JP2658831B2 - Method of manufacturing inspection connector - Google Patents

Method of manufacturing inspection connector

Info

Publication number
JP2658831B2
JP2658831B2 JP5281434A JP28143493A JP2658831B2 JP 2658831 B2 JP2658831 B2 JP 2658831B2 JP 5281434 A JP5281434 A JP 5281434A JP 28143493 A JP28143493 A JP 28143493A JP 2658831 B2 JP2658831 B2 JP 2658831B2
Authority
JP
Japan
Prior art keywords
inspection
electrode
electrode part
sheet
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5281434A
Other languages
Japanese (ja)
Other versions
JPH07135061A (en
Inventor
力 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP5281434A priority Critical patent/JP2658831B2/en
Publication of JPH07135061A publication Critical patent/JPH07135061A/en
Application granted granted Critical
Publication of JP2658831B2 publication Critical patent/JP2658831B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は、検査用コネクタの製造
方法に関し、特にフリップチップを電気特性検査装置に
電気的に接続させるための検査用コネクタの製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an inspection connector, and more particularly to a method of manufacturing an inspection connector for electrically connecting a flip chip to an electrical characteristic inspection apparatus.

【０００２】[0002]

【従来の技術】従来、半導体装置（以下、ＩＣという）
の製造技術における微小化と、これに伴う高集積化，高
機能化，多端子化という傾向により、これらのＩＣの接
続端子と回路基板の接続端子との接続についても同様
に、微小化，多端子化が要求されている。2. Description of the Related Art Conventionally, semiconductor devices (hereinafter referred to as ICs).
Due to the miniaturization in the manufacturing technology of the semiconductor devices and the accompanying trend of higher integration, higher functionality, and more terminals, the connection between the connection terminals of these ICs and the connection terminals of the circuit board has been similarly reduced. Terminalization is required.

【０００３】ＩＣと回路基板との接続方法には、ワイヤ
ーボンド方式，ＴＡＢ方式，フリップチップ方式などが
知られているが、多端子を有するＩＣの高密度実装方式
としては、フリップチップ方式が適している。その理由
は、フリップチップ方式ではＩＣの表面上の全面に接続
端子を設けることができ、多端子化が容易であるためで
ある。また、フリップチップ方式は、接続に有する配線
長が短いため、電気特性にも優れている。このため、１
０数年前から実装方式の一つとして、特に大型コンピュ
ータの実装方式として、フリップチップ方式が検討ある
いは実用化されており、最近では液晶表示電子部品への
実装も検討されている。As a method of connecting an IC to a circuit board, a wire bonding method, a TAB method, a flip chip method and the like are known, but a flip chip method is suitable as a high-density mounting method of an IC having multiple terminals. ing. The reason is that in the flip-chip method, connection terminals can be provided over the entire surface of the IC, and it is easy to increase the number of terminals. In addition, the flip-chip method has excellent electrical characteristics because the wiring length for connection is short. Therefore, 1
A flip-chip method has been studied or put into practical use as one of the mounting methods, especially as a mounting method for a large computer, for several decades. Recently, mounting on a liquid crystal display electronic component has been studied.

【０００４】また、従来では、フリップチップボンディ
ングを行った後に、電気的特性評価を行っていたため、
ＩＣに異常があった場合、ＩＣの取り外し（リペア）は
非常に困難であり、またＩＣを搭載する基板の再生も非
常に困難である。従来において、フリップチップボンデ
ィング後に電気的特性評価を行うという理由は、フリッ
プチップボンディングを実施する前にチップ状態で最終
的な電気的特性評価を十分に実施することが困難であっ
たことによるものである。[0004] Conventionally, electrical characteristics were evaluated after performing flip chip bonding.
When there is an abnormality in the IC, it is very difficult to remove (repair) the IC, and it is also very difficult to reproduce a substrate on which the IC is mounted. In the past, the reason that the electrical characteristics were evaluated after flip-chip bonding was that it was difficult to sufficiently perform the final electrical characteristics evaluation in the chip state before performing flip-chip bonding. is there.

