JP2650779B2 - Jig for stamper production - Google Patents

Description

【発明の詳細な説明】 （イ）産業上の利用分野 この発明は、光ディスク、光カードその他光応用プラ
スチック製品等の製造に係るスタンパの製造に用いるス
タンパ製造用治具に関する。さらに詳しくは、スタンパ
製造工程における電鋳工程の際に使用される治具に関す
る。The present invention relates to a stamper manufacturing jig used for manufacturing a stamper for manufacturing an optical disk, an optical card, and other optically applied plastic products. More specifically, the present invention relates to a jig used in an electroforming process in a stamper manufacturing process.

（ロ）従来の技術 従来光ディスクなどの製造に係るスタンパは、第５図
に示す製造工程によって製造されるもので、その製造工
程における電鋳の際には、第６図に示すスタンパ製造治
具が使用される。(B) Conventional technology A stamper according to the related art for manufacturing an optical disc or the like is manufactured by a manufacturing process shown in FIG. 5, and when performing electroforming in the manufacturing process, a stamper manufacturing jig shown in FIG. Is used.

スタンパ製造は、まず第５図（ａ）のようにガラス基
板50にフォトレジスト51を塗布し、レーザー光52等によ
ってカッティングを行った後、これを現像して所望の形
状の凹凸パターン51aを形成する（第５図（ｂ）及び第
５図（ｃ））。次に第５図（ｄ）のように凹凸パターン
51aを備えたガラス基板50上にスパッタリング、蒸着等
の方法で導電膜53を形成し、その後電鋳処理を行って金
属、例えばNiの電鋳膜54を所望の厚さで形成する（第５
図（ｅ）及び第５図（ｆ））。そのガラス基板50と電鋳
膜54とを剥離して第５図（ｆ）のようなスタンパ55とす
るのである。The stamper is manufactured by first applying a photoresist 51 to a glass substrate 50 as shown in FIG. 5 (a), performing cutting with a laser beam 52 or the like, and then developing this to form a concavo-convex pattern 51a having a desired shape. (FIGS. 5 (b) and 5 (c)). Next, as shown in FIG.
A conductive film 53 is formed on a glass substrate 50 provided with 51a by a method such as sputtering or vapor deposition, and then electroformed to form an electroformed film 54 of metal, for example, Ni to a desired thickness (fifth embodiment).
Figures (e) and 5 (f)). The glass substrate 50 and the electroformed film 54 are separated to form a stamper 55 as shown in FIG. 5 (f).

ところで、第５図（ｄ）のように凹凸パターン51aを
備えたガラス基板50に電鋳膜54を電鋳する際の通電方式
としては、第６図に示すスタンパ製造用治具を用いた、
ガラス基板50の外周部に電鋳用通電治具56を配置する外
周通電方式が良く用いられている。By the way, as an energizing method for electroforming the electroformed film 54 on the glass substrate 50 having the concavo-convex pattern 51a as shown in FIG. 5 (d), a jig for stamper production shown in FIG. 6 was used.
An outer periphery energizing method in which an electroforming energizing jig 56 is arranged on the outer periphery of the glass substrate 50 is often used.

