JP2665104B2 - Composite dielectric and printed circuit board - Google Patents
Composite dielectric and printed circuit boardInfo
- Publication number
- JP2665104B2 JP2665104B2 JP6423892A JP6423892A JP2665104B2 JP 2665104 B2 JP2665104 B2 JP 2665104B2 JP 6423892 A JP6423892 A JP 6423892A JP 6423892 A JP6423892 A JP 6423892A JP 2665104 B2 JP2665104 B2 JP 2665104B2
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- Prior art keywords
- dielectric
- inorganic
- composite
- composite dielectric
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
【０００１】[0001]
【産業上の利用分野】この発明は複合誘電体およびプリ
ント回路用基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite dielectric and a printed circuit board.
【０００２】[0002]
【従来の技術】高度情報化社会を迎え、情報伝送は、よ
り高速化、高周波化の傾向にある。自動車電話やパーソ
ナル無線等の移動無線、衛星放送、衛星通信やＣＡＴＶ
等のニューメディアも実用化されようとしている。一
方、移動無線やニューメディアでは、機器の小型化が推
進されている。これに伴って、誘電体共振器等のマイク
ロ波回路素子も小型化が強く望まれている。2. Description of the Related Art With the advent of an advanced information society, information transmission tends to be faster and higher in frequency. Mobile radio such as car phone and personal radio, satellite broadcasting, satellite communication and CATV
And other new media are also being put to practical use. On the other hand, in mobile radio and new media, miniaturization of devices has been promoted. Accordingly, there is a strong demand for miniaturization of microwave circuit elements such as dielectric resonators.
【０００３】マイクロ波回路素子の大きさは、使用電磁
波の波長が基準になる。比誘電率ε r の誘電体中を伝搬
する電磁波の波長λは、真空中の伝搬波長をλ0 とする
とλ＝λ0 ／（εr ）0.5 となる。したがって、素子は
使用される複合誘電体の誘電率が大きいほど小型化でき
る。このような誘電率向上のため、樹脂中に無機誘電体
粒子を分散させてなる複合誘電体が注目され、具体的な
ものも提案されている（例えば、特開昭63-96309号公
報）。この複合誘電体を用いたプリント回路用基板など
の場合、価格や後加工（切断、孔開、接着等）等にも優
れている。[0003] The size of the microwave circuit element depends on the electromagnetic
The wavelength of the wave is the reference. Relative permittivity ε rPropagation in dielectric
The wavelength λ of the electromagnetic wave to be transmitted0To be
And λ = λ0/ (Εr)0.5Becomes Therefore, the element
The larger the dielectric constant of the composite dielectric used, the smaller the size
You. In order to improve the dielectric constant, an inorganic dielectric
Attention has been focused on composite dielectrics consisting of dispersed particles.
Some have been proposed (for example, Japanese Patent Application Laid-Open No. 63-96309).
Information). Printed circuit boards using this composite dielectric
Is excellent in price and post-processing (cutting, drilling, bonding, etc.)
Have been.
【０００４】[0004]
【発明が解決しようとする課題】しかし、この無機誘電
体粒子含有の複合誘電体として、高い誘電率であって、
しかも、高周波での誘電損失が大きいというように両性
能共に優れているものが中々ない。一般的にマイクロ波
用とされている無機誘電体粒子を複合誘電体に用いて
も、複合誘電体での誘電率はさほど高くならない。例え
ば、前記の特開昭63-96309号公報に記載の無機誘電体粒
子は、誘電率の温度特性が良く高周波での誘電損失が小
さいが、誘電率そのものが小さく、実用性が低い。これ
は、無機誘電体粒子を単独で焼結させた時の誘電率が小
さいためである。この場合、具体的には焼結体で８４以
下である。However, the composite dielectric containing the inorganic dielectric particles has a high dielectric constant,
Moreover, none of them have excellent both performances such as a large dielectric loss at a high frequency. Even if inorganic dielectric particles generally used for microwaves are used for a composite dielectric, the dielectric constant of the composite dielectric does not increase so much. For example, the inorganic dielectric particles described in the above-mentioned JP-A-63-96309 have a good temperature characteristic of the dielectric constant and a small dielectric loss at high frequencies, but have a small dielectric constant and are of low practicality. This is because the dielectric constant when the inorganic dielectric particles are sintered alone is small. In this case, specifically, it is 84 or less for the sintered body.
