JP2586008B2 - Manufacturing method of thermal head - Google Patents
Manufacturing method of thermal headInfo
- Publication number
- JP2586008B2 JP2586008B2 JP60251790A JP25179085A JP2586008B2 JP 2586008 B2 JP2586008 B2 JP 2586008B2 JP 60251790 A JP60251790 A JP 60251790A JP 25179085 A JP25179085 A JP 25179085A JP 2586008 B2 JP2586008 B2 JP 2586008B2
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- ink ribbon
- insulating substrate
- heating element
- common electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、例えば、絶縁基板端面近傍に発熱素子を
配置したシリアルプリンタ用のサーマルヘツドの、共通
電極構造、及び、サーマルヘツド形状に関するものであ
る。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a common electrode structure and a shape of a thermal head for a serial printer in which a heating element is arranged near an end surface of an insulating substrate. is there.
第５図に示すものは、サーマルヘルドを用いたシリア
ルプリンタを示すものであり、図において、（８）はサ
ーマルヘツド、（９）はそのサーマルヘルド（８）上に
搬送される転写層を有するインクリボン、（10）はイン
クリボン（９）と接せられる普通紙、（11）は普通紙
（10）を搬送し、サーマルヘツド（８）とインクリボン
（９）、普通紙（10）とをはさみ込むプラテンローラ、
（12）はインクリボンを収納し、インクリボンの巻き取
りを行うインクリボンカセツトである。FIG. 5 shows a serial printer using a thermal heald. In the figure, (8) shows a thermal head, and (9) has a transfer layer carried on the thermal heald (8). Ink ribbon, (10) is plain paper that is in contact with ink ribbon (9), (11) is plain paper (10), and thermal head (8), ink ribbon (9) and plain paper (10) are conveyed. A platen roller that sandwiches
(12) is an ink ribbon cassette for storing the ink ribbon and winding the ink ribbon.
次に動作について説明する。絶縁基板上に複数個の発
熱素子を配列してなるサーマルヘツド（８）の発熱素子
にパルス電圧を印加し、該ドツトの発熱により、インク
リボン（９）上の転写層を普通紙（10）上に転写し、文
字記号等を普通紙（10）上に印字させる方式が熱転写記
録方式である。第５図において、絶縁基板上に発熱素子
を形成したサーマルヘツド（８）は、図中、Ａの矢印方
向からの押圧により、プラテンローラ（11）と、インク
リボン（９）、普通紙（10）をはさみ込み、図中、Ｂの
矢印方向にインクリボンカセツト（12）、サーマルヘツ
ド（８）を移動させつつ、図中、Ｃの矢印方向にインク
リボンを搬送することにより、上記熱転写記録を可能と
している。Next, the operation will be described. A pulse voltage is applied to the heating element of the thermal head (8) having a plurality of heating elements arranged on an insulating substrate, and the heat generated by the dot causes the transfer layer on the ink ribbon (9) to become plain paper (10). The thermal transfer recording method is a method in which the characters are transferred onto the plain paper (10). In FIG. 5, a thermal head (8) having a heating element formed on an insulating substrate is pressed by a platen roller (11), an ink ribbon (9), and a plain paper (10) by pressing in the direction of arrow A in the figure. ), The ink ribbon cassette (12) and the thermal head (8) are moved in the direction of the arrow B in the figure, and the ink ribbon is transported in the direction of the arrow C in the figure. And
さて、発熱素子とインクリボン（９）、普通紙（10）
との接続圧力と普通紙（10）上に印字されたドツトの間
にはある関係があり、接触圧力が高い程、普通紙（10）
上の印字濃度が高く、印字品位が良いものとなる。この
ようなことから、発熱素子とインクリボン（９）、普通
紙（10）とのあたりを良くし、接触圧力を高くする目的
で、発熱素子を絶縁基板上に突起させるサーマルヘツド
が考案され実施された。By the way, heating element and ink ribbon (9), plain paper (10)
There is a relationship between the connection pressure with the paper and the dots printed on plain paper (10).
The print density above is high and the print quality is good. For this reason, a thermal head for projecting the heating element on the insulating substrate has been devised and implemented for the purpose of improving the contact between the heating element and the ink ribbon (9) and the plain paper (10) and increasing the contact pressure. Was done.
