JP2654871B2 - Partial metal plating method for lead frame - Google Patents
Partial metal plating method for lead frameInfo
- Publication number
- JP2654871B2 JP2654871B2 JP11244591A JP11244591A JP2654871B2 JP 2654871 B2 JP2654871 B2 JP 2654871B2 JP 11244591 A JP11244591 A JP 11244591A JP 11244591 A JP11244591 A JP 11244591A JP 2654871 B2 JP2654871 B2 JP 2654871B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- metal
- lead frame
- plating layer
- exposed portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、リードフレームの異種
金属部分めっき方法に係り、更に詳しくは、リードフレ
ームの同一平面上の所定の領域に第１の金属めっき層及
び第２の金属めっき層を形成する異種金属部分めっき方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for plating different kinds of metal on a lead frame, and more particularly, to a method for plating a first metal plating layer and a second metal plating layer on predetermined areas on the same plane of a lead frame. The present invention relates to a dissimilar metal partial plating method for forming a layer.
【０００２】[0002]
【従来の技術】近来では半導体装置の高集積化に伴いリ
ードピン数が増加し、インナーリードやアウターリード
部相互間隔の狭いリードフレームが一般的となり、それ
に伴ってインナーリード先端部上面のワイヤボンデング
領域、素子搭載部領域及びアウターリード部領域に半導
体装置組立に先立って異種金属部分めっきを施したリー
ドフレームが要求されるようになった。更に、マイグレ
ーションの要因となるめっき液の漏れによって端面等の
所定領域外のめっき付着の防止や端部のバリの発生を防
ぎ、且つ、めっき液の削減を図ったリードフレームの異
種金属部分めっきの製造方法に関する開発の要望が増加
している。前記リードフレームの一般例を図２に示す
が、図に示すように該リードフレーム１０は、素子搭載
部１１と、その周辺に放射状に配列されたインナーリー
ド部１２と、該インナーリード部１２に対応して外部導
通回路を構成するアウターリード部１３を有し、該リー
ドフレーム１０の所要の形状加工を行った後、前記リー
ドフレーム１０の素子搭載部１１及びインナーリード部
１２の所定の領域に、ＡｇやＡｕ等の第１の金属めっき
層１４及び前記アウターリード部１３の所定の領域にＮ
ｉ合金やＰｄ等の第２の金属めっき層１５からなる異種
金属の表面処理層を形成している。前記リードフレーム
１０に異種金属部分めっきを形成する従来方法の工程を
図３に示すが、素子搭載部１１、インナーリード部１２
及びアウターリード部１３等を備えるリードフレーム１
０の形状の加工を行った金属部材の全面に耐めっき性の
樹脂膜を塗布した後、素子搭載部１１及びインナーリー
ド部１２の所定の第１の金属めっき層１４に対応する領
域を露出した第１の露出部１７を有する耐めっき性の樹
脂膜１６を形成する工程（ａ図）と、前記第１の露出部
１７に所定の金属めっきを施して第１の金属めっき層１
４を形成する工程（ｂ図）と、前記耐めっき性の樹脂膜
１６を剥離して前記第１の金属めっき層１４を露出させ
る工程（ｃ図）と、該第１の金属めっき層１４を形成し
た金属部材の全面に耐めっき性の樹脂膜１８を塗布した
後、アウターリード部１３の第２の金属めっき層１５に
相当する部分を露出した第２の露出部１９を有する耐め
っき性の樹脂膜のパターンを形成する工程（ｄ図）と、
前記第２の露出部１９に第２金属のめっき層１５を形成
する工程と（ｅ図）と、前記耐めっき性の樹脂膜１８を
除去して第１の金属めっき層１４及び第２の金属めっき
層１５を露出させる工程（ｆ図）と経て、リードフレー
ム１０の所定の部分に第１の金属めっき層１４と、第２
の金属めっき層１５との異種金属部分めっき層を形成し
ている。2. Description of the Related Art In recent years, the number of lead pins has increased with the increase in the degree of integration of semiconductor devices, and lead frames having a narrow interval between inner leads and outer leads have become common. There has been a demand for a lead frame in which regions, element mounting regions, and outer lead regions are partially plated with different kinds of metal prior to assembling a semiconductor device. Furthermore, the plating solution leakage preventing the plating from adhering to a predetermined area such as the end face due to the leakage of the plating solution, preventing the occurrence of burrs at the end portion, and reducing the amount of the plating solution in the plating of the dissimilar metal portion of the lead frame. There is an increasing demand for development of manufacturing methods. FIG. 2 shows a general example of the lead frame. As shown in FIG. 2, the lead frame 10 includes an element mounting portion 11, an inner lead portion 12 arranged radially around the element mounting portion 11, and an inner lead portion 12. It has an outer lead portion 13 correspondingly constituting an external conduction circuit, and after a required shape processing of the lead frame 10 is performed, a predetermined region of the element mounting portion 11 and the inner lead portion 12 of the lead frame 10 is provided. , Ag, Au, etc., in a predetermined region of the first metal plating layer 14 and the outer lead portion 13.
