JP2750125B2 - Substrate structure of thermal head - Google Patents
Substrate structure of thermal headInfo
- Publication number
- JP2750125B2 JP2750125B2 JP63173489A JP17348988A JP2750125B2 JP 2750125 B2 JP2750125 B2 JP 2750125B2 JP 63173489 A JP63173489 A JP 63173489A JP 17348988 A JP17348988 A JP 17348988A JP 2750125 B2 JP2750125 B2 JP 2750125B2
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- substrate
- glass
- film
- substrate structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 ［発明の目的］ 〈産業上の利用分野〉 本発明は、基板上に配設された抵抗発熱体膜を選択的
に発熱させ、感熱紙や感熱転写インクリボンを介して普
通紙等に所望のパターンで印字するためのサーマルヘッ
ドの基板構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] <Industrial Application Field> The present invention selectively heats a resistive heating element film provided on a substrate and uses a heat-sensitive paper or a heat-sensitive transfer ink ribbon. And a substrate structure of a thermal head for printing in a desired pattern on plain paper.
〈従来の技術〉 例えば、サーマルヘッドの抵抗発熱部を、プラテンに
支持された用紙に感熱転写インクリボンを介して摺接さ
せることにより、紙面に所望のパターンで印字するサー
マルプリンタが知られている。上記したサーマルヘッド
に於ては、用紙に鮮明な印字を高速度で行うために抵抗
発熱部を印字後直ちに冷却可能として熱応答性を向上す
ることが好ましく、従来は該ヘッドにアルミナセラミッ
ク基板を用い、この基板に放熱用の金属製ヒートシンク
を密接させるようにしていた。<Prior Art> For example, a thermal printer that prints a desired pattern on a sheet of paper by sliding a resistance heating portion of a thermal head on a sheet supported by a platen via a thermal transfer ink ribbon is known. . In the above-described thermal head, it is preferable to improve the thermal responsiveness by cooling the resistance heating portion immediately after printing in order to perform clear printing on paper at a high speed, and conventionally, an alumina ceramic substrate is used for the head. In this case, a metal heat sink for heat radiation was brought into close contact with the substrate.
しかるに、アルミナセラミック基板と金属製ヒートシ
ンクとの熱膨脹率が各々異なることから、ラインヘッド
等に上記基板を用いると温度変化によりサーマルヘッド
全体が変形し、紙面に対する印字圧が不均一となり、印
字むらを生じる要因となっていた。また、アルミナセラ
ミック基板は比較的高価であり、かつ別途にヒートシン
クを設ける必要があることから、サーマルヘッドの部品
点数が増加し、生産コストも高騰化しがちになる問題も
あった。However, since the thermal expansion coefficients of the alumina ceramic substrate and the metal heat sink are different from each other, when the above substrate is used for a line head or the like, the entire thermal head is deformed due to a temperature change, and the printing pressure on the paper surface becomes non-uniform, thereby causing uneven printing. Was a factor that occurred. Further, since the alumina ceramic substrate is relatively expensive and it is necessary to separately provide a heat sink, there is a problem that the number of components of the thermal head increases and the production cost tends to increase.
そこで、サーマルヘッドの基板に放熱性及び加工性が
良く、かつ安価な金属基板を用いることが考えられる。
その場合、金属基板のベース層として用いられる例えば
アルミニウムの融点は660℃程度と比較的低いことか
ら、その表面に焼成されるガラスクレーズ層には焼成温
度が500℃〜600℃程度の低融点ガラスが用いられるが、
この低融点ガラスは比較的耐熱性の低い酸化鉛等を多く
含むことから、基板の表面に抵抗発熱体膜或いは電極膜
を形成する際に行われる酸性液のエッチングによりガラ
スクレーズ層が侵蝕され、その表面に凹凸が生じたり、
ガラスクレーズ層から溶出した上記酸化鉛等が抵抗発熱
体膜及び電極膜に付着し該膜に悪影響を及ぼす心配があ
る。Therefore, it is conceivable to use an inexpensive metal substrate having good heat dissipation and workability for the substrate of the thermal head.
In this case, for example, since the melting point of aluminum used as a base layer of the metal substrate is relatively low at about 660 ° C., the glass craze layer fired on its surface has a low melting point glass having a firing temperature of about 500 ° C. to 600 ° C. Is used,
Since this low-melting glass contains a lot of relatively low heat-resistant lead oxide and the like, the glass craze layer is eroded by the etching of the acid solution performed when the resistance heating element film or the electrode film is formed on the surface of the substrate, Irregularities occur on the surface,
The lead oxide and the like eluted from the glass craze layer may adhere to the resistance heating element film and the electrode film and adversely affect the film.