【０００５】誘電率を上昇させるためには、焼結体で誘
電率の高い無機誘電体粒子を用いる必要がある。無機誘
電体として良く知られるＢａＴｉＯ3 焼結体で５００〜
２０００程度の誘電率があり、複合誘電体の誘電率を向
上させる効果はあるが、高周波での誘電損失が大きくな
る。また、最近研究開発がなされているＰｂ含有の無機
誘電体粒子も優れた誘電体ではあるが、後加工での切
断、孔開などの際、有害なＰｂを含む無機誘電体粒子の
飛散が起こり、公害上の問題を起こすため、やはり実用
的ではない。In order to increase the dielectric constant, it is necessary to use inorganic dielectric particles having a high dielectric constant in a sintered body. BaTiO 3 sintered body well known as an inorganic dielectric is 500-
It has a dielectric constant of about 2000, which has the effect of improving the dielectric constant of the composite dielectric, but increases the dielectric loss at high frequencies. In addition, Pb-containing inorganic dielectric particles, which have been recently researched and developed, are also excellent dielectrics. However, harmful Pb-containing inorganic dielectric particles may be scattered when cutting or opening holes in post-processing. However, it is not practical because it causes pollution problems.
【０００６】この発明は、上記事情に鑑み、十分な誘電
率があって、高周波域での誘電損失が小さく、しかも、
公害が起こる心配のない複合誘電体およびプリント回路
用基板を提供することを課題とする。In view of the above circumstances, the present invention has a sufficient dielectric constant, a small dielectric loss in a high frequency range, and
It is an object of the present invention to provide a composite dielectric and a printed circuit board free from pollution.
【０００７】[0007]
【課題を解決するための手段】前記課題を解決するた
め、この発明にかかる複合誘電体では、樹脂中に分散さ
れている無機誘電体粒子は、 （Ｌａx Ｂａ1-x ）a （Ｔｉ1-y Ｚｒy ）b Ｏ3 但し： ０．１２≦ｘ≦０．１７ ０．０７≦ｙ≦０．１２ ０．１９≦ｘ＋ｙ≦０．２６５ ０．９７≦ａ／ｂ≦１．００ なる組成をもつ無機化合物（以下、適宜「基本無機化合
物」と言う）が基本構成要素となっており、この発明に
かかるプリント回路用基板では上記の複合誘電体が基板
材料となっている。Means for Solving the Problems To solve the above problems, in the composite dielectric according to the present invention, the inorganic dielectric particles dispersed in the resin are (La x Ba 1-x ) a (Ti 1 -y Zr y) b O 3 where: 0.12 ≦ x ≦ 0.17 0.07 ≦ y ≦ 0.12 0.19 ≦ x + y ≦ 0.265 0.97 ≦ a / b ≦ 1.00 a composition (Hereinafter, appropriately referred to as “basic inorganic compound”) is a basic constituent element, and in the printed circuit board according to the present invention, the above-mentioned composite dielectric is a substrate material.
【０００８】上の基本無機化合物におけるｘ，ｙ，ｘ＋
ｙ，ａ／ｂの数値範囲の限定事由は、以下の通りであ
る。「ｘ」に関しては、０．１２〜０．１７の範囲だけ
が適当な誘電率と高周波域での低誘電損失の双方を同時
に満足させる。０．１７を越えるとＬａが固溶しなくな
るために誘電率の低下が著しくなり、０．１２未満だと
誘電損失の増大が著しくなる。X, y, x + in the above basic inorganic compound
The reasons for limiting the numerical ranges of y and a / b are as follows. As for “x”, only the range of 0.12 to 0.17 simultaneously satisfies both an appropriate dielectric constant and low dielectric loss in a high frequency range. If it exceeds 0.17, La will not form a solid solution, so that the dielectric constant will decrease significantly. If it is less than 0.12, the dielectric loss will increase significantly.
【０００９】「ｙ」に関しては、０．０７〜０．１２の
範囲だけが適当な誘電率と高周波域での低誘電損失の双
方を同時に満足させる。０．１２を越えると誘電率の低
下が著しくなり、０．０７未満だと誘電率の低下と誘電
損失の増大が著しくなる。「ｘ＋ｙ」に関しては、０．
１９〜０．２６５の範囲だけが適当な誘電率と高周波域
での低誘電損失の双方を同時に満足させる。０．２６５
を越えると誘電率の低下が著しくなり、０．１９未満だ
と高周波での誘電損失の増大が著しくなる。As for “y”, only the range of 0.07 to 0.12 simultaneously satisfies both an appropriate dielectric constant and a low dielectric loss in a high frequency range. If it exceeds 0.12, the dielectric constant will decrease significantly, and if it is less than 0.07, the dielectric constant will decrease and the dielectric loss will increase significantly. Regarding “x + y”, 0.
