JP2613966B2 - Manufacturing method of contact material - Google Patents
Manufacturing method of contact materialInfo
- Publication number
- JP2613966B2 JP2613966B2 JP2270788A JP27078890A JP2613966B2 JP 2613966 B2 JP2613966 B2 JP 2613966B2 JP 2270788 A JP2270788 A JP 2270788A JP 27078890 A JP27078890 A JP 27078890A JP 2613966 B2 JP2613966 B2 JP 2613966B2
- Authority
- JP
- Japan
- Prior art keywords
- particles
- composite
- contact material
- dispersed
- drum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims description 51
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000002245 particle Substances 0.000 claims description 164
- 239000011246 composite particle Substances 0.000 claims description 36
- 239000010419 fine particle Substances 0.000 claims description 33
- 239000013078 crystal Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 20
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 7
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000010008 shearing Methods 0.000 claims description 3
- 239000002131 composite material Substances 0.000 description 16
- 238000003466 welding Methods 0.000 description 14
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 238000005491 wire drawing Methods 0.000 description 9
- 229910017937 Ag-Ni Inorganic materials 0.000 description 7
- 229910017984 Ag—Ni Inorganic materials 0.000 description 7
- 238000013329 compounding Methods 0.000 description 6
- 239000011324 bead Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000000635 electron micrograph Methods 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 230000000536 complexating effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001192 hot extrusion Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、例えば、リレー、マグネットスイッチ、
ブレーカ等の開閉機器の電気接点に用いる接点材料の製
造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to, for example, a relay, a magnet switch,
The present invention relates to a method for manufacturing a contact material used for an electrical contact of a switching device such as a breaker.
Ag素地接点材料であるAg−Ni系接点材料は、耐消耗性
および加工性に優れている。しかしながら、Ag−Ni系接
点材料は、同じAg素地接点材料であるAg−CdO系接点材
料やAg−SnO2系接点材料に比べ、耐溶着性が十分でない
ことから、利用が低負荷用〜中負荷用に限られる傾向が
あり、耐溶着性の改善が望まれている。Ag-Ni contact materials, which are Ag base contact materials, have excellent wear resistance and workability. However, Ag-Ni-based contact material, compared with the Ag-CdO-based contact material or Ag-SnO 2 based contact material is the same Ag matrix contact material, since the adhesion resistance is not sufficient, use is in ~ for low load It tends to be limited to loads, and improvement in welding resistance is desired.
従来、上記Ag−Ni系接点材料は、つぎのようにして製
造されている。Conventionally, the Ag-Ni-based contact material has been manufactured as follows.
それぞれ別々に製造したAg粒子にNi粒子を添加混合
し、圧縮成形して成形体を得て、ついで、成形体に対し
〔焼成→熱間圧縮〕を２〜３回繰り返し施すという焼結
工程を経て、焼結後、通常、引き伸ばし工程で引き伸ば
すようにする。引き伸ばし工程では、普通、焼結体を熱
間押し出しした後、さらに伸線する。Ni粒子は引き伸ば
し工程で伸線方向に引き延ばされており、接点材料中に
伸線方向に長手方向を向けた約５μｍ程度の平均径の繊
維状になっている。伸線した後、短く切断し、伸線方向
に対し直角の方向の断面（横断面）を接点面として使
う。すなわち、NiはAg素地中に平均径５μｍの繊維状で
接点面に対し交差する方向に配向分散しているのであ
る。A sintering step of adding and mixing Ni particles to separately produced Ag particles, compression-molding to obtain a molded body, and repeatedly performing [firing → hot compression] on the molded body 2-3 times. After sintering, it is usually stretched in a stretching step. In the stretching step, the sintered body is usually hot-extruded and then further drawn. The Ni particles are stretched in the wire drawing direction in the wire drawing step, and are in the form of fibers having an average diameter of about 5 μm and extending in the wire drawing direction in the contact material. After wire drawing, it is cut short, and a cross section (transverse cross section) perpendicular to the drawing direction is used as a contact surface. That is, Ni is oriented and dispersed in the Ag base material in a fibrous form having an average diameter of 5 μm in a direction crossing the contact surface.
耐溶着性を向上させるには、Niを接点面へ微細に満偏
無く分散させる必要がある。例えば、Ag粒子とNi粒子の
両方共に粒径１μｍ以下の微粒子にすれば、接点面に微
細なNi粒子が局在化せず満偏なく分散するはずである
が、実際はそうならない。微粒子を混合する段階で微粒
子が凝集して大きな２次粒子になり、結局、大きなNi粒
子として分散することになるからである。In order to improve the welding resistance, it is necessary to disperse Ni finely and evenly on the contact surface. For example, if both the Ag particles and the Ni particles are fine particles having a particle diameter of 1 μm or less, the fine Ni particles should not be localized on the contact surface and should be dispersed without bias, but this is not the case. This is because, at the stage of mixing the fine particles, the fine particles are aggregated into large secondary particles, and eventually dispersed as large Ni particles.
また、配合するAg、Ni全量を一緒に溶かした融液を噴
霧して、Ni含有Ag粒子およびNi粒子を同時に得て、これ
を成形・焼結することが考えられる。この場合には、Ag
粒子中には微細なNi粒子が存在するが、得た粒子の中に
非常に粒径の大きい粗大Ni粒子が混在する。Ag−Ni溶湯
中の未固溶Niが粗大Ni粒子となって混在するのである。
この粗大Ni粒子は、成形性・焼結性を低下させ耐溶着性
劣化を招く原因となる。上記溶湯中でのAg中へのNiの固
溶限は約6wt％であるから、溶湯中のNi量が6wt％以下で
あれば粗大Ni粒子の混在は解消されるが、しかしなが
ら、この場合、Ag−Ni系接点材料として十分なNi量の確
保は難しい。It is also conceivable to spray a melt in which the total amounts of Ag and Ni to be mixed are dissolved together to obtain Ni-containing Ag particles and Ni particles at the same time, and to mold and sinter them. In this case, Ag
Although fine Ni particles exist in the particles, coarse Ni particles having a very large particle size are mixed in the obtained particles. The undissolved Ni in the Ag-Ni melt is mixed as coarse Ni particles.
The coarse Ni particles reduce the formability and sinterability, and cause deterioration of welding resistance. Since the solid solubility limit of Ni in Ag in the molten metal is about 6 wt%, if the amount of Ni in the molten metal is 6 wt% or less, the mixture of coarse Ni particles is eliminated, however, in this case, It is difficult to secure a sufficient amount of Ni as an Ag-Ni contact material.
