JP2727413B2 - Substrate cleaning device - Google Patents
Substrate cleaning deviceInfo
- Publication number
- JP2727413B2 JP2727413B2 JP16922394A JP16922394A JP2727413B2 JP 2727413 B2 JP2727413 B2 JP 2727413B2 JP 16922394 A JP16922394 A JP 16922394A JP 16922394 A JP16922394 A JP 16922394A JP 2727413 B2 JP2727413 B2 JP 2727413B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cleaning brush
- cleaning
- arm
- brush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title claims description 103
- 239000000758 substrate Substances 0.000 title claims description 91
- 239000007788 liquid Substances 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000002245 particle Substances 0.000 description 9
- 230000000284 resting effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、例えば半導体ウエハ
やフォトマスク用ガラス板等（以下単に基板と称する）
を洗浄する基板洗浄装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer, a glass plate for a photomask, and the like (hereinafter simply referred to as a substrate).
The present invention relates to a substrate cleaning apparatus for cleaning a substrate.
【０００２】[0002]
【従来の技術】この種の基板洗浄技術としては、従来よ
り例えば特開昭５７−９０９４１号公報に開示されたス
イング式縦型洗浄装置が知られている。それは、基板を
吸着保持して回転する吸着チャックと、基板の洗浄面に
垂直に当接された回転ブラシと、回転ブラシを回転させ
るモータと、基板の直径方向に沿って上記回転ブラシを
前後進（スイング）させる駆動機構とを具備して成り、
回転する基板表面上で当該基板の直径方向に回転ブラシ
を当接させて往復移動させることにより、基板の表面を
洗浄するように構成されている。2. Description of the Related Art As this type of substrate cleaning technique, a swing type vertical cleaning apparatus disclosed in, for example, Japanese Patent Application Laid-Open No. 57-90941 has been known. It consists of a suction chuck that holds and rotates the substrate by suction, a rotating brush that is perpendicularly abutted on the cleaning surface of the substrate, a motor that rotates the rotating brush, and forward and backward movement of the rotating brush along the diameter direction of the substrate. (Swing) drive mechanism,
The surface of the substrate is cleaned by rotating and reciprocating the rotating brush in the diameter direction of the substrate on the surface of the rotating substrate.
【０００３】[0003]
【発明が解決しようとする課題】上記従来例では回転ブ
ラシを基板の直径範囲内で往復移動させるように構成さ
れているので、回転ブラシが周縁位置から中心位置へ移
動する際に、一度基板から除去したパーティクル等を基
板の中心部へ持ち込むことになり、パーティクル等が遠
心力の小さい基板中心部に残留してしまうという難点が
ある。 また、この種の基板洗浄装置では、洗浄を終えた
基板を引き続き回転させて液切り乾燥するが、基板の回
転乾燥時においても、回転ブラシが基板の上側にあるた
め、回転ブラシが含有する洗浄液の液滴が洗浄済みの基
板表面に落下し、パーティクル等が当該基板に再付着す
るおそれがある。本発明はこのような事情に鑑みてなさ
れたもので、洗浄済みの基板にパーティクル等が残留し
たり再付着したりするのを防止することを技術課題とす
る。Since the upper Symbol conventional [0008] is configured to reciprocally move the rotating brush in the diameter range of the substrate, the rotating brush is moved to the center position from the edge position
When moving, particles and the like once removed from the substrate
It will be brought to the center of the board and particles etc. will be far away
The drawback is that it remains in the center of the substrate where
is there. In addition, this type of substrate cleaning apparatus has completed cleaning.
The substrate is continuously rotated to drain off and dry.However , even during the rotational drying of the substrate, since the rotating brush is on the upper side of the substrate, droplets of the cleaning liquid contained in the rotating brush fall on the cleaned substrate surface, and particles are removed. May adhere to the substrate again. The present invention has been made in view of such circumstances, and particles and the like remain on a cleaned substrate.