Only the range of 19 to 0.265 simultaneously satisfies both an appropriate dielectric constant and low dielectric loss in a high frequency range. 0.265
If the ratio exceeds 0.1, the dielectric constant is significantly reduced, and if it is less than 0.19, the dielectric loss at high frequencies is significantly increased.
【００１０】「ａ／ｂ」に関しては、０．９７≦ａ／ｂ
≦１．００（好ましくは０．９８≦ａ／ｂ≦１．００）
が適当であって、１．００を越えるとアルカリ塩が無機
誘電体粒子に析出し易く耐水性が低下する。０．９７未
満だとペロブスカイト相以外の相の割合が増え誘電率の
低下が顕著となる。この発明の複合誘電体における無機
誘電体粒子は、全体が上の基本無機化合物からなる粒子
であってもよいし、基本無機化合物以外の無機化合物を
若干量含んでいるようであってもよい。例えば、無機誘
電体粒子がＭｎＯ2 を構成要素として、基本無機化合物
１００ mol％に対し０．０５〜５．０ mol％（好ましく
は０．０５〜１．０ mol％）程度含んでいてもよい。Regarding “a / b”, 0.97 ≦ a / b
≦ 1.00 (preferably 0.98 ≦ a / b ≦ 1.00)
If it exceeds 1.00, the alkali salt tends to precipitate on the inorganic dielectric particles, and the water resistance decreases. If it is less than 0.97, the ratio of phases other than the perovskite phase increases, and the decrease in the dielectric constant becomes remarkable. The inorganic dielectric particles in the composite dielectric of the present invention may be entirely composed of the above basic inorganic compound, or may contain a small amount of an inorganic compound other than the basic inorganic compound. For example, the inorganic dielectric particles may contain about 0.05 to 5.0 mol% (preferably 0.05 to 1.0 mol%) based on 100 mol% of the basic inorganic compound with MnO 2 as a constituent element. .
【００１１】このＭｎＯ2 は、絶縁性改善（絶縁抵抗を
高くすること）と低周波域での誘電損失の低減のために
加えるものであるが、含有量が５．０ mol％を越すと誘
電率の低下が大きくなる傾向が出てくるし、０．０５ m
ol％未満の含有量では適切な添加効果が得にくい。無機
誘電体粒子の形状は特別のものである必要はなく、普
通、平均粒径０．１〜３０μｍ程度のものが樹脂との複
合に適している。This MnO 2 is added for improving the insulating property (to increase the insulation resistance) and for reducing the dielectric loss in a low frequency range. However, when the content exceeds 5.0 mol%, the MnO 2 becomes a dielectric substance. The rate of drop tends to increase, and 0.05 m
If the content is less than ol%, it is difficult to obtain an appropriate addition effect. The shape of the inorganic dielectric particles does not need to be special, and an inorganic particle having an average particle size of about 0.1 to 30 μm is generally suitable for compounding with a resin.
【００１２】複合誘電体に用いる樹脂としては、特定の
樹脂である必要はなく、使用条件に応じて適当に選択さ
れるが、高周波用途では、高周波域での誘電損失の小さ
い樹脂が好ましく、例えば、ＰＰＯ（ポリフェニレンオ
キサイド）樹脂、フッ素樹脂（例えば、通称テフロンの
様なポリフッ化エチレン系樹脂）、ポリカーボネイト、
ポリエチレン、ポリエチレンテレフタレート、ポリプロ
ピレン、ポリスチレン、あるいは、これらの樹脂中から
選んだ２種以上の混合物、前記の各樹脂の変成品などが
あり、例えば、特公平01-016409 号公報に示されたもの
が挙げられる。これ以外に、誘電損失の点では多少劣る
が、ポリエステルあるいはエポキシなどの樹脂も挙げら
れる。The resin used for the composite dielectric does not need to be a specific resin and is appropriately selected according to the conditions of use. However, for high frequency applications, a resin having a small dielectric loss in a high frequency range is preferable. , PPO (polyphenylene oxide) resin, fluorine resin (for example, commonly known as a polyfluoroethylene resin such as Teflon), polycarbonate,
Polyethylene, polyethylene terephthalate, polypropylene, polystyrene, or a mixture of two or more selected from these resins, modified products of each of the above resins, and the like, for example, those disclosed in Japanese Patent Publication No. 01-016409 No. Other than this, resins such as polyester and epoxy may be used, although the dielectric loss is somewhat inferior.
