JP2682138B2 - Heating method and apparatus - Google Patents
Heating method and apparatusInfo
- Publication number
- JP2682138B2 JP2682138B2 JP12215589A JP12215589A JP2682138B2 JP 2682138 B2 JP2682138 B2 JP 2682138B2 JP 12215589 A JP12215589 A JP 12215589A JP 12215589 A JP12215589 A JP 12215589A JP 2682138 B2 JP2682138 B2 JP 2682138B2
- Authority
- JP
- Japan
- Prior art keywords
- hot air
- heating
- heated
- heating device
- air blowing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、プリント回路基板（以後基板と略す）等を
加熱する方法に係り、特に基板に電子部品を装着した
後、リフローはんだ付けするための加熱方法及びその装
置に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of heating a printed circuit board (hereinafter abbreviated as a board) and the like, and particularly to a heating method for mounting an electronic component on a board and then performing reflow soldering. A method and an apparatus therefor.
従来の技術 従来、基板にはんだ材料を塗布し、電子部品を装着し
た後、加熱リフローする装置には、熱風による加熱、赤
外線による加熱、あるいは蒸気潜熱を利用した加熱等が
使用されていた。2. Description of the Related Art Conventionally, a device that applies a solder material to a substrate, mounts electronic components thereon, and then heats and reflows the heat using heating with hot air, heating with infrared rays, heating using steam latent heat, and the like.
しかしながら、最近基板の実装密度が高くなるととも
に、電子部品の多様化が進む中で、ランニングコスト、
均一加熱性，生産性の点から、熱風を利用した加熱方法
が注目されている。However, with the recent increase in mounting density of boards and the diversification of electronic components, running costs,
From the viewpoints of uniform heating property and productivity, a heating method using hot air is drawing attention.
例えば特開昭63−278668号公報に示されているよう
に、第８図のような構造の例がある。For example, as shown in JP-A-63-278668, there is an example of the structure shown in FIG.
図において、モータ1aおよび1bでシロッコファン2aお
よび2bをまわす。そして、ヒータ３で空気を加熱し、被
加熱物である基板４に、吹き付けることで、リフローす
る構造になっている。In the figure, motors 1a and 1b rotate sirocco fans 2a and 2b. The heater 3 heats the air and blows it onto the substrate 4, which is the object to be heated, to reflow the structure.
発明が解決しようとする課題 しかしながら上記のような構成では、第９図に示すよ
うに比較的均一な風速の熱風を基板全面に吹き付けるこ
とになる。このような場合、基板上における熱風の持っ
ている運動エネルギー及びベクトルがほぼ同じなので、
部品4aと部品4aの谷間にあるような部分５や部品の下部
分６等において、熱風つまり空気が淀むこととなり、他
の部品に比べ加熱され難くなる。その結果、基板内の温
度ばらつきが大きくなる。However, in the above-mentioned configuration, as shown in FIG. 9, hot air having a relatively uniform wind speed is blown onto the entire surface of the substrate. In such a case, the kinetic energy and vector of hot air on the substrate are almost the same,
Hot air, that is, air, stagnates in the parts 5 and the lower parts 6 of the parts that are between the parts 4a and the parts 4a, so that it is more difficult to heat than other parts. As a result, the temperature variation in the substrate increases.
さらに、被加熱物である基板自身が大きくなると、該
基板の中央部付近にも空気の淀む傾向があり、空気と基
板間の熱伝達率が低くなる。そしてその結果、該基板中
央部付近の温度が低くなり、同一基板内温度ばらつきが
ますます大きくなる。この傾向は基板長手方向の寸法が
500mm前後になると顕著になる。Furthermore, when the substrate itself, which is the object to be heated, becomes large, air tends to stagnate near the central portion of the substrate, and the heat transfer coefficient between the air and the substrate becomes low. As a result, the temperature in the vicinity of the central portion of the board is lowered, and the temperature variation within the same board is further increased. This tendency is due to the dimension in the substrate longitudinal direction.
It becomes remarkable at around 500 mm.
本発明は上記問題点に鑑み、部品と部品の谷間や、大
きな基板の中央部付近などにおいても、熱風と被加熱物
である基板との熱伝達率を上げ、熱風自身の温度が、比
較的低くても、基板全体における温度が十分上がり、均
一な加熱と、信頼性の高いリフローはんだ付を実現する
ものである。In view of the above problems, the present invention increases the heat transfer coefficient between the hot air and the substrate that is the object to be heated, such as in the valley between the components and in the vicinity of the central portion of the large substrate, and the temperature of the hot air itself is relatively high. Even if the temperature is low, the temperature of the entire substrate is sufficiently increased to realize uniform heating and highly reliable reflow soldering.