And technical problems of preventing or to or reattached.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するた
め、本発明は以下のように構成される。即ち、回転する
基板の表面上に洗浄ブラシを移動させて基板表面を洗浄
する基板洗浄装置において、垂直軸を中心として回転可
能に前記洗浄ブラシを垂下支持する洗浄ブラシ支持手段
と、前記洗浄ブラシを回転させる洗浄ブラシ回転手段
と、前記洗浄ブラシ支持手段を駆動することにより、前
記洗浄ブラシを基板表面から離隔した状態で前記基板の
回転中心と対向する中心位置まで移動させた後、基板と
当接する位置まで下降させ、前記洗浄ブラシと基板表面
とが当接した状態で前記基板の周縁と対向する周縁位置
まで移動させ、その後前記洗浄ブラシが前記基板の周縁
より外側に位置する待機位置まで前記洗浄ブラシを移動
させる洗浄ブラシ移動手段と、前記基板の表面に洗浄液
を供給する洗浄液供給手段と、を具備することを特徴と
する。Means for Solving the Problems In order to solve the above problems, the present invention is configured as follows. That is, in a substrate cleaning apparatus for cleaning a substrate surface by moving a cleaning brush over a surface of a rotating substrate, a cleaning brush supporting means for hanging the cleaning brush rotatably about a vertical axis, and the cleaning brush. The cleaning brush rotating means to be rotated, and by driving the cleaning brush supporting means, after moving the cleaning brush to a center position opposed to the rotation center of the substrate in a state of being separated from the substrate surface ,
Lower the cleaning brush to the contact position, and
Edge position facing the edge of the substrate in a state where
Is moved to comprises then a cleaning brush moving means for moving the cleaning brush to the standby position where said cleaning brush is located outside the periphery of the substrate, and a cleaning liquid supply means for supplying a cleaning liquid to the surface of the substrate It is characterized by the following.
【０００５】[0005]
【作用】本発明では、回転する基板の表面に洗浄液供給
手段で洗浄液を供給しつつ、回転する洗浄ブラシを洗浄
ブラシ移動手段で基板の表面上を移動させて洗浄した
後、引き続き基板を回転させて液切り乾燥するが、基板
洗浄の際に、洗浄ブラシを基板表面から離隔した状態で
基板の回転中心と対向する中心位置まで移動させた後、
基板と当接する位置まで下降させ、洗浄ブラシと基板表
面とが当接した状態で前記基板の周縁と対向する周縁位
置まで移動させる。つまり、回転する洗浄ブラシを基板
表面の中心位置から周縁位置まで移動させてパーティク
ル等を基板表面から掃き出し、回転する基板の強力な遠
心力で洗浄液とともにパーティクル等を除去する。そし
て、基板の洗浄後は、当該洗浄ブラシを基板の周縁より
外側に位置する待機位置に移動させる。これにより基板
の液切り乾燥時に、洗浄ブラシが含有する洗浄液の液滴
が洗浄済みの基板表面に落下するのを防止する。 According to the present invention, the rotating cleaning brush is cleaned while the cleaning liquid is supplied to the surface of the rotating substrate by the cleaning liquid supply means.
Cleaning was performed by moving the surface of the substrate with a brush moving means.
After that, the substrate is rotated and drained and dried.
When cleaning, keep the cleaning brush away from the substrate surface.
After moving to the center position facing the rotation center of the substrate,
Lower it to a position where it comes into contact with the substrate.
A peripheral position facing the peripheral edge of the substrate in a state where the surface is in contact with the substrate
To the position. In other words, the rotating cleaning brush is
Move from the center of the surface to the peripheral
Of the rotating substrate,
Particles and the like are removed together with the cleaning liquid by heart. Soshi
Te, after washing the substrate Before moving the cleaning brush to a standby position located outside the periphery of the substrate. This allows the substrate
During the drying of the liquid, the droplets of the cleaning liquid contained in the cleaning brush are prevented from dropping on the cleaned substrate surface .