【００１３】また、この発明の複合誘電体は、ガラスク
ロス等の補強材で強化されていてもよい。この場合、機
械的強度の高いものとなる。なお、この発明の複合誘電
体における樹脂と無機誘電体粒子の割合は、普通、樹脂
２５〜９５ｖｏｌ％、無機誘電体粒子５〜７５ｖｏｌ％
であり、補強材を併用する場合、普通、補強材の占める
割合は７０ｖｏｌ％以下である。Further, the composite dielectric of the present invention may be reinforced with a reinforcing material such as glass cloth. In this case, the mechanical strength is high. The ratio of the resin and the inorganic dielectric particles in the composite dielectric of the present invention is usually 25 to 95 vol% of the resin and 5 to 75 vol% of the inorganic dielectric particles.
When a reinforcing material is used in combination, the ratio of the reinforcing material is usually 70 vol% or less.
【００１４】この発明の複合誘電体の用途としては、高
周波用のプリント回路用基板が挙げられるが、これに限
らず他の用途に用いられてもよいことは言うまでもな
い。The composite dielectric of the present invention may be used for a high frequency printed circuit board, but it is needless to say that the composite dielectric may be used for other purposes.
【００１５】[0015]
【作用】この発明の複合誘電体およびこれを用いたプリ
ント回路用基板では、樹脂中の無機誘電体粒子が、（Ｌ
ａx Ｂａ1-x ）a （Ｔｉ1-y Ｚｒy ）b Ｏ3 〔但し、
０．１２≦ｘ≦０．１７，０．０７≦ｙ≦０．１２，
０．１９≦ｘ＋ｙ≦０．２６５，０．９７≦ａ／ｂ≦
１．００〕なる組成をもつ無機化合物が基本構成要素で
あるため、誘電率が高く、しかも、高周波域での誘電損
失が少なく、その結果、複合誘電体自体も誘電率が高く
て高周波域での誘電損失が少ないものとなっている。According to the composite dielectric of the present invention and the printed circuit board using the same, the inorganic dielectric particles in the resin are (L)
a x Ba 1-x) a (Ti 1-y Zr y) b O 3 was prepared in which
0.12 ≦ x ≦ 0.17, 0.07 ≦ y ≦ 0.12
0.19 ≦ x + y ≦ 0.265, 0.97 ≦ a / b ≦
1.00] is a basic constituent element, and therefore has a high dielectric constant and a small dielectric loss in a high frequency range. As a result, the composite dielectric itself has a high dielectric constant and has a high dielectric constant in a high frequency range. Have low dielectric loss.
【００１６】それに、上記の基本無機化合物はＰｂを含
まないため、この発明の複合誘電体は、切断や孔開けな
どの後加工において、公害上の問題を起こすという心配
もない。無機誘電体粒子にＭｎＯ2 が含まれていると絶
縁性が良くて低周波域での誘電損失も少なくなる。In addition, since the above-mentioned basic inorganic compound does not contain Pb, the composite dielectric of the present invention does not cause a problem of pollution in post-processing such as cutting and drilling. When MnO 2 is contained in the inorganic dielectric particles, the insulating property is good and the dielectric loss in a low frequency range is reduced.
【００１７】複合誘電体が補強材で強化されている場合
には、機械的強度が高いという利点が加わる。When the composite dielectric is reinforced with a reinforcing material, the advantage of high mechanical strength is added.
