JPH05122566A - Fitting device for solid-state image pickup device - Google Patents
Fitting device for solid-state image pickup deviceInfo
- Publication number
- JPH05122566A JPH05122566A JP3283431A JP28343191A JPH05122566A JP H05122566 A JPH05122566 A JP H05122566A JP 3283431 A JP3283431 A JP 3283431A JP 28343191 A JP28343191 A JP 28343191A JP H05122566 A JPH05122566 A JP H05122566A
- Authority
- JP
- Japan
- Prior art keywords
- mounting member
- package
- ccd
- image pickup
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、ＣＣＤ等の固体撮像
素子を用いるビデオカメラ等において、上記固体撮像素
子をプリズムに取り付ける取付装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device for mounting a solid-state image pickup device such as a CCD on a prism in a video camera or the like.
【０００２】[0002]
【従来の技術】固体撮像素子としてＣＣＤ（電荷結合素
子）を３つ使用したカラービデオカメラにおいては、３
色分光プリズムに上記３つのＣＣＤが取り付けられる。2. Description of the Related Art In a color video camera using three CCDs (charge coupled devices) as solid-state image pickup devices
The above three CCDs are attached to the color spectral prism.
【０００３】図５は、３色分光プリズム１９にＣＣＤパ
ッケージ１０〜１２が取り付けられた状態を示す図であ
る。FIG. 5 is a view showing a state in which the CCD packages 10 to 12 are attached to the three-color spectral prism 19.
【０００４】図５において、ＣＣＤパッケージ１０は第
１の取付金具１３に図６に示すようにして取り付けられ
る。つまり、図６に示すように、第１の取付金具１３の
位置決め用ピン１３ｂをＣＣＤパッケージ１０の凹部１
０ｂに挿入することにより、パッケージ１０と第１の取
付金具１３との位置決めが行なわれる。そして、ねじ１
４ａ，１４ａをパッケージ１０に形成された貫通孔１０
ａ，１０ａに挿入し、第１の取付金具１３に形成された
ねじ穴１３ａ，１３ａに螺合することにより、パッケー
ジ１０と第１の取付金具１３とが取り付けられる。１０
ｃはパッケージ１０に固定されたＣＣＤであり、１３ｃ
は、第１の取付金具１３のＣＣＤ１０ｃに対応する位置
に形成された開口である。次に、プリズム１９に対する
ＣＣＤ１０ｃの６次元の位置決めが行なわれる。その
後、先にプリズム１９に取り付けられた第２の取付金具
１６に第１の取付金具１３を半田付けすることにより、
ＣＣＤ１０ｃがおよびそのパッケージ１０がプリズム１
９に取り付けられる。なお、１４および１５は取付金具
１３と同様な第１の取付金具、１７および１８は取付金
具１６と同様な第２の取付金具である。そして、ＣＣＤ
パッケージ１１および１２のプリズム１９への取付けは
上述したＣＣＤパッケージ１０の取付け方法と同様であ
るので省略する。In FIG. 5, the CCD package 10 is attached to the first mounting member 13 as shown in FIG. That is, as shown in FIG. 6, the positioning pin 13 b of the first mounting member 13 is connected to the recess 1 of the CCD package 10.
Positioning of the package 10 and the first mounting member 13 is performed by inserting the package 10 into the mounting member 0b. And screw 1
4a and 14a are through holes 10 formed in the package 10.
The package 10 and the first mounting member 13 are mounted by being inserted into the a and 10a and screwed into the screw holes 13a and 13a formed in the first mounting member 13. 10
c is a CCD fixed to the package 10, and 13c
Is an opening formed at a position corresponding to the CCD 10c of the first mounting member 13. Next, the CCD 10c is six-dimensionally positioned with respect to the prism 19. After that, by soldering the first mounting member 13 to the second mounting member 16 previously mounted on the prism 19,
The CCD 10c and the package 10 are the prism 1
It is attached to 9. It should be noted that 14 and 15 are first mounting brackets similar to the mounting bracket 13, and 17 and 18 are second mounting brackets similar to the mounting bracket 16. And CCD
The mounting of the packages 11 and 12 to the prism 19 is the same as the method of mounting the CCD package 10 described above, and therefore its description is omitted.