【０００６】[0006]
【実施例】以下、図１及び図２に基づいて説明する。こ
こで、図１は本発明の一実施例であって、基板洗浄装置
の機能説明用側面図、図２はその斜視図である。この基
板洗浄装置は、洗浄ブラシ支持手段と、洗浄ブラシ回転
手段と、洗浄ブラシ移動手段と、洗浄液供給手段とを具
備している。ここで、後述する揺動アーム１は洗浄ブラ
シ支持手段に該当し、駆動モータ３は洗浄ブラシ回転手
段に該当し、アーム支軸５の回転駆動手段１１及び昇降
駆動手段１７は洗浄ブラシ移動手段に該当し、洗浄液供
給ノズル４３は洗浄液供給手段に該当する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A description will be given below with reference to FIGS. Here, FIG. 1 is an embodiment of the present invention, and a side view for explaining a function of a substrate cleaning apparatus, and FIG. 2 is a perspective view thereof. This substrate cleaning apparatus includes cleaning brush support means, cleaning brush rotating means, cleaning brush moving means, and cleaning liquid supply means. Here, the swing arm 1 described later corresponds to the cleaning brush support means, the drive motor 3 corresponds to the cleaning brush rotating means, and the rotation driving means 11 and the elevation driving means 17 of the arm support shaft 5 correspond to the cleaning brush moving means. The cleaning liquid supply nozzle 43 corresponds to a cleaning liquid supply unit.
【０００７】この実施例装置は回転可能に設けた洗浄ブ
ラシ２を垂下支持し、水平揺動可能に設けられた揺動ア
ーム１と、揺動アーム１をその上端部に支持し、回転及
び昇降可能に設けられたアーム支軸５と、アーム支軸５
を位置制御可能に回転駆動する回転駆動手段１１と、ア
ーム支軸５を昇降駆動する昇降駆動手段１７と、アーム
支軸５に固定され揺動アーム１の荷重を受け止めるアー
ム荷重受止板７と、アーム１の減速下降用の錘り２２を
載置し、昇降可能に設けられた錘載置板２１と、その両
端部が上下方向に揺動可能に支持された両腕てこ２５
と、錘載置板２１の上昇速度を減速する減速シリンダ３
１と、錘載置板２１の上昇位置を微調整可能に規制する
ストッパ３２とを具備して成り、洗浄ブラシ２の、基板
表面への当接に際し、アーム荷重受止板７を両腕てこ２
５の一方の腕２５ａに載せ掛けるとともに、錘載置板２
１を他方の腕２５ｂに載せ掛けてアーム支軸５の下降速
度を減速することにより、スピンチャック４２の上面に
保持された基板４１上へ、洗浄ブラシ２を緩やかに当接
するように構成されている。なお、図１中符号４３は純
水等の洗浄液供給ノズルを示す。In this embodiment, a cleaning brush 2 rotatably provided is suspended, a swing arm 1 which is horizontally swingable, and a swing arm 1 is supported at an upper end thereof, and is rotated and moved up and down. Arm support shaft 5 provided so as to be capable of being provided, and arm support shaft 5
A rotary driving means 11 for rotating and driving the arm support shaft 5, an elevating drive means 17 for driving the arm support shaft 5 up and down, an arm load receiving plate 7 fixed to the arm support shaft 5 and receiving the load of the swing arm 1. The weight 22 for deceleration and lowering of the arm 1 is mounted thereon, and a weight mounting plate 21 provided so as to be able to move up and down, and a two-arm lever 25 whose both ends are supported so as to be vertically swingable.
And a reduction cylinder 3 for reducing the rising speed of the weight mounting plate 21
1 and a stopper 32 for finely adjusting the ascending position of the weight placing plate 21. When the cleaning brush 2 comes into contact with the substrate surface, the arm load receiving plate 7 is lifted with both arms. 2
5 on one arm 25a and the weight placing plate 2
1 is placed on the other arm 25b to reduce the descending speed of the arm support shaft 5, so that the cleaning brush 2 is gently brought into contact with the substrate 41 held on the upper surface of the spin chuck 42. I have. In FIG. 1, reference numeral 43 denotes a nozzle for supplying a cleaning liquid such as pure water.