【０００５】図６及び図７は、従来におけるチップ状態
での電気的特性評価の方法を示す断面図である。図６に
示すようなチップ状態での電気的特性評価方法を実施す
るにあたっては、検査対象のＩＣ１の電極と検査用基板
３のパッドとの間に半田バンプ２を介装し、半田バンプ
２を溶かしてＩＣ１を検査用基板３に搭載していた。FIGS. 6 and 7 are cross-sectional views showing a conventional method for evaluating electrical characteristics in a chip state. In carrying out the electrical characteristic evaluation method in a chip state as shown in FIG. 6, a solder bump 2 is interposed between an electrode of an IC 1 to be inspected and a pad of an inspection substrate 3, and the solder bump 2 is The IC 1 was melted and mounted on the inspection substrate 3.

【０００６】ところが、この方法では検査後にＩＣ１を
基板３から取外すことが困難であり、しかも半田バンプ
２をＩＣ１に再生させる必要があり、製造上の工程増
加，ＩＣの信頼性低下などの問題点があった。図７に示
すような方法では、検査用基板３とＩＣ１との間にシー
ト状の検査用コネクタ４を介装し、ＩＣ１の電極に設け
た半田バンプ２と検査用基板３のパッドとを検査用コネ
クタ４により電気的に接続していた。従来の検査用コネ
クタ４の例を図８及び図９に示す。従来の検査用コネク
タ４の構造は図８及び図９に示すように、耐熱温度が１
５０〜２００℃のシリコーンからなる絶縁性樹脂シート
５に、表面に金メッキ７が施された導電性を有する鉄や
銅などからなる金属細線６が埋め込まれたものである。
金属細線６は、その直径が約φ２０〜φ７０μｍであ
り、シート５内に埋め込まれた金属細線６の相互間のピ
ッチは約１５０〜３００μｍである。また金属細線６の
形状は図８に示すようにストレートタイプのものや、図
９に示すようにベンディングタイプのものがあった。However, in this method, it is difficult to remove the IC 1 from the substrate 3 after the inspection, and it is necessary to regenerate the solder bumps 2 into the IC 1, which causes problems such as an increase in manufacturing steps and a decrease in the reliability of the IC. was there. In the method shown in FIG. 7, a sheet-like inspection connector 4 is interposed between the inspection substrate 3 and the IC 1, and the solder bumps 2 provided on the electrodes of the IC 1 and the pads of the inspection substrate 3 are inspected. Electrical connection by means of the connector 4. 8 and 9 show an example of a conventional inspection connector 4. As shown in FIGS. 8 and 9, the structure of the conventional inspection connector 4 has a heat resistant temperature of 1 unit.
A thin metal wire 6 made of conductive iron or copper, the surface of which is plated with gold 7, is embedded in an insulating resin sheet 5 made of silicone at 50 to 200 ° C.
The metal wires 6 have a diameter of about φ20 to φ70 μm, and the pitch between the metal wires 6 embedded in the sheet 5 is about 150 to 300 μm. The shape of the thin metal wire 6 was a straight type as shown in FIG. 8 or a bending type as shown in FIG.

【０００７】[0007]

【発明が解決しようとする課題】図７に示すように、図
８，図９に示す検査用コネクタを用いたフリップチップ
ＩＣの検査方法は、ＩＣの半田バンプと検査用基板のパ
ッドとの加圧のみにより電気的に導通させるものであ
る。この方法においては、図８，９に示す検査用コネク
タを用いてＩＣの半田バンプ同士のわずかな高さの違い
を吸収するには、金属細線が剛体であるために、完全な
接触を得る上で大きな圧力、例えば３００ピンのＩＣで
は、４．５ｋｇ〜６ｋｇ程度の圧下力が必要となり、こ
の圧下力によりＩＣ及び検査用基板を破損してしまう恐
れがあった。As shown in FIG. 7, the method of inspecting a flip-chip IC using the inspection connector shown in FIGS. 8 and 9 applies a method of adding a solder bump of the IC to a pad of the inspection substrate. Electrical conduction is achieved only by pressure. In this method, in order to absorb a slight difference in height between the solder bumps of the IC using the inspection connector shown in FIGS. 8 and 9, it is necessary to obtain perfect contact because the thin metal wire is rigid. For a large pressure, for example, an IC with 300 pins, a rolling force of about 4.5 kg to 6 kg is required, and there is a possibility that the IC and the inspection substrate may be damaged by the rolling force.