【００１８】[0018]
【実施例】以下、この発明の実施例を説明する。この発
明は、下記の実施例に限らないことは言うまでもない。 −実施例１〜１２，比較例１〜９− まず、原料であるＢａＣＯ3 、Ｌａ2 Ｏ3 、ＴｉＯ2 、
ＺｒＯ2 、ＭｎＯ2 をそれぞれ表１に示す割合で配合し
乾式法で混合し、焼成して焼結体を得た。ついで、この
焼結体を粉砕し、平均粒径が約１μｍの無機誘電体粒子
を得た。Embodiments of the present invention will be described below. It goes without saying that the present invention is not limited to the following embodiments. Examples 1 to 12 and Comparative Examples 1 to 9 First, the raw materials BaCO 3 , La 2 O 3 , TiO 2 ,
ZrO 2 and MnO 2 were blended in the proportions shown in Table 1, mixed by a dry method, and fired to obtain a sintered body. Next, the sintered body was pulverized to obtain inorganic dielectric particles having an average particle size of about 1 μm.
【００１９】ついで、得られた無機誘電体粒子が３９．
８ｖｏｌ％（体積％）、ＰＰＯ系樹脂組成物が６０．２
ｖｏｌ％となるように秤量した。ＰＰＯ系樹脂組成物
は、ＰＰＯが２５wt％、ＳＢＳ（スチレンブタジエンコ
ポリマ）が２５wt％、ＴＡＩＣ（トリアリルイソシアネ
ート）が５０wt％、パーヘキシン２５Ｂ（２・５−ジメ
チル−２・５−ジ−（tert−ブチルパーオキシ）ヘキシ
ン−３：日本油脂社製の開始剤）が２wt％、ＫＢＭ５０
３（アクリル系シランカップリング剤：信越化学社製の
カップリング剤）が２wt％という配合のものである。そ
して、ＰＰＯ系樹脂組成物の４倍のトリクレンを添加し
ＰＰＯ系樹脂組成物を完全に溶解させたワニスを得た。Next, the obtained inorganic dielectric particles were made of 39.
8 vol% (vol%), PPO resin composition is 60.2%
It was weighed so as to be vol%. The PPO-based resin composition contains 25% by weight of PPO, 25% by weight of SBS (styrene butadiene copolymer), 50% by weight of TAIC (triallyl isocyanate), and 25% of perhexin 25B (2.5-dimethyl-2,5-di- (tert- Butylperoxy) hexyne-3: 2 wt% of an initiator manufactured by NOF Corporation, KBM50
No. 3 (acrylic silane coupling agent: coupling agent manufactured by Shin-Etsu Chemical Co., Ltd.) at a blending ratio of 2 wt%. Then, a varnish in which trichlorene four times the amount of the PPO-based resin composition was added to completely dissolve the PPO-based resin composition was obtained.
【００２０】このようにして得たワニスを、平織ガラス
クロス（厚み１００μｍ、繊維径７μｍ、織密度：２５
ｍｍ当たり 縦６０本 横５５本）に含浸させ、８０℃
で乾燥した。得られたワニス含浸ガラスクロスにおける
樹脂と無機誘電体粒子混合体の割合は８０ｖｏｌ％であ
った。このワニス含浸ガラスクロスを４枚重ね、上下に
銅箔（厚み１７μｍ）を配して、１８０℃、３０ｋｇ／
ｃｍ2 、１００分間の成形条件で成形し、複合誘電体
（プリント回路用基板）を得た。成形にあたっては熱融
着と架橋が同時に起こっている。The varnish obtained in this manner was applied to a plain woven glass cloth (thickness: 100 μm, fiber diameter: 7 μm, weaving density: 25).
80 mm per vertical 60 pieces horizontal 55 pieces)
And dried. The ratio of the mixture of the resin and the inorganic dielectric particles in the obtained varnish-impregnated glass cloth was 80 vol%. Four varnish-impregnated glass cloths are stacked, and copper foil (thickness: 17 μm) is arranged on the upper and lower sides.
Molding was performed under molding conditions of cm 2 and 100 minutes to obtain a composite dielectric (substrate for printed circuit). In molding, heat fusion and crosslinking occur simultaneously.
【００２１】−実施例１３− 無機誘電体粒子が実施例１と同じもの、ＰＰＯ系樹脂組
成物の代わりにポリスチレン樹脂、トリクレンの代わり
にトルエンをポリスチレン樹脂の３．５倍の量で使用す
るようにするとともに、１５０℃、３０ｋｇ／ｃｍ2 、
３０分間の成形条件で成形するようにした他は、実施例
１と同様にして複合誘電体（プリント回路用基板）を得
た。Example 13 The same inorganic dielectric particles as in Example 1 were used, and a polystyrene resin was used instead of the PPO-based resin composition, and toluene was used instead of trichlene in an amount 3.5 times that of the polystyrene resin. And at 150 ° C., 30 kg / cm 2 ,
A composite dielectric (printed circuit board) was obtained in the same manner as in Example 1, except that molding was performed under molding conditions for 30 minutes.