第３図に示すものがそれで、第３図は従来のサーマル
ヘツドを示す斜視図（第３図（Ａ））及び、Ｌ−Ｍ断面
図（第３図（Ｂ））であり、図において、（１）は例え
ばセラミツク基板のような絶縁基板、（２）は絶縁基板
（１）上に、数十ミクロンの厚みのガラスを印刷、数百
度で焼成することにより形成された半円筒形状の突起
部、（３）は該突起部（２）上形成された、抵抗薄膜を
一部露出させ形成し配列された複数個の発熱素子、
（５）は複数個の発熱素子（３）が接続される共通電
極、（６）は各発熱素子（３）個々から引き出された個
別電極、（７）は発熱素子（３）、共通電極（５）、個
別電極（６）を被う、例えばSiO2,Ta2O5等からなる保護
膜で、インクリボン（９）による摩耗防止膜となる。ま
た、第４図は第３図の等価回路であり、図において、Ｒ
は発熱素子（３）の抵抗値を,r1,r2は共通電極（５）の
微少配線パターン抵抗値を示している。第４図では共通
電極（５）からＶなる印加電圧を加え、個別電極（６）
を記録情報に応じてオン・オフするスイツチング素子sw
に接続し、接地することにより、個々の発熱素子（３）
にパルス電圧を印加することを示している。ところで、
第４図において例えば発熱素子（３）が１個ずつ接地さ
れた場合、実際に発熱素子（３）個々に加えられる印加
電圧は異なり、発熱素子（３）の個数をｎとすると共通
電極端子から最も離れた発熱素子では、RV/（Ｒ＋nr1＋
r2）なる印加電圧となり、最も近い発熱素子ではRV/
（Ｒ＋r2）なる印加電圧となつてしまう。さらに全発熱
素子ON、数個の発熱素子ON時でもこのような印加電圧の
差異が生じ発熱素子（３）個々の発熱温度が異なり、印
字dot形状が異なり、ひいては印字品位の悪化につなが
る。FIG. 3 shows a perspective view (FIG. 3 (A)) and a sectional view taken along line LM (FIG. 3 (B)) showing a conventional thermal head. (1) is an insulating substrate such as a ceramic substrate, and (2) is a semi-cylindrical projection formed by printing a glass having a thickness of several tens of microns on the insulating substrate (1) and firing it at several hundred degrees. (3) a plurality of heating elements formed on the protruding portion (2) and formed by partially exposing the resistive thin film and arranged;
(5) is a common electrode to which a plurality of heating elements (3) are connected, (6) is an individual electrode extracted from each heating element (3), and (7) is a heating element (3) and a common electrode (7). 5) A protective film that covers the individual electrodes (6) and is made of, for example, SiO 2 , Ta 2 O 5, etc., and serves as a film for preventing abrasion by the ink ribbon (9). FIG. 4 is an equivalent circuit of FIG.
Denotes the resistance value of the heating element (3), and r 1 and r 2 denote the resistance values of the minute wiring pattern of the common electrode (5). In FIG. 4, an applied voltage of V is applied from the common electrode (5) to the individual electrode (6).
Switching element sw for turning on and off according to recording information
To the individual heating elements (3)
Indicates that a pulse voltage is applied. by the way,
In FIG. 4, for example, when the heating elements (3) are grounded one by one, the applied voltage actually applied to each heating element (3) differs, and when the number of heating elements (3) is n, the common electrode terminal In the farthest heating element, RV / (R + nr 1 +
r 2 ) The applied voltage is RV /
(R + r 2 ). Further, even when all of the heating elements are ON and several heating elements are ON, such a difference in the applied voltage occurs, and the heating temperature of each heating element (3) is different, the dot shape of the printing is different, and the printing quality is deteriorated.
これを解決するには共通電極（５）の微少配線パター
ン抵抗r1,r2をゼロに限りなく近づけることが必要であ
り、印字品位の満足できる範囲でr1,r2の値が決定さ
れ、共通電極（５）のパターン幅が決定されることにな
る。したがつて、絶縁基板（１）端から突起部（２）上
の発熱素子（３）までの距離は、決定された共通電極
（５）のパターン幅にて決定され、短かくできないこと
になつてしまい、サーマルヘツドの小型化が難しいこと
になる。In order to solve this, it is necessary to make the minute wiring pattern resistances r 1 and r 2 of the common electrode (5) as close as possible to zero, and the values of r 1 and r 2 are determined within a range where the printing quality can be satisfied. , The pattern width of the common electrode (5) is determined. Therefore, the distance from the end of the insulating substrate (1) to the heating element (3) on the protrusion (2) is determined by the determined pattern width of the common electrode (5), and cannot be shortened. This makes it difficult to reduce the size of the thermal head.