【０００５】図７は、ＣＣＤパッケージ１０がプリズム
１９に取り付けられた状態の断面図である。図７におい
て、１５は弾性体からなる防塵用のパッキンである。こ
のパッキン１５は図５および図６においては省略してあ
る。FIG. 7 is a sectional view showing a state in which the CCD package 10 is attached to the prism 19. In FIG. 7, 15 is a dustproof packing made of an elastic body. The packing 15 is omitted in FIGS. 5 and 6.
【０００６】なお、上述のように、第１の取付金具と第
２の取付金具とを半田付けすることにより、ＣＣＤおよ
びそのパッケージをプリズムに取り付けるようにした固
体撮像素子の取付装置としては、例えば特開昭６１−１
３５２７９号公報に記載されたものがある。As a mounting device for a solid-state image pickup device in which the CCD and its package are mounted on a prism by soldering the first mounting metal and the second mounting metal as described above, for example, JP-A-61-1
There is one described in Japanese Patent No. 35279.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、上記従
来の固体撮像素子の取付装置にあっては、ＣＣＤのパッ
ケージと第１の取付金具とをねじにより固定するように
なっているので、上記パッケージにねじ挿入用の貫通孔
が必要でパッケージが大型となるばかりか、パッケージ
がねじの締め付けにより圧縮され撮像面にストレスがか
かってしまう恐れがあった。However, in the above-mentioned conventional mounting device for a solid-state image pickup device, the CCD package and the first mounting bracket are fixed by screws, so that the above-mentioned package is used. Not only the through hole for screw insertion is required, but the package becomes large in size, and the package is compressed by tightening the screw, which may cause stress on the imaging surface.
【０００８】また、図７に示すように、プリズム１９を
通過した光の一部が第１の取付金具１３の開口１３ｃの
端部１３ｅに反射して、撮像面に入射して、ゴーストが
生じてしまう可能性がある。このゴーストの発生を防止
するためには、端部１３ｅに黒メッキ等を施さねばなら
なかった。Further, as shown in FIG. 7, a part of the light passing through the prism 19 is reflected by the end portion 13e of the opening 13c of the first mounting member 13 and is incident on the image pickup surface to cause a ghost. There is a possibility that it will end up. In order to prevent the generation of this ghost, the end portion 13e had to be black-plated or the like.
【０００９】さらに、従来においては、防塵用のパッキ
ン１５を第１の取付金具１３とプリズム１９との間に配
置する構造となっているが、第１の取付金具１３とパッ
ケージ１０との隙間から塵埃がＣＣＤ１０ｃの近辺まで
侵入してしまう恐れがあった。このため、従来において
は、ＣＣＤパッケージ１０と第１の取付金具１３との間
にシーリング材を塗布していた。したがって、ＣＣＤの
プリズムへの取付工程が煩雑となっていた。Further, in the conventional structure, the dust-proof packing 15 is arranged between the first mounting member 13 and the prism 19, but the gap between the first mounting member 13 and the package 10 is used. There is a risk that dust may enter the vicinity of the CCD 10c. Therefore, conventionally, the sealing material is applied between the CCD package 10 and the first mounting member 13. Therefore, the process of mounting the CCD on the prism has been complicated.
