JP2768720B2 - Coating device - Google Patents
Coating deviceInfo
- Publication number
- JP2768720B2 JP2768720B2 JP1048597A JP4859789A JP2768720B2 JP 2768720 B2 JP2768720 B2 JP 2768720B2 JP 1048597 A JP1048597 A JP 1048597A JP 4859789 A JP4859789 A JP 4859789A JP 2768720 B2 JP2768720 B2 JP 2768720B2
- Authority
- JP
- Japan
- Prior art keywords
- coating
- light
- coating liquid
- film thickness
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ この発明は、液体の塗布装置に関し、さらに詳しくい
うと、例えば半導体ウエハの表面にレジストを回転塗布
するスピンコータと呼ばれる塗布装置に関するものであ
る。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid coating apparatus, and more particularly, to a coating apparatus called a spin coater for spin-coating a resist on a surface of a semiconductor wafer, for example.
［従来の技術］ 従来、この種の塗布装置は、株式会社工業調査会発
行、「電子材料」1988年12月号別冊、78−83ページに示
されているように、膜厚の均一な薄膜をウエハなどの被
塗布体上に形成するのに用いられる。第４図は従来の一
般的な塗布装置（以下、従来例１と呼ぶ）を示し、被塗
布体（１）はチャック（４）上に置かれ、真空吸着など
の方法により固定される。塗布液（２）をノズル（３）
から被塗布体（１）上に滴下し、モータ（５）によりチ
ャック（４）・被塗布体（１）を一定時間、高速回転さ
せることにより、遠心力で塗布液（２）を拡げ、その薄
膜を形成する。[Prior art] Conventionally, this type of coating apparatus is a thin film having a uniform film thickness, as shown in “Electronic Materials”, December 1988, separate volume, pages 78-83, issued by the Industrial Research Institute, Inc. Is formed on an object to be coated such as a wafer. FIG. 4 shows a conventional general coating apparatus (hereinafter referred to as Conventional Example 1), in which an object to be coated (1) is placed on a chuck (4) and fixed by a method such as vacuum suction. Nozzle (3) with coating liquid (2)
The coating liquid (2) is spread by centrifugal force by rotating the chuck (4) and the coating object (1) at a high speed for a certain period of time by a motor (5). Form a thin film.
モータ（５）の回転数や回転時間などは使用する塗布
液の粘度や、所望の膜厚から予め条件出しを行って決定
されている。The number of rotations and the rotation time of the motor (5) are determined by setting conditions in advance from the viscosity of the coating solution to be used and the desired film thickness.
以上のような従来の塗布装置は、予め決められた条件
で一律に運転されるため、通常、多数枚のウエハなどが
連続して処理される際に、供給液温や雰囲気条件などの
変動に対して、被塗布体表面に形成されるレジストの膜
厚を一定にすることが困難であり、膜薄のばらつきを招
くという欠点があった。Since the conventional coating apparatus as described above is operated uniformly under predetermined conditions, when a large number of wafers or the like are continuously processed, fluctuations in supply liquid temperature, atmospheric conditions, and the like are usually caused. On the other hand, it is difficult to make the thickness of the resist formed on the surface of the object to be coated constant, and there is a drawback that the thickness of the resist varies.
このような欠点を解消する手段としては、特開昭63−
51976号公報に示された発明（以下この発明を従来例２
と呼ぶ）があり、これを第５図に示す。図において（10
4）は膜厚測定部、（105）は膜厚制御部、（106）はモ
ーター制御部、（100）はレーザ光である。As means for overcoming such disadvantages, Japanese Patent Application Laid-Open
No. 51976 (hereinafter referred to as Conventional Example 2)
This is shown in FIG. In the figure, (10
4) is a film thickness measurement unit, (105) is a film thickness control unit, (106) is a motor control unit, and (100) is a laser beam.
上記従来例２では、回転されつつある被塗布体（１）
における塗布液（２）の膜厚を、レーザ光（100）によ
る干渉縞の観察により計測する膜厚測定部（104）と、
この測定部における測定値に基づいて、膜厚制御部（10
5）とモータ制御部（106）により、回転されつつある被
塗布体の回転速度を制御し所定の膜厚を得るものであ
る。ここでは予め記憶された時間−膜厚関係と回転中の
膜厚計測値の比較によりモータの回転数を塗布中に動的
に制御するようになっている。In the above conventional example 2, the object to be coated (1) being rotated
A film thickness measuring unit (104) for measuring the film thickness of the coating liquid (2) in the above by observing interference fringes with a laser beam (100);
On the basis of the measurement value in this measurement unit, the film thickness control unit (10
The rotation speed of the object being rotated is controlled by 5) and the motor control unit (106) to obtain a predetermined film thickness. Here, the number of rotations of the motor is dynamically controlled during coating by comparing the previously stored relationship between time and film thickness and the measured value of the film thickness during rotation.
