JP2618834B2 - Substrate cleaning method and substrate cleaning apparatus - Google Patents
Substrate cleaning method and substrate cleaning apparatusInfo
- Publication number
- JP2618834B2 JP2618834B2 JP16567894A JP16567894A JP2618834B2 JP 2618834 B2 JP2618834 B2 JP 2618834B2 JP 16567894 A JP16567894 A JP 16567894A JP 16567894 A JP16567894 A JP 16567894A JP 2618834 B2 JP2618834 B2 JP 2618834B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cleaning brush
- cleaning
- rotating
- brush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title claims description 125
- 239000000758 substrate Substances 0.000 title claims description 112
- 238000000034 method Methods 0.000 title claims description 8
- 239000007788 liquid Substances 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 20
- 239000002245 particle Substances 0.000 description 16
- 238000005406 washing Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000010408 sweeping Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、例えば半導体ウエハ
やフォトマスク用ガラス板等（以下単に基板と称する）
を洗浄する基板洗浄方法及び基板洗浄装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a semiconductor wafer, a glass plate for a photomask, etc. (hereinafter simply referred to as a substrate).
The present invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning substrates.
【０００２】[0002]
【従来の技術】この種の基板洗浄技術としては、従来よ
り例えば特開昭５７−９０９４１号公報に開示されたス
イング式縦型洗浄装置が知られている。それは、基板を
吸着保持して回転する吸着チャックと、基板の洗浄面に
垂直に当接された回転ブラシと、回転ブラシを回転させ
るモータと、基板の直径方向に沿って上記回転ブラシを
前後進（スイング）させる駆動機構とを具備して成り、
回転する基板表面上で当該基板の直径方向に回転ブラシ
を当接させて往復移動させることにより、基板の表面を
洗浄するように構成されている。2. Description of the Related Art As a substrate cleaning technique of this type, a swing type vertical cleaning apparatus disclosed in, for example, Japanese Patent Laid-Open No. 57-90941 has been conventionally known. It is a suction chuck that holds and rotates a substrate, a rotating brush that is in vertical contact with the cleaning surface of the substrate, a motor that rotates the rotating brush, and a forward / backward movement of the rotating brush along the diameter direction of the substrate. (Swing) drive mechanism,
The surface of the substrate is cleaned by rotating and reciprocating the rotating brush in the diameter direction of the substrate on the surface of the rotating substrate.
【０００３】[0003]
【発明が解決しようとする課題】上記従来例では、回転
する基板表面上で当該基板の直径方向に回転ブラシを当
接させて往復移動させるように構成されているので、回
転ブラシが周縁位置から中心位置へ移動する際に、一度
基板から除去したパーティクル等を基板の中心部へ持ち
込むことになり、パーティクル等が遠心力の小さい基板
中心部に残留してしまうという難点がある。本発明はこ
のような事情に鑑みてなされたもので、基板上からパー
ティクル等を掃き出すことにより、パーティクル等が基
板中心部に残留する不都合を解消すことを技術課題とす
る。In the above-mentioned conventional example, since the rotating brush is abutted on the surface of the rotating substrate in the diameter direction of the substrate to reciprocate, the rotating brush is moved from the peripheral position. When moving to the center position, particles and the like once removed from the substrate are brought to the center of the substrate, and there is a problem that the particles and the like remain at the center of the substrate where the centrifugal force is small. The present invention has been made in view of such circumstances, and it is an object of the present invention to eliminate the inconvenience of particles and the like remaining at the center of the substrate by sweeping the particles and the like from the substrate.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するた
め、請求項１の発明は、回転する基板の表面に、洗浄液
を供給するとともに、洗浄ブラシを移動させて基板表面
を洗浄する基板洗浄方法において、前記洗浄ブラシを前
記基板表面から離隔した状態で基板の回転中心と対向す
る中心位置まで移動させる第１ステップと、前記洗浄ブ
ラシをその下端が基板の回転中心と当接する位置まで下
降させる第２ステップと、前記洗浄ブラシと前記基板の
表面とが当接した状態で前記洗浄ブラシを前記基板の周
縁と対向する周縁位置まで移動させる第３ステップとを
備える基板洗浄方法である。According to a first aspect of the present invention, there is provided a substrate cleaning method for supplying a cleaning liquid to a rotating substrate surface and moving a cleaning brush to clean the substrate surface. In the first step, the cleaning brush is moved to a central position facing the rotation center of the substrate in a state of being separated from the substrate surface, and the cleaning brush is lowered to a position where the lower end of the cleaning brush contacts the rotation center of the substrate. A substrate cleaning method comprising: two steps; and a third step of moving the cleaning brush to a peripheral position facing the peripheral edge of the substrate while the cleaning brush and the surface of the substrate are in contact with each other.