【０００８】また、ＩＣの半田バンプと検査用基板のパ
ッドとの導通を図る金属細線の導通抵抗は、例えば数百
Ωと大きいため、検査対象のＩＣがパワーＩＣ等である
場合には、検査時の大電流によりシリコーンからなる絶
縁性樹脂５が発熱し、その物性値が劣化して検査用コネ
クタ４が変形するという問題点があった。In addition, since the conduction resistance of a thin metal wire for conducting between the solder bumps of the IC and the pads of the inspection substrate is as large as several hundreds of ohms, if the IC to be inspected is a power IC, etc. There is a problem that the insulating resin 5 made of silicone generates heat due to a large current at the time, the physical property value thereof is deteriorated, and the inspection connector 4 is deformed.

【０００９】図８及び図９に示す検査用コネクタを用い
て図７に示すような検査方法では、上述したような種々
の問題点があったため、図６に示した方法で最終的な電
気的特性評価を行っているのが実情であった。In the inspection method shown in FIG. 7 using the inspection connector shown in FIGS. 8 and 9, there are various problems as described above. The fact was that the characteristics were evaluated.

【００１０】本発明の目的は、上記従来技術の問題点に
鑑みてなされたものであって、フリップチップのチップ
状態で電気的特性評価が行えるように低圧で加圧可能な
検査用コネクタの製造方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention has been made in view of the above-mentioned problems of the prior art, and is intended to manufacture a test connector which can be pressurized at a low pressure so that electrical characteristics can be evaluated in a flip-chip state. It is to provide a method.

【００１１】[0011]

【課題を解決するための手段】前記目的を達成するた
め、本発明に係る検査用コネクタの製造方法は、電極部
打抜工程と、電極部埋込工程と、電極部仕上工程とを有
する検査用コネクタの製造方法であって、検査対象の半
導体装置は、表面上にバンプを有し、バンプは、配線を
用いないフリップチップ方式で接続処理されるものであ
り、検査用コネクタは、検査対象の半導体装置と検査用
基板との間に介装されるシート状をなし、シート状支持
基体に支持された電極部を、検査対象の半導体装置のバ
ンプに突き合せて圧着し電気的に導通させるものであ
り、電極部打抜工程は、打抜加工用のポンチ及びダイス
を用いて、帯状の導電性材料より柱状の電極部を打抜
き、これらを縦向き姿勢に保持して平面上に所定ピッチ
で配列させる工程であり、電極部埋込工程は、平面上に
縦向き姿勢に保持された電極部間に耐熱性をもつ絶縁性
材料を注入し、該絶縁性材料からなるシート状支持基体
の厚さ方向に電極部を相互に絶縁させて埋め込む工程で
あり、電極部仕上工程は、シート状支持基体の厚み方向
の面をエッチングし、該シート状支持基体の面内に電極
部の端部を露出させる工程である。In order to achieve the above object, a method for manufacturing an inspection connector according to the present invention is directed to an inspection method including an electrode part punching step, an electrode part embedding step, and an electrode part finishing step. a method of manufacturing a use connectors, inspected half
The conductor device has bumps on the surface, and the bumps
It is connected by flip chip method that is not used.
Ri, test connector, without the sheet being interposed between the testing board and the semiconductor device to be inspected, the electrode portion supported on sheet supporting base, against the bumps of the semiconductor device to be inspected The electrode part punching step is to punch a columnar electrode part from a strip-shaped conductive material using a punch and a die for punching, and hold them vertically. And embedding a heat-resistant insulating material between the electrode parts held in a vertical orientation on the plane, and injecting the insulating material. Is a step of embedding the electrode portions in the thickness direction of the sheet-shaped support substrate made of a conductive material while insulating each other from each other. The electrode portion finishing step etches the surface of the sheet-shaped support substrate in the thickness direction, and The end of the electrode part is exposed in the plane of It is a degree.

【００１２】[0012]

【課題を解決するための手段】また、表面に薄膜層が形
成された帯状の導電性材料を柱状に打ち抜くことによ
り、前記電極部を形成する。A thin film layer is formed on the surface.
By punching the formed strip-shaped conductive material into columns
Then, the electrode portion is formed .