〈発明が解決しようとする課題〉 このような従来技術の問題点に鑑み、本発明の主な目
的は、印字時の熱応答性が損われることがなく、またラ
インヘッド等に用いても印字圧が不均一になることがな
く、更に部品点数及び生産コストが削減されたサーマル
ヘッドの基板構造を提供することにある。<Problems to be Solved by the Invention> In view of the problems of the prior art described above, a main object of the present invention is not to impair the thermal responsiveness at the time of printing, and to print even when used in a line head or the like. An object of the present invention is to provide a substrate structure of a thermal head in which the pressure does not become non-uniform and the number of parts and production cost are further reduced.
［発明の構成］ 〈課題を解決するための手段〉 このような目的は、本発明によれば、表面に抵抗体膜
及び電極膜が形成されるサーマルヘッドの基板構造であ
って、アルミニウム及びステンレス鋼のいずれか一方か
らなるベース層と、前記ベース層表面に設けられた低融
点ガラスからなるガラスグレーズ層と、前記ガラスグレ
ーズ層表面に直接二酸化珪素を成膜してなる酸化防止膜
とを有することを特徴とするサーマルヘッドの基板構造
を提供することにより達成される。[Constitution of the Invention] <Means for Solving the Problems> According to the present invention, there is provided a substrate structure of a thermal head having a resistor film and an electrode film formed on a surface thereof. It has a base layer made of any one of steel, a glass glaze layer made of low melting point glass provided on the surface of the base layer, and an antioxidant film formed by depositing silicon dioxide directly on the surface of the glass glaze layer. This is achieved by providing a substrate structure for a thermal head.
〈作用〉 このように、金属ベース層表面に設けられたガラスグ
レーズ層の表面に酸化防止膜を設けることにより、抵抗
発熱体膜や電極膜を形成する際のエッチングによりガラ
スグレーズ層が侵蝕されることが抑制されることはもと
より、ガラスグレーズ層から溶出した酸化鉛等が抵抗発
熱体膜及び電極膜に付着することが抑制される。従っ
て、サーマルヘッドの基板に金属基板を用いることがで
きる。<Function> As described above, by providing the antioxidant film on the surface of the glass glaze layer provided on the surface of the metal base layer, the glass glaze layer is eroded by etching when forming the resistance heating element film and the electrode film. Not only that, the lead oxide and the like eluted from the glass glaze layer are suppressed from adhering to the resistance heating element film and the electrode film. Therefore, a metal substrate can be used as the substrate of the thermal head.
〈実施例〉 以下、本発明の好適実施例を添付の図面について詳し
く説明する。<Embodiment> Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
第１図は本発明が適用されたサーマルヘッドの基板１
を示す。基板１は、アルミニウムからなるベース層２
と、このベース層２の表面に低融点ガラスからなるガラ
スペーストをスクリーン印刷により２〜３回塗布し厚さ
30μｍ〜50μｍとなるように焼成したガラスグレーズ層
３と、ガラスグレーズ層３の表面にスパッタリングによ
り厚さ２μｍ以上、好ましくは２μｍ〜３μｍに成膜し
た二酸化珪素からなる酸化防止膜４とを有している。実
際には、この酸化防止膜４の表面に窒化タンタル或いは
タンタル二酸化珪素等からなる発熱抵抗体膜及び金或い
はアルミニウム等からなる電極膜がフォトリソグラフィ
によりパターン形成された後、酸性液でエッチングされ
ることにより形成される。FIG. 1 shows a substrate 1 of a thermal head to which the present invention is applied.
Is shown. The substrate 1 has a base layer 2 made of aluminum.
And a glass paste made of low-melting glass is applied to the surface of the base layer 2 by screen printing two to three times.
It has a glass glaze layer 3 fired to have a thickness of 30 μm to 50 μm, and an antioxidant film 4 made of silicon dioxide formed on the surface of the glass glaze layer 3 by sputtering to a thickness of 2 μm or more, preferably 2 μm to 3 μm. ing. Actually, after a heating resistor film made of tantalum nitride or tantalum silicon dioxide or the like and an electrode film made of gold or aluminum are formed on the surface of the antioxidant film 4 by photolithography, they are etched with an acid solution. It is formed by this.