【００１０】[0010]
【課題を解決するための手段】上記問題点を解決するた
め、この発明によれば、固体撮像素子を保持するパッケ
ージが接着される上面部と、この上面部の端部から延び
る脚部とを有する第１の取付金具と、上記パッケージの
固体撮像素子が保持された位置に対応する位置に開口部
を有する底面部と、この底面部の端部から上記第１の取
付金具に向かって延び、上記第１の取付金具の脚部と半
田付けにより固定される脚部と、を有する第２の取付金
具と、を備え、上記第１の取付金具と第２の取付金具と
の間に上記パッケージが配置されるように構成したこと
を特徴としている。In order to solve the above problems, according to the present invention, an upper surface portion to which a package for holding a solid-state image pickup device is adhered and a leg portion extending from an end portion of the upper surface portion are provided. A first mounting member having, a bottom surface portion having an opening at a position corresponding to a position where the solid-state imaging device of the package is held, and an end portion of the bottom surface portion extending toward the first mounting metal member, A second mounting member having a leg portion of the first mounting member and a leg portion fixed by soldering; and the package between the first mounting member and the second mounting member. It is characterized in that it is configured to be arranged.
【００１１】[0011]
【作用】第１の取付金具にパッケージ固定用のねじ貫通
孔およびねじが不要となるとともに、ねじの締め付けよ
る固体撮像素子の撮像面へのストレスが回避される。ま
た、撮像面とプリズムとの間にパッキンを配置すれば、
撮像面を第１の取付金具から遮断することができるので
第１の取付金具に黒メッキ等を施すことなく、反射光に
よるゴーストの発生を防止することができるとともに十
分な防塵を行うことができる。The first mounting member does not need a screw through hole and a screw for fixing the package, and stress on the image pickup surface of the solid-state image pickup device due to tightening the screw is avoided. Moreover, if packing is arranged between the imaging surface and the prism,
Since the imaging surface can be shielded from the first mounting member, it is possible to prevent generation of a ghost due to reflected light and to perform sufficient dust prevention without applying black plating or the like to the first mounting member. ..
【００１２】[0012]
【実施例】図１は、この発明の一実施例である固体撮像
素子の取付装置の分解斜視図、図２は上記一実施例をプ
リズム５に取り付けた場合の断面図である。なお、図１
においては、図２に示したパッキン６は省略してある。FIG. 1 is an exploded perspective view of a solid-state image pickup device mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view of the above-described one embodiment mounted on a prism 5. Note that FIG.
2, the packing 6 shown in FIG. 2 is omitted.
【００１３】図１および図２において、１は第１の取付
金具、２はＣＣＤを保持するパッケージであり、このＣ
ＣＤパッケージ２にＣＣＤ４が固定されている。そし
て、ＣＣＤパッケージ２の、ＣＣＤ４の撮像面が露出さ
れている面と反対側の面には、２つの凹部が形成されて
いる。第１の取付金具１の上面部１ｇには、上記ＣＣＤ
パッケージ２に形成された２つの凹部２ａおよび２ｂの
それぞれに対応する位置に、貫通孔１ｅおよび１ｆが形
成されている。また、第１の取付金具の上面部１ｇには
ＣＣＤパッケージ２の方向に延びる４つの脚部１ａ，１
ｂ，１ｃ，１ｄが形成されている。３は第２の取付金具
であり、この第２の取付金具３の底面部３ｆにはＣＣＤ
４に対応する位置に開口３ｅが形成されている。また、
この第２の取付金具３には、ＣＣＤパッケージ２の方向
に延びる４つの脚部３ａ，３ｂ，３ｃ，３ｄが形成され
ている。In FIGS. 1 and 2, reference numeral 1 is a first mounting member, and 2 is a package for holding a CCD.
A CCD 4 is fixed to the CD package 2. Then, two recesses are formed on the surface of the CCD package 2 opposite to the surface on which the image pickup surface of the CCD 4 is exposed. On the upper surface 1g of the first mounting member 1, the above CCD
Through holes 1e and 1f are formed at positions corresponding to the two recesses 2a and 2b formed in the package 2, respectively. In addition, on the upper surface 1g of the first mounting member, four leg portions 1a, 1 extending in the direction of the CCD package 2 are provided.
b, 1c, 1d are formed. Reference numeral 3 denotes a second mounting member, and a CCD is provided on the bottom surface 3f of the second mounting member 3.
