JP2589417B2 - Processing method of small parts using dicing saw - Google Patents
Processing method of small parts using dicing sawInfo
- Publication number
- JP2589417B2 JP2589417B2 JP3108869A JP10886991A JP2589417B2 JP 2589417 B2 JP2589417 B2 JP 2589417B2 JP 3108869 A JP3108869 A JP 3108869A JP 10886991 A JP10886991 A JP 10886991A JP 2589417 B2 JP2589417 B2 JP 2589417B2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- dicing saw
- blade
- base material
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、半導体基板等をカッ
トするためのダイシングソーを利用して、一方向へ直線
状に連続する溝を有する小物部品を加工する方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a small component having a groove which is linearly continuous in one direction by using a dicing saw for cutting a semiconductor substrate or the like.
【０００２】[0002]
【従来の技術】図６は溝を有する小物部品を量産する方
法の一例を示す説明図である。従来の量産方法は、所定
の寸法の基材３にエッチング処理を施して溝２および分
割用の溝４を形成した後に、分割用の溝４に沿ってダイ
シングソー等の加工機械で基材３を分割して、複数の小
物部品（チップ）１を得ていた。2. Description of the Related Art FIG. 6 is an explanatory view showing an example of a method of mass-producing small parts having a groove. In a conventional mass production method, after a base material 3 having a predetermined size is subjected to an etching process to form a groove 2 and a dividing groove 4, the base material 3 is cut along the dividing groove 4 by a processing machine such as a dicing saw. To obtain a plurality of small parts (chips) 1.
【０００３】[0003]
【発明が解決しようとする課題】このように従来の加工
方法は、エッチング等の処理工程と各部品を分割するた
めの機械加工工程が必要で、２種類の装置が必要であっ
た。また、エッチング加工では、図７に示すように、溝
２の角部が直角にならずＲが残ったり、溝２の底部の平
坦度が充分に確保できないという問題があった。さら
に、加工対象の材質が異なると、それに対応して異なる
エッチング液を用いなければならない。As described above, the conventional processing method requires a processing step such as etching and a machining step for dividing each component, and thus requires two types of apparatuses. In addition, in the etching process, as shown in FIG. 7, the corners of the groove 2 do not become right angles, leaving R, and there is a problem that the flatness of the bottom of the groove 2 cannot be sufficiently ensured. Further, when the material to be processed is different, a different etching solution must be used correspondingly.
【０００４】この発明はこのような課題を解決するため
なされたもので、その目的は１種類の加工装置で溝を有
する小物部品を精度よく加工する方法を提供することに
ある。[0004] In particular the present invention has been made to solve the above problems, and its object is to provide a method for processing with high accuracy small parts having a groove in one of the processing device
There is .
【０００５】[0005]
【課題を解決するための手段】前記課題を解決するため
この発明では、加工対象である基材に対してダイシング
ソーを用いて一方向へ直線状に延出する溝を形成した後
に、前記ダイシングソーを用いて前記溝とは異なる方向
へ前記基材をフルカッティングするダイシングソーを用
いた小物部品の加工方法において、前記溝の形成は、前
記ダイシングソーの刃を前記基材に対して前記基材の厚
さより小さい所定の深さまで切り込ませながら一方向へ
直線状に延出する溝を形成した後に、このダイシングソ
ーの刃を前記基材から離した状態でこのダイシングソー
の刃もしくは前記基材を前記溝の幅方向へ刃幅以下の距
離だけ移動させ、再度ダイシングソーの刃を前記基材に
対して前記基材の厚さより小さい所定の深さまで切り込
ませながら一方向へ直線状に延出する幅広の溝を形成す
ること、またはこれを繰り返して更に幅広の溝を形成す
ることからなる。 [MEANS FOR SOLVING THE PROBLEMS]
In the present invention, dicing is performed on a substrate to be processed.