【００２２】実施例および比較例の複合誘電体について
誘電特性と絶縁抵抗を測定した。１ｋHzおよび１ＭHzの
誘電特性はインピーダンスアナライザ（ＨＰ４１９４
Ａ）で測定し、１ＧHzの誘電特性はインピーダンスアナ
ライザ（ＨＰ４１９１Ａ）で測した。絶縁抵抗は５００
Ｖ／ｍｍの条件で測定した。測定結果を表２，３に示
す。The dielectric properties and insulation resistance of the composite dielectrics of the examples and comparative examples were measured. The dielectric characteristics at 1 kHz and 1 MHz are measured using an impedance analyzer (HP4194).
A), and the dielectric characteristics at 1 GHz were measured with an impedance analyzer (HP4191A). Insulation resistance is 500
It was measured under the condition of V / mm. Tables 2 and 3 show the measurement results.
【００２３】さらに、全実施例および比較例１〜３，５
〜９における無機誘電体粉末に関し焼結体状態での高周
波域での誘電特性を測定した。測定結果を表４，５に示
す。Further, all Examples and Comparative Examples 1-3,5
The dielectric properties of the inorganic dielectric powders of Comparative Examples No. to No. 9 in a high-frequency range in a sintered state were measured. Tables 4 and 5 show the measurement results.
【００２４】[0024]
【表１】 [Table 1]
【００２５】[0025]
【表２】 [Table 2]
【００２６】[0026]
【表３】 [Table 3]
【００２７】[0027]
【表４】 [Table 4]
【００２８】[0028]
【表５】 [Table 5]
【００２９】表２，３にみるように、各実施例の複合誘
電体は十分な誘電率を有するとともに高周波域での誘電
損失が低い。また、実施例１と実施例６のデータを比べ
れば無機誘電体粒子がＭｎＯ2 を含んでいることが絶縁
性を高めるものであることがよく分かる。また、表２，
３の各比較例の複合誘電体のデータを見れば、この発明
における基本無機化合物の組成から外れると適切な誘電
特性が得られないことも良く分かる。また、表４，５の
データは、実施例の高周波域での誘電損失の低減が無機
誘電体粉末の高周波域での誘電損失の低減に起因するも
のであることを示している。As shown in Tables 2 and 3, the composite dielectric of each embodiment has a sufficient dielectric constant and a low dielectric loss in a high frequency range. Comparing the data of Example 1 with the data of Example 6, it is clear that the inclusion of MnO 2 in the inorganic dielectric particles enhances the insulating property. Table 2
From the data of the composite dielectric material of each comparative example of No. 3, it can be clearly understood that an appropriate dielectric property cannot be obtained if the composition deviates from the composition of the basic inorganic compound in the present invention. Further, the data in Tables 4 and 5 show that the reduction of the dielectric loss in the high frequency range in the examples is due to the reduction of the dielectric loss in the high frequency range of the inorganic dielectric powder.
【００３０】[0030]
【発明の効果】この発明の複合誘電体およびプリント回
路用基板では、樹脂中の無機誘電体粒子が、誘電率の高
い高周波域での誘電損失の少ないものであるため、複合
誘電体自体も誘電率が高くて高周波域での誘電損失が少
ないものとなっており、しかも、無機誘電体粒子を構成
する基本無機化合物がＰｂを含まないため、この発明の
複合誘電体は、切断や孔開けなどの後加工において、公
害上の問題を起こすという心配もなく、したがって、非
常に実用的である。According to the composite dielectric and printed circuit board of the present invention, the inorganic dielectric particles in the resin have a small dielectric loss in a high-frequency region having a high dielectric constant. The composite dielectric of the present invention has high efficiency and low dielectric loss in the high frequency range, and furthermore, since the basic inorganic compound constituting the inorganic dielectric particles does not contain Pb, the composite dielectric of the present invention can be used for cutting or drilling. In post-processing there is no concern that it will cause pollution problems and is therefore very practical.
【００３１】また、上に加えて、無機誘電体粒子にＭｎ
Ｏ2 が含まれていると絶縁性が高くて低周波域での誘電
損失も少なくなるという利点が加わる。さらに、上に加
えて、複合誘電体が補強材で強化されている場合には、
機械的強度が高いという利点が加わる。Further, in addition to the above, Mn is added to the inorganic dielectric particles.