【０００８】洗浄ブラシ２は揺動アーム１の先端側に回
転自在に垂下支持されており、揺動アーム１の基端側に
配置した駆動モータ３によって伝動ベルト４を介して回
転駆動される。なお、洗浄ブラシ２はスポンジ状のも
の、羽毛状のもの等、洗浄工程等に応じて適宜選択して
使用される。揺動アーム１はその基端部がアーム支軸５
の上端部に固定され、アーム支軸５を中心として水平回
転可能に、かつ、アーム支軸５を昇降することにより昇
降自在に設けられている。The cleaning brush 2 is rotatably suspended at the distal end of the swing arm 1 and is rotatably driven via a transmission belt 4 by a drive motor 3 disposed at the base end of the swing arm 1. Note that the cleaning brush 2 is appropriately selected and used depending on a cleaning step or the like, such as a sponge-like one or a feather-like one. The swing arm 1 has an arm support shaft 5 at its base end.
, Which is horizontally rotatable about the arm support shaft 5, and is provided so as to be able to move up and down by moving the arm support shaft 5 up and down.
【０００９】アーム支軸５は、基台４０上に固定した支
軸用ボス６に回転及び昇降自在に支持されており、この
アーム支軸５にはボス６の上方に位置する部位にアーム
荷重受止板７が固定されるとともに、基台４０を貫通し
た下部に、スプラインスリーブ８を介して従動プーリ１
０が連結されている。即ち、アーム支軸５の下部はスプ
ライン軸５ｂになっており、このスプライン軸５ｂにス
プラインスリーブ８を外嵌し、スプラインスリーブ８を
軸受９を介して回転可能に基台４０へ支持し、スプライ
ンスリーブ８のプーリ固定軸８ｂに従動プーリ１０が固
定されている。The arm support shaft 5 is supported by a support boss 6 fixed on a base 40 so as to be rotatable and vertically movable. The arm support shaft 5 has an arm load on a portion located above the boss 6. The receiving plate 7 is fixed, and the driven pulley 1 is
0 is linked. That is, a lower portion of the arm support shaft 5 is a spline shaft 5b, and a spline sleeve 8 is externally fitted to the spline shaft 5b, and the spline sleeve 8 is rotatably supported on a base 40 via a bearing 9; A driven pulley 10 is fixed to a pulley fixing shaft 8 b of the sleeve 8.
【００１０】アーム支軸５の回転駆動手段１１は、駆動
プーリ１３及び伝動ベルト１４を介して従動プーリ１０
を正逆転駆動する駆動モータ１２と、位置制御用のセン
サ１５Ａ・１５Ｂ・１５Ｃを具備して成り、揺動アーム
１の先端に取り付けられた洗浄ブラシ２の位置につい
て、待機位置Ａ、基板４１の中心位置Ｂ、基板４１の周
縁位置Ｃを検出して位置制御するように構成されてい
る。なお符号１６Ａ・１６Ｂ・１６Ｃはそれぞれ所定位
置にスリットが付設された円板を示す。The rotation driving means 11 of the arm support shaft 5 is driven by a driven pulley 10 via a driving pulley 13 and a transmission belt 14.
And a position control sensor 15A, 15B, and 15C. The position of the cleaning brush 2 attached to the tip of the swing arm 1 is determined by the standby position A and the position of the substrate 41. The position is controlled by detecting the center position B and the peripheral position C of the substrate 41. Reference numerals 16A, 16B, and 16C denote discs provided with slits at predetermined positions.
【００１１】昇降駆動手段１７は、基台４０の下側にエ
アシリンダ１８を固定し、エアシリンダ１８の出力ロッ
ド１９をアーム支軸５の下端（スプライン軸５ｂ）に押
し当てて進退させることにより、揺動アーム１を昇降駆
動するように構成されている。なお、符号２０Ａ・２０
Ｂは、出力ロッド１９の進退位置を検知するセンサを示
し、出力ロッド１９の進退ストロークに沿って付設され
ている。The lifting drive means 17 fixes the air cylinder 18 below the base 40 and pushes the output rod 19 of the air cylinder 18 against the lower end (spline shaft 5b) of the arm support shaft 5 to advance and retreat. The swing arm 1 is configured to be driven up and down. Note that reference numerals 20A and 20A
B indicates a sensor for detecting the advance / retreat position of the output rod 19, and is provided along the advance / retreat stroke of the output rod 19.