この発明は、上記事情に鑑み、耐溶着性に富む優れた
Ag−Ni系接点材料を容易に製造する方法を提供すること
を課題とする。The present invention has been made in view of the above circumstances, and has an excellent welding resistance.
An object of the present invention is to provide a method for easily producing an Ag-Ni-based contact material.
上記課題を解決するため、請求項１〜５記載の接点材
料の製造方法では、回転可能なドラム内周面に臨む曲面
を有する固定部材を収容したドラム内にAg粒子とNi粒子
とを投入して、次いでドラムを回転させて、両粒子に対
し固定部材の曲面にて圧縮及び剪断を施すことでもって
複合化した複合粒子を焼結するようにしており、接合化
には、例えば、請求項２のように、Ni層がAg粒子の表面
を被覆している形態が挙げられる。In order to solve the above problems, in the method for manufacturing a contact material according to claims 1 to 5, Ag particles and Ni particles are charged into a drum containing a fixed member having a curved surface facing a rotatable drum inner peripheral surface. Then, the drum is rotated to compress and shear the two particles on the curved surface of the fixing member so as to sinter the composite particles that have been composited. As shown in FIG. 2, a form in which the Ni layer covers the surface of the Ag particles is exemplified.
Ag粒子としては、純Ag粒子に限らず、請求項３のよう
に、Ni微粒子が分散したAg粒子を用いるようにしてもよ
い。Ni微粒子の量は１乃至6wt％（同粒子全体を100wt％
とする）であり、かつNi微粒子の平均粒径は１μｍ未満
である。さらに、請求項４のように、Ag粒子は内部に結
晶粒界を有するものであって、複合粒子はNi粒子が結晶
粒界に存在しているものであってもよい。複合粒子は、
請求項５のように、総Ni量が、通常、６乃至20wt％であ
るものである。The Ag particles are not limited to pure Ag particles, but Ag particles in which Ni fine particles are dispersed may be used. The amount of Ni fine particles is 1 to 6 wt% (100 wt% of the whole particles)
And the average particle size of the Ni fine particles is less than 1 μm. Further, as in the fourth aspect, the Ag particles may have a crystal grain boundary inside, and the composite particles may have Ni particles existing at the crystal grain boundary. The composite particles are
As in claim 5, the total amount of Ni is usually 6 to 20 wt%.
以下、この発明を、製造の段階から順を追って具体的
に説明する。Hereinafter, the present invention will be specifically described step by step from the manufacturing stage.
この発明の接点材料の製造法では、まず、機械的複合
化処理によりAg粒子とNi粒子とを複合化したAg・Ni複合
粒子を用いて成形体を作る。In the method for manufacturing a contact material according to the present invention, first, a molded body is produced using Ag / Ni composite particles obtained by compounding Ag particles and Ni particles by a mechanical compounding treatment.
複合粒子作成用のAg粒子には、純Agの粒子、あるい
は、Ni微粒子がAg中に分散した粒子を使う。このAg粒子
の平均粒径は、通常、0.01〜500μｍ程度である。複合
粒子作製用のNi粒子の平均粒径は、通常、0.01〜10μｍ
程度であり、この範囲を外れると適切な複合化は難かし
くなる。普通、Ni粒子はAg粒子より小さいものを使う。
Ni粒子の粒径は、Ag粒子の粒径の1/2以下（より好まし
くは1/10以下）程度である。Pure Ag particles or particles in which Ni fine particles are dispersed in Ag are used as Ag particles for preparing composite particles. The average particle size of the Ag particles is usually about 0.01 to 500 μm. The average particle size of the Ni particles for preparing composite particles is usually 0.01 to 10 μm.
If it is out of this range, it is difficult to form an appropriate composite. Normally, Ni particles are smaller than Ag particles.
The particle size of the Ni particles is about 1/2 or less (more preferably 1/10 or less) of the particle size of the Ag particles.
Ni微粒子分散のAg粒子の場合、Ni微粒子の平均粒径が
１μｍ以上であったり、Ni含有量が1wt％未満である場
合、十分なAg素地面強化効果は期待し難く、Ni含有量が
6wt％を超えると粒子構造が困難になる。このNi微粒子
分散のAg粒子は、NiとAgの溶湯を超急冷することで得ら
れるが、6wt％以上のNiを固溶することは困難なのであ
る。In the case of Ag particles in which Ni particles are dispersed, if the average particle size of the Ni particles is 1 μm or more, or if the Ni content is less than 1 wt%, it is difficult to expect a sufficient Ag base strengthening effect.
If it exceeds 6 wt%, the particle structure becomes difficult. The Ag particles in which the Ni fine particles are dispersed can be obtained by ultra-quenching a molten metal of Ni and Ag, but it is difficult to form a solid solution of 6 wt% or more of Ni.
複合粒子におけるAg・Niの複合化の適切な形態は、以
下の二つである。Suitable forms of Ag / Ni composite in the composite particles are the following two.
第１の形態は、第１図（ａ）、（ｂ）にみるように、
複合化Ni3が、純Ag粒子１あるいはNi微粒子２分散のAg
粒子１′の表面を覆うNi層を形成するという形態であ
る。In the first embodiment, as shown in FIGS. 1 (a) and 1 (b),
Composite Ni3 is pure Ag particles 1 or Ni fine particles 2 dispersed Ag
In this embodiment, a Ni layer covering the surface of the particle 1 'is formed.
第２の形態は、第２図にみるように、Ni微粒子２分散
のAg粒子１′が結晶粒界を有しており、複合化Ni3′が
結晶粒界に存在するという形態である。結晶粒界を覆っ
てしまうほどにNiが存在することが望ましい。In the second embodiment, as shown in FIG. 2, Ag particles 1 'dispersed with Ni fine particles 2 have crystal grain boundaries, and composite Ni3' exists at the crystal grain boundaries. It is desirable that Ni be present enough to cover the crystal grain boundaries.
つぎに、Ag粒子とNi粒子の機械的複合化処理を行う処
理装置の説明を行う。処理装置として、第３図に示すよ
うな高速・高剪断型ミル（例えば、（株）ホウカワミク
ロン製のメカノフュージョンシステム用オングミル）が
用いられる。Next, a description will be given of a processing apparatus for performing mechanical compounding of Ag particles and Ni particles. As a processing apparatus, a high-speed and high-shear type mill as shown in FIG. 3 (for example, an ang mill for a mechanofusion system manufactured by Houkawa Micron Corporation) is used.