【０００５】また、請求項２の発明は、請求項１に記載
の基板洗浄方法において、第１ステップ、第２ステッ
プ、第３ステップを複数回繰り返す基板洗浄方法であ
る。According to a second aspect of the present invention, there is provided the substrate cleaning method according to the first aspect, wherein the first step, the second step, and the third step are repeated a plurality of times.
【０００６】さらに、請求項３の発明は、回転する基板
の表面上に洗浄ブラシを移動させて基板表面を洗浄する
基板洗浄装置において、垂直軸を中心として回転可能に
前記洗浄ブラシを垂下支持する洗浄ブラシ支持手段と、
前記洗浄ブラシを回転させる洗浄ブラシ回転手段と、前
記洗浄ブラシ支持手段を駆動することにより、前記洗浄
ブラシを前記基板の回転中心と対向する中心位置まで移
動させた後、基板と当接する位置まで下降させ、前記洗
浄ブラシと基板表面とが当接した状態で前記基板の周縁
と対向する周縁位置まで移動させる洗浄ブラシ移動手段
と、前記基板の表面に洗浄液を供給する洗浄液供給手段
とを具備する基板洗浄装置である。Further, according to a third aspect of the present invention, in the substrate cleaning apparatus for cleaning the substrate surface by moving the cleaning brush on the surface of the rotating substrate, the cleaning brush is supported so as to be rotatable about a vertical axis. Cleaning brush support means,
By driving the cleaning brush rotating means for rotating the cleaning brush and the cleaning brush supporting means, the cleaning brush is moved to a center position opposed to the rotation center of the substrate, and then lowered to a position in contact with the substrate. And a cleaning liquid supply unit for supplying a cleaning liquid to the surface of the substrate, the cleaning brush moving unit moving the cleaning brush to a peripheral position facing the peripheral edge of the substrate in a state where the cleaning brush and the substrate surface are in contact with each other. It is a cleaning device.
【０００７】[0007]
【作用】請求項１の発明では、回転する基板の表面に洗
浄液を供給しつつ、洗浄ブラシを移動させて基板表面を
洗浄するが、その際に、第１ステップで洗浄ブラシを基
板表面から離隔した状態で基板の回転中心と対向する中
心位置まで移動させ、第２ステップで前記洗浄ブラシを
その下端が基板の回転中心と当接する位置まで下降さ
せ、引き続き第３ステップで洗浄ブラシと基板の表面と
が当接した状態で、基板の周縁と対向する位置まで洗浄
ブラシを移動させる。つまり、洗浄ブラシを基板表面の
中心位置から周縁位置まで移動させてパーティクル等を
基板表面から掃き出すとともに、回転する基板の強力な
遠心力で洗浄液とともにパーティクル等を除去する。According to the first aspect of the present invention, the cleaning brush is moved to clean the substrate surface while supplying the cleaning liquid to the surface of the rotating substrate. At this time, the cleaning brush is separated from the substrate surface in the first step. The cleaning brush is moved to a center position opposed to the rotation center of the substrate in a state where the cleaning brush is moved down to a position where the lower end of the cleaning brush contacts the rotation center of the substrate in a second step. The cleaning brush is moved to a position facing the peripheral edge of the substrate in a state where they are in contact with each other. That is, the cleaning brush is moved from the center position to the peripheral position of the substrate surface to sweep out particles and the like from the substrate surface, and the centrifugal force of the rotating substrate removes the particles and the like together with the cleaning liquid.
【０００８】また、請求項２の発明では、上記第１ステ
ップ〜第３ステップを複数回繰り返すことにより、パー
ティクル等を基板表面から完全に掃き出す。In the invention of claim 2, particles and the like are completely swept out of the substrate surface by repeating the first to third steps a plurality of times.
【０００９】さらに、請求項３の発明においても、回転
する基板の表面に洗浄液供給手段で洗浄液を供給しつ
つ、回転する洗浄ブラシを洗浄ブラシ移動手段で基板の
表面上を移動させて洗浄するが、その際に、洗浄ブラシ
を基板の回転中心と対向する中心位置まで移動させた
後、基板と当接する位置まで下降させ、洗浄ブラシと基
板表面とが当接した状態で前記基板の周縁と対向する周
縁位置まで移動させる。つまり、回転する洗浄ブラシを
基板表面の中心位置から周縁位置まで移動させてパーテ
ィクル等を基板表面から掃き出し、回転する基板の強力
な遠心力で洗浄液とともにパーティクル等を除去する。Further, in the present invention, the cleaning brush is moved by the cleaning brush moving means to clean the surface of the rotating substrate while the cleaning liquid is supplied to the surface of the rotating substrate by the cleaning liquid supply means. At that time, after moving the cleaning brush to a center position facing the rotation center of the substrate, it is lowered to a position where it contacts the substrate, and the cleaning brush and the substrate surface face the peripheral edge of the substrate in the contact state. Move to the peripheral position. That is, the rotating cleaning brush is moved from the center position to the peripheral position of the substrate surface to sweep particles and the like from the substrate surface, and remove the particles and the like together with the cleaning liquid by the strong centrifugal force of the rotating substrate.