ところで、第５図に示す実際のシリアルプリンタでは
図中、Ｂの矢印方向へのサーマルヘツド（８）の走行
は、第６図に示すごとく、走行方向に対し、傾く場合も
あり、絶縁基板（１）の端面の角部とインクリボン
（９）とが接し、場合によつては、普通紙（10）へのス
ジ引きのような印字となつたり、インクリボンが切れて
しまつたりする。By the way, in the actual serial printer shown in FIG. 5, the traveling of the thermal head (8) in the direction of the arrow B in the drawing may be inclined with respect to the traveling direction as shown in FIG. The corner of the end face of 1) comes in contact with the ink ribbon (9), and depending on the case, printing such as streaking on plain paper (10) may occur, or the ink ribbon may break.
［発明が解決しようとする課題］ このため、絶縁基板の端部の角部にインクリボンが接
しないように絶縁基板の端部に面取り部を形成するが、
この面取り部をサーマルヘッドの形成後に研磨加工を施
すこと等により形成するとすれば、突起部を研磨してし
まったり、研磨面に導体が露出したりする等の不具合が
生ずるという問題があった。[Problem to be Solved by the Invention] For this reason, a chamfered portion is formed at the end of the insulating substrate so that the ink ribbon does not contact the corner of the end of the insulating substrate.
If the chamfered portion is formed by polishing after forming the thermal head, there is a problem that the protrusions are polished or the conductor is exposed on the polished surface.
そこで、この発明は上記のような問題点を解消するた
めになされたもので、熱転写インクリボンが切れること
なく、信頼性の高いサーマルヘッドの製造方法を提供す
ることを目的とする。SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing a thermal head with high reliability without breaking a thermal transfer ink ribbon.
［課題を解決するための手段］ この発明におけるサーマルヘッドの製造方法は、セラ
ミックからなる絶縁基板の端部にその平面と所定の傾き
の面取り部を形成する工程と、この工程後に前記絶縁基
板の平面における前記面取り部の近傍にガラス層の突起
部を設ける工程と、この突起部上に複数個の発熱素子を
配設する工程と、これらの発熱素子に接続される導体パ
ターンを前記面取り部に延設する工程と、前記導体パタ
ーンを保護膜により覆う工程とを備え、前記発熱素子上
を通過する熱転写インクリボンを前記面取り部の方向に
走行させることを特徴とするものである。[Means for Solving the Problems] A method of manufacturing a thermal head according to the present invention includes a step of forming a chamfer with a predetermined inclination with respect to a plane of an insulating substrate made of ceramic, and after this step, Providing a protruding portion of the glass layer near the chamfered portion in the plane, arranging a plurality of heating elements on the protruding portion, and providing a conductor pattern connected to these heating elements to the chamfered portion. The method includes a step of extending and a step of covering the conductive pattern with a protective film, wherein the thermal transfer ink ribbon passing over the heating element is caused to travel in a direction of the chamfered portion.