第３図の処理装置20は、モータ（図示省略）により高
速回転可能なドラム（円筒容器）21を備え、同ドラム21
内側に固定アーム22で支持されたれたセラミック（例え
ば、硬質アルミナ）製半円柱状固定部材23が設けられた
構成である。固定部材23は半円柱周曲面（曲面）23aを
ドラム内面21aに臨ませた状態で固定されており、ドラ
ム21の回転中、不動の半円柱周曲面23aの前をドラム21a
内面が移動してゆく。この半円柱周曲面23aの曲率半径
はドラム内面21の曲率半径よりも小さい。3 includes a drum (cylindrical container) 21 that can be rotated at a high speed by a motor (not shown).
A semi-cylindrical fixing member 23 made of ceramic (for example, hard alumina) supported by a fixing arm 22 is provided inside. The fixing member 23 is fixed with a semi-cylindrical peripheral curved surface (curved surface) 23a facing the drum inner surface 21a. During the rotation of the drum 21, the semi-cylindrical peripheral curved surface 23a is fixed in front of the semi-cylindrical peripheral curved surface 23a.
The inner surface moves. The radius of curvature of the semi-cylindrical peripheral curved surface 23a is smaller than the radius of curvature of the drum inner surface 21.
複合化処理を行う場合、ドラム21内にAg粒子およびNi
粒子を（必要に応じて加えられる媒体剤用ビーズと一緒
に）投入するとともにドラム21内を不活性ガス雰囲気と
しドラム21を高速回転させる。そうすると、第４図にみ
るように、Ag粒子およびNi粒子が遠心力でドラム内面21
aに押し付けられ、ドラム21と一緒に回転して、半円柱
周曲面23aの前側領域（Ａ−Ｂ間）でAg粒子およびNi粒
子が強い圧縮力、剪断力を受け発生する熱も伴って複合
化される。媒体用ビーズ（例えば、粒径1mm前後のジル
コニアビーズ）を併用する場合、Ni粒子はまずビーズに
付着してからAg粒子に付着することになる。このよう
に、市販の処理装置で容易に複合粒子を作ることができ
る。When performing the compounding process, Ag particles and Ni
The particles are charged (along with beads for medium agent added as needed), and the inside of the drum 21 is set to an inert gas atmosphere, and the drum 21 is rotated at a high speed. Then, as shown in FIG. 4, the Ag particles and the Ni particles are separated by the centrifugal force into the drum inner surface 21.
a and Ag particles in the front region (between A and B) of the semi-cylindrical circumferential curved surface 23a, and the Ag particles and the Ni particles are combined with the heat generated by the strong compressive and shearing forces. Be transformed into When medium beads (for example, zirconia beads having a particle diameter of about 1 mm) are used in combination, the Ni particles first adhere to the beads and then adhere to the Ag particles. Thus, composite particles can be easily produced with a commercially available processing apparatus.
ドラムの回転速度は500〜2000回／分程度である。半
円柱周曲面23aとドラム内面21aの間隔ｄは、通常、１〜
5mm程度である。The rotation speed of the drum is about 500 to 2000 times / minute. The interval d between the semi-cylindrical peripheral curved surface 23a and the drum inner surface 21a is usually 1 to
It is about 5mm.
処理開始当初、第５図（ａ）にみるように、弱い凝集
状態にあったNi粒子30は、ドラム21回転に伴い１次粒子
化され、その後、第５図（ｂ）にみるように、Ag粒子１
（１′）表面にNi粒子が付着し、処理が進むと、第５図
（ｃ）にみるように、Ni粒子30が規則正しく配列したオ
ーダードミクスチャー状態となる。さらに、処理が進む
と、強い圧縮力と剪断力および発生する熱の作用で、第
５図（ｄ）にみるように、複合化Ni3がAg粒子１
（１′）表面を覆うNi層を形成する。Ni層が形成される
までの処理時間は、通常、15〜70分程度である。At the beginning of the treatment, as shown in FIG. 5 (a), the Ni particles 30 in the weakly agglomerated state are converted into primary particles with the rotation of the drum 21, and thereafter, as shown in FIG. 5 (b), Ag particles 1
(1 ') When the Ni particles adhere to the surface and the processing proceeds, the Ni particles 30 are in an ordered mixed state in which the Ni particles 30 are regularly arranged as shown in FIG. 5 (c). Further, as the treatment proceeds, the composite Ni3 is converted into the Ag particles 1 by the action of strong compressive and shearing forces and the generated heat, as shown in FIG.
(1 ') Form a Ni layer covering the surface. The processing time until the Ni layer is formed is usually about 15 to 70 minutes.
そして、発明者らは、Ag粒子１′（Ni微粒子分散のAg
粒子）の場合、適当な結晶粒界を有しておれば、処理を
さらに続けると複合化Niが結晶粒界に入ってゆくことを
見出している。すなわち、第６図（ａ）にみるように、
Ag粒子１′の表面を覆った複合化Ni3は、結晶粒界のす
べり・回転に伴い、第６図（ｂ）にみるように、結晶粒
界に侵入し、処理が進行するにつれて、第６図（ｃ）に
みるように、粒界に沿って均一に分散し結晶粒界に複合
化Ni3′が存在した状態になる。この状態となるまでの
処理時間は、通常、60〜120分程度である。なお、Ag粒
子１′表面に複合化Niが一部まだ残留しており、複合化
NiがAg粒子１′表面および結晶粒界の両方に存在した状
態で処理を終えてもよい。Ag粒子の結晶粒の適当な平均
粒径は、２〜50μｍ程度である。前述のNiを１〜6wt％
の量含むAg溶湯を超急冷（例えば、水によるアトマイ
ズ）して得たAg粒子１′だと平均粒径５〜30μｍの結晶
粒が出来ている。Then, the inventors have proposed that the Ag particles 1 '(Ag
In the case of (grain), it has been found that if the treatment has continued, the compounded Ni will enter the crystal grain boundary if the crystal grain boundary has an appropriate crystal grain boundary. That is, as shown in FIG.
As shown in FIG. 6 (b), the composite Ni3 covering the surface of the Ag particles 1 'penetrates into the crystal grain boundaries as shown in FIG. As shown in FIG. 3 (c), a state in which the composite Ni3 'is uniformly dispersed along the grain boundaries and present at the crystal grain boundaries is obtained. The processing time required to reach this state is usually about 60 to 120 minutes. Note that a portion of the composite Ni still remains on the surface of the Ag particles 1 ',
The treatment may be terminated in a state where Ni is present on both the surface of the Ag particles 1 'and the crystal grain boundaries. A suitable average particle size of the crystal grains of the Ag particles is about 2 to 50 μm. 1 to 6 wt% of Ni described above
Ag particles 1 'obtained by ultra-quenching (for example, atomizing with water) an Ag molten metal containing the above amount have crystal grains having an average particle diameter of 5 to 30 μm.