【００１０】[0010]
【実施例】以下、図１及び図２に基づいて説明する。こ
こで、図１は本発明の一実施例であって、基板洗浄装置
の機能説明用側面図、図２はその斜視図である。この基
板洗浄装置は、洗浄ブラシ支持手段と、洗浄ブラシ回転
手段と、洗浄ブラシ移動手段は、洗浄液供給手段とを具
備している。ここで、後述する揺動アーム１は洗浄ブラ
シ支持手段に該当し、駆動モータ３は洗浄ブラシ回転手
段に該当し、アーム支軸５の回転駆動手段１１及び昇降
駆動手段１７は洗浄ブラシ移動手段に該当し、洗浄液供
給ノズル４３は洗浄液供給手段に該当する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A description will be given below with reference to FIGS. Here, FIG. 1 is an embodiment of the present invention, and a side view for explaining a function of a substrate cleaning apparatus, and FIG. 2 is a perspective view thereof. This substrate cleaning apparatus includes cleaning brush support means, cleaning brush rotating means, and cleaning brush moving means, and cleaning liquid supply means. Here, the swing arm 1 described later corresponds to the cleaning brush support means, the drive motor 3 corresponds to the cleaning brush rotating means, and the rotation driving means 11 and the elevation driving means 17 of the arm support shaft 5 correspond to the cleaning brush moving means. The cleaning liquid supply nozzle 43 corresponds to a cleaning liquid supply unit.
【００１１】この実施例装置は回転可能に設けた洗浄ブ
ラシ２を垂下支持し、水平揺動可能に設けられた揺動ア
ーム１と、揺動アーム１をその上端部に支持し、回転及
び昇降可能に設けられたアーム支軸５と、アーム支軸５
を位置制御可能に回転駆動する回転駆動手段１１と、ア
ーム支軸５を昇降駆動する昇降駆動手段１７と、アーム
支軸５に固定され揺動アーム１の荷重を受け止めるアー
ム荷重受止板７と、アーム１の減速下降用の錘り２２を
載置し、昇降可能に設けられた錘載置板２１と、その両
端部が上下方向に揺動可能に支持された両腕てこ２５
と、錘載置板２１の上昇速度を減速する減速シリンダ３
１と、錘載置板２１の上昇位置を微調整可能に規制する
ストッパ３２とを具備して成り、洗浄ブラシ２の、基板
表面への当接に際し、アーム荷重受止板７を両腕てこ２
５の一方の腕２５ａに載せ掛けるとともに、錘載置板２
１を他方の腕２５ｂに載せ掛けてアーム支軸５の下降速
度を減速することにより、スピンチャック４２の上面に
保持された基板４１上へ、洗浄ブラシ２を緩やかに当接
するように構成されている。なお、図１中符号４３は純
水等の洗浄液供給ノズルを示す。In this embodiment, a cleaning brush 2 rotatably provided is suspended, and a swing arm 1 provided so as to be horizontally swingable, and the swing arm 1 is supported at an upper end thereof, are rotated and moved up and down. Arm support shaft 5 provided so as to be capable of being provided, and arm support shaft 5
A rotary driving means 11 for rotating and driving the arm support shaft 5, an elevating drive means 17 for driving the arm support shaft 5 up and down, an arm load receiving plate 7 fixed to the arm support shaft 5 and receiving the load of the swing arm 1. , A weight mounting plate 21 on which a weight 22 for decelerating and descending the arm 1 is mounted and which can be moved up and down, and both arm levers 25 whose both ends are supported to be vertically swingable.
And a reduction cylinder 3 for reducing the rising speed of the weight mounting plate 21
1 and a stopper 32 for finely adjusting the ascending position of the weight placing plate 21. When the cleaning brush 2 comes into contact with the substrate surface, the arm load receiving plate 7 is lifted with both arms. Two
5 on one arm 25a and the weight placing plate 2
1 is placed on the other arm 25b to reduce the descending speed of the arm support shaft 5, so that the cleaning brush 2 is gently brought into contact with the substrate 41 held on the upper surface of the spin chuck 42. There is. In FIG. 1, reference numeral 43 denotes a nozzle for supplying a cleaning liquid such as pure water.