【００１３】[0013]

【作用】ポンチとダイスとを用いて、帯状の帯電性材料
を柱状に打抜き、これを電極部として利用している。柱
状の電極部は、ポンチ及びダイスを用いた打抜き加工に
より成形されるものであるから、帯電材料として、従来
の金属細線に比べて柔らかな材料、例えば半田等を用い
て、これから柱状の電極部を加工成形することができ
る。してみれば、電極部を柔らかな材料で構成すること
が可能であるから、該電極部を検査用基板のパッドと検
査対象のＩＣのバンプとの間に介装して電気的接続を図
る場合に、その圧下力は比較的小さいもので済み、した
がって、検査用基板や検査対象のＩＣを破壊することは
ない。A band-shaped charging material is punched into a column using a punch and a die, and this is used as an electrode portion. Since the columnar electrode portion is formed by punching using a punch and a die, a softer material than a conventional thin metal wire, such as solder, is used as a charging material. Can be formed. In this case, since the electrode portion can be made of a soft material, the electrode portion is interposed between the pad of the inspection substrate and the bump of the IC to be inspected to achieve electrical connection. In this case, the rolling force is relatively small, so that the inspection substrate and the IC to be inspected are not broken.

【００１４】[0014]

【実施例】次に、本発明の実施例について図面を参照し
て説明する。Next, embodiments of the present invention will be described with reference to the drawings.

【００１５】（実施例１）図１は、本発明の実施例１に
係る検査用コネクタを示す断面図である。図において、
本発明の実施例１に係る検査用コネクタ４１は、シート
状支持基体５と、柱状電極部８２との組合せからなるも
のである。Embodiment 1 FIG. 1 is a sectional view showing an inspection connector according to Embodiment 1 of the present invention. In the figure,
The inspection connector 41 according to the first embodiment of the present invention includes a combination of the sheet-like support base 5 and the columnar electrode portion 82.

【００１６】支持基体５は、検査対象のＩＣ１と検査用
基板３との間に介装されるシート状をなし（図２参
照）、耐熱性をもつ絶縁性材料、例えば耐熱温度の高い
ポリイミドなどから構成されている。また、柱状電極部
８２は、ポンチ及びダイスを用いて帯状の導電性材料か
ら打抜き加工され、シート状支持基体５の厚さ方向に相
互に絶縁されて埋設され、その両端部がシート状支持基
体５の対向する面にそれぞれ露出しており、検査用基板
３のパッドと検査対象のＩＣ１の半田バンプ２とにそれ
ぞれ突き当たるようになっている。The support base 5 is in the form of a sheet interposed between the IC 1 to be inspected and the inspection substrate 3 (see FIG. 2), and is a heat-resistant insulating material such as polyimide having a high heat-resistant temperature. It is composed of The columnar electrode portion 82 is stamped from a strip-shaped conductive material using a punch and a die, and is buried in the sheet-like support base 5 while being insulated from each other in the thickness direction. 5 are exposed to the opposing surfaces, respectively, and come into contact with the pads of the inspection substrate 3 and the solder bumps 2 of the IC 1 to be inspected.