After forming a groove that extends linearly in one direction using a saw
In the direction different from the groove using the dicing saw
Use a dicing saw to fully cut the substrate
In the method of processing a small component,
The thickness of the base material with respect to the base material
In one direction while cutting to a predetermined depth smaller than
After forming a groove that extends in a straight line,
With the blade of the dicing machine separated from the substrate,
Of the blade or the base material in the width direction of the groove is smaller than the blade width.
And then move the dicing saw blade to the base again.
On the other hand, cut to a predetermined depth smaller than the thickness of the base material
To form a wide groove that extends linearly in one direction
Or repeat this to form a wider groove.
Consisting of
【０００６】なお、溝の形成は、基材に対してダイシン
グソーの刃を所定の深さまで切り込ませながら一方向へ
直線状に延出する溝を形成した後に、このダイシングソ
ーの刃を基材から離した状態で切り込み位置を前記溝の
幅方向へずらし、再度ダイシングソーの刃を基材に対し
て所定の深さまで切り込ませながら一方向へ直線状に延
出する幅広の溝を形成すること、またはこれを繰り返し
て更に幅広の溝を形成することからなるのが望ましい。[0006] The grooves are formed on the substrate by die-cutting.
While cutting the gusso blade to the specified depth, in one direction
After forming the groove extending linearly , the cutting position is shifted in the width direction of the groove while the blade of the dicing saw is separated from the substrate, and the blade of the dicing saw is again moved to a predetermined depth with respect to the substrate. Extend straight in one direction while cutting
Forming a wide groove that protrudes, or repeating this
It is preferable to form a wider groove .
【０００７】[0007]
【作用】ダイシングソーだけの１種類の加工装置で、一
方向へ連続する溝を有する小物部品をダイシングソーの
加工精度で製造することができる。また、ダイシングソ
ーの刃幅より幅広の溝を形成することができる。 With a single type of processing apparatus using only a dicing saw, small parts having grooves continuous in one direction can be manufactured with the processing accuracy of the dicing saw. In addition, dicing
A groove wider than the blade width of the blade can be formed.
【０００８】[0008]
【実施例】以下、この発明の実施例を添付図面に基づい
て説明する。図１はこの発明に関連する小物部品の加工
方法の説明図、図２は加工完了後の小物部品の形状例を
示す斜視図である。図１は、所定の寸法の基材３から図
２に示す溝付の角型部品を製造する方法を示したもので
ある。Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an explanatory view of a method for processing a small part related to the present invention , and FIG. 2 is a perspective view showing an example of the shape of the small part after processing is completed. FIG. 1 shows a method of manufacturing the grooved square part shown in FIG. 2 from a base material 3 having a predetermined size.
【０００９】半導体基板、セラミック基板、ベーク板等
の加工対象である基材３に対して、図１（ａ）に示すよ
うに、ダイシングソーの刃５を基材３の厚さより小さい
所定の深さまで切り込ませながら一方向へ直線状に延出
する溝２を形成する。次に、図１（ｂ）に示すように、
基材３の向きを９０度変えて、ダイシングソーの刃５で
基材３を切断することで、図２に示す小物部品１を得
る。As shown in FIG. 1A, the blade 5 of the dicing saw is smaller than the thickness of the substrate 3 for the substrate 3 to be processed, such as a semiconductor substrate, a ceramic substrate, and a bake plate. > Form a groove 2 that extends linearly in one direction while cutting to a predetermined depth. Next, as shown in FIG.
The small component 1 shown in FIG. 2 is obtained by changing the direction of the substrate 3 by 90 degrees and cutting the substrate 3 with the blade 5 of the dicing saw.
【００１０】次に、図２に示すように、幅１．５ｍｍ，
深さ０．８ｍｍ程度のダイシングソー加工としては比較
的幅広の溝を形成する場合について、図３を参考に説明
する。ダイシングソーは半導体チップの分離等に通常使
用されるもので、その刃５は極めて狭く、例えば１０μ
ｍ程度の刃幅であるが、ここでは加工する溝幅が広いた
め刃幅０．５ｍｍの刃５を用いる。また、ダイシングソ
ーはもともと半導体基板からチップを切り取るために用
いるものであるため、刃５の回転駆動力はそれ程大きく
ない。そこで、基材３に対して１回に切り込む深さを約
０．４ｍｍとしている。Next, as shown in FIG.