【００１２】ここで、揺動アーム１は、待機位置Ａでは
アーム荷重受止板７が支軸ボス６の上面に載った状態で
停止しており、基板４１の洗浄に際して、先ず待機位置
Ａでエアシリンダ１８の出力ロッド１９を進出させてア
ーム支軸５を押し上げることにより揺動アーム１を持ち
上げ、次いで駆動モータ１２を正転させて揺動アーム１
の先端に取付けられた洗浄ブラシ２を基板４１の中心位
置Ｂへ移動させ、その中心位置Ｂでエアシリンダ１８の
出力ロッド１９を退行させて揺動アーム１を下降させる
ことにより、アーム荷重受止板７が前記両腕てこ２５の
一方の短腕２５ａに付設したコロ２６に載り掛かるよう
になっている。At this time, the swing arm 1 is stopped at the standby position A with the arm load receiving plate 7 resting on the upper surface of the support boss 6. The output rod 19 of the air cylinder 18 is advanced and the arm support shaft 5 is pushed up to lift the swing arm 1, and then the drive motor 12 is rotated forward to rotate the swing arm 1.
Is moved to the center position B of the substrate 41, and the output rod 19 of the air cylinder 18 is retreated at the center position B to lower the swing arm 1, thereby receiving the arm load. The plate 7 rests on a roller 26 attached to one short arm 25a of the two-arm lever 25.
【００１３】錘載置板２１は、両腕てこ２５を介して揺
動アーム１の下降速度を減速するためのもので、基台４
０に固定具２３を介して立設した昇降案内棒２４に沿っ
て昇降するように設けられており、上記両腕てこ２５の
他方の長腕２５ｂに付設したコロ２７に載り掛かるよう
に構成されている。なお、錘載置板２１に載置される錘
り２２は、適宜重量調整可能に設けられ、少なくとも揺
動アーム１の荷重とアーム支軸５の荷重との和による偶
力モーメントが、当該錘り２２の重量による偶力モーメ
ントよりも若干大きくなるように設定される。また、両
腕てこ２５は、その両端部が支軸２８を中心として垂直
面内で上下方向に揺動可能に支軸用ボス６に支持されて
いる。The weight mounting plate 21 serves to reduce the descending speed of the swing arm 1 via the two-arm lever 25, and
0 is provided so as to ascend and descend along an elevating guide rod 24 erected through a fixture 23, and is configured to rest on a roller 27 attached to the other long arm 25b of the two-arm lever 25. ing. The weight 22 mounted on the weight mounting plate 21 is provided so that the weight can be adjusted appropriately, and a couple moment at least due to the sum of the load of the swing arm 1 and the load of the arm support shaft 5 is determined by the weight. Is set to be slightly larger than the couple moment due to the weight of the rib 22. Further, the both-arm lever 25 is supported by the support boss 6 such that both ends thereof can swing vertically about a support shaft 28 in a vertical plane.
【００１４】また、基台４０に立設した固定金具３０に
は、錘載置板２１の上昇速度を適宜減速する減速シリン
ダ３１及び錘載置板２１の上限位置を規定するストッパ
３２が設けられており、減速シリンダ３１のオリフィス
（図示せず）を適宜調整することで、両腕てこ２５を介
して下降する洗浄ブラシ２の下降速度を所望の速度まで
減速することができるとともに、マイクロメータ３３に
よりストッパ３２の規制位置を微調整することで、洗浄
ブラシ２の下端の位置を適宜設定することができ、これ
により洗浄ブラシ２が基板４１に下降当接する際の衝撃
をなくすように構成されている。The fixing bracket 30 erected on the base 40 is provided with a deceleration cylinder 31 for appropriately reducing the rising speed of the weight mounting plate 21 and a stopper 32 for defining an upper limit position of the weight mounting plate 21. By appropriately adjusting the orifice (not shown) of the reduction cylinder 31, the descent speed of the cleaning brush 2 descending through the both-arm lever 25 can be reduced to a desired speed, and the micrometer 33 can be reduced. By finely adjusting the restricting position of the stopper 32, the position of the lower end of the cleaning brush 2 can be appropriately set, whereby the impact when the cleaning brush 2 descends and contacts the substrate 41 is eliminated. I have.