A surface treatment layer of a dissimilar metal made of a second metal plating layer 15 such as an i-alloy or Pd is formed. FIG. 3 shows the steps of a conventional method of forming a different metal partial plating on the lead frame 10, wherein an element mounting portion 11 and an inner lead portion 12 are formed.
Frame 1 provided with an outer lead portion 13 and the like
After applying a plating-resistant resin film to the entire surface of the metal member processed to have a shape of 0, the region corresponding to the predetermined first metal plating layer 14 of the element mounting portion 11 and the inner lead portion 12 was exposed. A step of forming a plating-resistant resin film 16 having a first exposed portion 17 (FIG. 7A); and applying a predetermined metal plating to the first exposed portion 17 to form a first metal plating layer 1.
4 (FIG. 2B), a step of exfoliating the plating-resistant resin film 16 to expose the first metal plating layer 14 (FIG. 3C), After applying a plating-resistant resin film 18 over the entire surface of the formed metal member, a plating-resistant resin film 18 having a second exposed portion 19 exposing a portion corresponding to the second metal plating layer 15 of the outer lead portion 13 is provided. A step (d) of forming a pattern of the resin film;
Forming a second metal plating layer 15 on the second exposed portion 19 (FIG. 5E); removing the plating-resistant resin film 18 to remove the first metal plating layer 14 and the second metal plating layer; Through a step (f) of exposing the plating layer 15, the first metal plating layer 14 and the second
And a metal plating layer different from the metal plating layer 15 of FIG.
【０００３】[0003]
【発明が解決しようとする課題】前記従来例に係る方法
では、前記金属部材の第１の金属めっき層１４と第２の
金属めっき層１５とを形成するに際して、第１の露出部
１７を有する耐めっき性の樹脂膜１６と、第２の露出部
１９を有する耐めっき性の樹脂膜１８とを別々に形成す
る必要があって、製造工程が複雑となり、作業効率が低
下するという問題点があった。また、取扱いによるリー
ドフレームの損傷が発生し、製造コストが増加するとい
う問題点があった。本発明はかかる事情に鑑みてなされ
たもので、リードフレームの一製造工程内で、第１の金
属めっき層と第２の金属めっき層を順次形成して製造工
程の簡素化を図ると共に、所定領域以外の側面付着や端
面のバリの発生を防止し、めっき液の無駄を省き、高品
質の半導体装置用リードフレームを製造する異種金属部
分めっき方法を提供することを目的とする。In the method according to the conventional example, when forming the first metal plating layer 14 and the second metal plating layer 15 of the metal member, a first exposed portion 17 is provided. It is necessary to separately form the plating-resistant resin film 16 and the plating-resistant resin film 18 having the second exposed portion 19, which complicates the manufacturing process and reduces the work efficiency. there were. Further, there is a problem that the lead frame is damaged due to handling, and the manufacturing cost is increased. The present invention has been made in view of the above circumstances, and in one manufacturing process of a lead frame, a first metal plating layer and a second metal plating layer are sequentially formed to simplify the manufacturing process and achieve a predetermined process. An object of the present invention is to provide a dissimilar metal partial plating method for producing a high-quality semiconductor device lead frame by preventing side surface adhesion and end surface burrs from being generated outside a region and eliminating waste of a plating solution.