【００１２】洗浄ブラシ２は揺動アーム１の先端側に回
転自在に垂下支持されており、揺動アーム１の基端側に
配置した駆動モータ３によって伝動ベルト４を介して回
転駆動される。なお、洗浄ブラシ２はスポンジ状のも
の、羽毛状のもの等、洗浄工程等に応じて適宜選択して
使用され、また、同様に洗浄工程等により、必ずしも回
転式のものを使用する必要はない。揺動アーム１はその
基端部がアーム支軸５の上端部に固定され、アーム支軸
５を中心として水平回転可能に、かつ、アーム支軸５を
昇降することにより昇降自在に設けられている。The cleaning brush 2 is rotatably supported on the tip end side of the swing arm 1 and rotatably driven by a drive motor 3 disposed on the base end side of the swing arm 1 via a transmission belt 4. Note that the cleaning brush 2 is appropriately selected and used depending on a cleaning step or the like, such as a sponge-shaped one or a feather-shaped one. Similarly, it is not always necessary to use a rotary brush for the cleaning step or the like. . The swing arm 1 has its base end fixed to the upper end of the arm support shaft 5 and is provided so as to be horizontally rotatable about the arm support shaft 5 and to be able to move up and down by moving the arm support shaft 5 up and down. There is.
【００１３】アーム支軸５は、基台４０上に固定した支
軸用ボス６に回転及び昇降自在に支持されており、この
アーム支軸５にはボス６の上方に位置する部位にアーム
荷重受止板７が固定されるとともに、基台４０を貫通し
た下部に、スプラインスリーブ８を介して従動プーリ１
０が連結されている。即ち、アーム支軸５の下部はスプ
ライン軸５ｂになっており、このスプライン軸５ｂにス
プラインスリーブ８を外嵌し、スプラインスリーブ８を
軸受９を介して回転可能に基台４０へ支持し、スプライ
ンスリーブ８のプーリ固定軸８ｂに従動プーリ１０が固
定されている。The arm support shaft 5 is supported by a support boss 6 fixed on a base 40 so as to be rotatable and vertically movable. The arm support shaft 5 has an arm load on a portion located above the boss 6. The receiving plate 7 is fixed, and the driven pulley 1 is provided below the penetrating base 40 via a spline sleeve 8.
0 is linked. That is, a lower portion of the arm support shaft 5 is a spline shaft 5b, and a spline sleeve 8 is externally fitted to the spline shaft 5b, and the spline sleeve 8 is rotatably supported via a bearing 9 to a base 40. A driven pulley 10 is fixed to a pulley fixing shaft 8 b of the sleeve 8.
【００１４】アーム支軸５の回転駆動手段１１は、駆動
プーリ１３及び伝動ベルト１４を介して従動プーリ１０
を正逆転駆動する駆動モータ１２と、位置制御用のセン
サ１５Ａ・１５Ｂ・１５Ｃを具備して成り、揺動アーム
１の先端に取り付けられた洗浄ブラシ２の位置につい
て、待機位置Ａ、基板４１の中心位置Ｂ、基板４１の周
縁位置Ｃを検出して位置制御するように構成されてい
る。なお符号１６Ａ・１６Ｂ・１６Ｃはそれぞれ所定位
置にスリットが付設された円板を示す。The rotation driving means 11 of the arm support shaft 5 is provided with a driven pulley 10 via a driving pulley 13 and a transmission belt 14.
And a position control sensor 15A, 15B, and 15C. The position of the cleaning brush 2 attached to the tip of the swing arm 1 is determined by the standby position A and the position of the substrate 41. The position is controlled by detecting the center position B and the peripheral position C of the substrate 41. Reference numerals 16A, 16B, and 16C denote discs each having a slit provided at a predetermined position.
【００１５】昇降駆動手段１７は、基台４０の下側にエ
アシリンダ１８を固定し、エアシリンダ１８の出力ロッ
ド１９をアーム支軸５の下端（スプライン軸５ｂ）に押
し当てて進退させることにより、揺動アーム１を昇降駆
動するように構成されている。なお、符号２０Ａ・２０
Ｂは、出力ロッド１９の進退位置を検知するセンサを示
し、出力ロッド１９の進退ストロークに沿って付設され
ている。The lifting drive means 17 fixes the air cylinder 18 below the base 40, and pushes the output rod 19 of the air cylinder 18 against the lower end (spline shaft 5b) of the arm support shaft 5 to move forward and backward. The swing arm 1 is configured to be moved up and down. Note that reference numerals 20A and 20
B indicates a sensor for detecting the advance / retreat position of the output rod 19, and is provided along the advance / retreat stroke of the output rod 19.
【００１６】ここで、揺動アーム１は、待機位置Ａでは
アーム荷重受止板７が支軸ボス６の上面に載った状態で
停止しており、基板４１の洗浄に際して、先ず待機位置
Ａでエアシリンダ１８の出力ロッド１９を進出させてア
ーム支軸５を押し上げることにより揺動アーム１を持ち
上げ、次いで駆動モータ１２を正転させて揺動アーム１
の先端に取付けられた洗浄ブラシ２を基板４１の中心位
置Ｂへ移動させ、その中心位置Ｂでエアシリンダ１８の
出力ロッド１９を退行させて揺動アーム１を下降させる
ことにより、アーム荷重受止板７が前記両腕てこ２５の
一方の短腕２５ａに付設したコロ２６に載り掛かるよう
になっている。At the standby position A, the swing arm 1 is stopped with the arm load receiving plate 7 placed on the upper surface of the support shaft boss 6, and when cleaning the substrate 41, the swing arm 1 is first moved to the standby position A. The output rod 19 of the air cylinder 18 is advanced and the arm support shaft 5 is pushed up to lift the swing arm 1, and then the drive motor 12 is rotated forward to rotate the swing arm 1.
By moving the cleaning brush 2 attached to the tip of the base plate to the central position B of the substrate 41, retracting the output rod 19 of the air cylinder 18 and lowering the swing arm 1 at the central position B, the arm load is received. The plate 7 rests on a roller 26 attached to one short arm 25a of the two-arm lever 25.
【００１７】錘載置板２１は、両腕てこ２５を介して揺
動アーム１の下降速度を減速するためのもので、基台４
０に固定具２３を介して立設した昇降案内棒２４に沿っ
て昇降するように設けられており、上記両腕てこ２５の
他方の長腕２５ｂに付設したコロ２７に載り掛かるよう
に構成されている。なお、錘載置板２１に載置される錘
り２２は、適宜重量調整可能に設けられ、少なくとも揺
動アーム１の荷重とアーム支軸５の荷重との和による偶
力モーメントが、当該錘り２２の重量による偶力モーメ
ントよりも若干大きくなるように設定される。また、両
腕てこ２５は、その両端部が支軸２８を中心として垂直
面内で上下方向に揺動可能に支軸用ボス６に支持されて
いる。The weight mounting plate 21 is used to reduce the lowering speed of the swing arm 1 via the two-arm lever 25, and
0 is provided so as to be lifted and lowered along a lifting guide rod 24 erected via a fixture 23, and is configured to rest on a roller 27 attached to the other long arm 25b of the both arm levers 25. ing. The weight 22 mounted on the weight mounting plate 21 is provided so that the weight can be adjusted appropriately, and a couple moment at least due to the sum of the load of the swing arm 1 and the load of the arm support shaft 5 is determined by the weight. It is set to be slightly larger than the couple moment due to the weight of the ball 22. Further, the both-arm lever 25 is supported by the support boss 6 such that both ends thereof can swing vertically about a support shaft 28 in a vertical plane.
【００１８】また、基台４０に立設した固定金具３０に
は、錘載置板２１の上昇速度を適宜減速する減速シリン
ダ３１及び錘載置板２１の上限位置を規定するストッパ
３２が設けられており、減速シリンダ３１のオリフィス
（図示せず）を適宜調整することで、両腕てこ２５を介
して下降する洗浄ブラシ２の下降速度を所望の速度まで
減速することができるとともに、マイクロメータ３３に
よりストッパ３２の規制位置を微調整することで、洗浄
ブラシ２の下端の位置を適宜設定することができ、これ
により洗浄ブラシ２が基板４１に下降当接する際の衝撃
をなくすように構成されている。Further, the fixing metal fitting 30 provided upright on the base 40 is provided with a deceleration cylinder 31 for appropriately reducing the rising speed of the weight mounting plate 21 and a stopper 32 for defining the upper limit position of the weight mounting plate 21. By appropriately adjusting the orifice (not shown) of the reduction cylinder 31, the descent speed of the cleaning brush 2 descending through the both-arm lever 25 can be reduced to a desired speed, and the micrometer 33 can be reduced. By finely adjusting the restriction position of the stopper 32, the position of the lower end of the cleaning brush 2 can be appropriately set, and thereby the impact when the cleaning brush 2 is brought into abutting contact with the substrate 41 is eliminated. I have.