【００１５】なお、アーム支軸５の支持用ボス６には支
持具３５を介してブラシ回転始動センサ３６が設けら
れ、他方上記錘載置板２１には被検板３７が立設されて
おり、錘載置板２１が一定の高さまで上昇して、センサ
３６が被検板３７を検知することに基づき洗浄ブラシ２
が、基板４１に当接する前に回転始動するように構成さ
れている。The support boss 6 of the arm support shaft 5 is provided with a brush rotation start sensor 36 via a support 35, while the weight mounting plate 21 is provided with a test plate 37 standing upright. When the weight mounting plate 21 rises to a certain height and the sensor 36 detects the test plate 37, the cleaning brush 2
Are configured to start rotating before coming into contact with the substrate 41.
【００１６】以下、上記実施例装置の動作について簡単
に説明する。基板の洗浄動作開始前には、揺動アーム１
は、待機位置Ａで待機しており、この位置Ａでは、アー
ム荷重受止板７は支軸用ボス６の上面に載った状態で停
止している。基板４１の洗浄が行われる場合には、先ず
待機位置Ａでエアシリンダ１８の出力ロッド１９でアー
ム支軸５を押し上げ、次いで駆動モータ１２でアーム支
軸５をその軸線回りに回転させることにより洗浄ブラシ
２を基板４１の中心位置Ｂへ移動させる。The operation of the above embodiment will be briefly described below. Before starting the substrate cleaning operation, the swing arm 1
Are waiting at a standby position A. At this position A, the arm load receiving plate 7 is stopped while resting on the upper surface of the support boss 6. When the substrate 41 is to be cleaned, first, the arm support shaft 5 is pushed up by the output rod 19 of the air cylinder 18 at the standby position A, and then the arm support shaft 5 is rotated by the drive motor 12 around its axis. The brush 2 is moved to the center position B of the substrate 41.
【００１７】次に、その位置Ｂでエアシリンダ１８の出
力ロッド１９を退行させてアーム支軸５を下降させるこ
とにより、アーム荷重受止板７を両腕てこ２５の一方の
コロ２６に載せ掛ける。このときブラシ回転始動センサ
３６が作動して、洗浄ブラシ２が始動回転する。Next, at the position B, the output rod 19 of the air cylinder 18 is retreated and the arm support shaft 5 is lowered, so that the arm load receiving plate 7 is placed on one roller 26 of the two-arm lever 25. . At this time, the brush rotation start sensor 36 is operated, and the cleaning brush 2 starts rotating.
【００１８】一方、錘載置板２１は、両腕てこ２５の他
方のコロ２７に載り掛かっており、アーム支軸５の下降
に伴って、両腕てこ２５を介して押し上げられる。この
とき、錘載置板２１上の錘り２２及び減速シリンダ３１
の出力ロッド３１ａが錘載置板２１の上昇速度を減じる
ように作用するので、短腕２５ａ側に載り掛かっている
アーム荷重受止板７の下降速度は一層減速される。そし
て洗浄ブラシ２は回転しながら基板４１上に緩やかに当
接し、次いであるいは同時に、錘載置板２１がストッパ
３２に当接して下降停止する。これにより、洗浄ブラシ
が基板表面と接触状態で始動回転するのを回避して、基
板の表面に微細な傷が発生するのを防止することができ
る。On the other hand, the weight mounting plate 21 rests on the other roller 27 of the both-arm lever 25 and is pushed up through the both-arm lever 25 as the arm support shaft 5 descends. At this time, the weight 22 on the weight mounting plate 21 and the reduction cylinder 31
Of the arm load receiving plate 7 resting on the short arm 25a side, the lowering speed of the output rod 31a of the arm load receiving plate 21 is further reduced. Then, the cleaning brush 2 gently contacts the substrate 41 while rotating, and then or simultaneously, the weight mounting plate 21 contacts the stopper 32 and stops descending. Thus, the starting rotation of the cleaning brush in contact with the surface of the substrate can be avoided, and the occurrence of minute scratches on the surface of the substrate can be prevented.