課題を解決するための手段 上記問題点を解決するために本発明の加熱方法は、被
加熱物である基板などの、幅および長さの少なくても一
方よりも短い間隔で、熱風吹き付け部と熱風吸い込み部
が存在し、且つ、各２ヶ所以上存在するようにしたもの
である。Means for Solving the Problems In order to solve the above problems, the heating method of the present invention is, for example, a substrate that is an object to be heated, at an interval shorter than one of width and length, and a hot air blowing unit. There is a hot air suction part, and there are two or more hot air suction parts.
作用 本発明は上記した構成によって、大きな基板や電子部
品が高密度に実装してある基板などをリフローする場合
において、熱風の淀み部分の発生をほとんど無くするこ
とで、均一加熱が実現できると同時に、熱風と基板との
熱伝達率も高くすることができ、比較的低い温度の熱風
でリフローできることになる。The present invention, by the above-described configuration, when reflowing a large substrate or a substrate on which electronic components are mounted at high density, by almost eliminating the occurrence of stagnation of hot air, uniform heating can be realized at the same time. The heat transfer coefficient between the hot air and the substrate can also be increased, and reflow can be performed with hot air at a relatively low temperature.
実施例 以下本発明の一実施例の加熱方法及びその装置につい
て、図面を参照しながら説明する。Example Hereinafter, a heating method and an apparatus therefor according to an example of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例における加熱装置の概略構
造を示す縦断面図である。第１図において、７は熱風吹
き出しノズル、８は穴のあいた板であり、ノズル７との
間に隙間９または穴を設けてある。FIG. 1 is a vertical sectional view showing a schematic structure of a heating device according to an embodiment of the present invention. In FIG. 1, 7 is a hot air blowing nozzle, 8 is a plate with holes, and a gap 9 or a hole is provided between the nozzle 7 and the nozzle 7.
熱風発生機（図示せず）から出てきた熱風が、熱風吹
き出し用空間10を通りノズル７から吹き出し、被加熱物
である基板11にあたり、隙間９または穴を通って排気用
空間12に入り、熱風発生機の吸気口に戻る構造となって
いる。The hot air coming out of the hot air generator (not shown) blows out from the nozzle 7 through the hot air blowing space 10, hits the substrate 11 which is the object to be heated, enters the exhaust space 12 through the gap 9 or the hole, It has a structure that returns to the inlet of the hot air generator.
そこで、ノズル７から出た熱風は基板11に当り、基板
11にそって水平方向に流れる。そして、ノズル７どうし
の間隔は、図に示すように基板11の寸法よりも短くして
あるので、隣のノズルから出てきた空気とぶつかると同
時に、上方へと流れ、隙間９を通って熱風発生機の方へ
戻ることになる。Therefore, the hot air discharged from the nozzle 7 hits the substrate 11 and
Flow horizontally along 11. Since the distance between the nozzles 7 is shorter than the dimension of the substrate 11 as shown in the figure, at the same time as it collides with the air coming out from the adjacent nozzle, it flows upward and passes through the gap 9 to generate hot air. We will return to the generator.
以上のように、ノズル７から出た熱風は基板11に当た
る時と、熱風どうしが衝突する時の２回流れの方向を大
きく変えると同時に、流れを乱すので、その位置での熱
風と基板11との熱伝達率が高くなり、低い熱風温度で
も、効率よく被加熱物に伝えることが可能となった。As described above, the hot air emitted from the nozzle 7 largely changes the direction of the flow twice when it hits the substrate 11 and when the hot air collides with each other, and at the same time, it disturbs the flow, so that the hot air and the substrate 11 at that position Since the heat transfer coefficient of the product has been increased, it is possible to efficiently transfer it to the object to be heated even at low hot air temperature.
このことは、ノズル７から被加熱物に対して、略垂直
方向であるとき効果が最も大きく、ノズルのピッチが短
いほど熱伝達率も高くなる。This is most effective when the nozzle 7 is substantially perpendicular to the object to be heated, and the shorter the nozzle pitch, the higher the heat transfer coefficient.
