JP2666778B2 - Substrate editor for electronic device and method of dividing the same - Google Patents
Substrate editor for electronic device and method of dividing the sameInfo
- Publication number
- JP2666778B2 JP2666778B2 JP7164261A JP16426195A JP2666778B2 JP 2666778 B2 JP2666778 B2 JP 2666778B2 JP 7164261 A JP7164261 A JP 7164261A JP 16426195 A JP16426195 A JP 16426195A JP 2666778 B2 JP2666778 B2 JP 2666778B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- substrate
- board
- dividing
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子装置用基板編集体お
よびその分割方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board editing body for an electronic device and a dividing method thereof.
【０００２】[0002]
【従来の技術】プリント配線板等により形成され、電子
部品が実装されてハイブリッドＩＣ等に組立てられる電
子装置用基板は、組立工程における装置の適用の容易化
や効率化のため複数の基板を連結したり、縁取り部を付
けたりして常に同じ大きさの編集体として組立に投入す
るのが普通である。特に多品種少量生産を実施している
製造者においてはこれが顕著である。2. Description of the Related Art A substrate for an electronic device formed of a printed wiring board or the like, on which electronic components are mounted and assembled into a hybrid IC or the like, is formed by connecting a plurality of substrates for facilitating application of the device in an assembly process and improving efficiency. It is common to always put them into the assembly as an editing body of the same size, for example, by adding a border or adding a border. This is particularly remarkable in a manufacturer that performs high-mix low-volume production.
【０００３】従来の電子装置用基板編集体は図３に示す
ように、ガラス−エポキシ樹脂基板から成り、ある所定
の大きさとなるように電子装置用基板部１が連結部３に
より複数連結され、その外周に縁取り部２が連結されて
いる。そして、連結部３は各部分の間の基板材を部分的
に残す形で形成されている。この連結部３の厚さは周囲
の部分と同じ厚さとなっている。電子装置に組立後、個
々の電子装置を編集状態から分割するが、この分割は図
４に示すように、通常、量産性の良い金型によるプレス
切断で連結部３を落とすことにより実施している。金型
はポンチ５とダイス６から成り、また押さえとしてスト
リッパ７を備えている。ポンチ５とダイス６の間にはク
リアランス８と言われる間隔がとられる。このクリアラ
ンス８には切断される材料とその厚さに応じて最適値が
有る。大き過ぎれば上，下面においてだれとかえりを大
きく生じ、また断面は大きく流れガラス繊維が飛び出る
などのバリが生じ易くなり、外観が悪くなるばかりでな
く、設計寸法の制限をこえたり、マザーボードの電極に
接触してオープン不良になる。また、小さ過ぎればせん
断抵抗が大きくなって金型に大きく力が加わり金型の寿
命が短くなる。従って、クリアランス８は基板材質が同
じであれば、板厚によって変える必要が有った。As shown in FIG. 3, a conventional electronic device board editing body is made of a glass-epoxy resin substrate, and a plurality of electronic device board portions 1 are connected by a connecting portion 3 so as to have a predetermined size. A rim portion 2 is connected to the outer periphery. The connecting portion 3 is formed so as to partially leave the substrate material between the portions. The thickness of the connecting portion 3 is the same as that of the surrounding portion. After assembling into the electronic device, the individual electronic devices are divided from the editing state. As shown in FIG. 4, this division is usually performed by dropping the connecting portion 3 by press cutting with a mold having good mass productivity. I have. The mold comprises a punch 5 and a die 6, and has a stripper 7 as a retainer. An interval called a clearance 8 is provided between the punch 5 and the die 6. The clearance 8 has an optimum value according to the material to be cut and its thickness. If it is too large, large burrs will be formed on the upper and lower surfaces, the cross section will be large, and burrs such as glass fiber will pop out. And contact with it will cause open failure. On the other hand, if it is too small, the shear resistance increases and a large force is applied to the mold, thereby shortening the life of the mold. Therefore, if the substrate material is the same, the clearance 8 needs to be changed according to the plate thickness.