【００１７】次に、図３及び図４により、本発明の実施
例１に係る検査用コネクタの製造方法を工程順に説明す
る。まず、図３（Ａ），（Ｂ）において、電極部打抜処
理を行う。電極部打抜工程は、図３（Ａ）に示すよう
に、ステージ１２上にトレー１１を配置し、トレー１１
の上方にダイス１０とポンチ９とを配設する。そして、
ダイス１０とポンチ９との間に帯状の導電性材料８１を
供給し、図３（Ｂ）に示すように、ポンチ９とダイス１
０によりトレー１１上に導電性材料８１から柱状の電極
部８２を打抜き、その柱状電極部８２をダイス１０でガ
イドし、これを縦向き姿勢に載置する。この一連の打抜
き動作を繰返し行い、かつステージ１２をダイス１０に
対して相対変位させることにより、トレー１１上に電極
部８２を所定のピッチで並立させる。この場合、導電性
材料８１としては、例えば半田等を用いる。また、トレ
ー１１上に電極部８２を配置する所定のピッチは、例え
ば５０〜３００μｍである。また電極部８２は、その直
径が例えば２５μｍ〜１００μｍである。柱状の電極部
８２を図４（Ａ）に示すトレー１１上に並べた状態は、
図４（Ｂ）に示すような状態となる。Next, a method for manufacturing the inspection connector according to the first embodiment of the present invention will be described in the order of steps with reference to FIGS. First, in FIGS. 3A and 3B, an electrode portion punching process is performed. In the electrode part punching step, as shown in FIG.
The die 10 and the punch 9 are arranged above the. And
A strip-shaped conductive material 81 is supplied between the die 10 and the punch 9, and as shown in FIG.
The columnar electrode portion 82 is punched out of the conductive material 81 on the tray 11 according to 0, the columnar electrode portion 82 is guided by the die 10, and is placed in a vertical position. By repeating this series of punching operations and displacing the stage 12 relative to the die 10, the electrode portions 82 are arranged on the tray 11 at a predetermined pitch. In this case, for example, solder or the like is used as the conductive material 81. The predetermined pitch at which the electrode portions 82 are arranged on the tray 11 is, for example, 50 to 300 μm. The diameter of the electrode part 82 is, for example, 25 μm to 100 μm. The state where the columnar electrode portions 82 are arranged on the tray 11 shown in FIG.
The state is as shown in FIG.

【００１８】次いで図４（Ｃ）に示すように、トレー１
１上に縦置き姿勢に保持された電極部８２間に耐熱性を
もつ絶縁性樹脂を注入し、絶縁性樹脂からなるシート状
支持基体５の厚さ方向に電極部８２を相互に絶縁させて
埋め込み、樹脂のキュアを行い、電極部埋込工程の処理
を実行する。Next, as shown in FIG.
A heat-resistant insulating resin is injected between the electrode portions 82 held in a vertical posture on the substrate 1 to insulate the electrode portions 82 from each other in the thickness direction of the sheet-like support base 5 made of the insulating resin. Embedding and curing of the resin are performed, and the process of the electrode portion embedding process is executed.

【００１９】次に、図４（Ｄ）に示すように、シート状
支持基体５の表面を例えば０．１〜０．３ｍｍ程度エッ
チング処理を行い、電極部８２の上端部を０．０５〜
０．１ｍｍ程度シート状支持基体５の対向する上面より
突出させる。さらに図４（Ｅ）に示すように、トレー１
１を除去し、前記図４（Ｄ）と同様の処理を行うことに
よって電極部８２の端部をシート状支持基体５の対向す
る下面より突出させて電極部仕上工程の処理を行い、図
４（Ｆ）に示すような検査用コネクタを完成させる。Next, as shown in FIG. 4D, the surface of the sheet-like support base 5 is etched, for example, by about 0.1 to 0.3 mm, and the upper end of the electrode section 82 is set to 0.05 to 0.3 mm.
It is made to protrude from the opposing upper surface of the sheet-like support base 5 by about 0.1 mm. Further, as shown in FIG.
1 is removed, and by performing the same processing as in FIG. 4D, the end of the electrode portion 82 is made to protrude from the lower surface of the sheet-like support base 5 facing the opposite side to perform the processing of the electrode portion finishing step. An inspection connector as shown in FIG.

【００２０】上述の方法で作られた検査用コネクタは、
電極部８２の径が２５〜１００μｍであるため、電流容
量が大きい。また、打抜法により一様な長さ及び径の半
田等の導電性材料から電極部８２を加工成形するため、
電極部８２の形状が非常に均一になるという特徴があ
る。The inspection connector manufactured by the above-described method includes:
Since the diameter of the electrode portion 82 is 25 to 100 μm, the current capacity is large. Further, in order to form the electrode portion 82 from a conductive material such as solder having a uniform length and diameter by a punching method,
There is a feature that the shape of the electrode portion 82 is very uniform.