【０００４】[0004]
【課題を解決するための手段】前記目的に沿う請求項第
１項記載のリードフレームの異種金属部分めっき方法
は、素子搭載部、インナーリード部及びアウターリード
部を有して構成されたリードフレームの所定の領域に異
種金属部分めっき層を形成するリードフレームの異種金
属部分めっき方法であって、前記素子搭載部、インナー
リード部及びアウターリード部を備えるリードフレーム
の形状加工を行う工程と、前記リードフレームの全面を
耐めっき性の樹脂で被覆し、前記素子搭載部及び／又は
インナーリード部の所定領域に形成する第１の金属部分
めっき層の位置する部分の樹脂膜を除去して下地金属層
を露出した第１の露出部と、前記アウターリード部の所
定領域に形成する第２の金属部分めっき層の位置する部
分の樹脂膜を除去して下地金属層を露出させた第２の露
出部とを同時に形成する工程と、前記第１の露出部の位
置に相当する部分にめっき液噴流用の貫通孔を備えたマ
スクプレートで前記第２の露出部を被覆して、第１の露
出部に第１の金属部分めっき層を形成する工程と、前記
第２の露出部の位置に相当する部分にめっき液噴流用の
貫通孔を備えたマスクプレートで前記第１の金属部分め
っき層を被覆して、第２の露出部に第２の金属部分めっ
き層を形成する工程と、前記耐めっき性の樹脂膜を除去
する工程とを有している。According to a first aspect of the present invention, there is provided a method for plating a lead frame of a dissimilar metal portion, comprising a device mounting portion, an inner lead portion, and an outer lead portion. A method for forming a dissimilar metal partial plating layer on a predetermined area of a dissimilar metal partial plating layer, wherein the element mounting portion, an inner lead portion and an outer lead portion are subjected to shape processing of a lead frame, and The entire surface of the lead frame is coated with a plating-resistant resin, and the resin film in the portion where the first metal partial plating layer formed in the predetermined region of the element mounting portion and / or the inner lead portion is located is removed. The resin film is removed from a first exposed portion where the layer is exposed and a portion where a second metal partial plating layer formed in a predetermined region of the outer lead portion is located. Simultaneously forming a second exposed portion exposing the base metal layer, and forming the second exposed portion on a mask plate having a through hole for plating solution jet at a portion corresponding to the position of the first exposed portion. Forming a first metal partial plating layer on the first exposed portion by covering the exposed portion; and a mask having a through hole for plating solution jet flow at a portion corresponding to the position of the second exposed portion. A step of covering the first metal partial plating layer with a plate to form a second metal partial plating layer on a second exposed portion; and a step of removing the plating-resistant resin film. I have.
【０００５】[0005]
【作用】本発明においては、リードフレームの全面を耐
めっき性の樹脂膜で被覆した後、所定のめっき領域のみ
下地金属を露出しているので、めっき液漏れがあっても
めっき不必要な部分にめっき層を形成することがなく、
めっきバリの発生やマイグレーションの防止をすると共
にめっき液を削減する作用がある。更に、耐めっき性の
樹脂膜によって覆われたリードフレームは、所要の異種
金属めっき領域に対応するそれぞれの下地金属を露出し
たパターン形成が同時に行われ、それぞれのマスクプレ
ートで前記第１及び第２の露出部を交互に被覆し、各露
出部に異種金属めっき層を一製造装置内で一括して形成
でき、製造工程を簡素化できる作用がある。According to the present invention, the entire surface of the lead frame is covered with a plating-resistant resin film, and then the underlying metal is exposed only in a predetermined plating area. Without forming a plating layer on
This has the effect of preventing generation of plating burrs and migration, and reducing plating solution. Further, in the lead frame covered with the plating-resistant resin film, the pattern formation exposing the respective base metals corresponding to the required dissimilar metal plating regions is simultaneously performed, and the first and second patterns are formed on the respective mask plates. Are alternately covered, and different metal plating layers can be collectively formed on each exposed portion in one manufacturing apparatus, which has the effect of simplifying the manufacturing process.
