (en) | 1988-05-09 | 1989-05-08 | Flat cooling structure for integrated circuit. |
| CA000599031A CA1303238C (en) | 1988-05-09 | 1989-05-08 | Flat cooling structure of integrated circuit |
| EP89304623A EP0341950B1 (en) | 1988-05-09 | 1989-05-08 | Flat cooling structure of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63253540A JP2793204B2 (en) | 1988-10-06 | 1988-10-06 | Integrated circuit cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02100351A JPH02100351A (en) | 1990-04-12 |
| JP2793204B2 true JP2793204B2 (en) | 1998-09-03 |
Family
ID=17252790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63253540A Expired - Fee Related JP2793204B2 (en) | 1988-05-09 | 1988-10-06 | Integrated circuit cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2793204B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0786471A (en) * | 1993-09-20 | 1995-03-31 | Hitachi Ltd | Semiconductor module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6287452U (en) * | 1985-11-19 | 1987-06-04 |
-
1988
- 1988-10-06 JP JP63253540A patent/JP2793204B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02100351A (en) | 1990-04-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0341950B1 (en) | Flat cooling structure of integrated circuit | |
| US5463528A (en) | Cooling structure for integrated circuits | |
| US4729060A (en) | Cooling system for electronic circuit device | |
| JP2852148B2 (en) | Cooling structure of integrated circuit package | |
| JP2853481B2 (en) | Semiconductor element cooling structure | |
| JP2793204B2 (en) | Integrated circuit cooling structure | |
| JP2845447B2 (en) | Integrated circuit cooling structure | |
| JP2610492B2 (en) | Semiconductor device cooling mounting structure | |
| JPH0724349B2 (en) | Integrated circuit cooling structure | |
| JP2901408B2 (en) | Integrated circuit cooling mechanism | |
| JPH05275586A (en) | Integrated circuit cooling structure | |
| JP2712872B2 (en) | Integrated circuit cooling mechanism | |
| JP2748762B2 (en) | Cooling device for integrated circuits | |
| JPH05251600A (en) | Immersion jet cooling heat sink | |
| JP2969812B2 (en) | Integrated circuit cooling structure | |
| JP3395409B2 (en) | Semiconductor module | |
| JPH04152660A (en) | Integrated circuit cooling mechanism | |
| JPH07101782B2 (en) | Cooling power supply mechanism for integrated circuits | |
| JPH05109953A (en) | Cooling structure for integrated circuit | |
| JP2510161Y2 (en) | Electronic device cooling device | |
| EP0375777A1 (en) | Semiconductor packaging module and heat-conducting block structure used therefor | |
| JPH06224577A (en) | Mechanism for cooling and feeding integrated | |
| JP2002205400A (en) | Ink jet recording head | |
| JPH07321267A (en) | Cooling structure for semiconductor device | |
| JPH08139237A (en) | Cooling structure of integrated circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |