JP2724890B2 - Three-dimensional assembly structure of printed circuit board and method of manufacturing the same - Google Patents
Three-dimensional assembly structure of printed circuit board and method of manufacturing the sameInfo
- Publication number
- JP2724890B2 JP2724890B2 JP1294041A JP29404189A JP2724890B2 JP 2724890 B2 JP2724890 B2 JP 2724890B2 JP 1294041 A JP1294041 A JP 1294041A JP 29404189 A JP29404189 A JP 29404189A JP 2724890 B2 JP2724890 B2 JP 2724890B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- board
- assembly structure
- dimensional assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、プリント基板に平面実装（SMT）によって
電子部品を搭載したプリント基板回路を高密度化するた
めに複数枚立体的に組み立てたプリント基板回路の立体
組立構造体及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a printed circuit in which a plurality of three-dimensionally assembled printed circuit boards on which electronic components are mounted by planar mounting (SMT) are mounted on a printed circuit board. The present invention relates to a three-dimensional assembly structure of a substrate circuit and a method of manufacturing the same.
（従来の技術） 従来の平面実装（SMT）は、１枚のプリント基板に高
密度で電子部品を装着することが主体となって進められ
ており、多様な高さの電子部品が実装された後のプリン
ト基板回路を複数枚高密度に立体的に組み立てることに
よって、必要とする電子回路を構成することは考慮され
ていない。(Prior art) Conventional planar mounting (SMT) has been mainly carried out by mounting electronic components at high density on one printed circuit board, and electronic components of various heights have been mounted. No consideration is given to constructing a required electronic circuit by assembling a plurality of printed circuit boards three-dimensionally at a high density.
また、現在実施されている技術にプリント基板の多層
化やフィルム状基板（フレキシブル基板）の多層化があ
る。プリント基板の多層化は、プリント基板の製造工程
（成形）中で回路機能も含めて多層化するものが殆どで
あり、フィルム状基板の多層化もフィルム上に蒸着、ス
パッタ、イオンプレーティングやスクリーン印刷も含め
て薄膜や厚膜で回路を構成して、フィルムを何枚も積み
重ねて上下の接続をスルーホールや端面引き出しで行う
ものである。In addition, the technologies currently being used include multi-layered printed circuit boards and multi-layered film-shaped substrates (flexible substrates). In most cases, printed circuit boards are multi-layered, including circuit functions, during the manufacturing process (molding) of printed circuit boards. Multi-layered film substrates are also deposited, sputtered, ion-plated and screened on films. A circuit is composed of a thin film or a thick film including printing, and a number of films are stacked, and the upper and lower connections are made by through holes or end faces.
（発明が解決しようとする課題） ところで、従来のプリント基板の多層化やフィルム状
基板の多層化技術の場合、使用する回路部品の高さ（厚
み）が揃っていてしかも薄い必要があり、使用可能な部
品に制限があり、従って構成できる回路も限られてしま
う嫌いがあった。(Problems to be Solved by the Invention) By the way, in the case of the conventional multi-layered technology of a printed circuit board or a multi-layered film-like substrate, it is necessary that circuit components to be used have a uniform height (thickness) and are thin. There were limitations on the parts that could be used, and there was a dislike that the circuits that could be configured were also limited.
本発明は、上記の点に鑑み、多種多様な外形、高さを
有する電子部品を搭載したプリント基板回路であっても
立体的に組み立てて任意の回路構成を高密度で実現可能
なプリント基板回路の立体組立構造体及びその製造方法
を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above, the present invention provides a printed circuit board capable of realizing an arbitrary circuit configuration with high density by assembling three-dimensionally even with a printed circuit board on which electronic components having various external shapes and heights are mounted. And a method of manufacturing the same.
（課題を解決するための手段） 上記目的を達成するために、本発明のプリント基板回
路の立体組立構造体は、プリント基板に電子部品を装着
してプリント基板回路を構成し、前記プリント基板間に
スペーサ部材を設けて複数枚のプリント基板回路を相互
に位置決めして立体的に重ねて一体化した構成におい
て、 前記スペーサ部材が前記プリント基板間に介在する枠
状ホルダであり、該枠状ホルダは厚み方向に貫通したピ
ンを有していて、当該ピンは前記プリント基板回路相互
の接続配線のためのジャンパー線となっていることを特
徴としている。(Means for Solving the Problems) In order to achieve the above object, a three-dimensional assembled structure of a printed circuit board according to the present invention comprises a printed circuit board mounted with electronic components to form a printed circuit board. Wherein a plurality of printed circuit boards are positioned relative to each other, three-dimensionally overlapped and integrated, and wherein the spacer member is a frame-shaped holder interposed between the printed circuit boards. Has a pin penetrating in the thickness direction, and the pin is a jumper wire for connection wiring between the printed circuit boards.
前記プリント基板回路の立体組立構造体において、前
記プリント基板回路を立体的に重ねて筒状パッケージ内
に収納一体化した構成としてもよい。また、前記パッケ
ージに接続用端子又はコネクタが設けられた構成として
もよい。In the three-dimensional assembly structure of the printed circuit board, the printed circuit board may be three-dimensionally overlapped and housed and integrated in a cylindrical package. Further, the package may be provided with a connection terminal or a connector.
本発明に係るプリント基板回路の立体組立構造体の第
１の製造方法は、昇降自在なセンターテーブル上に基板
トランスファ機構によりスペーサ部材付きのプリント基
板回路を供給して載置し、前記センターテーブルを当該
プリント基板回路の厚み相当分だけ下降させた後、次の
プリント基板回路を前記センターテーブル上の既に載置
されているプリント基板回路上に重ねて載置することを
特徴としている。According to a first method of manufacturing a three-dimensionally assembled structure of a printed circuit board according to the present invention, a printed circuit board with a spacer member is supplied and placed on a vertically movable center table by a board transfer mechanism, and the center table is mounted. After the printed circuit is lowered by an amount corresponding to the thickness of the printed circuit, the next printed circuit is placed on the printed circuit already mounted on the center table.
また、本発明に係るプリント基板回路の立体組立構造
体の第２の製造方法は、垂直方向の基板トランスファに
よりスペーサ部材付きのプリント基板を移送しながら電
子部品を装着してプリント基板回路を組み立てて順次テ
ーブル上に重ねて載置することを特徴としている。In a second method of manufacturing a three-dimensionally assembled structure of a printed circuit board according to the present invention, the printed circuit board is assembled by mounting electronic components while transferring a printed circuit board with spacer members by a vertical board transfer. It is characterized by being sequentially placed on a table.
（作用） 従来の複合化は多層化技術によって固体回路的に薄膜
化しているが、本発明においては、立体的なアセンブリ
によって複合化を図るものである。本発明の場合、プリ
ント基板回路を立体的に組み立てて必要な回路を構成で
き、立体的空間の高密度利用が可能であり、立体的に組
み立てて所要の回路を構成した後の電子機器への回路の
実装、組み込み、配線等のトータルコストを低減するこ
とができる。また、各プリント基板上に搭載される電子
部品の高さがまちまちであってもプリント基板回路を相
互に位置決めして立体的に組み合わせることができ、多
様な部品を持つプリント基板回路の立体的組み立てによ
る高密度化を図ることができる。また、プリント基板間
に介在するスペーサ部材として、厚み方向に貫通するピ
ンを有する枠状ホルダを用いることで、当該ピンをプリ
ント基板に電子部品を搭載してなるプリント基板回路相
互の接続配線のためのジャンパー線として用いることが
でき、プリント基板回路相互の接続配線を容易に実行で
きる。(Operation) In the conventional compounding, a thin film is formed in a solid state circuit by a multilayer technology, but in the present invention, the compounding is achieved by a three-dimensional assembly. In the case of the present invention, a required circuit can be configured by three-dimensionally assembling a printed circuit board, a high-density use of a three-dimensional space is possible, and a three-dimensionally assembled required circuit is formed on an electronic device. The total cost of mounting, assembling, wiring, etc. the circuit can be reduced. In addition, even if the height of electronic components mounted on each printed circuit board varies, the printed circuit boards can be positioned and combined three-dimensionally, and three-dimensional assembly of printed circuit boards with various components , It is possible to increase the density. Further, by using a frame-shaped holder having pins penetrating in the thickness direction as a spacer member interposed between the printed boards, the pins are used for connecting wiring between printed circuit boards each having an electronic component mounted on the printed board. Can be used as a jumper wire, and connection wiring between printed circuit boards can be easily executed.
また、製造にあたっては、プリント基板回路の厚み相
当分だけ段階的に下降するセンターテーブルに順次プリ
ント基板回路を供給載置して行く方法、又は垂直方向に
プリント基板を移送しながら電子部品を装着してプリン
ト基板回路を組み立てて順次テーブル上に重ねて載置す
る方法を採用したりすることにより、効率的に組立を実
行できる。Also, in manufacturing, a method of sequentially supplying and mounting printed circuit boards on a center table descending stepwise by an amount corresponding to the thickness of the printed circuit board, or mounting electronic components while transferring the printed circuit board in a vertical direction. By using a method of assembling a printed circuit board and sequentially placing it on a table, the assembling can be performed efficiently.
（実施例） 以下、本発明に係るプリント基板回路の立体組立構造
体及びその製造方法の実施例を図面に従って説明する。(Example) Hereinafter, an example of a three-dimensional assembly structure for a printed circuit board and a method of manufacturing the same according to the present invention will be described with reference to the drawings.
第８図は本発明の基になる構成を示す参考例であり、
プリント基板１に種々の電子部品２を面実装したプリン
ト基板回路３をスペーサ部材４を介して複数枚高さ方向
に重ねて一体化したものである。ここで、スペーサ部材
４はプリント基板１の四隅等の空きスペースにビス、接
着剤、圧入、嵌入等で固着されるもので、該スペーサ部
材４により、各プリント基板回路３は相互に所要間隔を
保持した状態で位置決めされる。FIG. 8 is a reference example showing a configuration based on the present invention,
A plurality of printed circuit boards 3 on which various electronic components 2 are surface-mounted on a printed circuit board 1 are stacked and integrated in the height direction via spacer members 4. Here, the spacer members 4 are fixed to empty spaces such as the four corners of the printed circuit board 1 by screws, adhesives, press-fitting, fitting, or the like. Positioning is performed while holding.
なお、各プリント基板回路３間の接続ははんだ付けや
ワイヤーボンディングにより行うことができる。The connection between the printed circuit boards 3 can be made by soldering or wire bonding.
第１図及び第２図は本発明のプリント基板回路の立体
組立構造体の第１実施例であり、プリント基板１に種々
の電子部品を面実装してプリント基板回路３を構成し、
複数枚のプリント基板回路３の間に方形枠状ホルダ10を
介在させて当該複数枚のプリント基板回路３を立体的に
位置決め一体化したものである。ここで、方形枠状ホル
ダ10は厚み方向に貫通するピン11を有し、該ピン11はプ
リント基板１の位置決め穴12に嵌入してプリント基板１
の位置決め固定を実行する。また、ピン11はプリント基
板回路３相互の接続配線のためのジャンパー線とても利
用できる。FIGS. 1 and 2 show a first embodiment of a three-dimensionally assembled structure of a printed circuit board according to the present invention, in which various electronic components are surface-mounted on a printed circuit board 1 to constitute a printed circuit board 3.
A plurality of printed circuit boards 3 are three-dimensionally positioned and integrated by interposing a rectangular frame-shaped holder 10 between the plurality of printed circuit boards 3. Here, the rectangular frame-shaped holder 10 has a pin 11 that penetrates in the thickness direction.
Execute positioning fixation. Also, the pin 11 can be used very much as a jumper wire for interconnecting the printed circuit board 3.
なお、接着剤を併用して方形枠状ホルダ10とプリント
基板１相互を接着しても良い。The rectangular frame-shaped holder 10 and the printed circuit board 1 may be bonded to each other by using an adhesive.
第３図は本発明のプリント基板回路の立体組立構造体
の第２実施例であり、プリント基板１に種々の電子部品
２を面実装してプリント基板回路３を構成し、複数枚の
プリント基板回路３の間に前述の実施例に示したような
スペーサ部材としての方形枠状ホルダを介在させて当該
複数枚のプリント基板回路３を立体的に重ねて樹脂等の
方形筒状パッケージ25で位置ずれしないように保持、一
体化したものである。ここで、パッケージ25の外面には
外部接続用のコネクタ（又は接続端子）26が固着されて
いる。FIG. 3 shows a second embodiment of a three-dimensionally assembled structure of a printed circuit board according to the present invention, in which various electronic components 2 are surface-mounted on a printed circuit board 1 to constitute a printed circuit board 3, and a plurality of printed circuit boards are formed. A plurality of printed circuit boards 3 are stacked three-dimensionally with a rectangular frame-shaped holder as a spacer member as shown in the above-described embodiment interposed between the circuits 3 and positioned in a rectangular cylindrical package 25 such as a resin. It is held and integrated so as not to shift. Here, a connector (or connection terminal) 26 for external connection is fixed to the outer surface of the package 25.
この場合、パッケージ25の上下開口を樹脂モールドし
て閉塞した構造としても良い。In this case, the upper and lower openings of the package 25 may be closed by resin molding.
第４図及び第５図は本発明に係るプリント基板回路の
立体組立構造体の製造方法の実施例であり、30はセンタ
ーテーブル、31A乃至31Cは搬入用基板トランスファ、32
は搬出用基板トランスファである。搬入用基板トランス
ファ31A乃至31Cはそれぞれ異なった種類のプリント基板
回路３（但し、図５に示すようにスペーサ部材付き）を
センターテーブル30上に供給、載置するものであり、セ
ンターテーブル30は昇降自在であって、載置されたプリ
ント基板回路３の厚みＴに相当する距離だけ段階的に下
降動作を行う。4 and 5 show an embodiment of the method for manufacturing a three-dimensionally assembled structure of a printed circuit board according to the present invention, in which 30 is a center table, 31A to 31C are carry-in substrate transfers, 32
Denotes an unloading substrate transfer. The carry-in board transfers 31A to 31C are for supplying and placing different types of printed circuit boards 3 (with a spacer member as shown in FIG. 5) on the center table 30, and the center table 30 is moved up and down. It is freely movable, and performs a descending operation stepwise by a distance corresponding to the thickness T of the mounted printed circuit board 3.
従って、プリント基板回路の立体組立構造体の組立
は、センターテーブル30上に最下段となるべきプリント
基板回路３を搬入用基板トランスファ31A乃至31Cのいず
れかから供給し、センターテーブル30がプリント基板回
路の厚みＴだけ段階的に下降したら、次のプリント基板
回路３を搬入用基板トランスファ31A乃至31Cのいずれか
から供給し最下段のプリント基板回路３上に重ねて載置
し、このような載置動作を繰り返した後、最上段のプリ
ント基板回路３を搬入用基板トランスファ31A乃至31Cの
いずれかから供給して今まで積み重ねらたプリント基板
回路上に載置することにより行う。その後、センターテ
ーブル30上のプリント基板回路の立体組立構造体は、セ
ンターテーブル30の上昇位置への復帰により搬出用基板
トランスファ32と同じ高さにされて該搬出用基板トラン
スファ32により排出される。Therefore, in assembling the three-dimensionally assembled structure of the printed circuit board, the printed circuit board 3 to be the lowermost stage is supplied from one of the carry-in board transfers 31A to 31C on the center table 30, and the center table 30 is mounted on the printed circuit board. , The next printed circuit board 3 is supplied from any of the carry-in board transfer circuits 31A to 31C and placed on the lowermost printed circuit board circuit 3 in such a manner that the next printed circuit board 3 is placed. After the operation is repeated, the uppermost printed circuit board circuit 3 is supplied from any of the carry-in board transfer circuits 31A to 31C, and is mounted on the printed circuit board circuits thus far stacked. Thereafter, the three-dimensional assembled structure of the printed circuit board on the center table 30 is returned to the ascending position of the center table 30 so as to have the same height as the unloading board transfer 32, and is discharged by the unloading board transfer 32.
なお、プリント基板回路３の積み重ね順序、枚数は予
め制御用コンピュータに入力した回路情報によって行う
ことができる。The stacking order and the number of the printed circuit boards 3 can be determined based on circuit information input in advance to the control computer.
上記製造方法の実施例によれば、センターテーブル30
がプリント基板回路３の厚みＴに相当する距離ずつ段階
的に下降するので、各トランスファ31A乃至31Cはプリン
ト基板回路３の水平方向の移送動作を実行すれば良く、
機構が簡単になる。According to the embodiment of the manufacturing method, the center table 30
Are stepwise lowered by a distance corresponding to the thickness T of the printed circuit board 3, so that the transfer units 31A to 31C only need to execute the transfer operation of the printed circuit board 3 in the horizontal direction.
The mechanism becomes simple.
第６図は本発明の製造方法の他の実施例であり、昇降
テーブル40に対して垂直方向の基板トランスファ41によ
りプリント基板１を移送しながら電子部品を点線矢印の
如く装着機等で供給、装着してプリント基板回路３を組
み立て、これを順次テーブル40上に重ねて載置する工程
を持つ。FIG. 6 shows another embodiment of the manufacturing method of the present invention, in which electronic components are supplied by a mounting machine or the like as indicated by dotted arrows while transferring the printed circuit board 1 by a board transfer 41 in a vertical direction with respect to the elevating table 40. The printed circuit board 3 is assembled by mounting it, and the printed circuit board 3 is sequentially placed on the table 40.
この場合、プリント基板１を中心とした同心円上に種
々の電子部品の供給部を配置して、プリント基板１に対
して電子部品を放射状に移送して装着を実行することが
でき、従来のプリント基板を水平方向に搬送する方法に
比べプリント基板の移動距離を少なくすることができ
る。In this case, the supply units of various electronic components are arranged on a concentric circle centered on the printed circuit board 1, and the electronic components can be radially transferred to the printed circuit board 1 to be mounted thereon. The moving distance of the printed board can be reduced as compared with the method of transporting the board in the horizontal direction.
（発明の効果） 以上説明したように、本発明によれば、以下の効果を
得ることができる。(Effects of the Invention) As described above, according to the present invention, the following effects can be obtained.
（１） 従来は多層化によって薄型化していたが、本発
明では立体化によって小型化を図るものである。そし
て、装着しながら立体的に組み立て可能であり、従来の
装着、組立技術に比べ、大幅にスペース削減ができる。
例えば第７図のように従来ｍ×ｎのプリント基板１枚に
実装していた回路を、点線の如く分割して垂直方向に複
数枚立体的に重ねることにより、平面的な占有面積を縮
小して小型化を図ることができる。しかも、高さの異な
る電子部品を搭載したプリント基板回路を立体的に高密
度に組み立てることができ、立体空間を有効利用でき、
多様な回路を構成可能である。とくに、スペーサ部材と
してプリント基板間に介在する枠状ホルダを用い、該枠
状ホルダが厚み方向に貫通したピンを有するため、当該
ピンは前記プリント基板回路相互の接続配線のためのジ
ャンパー線として機能するから、プリント基板回路相互
間の接続配線の簡略化を図り得る。(1) Conventionally, the thickness was reduced by multi-layering, but in the present invention, the size is reduced by three-dimensionalization. And, it is possible to assemble three-dimensionally while mounting, so that the space can be greatly reduced as compared with conventional mounting and assembling techniques.
For example, as shown in FIG. 7, a circuit previously mounted on a single m × n printed circuit board is divided as indicated by a dotted line, and a plurality of three-dimensionally stacked in a vertical direction, thereby reducing a planar occupation area. Thus, downsizing can be achieved. Moreover, printed circuit boards with electronic components of different heights can be assembled three-dimensionally and with high density, and three-dimensional space can be used effectively.
Various circuits can be configured. In particular, since a frame-shaped holder interposed between printed circuit boards is used as a spacer member, and the frame-shaped holder has pins that penetrate in the thickness direction, the pins function as jumper wires for connection wiring between the printed circuit boards. Therefore, connection wiring between printed circuit boards can be simplified.
（２） 種々の回路構成を高密度で小形に構成できるの
で、多機能、複合化に対応でき、さらに電子機器への回
路の実装、組み立て、配線等の作業を簡略化することが
可能である。(2) Since various circuit configurations can be configured with high density and small size, it is possible to cope with multiple functions and complexities, and it is possible to simplify the work of mounting, assembling, and wiring circuits on electronic devices. .
（３） プリント基板回路のの厚みに相当する距離ずつ
段階的に下降するセンターテーブルに対して基板トラン
スファよりプリント基板回路を移送する方法や、垂直方
向にプリント基板を移送しながら電子部品を装着してプ
リント基板回路を組み立てて順次テーブル上に重ねて載
置する方法を採用することができ、これによって、製造
組立の自動化が容易である。また、プリント基板の搬送
を合理的に実施することによりプリント基板の移動距離
は少なくなり、各プリント基板に電子部品を実装済みの
半製品のプリント基板回路の状態で供給し、組み立てて
完成できるので、実装の工数、工程数、完成度（完成さ
せるまでの手間）、リードタイム（完成までの時間）の
削減、ひいてはトータルコストの低減が可能である。(3) A method of transferring a printed circuit board from a board transfer to a center table that is gradually lowered by a distance corresponding to the thickness of the printed circuit board, or mounting electronic components while transferring a printed circuit board in a vertical direction. A method of assembling a printed circuit board and sequentially placing it on a table can be adopted, which makes it easy to automate manufacturing and assembly. In addition, by moving the printed circuit board rationally, the moving distance of the printed circuit board is reduced, and the electronic components can be supplied to each printed circuit board in the form of a semi-finished printed circuit board, and assembled and completed. In addition, it is possible to reduce the number of steps, the number of steps, the degree of completion (time required for completing), the lead time (time required for completion), and the total cost.
第１図は本発明に係るプリント基板回路の立体組立構造
体の第１実施例を示す分解斜視図、第２図は同部分断面
図、第３図は同じく第２実施例を示す斜視図、第４図は
本発明に係るプリント基板回路の立体組立構造体の製造
方法の実施例を示す平面図、第５図は同じく実施例にお
けるセンターテーブルの動作説明図、第６図は本発明に
係る製造方法の他の実施例を示す正面図、第７図は本発
明の効果説明のための説明図、第８図は本発明のプリン
ト基板回路の立体組立構造体の基になる参考例を示す斜
視図である。 １……プリント基板、２……電子部品、３……プリント
基板回路、４……スペーサ部材、10……方形枠状ホル
ダ、11……ピン、25……方形筒状パッケージ、30……セ
ンターテーブル、31A乃至31C,32……基板トランスフ
ァ。1 is an exploded perspective view showing a first embodiment of a three-dimensionally assembled structure of a printed circuit board according to the present invention, FIG. 2 is a partial sectional view of the same, FIG. 3 is a perspective view showing a second embodiment of the same, FIG. 4 is a plan view showing an embodiment of a method of manufacturing a three-dimensional assembled structure of a printed circuit board according to the present invention, FIG. 5 is an explanatory view of the operation of a center table in the same embodiment, and FIG. FIG. 7 is a front view showing another embodiment of the manufacturing method, FIG. 7 is an explanatory view for explaining the effect of the present invention, and FIG. 8 shows a reference example serving as a basis for a three-dimensional assembly structure of a printed circuit board according to the present invention. It is a perspective view. DESCRIPTION OF SYMBOLS 1 ... Printed circuit board, 2 ... Electronic component, 3 ... Printed circuit board, 4 ... Spacer member, 10 ... Square frame-shaped holder, 11 ... Pin, 25 ... Square tubular package, 30 ... Center Table, 31A to 31C, 32 ... board transfer.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 宮内 栄作 東京都中央区日本橋１丁目13番１号 テ ィーディーケイ株式会社内 (72)発明者 渕口 鉄哉 東京都中央区日本橋１丁目13番１号 テ ィーディーケイ株式会社内 (56)参考文献 特開 昭63−84097（ＪＰ，Ａ) 特開 平１−257392（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuing on the front page (72) Eisai Miyauchi 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Tetsuya Fuchiguchi 1-13-1 Nihonbashi, Chuo-ku, Tokyo (56) References JP-A-63-84097 (JP, A) JP-A-1-257392 (JP, A)
Claims (5)
ト基板回路を構成し、前記プリント基板間にスペーサ部
材を設けて複数枚のプリント基板回路を相互に位置決め
して立体的に重ねて一体化したプリント基板回路の立体
組立構造体において、 前記スペーサ部材が前記プリント基板間に介在する枠状
ホルダであり、該枠状ホルダは厚み方向に貫通したピン
を有していて、当該ピンは前記プリント基板回路相互の
接続配線のためのジャンパー線となっていることを特徴
とするプリント基板回路の立体組立構造体。An electronic component is mounted on a printed circuit board to form a printed circuit board, a spacer member is provided between the printed circuit boards, a plurality of printed circuit boards are positioned with respect to each other, and three-dimensionally overlapped and integrated. In the three-dimensional assembled structure of a printed circuit board, the spacer member is a frame-shaped holder interposed between the printed circuit boards, and the frame-shaped holder has a pin penetrating in a thickness direction, and the pin is the printed board. A three-dimensional assembly structure for a printed circuit board, which is a jumper wire for connecting wiring between the board circuits.
状パッケージ内に収納一体化した請求項１記載のプリン
ト基板回路の立体組立構造体。2. The three-dimensional assembly structure of a printed circuit board according to claim 1, wherein said printed circuit boards are three-dimensionally stacked and housed and integrated in a cylindrical package.
が設けられている請求項２記載のプリント基板回路の立
体組立構造体。3. A three-dimensional assembly structure for a printed circuit board according to claim 2, wherein said package is provided with connection terminals or connectors.
ンスファ機構によりスペーサ部材付きのプリント基板回
路を供給して載置し、前記センターテーブルを当該プリ
ント基板回路の厚み相当分だけ下降させた後、次のプリ
ント基板回路を前記センターテーブル上の既に載置され
ているプリント基板回路上に重ねて載置することを特徴
とするプリント基板回路の立体組立構造体の製造方法。4. A printed circuit board with a spacer member is supplied and placed on a vertically movable center table by a board transfer mechanism, and the center table is lowered by an amount corresponding to the thickness of the printed circuit board. And mounting the printed circuit board on the printed circuit board already mounted on the center table.
サ部材付きのプリント基板を移送しながら電子部品を装
着してプリント基板回路を組み立てて順次テーブル上に
重ねて載置することを特徴とするプリント基板回路の立
体組立構造体の製造方法。5. A printed circuit board characterized by mounting electronic components while assembling a printed circuit board with a spacer member by means of a vertical board transfer, assembling a printed circuit board, and sequentially placing the printed circuit board on a table. Method for manufacturing a three-dimensional assembly structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1294041A JP2724890B2 (en) | 1989-11-14 | 1989-11-14 | Three-dimensional assembly structure of printed circuit board and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1294041A JP2724890B2 (en) | 1989-11-14 | 1989-11-14 | Three-dimensional assembly structure of printed circuit board and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03155184A JPH03155184A (en) | 1991-07-03 |
| JP2724890B2 true JP2724890B2 (en) | 1998-03-09 |
Family
ID=17802509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1294041A Expired - Lifetime JP2724890B2 (en) | 1989-11-14 | 1989-11-14 | Three-dimensional assembly structure of printed circuit board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2724890B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106329175A (en) * | 2016-10-28 | 2017-01-11 | 上海航天科工电器研究院有限公司 | Composite backing plate for connectors |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000276068A (en) | 1999-03-26 | 2000-10-06 | Seiko Epson Corp | Display device and electronic equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5766593U (en) * | 1980-10-09 | 1982-04-21 | ||
| JPS6047497A (en) * | 1983-08-25 | 1985-03-14 | 富士通株式会社 | Method of attaching and detaching printed board |
| JPS6372083A (en) * | 1986-09-16 | 1988-04-01 | 東芝エンジニアリング株式会社 | Wiring board mounter |
| JPH0630277B2 (en) * | 1986-09-29 | 1994-04-20 | 株式会社日立製作所 | Connection method between printed circuit boards |
| JPH01257392A (en) * | 1989-02-08 | 1989-10-13 | Sanyo Electric Co Ltd | Multi-layer hybrid integrated circuit device |
-
1989
- 1989-11-14 JP JP1294041A patent/JP2724890B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106329175A (en) * | 2016-10-28 | 2017-01-11 | 上海航天科工电器研究院有限公司 | Composite backing plate for connectors |
| CN106329175B (en) * | 2016-10-28 | 2018-06-01 | 上海航天科工电器研究院有限公司 | A kind of connector composite back plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03155184A (en) | 1991-07-03 |
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