【００１９】次に、揺動アーム１の駆動モータ１２を逆
転させることにより、洗浄ブラシ２を回転させた状態で
基板４１の中心位置Ｂから周縁位置Ｃへ向けて移動さ
せ、同時に洗浄液供給ノズル４３から洗浄液を吐出させ
て基板４１全面を洗浄する。そして基板４１の洗浄後
は、当該洗浄ブラシ２を前記待機位置Ａに移動させる。
なお、洗浄ブラシ２が基板の中心位置Ｂから周縁位置Ｃ
へ向けて移動する間、アーム荷重受止板７はコロ２６に
載り掛かったままの状態に維持される。また、基板の洗
浄が不十分な場合等、必要な場合には、洗浄ブラシ２の
持ち上げ、基板の中心位置Ｂへの移動、洗浄ブラシ２の
軟着、基板の周縁位置Ｃへの移動という一連の動作が必
要回数繰り返される。Next, by rotating the drive motor 12 of the swing arm 1 in the reverse direction, the cleaning brush 2 is moved from the center position B to the peripheral position C of the substrate 41 while rotating, and at the same time, the cleaning liquid supply nozzle 43 is rotated. The cleaning liquid is discharged from the substrate 41 to clean the entire surface of the substrate 41. After cleaning the substrate 41, the cleaning brush 2 is moved to the standby position A.
The cleaning brush 2 is moved from the center position B of the substrate to the peripheral position C.
During the movement toward, the arm load receiving plate 7 is maintained in a state of resting on the roller 26. Further, when necessary, such as when the cleaning of the substrate is insufficient, a series of steps of lifting the cleaning brush 2, moving the substrate to the center position B, softly attaching the cleaning brush 2, and moving to the peripheral position C of the substrate. Is repeated as many times as necessary.
【００２０】なお、上記実施例では、洗浄ブラシ２を基
板４１上へ当接させて洗浄する場合について例示した
が、いわゆるハイドロプレーン方式においては、ストッ
パ３２を微調整することにより洗浄ブラシ２を基板４１
よりわずかに浮上させて洗浄することもできる。In the above embodiment, the case where the cleaning brush 2 is brought into contact with the substrate 41 for cleaning is exemplified. However, in the so-called hydroplane system, the cleaning brush 2 is adjusted by finely adjusting the stopper 32. 41
It is also possible to wash with a slightly raised surface.
【００２１】[0021]
【発明の効果】以上の説明で明らかなように、本発明に
よれば、基板表面の中心位置から周縁位置まで回転する
洗浄ブラシを移動させてパーティクル等を基板表面から
掃き出し、回転する基板の強力な遠心力で洗浄液ととも
にパーティクル等を除去することにより、パーティクル
等が遠心力の小さい基板表面の中心部に残留することは
なくなる。また、基板の洗浄後は、当該洗浄ブラシを基
板の周縁より外側に位置する待機位置に移動させること
により、洗浄ブラシが含有する洗浄液の液滴が洗浄後の
基板表面に落下することはないので、洗浄済みの基板に
パーティクル等が再付着するのを防止することができ
る。As is apparent from the above description, according to the present invention, the substrate rotates from the center position to the peripheral position on the substrate surface.
Move the cleaning brush to remove particles from the substrate surface
With the strong centrifugal force of the swept and rotating substrate
Particles are removed by removing particles
Etc. remain at the center of the substrate surface with small centrifugal force.
Disappears. Further, after cleaning the substrate, by moving the cleaning brush to a standby position located outside the peripheral edge of the substrate, droplets of the cleaning liquid contained in the cleaning brush do not fall on the surface of the cleaned substrate. Further, it is possible to prevent particles and the like from re-adhering to the cleaned substrate.
【図１】本発明に係る基板洗浄装置の一実施例を示す機
能説明用側面図である。FIG. 1 is a side view for explaining functions of an embodiment of a substrate cleaning apparatus according to the present invention.
【図２】本発明に係る基板洗浄装置の斜視図である。FIG. 2 is a perspective view of a substrate cleaning apparatus according to the present invention.