An opening 3e is formed at a position corresponding to 4. Also,
The second mounting member 3 is formed with four leg portions 3a, 3b, 3c, 3d extending in the direction of the CCD package 2.
【００１４】さて、上記固体撮像素子の取付装置におい
て、まず第１の取付金具１の貫通孔１ｅおよび１ｆのそ
れぞれに対応する位置に、２つのピンが形成された位置
決め用治具（図示せず）によりＣＣＤパッケージ２に対
する位置決めが行なわれる。つまり、上記位置決め用治
具の一方のピンが貫通孔１ｅを介してパッケージ２の凹
部２ａに挿入されるとともに、他方のピンが貫通孔１ｆ
を介して凹部２ｂに挿入される。そして、第１の取付金
具１とＣＣＤパッケージ２との位置決めが行なわれなが
ら、取付金具１とパッケージ２とが接着剤により接着さ
れ、固定される。続いて、図２に示すように、分光プリ
ズム５に先に取り付けられたパッキン６にパッケージ４
が配置されるとともに、第１の取付金具１の脚部１ａ，
１ｂ，１ｃ，１ｄが、プリズム５に先に取り付けられた
第２の取付金具３の脚部３ａ，３ｂ，３ｃ，３ｄに配置
される。そして、ＣＣＤ４のプリズム５に対する６次元
の位置決めが行なわれる。この位置決めが行なわれた
後、第１の取付金具１の脚部１ａ，１ｂ，１ｃ，１ｄと
第２の取付金具３の脚部３ａ，３ｂ，３ｃ，３ｄとが半
田付けされる。In the mounting device for the solid-state image pickup device, first, a positioning jig (not shown) in which two pins are formed at positions corresponding to the through holes 1e and 1f of the first mounting member 1, respectively. ), The positioning with respect to the CCD package 2 is performed. That is, one pin of the positioning jig is inserted into the recess 2a of the package 2 via the through hole 1e, and the other pin is inserted into the through hole 1f.
It is inserted into the concave portion 2b via the. Then, while the first mounting member 1 and the CCD package 2 are positioned, the mounting member 1 and the package 2 are bonded and fixed with an adhesive. Then, as shown in FIG. 2, the package 4 is attached to the packing 6 previously attached to the spectral prism 5.
And the leg portion 1a of the first mounting member 1,
1b, 1c, 1d are arranged on the legs 3a, 3b, 3c, 3d of the second mounting member 3 previously mounted on the prism 5. Then, the CCD 4 is positioned in six dimensions with respect to the prism 5. After this positioning is performed, the legs 1a, 1b, 1c, 1d of the first mounting member 1 and the legs 3a, 3b, 3c, 3d of the second mounting member 3 are soldered.
【００１５】以上のように、この発明の一実施例によれ
ば、パッケージ２の、ＣＣＤ４の撮像面が露出される面
と反対側の面が、第１の取付金具１に接着され、ＣＣＤ
４の撮像面が第２の取付金具３に面するように、第１の
取付金具１と第２の取付金具３とが半田付けされ固定さ
れる構成としたので、第１の取付金具１にパッケージ２
固定用のねじ貫通穴が不要となるとともに、ねじの締め
付けによるＣＣＤ４の撮像面へのストレスが回避され
る。As described above, according to the embodiment of the present invention, the surface of the package 2 opposite to the surface on which the image pickup surface of the CCD 4 is exposed is adhered to the first mounting member 1, and the CCD is attached.
Since the first mounting member 1 and the second mounting member 3 are soldered and fixed so that the imaging surface of 4 faces the second mounting member 3, Package 2
A screw through hole for fixing is not required, and stress on the image pickup surface of the CCD 4 due to tightening the screw is avoided.