（ハ）発明が解決しようとする課題 上記のような外周通電方式の電鋳では、ガラス基板50
を固定するガラス基板ホルダ57の外周部に電鋳処理時の
陰極58があり、電極押さえ部材59と電鋳用通電治具56に
よって、ガラス基板50と陰極58とを同時に押さえる構造
となっている。このためガラス基板50の大きさが例えば
直径200mmから直径150mmに変わるとそのガラス基板に合
った大きさのガラス基板ホルダと電鋳用通電治具が必要
となる（第７図A,B）。ガラス基板ホルダ57の大きさが
異なるために、当然の結果として、陰極となるべき面積
を異なり、電鋳条件例えば電流密度、陽陰極間距離等も
異なってしまう。つまり、異なった大きさのガラス基板
を使用するためには、ガラス基板ホルダ57の大きさを変
えるだけでなく、電鋳条件自体の調整も必要となり、生
産性を低下させるものとなっていた。(C) Problems to be Solved by the Invention In the electroforming of the outer periphery energizing method as described above, the glass substrate 50
There is a cathode 58 at the time of electroforming on the outer peripheral portion of the glass substrate holder 57 for fixing the glass substrate holder 57, and has a structure in which the glass substrate 50 and the cathode 58 are simultaneously pressed by the electrode pressing member 59 and the electroforming jig 56. . For this reason, when the size of the glass substrate 50 changes from, for example, a diameter of 200 mm to a diameter of 150 mm, a glass substrate holder and an electroforming energizing jig having a size corresponding to the glass substrate are required (FIGS. 7A and 7B). Since the size of the glass substrate holder 57 is different, as a matter of course, the area to be the cathode is different, and the electroforming conditions such as the current density and the distance between the cathode and the cathode are also different. In other words, in order to use glass substrates of different sizes, not only the size of the glass substrate holder 57 must be changed, but also the electroforming conditions themselves need to be adjusted, which reduces productivity.

この発明は上記の事情を考慮してなされたもので、原
盤の大きさが変わっても同一の製造工程、特に同一の電
鋳条件によりスタンパを製造することができるスタンパ
製造用治具を提供しようとするものである。The present invention has been made in view of the above circumstances, and will provide a stamper manufacturing jig that can manufacture a stamper under the same manufacturing process, particularly under the same electroforming conditions, even if the size of the master is changed. It is assumed that.

（ニ）課題を解決するための手段及び作用 この発明は、所望の形状の凹凸パターンを形成した最
大外形寸法の原盤の収容しうる、内側表面前面に同電送
が形成されてなる凹部を有する原盤ホルダと、最大外形
寸法の原盤を電鋳する際に必要な電極の外形寸法と略同
一の外形寸法を有し、かつ最大外形寸法の原盤よりも小
さい外形寸法の所望の原盤に対応するスタンパの外形寸
法と略同一の内側寸法を有する電鋳用電極と、原盤ホル
ダの凹部の内側寸法と略同一の外形寸法を有し、かつ所
望の原盤の外形寸法と略同一の内側寸法を有し、電鋳用
電極の下面に同心上に取り付けられてなる心出し部材
と、所望の原盤と電鋳用電極の取り付けられた心出し部
材とが原盤ホルダ内に装着された際に電鋳用電極を押さ
えつける電極押え部材とからなるスタンパ製造用治具で
ある。(D) Means and Actions for Solving the Problems The present invention provides a master having a concave portion formed with the same electric transmission on the front surface of the inner surface, which can accommodate a master having the maximum outer dimensions in which a concavo-convex pattern having a desired shape is formed. A holder and a stamper corresponding to a desired master having the same outer dimensions as the electrodes required for electroforming the master having the maximum outer dimensions and having a smaller outer dimension than the master having the maximum outer dimensions. An electroforming electrode having substantially the same inside dimensions as the outside dimensions, having substantially the same outside dimensions as the inside dimensions of the recesses of the master holder, and having substantially the same inside dimensions as the desired master outer dimensions, When the centering member attached concentrically to the lower surface of the electrode for electroforming and the centering member attached with the desired master and the electrode for electroforming are mounted in the master holder, the electrode for electroforming is formed. A switch consisting of an electrode holding member This is a tamper manufacturing jig.

この発明におけるスタンパ製造用治具は、原盤ホルダ
の凹部の寸法が、光ディスクなどの光メモリ媒体の原盤
のうちの最大外形寸法のものに対応し、その凹部内に、
電鋳用電極の取付けられた心出し部材と所望の原盤とが
入れられ、電極押え部材によって電鋳用電極が押さえら
れて、電鋳加工を行う際に使用されるものである。In the stamper manufacturing jig according to the present invention, the dimensions of the concave portion of the master holder correspond to those of the maximum outer dimensions of the master of an optical memory medium such as an optical disk.
The centering member on which the electrode for electroforming is mounted and a desired master are placed, and the electrode for electroforming is pressed by an electrode pressing member, and is used when performing electroforming.