一方、純Ag粒子１の場合、第７図（ａ）〜（ｄ）にみ
るように、純Ag粒子１の表面にNi粒子30が付着し、その
後、さらに機械的複合化処理が進むと、第７図（ｅ）に
みるように、複数の純Ag粒子１同士がくっつき、さら
に、第７図（ｆ）にみるように、Ni粒子30を内に取り込
んだ融合体10になり、最終的に十分な量の微細なNi粒子
30が分散した複合粒子１″が造粒される。この複合粒子
１″の場合、普通、平均粒径0.01〜５μｍ以下のNi粒子
30を使うようにする。On the other hand, in the case of the pure Ag particles 1, as shown in FIGS. 7 (a) to 7 (d), when the Ni particles 30 adhere to the surface of the pure Ag particles 1 and thereafter the mechanical complexing process further proceeds, As shown in FIG. 7 (e), a plurality of pure Ag particles 1 are stuck together, and further, as shown in FIG. 7 (f), a fused body 10 incorporating Ni particles 30 is obtained. Enough fine Ni particles
The composite particles 1 "in which 30 are dispersed are granulated. In the case of the composite particles 1", usually, Ni particles having an average particle size of 0.01 to 5 μm or less are used.
Use 30.
従来、成形前にAg粒子およびNi粒子はＶ状ミルで混合
するが、粒子は撹拌混合されるだけで複合化されるわけ
ではなく、混合状態を微細にみるとAg粒子とNi粒子は個
々に分離した状態である。Conventionally, Ag particles and Ni particles are mixed in a V-shaped mill before molding.However, the particles are not simply composited by stirring and mixing. It is in a separated state.
上記のようにして得た複合粒子を加圧成形して成形体
を得る。The composite particles obtained as described above are molded under pressure to obtain a molded article.
つぎに、成形体の焼結工程に入る。この焼結工程で
は、通常、成形体に対し〔焼成→熱間圧縮〕を施す処理
を２〜３回繰り返すことにより焼結体化する。Next, a sintering step of the compact starts. In this sintering step, the molded body is usually formed into a sintered body by repeating a process of performing [firing → hot compression] two to three times.
焼結した後、引き伸ばし工程に入る。この引き伸ばし
工程では、焼結体を熱間押し出しした後さらに伸線す
る。After sintering, a stretching process is started. In this stretching step, the sintered body is further extruded after hot extrusion.
引き伸ばし工程を経た接点材料は、第１図（ａ）の複
合粒子を用いた場合だと、第８図にみるように、Ag素地
40中のNi41は伸線方向に細長く引き伸ばされた状態で存
在する。第１図（ｂ）の複合粒子を用いた場合も、第11
図にみるように、Ag素地40中にNi41が伸線方向に細長く
引き伸ばされた状態で存在し、その間にNi微粒子42が分
散することになる。In the case of using the composite particles shown in FIG. 1 (a), the contact material having undergone the stretching step is, as shown in FIG.
Ni41 in 40 exists in an elongated state in the drawing direction. When the composite particles shown in FIG.
As shown in the figure, Ni 41 exists in the Ag base material 40 in a state of being elongated in the wire drawing direction, and during this time, the Ni fine particles 42 are dispersed.
引き伸ばしは、普通、〔引き伸ばし前の断面積〕／
〔引き伸ばし後の断面積〕が150以上となるように行
う。Stretching is usually [cross-sectional area before stretching] /
[Section area after stretching] is 150 or more.
伸線した後、伸線方向と直角の方向に寸断し、その切
断面を接点面にする。普通、切断してから、第９図また
は第12図にみるように、リベット加工を施し電気接点5
0、50′にする。After wire drawing, the wire is cut in a direction perpendicular to the wire drawing direction, and the cut surface is used as a contact surface. Normally, after cutting, the electrical contacts 5 are riveted as shown in FIG. 9 or FIG.
0, 50 '.
第８図の接点材料の場合、Ag素地40中にNiが繊維状な
いし帯状で接点面（切断面）に対し交差する方向に配向
分散しており、接点面では、第10図にみるように、繊維
状のNiはドット状Ni41′として露出しており、帯状のNi
は線状Ni41″として露出している。In the case of the contact material shown in FIG. 8, Ni is fibrous or strip-shaped in the Ag substrate 40 and is oriented and dispersed in a direction intersecting the contact surface (cut surface). As shown in FIG. , Fibrous Ni is exposed as dot-like Ni 41 ′
Are exposed as linear Ni 41 ″.
第11図の接点材料の場合、Ag素地40中にNiが繊維状な
いし帯状で接点面（切断面）に対し交差する方向に配向
分散するとともにその間にNi微粒子が分散しており、接
点面では、第13図にみるように、繊維状Niはドット状Ni
41′として露出しており、帯状のNiは線状Ni41″として
露出するとともにその間にNi微粒子42が顔を出してい
る。ドット状Ni41′および線状Ni41″は元々Ag粒子表面
のNi層を形成しており、そのためにミクロには分断され
たりしているが、マクロには環状に繋がっていて、第1
0、13図にみるように、接点面に網目様のNi部分を現出
させている。このように接点面に網目様にNi部分が現出
している場合は、耐溶着性・耐消耗性等の面で有利であ
ると考えられる。これは、Ag素地の損傷を各環状Ni内側
で留められ接点面の劣化進行が抑えられると推察される
からである。In the case of the contact material shown in FIG. 11, Ni is fibrous or strip-shaped in the Ag base material 40 and is oriented and dispersed in a direction intersecting the contact surface (cut surface), and Ni fine particles are dispersed therebetween. As shown in FIG. 13, the fibrous Ni
The strip Ni is exposed as a linear Ni 41 ″, and the Ni fine particles 42 are exposed between them. The dot Ni 41 ′ and the linear Ni 41 ″ originally remove the Ni layer on the Ag particle surface. Although it is formed, it is divided into micros for that purpose, but it is connected in a ring to the macro, the first
As shown in FIGS. 0 and 13, a mesh-like Ni portion appears on the contact surface. When the Ni portion appears like a mesh on the contact surface in this way, it is considered to be advantageous in terms of welding resistance, wear resistance and the like. This is because it is presumed that the damage to the Ag base is stopped inside each annular Ni and the deterioration of the contact surface is prevented from progressing.