【０００４】[0004]
【発明が解決しようとする課題】近年、プラスチックＬ
ＣＣなどにおいて、ボンディグし易いように電子装置用
基板中にチップ搭載用の凹部を形成する場合があり、通
常よりも厚い基板を用いる必要がでてきた。そのため、
同じ製品群でも厚みの異った複数の基板を用いなければ
ならなくなっている。この従来の電子装置用基板編集体
では、板厚が大きく異なったものに対しては板厚以外の
寸法が同じであったとしても同じ金型による分割は、ク
リアランスの問題で適切な状態で切断が実施できないた
め、困難であった。このため、異なった板厚のものに対
して、別の金型を用意しなけらばならず、多大な費用と
長い期間が必要であり、特に、多品種少量生産の場合に
は、この初期的な費用が多く必要で大きな負担となって
おり安く電子装置が製造できないという問題が有った。In recent years, plastic L
In CC and the like, there is a case where a concave portion for mounting a chip is formed in a substrate for an electronic device in order to facilitate bonding, and it is necessary to use a substrate thicker than usual. for that reason,
Even in the same product group, a plurality of substrates having different thicknesses must be used. In this conventional electronic device board editing body, even if the board thickness differs greatly, even if the dimensions other than the board thickness are the same, division by the same mold is cut in an appropriate state due to clearance problems. It was difficult because it was not possible. For this reason, different molds must be prepared for different thicknesses, which requires enormous costs and a long period of time. However, there is a problem that electronic equipment cannot be manufactured at a low cost because a large cost is required and a large burden is imposed.
【０００５】本発明の目的は、電子装置用基板編集体の
板厚が異っても同じ金型による分割が可能で、多大な費
用と長期間を必要とせず、安価に電子装置を製造できる
電子装置用基板編集体およびその分割方法を提供するこ
とにある。SUMMARY OF THE INVENTION An object of the present invention is to enable an electronic device to be manufactured at a low cost without requiring a great deal of cost and a long period of time, even if the thickness of the board edit body for the electronic device varies. An object of the present invention is to provide a substrate edit body for an electronic device and a method for dividing the same.
【０００６】[0006]
【課題を解決するための手段】本発明の電子装置用基板
編集体は、配線と絶縁層とを備え電子部品が実装されて
電子装置を構成する複数の電子装置用基板と、この複数
の電子装置用基板の周囲に配置された縁取り部と、この
縁取り部と前記複数の電子装置用基板およびこの複数の
電子装置用基板のそれぞれを連結する連結部とを有する
電子装置用基板編集体において、前記連結部の少くとも
個々の前記電子装置用基板を前記電子装置用基板編集体
から分割するための切断を実施する部分に溝を設け、こ
の溝の切断実施部分を所定の板厚に形成したことを特徴
とする。According to the present invention, there is provided an electronic device board editing body comprising a plurality of electronic device substrates comprising wiring and an insulating layer on which electronic components are mounted to constitute an electronic device; In an electronic device board editing body having a rim arranged around the device substrate and a connecting portion connecting the rim and the plurality of electronic device substrates and the plurality of electronic device substrates, At least the connection
Each of the electronic device substrates is converted into the electronic device substrate editing body.
A groove provided in a portion to carry out the cutting for dividing from this
The cutting portion of the groove is formed to have a predetermined plate thickness .
【０００７】本発明の電子装置用基板編集体の分割方法
は、請求項１記載の電子装置用基板編集体を連結部の所
定の板厚になるように形成された溝の部分でポンチとダ
イスによるプレス切断を行って分割を実施することを特
徴とする。According to the method of dividing the electronic device substrate editing body of the present invention, the electronic device substrate editing body according to the first aspect of the present invention is provided with a punch and a die at a groove formed at a predetermined thickness of the connecting portion. And press-cutting is performed to perform division.
【０００８】[0008]
【実施例】次に本発明の実施例について図面を参照して
説明する。Next, an embodiment of the present invention will be described with reference to the drawings.
【０００９】図１は本発明の電子装置用基板編集体の一
実施例の要部斜視図である。本発明の電子装置用基板編
集体の一実施例は、図１に示すように、まず、ガラス−
エポキシ樹脂等の材質の１枚のプリント配線板より図３
に示した従来の電子装置用基板編集体と同様に、電子装
置用基板部１と、縁取り部２およびそれぞれの電子装置
用基板部１と電子装置用基板部１と縁取り部２を連結す
る連結部３を形成する。次に、連結部３全体の上面をル
ータ加工等により切削し、断面形状が連結部３の長さに
等しい幅をもった溝４を形成する。溝４の残り厚みは、
対象とする複数の電子装置用基板編集体のなかで外形が
同一で厚みが最も薄い基板の厚みとほぼ等しく設定す
る。FIG. 1 is a perspective view of a main part of an embodiment of a board edit body for an electronic device according to the present invention. One embodiment of the electronic device substrate editing body of the present invention, as shown in FIG.