【０００６】[0006]
【実施例】続いて、添付した図面を参照しつつ、本発明
を具体化した実施例につき説明し、本発明の理解に供す
る。なお、前記図２に示す構成要素と同一の構成要素に
ついては同一の番号を付してその詳しい説明を省略す
る。まず、素子搭載部１１、インナーリード部１２及び
アウターリード部１３を有するリードフレーム２１に所
要の形状加工を行い、該リードフレーム２１の全面に耐
めっき性の樹脂を塗布して、全体を該耐めっき性の樹脂
膜２２によって被覆する。そして、図１の（ａ）に示す
ように、第１及び第２のめっき層に対応する部分の樹脂
膜を周知の方法によって除去して第１の露出部２３と、
第２の露出部２４とを形成する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will now be described with reference to the accompanying drawings to provide an understanding of the present invention. The same components as those shown in FIG. 2 are denoted by the same reference numerals, and detailed description thereof will be omitted. First, the lead frame 21 having the element mounting portion 11, the inner lead portion 12, and the outer lead portion 13 is processed into a required shape, and a plating-resistant resin is applied to the entire surface of the lead frame 21, and the whole is subjected to the resistance-to-resistance. It is covered with a plating resin film 22. Then, as shown in FIG. 1A, a portion of the resin film corresponding to the first and second plating layers is removed by a known method to form a first exposed portion 23,
The second exposed portion 24 is formed.
【０００７】次に、図１の（ｂ）に示すように、第２の
露出部２４をマスクプレート２５で被覆する。該マスク
プレート２５の前記第１の露出部２３に対応する位置に
はめっき液噴流用の貫通孔２６が設けられている。な
お、該マスクプレート２５が設けられていないリードフ
レーム２１の反対側には押さえプレート２７が設けられ
ている。この状態で第１の露出部２３にめっき液を噴流
し、第１の金属部分めっき層２８を形成する。Next, as shown in FIG. 1B, the second exposed portion 24 is covered with a mask plate 25. At a position corresponding to the first exposed portion 23 of the mask plate 25, a through-hole 26 for jetting a plating solution is provided. A holding plate 27 is provided on the opposite side of the lead frame 21 where the mask plate 25 is not provided. In this state, a plating solution is jetted onto the first exposed portion 23 to form a first metal partial plating layer 28.
【０００８】そして、図１の（ｃ）に示すように、該第
１の金属部分めっき層２８を含む第１の露出部２３を別
のマスクプレート２９、３０で覆う。このマスクプレー
ト２９、３０には第２の露出部２４にめっき液を噴流す
るための貫通孔３１、３２がそれぞれ設けられている。
この後、この部分にめっき液を噴流し、アウター側面を
含む第２の金属部分めっき層３３を形成する。Then, as shown in FIG. 1C, the first exposed portion 23 including the first metal partial plating layer 28 is covered with another mask plate 29, 30. The mask plates 29 and 30 are provided with through holes 31 and 32 for jetting a plating solution to the second exposed portion 24, respectively.
Thereafter, a plating solution is jetted onto this portion to form a second metal partial plating layer 33 including the outer side surface.
【０００９】以上の工程を終えた後、リードフレーム２
１の表面に被覆されている耐めっき性の樹脂膜２２を除
去することによって、図１の（ｄ）に示すように所要部
分に第１のめっき層２８と側面を含む第２のめっき層３
３が形成されたリードフレーム２１ができる。前記実施
例においては、第１の露出部２３に先にめっきを行い、
第２の露出部２４に後からめっきを行ったが、先に第２
の露出部２４にめっきを行い、後から第１の露出部２３
に後からめっきを行うことも可能である。また、前記実
施例においては２種類の異種金属部分めっきを行った場
合について説明したが、３種類以上の異種金属部分めっ
きを行う場合も本発明は適用される。After completing the above steps, the lead frame 2
By removing the plating-resistant resin film 22 coated on the surface of the first plating layer 3, the second plating layer 3 including the first plating layer 28 and the side surface at required portions as shown in FIG.