Ag粒子表面を覆っていたNi層の細く裂けた部分は、引
き延ばされて繊維状となり、裂けなかった部分は引き延
ばされて帯状となるのである。繊維状ないし帯状のNiの
径・幅はNi層の厚み・引き伸ばしの程度で決まるが、１
μｍ未満の平均径あるいは１μｍ未満の平均幅であるこ
とが好ましい。また、Ni微粒子42は平均粒径0.5μｍ以
下であることが好ましい。このNi微粒子42は、Ag粒子
１′内に平均粒径１μｍ未満のNi微粒子として予め分散
しているものである。繊維状、帯状の両方が存在してい
る必要はなく、いずれか一方だけがある状態でもよい。The thinly torn portion of the Ni layer covering the surface of the Ag particles is stretched into a fibrous shape, and the portion that is not torn is stretched to a strip shape. The diameter and width of the fibrous or belt-like Ni are determined by the thickness and the degree of stretching of the Ni layer.
Preferably, the average diameter is less than μm or the average width is less than 1 μm. Further, the Ni fine particles 42 preferably have an average particle diameter of 0.5 μm or less. The Ni fine particles 42 are dispersed in advance as Ag fine particles having an average particle diameter of less than 1 μm in the Ag particles 1 ′. It is not necessary that both the fibrous form and the band form exist, and only one of them may be present.
この発明の製造方法で得られる接点材料は、第10図、
第13図に示す構成に限らないことは言うまでもない。例
えば、複合粒子１″を使う場合はNiは殆ど繊維状で分散
することになる。The contact material obtained by the manufacturing method of the present invention is shown in FIG.
Needless to say, the configuration is not limited to the configuration shown in FIG. For example, when the composite particles 1 "are used, Ni is almost fibrous and dispersed.
請求項１記載の接点材料の製造方法によれば、固定部
材がドラム内で固定されているので、固定部材の曲面は
ドラム内周面に対して一定の間隔を保つようになってい
る。ドラム内周面を回転させると、ドラム内のAg粒子と
Ni粒子は、遠心力でドラム内周面に押し付けられて一緒
に回転し、固定部材の曲面上を通過する。この通過時
に、両粒子は、固定部材の曲面とドラム内周面とで挟ま
れる。このとき、固定部材の曲面とドラム内周面との間
隔は自由に広がらず、両粒子に強い圧縮力と剪断とが作
用する。このため、複合化を短時間に行うことができ
る。こうして得られた複合粒子では、十分な量のNiが個
々のAg粒子に予め分かち与えられている。この複合粒子
を焼結させて得られる接点材料では、十分な量のNiが局
在せずに微細な状態で満遍なく存在し、内部に空隙がほ
とんどあるいは全く存在しないため、耐溶着性が向上す
る。According to the method for manufacturing a contact material according to the first aspect, since the fixing member is fixed in the drum, the curved surface of the fixing member keeps a constant interval with respect to the inner peripheral surface of the drum. By rotating the inner peripheral surface of the drum, the Ag particles in the drum
The Ni particles are pressed against the drum inner peripheral surface by centrifugal force, rotate together, and pass on the curved surface of the fixing member. During this passage, both particles are sandwiched between the curved surface of the fixing member and the inner peripheral surface of the drum. At this time, the interval between the curved surface of the fixing member and the inner peripheral surface of the drum does not freely expand, and a strong compressive force and shear act on both particles. For this reason, compounding can be performed in a short time. In the composite particles thus obtained, a sufficient amount of Ni has been previously provided to the individual Ag particles. In the contact material obtained by sintering the composite particles, a sufficient amount of Ni is not localized and is present in a fine state evenly, and there are few or no voids inside, so that the welding resistance is improved. .
請求項２の場合、個々のAg粒子表面のNi層が十分な量
と偏りのないNi分散状態を作り出す。In the case of the second aspect, the Ni layer on the surface of each Ag particle creates a sufficient amount and an unbiased Ni dispersion state.
請求項３の場合、Ag粒子に予め分散しているNi微粒子
がAg素地をさらに強化する。特に、Ni微粒子の量が１〜
6wt％であって、同Ni微粒子の平均粒径が１μｍ未満で
ある場合、Ni微粒子による強化効果が顕著である。In the case of the third aspect, the Ni fine particles preliminarily dispersed in the Ag particles further strengthen the Ag base. In particular, when the amount of Ni fine particles is 1 to
When the content is 6 wt% and the average particle size of the Ni fine particles is less than 1 μm, the strengthening effect by the Ni fine particles is remarkable.
請求項４の場合、Ag粒子が内部に結晶粒界を有してお
り、複合粒子はNi粒子が結晶粒界に存在しているため、
よりNiが満遍なく分散するようになり、耐溶着性が一層
向上することが期待できる。In the case of claim 4, the Ag particles have crystal grain boundaries inside, and the composite particles have Ni particles at the crystal grain boundaries,
It can be expected that Ni will be more evenly dispersed and the welding resistance will be further improved.
請求項５のように、複合粒子の総Ni量が６〜20wt％で
ある場合、Ni量が適切であり、顕著なNi添加効果が確実
にあらわれる。When the total amount of Ni in the composite particles is 6 to 20% by weight as in claim 5, the amount of Ni is appropriate, and a remarkable effect of adding Ni is surely exhibited.
以下、この発明の実施例を説明する。この発明は下記
の実施例に限らない。Hereinafter, embodiments of the present invention will be described. The present invention is not limited to the following embodiments.
−実施例１− まず、Ni微粒子分散のAg粒子を、以下のようにして得
た。AgおよびNiを高周波炉で一緒に溶解し1650℃の溶湯
を吊り、これをノズルより噴出させ高圧水により水アト
マイズした。得られたAg粒子は、平均粒径が40μｍ、Ni
含有量が5.2wt％である。-Example 1-First, Ag particles in which Ni fine particles were dispersed were obtained as follows. Ag and Ni were melted together in a high-frequency furnace, and a molten metal at 1650 ° C was suspended. The molten metal was ejected from a nozzle and water-atomized with high-pressure water. The obtained Ag particles have an average particle size of 40 μm, Ni
The content is 5.2% by weight.
このAg粒子と平均粒径１μｍのNi粒子をNi総含有量が
10wt％となるように秤量し、前述の高速・高剪断ミルを
用い、ドラム内をArガス雰囲気とし媒体剤として平均粒
径約1mmのジルコニアビーズを使い、3000秒処理し、複
合粒子を得た。The Ag particles and the Ni particles having an average particle diameter of 1 μm have a total Ni content of
It was weighed so as to be 10 wt%, and was treated for 3000 seconds using a zirconia bead having an average particle diameter of about 1 mm as a medium using a high-speed, high-shear mill as described above, using an Ar gas atmosphere in the drum, and obtaining composite particles. .