【００１６】また、パッキン６によって、ＣＣＤ４の撮
像面は第１の取付金具１から遮蔽されているので、プリ
ズム５を通過した光が第１の取付金具１に反射してＣＣ
Ｄ４の撮像面に入射することはない。したがって、第１
の取付金具１への黒メッキは不要となる。さらに、上記
パッキン６はパッケージ２に直接密着されるので、十分
な防塵を行なうことができる。したがって、従来のよう
なシーリング材の塗布は不要となる。Further, since the image pickup surface of the CCD 4 is shielded from the first mounting member 1 by the packing 6, the light passing through the prism 5 is reflected by the first mounting member 1 and CC
It does not enter the image pickup surface of D4. Therefore, the first
The black plating on the mounting bracket 1 is unnecessary. Furthermore, since the packing 6 is directly adhered to the package 2, sufficient dust protection can be performed. Therefore, it is not necessary to apply the sealing material as in the conventional case.
【００１７】図３は、この発明の他の実施例の要部斜視
図である。なお、図３においては、第２の取付金具およ
びパッキンは上述した一実施例と同様であるので省略し
てある。FIG. 3 is a perspective view of an essential part of another embodiment of the present invention. Note that, in FIG. 3, the second mounting member and the packing are omitted since they are similar to those of the above-described embodiment.
【００１８】図３において、７は第１の取付金具であ
る。この第１の取付金具７は、上記第１の取付金具１に
放熱用のフィン７ｇが形成されたものである。そして、
他の形状は第１の取付金具１と同様であるので説明は省
略する。In FIG. 3, 7 is a first mounting member. The first mounting member 7 is the first mounting member 1 on which heat radiation fins 7g are formed. And
Since the other shapes are the same as those of the first mounting member 1, description thereof will be omitted.
【００１９】この図３の例によれば、図１の例と同様な
効果の他に、ＣＣＤ４の放熱性を向上することができる
という効果が得られる。According to the example of FIG. 3, in addition to the effect similar to the example of FIG. 1, the effect that the heat dissipation of the CCD 4 can be improved is obtained.
【００２０】図４は、この発明のさらに他の実施例の要
部斜視図であり、第２の取付金具およびパッキンは上述
した一実施例と同様であるので省略してある。FIG. 4 is a perspective view of a main part of still another embodiment of the present invention, and the second mounting member and packing are the same as those of the above-mentioned one embodiment, and are omitted.
【００２１】図４において、８は第１の取付金具であ
り、この第１の取付金具８には、第２の取付金具と半田
付けされる脚部８ａおよび８ｂと側面部に位置決め用ガ
イド部８ｃおよび８ｄとが形成される。In FIG. 4, reference numeral 8 denotes a first mounting member, and the first mounting member 8 has leg portions 8a and 8b to be soldered to the second mounting member and a positioning guide portion on the side surface portion. 8c and 8d are formed.
【００２２】そして、ＣＣＤパッケージ９は上記脚部８
ａおよび８ｂとガイド部８ｃおよび８ｄとにより位置決
めされて、第１の取付金具８に接着される。この場合、
パッケージ９は、ＣＣＤ９ａの撮像面が露出した面と反
対側の面が第１の取付金具８に接着される。The CCD package 9 has the leg portion 8
It is positioned by a and 8b and guide portions 8c and 8d, and is bonded to the first mounting member 8. in this case,
The surface of the package 9 opposite to the surface on which the image pickup surface of the CCD 9a is exposed is adhered to the first mounting member 8.