【００２１】ここで、上記検査用コネクタの使用方法に
ついて説明する。図２は図１，図３，図４に示した検査
用コネクタの使用状態を示す断面図である。図２に示す
ように、検査用コネクタ４１は、検査用基板３とＩＣ１
との間に介装され、検査用基板３とＩＣ１とで挟持する
ように加圧されることにより、検査用基板３のパッドと
ＩＣ１の半田バンプ２とが電極部８２により導通され
る。このとき、電極部８２は例えば半田である場合、従
来の鉄や銅などからなる金属細線に比べて柔らかいた
め、例えば３００ピンのＩＣの場合、１．５〜２．０ｋ
ｇの低い圧力にて完全な接触を得ることができ、検査用
基板及びＩＣが加圧によって破損されずに済む。Here, a method of using the inspection connector will be described. FIG. 2 is a cross-sectional view showing a use state of the inspection connector shown in FIGS. As shown in FIG. 2, the inspection connector 41 includes the inspection substrate 3 and the IC 1.
And pressurized so as to be sandwiched between the test substrate 3 and the IC 1, so that the pads of the test substrate 3 and the solder bumps 2 of the IC 1 are conducted by the electrode portions 82. At this time, when the electrode portion 82 is made of, for example, solder, it is softer than a conventional thin metal wire made of iron, copper, or the like.
A perfect contact can be obtained at a low pressure of g, so that the test substrate and the IC are not damaged by pressurization.

【００２２】また、シート状支持基体５の材料が従来の
シリコーンに代えて高耐熱性のポリイミドなどから構成
してあるため、パワーＩＣなどの検査時の大電流により
絶縁性樹脂が発熱し、その物性値が劣化して検査用コネ
クタが変形することがなくなる。Further, since the material of the sheet-like support base 5 is made of polyimide having high heat resistance instead of the conventional silicone, the insulating resin generates heat due to a large current at the time of inspection of a power IC or the like. The inspection connector is not deformed due to deterioration of the physical property values.

【００２３】このため、最終的な電気的特性評価を行う
ことができ、フリップチップＩＣの製造効率の向上や信
頼性向上に大きな効果がある。As a result, the final evaluation of the electrical characteristics can be performed, which has a great effect on the improvement of the manufacturing efficiency and the reliability of the flip-chip IC.

【００２４】（実施例２）図５は、本発明の実施例２に
係る検査用コネクタの製造方法を工程順に示す断面図で
ある。(Embodiment 2) FIG. 5 is a sectional view showing a method of manufacturing an inspection connector according to Embodiment 2 of the present invention in the order of steps.

【００２５】本実施例の検査用コネクタは図５（Ｂ）に
示すように、電極部８３の表面と裏面にメッキ法あるい
はクラッド法により金等の薄膜層８４が設けられた構造
のものである。As shown in FIG. 5B, the inspection connector of this embodiment has a structure in which a thin film layer 84 of gold or the like is provided on the front and back surfaces of an electrode portion 83 by plating or cladding. .

【００２６】以下、本実施例における検査用コネクタの
製造方法について説明する。図５（Ｂ）に示すように、
帯状の導電性材料の表裏面に薄膜層８４が積層形成され
ており、この帯状の導電性材料からダイス及びポンチに
より柱状の電極部８３を打抜き、これをトレー１１上に
一定のピッチで載置し、図５（Ｃ）に示すように耐熱性
をもつ絶縁性樹脂を注入し、シート状支持基体５５に電
極部８３を埋込み、樹脂のキュアを行う。そして図５
（Ｄ）に示すように、シート状支持基体５５の表面をド
ライ法あるいはウェット法によりエッチング処理を行
い、電極部８３の薄膜層８４をシート状支持基体５５よ
り露出させる。このとき電極部８３はシート状支持基体
５５より露出しないように制御する。さらに図５（Ｅ）
に示すようにトレー１１を除去し、前記図５（Ｄ）を同
様の処理を行うことによって図５（Ｆ）に示すような検
査用コネクタを完成させる。Hereinafter, a method for manufacturing the inspection connector according to the present embodiment will be described. As shown in FIG.
A thin film layer 84 is laminated on the front and back surfaces of the strip-shaped conductive material, and a columnar electrode portion 83 is punched from the strip-shaped conductive material with a die and a punch, and is placed on the tray 11 at a constant pitch. Then, as shown in FIG. 5C, an insulating resin having heat resistance is injected, the electrode portion 83 is embedded in the sheet-like support base 55, and the resin is cured. And FIG.
As shown in (D), the surface of the sheet-like support base 55 is etched by a dry method or a wet method, and the thin film layer 84 of the electrode part 83 is exposed from the sheet-like support base 55. At this time, the electrode section 83 is controlled so as not to be exposed from the sheet-like support base 55. Further, FIG.
Then, the tray 11 is removed as shown in FIG. 5 and the same processing as in FIG. 5D is performed to complete the inspection connector as shown in FIG.