【００１９】なお、アーム支軸５の支持用ボス６には支
持具３５を介してブラシ回転始動センサ３６が設けら
れ、他方上記錘載置板２１には被検板３７が立設されて
おり、錘載置板２１が一定の高さまで上昇して、センサ
３６が被検板３７を検知することに基づき洗浄ブラシ２
が、基板４１に当接する前に回転始動するように構成さ
れている。A brush rotation start sensor 36 is provided on the support boss 6 of the arm support shaft 5 via a support 35, and a test plate 37 is set up on the weight mounting plate 21. When the weight mounting plate 21 rises to a certain height and the sensor 36 detects the test plate 37, the cleaning brush 2
However, it is configured to start rotating before coming into contact with the substrate 41.
【００２０】以下、上記実施例装置の動作について簡単
に説明する。基板の洗浄動作開始前には、揺動アーム１
は、待機位置Ａで待機しており、この位置Ａでは、アー
ム荷重受止板７は支軸用ボス６の上面に載った状態で停
止している。基板４１の洗浄が行われる場合には、先ず
待機位置Ａでエアシリンダ１８の出力ロッド１９でアー
ム支軸５を押し上げ、次いで駆動モータ１２でアーム支
軸５をその軸線回りに回転させることにより洗浄ブラシ
２を基板４１の中心位置Ｂへ移動させる。The operation of the apparatus of the above embodiment will be briefly described below. Before starting the substrate cleaning operation, the swing arm 1
Stands by at the standby position A, and at this position A, the arm load receiving plate 7 is stopped while resting on the upper surface of the spindle boss 6. When the substrate 41 is to be cleaned, first, the arm support shaft 5 is pushed up by the output rod 19 of the air cylinder 18 at the standby position A, and then the arm support shaft 5 is rotated by the drive motor 12 around its axis. The brush 2 is moved to the center position B of the substrate 41.
【００２１】次に、その位置Ｂでエアシリンダ１８の出
力ロッド１９を退行させてアーム支軸５を下降させるこ
とにより、アーム荷重受止板７を両腕てこ２５の一方の
コロ２６に載せ掛ける。このときブラシ回転始動センサ
３６が作動して、洗浄ブラシ２が始動回転する。Next, at the position B, the output rod 19 of the air cylinder 18 is retracted and the arm support shaft 5 is lowered to mount the arm load receiving plate 7 on one roller 26 of both arm levers 25. . At this time, the brush rotation start sensor 36 is operated, and the cleaning brush 2 starts rotating.
【００２２】一方、錘載置板２１は、両腕てこ２５の他
方のコロ２７に載り掛かっており、アーム支軸５の下降
に伴って、両腕てこ２５を介して押し上げられる。この
とき、錘載置板２１上の錘り２２及び減速シリンダ３１
の出力ロッド３１ａが錘載置板２１の上昇速度を減じる
ように作用するので、短腕２５ａ側に載り掛かっている
アーム荷重受止板７の下降速度は一層減速される。そし
て洗浄ブラシ２は回転しながら基板４１上に緩やかに当
接し、次いであるいは同時に、錘載置板２１がストッパ
３２に当接して下降停止する。これにより、洗浄ブラシ
が基板表面と接触状態で始動回転するのを回避して、基
板の表面に微細な傷が発生するのを防止することができ
る。On the other hand, the weight mounting plate 21 rests on the other roller 27 of the both arm levers 25 and is pushed up via the both arm levers 25 as the arm support shaft 5 descends. At this time, the weight 22 on the weight mounting plate 21 and the reduction cylinder 31
Of the arm load receiving plate 7 resting on the short arm 25a side, the lowering speed of the output rod 31a of the arm load receiving plate 21 is further reduced. Then, the cleaning brush 2 gently contacts the substrate 41 while rotating, and then or simultaneously, the weight mounting plate 21 contacts the stopper 32 and stops descending. As a result, it is possible to prevent the cleaning brush from starting and rotating in contact with the surface of the substrate, and prevent generation of fine scratches on the surface of the substrate.
【００２３】次に、揺動アーム１の駆動モータ１２を逆
転させることにより、洗浄ブラシ２を回転させた状態
で、基板４１の中心位置Ｂから周縁位置Ｃへ向けて移動
させ、同時に洗浄液供給ノズル４３から洗浄液を吐出さ
せて基板４１全面を洗浄する。そして基板４１の洗浄後
は、当該洗浄ブラシ２を前記待機位置Ａに移動させる。
なお、洗浄ブラシ２がＢ位置からＣ位置へ向けて移動す
る間、アーム荷重受止板７はコロ２６に載り掛かったま
まの状態に維持される。また、基板の洗浄が不十分な場
合等、必要な場合には、洗浄ブラシ２の持ち上げ、基板
中心位置Ｂへの移動、洗浄ブラシ２の軟着、基板周縁位
置Ｃへの移動という一連の動作が必要回数繰り返され
る。Next, by rotating the drive motor 12 of the swing arm 1 in the reverse direction, the washing brush 2 is moved from the center position B to the peripheral position C of the substrate 41 while rotating, and at the same time, the cleaning liquid supply nozzle is rotated. The cleaning liquid is discharged from 43 to clean the entire surface of the substrate 41. Then, after cleaning the substrate 41, the cleaning brush 2 is moved to the standby position A.