【００２３】この図４の例によれば、第１の取付金具８
の脚部８ａ，８ｂ，ガイド部８ｃ，８ｄによりＣＣＤパ
ッケージ９の位置決めが行なわれるようになっているの
で、第１の取付金具には、位置決め用の貫通孔は不要と
なるとともに、ＣＣＤのパッケージに位置決め用の凹部
も不要となる。したがって、図１の例と同様な効果に加
えて、第１の取付金具８を小型化することができるとと
もに、ＣＣＤパッケージ９も小型化することができる。According to the example of FIG. 4, the first mounting member 8
Since the CCD package 9 is positioned by the legs 8a, 8b and the guides 8c, 8d of the first mounting bracket, the first mounting member does not require a through hole for positioning, and the CCD package In addition, a concave portion for positioning is unnecessary. Therefore, in addition to the effect similar to the example of FIG. 1, the first mounting member 8 can be downsized, and the CCD package 9 can also be downsized.
【００２４】[0024]
【発明の効果】以上のように、この発明によれば、固体
撮像素子を保持するパッケージが接着される上面部と、
この上面部の端部から延びる脚部とを有する第１の取付
金具と、上記パッケージの固体撮像素子が保持された位
置に対応する位置に開口部を有する底面部と、この底面
部の端部から上記第１の取付金具に向かって延び、上記
第１の取付金具の脚部と半田付けにより固定される脚部
と、を有する第２の取付金具と、を備え、上記第１の取
付金具と第２の取付金具との間に上記パッケージが配置
されるように構成したので、第１の取付金具にパッケー
ジ固定用のねじ貫通穴およびねじが不要となり小型化が
可能となるとともに、ねじの締め付けによる固体撮像素
子の撮像面へのストレスが回避される。また、撮像面と
プリズムとの間にパッキンを配置すれば、撮像面を第１
の取付金具から遮蔽することができるので第１の取付金
具に黒メッキ等を施すことなく、反射光によるゴースト
の発生を防止することができるとともにシーリング材を
塗布することなく十分な防塵を行うことができる。した
がって、黒メッキ工程やシーリング材の塗布工程を省略
することができ、製造コストを低減することができる。As described above, according to the present invention, the upper surface portion to which the package holding the solid-state image pickup device is adhered,
A first mounting member having a leg portion extending from an end portion of the upper surface portion, a bottom surface portion having an opening portion at a position corresponding to a position where the solid-state imaging device of the package is held, and an end portion of the bottom surface portion. From the first mounting bracket to the first mounting bracket, the second mounting bracket having a leg section of the first mounting bracket and a leg section fixed by soldering, and the first mounting bracket. Since the package is arranged between the second mounting member and the second mounting member, the first mounting member does not need a screw through hole and a screw for fixing the package, which enables downsizing and also reduces the size of the screw. Stress on the imaging surface of the solid-state imaging device due to tightening is avoided. If a packing is arranged between the imaging surface and the prism,
Since it can be shielded from the mounting bracket of No. 1, it is possible to prevent the generation of ghost due to reflected light without applying black plating etc. to the first mounting bracket, and to perform sufficient dust prevention without applying a sealing material. You can Therefore, the black plating step and the sealing material application step can be omitted, and the manufacturing cost can be reduced.
【図１】この発明の一実施例の分解斜視図。FIG. 1 is an exploded perspective view of an embodiment of the present invention.
【図２】この発明の一実施例の断面図。FIG. 2 is a sectional view of an embodiment of the present invention.
【図３】この発明の他の実施例の要部斜視図。FIG. 3 is a perspective view of a main part of another embodiment of the present invention.
【図４】この発明のさらに他の実施例の要部斜視図。FIG. 4 is a perspective view of a main part of still another embodiment of the present invention.
【図５】従来の固体撮像素子の取付装置が分光プリズム
に取付けられた状態を示す図。FIG. 5 is a diagram showing a state in which a conventional solid-state image sensor mounting device is mounted on a spectral prism.
【図６】従来の固体撮像素子の取付装置の要部分解斜視
図。FIG. 6 is an exploded perspective view of essential parts of a conventional mounting device for a solid-state imaging device.