【００２７】[0027]

【発明の効果】以上説明したように本発明は、耐熱性を
もつシート状支持基体内に電極部を保持させるため、検
査時に電極部に大電流が流れるパワーＩＣ等の検査にお
いて検査用コネクタが発熱して変形するのを防止するこ
とができる。As described above, according to the present invention, since the electrode portion is held in the heat-resistant sheet-like support base, the inspection connector is used in the inspection of a power IC or the like in which a large current flows through the electrode portion during the inspection. It is possible to prevent deformation due to heat generation.

【００２８】また、検査用基板のパッドとＩＣの半田バ
ンプとを導通させる電極部として、従来の鉄や銅からな
る金属細線に代えて半田等の柔らかい材料を用いること
ができるため、多端子ＩＣであっても低荷重で完全な接
触を得ることができ、しかもＩＣ及び検査用基板を圧下
力による破損から保護することができる。In addition, a soft material such as solder can be used instead of a conventional thin metal wire made of iron or copper as an electrode portion for conducting a pad of an inspection substrate to a solder bump of an IC. Even in this case, complete contact can be obtained with a low load, and the IC and the inspection substrate can be protected from breakage due to the rolling force.

【００２９】したがって、本発明の検査用コネクタを使
用すれば、最終的な電気的特性評価をＩＣ単体のままで
十分に、かつ容易に実施することができ、フリップチッ
プ方式であるがために生じていた生産性の悪化を改善
し、かつ信頼性を向上できるという効果を有する。Therefore, if the inspection connector of the present invention is used, the final evaluation of the electrical characteristics can be performed sufficiently and easily with the IC alone, and the flip-chip method is used. This has the effect of reducing the deterioration of productivity and improving reliability.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の実施例１に係る検査用コネクタを示す
断面図である。FIG. 1 is a cross-sectional view illustrating an inspection connector according to a first embodiment of the present invention.

【図２】図１，図３，図４に示した検査用コネクタの使
用状態を示す断面図である。FIG. 2 is a cross-sectional view showing a usage state of the inspection connector shown in FIGS. 1, 3, and 4;

【図３】図１に示した検査用コネクタの製造工程のうち
電極部打抜工程を示す断面図である。FIG. 3 is a cross-sectional view showing an electrode part punching step in the manufacturing process of the inspection connector shown in FIG. 1;

【図４】本発明の実施例１に係る検査用コネクタの製造
方法を工程順に示す断面図である。FIG. 4 is a sectional view illustrating a method of manufacturing the inspection connector according to the first embodiment of the present invention in the order of steps.

【図５】本発明の実施例２に係る検査用コネクタの製造
方法を工程順に示す断面図である。FIG. 5 is a sectional view illustrating a method of manufacturing the inspection connector according to the second embodiment of the present invention in the order of steps.

【図６】従来のチップ状態での電気的特性評価の方法を
具現化した断面図である。FIG. 6 is a cross-sectional view embodying a conventional method for evaluating electrical characteristics in a chip state.

【図７】従来のチップ状態での電気的特性評価の方法を
具現化した断面図である。FIG. 7 is a cross-sectional view embodying a conventional method for evaluating electrical characteristics in a chip state.

【図８】従来の検査用コネクタの構造を示す断面図であ
る。FIG. 8 is a cross-sectional view showing a structure of a conventional inspection connector.

【図９】従来の検査用コネクタの構造を示す断面図であ
る。FIG. 9 is a cross-sectional view showing the structure of a conventional inspection connector.