複合粒子の外観（粒子構造）を第14図に、粒子断面
（金属組織）を第15、16図に示す。第14〜16図は、走査
型電子顕微鏡による写真であって、第14、15図は２次電
子線（SEM像）写真、第16図は特性Ｘ線（NiKα像）写真
である。特に、第16図をみると、Ag粒子は、内部に平均
粒径１μｍ未満のNi微粒子が分散しており、表面に複合
化NiによるNi層が出来ていることがよく分かる。The appearance (particle structure) of the composite particles is shown in FIG. 14, and the cross section of the particles (metal structure) is shown in FIGS. FIGS. 14 to 16 are photographs taken by a scanning electron microscope, FIGS. 14 and 15 are secondary electron beam (SEM image) photographs, and FIG. 16 is a characteristic X-ray (NiKα image) photograph. In particular, FIG. 16 clearly shows that the Ag particles have Ni particles having an average particle size of less than 1 μm dispersed therein, and that a Ni layer of composite Ni is formed on the surface.
つぎに、複合粒子を加圧成形（30kgf/mm）し成形体を
得た。Next, the composite particles were subjected to pressure molding (30 kgf / mm) to obtain a molded body.
ついで、850℃・２時間の焼成→420℃・90kgf/mmの熱
間圧縮を３回繰り返し焼結体を得た。なお、１回目の焼
成は真空雰囲気、２・３回目の焼成は窒素雰囲気で行っ
た。Then, firing at 850 ° C. for 2 hours → hot pressing at 420 ° C. at 90 kgf / mm was repeated three times to obtain a sintered body. The first firing was performed in a vacuum atmosphere, and the second and third firings were performed in a nitrogen atmosphere.
続いて、焼結体予熱温度800℃、金型温度420℃で熱間
押し出しして直径8mmまで延ばした後、さらに伸線し直
径2mmにした。伸線した接点材料の長手方向に沿った断
面状態を、第17、18図に示す。第17、18図は、走査型電
子顕微鏡による写真であって、第17図は２次電子線（SE
M像）写真、第18図は特性Ｘ線（NiKα像）写真である。
第17、18図より、Ag粒子表面のNi層部分が伸線方向に細
長く引き延ばされて薄くなっており、その間に多数のNi
微粒子が分散していることがよく分かる。伸線の後、伸
線方向と直角の方向に寸断してからリベット加工を施
し、接点性能評価用のリベット接点を得た。Subsequently, the sintered body was hot-extruded at a preheating temperature of 800 ° C. and a mold temperature of 420 ° C. to extend to a diameter of 8 mm, and then further drawn to a diameter of 2 mm. FIGS. 17 and 18 show cross-sectional states of the drawn contact material along the longitudinal direction. FIGS. 17 and 18 are photographs taken by a scanning electron microscope. FIG. 17 shows a secondary electron beam (SE
FIG. 18 is a characteristic X-ray (NiKα image) photograph.
From FIGS. 17 and 18, the Ni layer portion on the surface of the Ag particles is elongated in the drawing direction and thinned, and a large number of Ni
It can be clearly seen that the fine particles are dispersed. After wire drawing, the wire was cut in a direction perpendicular to the wire drawing direction and then riveted to obtain a rivet contact for evaluating contact performance.
−実施例２− Ag粒子の平均粒径が380μｍであり、Ni粒子の平均粒
径が0.02μｍである他は、実施例１と同様にして接点材
料を得た。Example 2 A contact material was obtained in the same manner as in Example 1, except that the average particle size of the Ag particles was 380 μm and the average particle size of the Ni particles was 0.02 μm.
なお、複合粒子の外観（粒子構造）を第19図に、断面
（金属組織）を第20、21図に示す。第19〜21図は、走査
型電子顕微鏡による写真であって、第19、20図は２次電
子線（SEM像）写真、第21図は特性Ｘ線（NiKα像）写真
である。特に、第21図をみると、Ag粒子は、内部にNi微
粒子が分散しており、表面に複合化NiによるNi層が形成
されていることがよく分かる。The appearance (particle structure) of the composite particles is shown in FIG. 19, and the cross section (metal structure) is shown in FIGS. 19 to 21 are photographs taken by a scanning electron microscope, FIGS. 19 and 20 are secondary electron beam (SEM image) photographs, and FIG. 21 is a characteristic X-ray (NiKα image) photograph. In particular, it can be seen from FIG. 21 that the Ag particles have Ni fine particles dispersed therein, and a Ni layer is formed on the surface by composite Ni.
−実施例３− Ag粒子の平均粒径が10μｍ、Ni含有量が3.1wt％であ
り、Ni粒子の平均粒径が0.02μｍであり、Ni総含有量が
20wt％となるようにした他は、実施例１と同様にして接
点材料を得た。-Example 3-Average particle size of Ag particles is 10 µm, Ni content is 3.1 wt%, average particle size of Ni particles is 0.02 µm, and total Ni content is
A contact material was obtained in the same manner as in Example 1 except that the amount was 20 wt%.
−実施例４− Ag粒子の平均粒径が200μｍ、結晶粒平均粒径が10μ
ｍ、Ni含有量が3.1wt％であって、Ni粒子に平均粒径0.2
μｍのものを使い、Ni総含有量が15wt％となるようにす
るとともに、複合化処理時間を6200秒とし結晶粒界を複
合化Niで覆うようにした他は、実施例１と同様にして接
点材料を得た。-Example 4-Average particle size of Ag particles is 200 µm, average crystal particle size is 10 µm
m, Ni content is 3.1 wt% and Ni particles have an average particle size of 0.2
μm, the total Ni content was 15 wt%, the complexing time was 6200 seconds, and the crystal grain boundaries were covered with complexed Ni. Contact material was obtained.
−実施例５− Ag粒子にNi微粒子を含まない平均粒径１μｍの純Ag粒
子を使い、Ni粒子に平均粒径0.02μｍのものを使って、
Ni総含有量が6wt％となるようにした他は、実施例１と
同様にして接点材料を得た。-Example 5-Using pure Ag particles having an average particle size of 1 µm that does not contain Ni fine particles as Ag particles, and using Ni particles having an average particle size of 0.02 µm,
A contact material was obtained in the same manner as in Example 1, except that the total Ni content was 6 wt%.
−比較例１− 実施例１のAg粒子をNiを複合化させずそのまま使って
成形体を作った後は、実施例１と同様にして接点材料を
得た。Comparative Example 1 A contact material was obtained in the same manner as in Example 1 after using the Ag particles of Example 1 as they were without using Ni as a composite to form a molded body.