このように上記従来例２では、従来は、従来例１のよ
うに予め決められた条件で一律に運転されていた塗布装
置に、フィードバック制御の考えを取り入れることによ
り膜厚のばらっきの問題を解決しようとしたものであ
る。As described above, in the above-described conventional example 2, the problem of the variation in the film thickness is introduced by incorporating the idea of the feedback control into the coating apparatus which is conventionally operated uniformly under the predetermined conditions as in the conventional example 1. Is to solve.
［発明が解決しようとする課題］ 以上のような従来例２による塗布装置では、塗布時間
を一定に保つために回転速度を動的に制御するものとし
ているが、通常回転塗布工程に要する時間は高々数十秒
程度であり、この間に回転塗布の動的な制御を行うため
には、高速に膜厚が計測され、高速に制御方策が決定さ
れ、かつ、高速に制御が実行されねばならず、このよう
な制御系を構成するのは容易なことではない。さらに、
例えば半導体ウエハにフオトレジスト液を塗布する装置
においては、レジスト液塗布後のベーキング工程の方が
所要時間が長く、回転塗布工程に要する時間の変動はベ
ーキング工程の待ち時間を変えるだけであり、プロセス
全体の所要時間には影響を与えず、従って、回転塗布時
間を敢えて一定に保つことに意味はない。[Problem to be Solved by the Invention] In the coating apparatus according to Conventional Example 2 described above, the rotation speed is dynamically controlled in order to keep the coating time constant. At most several tens of seconds, in order to perform dynamic control of spin coating during this time, the film thickness must be measured at high speed, control measures must be determined at high speed, and control must be executed at high speed. However, it is not easy to configure such a control system. further,
For example, in an apparatus for applying a photoresist solution to a semiconductor wafer, the baking step after the application of the resist solution requires a longer time, and the change in the time required for the spin coating step only changes the waiting time of the baking step. It has no effect on the overall time required, so it does not make sense to dare keep the spin-coating time constant.
この発明は上記のような問題点を解消するためになさ
れたもので、被塗布体の回転制御を容易にし、供給液温
や雰囲気条件の変動に伴う膜厚のばらつきを無くすこと
のできる塗布装置を得ることを目的とする。The present invention has been made in order to solve the above-mentioned problems, and it is intended to make it easy to control the rotation of an object to be coated, and to eliminate a variation in a film thickness due to a change in a supply liquid temperature or an atmospheric condition. The purpose is to obtain.
［課題を解決するための手段］ この発明に係る塗装装置は、塗布液の塗布中に被塗布
体上の塗布液の膜厚を光吸収法により計測する測定手段
と、この測定手段における測定値に基づいて前記被塗布
体の回転停止時間を制御する制御手段とを備え、前記測
定手段は、光源と、前記塗布液に照射された前記光源か
らの光が前記被塗布体上で反射され、その反射光を検出
する受光素子とを有しているものである。[Means for Solving the Problems] A coating apparatus according to the present invention comprises a measuring means for measuring the film thickness of a coating solution on an object to be coated by a light absorption method during application of a coating solution, and a measurement value in the measuring means. Control means for controlling the rotation stop time of the object to be coated based on, the measuring means, light source, light from the light source irradiated to the coating liquid is reflected on the object, And a light receiving element for detecting the reflected light.
［作用］ この発明においては、塗布液で一部吸収された光の反
射強度が所定の値に達したとき、被塗布体の回転を停止
する。[Operation] In the present invention, when the reflection intensity of light partially absorbed by the coating liquid reaches a predetermined value, the rotation of the object to be coated is stopped.