Referring to FIG. 3, a case where a relatively wide groove is formed as a dicing saw with a depth of about 0.8 mm will be described. The dicing saw is usually used for separating semiconductor chips, etc., and its blade 5 is extremely narrow, for example, 10 μm.
Although the blade width is about m, the blade 5 having a blade width of 0.5 mm is used here because the groove width to be processed is wide. Further, since the dicing saw is originally used for cutting chips from the semiconductor substrate, the rotational driving force of the blade 5 is not so large. Therefore, the depth of the cut into the substrate 3 at one time is set to about 0.4 mm.
【００１１】そして、図３（ａ）〜（ｆ）に示す順序で
溝の加工を行う。まず、刃幅０．５ｍｍの刃５で、基材
３の厚さより小さい深さ０．４ｍｍまで基材３を切り込
ませながら一方向へ直線状に延出する溝２を形成する
（ａ）。その後刃５を一旦持上げて次の切り込み深さ
（０．４ｍｍ）をセットし、所望の深さ（０．８ｍｍ）
まで切り込ませながら溝２を深く形成する（ｂ）。次
に、ダイシングソーの刃５を持上げて基材３から離した
状態で、この刃５もしくは基材３を溝２の幅方向へ刃幅
の距離（０．５ｍｍ）だけ移動させて、同様な工程を繰
り返す（ｃ〜ｆ）。溝加工が終了した後に、必要に応じ
てダイシングソーの刃５を刃幅の狭いものに交換し、基
材３をフルカットして個々の小物部品（チップ）に分割
する。Then, the grooves are processed in the order shown in FIGS. First, in the blade 5 of the blade width 0.5 mm, the substrate
Cut the substrate 3 to a depth of 0.4 mm smaller than the thickness of 3
To form a groove 2 extending linearly in one direction
(A). Thereafter, the blade 5 is once lifted and the next cutting depth (0.4 mm) is set, and the desired depth (0.8 mm) is set.
The groove 2 is formed deeply while being cut in (b). Next, with the blade 5 of the dicing saw lifted and separated from the substrate 3, the blade 5 or the substrate 3 is moved in the width direction of the groove 2 to have a blade width.
And the same process is repeated (cf). After the completion of the grooving, the blade 5 of the dicing saw is replaced with a blade having a smaller blade width if necessary, and the base material 3 is fully cut to be divided into individual small parts (chips).
【００１２】図４はこの発明に関連する他の加工方法の
説明図である。図４（ａ）に示すように、基材３に対し
て溝２および分割用の溝４をダイシングソーで切り込ん
で形成した後に、図４（ｂ）に示すように、基材３もし
くはダイシングソーの刃５の向きを変えて基材３をフル
カットし小物部品１を得るものである。FIG. 4 is an explanatory view of another processing method related to the present invention. As shown in FIG. 4A , the grooves 2 and the dividing grooves 4 are cut into the base material 3 with a dicing saw.
Then, as shown in FIG. 4 (b), the direction of the base member 3 or the blade 5 of the dicing saw is changed to fully cut the base member 3 to obtain the small component 1.
【００１３】なお、図３と同様な工程で、図５（ａ）お
よび（ｂ）に示す溝形状の小物部品１を作成することが
できる。Note that the groove-shaped small parts 1 shown in FIGS. 5 (a) and 5 (b) can be produced by the same steps as those in FIG .
【００１４】[0014]
【発明の効果】以上説明したようにこの発明に係る加工
方法によれば、ダイシングソーだけの１種類の加工装置
で、一方向へ連続する溝を有する小物部品をダイシング
ソーの加工精度で製造することができる。また、ダイシ
ングソーの刃幅より幅広の溝を有する小物部品を製造す
ることができる。 As described above, according to the processing method of the present invention, a small component having a groove continuous in one direction can be manufactured with the processing accuracy of the dicing saw using only one type of processing apparatus including only the dicing saw. be able to. Also, Daishi
Small parts with grooves wider than the blade width of
Can be
【図１】この発明に関連する小物部品の加工方法の説明
図FIG. 1 is an explanatory view of a method for processing a small component according to the present invention.