１…洗浄ブラシ支持手段（揺動アーム）、２…洗浄ブラ
シ、３…洗浄ブラシ回転手段（駆動モータ）、１１・１
７…洗浄ブラシ移動手段（アーム支軸の回転駆動手段及
び昇降駆動手段）、４１…基板、４３…洗浄液供給手段
（洗浄液供給ノズル）、Ａ…待機位置、Ｂ…基板の中心
位置、Ｃ…基板の周縁位置。DESCRIPTION OF SYMBOLS 1 ... Cleaning brush support means (swinging arm), 2 ... Cleaning brush, 3 ... Cleaning brush rotation means (drive motor), 11.1
7: cleaning brush moving means (rotation driving means and lifting / lowering driving means of arm support shaft), 41: substrate, 43: cleaning liquid supply means (cleaning liquid supply nozzle), A: standby position, B: center position of substrate, C: substrate Marginal position of.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭57−90941（ＪＰ，Ａ) 特開 昭62−125632（ＪＰ，Ａ) 特開 昭62−128125（ＪＰ，Ａ) 特開 昭61−131460（ＪＰ，Ａ) 特開 昭62−181134（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-57-90941 (JP, A) JP-A-62-125632 (JP, A) JP-A-62-128125 (JP, A) JP-A-61-125 131460 (JP, A) JP-A-62-181134 (JP, A)
Claims (1)
動させて基板表面を洗浄する基板洗浄装置において、 垂直軸を中心として回転可能に前記洗浄ブラシを垂下支
持する洗浄ブラシ支持手段と、 前記洗浄ブラシを回転させる洗浄ブラシ回転手段と、 前記洗浄ブラシ支持手段を駆動することにより、前記洗
浄ブラシを基板表面から離隔した状態で前記基板の回転
中心と対向する中心位置まで移動させた後、基板と当接
する位置まで下降させ、前記洗浄ブラシと基板表面とが
当接した状態で前記基板の周縁と対向する周縁位置まで
移動させ、その後前記洗浄ブラシが前記基板の周縁より
外側に位置する待機位置まで前記洗浄ブラシを移動させ
る洗浄ブラシ移動手段と、 前記基板の表面に洗浄液を供給する洗浄液供給手段と、
を具備することを特徴とする基板洗浄装置。1. A substrate cleaning apparatus for cleaning a substrate surface by moving a cleaning brush on a surface of a rotating substrate, wherein: a cleaning brush supporting means for suspending the cleaning brush so as to be rotatable about a vertical axis; a cleaning brush rotating means for rotating the cleaning brush, by driving the cleaning brush supporting means, after moving to the center position facing the rotation center of the substrate while spaced apart the cleaning brush from the substrate surface, the substrate Abut
The cleaning brush and the substrate surface
While abutting to the peripheral position facing the periphery of the substrate
The moved, and then the cleaning liquid supply means for supplying a cleaning brush moving means for moving the cleaning brush to the standby position, the cleaning liquid on the surface of the substrate to the cleaning brush is located outside the periphery of the substrate,
A substrate cleaning apparatus comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16922394A JP2727413B2 (en) | 1994-07-21 | 1994-07-21 | Substrate cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16922394A JP2727413B2 (en) | 1994-07-21 | 1994-07-21 | Substrate cleaning device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16567894A Division JP2618834B2 (en) | 1994-07-19 | 1994-07-19 | Substrate cleaning method and substrate cleaning apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07169725A JPH07169725A (en) | 1995-07-04 |
| JP2727413B2 true JP2727413B2 (en) | 1998-03-11 |
Family
ID=15882508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16922394A Expired - Lifetime JP2727413B2 (en) | 1994-07-21 | 1994-07-21 | Substrate cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2727413B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4423289B2 (en) * | 2004-04-06 | 2010-03-03 | 東京エレクトロン株式会社 | Substrate cleaning apparatus, substrate cleaning method, and medium recording program used for the method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5790941A (en) * | 1980-11-27 | 1982-06-05 | Toshiba Corp | Swing type vertical washer |
| JPS62125632A (en) * | 1985-11-26 | 1987-06-06 | Ricoh Co Ltd | Cleaning method for substrate of glass wafer, optical disc substrate or the like |
| JPS62128125A (en) * | 1985-11-29 | 1987-06-10 | Canon Inc | Wafer washing apparatus |
-
1994
- 1994-07-21 JP JP16922394A patent/JP2727413B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07169725A (en) | 1995-07-04 |
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