電鋳用電極は、環状形状をしており、その外形寸法が
最大外形寸法の原盤を電鋳する際に必要な電極の外形寸
法と略同一であるので、実質的に電鋳の際の陰極面積が
所望の原盤の場合でも最大外形寸法の原盤の場合と変わ
らないものとなる。したがって所望の原盤に対する電鋳
条件は、最大外形寸法の原盤に対するそれと同一であっ
てよい。The electrode for electroforming has an annular shape, and its outer dimensions are substantially the same as the outer dimensions of the electrodes required for electroforming a master having the maximum outer dimensions. Even in the case of a desired master, the area is the same as that of the master having the maximum outer dimensions. Therefore, the electroforming conditions for the desired master may be the same as those for the master having the maximum outer dimensions.

このことは、心出し部材及び電鋳用電極を所望の原盤
に対応して数種類準備しておけば、１つの原盤ホルダを
使用して最大外形寸法の原盤の電鋳条件と同一条件で、
その原盤より小さい外形寸法の原盤を行うことを可能に
するものである。This means that if several types of centering members and electroforming electrodes are prepared corresponding to the desired master, the electroforming conditions of the master having the maximum external dimensions using one master holder are the same,
This makes it possible to make a master having an outer dimension smaller than that of the master.

（ホ）実施例 以下この発明の実施例を図面にて詳述するが、この発
明は以下の実施例に限定されるものではない。(E) Embodiment Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings, but the present invention is not limited to the following embodiment.

第１図において、１は原盤ホルダで、所望の形状の凹
凸パターンを形成した最大外形寸法の原盤を収容しう
る、その全表面に導電層2aが形成されている凹部２を有
している。原盤は、例えば光ディスク用スタンパ製造の
場合、当該分野で広く知られている方法で凹凸パターン
が形成された円盤形状をしたガラス基板で、その最大外
形寸法つまり最大外径は300mmである。この種のガラス
基板には、このほかにその外径が200mm、150mm及び120m
mであるものがある。この実施例においては、凹部２は
円盤形状のガラス基板に対応して、ガラス基板の厚みと
ほぼ同一の深さを有し、かつ最大外径に対応してほぼ30
0mmの直径を有する円形のものとする。In FIG. 1, reference numeral 1 denotes a master disk holder, which has a concave portion 2 in which a conductive layer 2a is formed on the entire surface thereof, which can accommodate a master disk having a maximum outer dimension in which a concavo-convex pattern having a desired shape is formed. For example, in the case of manufacturing a stamper for an optical disk, the master is a disk-shaped glass substrate on which a concavo-convex pattern is formed by a method widely known in the art, and its maximum outer dimension, that is, the maximum outer diameter is 300 mm. This type of glass substrate also has an outer diameter of 200mm, 150mm and 120m
Some are m. In this embodiment, the recess 2 has a depth substantially equal to the thickness of the glass substrate corresponding to the disk-shaped glass substrate, and has a depth of approximately 30 corresponding to the maximum outer diameter.
It shall be circular with a diameter of 0 mm.

３は心出し部材で、原盤ホルダ１の凹部２の内側寸法
と略同一の外径寸法を有し、かつ所望の原盤６の外形寸
法と略同一の内側寸法を有し電鋳用電極４の下面に同心
上に取り付けられている（第２図及び第３図参照）。す
なわち心出し部材３は原盤ホルダ１の凹部２の深さとほ
ぼ同じ厚みを有する環状形である。心出し部材３の材質
としては、スタンパ製造工程における電鋳の際に、電鋳
用電解液に侵されないものであればよく、例えばステン
レス、アクリル、ポリプロピレン、塩化ビニル樹脂など
が挙げられる。Reference numeral 3 denotes a centering member, which has an outer diameter substantially the same as the inner dimension of the concave portion 2 of the master holder 1 and has an inner size substantially the same as the outer dimension of a desired master 6, It is mounted concentrically on the lower surface (see FIGS. 2 and 3). That is, the centering member 3 has an annular shape having substantially the same thickness as the depth of the concave portion 2 of the master holder 1. The material of the centering member 3 may be a material which is not affected by the electrolytic solution for electroforming at the time of electroforming in the stamper manufacturing process, and examples thereof include stainless steel, acrylic, polypropylene, and vinyl chloride resin.