【図７】従来の固体撮像素子の取付装置の断面図。FIG. 7 is a cross-sectional view of a conventional mounting device for a solid-state image sensor.
１，７，８…第１の取付金具、１ａ，１ｂ，１ｃ，１
ｄ、３ａ，３ｂ，３ｃ，３ｄ，８ａ，８ｂ…脚部、１ｇ
…上面部、２，９…ＣＣＤパッケージ、３…第２の取付
金具、３ｆ…底面部、４，９ａ…ＣＣＤ、５…プリズ
ム、６…パッキン。1, 7, 8 ... First mounting bracket, 1a, 1b, 1c, 1
d, 3a, 3b, 3c, 3d, 8a, 8b ... Legs, 1g
... top part, 2, 9 ... CCD package, 3 ... second mounting bracket, 3f ... bottom part, 4, 9a ... CCD, 5 ... prism, 6 ... packing.
Claims (1)
着される上面部と、この上面部の端部から延びる脚部と
を有する第１の取付金具と、 上記パッケージの固体撮像素子が保持された位置に対応
する位置に開口部を有する底面部と、この底面部の端部
から上記第１の取付金具に向かって延び、上記第１の取
付金具の脚部と半田付けにより固定される脚部と、を有
する第２の取付金具と、 を備え、上記第１の取付金具と第２の取付金具との間に
上記パッケージが配置されるように構成したことを特徴
とする固体撮像素子の取付装置。1. A first mounting member having an upper surface portion to which a package holding a solid-state imaging device is bonded, and a leg portion extending from an end of the upper surface portion, and the solid-state imaging device of the package is held. A bottom portion having an opening at a position corresponding to the position, a leg portion extending from an end of the bottom portion toward the first mounting member, and fixed to the leg portion of the first mounting member by soldering. And a second mounting member having: and a structure for mounting the package between the first mounting member and the second mounting member. apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3283431A JPH05122566A (en) | 1991-10-30 | 1991-10-30 | Fitting device for solid-state image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3283431A JPH05122566A (en) | 1991-10-30 | 1991-10-30 | Fitting device for solid-state image pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05122566A true JPH05122566A (en) | 1993-05-18 |
Family
ID=17665449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3283431A Pending JPH05122566A (en) | 1991-10-30 | 1991-10-30 | Fitting device for solid-state image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05122566A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007166349A (en) * | 2005-12-15 | 2007-06-28 | Hitachi Kokusai Electric Inc | Unit and method for mounting solid imaging device |
| JP2008136064A (en) * | 2006-11-29 | 2008-06-12 | Hitachi Kokusai Electric Inc | Mounting device and mounting method of solid-state imaging device |
| JP2008199158A (en) * | 2007-02-09 | 2008-08-28 | Matsushita Electric Ind Co Ltd | Heat-dissipating structure of solid-state imaging element, and solid-state imaging device |
| CN102436120A (en) * | 2010-09-29 | 2012-05-02 | Hoya株式会社 | Imaging unit |
| JP2012177886A (en) * | 2011-02-03 | 2012-09-13 | Hoya Corp | Imaging unit |
-
1991
- 1991-10-30 JP JP3283431A patent/JPH05122566A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007166349A (en) * | 2005-12-15 | 2007-06-28 | Hitachi Kokusai Electric Inc | Unit and method for mounting solid imaging device |
| JP2008136064A (en) * | 2006-11-29 | 2008-06-12 | Hitachi Kokusai Electric Inc | Mounting device and mounting method of solid-state imaging device |
| JP2008199158A (en) * | 2007-02-09 | 2008-08-28 | Matsushita Electric Ind Co Ltd | Heat-dissipating structure of solid-state imaging element, and solid-state imaging device |
| CN102436120A (en) * | 2010-09-29 | 2012-05-02 | Hoya株式会社 | Imaging unit |
| JP2012177886A (en) * | 2011-02-03 | 2012-09-13 | Hoya Corp | Imaging unit |
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