−比較例２− 平均粒径45μｍの電解Ag粒子と平均粒径５μｍのカル
ボニールNi粒子（粉）とを混合し成形体を得た後は、実
施例１と同様にして接点材料を得た。なお、Ni含有量は
10wt％である。Comparative Example 2 Electrolytic Ag particles having an average particle size of 45 μm and carbonyl Ni particles (powder) having an average particle size of 5 μm were mixed to obtain a molded body, and a contact material was obtained in the same manner as in Example 1. The Ni content is
10 wt%.
実施例１〜５および比較例１、２のリベット接点につ
いて、ASTM試験により耐溶着特性、消耗特性を調べた
（サンプル数Ｎ＝３）。試験条件は下記の通りである。
試験結果を、第１表に示す。For the rivet contacts of Examples 1 to 5 and Comparative Examples 1 and 2, welding resistance and wear characteristics were examined by an ASTM test (sample number N = 3). The test conditions are as follows.
The test results are shown in Table 1.
負荷： 抵抗負荷 電圧： 100V 電流： 40A 開閉回数： ５万回 実施例１、比較例１の接点材料について、高温硬度の
測定を行った。測定結果を、第22図に示す。また、実施
例１〜５および比較例２の接点材料の接点面における繊
維状ないし帯状のNiの平均粒径ないし平均幅を調べ、実
施例１、３、４については、Ni微粒子の平均粒径も調べ
た。Load: Resistance load Voltage: 100 V Current: 40 A Switching frequency: 50,000 times The contact materials of Example 1 and Comparative Example 1 were measured for high-temperature hardness. The measurement results are shown in FIG. Further, the average particle size or average width of fibrous or band-like Ni on the contact surfaces of the contact materials of Examples 1 to 5 and Comparative Example 2 was examined. I also checked.
第１表にみるように、実施例の接点材料は、良好な耐
消耗性を持ちながら比較例のものよりも耐溶着性に優れ
るものになっている。 As shown in Table 1, the contact materials of the examples have good wear resistance and are more excellent in welding resistance than those of the comparative example.
第22図にみるように、実施例１の接点材料は比較例１
のものに比べ高温硬度が高くなっており、耐溶着性の向
上を裏付ける測定結果である。As shown in FIG. 22, the contact material of Example 1 was Comparative Example 1
The hardness at high temperature is higher than that of the sample, and this is a measurement result supporting the improvement of the welding resistance.
接点面での繊維状ないし帯状のNiの平均粒径あるいは
平均幅は、実施例１、３、４、５の接点材料では１μｍ
未満、実施例２の接点材料では３μｍであった。一方、
比較例２の接点材料では５μｍであった。実施例の接点
材料の方がNiが微細な状態で分散しており、耐溶着性の
向上を裏付ける測定結果である。なお、実施例１、３、
４の接点材料のNi微粒子の平均粒径は0.5μｍ以下であ
った。The average particle size or average width of the fibrous or band-like Ni at the contact surface is 1 μm for the contact materials of Examples 1, 3, 4, and 5.
Less than 3 μm for the contact material of Example 2. on the other hand,
The thickness of the contact material of Comparative Example 2 was 5 μm. In the contact material of the example, Ni is dispersed in a finer state, and this is a measurement result supporting the improvement of welding resistance. Examples 1, 3,
The average particle size of the Ni fine particles of the contact material No. 4 was 0.5 μm or less.
請求項１から５までに記載の接点材料の製造方法によ
れば、複合化により個々のAg粒子に十分な量のNiが予め
分かち与えられている複合粒子が得られ、この複合粒子
を焼結してなる接点材料では、十分な量のNiが微細に満
遍なくAg素地中に分散することとなる。このため、この
方法によれば、耐溶着性に富む優れたAg−Ni接点材料を
容易に得ることができる。According to the method for manufacturing a contact material according to claims 1 to 5, a composite particle in which a sufficient amount of Ni is previously given to individual Ag particles by composite is obtained, and the composite particle is sintered. In such a contact material, a sufficient amount of Ni is finely and evenly dispersed in the Ag base material. For this reason, according to this method, it is possible to easily obtain an excellent Ag-Ni contact material having excellent welding resistance.
請求項２記載の方法の場合は、複合化NiがAg粒子表面
のNi層として分かち与えられ、これにより、十分な量の
Niが微細に満遍なくAg素地中に確実に分散してくれる。In the case of the method according to claim 2, the composite Ni is provided as a Ni layer on the surface of the Ag particles, whereby a sufficient amount of Ni is provided.
Ni is finely and evenly dispersed throughout the Ag substrate.
請求項３記載の方法の場合は、Ag粒子の内部に予め分
散しているNi微粒子がAg素地を余すところなく強化する
ため、より耐溶着性が向上するようになる。しかも、Ni
微粒子の粒径および含有量が適切であるため、同Ni微粒
子による強化作用が顕著で確実である。In the case of the method according to the third aspect, the Ni fine particles preliminarily dispersed inside the Ag particles strengthen the Ag base thoroughly, so that the welding resistance is further improved. Moreover, Ni
Since the particle size and content of the fine particles are appropriate, the strengthening action by the Ni fine particles is remarkable and certain.
請求項４記載の方法の場合は、複合化NiがAg粒子の結
晶粒界に存在しているため、よりNiが満遍なく分散し、
耐溶着性の一層の向上が期待できる。In the case of the method according to claim 4, since the composite Ni is present at the crystal grain boundary of the Ag particles, Ni is more evenly dispersed,
Further improvement in welding resistance can be expected.
請求項５記載の方法の場合は、総Ni量が適切であるた
め、Ni添加効果が顕著である。In the case of the method according to claim 5, since the total amount of Ni is appropriate, the effect of adding Ni is remarkable.