この心出し部材３の内側寸法は、所望の原盤であるガ
ラス基板６の外形寸法が200mmの場合、201〜202mmであ
る。The inner dimension of the centering member 3 is 201 to 202 mm when the outer dimension of the glass substrate 6 as a desired master is 200 mm.

心出し部材３に取付けられる電鋳用電極４は、最大外
形寸法の原盤を電鋳する際に必要な電極の外形寸法と略
同一の外形寸法を有し、かつ最大外形寸法の原盤よりも
小さい外形寸法の所望の原盤６に対応するスタンパの外
形寸法と略同一の内側寸法を有している。この電鋳用電
極４は、心出し部材３の上面に、複数のビス５によって
取り付けられている。ビス５は導電性のない材質、例え
ばアクリル製のものを使用すれば、ビス５の上へメッキ
が異常析出することなく、良好である。ビス５のかわり
に接着剤で固定してもよい。また電鋳用電極４の材質
は、電鋳の際のメッキが電極上面に析出するものであれ
ばよく、例えばニッケル、鉄、ステンレスなどが挙げら
れる。さらに電鋳用電極４はガラス基板６の上面との密
着性を良好になるように、弾性力を有する形状にするの
が好ましい。The electroforming electrode 4 attached to the centering member 3 has substantially the same outer dimensions as the electrodes required for electroforming a master having the maximum outer dimensions, and is smaller than the master having the maximum outer dimensions. The stamper has the same inner dimensions as the outer dimensions of the stamper corresponding to the desired master 6 having the outer dimensions. The electroforming electrode 4 is mounted on the upper surface of the centering member 3 by a plurality of screws 5. If a material having no conductivity, for example, an acrylic material, is used for the screw 5, the plating is excellent without abnormal deposition of plating on the screw 5. Instead of the screw 5, it may be fixed with an adhesive. The material of the electrode 4 for electroforming may be any material as long as plating at the time of electroforming is deposited on the upper surface of the electrode, and examples thereof include nickel, iron, and stainless steel. Further, it is preferable that the electrode 4 for electroforming has a shape having elasticity so that the adhesion to the upper surface of the glass substrate 6 becomes good.

７は電極押さえ部材で、所望の原盤であるガラス基板
６と電鋳用電極４の取り付けられた心出し部材３とが原
盤ホルダ１内に装着された際に電鋳用電極４を押さえつ
けるものである。すなわち、電極押さえ部材７は、その
一方の端部7aで電鋳用電極４の外周部分を、原盤ホルダ
１の凹部２の内側壁に形成された導電層2bに密着させる
ように押さえつけるものである。この電極押さえ部材７
は、複数個使用されて、あるいは環状形のものが使用さ
れて電鋳用電極４が外周部分を均等にガラス基板６へ押
さえつけるものである。Reference numeral 7 denotes an electrode pressing member which presses the electrode 4 for electroforming when the glass substrate 6 as a desired master and the centering member 3 to which the electrode 4 for electroforming is attached are mounted in the master holder 1. is there. That is, the electrode pressing member 7 presses the outer peripheral portion of the electrode 4 for electroforming at one end 7a so as to be in close contact with the conductive layer 2b formed on the inner side wall of the concave portion 2 of the master holder 1. . This electrode pressing member 7
Is used in a plurality or in an annular shape so that the electrode 4 for electroforming uniformly presses the outer peripheral portion against the glass substrate 6.