Fig. 3 from a single printed wiring board made of epoxy resin or other material
In the same manner as the conventional electronic device substrate editing body shown in FIG. 1, the electronic device substrate portion 1, the edging portion 2, and the connection for connecting the respective electronic device substrate portions 1, the electronic device substrate portion 1, and the edging portion 2 to each other. The part 3 is formed. Next, the upper surface of the entire connecting portion 3 is cut by a router process or the like to form a groove 4 having a cross section having a width equal to the length of the connecting portion 3. The remaining thickness of the groove 4 is
The thickness is set substantially equal to the thickness of the thinnest substrate among the plurality of target electronic device board editing bodies.
【００１０】図２は図１の電子装置用基板編集体の分割
方法の一実施例を説明するプレス金型の断面図である。
図１に示した電子装置用基板編集体の分割方法の一例
は、図２に示すように、連結部３の周辺部にポンチ５，
ダイス６およびストリッパ７を配置し、ストリッパ７で
電子装置用基板部１を押えながらポンチ５を下降させて
プレス金型による連結部３の溝４におけるプレス切断を
行う。このときの切断部の厚みは、対象とする外形が同
一の複数の電子装置用基板編集体のうちで最も薄い基板
の厚みとほぼ等しく形成されているので最も板厚の薄い
電子装置用基板編集体に用いたプレス金型が問題なく共
用できるので、新らたに金型を作成する必要は無い。
尚、一般に、金型で切断される基板の板厚は、ポンチ５
の幅より薄い方がポンチ５の強度の点で望ましく、ポン
チ５の幅があまりにも狭いとポンチ５が折れてしまった
り、ポンチ５にかかる単位面積当りの力が大きくなるた
め寿命が短くなるので、溝４はこの切断厚みより幅広で
あった方が良い。ガラス−エポキシ樹脂を基板とした電
子装置用基板編集体では、板厚が０．４〜０．８ｍｍで
ある場合に金型による切断の不具合いが少く、また、電
子装置用基板としても十分な強度を得ることができる。
板厚が１．６ｍｍ以上になると金型での分割精度が得ら
れにくくなり、０．１ｍｍを越えるバリやかけが発生す
る。FIG. 2 is a sectional view of a press die for explaining an embodiment of a method of dividing the electronic device substrate editing body of FIG.
One example of a method of dividing the electronic device substrate editing body shown in FIG. 1 is as shown in FIG.
The die 6 and the stripper 7 are arranged, and the punch 5 is lowered while pressing the electronic device substrate 1 with the stripper 7 to perform press cutting in the groove 4 of the connecting portion 3 by a press die. The thickness of the cut portion at this time is substantially the same as the thickness of the thinnest substrate among the plurality of electronic device substrate editing bodies having the same target outer shape, so that the electronic device substrate editing with the smallest thickness is performed. Since the press mold used for the body can be shared without any problem, there is no need to create a new mold.
In general, the thickness of a substrate cut by a die is a punch 5
Is preferable in terms of the strength of the punch 5. If the width of the punch 5 is too narrow, the punch 5 will be broken or the force applied to the punch 5 per unit area will be large, and the life will be shortened. The groove 4 is preferably wider than the cut thickness. In a board edit body for an electronic device using a glass-epoxy resin as a substrate, when the plate thickness is 0.4 to 0.8 mm, there is little trouble of cutting by a mold, and it is also sufficient as a substrate for an electronic device. Strength can be obtained.
When the plate thickness is 1.6 mm or more, it becomes difficult to obtain the accuracy of division with a mold, and burrs or cracks exceeding 0.1 mm occur.
【００１１】以上本発明の一実施例について説明した
が、溝は電子装置用基板編集体の上面ばかりでなく、下
面または上下両面に形成しても同じ効果が得られる。Although the embodiment of the present invention has been described above, the same effect can be obtained by forming the groove not only on the upper surface but also on the lower surface or both upper and lower surfaces of the electronic device substrate editing body.
【００１２】[0012]
【発明の効果】以上説明したように本発明は、板厚の電
子装置用基板編集体において、その連結部に溝を形成し
て切断部の板厚を対象とする電子装置用基板編集体のう
ちで最も薄い板厚と同等としたので、それぞれの電子装
置用基板の個片分割の際に金型を共用でき、低コストで
品質の良い分割が容易に実施できるようになるという効
果がある。例えば、従来では０．５ｍｍの板厚の電子装
置用基板と１．２ｍｍのものとでは同じ金型で満足のい
く切断は実施できなかったが、本発明の適用により、同
じ金型を用いて双方満足のいく分割をすることが可能と
なり、電子装置用基板の製造費用と工数を大きく省くこ
とができた。As described above, the present invention relates to a board edit body for an electronic device having a plate thickness, wherein a groove is formed in a connecting portion of the board edit body, and the board edit body for an electronic device is intended for the board thickness of a cut portion. Since the thickness is the same as the thinnest among them, a mold can be shared when dividing each electronic device substrate into individual pieces, and there is an effect that high quality division can be easily performed at low cost. . For example, in the past, satisfactory cutting could not be performed using the same mold with a substrate for an electronic device having a thickness of 0.5 mm and a substrate with a thickness of 1.2 mm, but by applying the present invention, the same mold was used. It was possible to satisfactorily divide both of them, and it was possible to greatly reduce the manufacturing cost and man-hour of the substrate for an electronic device.