While the cleaning brush 2 moves from the B position to the C position, the arm load receiving plate 7 is maintained on the roller 26. If necessary, for example, when the cleaning of the substrate is insufficient, the cleaning brush 2 is lifted, moved to the substrate center position B, the cleaning brush 2 is softly attached, and the substrate is moved to the peripheral position C. Is repeated as many times as necessary.
【００２４】なお、上記実施例では、洗浄ブラシ２を基
板４１上へ当接させて洗浄する場合について例示した
が、いわゆるハイドロプレーン方式においては、ストッ
パ３２を微調整することにより洗浄ブラシ２を基板４１
よりわずかに浮上させて洗浄することもできる。In the above embodiment, the cleaning brush 2 is brought into contact with the substrate 41 for cleaning, but in the so-called hydroplane system, the cleaning brush 2 is cleaned by finely adjusting the stopper 32. 41
It can also be floated slightly and washed.
【００２５】[0025]
【発明の効果】以上の説明で明らかなように、本発明に
よれば以下の効果を奏する。請求項１の発明では、基板
表面の中心位置から周縁位置まで洗浄ブラシを移動させ
てパーティクル等を基板表面から掃き出すとともに、回
転する基板の強力な遠心力で洗浄液とともにパーティク
ル等を除去することにより、パーティクル等が遠心力の
小さい基板表面の中心部に残留することはなくなる。As is apparent from the above description, the present invention has the following effects. In the invention of claim 1, by moving the cleaning brush from the center position of the substrate surface to the peripheral position to sweep out particles and the like from the substrate surface, and by removing the particles and the like together with the cleaning liquid by the strong centrifugal force of the rotating substrate, Particles and the like do not remain at the center of the substrate surface having a small centrifugal force.
【００２６】また、請求項２の発明では、上記掃き出し
を複数回繰り返すことにより、パーティクル等を基板表
面から完全に掃き出すことができる。According to the second aspect of the present invention, particles and the like can be completely swept out of the substrate surface by repeating the sweeping operation a plurality of times.
【００２７】請求項３の発明においても、基板表面の中
心位置から周縁位置まで回転する洗浄ブラシを移動させ
てパーティクル等を基板表面から掃き出し、回転する基
板の強力な遠心力で洗浄液とともにパーティクル等を除
去することにより、パーティクル等が遠心力の小さい基
板表面の中心部に残留することはなくなる。Also in the invention of claim 3, the cleaning brush rotating from the central position to the peripheral position of the substrate surface is moved to sweep out particles and the like from the substrate surface, and the powerful centrifugal force of the rotating substrate removes the particles and the like together with the cleaning liquid. By the removal, particles and the like do not remain at the center of the substrate surface having a small centrifugal force.
【図１】本発明に係る基板洗浄装置の一実施例を示す機
能説明用側面図である。FIG. 1 is a side view for explaining functions of an embodiment of a substrate cleaning apparatus according to the present invention.
【図２】本発明に係る基板洗浄装置の斜視図である。FIG. 2 is a perspective view of a substrate cleaning apparatus according to the present invention.
１…洗浄ブラシ支持手段（揺動アーム）、２…洗浄ブラ
シ、３…洗浄ブラシ回転手段（駆動モータ）、１１・１
７…洗浄ブラシ移動手段（アーム支軸の回転駆動手段及
び昇降駆動手段）、４１…基板、４３…洗浄液供給手段
（洗浄液供給ノズル）、Ｂ…基板の中心位置、Ｃ…基板
の周縁位置。DESCRIPTION OF SYMBOLS 1 ... Washing brush support means (swinging arm), 2 ... Washing brush, 3 ... Washing brush rotating means (driving motor), 11.1.