［実施例］ 第１図はこの発明の一実施例を示し、ここで、被塗布
体（１）へ塗布液（２）の塗布を行う場合、まずチャッ
ク（４）上に被塗布体（１）を載せ、真空吸着により固
定する。その後、ノズル（３）から塗布液（２）を被塗
布体（１）上に滴下する。さらに、モータ（５）により
被塗布体（１）およびチャック（４）を一定時間、高速
で回転し、被塗布体（１）上の塗布液（２）を遠心力に
より拡げて、塗布液（２）の膜を形成する。塗布中、光
源（10）から被塗布体（１）上に光を照射し、その光の
一部は塗布液（２）で吸収され、被塗布体（１）上で反
射された反射光は受光素子（11）で検出される。時間は
経過に伴い、塗布液（２）の膜厚が減少し、従って、塗
布液（２）で吸収される光量は減少し、被塗布体（１）
上で反射された反射光が受光素子（11）で検出される反
射光強度は増加する。この様子を第２図に示す。同図
（ａ）は時間ｔと膜厚ｌの関係を示し、同図（ｂ）は時
間ｔと反射光強度Ｉの関係を示す。図中、lfは所望の膜
厚、Ifは上記所望の膜厚lfのときの反射光強度を示して
いる。Ifは予め実験等により決定し、モータ回転停止制
御部（12）に記憶されている。モータ回転停止制御部
（12）は、第３図のように、受光素子（11）からの電気
的信号を取り込み、その信号強度から反射光強度Ｉを求
め、その値がIfになった時点でモータ（５）の回転を停
止する。[Embodiment] Fig. 1 shows an embodiment of the present invention. In this case, when the coating liquid (2) is applied to the object (1), first, the object (1) is placed on the chuck (4). ) And fix by vacuum suction. Thereafter, the coating liquid (2) is dropped onto the object (1) from the nozzle (3). Further, the object (1) and the chuck (4) are rotated at a high speed by a motor (5) for a certain period of time, and the coating liquid (2) on the object (1) is spread by centrifugal force. The film of 2) is formed. During coating, light is emitted from the light source (10) onto the object (1), and part of the light is absorbed by the coating liquid (2), and the reflected light reflected on the object (1) is The light is detected by the light receiving element (11). As the time elapses, the film thickness of the coating liquid (2) decreases, and accordingly, the amount of light absorbed by the coating liquid (2) decreases, and the object to be coated (1)
The reflected light intensity at which the reflected light reflected above is detected by the light receiving element (11) increases. This is shown in FIG. FIG. 7A shows the relationship between time t and the film thickness l, and FIG. 7B shows the relationship between time t and the reflected light intensity I. In the figure, l f is the desired thickness, the I f indicates the reflected light intensity when the desired film thickness l f. If is determined in advance by an experiment or the like, and is stored in the motor rotation stop control unit (12). As shown in FIG. 3, the motor rotation stop control unit (12) fetches the electric signal from the light receiving element (11), obtains the reflected light intensity I from the signal intensity, and determines when the value becomes If. To stop the rotation of the motor (5).
［発明の効果］ 以上のように、この発明によれば、塗布液の塗布中に
被塗布体上の塗布液の膜厚を光吸収法により計測する測
定手段と、この測定手段における測定値に基づいて被塗
布体の回転停止時間を制御する制御手段とを備え、前記
測定手段は、光源と、前記塗布液に照射された前記光源
からの光が前記被塗布体上で反射され、その反射光を検
出する受光素子とを有しているので、塗布液膜の厚さを
簡単な構成で一定に保つことができ、膜厚のばらつきを
小さくすることができるという効果があり、例えば、半
導体製品の品質や歩留まりの向上に寄与するところ大で
ある。[Effects of the Invention] As described above, according to the present invention, a measuring unit that measures the film thickness of a coating solution on an object to be coated by a light absorption method during application of a coating solution, and a measurement value obtained by the measuring unit. Control means for controlling the rotation stop time of the object to be coated based on the light source, the light from the light source applied to the coating liquid is reflected on the object to be coated, the reflection Since it has a light receiving element for detecting light, the thickness of the coating liquid film can be kept constant with a simple configuration, and there is an effect that variation in the film thickness can be reduced. It greatly contributes to the improvement of product quality and yield.