第１図は、この発明の方法で使う複合粒子の一例をあら
わす概略断面図、第２図は、この発明の方法で使う複合
粒子の一例の内部状態をあらわす説明図、第３図は、こ
の発明の方法で使う複合粒子を作る装置の要部構成をあ
らわす概略断面図、第４図は、同装置の機械的複合化処
理中の状態をあらわす説明図、第５〜７図は、複合化処
理の進行に伴う粒子変化を進行順にあらわす説明図、第
８図および第11図は、この発明の接点材料の伸線方向に
沿う断面でのNiの分散状態をあらわす説明図、第９図お
よび第12図は、この発明の接点材料を用いたリベット接
点をあらわす平面図、第10図および第13図は、上記リベ
ット接点の接点面におけるNiの露出状態をあらわす説明
図、第14図は、実施例１の複合粒子の粒子構造をあらわ
す電子顕微鏡写真、第15図および第16図は、同複合粒子
断面の金属組織をあらわす電子顕微鏡写真、第17図およ
び第18図は、実施例１の接点材料の断面の金属組織をあ
らわす電子顕微鏡写真、第19図は、実施例２の複合粒子
の粒子構造をあらわす電子顕微鏡写真、第20図および第
21図は、同複合粒子断面の金属組織をあらわす電子顕微
鏡写真、第22図は、実施例１および比較例１の接点材料
の高温硬度特性をあらわすグラフである。 １、１′……Ag粒子、１″……複合粒子、20……Ni微粒
子、３……Ni層（複合化Ni）、20……機械的複合化処理
装置、21……ドラム、21a……ドラム内面、23……固定
部材、23a……半円柱周曲面（曲面）、30……Ni粒子、4
0……Ag素地、41……（分散）Ni、42……Ni微粒子FIG. 1 is a schematic sectional view showing an example of a composite particle used in the method of the present invention, FIG. 2 is an explanatory diagram showing an internal state of an example of the composite particle used in the method of the present invention, and FIG. FIG. 4 is a schematic cross-sectional view showing a main part of an apparatus for producing composite particles used in the method of the present invention, FIG. 4 is an explanatory view showing a state of the apparatus during mechanical compounding processing, and FIGS. FIG. 8 and FIG. 11 are views showing the change of particles with the progress of the processing in the order of progress, and FIG. 9 is a view showing the state of dispersion of Ni in a cross section along the drawing direction of the contact material of the present invention, FIG. FIG. 12 is a plan view showing a rivet contact using the contact material of the present invention, FIGS. 10 and 13 are explanatory views showing an exposed state of Ni on the contact surface of the rivet contact, FIG. Electron micrograph showing the particle structure of the composite particles of Example 1, FIG. FIGS. 16 and 17 are electron micrographs showing the metal structure of the cross section of the composite particle, FIGS. 17 and 18 are electron micrographs showing the metal structure of the cross section of the contact material of Example 1, and FIG. , Electron micrograph showing the particle structure of the composite particles of Example 2, FIG. 20 and FIG.
FIG. 21 is an electron micrograph showing the metal structure of the cross section of the composite particle, and FIG. 22 is a graph showing the high-temperature hardness characteristics of the contact materials of Example 1 and Comparative Example 1. 1, 1 ': Ag particles, 1 ": Composite particles, 20: Ni fine particles, 3: Ni layer (composite Ni), 20: Mechanical composite treatment apparatus, 21: Drum, 21a ... … Drum inner surface, 23 …… Fixing member, 23a …… Semicircular cylindrical curved surface (curved surface), 30… Ni particles, 4
0: Ag base, 41: (dispersed) Ni, 42: Ni fine particles
───────────────────────────────────────────────────── フロントページの続き (72)発明者 宮南 啓 大阪府堺市百舌鳥西之町１―98―２ (72)発明者 谷村 眞治 大阪府河内長野市南青葉台27―10 (56)参考文献 特開 昭63−238230（ＪＰ，Ａ) 特開 昭61−279644（ＪＰ，Ａ) 特開 昭60−251236（ＪＰ，Ａ) 特開 平１−180901（ＪＰ，Ａ) 特開 平３−277763（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kei Miyanan 1-98-2 Mozuto Nishinocho, Sakai City, Osaka (72) Inventor Shinji Tanimura 27-10 Minami-Aobadai, Kawachinagano City, Osaka (56) References JP-A-63-238230 (JP, A) JP-A-61-279644 (JP, A) JP-A-60-251236 (JP, A) JP-A-1-180901 (JP, A) JP-A-3-277763 (JP JP, A)
Claims (5)
る固定部材を収容したドラム内にAg粒子とNi粒子とを投
入して、次いでドラムを回転させて、両粒子に対し固定
部材の曲面にて圧縮及び剪断を施すことでもって複合化
した複合粒子を焼結する、接点材料の製造方法。An Ag particle and a Ni particle are charged into a drum accommodating a fixing member having a curved surface facing the inner peripheral surface of a rotatable drum, and then the drum is rotated to fix the fixing member to both particles. A method for producing a contact material, comprising sintering composite particles that have been composited by applying compression and shearing on a curved surface.
を被覆しているものである、請求項１記載の接点材料の
製造方法。2. The method for producing a contact material according to claim 1, wherein the composite particles have a Ni layer covering the surface of the Ag particles.
って、Ni微粒子の量が１乃至6wt％であってかつNi微粒
子の平均粒径が１μｍ未満である、請求項１または２記
載の接点材料の製造方法。3. The Ag particles in which Ni fine particles are dispersed, wherein the amount of the Ni fine particles is 1 to 6% by weight and the average particle size of the Ni fine particles is less than 1 μm. Manufacturing method of contact material.
であって、前記複合粒子は前記Ni粒子が結晶粒界に存在
しているものである、請求項１から３までのいずれかに
記載の接点材料の製造方法。4. The method according to claim 1, wherein the Ag particles have a crystal grain boundary therein, and the composite particles have the Ni particles present at the crystal grain boundary. 3. The method for producing a contact material according to claim 1.
あるものである、請求項１から４までのいずれかに記載
の接点材料の製造方法。5. The method according to claim 1, wherein the composite particles have a total Ni content of 6 to 20 wt%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2270788A JP2613966B2 (en) | 1990-10-09 | 1990-10-09 | Manufacturing method of contact material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2270788A JP2613966B2 (en) | 1990-10-09 | 1990-10-09 | Manufacturing method of contact material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04147933A JPH04147933A (en) | 1992-05-21 |
| JP2613966B2 true JP2613966B2 (en) | 1997-05-28 |
Family
ID=17491011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2270788A Expired - Lifetime JP2613966B2 (en) | 1990-10-09 | 1990-10-09 | Manufacturing method of contact material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2613966B2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5763648A (en) * | 1980-10-02 | 1982-04-17 | Tanaka Kikinzoku Kogyo Kk | Manufacture of ag-ni composite electrical contact material |
| JPS60251236A (en) * | 1984-05-25 | 1985-12-11 | Matsushita Electric Works Ltd | Manufacture of electric contact point material |
| JPS61279644A (en) * | 1985-06-03 | 1986-12-10 | Sumitomo Electric Ind Ltd | Manufacture of ag-oxide-type electric contact point material |
| JPS63238230A (en) * | 1987-03-25 | 1988-10-04 | Matsushita Electric Works Ltd | Conducting composite material and its production |
-
1990
- 1990-10-09 JP JP2270788A patent/JP2613966B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04147933A (en) | 1992-05-21 |
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