【図１】本発明の電子装置用基板編集体の一実施例の要
部斜視図である。FIG. 1 is a perspective view of a main part of an embodiment of a substrate editing body for an electronic device according to the present invention.
【図２】図１の電子装置用基板編集体の分割方法の一実
施例を説明するプレス金型の断面図である。FIG. 2 is a cross-sectional view of a press die for explaining an embodiment of a method of dividing the electronic device substrate editing body of FIG. 1;
【図３】従来の電子装置用基板編集体の一例の要部斜視
図である。FIG. 3 is a perspective view of a relevant part of an example of a conventional electronic device substrate editing body.
【図４】図３の電子装置用基板編集体の分割方法の一例
を説明するプレス金型の断面図である。FIG. 4 is a cross-sectional view of a press die illustrating an example of a method of dividing the electronic device substrate editing body of FIG. 3;
１ 電子装置用基板部 ２ 縁取り部 ３ 連結部 ４ 溝 ５ ポンチ ６ ダイス ７ ストリッパ ８ クリアランス DESCRIPTION OF SYMBOLS 1 Substrate part for electronic devices 2 Edge part 3 Connection part 4 Groove 5 Punch 6 Dice 7 Stripper 8 Clearance
Claims (3)
れて電子装置を構成する複数の電子装置用基板と、この
複数の電子装置用基板の周囲に配置された縁取り部と、
この縁取り部と前記複数の電子装置用基板およびこの複
数の電子装置用基板のそれぞれを連結する連結部とを有
する電子装置用基板編集体において、前記連結部の少く
とも個々の前記電子装置用基板を前記電子装置用基板編
集体から分割するための切断を実施する部分に溝を設
け、この溝の切断実施部分を所定の板厚に形成したこと
を特徴とする電子装置用基板編集体。A plurality of electronic device substrates each including a wiring and an insulating layer on which an electronic component is mounted to form an electronic device; a border disposed around the plurality of electronic device substrates;
In the electronic device board editing body having the edge portion, the plurality of electronic device substrates, and a connecting portion connecting each of the plurality of electronic device substrates, at least the individual electronic device substrates of the connecting portion are provided. For the electronic device substrate
A board editing body for an electronic device, characterized in that a groove is provided in a portion where cutting for dividing from the aggregate is performed, and a portion where the groove is cut is formed to a predetermined thickness .
寸法よりも大きいことを特徴とする請求項１記載の電子
装置用基板編集体。2. A width dimension of the groove is determined by a thickness of a portion to be cut.
The board edit body for an electronic device according to claim 1, wherein the board edit body is larger than a dimension .
連結部の所定の板厚になるように形成された溝の部分で
ポンチとダイスによるプレス切断を行って分割を実施す
ることを特徴とする電子装置用基板編集体の分割方法。3. The method according to claim 1, wherein the electronic device substrate editing body is divided by performing press cutting with a punch and a die at a groove portion formed to have a predetermined thickness of the connecting portion. A method for dividing a substrate editing body for an electronic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7164261A JP2666778B2 (en) | 1995-06-29 | 1995-06-29 | Substrate editor for electronic device and method of dividing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7164261A JP2666778B2 (en) | 1995-06-29 | 1995-06-29 | Substrate editor for electronic device and method of dividing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0918096A JPH0918096A (en) | 1997-01-17 |
| JP2666778B2 true JP2666778B2 (en) | 1997-10-22 |
Family
ID=15789733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7164261A Expired - Lifetime JP2666778B2 (en) | 1995-06-29 | 1995-06-29 | Substrate editor for electronic device and method of dividing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2666778B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050031288A (en) * | 2003-09-29 | 2005-04-06 | 산양전기주식회사 | Structure for joining and manufacturing method of flexible printed circuit board |
| JP5505494B2 (en) * | 2012-12-21 | 2014-05-28 | 日立金属株式会社 | Circuit board manufacturing method |
| TWI623247B (en) * | 2015-06-25 | 2018-05-01 | Wafer Mems Co Ltd | Mass production method of preform of passive component |
-
1995
- 1995-06-29 JP JP7164261A patent/JP2666778B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0918096A (en) | 1997-01-17 |
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