ここで、ベース層２に用いられるアルミニウムの融点
は660℃程度であることから、その表面に焼成されるガ
ラスクレーズ層３には、焼成温度が500℃〜600℃程度の
耐蝕性に乏しい酸化鉛等を多く含む低融点ガラスが用い
られているが、その表面が酸化防止膜４に覆われている
ことにより、上記抵抗発熱体膜、電極膜形成時のエッチ
ングの際に、酸化防止膜４の表面が毎分500Å〜600Å程
度エッチングされるのみであり、ガラスクレーズ層が侵
蝕されることがない。また、酸化防止膜４をスパッタリ
ングにより形成することにより、基板１の表面の平滑性
も向上している。Here, since the melting point of aluminum used for the base layer 2 is about 660 ° C., the glass craze layer 3 baked on the surface thereof has a calcination temperature of about 500 ° C. to 600 ° C. and poor corrosion resistance lead oxide. Although a low-melting glass containing a large amount of such a material is used, the surface thereof is covered with the antioxidant film 4 so that the antioxidant film 4 is not etched when the resistance heating element film and the electrode film are formed. The surface is only etched at about 500 to 600 degrees per minute, and the glass craze layer is not eroded. Further, by forming the antioxidant film 4 by sputtering, the smoothness of the surface of the substrate 1 is also improved.
［発明の効果］ このように本発明によれば、金属ベース層表面に設け
られたガラスグレーズ層の表面に酸化防止膜を設けるこ
とにより、放熱性及び加工性が良く安価な金属基板をサ
ーマルヘッドの基板として用いることが可能となる。そ
のため、別途にヒートシンクを設けなくとも熱応答性を
損うことがない。また基板とヒートシンクとの熱膨脹率
の差によるサーマルヘッドの変形を防止でき、更に部品
点数をも削減することができる。以上のことから本発明
の効果が極めて大である。[Effects of the Invention] As described above, according to the present invention, by providing an antioxidant film on the surface of the glass glaze layer provided on the surface of the metal base layer, it is possible to use an inexpensive metal substrate with good heat dissipation and workability. Can be used as a substrate. Therefore, thermal responsiveness is not impaired without providing a heat sink separately. In addition, it is possible to prevent the thermal head from being deformed due to the difference in the coefficient of thermal expansion between the substrate and the heat sink, and to further reduce the number of components. From the above, the effect of the present invention is extremely large.
第１図は本発明が適用されたサーマルヘッドの基板の一
部を示す縦断面図である。 １…基板、２…ベース層 ３…ガラスグレーズ層、４…酸化防止膜FIG. 1 is a longitudinal sectional view showing a part of a substrate of a thermal head to which the present invention is applied. DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Base layer 3 ... Glass glaze layer, 4 ... Antioxidant film
Claims (1)
ーマルヘッドの基板構造であって、アルミニウム及びス
テンレス鋼のいずれか一方からなるベース層と、 前記ベース層表面に設けられた低融点ガラスからなるガ
ラスグレーズ層と、 前記ガラスグレーズ層表面に直接二酸化珪素を成膜して
なる酸化防止膜とを有することを特徴とするサーマルヘ
ッドの基板構造。1. A substrate structure of a thermal head having a surface on which a resistor film and an electrode film are formed, comprising: a base layer made of one of aluminum and stainless steel; and a low melting point provided on the surface of the base layer. A substrate structure for a thermal head, comprising: a glass glaze layer made of glass; and an antioxidant film formed by depositing silicon dioxide directly on the surface of the glass glaze layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63173489A JP2750125B2 (en) | 1988-07-12 | 1988-07-12 | Substrate structure of thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63173489A JP2750125B2 (en) | 1988-07-12 | 1988-07-12 | Substrate structure of thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0224154A JPH0224154A (en) | 1990-01-26 |
| JP2750125B2 true JP2750125B2 (en) | 1998-05-13 |
Family
ID=15961455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63173489A Expired - Lifetime JP2750125B2 (en) | 1988-07-12 | 1988-07-12 | Substrate structure of thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2750125B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100578976B1 (en) | 2004-10-15 | 2006-05-12 | 삼성에스디아이 주식회사 | Multilayer having an excellent adhesion and a methof for fabricating method the same |
| US9873939B2 (en) | 2011-09-19 | 2018-01-23 | The Regents Of The University Of Michigan | Microfluidic device and method using double anodic bonding |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61167572A (en) * | 1985-01-19 | 1986-07-29 | Fuji Xerox Co Ltd | Thermal head |
| JPS62111767A (en) * | 1985-11-11 | 1987-05-22 | Alps Electric Co Ltd | Thermal head |
-
1988
- 1988-07-12 JP JP63173489A patent/JP2750125B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0224154A (en) | 1990-01-26 |
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