さらに、第２図に示すように、基板11にチップ型アル
ミ電解コンデンサ14が、高密度に実装された場合に於い
ても、風速の均一でない熱風が基板上方から吹き付けて
くるので矢印13に示すように、部品と部品の間を淀みな
く流れることができ、均一な加熱が可能となる。Further, as shown in FIG. 2, even when the chip-type aluminum electrolytic capacitors 14 are mounted on the substrate 11 at a high density, hot air having a non-uniform wind speed is blown from above the substrate, and therefore is indicated by an arrow 13. As described above, it can flow between the parts without stagnation, and uniform heating is possible.
また、PLCC15の様に部品と基板11との間に空間があ
り、そこに小さなチップ部品16をはんだ付しようとする
場合に於いても、各場所に於ける熱風の持っている運動
エネルギーのポテンシャルが異なるので、PLCC15と基板
11との間の狭い隙間でも熱風がよく通り、比較的容易に
加熱リフローする事が可能となる。Also, when there is a space between the component and the substrate 11 like the PLCC 15 and a small chip component 16 is to be soldered there, the potential of the kinetic energy of the hot air at each location So PLCC15 and PCB
The hot air passes well even in the narrow gap between 11 and, and it becomes possible to reflow the heat relatively easily.
普通、基板にクリームはんだを使ってリフローはんだ
付する場合、予熱部では150℃程度まで加熱し、リフロ
ー部では200℃から230℃程度まで加熱するのが、一般的
である。そのためには、第１図に示すように予熱部とリ
フロー部に分け異なる温度の熱風を吹き付けることが大
切になる。Generally, when reflow soldering is performed on a substrate using cream solder, it is common to heat the preheat part to about 150 ° C and the reflow part to about 200 ° C to 230 ° C. For that purpose, it is important to blow hot air having different temperatures to the preheating section and the reflow section as shown in FIG.
さらに装置の消費電力を少なくし、ランニングコスト
を低減するためには、基板11に吹き付けた熱風を再度加
熱する熱風循環方式が重要である。Further, in order to reduce the power consumption of the device and the running cost, a hot air circulation method of reheating the hot air blown onto the substrate 11 is important.
また、熱風を吹き付ける場合、基板表面上で3m/秒か
ら6m/秒の風速が適しているので、熱風吹き付けノズル
７に供給する空気の圧力は、ノズル部での圧力損失を考
慮して、10mmAq以上が好ましい。しかし１気圧以上にす
ると圧力損失が大きく、効率が悪くなるので、10mmAq以
上、１気圧以下の範囲のブロアーを使用するのが効果的
である。Further, when blowing hot air, since a wind speed of 3 m / sec to 6 m / sec on the substrate surface is suitable, the pressure of the air supplied to the hot-air blowing nozzle 7 is 10 mmAq in consideration of the pressure loss at the nozzle portion. The above is preferable. However, if the pressure is higher than 1 atm, the pressure loss is large and the efficiency becomes poor. Therefore, it is effective to use a blower in the range of 10 mmAq or higher and 1 atm or lower.
また熱風吹き出しノズル７のピッチは短い方が、熱伝
達率の向上することが実験的に確かめられている。しか
し、最近では、はんだリフローする面実装基板の大きさ
も、一辺の長さが400mm以上のものも数多く出回るよう
になってきているので、熱風吹き付け部と熱風吸い込み
部が、各250mmピッチ以下の長さであれば、本発明の効
果は十分に発揮される。It has been experimentally confirmed that the shorter the pitch of the hot air blowing nozzles 7, the higher the heat transfer coefficient. However, recently, many solder reflow soldering boards have a side length of 400 mm or more. In that case, the effect of the present invention is sufficiently exerted.
そこで、第３図に示すように、熱風吹き付け部（ノズ
ル）を円筒状のパイプ17で構成した構造にすると、基板
搬送方向と直角方向にも熱風吹き出しノズルが、複数本
存在することになり、均一加熱に効果がある。なお、第
３図において、18はファン、19は熱風加熱ヒータであ
る。Therefore, as shown in FIG. 3, when the hot air blowing section (nozzle) is configured by the cylindrical pipe 17, there are a plurality of hot air blowing nozzles in the direction perpendicular to the substrate transfer direction. Effective for uniform heating. In FIG. 3, 18 is a fan and 19 is a hot air heater.
ところで、この効果は熱風吹き出しノズルが、第４図
に示す様に４角柱状のパイプ17や、６角柱状のパイプで
も効果は変わらない。By the way, this effect does not change even if the hot air blowing nozzle is a quadrangular prismatic pipe 17 or a hexagonal prismatic pipe as shown in FIG.
また、熱風吹き出しノズルと熱風吸い込み用パイプの
各ピッチは可能なかぎり短い方がよい。そこで、第５図
に示すように、パイプを束ね合わせ、それらを固定する
ことにより、熱風吹き出しノズル20、熱風吸い込みノズ
ル21を形成し、比較的簡単に熱風吹き出しノズルと、熱
風吸い込みノズル間の各ピッチの短い構造のユニットが
実現できる。Further, it is preferable that the pitches of the hot air blowing nozzle and the hot air suction pipe are as short as possible. Therefore, as shown in FIG. 5, by bundling the pipes and fixing them, the hot air blowing nozzle 20 and the hot air sucking nozzle 21 are formed, and each of the hot air blowing nozzle and the hot air sucking nozzle is relatively easily formed. A unit with a short pitch can be realized.
このとき、丸パイプを束ね合わせても良いが、四角の
パイプを束ねたり、六角のパイプを束ね合わせれば、隙
間なく束ね合わせることができるので、エネルギー損失
の少ない送風系ができる。At this time, the round pipes may be bundled, but if the square pipes or the hexagonal pipes are bundled, they can be bundled without a gap, so that a blower system with less energy loss can be formed.
さらに、パイプの代わりに棒状のヒータを組み込んだ
り、パイプの間にシート状のヒータを挟み込むことによ
り、熱風ヒータを簡単に形成できる。Further, a hot air heater can be easily formed by incorporating a rod-shaped heater instead of the pipe or by sandwiching a sheet-shaped heater between the pipes.
ところで、第６図に示すように、熱風吹き出し用のパ
イプ22をバーリング加工した金属板23にはめ込み固定す
ると、バーリング加工のコーナー24により矢印25に示す
熱風の流れが、スムーズになり、エネルギー損失の少な
い送風系ができる。By the way, as shown in FIG. 6, when the hot air blowing pipe 22 is fitted and fixed to the burring metal plate 23, the hot air flow indicated by the arrow 25 becomes smooth due to the burring corner 24, and energy loss A small air blow system can be created.
また、パイプ22をバーリング加工した金属板24にはめ
込む場合、第７図に示すように、凸部26の先端部分を通
る円の直径を、中に通すパイプの外形よりわずかに小さ
くしたバーリング加工により、パイプを中に通したと
き、比較的容易に精度良く固定できる。凸部26のような
形状は、バーリング加工用のポンチ（図示せず）に、溝
加工することで簡単に形成できる。Further, when fitting the pipe 22 into the burring-processed metal plate 24, as shown in FIG. 7, the diameter of the circle passing through the tip of the convex portion 26 is made slightly smaller than the outer diameter of the pipe to be passed through by the burring process. , When the pipe is passed through, it can be fixed relatively easily and accurately. The shape such as the convex portion 26 can be easily formed by grooving a punch (not shown) for burring.
発明の効果 以上のように本発明は、被加熱物の幅及び長さの少な
くても一方より短い間隔で、熱風吹き付け部と熱風吸い
込み部が、各２ヵ所以上存在するようにし、熱風を被加
熱物に対して、略垂直方向に吹き付けることにより、熱
風の淀み部分の発生もほとんど無くすることができ、熱
風と被加熱物との熱伝達率を向上させ、例えば220℃程
度の比較的低い温度の熱風で、温度ばらつきの少ない、
共晶はんだの加熱リフローが可能となる。EFFECTS OF THE INVENTION As described above, according to the present invention, the hot air blowing section and the hot air suction section are provided at two or more positions each at a shorter interval than the width and the length of the object to be heated, and the hot air is not exposed. By blowing in a substantially vertical direction to the heated object, it is possible to almost completely eliminate the stagnation part of the hot air, improve the heat transfer coefficient between the hot air and the object to be heated, and for example, a relatively low temperature of about 220 ° C. With hot air of temperature, there is little temperature variation,
Reheating of eutectic solder is possible.
第１図は本発明の一実施例における加熱装置の概略構造
を示す縦断面図、第２図は第１図に示した装置による加
熱状態の詳細を示した図、第３図は熱風吹き付け部が円
筒状のパイプで構成した構造を示した図、第４図はノズ
ルの第２の実施例を示した図、第５図はノズルの保持形
成方法の一実施例を示した図、第６図はノズルを金属板
に取り付ける方法を示した図、第７図は第６図の構造体
を形成する場合の一具体例を示した図、第８図は従来の
熱風加熱リフロー装置の概略縦断面図、第９図は第８図
のような従来のはんだ付け用リフロー加熱装置の熱風加
熱状態を示した図である。 ７……ノズル、10……熱風吹き付け用空間、11……基
板、12……排気用空間。FIG. 1 is a vertical cross-sectional view showing a schematic structure of a heating device in one embodiment of the present invention, FIG. 2 is a view showing details of a heating state by the device shown in FIG. 1, and FIG. 3 is a hot air blowing part. Shows a structure constituted by a cylindrical pipe, FIG. 4 shows a second embodiment of the nozzle, FIG. 5 shows an embodiment of a method for holding and forming the nozzle, and FIG. The figure shows a method of attaching the nozzle to a metal plate, FIG. 7 shows a specific example of forming the structure of FIG. 6, and FIG. 8 is a schematic vertical section of a conventional hot air heating reflow apparatus. FIG. 9 is a view showing a hot air heating state of the conventional soldering reflow heating device as shown in FIG. 7 ... Nozzle, 10 ... Hot air blowing space, 11 ... Substrate, 12 ... Exhaust space.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 谷口 昌弘 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 佐伯 啓二 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平２−137691（ＪＰ，Ａ) 特開 昭63−278668（ＪＰ，Ａ) 特開 平１−186270（ＪＰ，Ａ) 特開 平１−278965（ＪＰ，Ａ) 特開 昭63−180368（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masahiro Taniguchi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Keiji Saeki, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-2-137691 (JP, A) JP-A-63-278668 (JP, A) JP-A-1-186270 (JP, A) JP-A-1-278965 (JP, A) JP 63-180368 (JP, A)
Claims (13)
の被加熱物を加熱する場合において、前記被加熱物の幅
及び長さの少なくても一方よりも短い間隔で、熱風吹き
付け部と熱風吸い込み部が存在し、且つ、前記被加熱物
に対して、上方向側又は、下方向側又は上下両方向側に
各２ヵ所以上存在するようにし、前記熱風吹き付け部よ
り熱風を前記被加熱物の方向に吹き出し、被加熱物を加
熱することを特徴とする加熱方法。1. When heating an object to be heated, such as a printed circuit board on which electronic components are mounted, the hot air blowing section and the hot air are provided at intervals shorter than one of the width and length of the object to be heated. There is a suction part, and with respect to the object to be heated, there are two or more positions on each of the upper side, the lower side, and both the upper and lower sides, and hot air is blown from the hot air blowing part. A method for heating, characterized in that the object to be heated is blown out in a predetermined direction.
略垂直方向であることを特徴とする特許請求の範囲第１
項記載の加熱方法。2. The hot air blowing direction is such that
Claim 1 characterized in that it is substantially vertical
The heating method according to the item.
それぞれ設定した温度の空気を吹き付けられるようにし
たことを特徴とする特許請求の範囲第１項記載の加熱方
法。3. The spraying section is divided into several groups,
The heating method according to claim 1, wherein air having a set temperature is blown.
温度調節した後、再度吹き付ける熱風循環方式を採用し
た特許請求の範囲第１項記載の加熱方法。4. The hot air sucked from the hot air suction part,
The heating method according to claim 1, which employs a hot air circulation method of re-blowing after adjusting the temperature.
圧以下の圧力で、ノズルから被加熱物に、吹き付けるよ
うにしたことを特徴とする特許請求の範囲第１項記載の
加熱方法。5. The heating method according to claim 1, wherein the blower blows air under pressure and blows it from the nozzle onto the article to be heated at a pressure of 10 mmAq or more and 1 atm or less.
の被加熱物を加熱する加熱装置において、前記被加熱物
の幅及び長さの少なくとも一方より短い間隔で、且つ、
250mmピッチ以下の間隔で、熱風吹き付け部と熱風吸い
込み部が存在し、さらに、前記被加熱物に対して、上方
向側又は、下方向側又は上下両方側に各２ヶ所以上存在
するようにしたことを特徴とする加熱装置。6. A heating device for heating an object to be heated, such as a printed circuit board on which electronic parts are mounted, at an interval shorter than at least one of the width and the length of the object to be heated, and
A hot air blowing part and a hot air sucking part are present at intervals of 250 mm pitch or less, and further, there are two or more locations on the upper side, the lower side, or both the upper and lower sides of the object to be heated. A heating device characterized by the above.
されたことを特徴とする特許請求の範囲第６項記載の加
熱装置。7. The heating device according to claim 6, wherein the hot air blowing section is formed of a cylindrical pipe.
成されたことを特徴とする特許請求の範囲第６項記載の
加熱装置。8. The heating device according to claim 6, wherein the hot air blowing section is formed of a quadrangular prismatic pipe.
成されたことを特徴とする特許請求の範囲第６項記載の
加熱装置。9. The heating device according to claim 6, wherein the hot air blowing section is formed of a hexagonal columnar pipe.
付け部と、熱風吸い込み部を形成したことを特徴とする
特許請求の範囲第６項記載の加熱装置。10. The heating device according to claim 6, wherein the pipes are bundled and fixed to each other to form a hot air blowing portion and a hot air suction portion.
込み束ね合わせたことを特徴とする特許請求の範囲第10
項記載の加熱装置。11. The hot air heating heater is incorporated and bundled between pipes, and the invention is set forth in claim 10.
The heating device according to the item.
に熱風吹き出しまたは、熱風吸い込み用のパイプをはめ
込み固定したことを特徴とする特許請求の範囲第10項記
載の加熱装置。12. The heating apparatus according to claim 10, wherein the metal plate is subjected to burring processing, and a pipe for blowing hot air or sucking hot air is fitted and fixed in the hole.
形成し、そこにパイプを通し、固定するようにしたこと
を特徴とする特許請求の範囲第12項記載の加熱装置。13. The heating device according to claim 12, wherein a convex portion is formed inside the burring hole, and a pipe is passed through the convex portion to be fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12215589A JP2682138B2 (en) | 1989-05-16 | 1989-05-16 | Heating method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12215589A JP2682138B2 (en) | 1989-05-16 | 1989-05-16 | Heating method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02303674A JPH02303674A (en) | 1990-12-17 |
| JP2682138B2 true JP2682138B2 (en) | 1997-11-26 |
Family
ID=14828962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12215589A Expired - Lifetime JP2682138B2 (en) | 1989-05-16 | 1989-05-16 | Heating method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2682138B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006153440A (en) * | 2001-02-23 | 2006-06-15 | Tamura Seisakusho Co Ltd | Hot blast type heating device and heating furnace |
| JP2006162247A (en) * | 2001-02-23 | 2006-06-22 | Tamura Seisakusho Co Ltd | Heating furnace |
| US7692119B2 (en) | 2005-06-30 | 2010-04-06 | Tamura Fa System Corporation | Reflow furnace |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0846350A (en) * | 1994-07-27 | 1996-02-16 | Alps Electric Co Ltd | Reflow soldering device |
| US6145734A (en) * | 1996-04-16 | 2000-11-14 | Matsushita Electric Industrial Co., Ltd. | Reflow method and reflow device |
| EP1870191B9 (en) | 2004-08-04 | 2012-09-19 | Senju Metal Industry Co., Ltd. | Reflow oven |
| GB0512184D0 (en) * | 2005-06-15 | 2005-07-20 | Rolls Royce Plc | Method and apparatus for the treatment of a component |
| HUE052283T2 (en) * | 2009-09-24 | 2021-04-28 | Senju Metal Industry Co | Nozzle for heating or cooling device, heating or cooling device with such nozzle |
-
1989
- 1989-05-16 JP JP12215589A patent/JP2682138B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006153440A (en) * | 2001-02-23 | 2006-06-15 | Tamura Seisakusho Co Ltd | Hot blast type heating device and heating furnace |
| JP2006162247A (en) * | 2001-02-23 | 2006-06-22 | Tamura Seisakusho Co Ltd | Heating furnace |
| JP4537312B2 (en) * | 2001-02-23 | 2010-09-01 | 株式会社タムラ製作所 | Hot air jet type heating device and heating furnace |
| US7692119B2 (en) | 2005-06-30 | 2010-04-06 | Tamura Fa System Corporation | Reflow furnace |
| CN1893774B (en) * | 2005-06-30 | 2011-05-04 | 田村古河机械株式会社 | Reflow furnace |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02303674A (en) | 1990-12-17 |
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