【図２】加工終了後の小物部品の形状例を示す斜視図FIG. 2 is a perspective view showing an example of the shape of a small component after processing is completed.
【図３】この発明に係る小物部品の加工方法の特徴を説
明する幅広溝の加工工程図FIG. 3 illustrates the features of the processing method for small parts according to the present invention .
Machining process diagram of wide groove to be clarified
【図４】この発明に関連する他の加工方法の説明図FIG. 4 is an explanatory view of another processing method related to the present invention.
【図５】小物部品の一形状例を示す斜視図FIG. 5 is a perspective view showing an example of the shape of a small component.
【図６】従来の小物部品量産方法の一例を示す説明図FIG. 6 is an explanatory view showing an example of a conventional small part mass production method.
【図７】従来の小物部品量産方法の問題点を示す説明図FIG. 7 is an explanatory view showing a problem of a conventional small component mass production method.
１…小物部品、２…溝、３…基材、４…分割用の溝、５
…ダイシングソーの刃。DESCRIPTION OF SYMBOLS 1 ... Small parts, 2 ... Groove , 3 ... Base material, 4 ... Groove for division, 5
... Dicing saw blade.
Claims (1)
ソーを用いて一方向へ直線状に延出する溝を形成した後
に、前記ダイシングソーを用いて前記溝とは異なる方向
へ前記基材をフルカッティングするダイシングソーを用
いた小物部品の加工方法において、 前記溝の形成は、 前記ダイシングソーの刃を前記基材に対して前記基材の
厚さより小さい所定の深さまで切り込ませながら一方向
へ直線状に延出する溝を形成した後に、 このダイシングソーの刃を前記基材から離した状態でこ
のダイシングソーの刃もしくは前記基材を前記溝の幅方
向へ刃幅以下の距離だけ移動させ、再度ダイシングソー
の刃を前記基材に対して前記基材の厚さより小さい所定
の深さまで切り込ませながら一方向へ直線状に延出する
幅広の溝を形成すること、またはこれを繰り返して更に
幅広の溝を形成することからなる ことを特徴とするダイ
シングソーを用いた小物部品の加工方法。After forming a groove extending linearly in one direction on a base material to be processed using a dicing saw, the groove is different from the groove using the dicing saw. Use a dicing saw that fully cuts the substrate in the direction
In the method of processing a small component, the formation of the groove is performed by using a blade of the dicing saw with respect to the base material.
One direction while cutting to a predetermined depth smaller than the thickness
After forming a groove that extends in a straight line, the dicing saw blade is separated from the base material.
The dicing saw blade or the base material to the width of the groove
In the direction of the blade width
Blade is smaller than the thickness of the base material with respect to the base material.
Extend linearly in one direction while cutting to the depth of
Forming a wide groove, or repeating this for more
A method of processing a small component using a dicing saw, comprising forming a wide groove .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3108869A JP2589417B2 (en) | 1991-04-12 | 1991-04-12 | Processing method of small parts using dicing saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3108869A JP2589417B2 (en) | 1991-04-12 | 1991-04-12 | Processing method of small parts using dicing saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04314504A JPH04314504A (en) | 1992-11-05 |
| JP2589417B2 true JP2589417B2 (en) | 1997-03-12 |
Family
ID=14495653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3108869A Expired - Lifetime JP2589417B2 (en) | 1991-04-12 | 1991-04-12 | Processing method of small parts using dicing saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2589417B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2592489B2 (en) * | 1988-03-18 | 1997-03-19 | 富士通株式会社 | Wafer dicing method |
| JPH0336003A (en) * | 1989-07-04 | 1991-02-15 | Seiko Epson Corp | Dicing device |
-
1991
- 1991-04-12 JP JP3108869A patent/JP2589417B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04314504A (en) | 1992-11-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
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