3 is formed. In the embodiment, the first exposed portion 23 is plated first,
Although plating was performed on the second exposed portion 24 later,
Is plated on the exposed portion 24 of the first exposed portion 23.
It is also possible to perform plating later. In the above embodiment, the case where two kinds of different metal partial platings are performed is described. However, the present invention is also applicable to the case where three or more kinds of different metal partial platings are performed.
【００１０】[0010]
【発明の効果】以上説明してきたように、本発明によれ
ば、従来技術のようにめっきする異種金属毎に、リード
フレーム上に耐めっき性の樹脂膜を塗布して露出部のパ
ターンを形成する必要がないので、耐めっき性の樹脂膜
を形成する工程が簡素化され、作業効率が大幅に改善さ
れる。また、耐めっき性の樹脂膜を形成する工程が簡素
化されると共に、各工程の連続処理が可能となって搬送
途中に損傷することによって生じる不良品の発生を極力
防止できる。また、耐めっき性の樹脂膜の露出部のパタ
ーンを予め形成しているので、微細部分のめっきによる
表面処理領域を正確に形成できる。そして、耐めっき性
の樹脂膜で非めっき部分を被覆しているので、めっき時
にリードの側面等に高価な貴金属めっき層が付着するこ
とがなく、めっき液の節減になり、更にはバリの発生や
マイグレーション等の発生を防止できる。As described above, according to the present invention, a pattern of an exposed portion is formed by applying a plating-resistant resin film on a lead frame for each dissimilar metal to be plated as in the prior art. Since there is no need to perform the process, the process of forming the plating-resistant resin film is simplified, and the working efficiency is greatly improved. In addition, the step of forming the plating-resistant resin film is simplified, and continuous processing in each step becomes possible, thereby making it possible to minimize the occurrence of defective products caused by damage during transportation. In addition, since the pattern of the exposed portion of the plating-resistant resin film is formed in advance, a surface treatment region by plating a fine portion can be accurately formed. Since the non-plated portion is covered with a plating-resistant resin film, the expensive noble metal plating layer does not adhere to the side surfaces of the leads during plating, so that the plating solution is saved and burrs are generated. And migration can be prevented.
【図１】本発明の一実施例に係るリードフレームの異種
金属部分めっき方法の各工程を示す断面図である。FIG. 1 is a cross-sectional view showing each step of a method for partially plating different kinds of metals on a lead frame according to one embodiment of the present invention.
【図２】リードフレームの平面図である。FIG. 2 is a plan view of a lead frame.
【図３】従来例に係るリードフレームの異種金属部分め
っき方法の各工程を示す断面図である。FIG. 3 is a cross-sectional view showing each step of a method for partially plating different kinds of metals on a lead frame according to a conventional example.