When O 2 is contained, there is an added advantage that the insulating property is high and the dielectric loss in a low frequency range is reduced. Furthermore, in addition to the above, if the composite dielectric is reinforced with reinforcement,
The added advantage of high mechanical strength is added.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 野末 明義 大阪府門真市大字門真1048番地松下電工 株式会社内 (72)発明者 山河清志郎 大阪府門真市大字門真1048番地松下電工 株式会社内 (72)発明者 安倍 一允 大阪府堺市戎之町西１丁１番23号堺化学 工業株式会社内 (72)発明者 青木 昌史 大阪府堺市戎之町西１丁１番23号堺化学 工業株式会社内 (72)発明者 日高 一久 大阪府堺市戎之町西１丁１番23号堺化学 工業株式会社内 (56)参考文献 特開 昭64−27109（ＪＰ，Ａ) 特開 平３−214504（ＪＰ，Ａ) 特開 平３−297008（ＪＰ，Ａ) 特開 平４−26004（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Akiyoshi Nosue 1048 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Works, Ltd. (72) Inventor Kiyoshiro Yamakawa 1048 Odaka Kadoma, Kadoma City, Osaka Matsushita Electric Works Co., Ltd. (72) Inventor Kazunori Abe, 1-13-1, Ebisnomachi Nishi, Sakai City, Osaka Prefecture, Japan (72) Inventor Masafumi Aoki, 1-13-1 Ebisnomachi Nishi, Sakai City, Osaka Prefecture, Japan Sakai Chemical Industry Co., Ltd. (72) Invention Person: Kazuhisa Hidaka, 1-13-1 Nishi, Ebisno-cho, Sakai City, Osaka Prefecture (56) References JP-A-64-27109 (JP, A) JP-A-3-214504 (JP, A) JP-A-3-297008 (JP, A) JP-A-4-26004 (JP, A)
Claims (5)
る複合誘電体において、前記無機誘電体粒子は、 （Ｌａx Ｂａ1-x ）a （Ｔｉ1-y Ｚｒy ）b Ｏ3 但し： ０．１２≦ｘ≦０．１７ ０．０７≦ｙ≦０．１２ ０．１９≦ｘ＋ｙ≦０．２６５ ０．９７≦ａ／ｂ≦１．００ なる組成をもつ無機化合物が基本構成要素となっている
ことを特徴とする複合誘電体。1. A inorganic dielectric particles in the composite dielectric is dispersed in a resin, the inorganic dielectric particles, (La x Ba 1-x ) a (Ti 1-y Zr y) b O 3 where An inorganic compound having a composition of 0.12 ≦ x ≦ 0.17 0.07 ≦ y ≦ 0.12 0.19 ≦ x + y ≦ 0.265 0.97 ≦ a / b ≦ 1.00 is a basic constituent element. A composite dielectric, comprising:
として含む請求項１記載の複合誘電体。2. The composite dielectric according to claim 1, wherein the inorganic dielectric particles contain MnO 2 as a constituent element.
機化合物１００ mol％に対し０．０５〜５．０ mol％で
ある請求項２記載の複合誘電体。3. The composite dielectric according to claim 2, wherein the content of MnO 2 is 0.05 to 5.0 mol% based on 100 mol% of the inorganic compound as a basic constituent element.
までのいずれかに記載の複合誘電体。4. The method according to claim 1, which is reinforced with a reinforcing material.
The composite dielectric according to any one of the above.
プリント回路用基板。5. A printed circuit board using the composite dielectric according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6423892A JP2665104B2 (en) | 1992-03-19 | 1992-03-19 | Composite dielectric and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6423892A JP2665104B2 (en) | 1992-03-19 | 1992-03-19 | Composite dielectric and printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05267805A JPH05267805A (en) | 1993-10-15 |
| JP2665104B2 true JP2665104B2 (en) | 1997-10-22 |
Family
ID=13252361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6423892A Expired - Fee Related JP2665104B2 (en) | 1992-03-19 | 1992-03-19 | Composite dielectric and printed circuit board |
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| Country | Link |
|---|---|
| JP (1) | JP2665104B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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1992
- 1992-03-19 JP JP6423892A patent/JP2665104B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05267805A (en) | 1993-10-15 |
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