7: Cleaning brush moving means (rotation driving means and lifting / lowering driving means of arm support shaft), 41: substrate, 43: cleaning liquid supply means (cleaning liquid supply nozzle), B: center position of substrate, C: peripheral position of substrate.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−131460（ＪＰ，Ａ) 特開 昭62−128125（ＪＰ，Ａ) 特開 昭62−181134（ＪＰ，Ａ) 特開 昭62−125632（ＪＰ，Ａ) 特開 昭57−90941（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-131460 (JP, A) JP-A-62-128125 (JP, A) JP-A-62-181134 (JP, A) JP-A-62-181134 125632 (JP, A) JP-A-57-90941 (JP, A)
Claims (3)
るとともに、洗浄ブラシを移動させて基板表面を洗浄す
る基板洗浄方法において、 前記洗浄ブラシを前記基板表面から離隔した状態で基板
の回転中心と対向する中心位置まで移動させる第１ステ
ップと、 前記洗浄ブラシをその下端が基板の回転中心と当接する
位置まで下降させる第２ステップと、 前記洗浄ブラシと前記基板の表面とが当接した状態で前
記洗浄ブラシを前記基板の周縁と対向する周縁位置まで
移動させる第３ステップと、 を備える基板洗浄方法。1. A substrate cleaning method for supplying a cleaning liquid to a surface of a rotating substrate and moving a cleaning brush to clean the substrate surface, wherein the cleaning brush is separated from the substrate surface and the rotation center of the substrate is rotated. A first step of moving the cleaning brush to a central position opposite to the second position, a second step of lowering the cleaning brush to a position where the lower end of the cleaning brush contacts the rotation center of the substrate, and a state in which the cleaning brush contacts the surface of the substrate. A third step of moving the cleaning brush to a peripheral position facing a peripheral edge of the substrate.
ップを複数回繰り返す請求項１に記載の基板洗浄方法。2. The substrate cleaning method according to claim 1, wherein the first, second, and third steps are repeated a plurality of times.
動させて基板表面を洗浄する基板洗浄装置において、 垂直軸を中心として回転可能に前記洗浄ブラシを垂下支
持する洗浄ブラシ支持手段と、 前記洗浄ブラシを回転させる洗浄ブラシ回転手段と、 前記洗浄ブラシ支持手段を駆動することにより、前記洗
浄ブラシを前記基板の回転中心と対向する中心位置まで
移動させた後、基板と当接する位置まで下降させ、前記
洗浄ブラシと基板表面とが当接した状態で前記基板の周
縁と対向する周縁位置まで移動させる洗浄ブラシ移動手
段と、 前記基板の表面に洗浄液を供給する洗浄液供給手段と、 を具備する基板洗浄装置。3. A substrate cleaning apparatus for cleaning a substrate surface by moving a cleaning brush over a surface of a rotating substrate, wherein the cleaning brush supporting means rotatably supports the cleaning brush about a vertical axis; By driving the cleaning brush rotating means for rotating the cleaning brush and the cleaning brush supporting means, the cleaning brush is moved to a central position facing the center of rotation of the substrate, and then lowered to a position in contact with the substrate. A substrate comprising: a cleaning brush moving unit that moves the cleaning brush and a substrate surface to a peripheral position facing the peripheral edge of the substrate in a state where the cleaning brush and the substrate surface are in contact with each other; and a cleaning liquid supply unit that supplies a cleaning liquid to the surface of the substrate. Cleaning equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16567894A JP2618834B2 (en) | 1994-07-19 | 1994-07-19 | Substrate cleaning method and substrate cleaning apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16567894A JP2618834B2 (en) | 1994-07-19 | 1994-07-19 | Substrate cleaning method and substrate cleaning apparatus |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16922394A Division JP2727413B2 (en) | 1994-07-21 | 1994-07-21 | Substrate cleaning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0774134A JPH0774134A (en) | 1995-03-17 |
| JP2618834B2 true JP2618834B2 (en) | 1997-06-11 |
Family
ID=15816965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16567894A Expired - Lifetime JP2618834B2 (en) | 1994-07-19 | 1994-07-19 | Substrate cleaning method and substrate cleaning apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2618834B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11283950A (en) * | 1998-03-30 | 1999-10-15 | Ebara Corp | Substrate cleaner |
| JP2003068695A (en) | 2001-08-29 | 2003-03-07 | Hitachi Ltd | Manufacturing method of semiconductor integrated circuit device |
| JP2005039087A (en) * | 2003-07-16 | 2005-02-10 | Yaskawa Electric Corp | Substrate processing device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5790941A (en) * | 1980-11-27 | 1982-06-05 | Toshiba Corp | Swing type vertical washer |
| JPS5899734A (en) * | 1981-12-10 | 1983-06-14 | Fujitsu Ltd | Method and apparatus for inspecting photomask |
| JPS6226175A (en) * | 1985-07-29 | 1987-02-04 | ヤマハ発動機株式会社 | Engine guard |
| JP2628168B2 (en) * | 1987-07-14 | 1997-07-09 | 住友シチックス株式会社 | Surface treatment equipment for semiconductor wafers |
-
1994
- 1994-07-19 JP JP16567894A patent/JP2618834B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0774134A (en) | 1995-03-17 |
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