また、光干渉法による測定手段を用いて塗布液の膜厚
を求める場合、塗布液表面からの反射光と被塗布体から
の反射光との干渉による光強度の変動をモニターし、光
の入射角度、検出したい光の波長、波の数、塗布液の屈
折率からの塗布液の膜厚を求めるが、回転塗布において
回転初期の膜厚減少は極めて早く、それに伴って生じる
干渉による光強度の極めて早い変化を計測することは困
難であり、回転初期の膜厚を計測することに困難性があ
るのに対して、この発明による光吸収法を用いた場合、
光吸収による光強度の変化は膜厚に対し、単調に増加し
ていくだけであり、光干渉による光強度のような光強度
の極めて早い変化はなく、回転初期から十分に短時間で
計測することができ、それだけ膜厚の測定範囲が広くと
れる効果がある。In addition, when the thickness of the coating liquid is obtained by using a measuring means based on the optical interference method, a change in light intensity due to interference between the reflected light from the coating liquid surface and the reflected light from the object to be coated is monitored, and the light incident The film thickness of the coating solution is obtained from the angle, the wavelength of the light to be detected, the number of waves, and the refractive index of the coating solution. It is difficult to measure an extremely fast change and it is difficult to measure the film thickness at the beginning of rotation, whereas when using the light absorption method according to the present invention,
The change in light intensity due to light absorption only increases monotonically with the film thickness, and there is no extremely rapid change in light intensity such as the light intensity due to light interference. Therefore, there is an effect that the measurement range of the film thickness can be widened accordingly.
【図面の簡単な説明】 第１図はこの発明の一実施例の概略側面図、第２図は第
１図のものの動作特性線図、第３図は第１図のものの制
御方法を示したフローチャート図、第４図，第５図はそ
れぞれ従来の塗布装置の概略側面図である。 １……被塗布体、２……塗布液、３……ノズル、５……
モータ、10……光源、11……受光素子、12……モーター
回転停止制御部。 なお、各図中、同一符号は同一又は相当部分を示す。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic side view of one embodiment of the present invention, FIG. 2 is an operational characteristic diagram of FIG. 1, and FIG. 3 is a control method of FIG. 4 and 5 are schematic side views of a conventional coating apparatus. 1 ... Applicant, 2 ... Coating liquid, 3 ... Nozzle, 5 ...
Motor, 10 light source, 11 light receiving element, 12 motor rotation stop control unit. In the drawings, the same reference numerals indicate the same or corresponding parts.
フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) B05C 11/08 H01L 21/30Continuation of the front page (58) Field surveyed (Int.Cl. 6 , DB name) B05C 11/08 H01L 21/30
Claims (1)
体を回転させて前記塗布液を遠心力により拡げ、前記被
塗布体上に前記塗布液の薄膜を形成させる塗布装置にお
いて、前記塗布液の塗布中に前記被塗布体上の前記塗布
液の膜厚を光吸収法により計測する測定手段と、この測
定手段における測定値に基づいて前記被塗布体の回転停
止時間を制御する制御手段とを備え、前記測定手段は、
光源と、前記塗布液に照射された前記光源からの光が前
記被塗布体上で反射され、その反射光を検出する受光素
子とを有している塗布装置。1. A coating apparatus for dropping a coating liquid on an object to be coated, rotating said object to spread said coating liquid by centrifugal force, and forming a thin film of said coating liquid on said object to be coated. Measuring means for measuring the thickness of the coating liquid on the object by the light absorption method during application of the coating liquid, and controlling the rotation stop time of the object based on the measurement value of the measuring means. Control means to perform, the measuring means,
A coating apparatus, comprising: a light source; and a light receiving element configured to reflect light from the light source applied to the coating liquid on the coating object and detect the reflected light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1048597A JP2768720B2 (en) | 1989-03-02 | 1989-03-02 | Coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1048597A JP2768720B2 (en) | 1989-03-02 | 1989-03-02 | Coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02229577A JPH02229577A (en) | 1990-09-12 |
| JP2768720B2 true JP2768720B2 (en) | 1998-06-25 |
Family
ID=12807818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1048597A Expired - Fee Related JP2768720B2 (en) | 1989-03-02 | 1989-03-02 | Coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2768720B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4648443B2 (en) * | 2008-09-22 | 2011-03-09 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor integrated circuit device |
| JPWO2021260943A1 (en) * | 2020-06-26 | 2021-12-30 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6037402B2 (en) * | 1980-09-27 | 1985-08-26 | 松下電器産業株式会社 | How to measure film thickness |
| JPS5998238A (en) * | 1982-11-26 | 1984-06-06 | Toshiba Corp | Data setting method |
| JPS6115072U (en) * | 1984-06-29 | 1986-01-28 | ホ−ヤ株式会社 | Resist coating equipment |
-
1989
- 1989-03-02 JP JP1048597A patent/JP2768720B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02229577A (en) | 1990-09-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |