JP2680739B2 - Resin bond super abrasive whetstone - Google Patents

Resin bond super abrasive whetstone

Info

Publication number
JP2680739B2
JP2680739B2 JP2609991A JP2609991A JP2680739B2 JP 2680739 B2 JP2680739 B2 JP 2680739B2 JP 2609991 A JP2609991 A JP 2609991A JP 2609991 A JP2609991 A JP 2609991A JP 2680739 B2 JP2680739 B2 JP 2680739B2
Authority
JP
Japan
Prior art keywords
resin
grains
superabrasive
bond
grindstone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2609991A
Other languages
Japanese (ja)
Other versions
JPH04269172A (en
Inventor
肇 吉岡
文雄 井内
幸夫 樹神
明久 小泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP2609991A priority Critical patent/JP2680739B2/en
Publication of JPH04269172A publication Critical patent/JPH04269172A/en
Application granted granted Critical
Publication of JP2680739B2 publication Critical patent/JP2680739B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明の、CBN粒若しくはダイ
ヤモンド粒をレジンボンド(結合材)で固めて成るレジ
ンボンド超砥粒砥石に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-bonded superabrasive grindstone obtained by solidifying CBN grains or diamond grains with a resin bond (bonding material).

【0002】[0002]

【従来の技術】CBN(立方晶窒化硼素)粒若しくはダ
イヤモンド粒を超砥粒として用いてなる砥石は、従来よ
り知られており、CBN粒を用いたCBN砥石は主に金
属加工用に、又ダイヤモンド砥石は主にセラミックス加
工用にそれぞれ使用されている。そして、これらの砥石
は、超砥粒を固めるボンド(結合材)の種類によって、
メタルボンド砥石,レジンボンド砥石,ビトリファイド
ボンド砥石と3種類に分類されるが、一般にはレジン
(樹脂)を用いたレジンボンド砥石が最も多く用いられ
ている。
2. Description of the Related Art A grindstone using CBN (cubic boron nitride) grains or diamond grains as superabrasive grains has been conventionally known, and a CBN grindstone using CBN grains is mainly used for metal working and Diamond whetstones are mainly used for ceramics processing. And, these grindstones, depending on the type of bond (bonding material) that hardens the superabrasive grains,
There are three types of metal bond grindstones, resin bond grindstones, and vitrified bond grindstones. Generally, resin bond grindstones using resin (resin) are most often used.

【0003】レジンボンド砥石は、一般に、図2に示す
ような構造を有しており、超砥粒1は外表面が凹凸とな
ったNiコーティング層2が施された状態でレジンボン
ド3中に保持されている。なお、Niコーティング層2
は、超砥粒1とレジンボンド3との接着性を高めるため
のものであり、必ずしも必要ではない。
A resin bond grindstone generally has a structure as shown in FIG. 2, in which a superabrasive grain 1 is provided in a resin bond 3 with a Ni coating layer 2 having an uneven outer surface. Is held. The Ni coating layer 2
Is for enhancing the adhesiveness between the superabrasive grain 1 and the resin bond 3 and is not always necessary.

【0004】かかるレジンボンド砥石の性能はレジンボ
ンド3の砥粒保持力により左右され、研削時にNiコー
ティング層2が施された超砥粒1が脱落し難しいかどう
かが問題となる。そこで、レジンボンドの砥粒保持力を
増強させて砥粒脱落を抑制するレジンボンド超砥粒砥石
が種々検討されている。
The performance of such a resin-bonded grindstone depends on the abrasive-grain holding force of the resin-bond 3, and there is a problem whether the super-abrasive grains 1 having the Ni coating layer 2 applied thereto are difficult to drop during grinding. Therefore, various resin-bond superabrasive grindstones have been studied, which enhance the abrasive-particle holding power of the resin bond and suppress the falling of the abrasive grains.

【0005】そして、従来においては、図3に示すよう
に超砥粒1にNiコーティング層2を施した後、例えば
SiCを多く含んだ硬質レジン層4、さらにその周りに
通常の軟質レジン層5をそれぞれコーティングしてコー
ティング超砥粒6とし(図3(A))、このコーティン
グ超砥粒6を金型7内に充填・集合(図3(B))、所
定荷重をかけて焼成したレジンボンド超砥粒砥石8(図
3(C))が検討されている。
In the prior art, as shown in FIG. 3, after the Ni coating layer 2 is applied to the superabrasive grains 1, for example, a hard resin layer 4 containing a large amount of SiC, and a usual soft resin layer 5 around the hard resin layer 4. To form coated super-abrasive grains 6 (FIG. 3 (A)), and the coated super-abrasive grains 6 are filled / assembled in a mold 7 (FIG. 3 (B)) and baked by applying a predetermined load. A bond superabrasive grindstone 8 (FIG. 3 (C)) is under consideration.

【0006】[0006]

【発明が解決しようとする課題】前述したように、超砥
粒1に2重あるいはそれ以上に異種のレジン層をコーテ
ィングしたコーティング超砥粒6を集合・焼成した場
合、図3(C)に示すようにレジンボンド超砥粒砥石8
において硬質レジンと軟質レジンとの境界が曖昧なもの
となり、内側にコーティングした硬質レジン層4の効果
である砥粒保持力が十分に得られないという問題があ
る。
As described above, when the superabrasive grains 1 are coated with the coated superabrasive grains 6 in which two or more different types of resin layers are coated and fired, as shown in FIG. Resin bond superabrasive grindstone 8 as shown
In the above, there is a problem that the boundary between the hard resin and the soft resin becomes ambiguous, and the abrasive grain holding force which is the effect of the hard resin layer 4 coated on the inside cannot be sufficiently obtained.

【0007】本発明はこのような事情に鑑み、砥粒保持
力が十分に大きいレジンボンド超砥粒砥石を提供するこ
とを目的とする。
In view of such circumstances, it is an object of the present invention to provide a resin-bonded superabrasive grindstone having a sufficiently large abrasive retention.

【0008】[0008]

【課題を解決するための手段】前記目的を達成する本発
明に保るレジンボンド超砥粒砥石は、CBN粒若しくは
ダイヤモンド粒をレジンボンド中に散在させたレジンボ
ンド超砥粒砥石であってCBN粒若しくはダイヤモンド
粒を硬質レジンで被覆したコーティング超砥粒と、軟質
レジンを造粒した軟質レジン粒子とを混合・加圧焼成し
てなることを特徴とする。
A resin bond superabrasive grindstone according to the present invention for achieving the above object is a resin bond superabrasive grindstone in which CBN grains or diamond grains are dispersed in a resin bond. It is characterized in that coating superabrasive grains in which grains or diamond grains are coated with a hard resin and soft resin grains in which a soft resin is granulated are mixed and fired under pressure.

【0009】[0009]

【作用】硬質レジン層を有するコーティング超砥粒と軟
質レジンからなる軟質レジン粒子とを混合して焼成する
と、コーティング超砥粒の間に軟質レジン粒子が入り込
んだ状態で結合されるので、レジン溶融状態での超砥粒
の移動距離が小さく、超砥粒の周囲に硬質レジン層が保
持された状態のレジンボンド超砥粒砥石となる。
[Function] When the coating superabrasive grains having the hard resin layer and the soft resin particles made of the soft resin are mixed and fired, the soft resin particles are bonded in a state in which the resin particles melt between the coating superabrasive grains. The resin-bonded superabrasive grindstone has a small movement distance of the superabrasive grains in a state and a hard resin layer is held around the superabrasive grains.

【0010】[0010]

【実施例】以下、本発明を実施例に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments.

【0011】図1は一実施例に係るレジンボンド超砥粒
砥石を示す説明図である。図1(A)に示すように、本
実施例のレジンボンド超砥粒砥石10においては、CB
N粒若しくはダイヤモンド粒からなる超砥粒11はニッ
ケル等の金属コーティング層12及び硬質レジン層13
が施されたコーティング超砥粒14として、軟質レジン
ボンド15により分散・結合されている。
FIG. 1 is an explanatory view showing a resin bond superabrasive grindstone according to one embodiment. As shown in FIG. 1 (A), in the resin bond superabrasive grindstone 10 of the present embodiment, CB
The superabrasive grain 11 made of N grains or diamond grains is a metal coating layer 12 of nickel or the like and a hard resin layer 13.
The coated superabrasive grains 14 provided with the above are dispersed and bonded by a soft resin bond 15.

【0012】このレジンボンド超砥粒砥石10を製造す
るには、まず、例えばCBN砥粒からなる超砥粒11に
金属コーティング層12をコーティングし、さらに、硬
質レジン層13をコーティングしてコーティング超砥粒
14を形成する(図1(B))。ここで、硬質レジン層
13は、例えばフェノール樹脂,エポキシ樹脂,ポリイ
ミド樹脂等のレジンに硬質粒子を添加して耐摩耗性を向
上させたものであり、硬質粒子としては、SiC,Si
3 4 ,B4 C,WC,TiN等のセラミックス粉末、
あるいはCBN粉末、ダイヤモンド粉末を挙げることが
できる。本実施例ではSiCを20vol%含有した硬質レ
ジンを用いて硬質レジン層13とした。また、別に、S
iCを8vol%含む軟質レジンを造粒して軟質レジン粒子
16を形成する(図1(B))。そして、このように形
成したコーティング超砥粒14と軟質レジン粒子16と
を混合して金型17に充填し、所定荷重をかけて焼成す
ることにより(図1(C))、集中度100,粒度14
0のレジンボンド超砥粒砥石10とする。
In order to manufacture the resin-bonded superabrasive grindstone 10, first, a superabrasive grain 11 made of, for example, CBN abrasive grains is coated with a metal coating layer 12, and further, a hard resin layer 13 is coated. The abrasive grains 14 are formed (FIG. 1 (B)). Here, the hard resin layer 13 is made by adding hard particles to a resin such as a phenol resin, an epoxy resin, or a polyimide resin to improve wear resistance.
Ceramic powder such as 3 N 4 , B 4 C, WC, and TiN,
Alternatively, CBN powder and diamond powder can be used. In this embodiment, the hard resin layer 13 is made of a hard resin containing 20 vol% of SiC. In addition, S
Soft resin particles containing 8 vol% of iC are granulated to form soft resin particles 16 (FIG. 1 (B)). Then, the coated superabrasive particles 14 and the soft resin particles 16 thus formed are mixed and filled in a mold 17, and a predetermined load is applied (FIG. 1 (C)) to perform a concentration of 100, Grain size 14
The resin-bonded superabrasive grindstone 10 of 0 is used.

【0013】このように製作されるレジンボンド超砥粒
砥石10では、混合・集合時に軟質レジン粒子16がコ
ーティング超砥粒14の間に入り込み、焼成時のレジン
溶融状態でコーティング超砥粒14の移動があまりな
く、硬質レジン層13と軟質レジン粒子16とがほどん
ど混ざりあわずに軟質レジン粒子16が軟質レジンボン
ド15を形成するようになる。したがって、焼成後に超
砥粒11の周囲に硬質レジン層13が維持されており、
その砥粒保持力が十分発揮される。因みに、従来技術の
項で説明したように超砥粒に硬質レジン層及び軟質レジ
ン層を形成した場合には、粒子が大きくなって集合時の
すきまが大きく焼成時のレジン溶融状態で砥粒移動距離
が大きくなると考えられる。したがって硬質レジン層と
軟質レジン層とが混ざりあったレジンボンドとなり、砥
粒保持力が低下したものとなると考えられる。
In the resin-bonded superabrasive grindstone 10 manufactured as described above, the soft resin particles 16 enter between the coating superabrasive particles 14 at the time of mixing and assembling, and the coating superabrasive particles 14 are melted in a resin molten state at the time of firing. There is not much movement, and the hard resin layer 13 and the soft resin particles 16 hardly mix and the soft resin particles 16 form the soft resin bond 15. Therefore, the hard resin layer 13 is maintained around the superabrasive grains 11 after firing,
The holding power of the abrasive grains is sufficiently exerted. By the way, when the hard resin layer and the soft resin layer are formed on the superabrasive grains as explained in the section of the prior art, the grains become large and the clearance at the time of assembly is large and the abrasive grains move in the molten state of the resin during firing. It is thought that the distance will increase. Therefore, it is considered that the hard resin layer and the soft resin layer are mixed to form a resin bond, and the abrasive grain holding power is lowered.

【0014】[0014]

【発明の効果】以上説明したように、本発明のレジンボ
ンド超砥粒砥石は、硬質レジン層を有する超砥粒が軟質
レジンボンドで結合されているので、砥粒保持力が大き
く、研削時に超砥粒が脱落し難いものである。
As described above, in the resin-bonded superabrasive grain grinding wheel of the present invention, since the superabrasive grains having the hard resin layer are bonded by the soft resin bond, the abrasive grain retention force is large, It is difficult for the superabrasive grains to fall off.

【図面の簡単な説明】[Brief description of the drawings]

【図1】一実施例に係るレジンボンド超砥粒砥石を説明
する概略図である。
FIG. 1 is a schematic view illustrating a resin-bonded superabrasive grindstone according to an embodiment.

【図2】レジンボンド砥石の一例を示す概略図である。FIG. 2 is a schematic view showing an example of a resin bond grindstone.

【図3】従来のレジンボンド砥石を説明する概略図であ
る。
FIG. 3 is a schematic view illustrating a conventional resin bond grindstone.

【符号の説明】[Explanation of symbols]

10 レジンボンド超砥粒砥石 11 超砥粒 12 金属コーティング層 13 硬質レジン層 14 コーティング超砥粒 15 軟質レジンボンド 16 軟質レジン粒子 17 金型 10 Resin Bond Super Abrasive Grain Stone 11 Super Abrasive Grain 12 Metal Coating Layer 13 Hard Resin Layer 14 Coating Super Abrasive Grain 15 Soft Resin Bond 16 Soft Resin Particle 17 Mold

フロントページの続き (72)発明者 小泉 明久 京都府京都市右京区太秦巽町1番地 三 菱重工業株式会社 京都精機製作所内 (56)参考文献 特開 平3−281172(JP,A) 特開 平4−256579(JP,A)Front Page Continuation (72) Inventor Akihisa Koizumi 1 Uzumasa Tatsumi-cho, Ukyo-ku, Kyoto, Japan Sanryo Heavy Industries Co., Ltd. Kyoto Seiki Co., Ltd. (56) Reference JP-A-3-281172 (JP, A) JP-A-4 -256579 (JP, A)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 CBN粒若しくはダイヤモンド粒をレジ
ンボンド中に散在させたレジンボンド超砥粒砥石であっ
てCBN粒若しくはダイヤモンド粒を硬質レジンで被覆
したコーティング超砥粒と、軟質レジンを造粒した軟質
レジン粒子とを混合・加圧焼成してなることを特徴とす
るレジンボンド超砥粒砥石。
1. A resin-bonded superabrasive grindstone in which CBN grains or diamond grains are dispersed in a resin bond, wherein coated CBN grains or diamond grains are coated with a hard resin, and a soft resin is granulated. A resin bond superabrasive grindstone characterized by being formed by mixing soft resin particles and firing under pressure.
JP2609991A 1991-02-20 1991-02-20 Resin bond super abrasive whetstone Expired - Lifetime JP2680739B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2609991A JP2680739B2 (en) 1991-02-20 1991-02-20 Resin bond super abrasive whetstone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2609991A JP2680739B2 (en) 1991-02-20 1991-02-20 Resin bond super abrasive whetstone

Publications (2)

Publication Number Publication Date
JPH04269172A JPH04269172A (en) 1992-09-25
JP2680739B2 true JP2680739B2 (en) 1997-11-19

Family

ID=12184151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2609991A Expired - Lifetime JP2680739B2 (en) 1991-02-20 1991-02-20 Resin bond super abrasive whetstone

Country Status (1)

Country Link
JP (1) JP2680739B2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT403671B (en) * 1996-02-14 1998-04-27 Swarovski Tyrolit Schleif GRINDING TOOL WITH A METAL RESIN BINDING AGENT AND METHOD FOR THE PRODUCTION THEREOF
JP4555580B2 (en) * 2004-01-19 2010-10-06 旭ダイヤモンド工業株式会社 Super abrasive wheel for precision grinding of hard and brittle materials, method for producing the same, and grinding method using the super abrasive wheel
JP5772039B2 (en) 2011-02-15 2015-09-02 株式会社リコー Method for manufacturing electromechanical conversion film and method for manufacturing electromechanical conversion element
JP5953775B2 (en) * 2012-01-31 2016-07-20 株式会社ジェイテクト Vitrified bond grinding wheel manufacturing method
JP2013154441A (en) * 2012-01-31 2013-08-15 Jtekt Corp Vitrified bond grindstone manufacturing method and vitrified bond grindstone
US9908216B2 (en) * 2012-01-31 2018-03-06 Jtekt Corporation Grinding wheel manufacturing method and grinding wheel
CN115056149B (en) * 2022-06-24 2024-01-26 佛山科学技术学院 Resin grinding wheel and preparation method and application thereof
CN115338783B (en) * 2022-08-03 2024-04-16 莆田市屹立砂轮磨具有限公司 Grinding wheel grinding tool with long service life and preparation process thereof

Also Published As

Publication number Publication date
JPH04269172A (en) 1992-09-25

Similar Documents

Publication Publication Date Title
JPS6336905B2 (en)
US5651729A (en) Grinding wheel, grinding rim for a grinding tool, and method of manufacturing a grinding tool
JP2680739B2 (en) Resin bond super abrasive whetstone
US3899307A (en) Resin bonded diamond wheels with copper and silicon carbide fillers
JP2659811B2 (en) Resin bond super abrasive whetstone
JP2971764B2 (en) Abrasive fixed type polishing table
JP3712832B2 (en) Resinoid super abrasive wheel
JP2834363B2 (en) Resin bond whetstone
JPS6311283A (en) Diamond wheel and formation thereof
JP2695683B2 (en) Resin bond super abrasive whetstone
JP3051486B2 (en) Metal Bond Super Abrasive Whetstone
JP2678288B2 (en) Superabrasive vitrified bond grindstone and manufacturing method
JPH0716879B2 (en) Grinding tool
JP2580280B2 (en) Resin bond whetstone
KR100334430B1 (en) Tip manufacturing method of grinding wheel
JPH085012B2 (en) Metal bond whetstone
JPH04269175A (en) Polishing disk and manufacture thereof
JP2680740B2 (en) Method for manufacturing resin bond superabrasive grindstone
JPH05192868A (en) Vitrified bond super hard abrasive grain grinding wheel
JP3039118B2 (en) Resin bond whetstone
JP2003220563A (en) Vitrified bonded wheel
JPH05192867A (en) Vitrified bond super head abrasive grain grinding wheel
JP3086668B2 (en) Vitrified bond super abrasive whetstone
JPH03245973A (en) Resin bonding super abrasive grain grindstone
JPH04322972A (en) Binder material for diamond abrasive grain

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19970701

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20070801

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080801

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080801

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090801

Year of fee payment: 12

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090801

Year of fee payment: 12

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100801

Year of fee payment: 13

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100801

Year of fee payment: 13

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110801

Year of fee payment: 14

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110801

Year of fee payment: 14