１０ リードフレーム １１ 素子搭載部 １２ インナーリード部 １３ アウターリード部 ２１ リードフレーム ２２ 耐めっき性の樹脂膜 ２３ 第１の露出部 ２４ 第２の露出部 ２５ マスクプレート ２６ 貫通孔 ２７ 押さえプレート ２８ 第１の金属部分めっき層 ２９ マスクプレート ３０ マスクプレート ３１ 貫通孔 ３２ 貫通孔 ３３ 第２の金属部分めっき層 DESCRIPTION OF SYMBOLS 10 Lead frame 11 Element mounting part 12 Inner lead part 13 Outer lead part 21 Lead frame 22 Plating-resistant resin film 23 First exposed part 24 Second exposed part 25 Mask plate 26 Through hole 27 Press plate 28 First Metal partial plating layer 29 Mask plate 30 Mask plate 31 Through hole 32 Through hole 33 Second metal partial plating layer
Claims (1)
ターリード部を有して構成されたリードフレームの所定
の領域に異種金属部分めっき層を形成するリードフレー
ムの異種金属部分めっき方法であって、 前記素子搭載部、インナーリード部及びアウターリード
部を備えるリードフレームの形状加工を行う工程と、 前記リードフレームの全面を耐めっき性の樹脂で被覆
し、前記素子搭載部及び／又はインナーリード部の所定
領域に形成する第１の金属部分めっき層の位置する部分
の樹脂膜を除去して下地金属層を露出した第１の露出部
と、前記アウターリード部の所定領域に形成する第２の
金属部分めっき層の位置する部分の樹脂膜を除去して下
地金属層を露出させた第２の露出部とを同時に形成する
工程と、 前記第１の露出部の位置に相当する部分にめっき液噴流
用の貫通孔を備えたマスクプレートで前記第２の露出部
を被覆して、第１の露出部に第１の金属部分めっき層を
形成する工程と、 前記第２の露出部の位置に相当する部分にめっき液噴流
用の貫通孔を備えたマスクプレートで前記第１の金属部
分めっき層を被覆して、第２の露出部に第２の金属部分
めっき層を形成する工程と、 前記耐めっき性の樹脂膜を除去する工程とを有してなる
ことを特徴とするリードフレームの異種金属部分めっき
方法。1. A method for plating a different kind of metal part on a lead frame, comprising forming a different kind metal part plating layer in a predetermined region of a lead frame having an element mounting part, an inner lead part and an outer lead part, A step of forming a lead frame including the element mounting portion, an inner lead portion and an outer lead portion; and covering the entire surface of the lead frame with a plating-resistant resin, and forming the element mounting portion and / or the inner lead portion. A first exposed portion in which a resin film in a portion where a first metal partial plating layer formed in a predetermined region is located is exposed to expose a base metal layer, and a second metal formed in a predetermined region of the outer lead portion Removing the resin film in the portion where the partial plating layer is located to simultaneously form a second exposed portion exposing the underlying metal layer; Forming a first metal partial plating layer on the first exposed portion by covering the second exposed portion with a mask plate having a through hole for a plating solution jet in a corresponding portion; The first metal partial plating layer is covered with a mask plate provided with a through hole for a plating solution jet at a portion corresponding to the position of the exposed portion of the above, and the second metal partial plating layer is coated on the second exposed portion. A method of plating a dissimilar metal part of a lead frame, comprising: a step of forming; and a step of removing the plating-resistant resin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11244591A JP2654871B2 (en) | 1991-04-16 | 1991-04-16 | Partial metal plating method for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11244591A JP2654871B2 (en) | 1991-04-16 | 1991-04-16 | Partial metal plating method for lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04318187A JPH04318187A (en) | 1992-11-09 |
| JP2654871B2 true JP2654871B2 (en) | 1997-09-17 |
Family
ID=14586812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11244591A Expired - Lifetime JP2654871B2 (en) | 1991-04-16 | 1991-04-16 | Partial metal plating method for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2654871B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1015669B1 (en) | 1997-04-04 | 2010-11-17 | University Of Southern California | Electroplating method for forming a multilayer structure |
| US9614266B2 (en) | 2001-12-03 | 2017-04-04 | Microfabrica Inc. | Miniature RF and microwave components and methods for fabricating such components |
| AU2002360464A1 (en) | 2001-12-03 | 2003-06-17 | Memgen Corporation | Miniature rf and microwave components and methods for fabricating such components |
| US10297421B1 (en) | 2003-05-07 | 2019-05-21 | Microfabrica Inc. | Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures |
| JP2005097714A (en) * | 2003-08-25 | 2005-04-14 | Matsushita Electric Ind Co Ltd | Method of forming spot-plated film |
-
1991
- 1991-04-16 JP JP11244591A patent/JP2654871B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04318187A (en) | 1992-11-09 |
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