【符号の説明】[Explanation of symbols]

１ 検査対象のＩＣ ２ 半田バンプ ３ 検査用基板 ４，４１ 検査用コネクタ ５，５５ シート状支持基体 ９ ポンチ １０ ダイス １１ トレー １２ ステージ ８２，８３，８４ 電極部 DESCRIPTION OF SYMBOLS 1 IC to be inspected 2 Solder bump 3 Inspection board 4,41 Inspection connector 5,55 Sheet-like support base 9 Punch 10 Dice 11 Tray 12 Stage 82,83,84 Electrode section

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 電極部打抜工程と、電極部埋込工程と、
電極部仕上工程とを有する検査用コネクタの製造方法で
あって、検査対象の半導体装置は、表面上にバンプを有し、バン
プは、配線を用いないフリップチップ方式で接続処理さ
れるものであり、 検査用コネクタは、検査対象の半導体装置と検査用基板
との間に介装されるシート状をなし、シート状支持基体
に支持された電極部を、検査対象の半導体装置のバンプ
に突き合せて圧着し電気的に導通させるものであり、 電極部打抜工程は、打抜加工用のポンチ及びダイスを用
いて、帯状の導電性材料より柱状の電極部を打抜き、こ
れらを縦向き姿勢に保持して平面上に所定ピッチで配列
させる工程であり、 電極部埋込工程は、平面上に縦向き姿勢に保持された電
極部間に耐熱性をもつ絶縁性材料を注入し、該絶縁性材
料からなるシート状支持基体の厚さ方向に電極部を相互
に絶縁させて埋め込む工程であり、 電極部仕上工程は、シート状支持基体の厚み方向の面を
エッチングし、該シート状支持基体の面内に電極部の端
部を露出させる工程であることを特徴とする検査用コネ
クタの製造方法。An electrode part punching step, an electrode part embedding step,
A method of manufacturing a connector for inspection having an electrode part finishing step , wherein the semiconductor device to be inspected has bumps on its surface,
Are connected by a flip-chip method without wiring.
The inspection connector is in the form of a sheet interposed between the semiconductor device to be inspected and the inspection substrate, and the electrode portion supported by the sheet-like supporting base is provided on the inspection target semiconductor device. bump
The electrode part punching step is to punch a columnar electrode part from a strip-shaped conductive material using a punch and a die for punching, This is a step of maintaining the orientation posture and arranging it at a predetermined pitch on a plane, and the electrode part embedding step is to inject an insulating material having heat resistance between the electrode parts held in a vertical posture on the plane, A step of embedding the electrode portions in the thickness direction of the sheet-like support base made of the insulating material while insulating each other from each other. A method for manufacturing an inspection connector, comprising a step of exposing an end of an electrode portion in a plane of a support base. 【請求項２】 表面に薄膜層が形成された帯状の導電性
材料を柱状に打ち抜くことにより、前記電極部を形成す
ることを特徴とする請求項１に記載の検査用コネクタの
製造方法。2. A strip-shaped conductive film having a thin film layer formed on its surface.
The electrode portion is formed by punching a material into a column shape.
Inspection connector method according to claim 1, characterized in that that.
JP5281434A 1993-11-10 1993-11-10 Method of manufacturing inspection connector Expired - Lifetime JP2658831B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5281434A JP2658831B2 (en) 1993-11-10 1993-11-10 Method of manufacturing inspection connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5281434A JP2658831B2 (en) 1993-11-10 1993-11-10 Method of manufacturing inspection connector

Publications (2)

Publication Number Publication Date
JPH07135061A JPH07135061A (en) 1995-05-23
JP2658831B2 true JP2658831B2 (en) 1997-09-30

Family

ID=17639118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5281434A Expired - Lifetime JP2658831B2 (en) 1993-11-10 1993-11-10 Method of manufacturing inspection connector

Country Status (1)

Country Link
JP (1) JP2658831B2 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111015A (en) * 1979-02-20 1980-08-27 Sanyo Electric Co Feeder for electric equipment and method of manufacturing same
JPH0369132A (en) * 1989-08-08 1991-03-25 Fujitsu Ltd Jig for measurement
JP2832560B2 (en) * 1991-03-26 1998-12-09 キヤノン株式会社 Electrical connection member and method of manufacturing the same

Also Published As

Publication number Publication date
JPH07135061A (en) 1995-05-23

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