以上の構成において、ガラス基板６を原盤ホルダ１の
凹部２に収めた後、ガラス基板６と凹部２の内側壁2bと
の間隙に心出し部材３を挿入し、電鋳用電極４を押さえ
部材７にて押さえる。このようにガラス基板６を原盤ホ
ルダ１を収容して、従来と同様に、導電層２を陰極とし
て電鋳加工をおこない、ガラス基板６上に電鋳膜８を形
成する。この場合の電鋳条件は、外径300mmのガラス基
板に電鋳する場合の条件と同一条件にておこなう。In the above configuration, after the glass substrate 6 is housed in the concave portion 2 of the master holder 1, the centering member 3 is inserted into the gap between the glass substrate 6 and the inner wall 2b of the concave portion 2, and the electroforming electrode 4 is pressed. Hold down at 7. As described above, the glass substrate 6 is accommodated in the master holder 1, and electroforming is performed using the conductive layer 2 as a cathode to form an electroformed film 8 on the glass substrate 6, as in the related art. The electroforming conditions in this case are the same as those for electroforming a glass substrate having an outer diameter of 300 mm.

第４図A,B,Cに、異なる外径のガラス基板に対し、同
一の電鋳条件により電鋳をおこなった場合に形成された
電鋳膜の膜厚分布を示す。FIGS. 4A, 4B and 4C show film thickness distributions of electroformed films formed when electroforming is performed on glass substrates having different outer diameters under the same electroforming conditions.

第４図Ａはこの実施例におけるもので、メッキが析出
する面積が外径300mmのガラス基板の場合と同じになる
ため、膜厚及び膜厚分布とも第４図Ｂに示した外形300m
mのガラス基板の場合と変らず、±５μｍの範囲に膜厚
のバラツキがおさまった電鋳膜８が得られた。FIG. 4A shows the result of this embodiment, in which the area where the plating deposits is the same as that of a glass substrate having an outer diameter of 300 mm.
As in the case of a glass substrate having a thickness of m, an electroformed film 8 having a thickness variation within a range of ± 5 μm was obtained.

これに対し、従来の場合、第７図Ａ及びＢに示すよう
に、ガラス基板60、61の外径にあわせた電鋳用電極62、
63を用いて電鋳をおこなった場合、ガラス基板62におい
てメッキが析出する面積S2はガラス基板60における面積
S1に比べて小さくなるので、第４図Ｃに示すように、膜
厚が厚く、かつ膜厚のバラツキも±10μｍを越えた電鋳
膜となり、スタンパとして使用できないものとなった。On the other hand, in the case of the prior art, as shown in FIGS. 7A and 7B, the electroforming electrodes 62 corresponding to the outer diameters of the glass substrates 60 and 61,
When electroforming is performed using 63, the area S2 where plating is deposited on the glass substrate 62 is the area on the glass substrate 60.
Since it is smaller than S1, as shown in FIG. 4C, an electroformed film having a large film thickness and a variation in film thickness exceeding ± 10 μm cannot be used as a stamper.

上記実施例では、外径150mmのガラス基板に電鋳をお
こなう場合の電柱用電極及び心出し部材を有するスタン
パ製造用治具を示したが、この発明の治具は、同一の原
盤ホルダに対し、複数の、寸法の異なる電鋳用電極及び
心出し部材を組み合せて備えることにより、大きさの異
なる同種のガラス基板に対し、電鋳条件を変えることな
く電鋳加工をおこなえるものである。In the above embodiment, a jig for manufacturing a stamper having an electrode for a power pole and a centering member in the case of performing electroforming on a glass substrate having an outer diameter of 150 mm was shown. By providing a plurality of electroforming electrodes having different dimensions and a centering member in combination, electroforming can be performed on the same type of glass substrates having different sizes without changing the electroforming conditions.

（ヘ）発明の効果 この発明によれば、電鋳用電極の内側寸法を所望の原
盤の外径に合わせて変化させることにより、原盤の大き
さが変わっても見かけの陰極面積が変わらないので、同
一の原盤ホルダ、同一の電鋳条件で高精度なスタンパを
作製できる。(F) Effects of the Invention According to the present invention, by changing the inner dimensions of the electrode for electroforming according to the desired outer diameter of the master, the apparent cathode area does not change even if the size of the master changes. A highly accurate stamper can be manufactured under the same master holder and the same electroforming conditions.

又、心出し部材と電鋳用電極とを一体化させて使用す
ることにより、電鋳加工時の原盤のずれや脱落も防止で
きる。したがって、原盤の大きさが異なっても電鋳工程
での対応が素早くとれ、スタンパを容易に、かつ高精度
に作製することができる。Further, by using the centering member and the electrode for electroforming integrally, it is possible to prevent the master from shifting or falling off during electroforming. Therefore, even if the sizes of the masters are different, it is possible to quickly respond to the electroforming process, and it is possible to manufacture the stamper easily and with high precision.

【図面の簡単な説明】[Brief description of the drawings]

第１図はこの発明の実施例の構成を示す部分縦断面図、
第２図及び第３図は実施例の電鋳用電極、心出し部材及
びガラス基板の大きさの関係を示す一部省略平面図及び
縦断面図、第４図Ａ、Ｂ及Ｃは実施例、基準のガラス基
板及び従来例の場合の電鋳膜厚を示す分布図、第５図は
スタンパの製造方法を示す製造工程図、第６図は従来例
の構成を示す部分縦断面図、第７図Ａ及びＢはそれぞれ
従来例における直径200mmのガラス基板及び直径150mmの
ガラス基板と電鋳用通電治具との大きさの関係を示す一
部省略平面図である。 １……原盤ホルダ、２……凹部、 2a……導電層、３……心出し部材、 ４……電鋳用電極、７……電極押え部材。FIG. 1 is a partial longitudinal sectional view showing a configuration of an embodiment of the present invention,
2 and 3 are a partially omitted plan view and a longitudinal sectional view showing the relationship between the size of the electrode for electroforming, the centering member and the glass substrate of the embodiment, and FIGS. 4A, 4B and 4C show the embodiment. FIG. 5 is a distribution diagram showing a standard glass substrate and an electroformed film thickness in the case of the conventional example, FIG. 5 is a manufacturing process diagram showing a manufacturing method of the stamper, FIG. FIGS. 7A and 7B are partially omitted plan views showing the relationship between the size of a glass substrate having a diameter of 200 mm and the glass substrate having a diameter of 150 mm and a current-carrying jig in a conventional example. DESCRIPTION OF SYMBOLS 1 ... Master holder, 2 ... recessed part, 2a ... Conductive layer, 3 ... Centering member, 4 ... Electroforming electrode, 7 ... Electrode holding member.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】所望の形状の凹凸パターンを形成した最大
外形寸法の原盤を収容しうる、内側表面全面に導電層が
形成されてなる凹部を有する原盤ホルダと、 最大外形寸法の原盤を電鋳する際に必要な電極の外形寸
法と略同一の外形寸法を有し、かつ最大外形寸法の原盤
よりも小さい外形寸法の所望の原盤に対応するスタンパ
の外形寸法と略同一の内側寸法を有する電鋳用電極と、 原盤ホルダの凹部の内側寸法と略同一の外形寸法を有
し、かつ所望の原盤の外形寸法と略同一の内側寸法を有
し、電鋳用電極の下面に同心上に取り付けられてなる心
出し部材と、 所望の原盤と電鋳用電極の取り付けられた心出し部材と
が原盤ホルダ内に装着された際に電鋳用電極を押さえつ
ける電極押え部材と からなるスタンパ製造用治具。1. A master holder having a concave portion in which a conductive layer is formed on the entire inner surface and capable of accommodating a master having a maximum outer dimension formed with a concavo-convex pattern having a desired shape, and electroforming a master having the maximum outer dimension. The outer dimensions of the stamper corresponding to the desired master having a smaller outer dimension than the master having the maximum outer dimensions are substantially the same as the outer dimensions of the electrodes required for the operation. The casting electrode has the same outer dimensions as the inner dimensions of the recess of the master holder, and has the same inner dimensions as the desired outer dimensions of the master, and is mounted concentrically on the lower surface of the electrode for electroforming. A stamper manufacturing jig, comprising: a centering member formed as described above; and an electrode holding member for holding down the electroforming electrode when the desired master and the centering member with the electrode for electroforming are mounted in the master holder. Utensils.