以下、この発明の一実施例を図について説明する。第
１図，第２図はこの発明の実施例である。まず第１図に
ついて説明する。第１図において、（１）は例えばセラ
ミツク基板のような絶縁基板、（４）は該絶縁基板端面
を研摩した面取り部、（２）は絶縁基板（１）上と、面
取り部（４）との境界部分に数十ミクロンの厚みのガラ
スを印刷、数百度で焼成することにより形成された、半
円筒形状の突起部、（３）は、該突起部（２）上に形成
された、抵抗薄膜を一部露出させ形成し配列された複数
個の発熱素子、（５）は面取り部（４）上に配置された
複数個の発熱素子（３）が接続される共通電極、（６）
は各発熱素子（３）個々から引き出された個別電極、
（７）は発熱素子（３）、共通電極（５）、個別電極
（６）を被う、例えばSiO2,Ta2O5等からなる保護膜で、
インクリボン（９）による摩耗防止膜となるものであ
る。An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 show an embodiment of the present invention. First, FIG. 1 will be described. In FIG. 1, (1) is an insulating substrate such as a ceramic substrate, (4) is a chamfered portion obtained by polishing an end surface of the insulating substrate, (2) is a portion on the insulating substrate (1) and a chamfered portion (4). A semi-cylindrical projection formed by printing a glass having a thickness of several tens of microns on the boundary portion of the substrate and firing the glass at a temperature of several hundred degrees, (3) is a resistor formed on the projection (2). A plurality of heating elements formed by partially exposing the thin film and arranged; (5) a common electrode to which a plurality of heating elements (3) arranged on a chamfered part (4) are connected; (6)
Is an individual electrode drawn from each heating element (3),
(7) is a protective film that covers the heating element (3), the common electrode (5), and the individual electrode (6) and is made of, for example, SiO 2 , Ta 2 O 5, and the like.
It serves as a film for preventing abrasion by the ink ribbon (9).
又、第２図において第１図と同一符号部分は同一又は
相当部分を示す。In FIG. 2, the same reference numerals as those in FIG. 1 indicate the same or corresponding parts.
次に本発明のサーマルヘツドの動作について説明す
る。第６図は本発明に係るサーマルヘツドを装着したシ
リアルプリンタを示す。第６図に示すように、シリアル
プリンタにおけるサーマルヘツド（８）の傾きが生じた
としても、突起部（２）の境界部分から面取り部（４）
としていることにより、インクリボンカセツト（12）へ
のインクリボン（９）搬送時に、絶縁基板端面の角部と
インクリボン（９）との接触がなくなり、普通紙（10）
へのスジ引き印字がなく、また、インクリボン（９）が
切れることも起こらない。また、面取り部（４）の斜面
を共通電極（５）とすることにより平面に共通電極
（５）を配置した場合に比べ、共通電極（５）のパター
ン幅が広くとれ、配線パターン抵抗をより小さくでき、
より印字品位が良いものとなる。また、絶縁基板（１）
全体を小さくでき、サーマルヘツドをより小型にするこ
とができる。Next, the operation of the thermal head of the present invention will be described. FIG. 6 shows a serial printer equipped with a thermal head according to the present invention. As shown in FIG. 6, even if the thermal head (8) of the serial printer is tilted, the chamfered portion (4) starts from the boundary of the protrusion (2).
As a result, when the ink ribbon (9) is conveyed to the ink ribbon cassette (12), there is no contact between the corner of the insulating substrate end face and the ink ribbon (9), and the plain paper (10)
No streak printing is performed on the ink ribbon, and the ink ribbon (9) does not break. Further, by making the inclined surface of the chamfered portion (4) a common electrode (5), the pattern width of the common electrode (5) can be made wider than in the case where the common electrode (5) is arranged on a plane, and the wiring pattern resistance can be further increased. Can be made smaller,
The print quality is better. Also, an insulating substrate (1)
The whole can be made smaller, and the thermal head can be made smaller.
なお、上記実施例では、絶縁基板（１）の突起部
（２）形成位置の境界部分から面取り部（４）を設ける
ことについて示したが、第２図に示すごとく、突起部
（２）下面より面取り部（４）を設けてもよく、また、
より共通電極（５）の配線パターン抵抗を小さくするた
め、絶縁基板（１）の面取り部（４）上を表面相度の良
いガラスのようなもので被い、その上に共通電極（５）
を配置してもよく、上記実施例と同様の効果を奏する。In the above embodiment, the chamfered portion (4) is provided from the boundary portion of the insulating substrate (1) where the protrusion (2) is formed. However, as shown in FIG. 2, the lower surface of the protrusion (2) is provided. A more chamfered portion (4) may be provided,
In order to further reduce the wiring pattern resistance of the common electrode (5), the chamfered portion (4) of the insulating substrate (1) is covered with a material such as glass having a good surface compatibility, and the common electrode (5) is placed thereon.
May be arranged, and the same effect as in the above embodiment can be obtained.
以上のように、この発明によれば熱転写インクリボン
が切れるのを防止できると共に、前記面取り部の形成の
後に前記突起部等を形成するので、前記面取り部の形成
が容易となり、前記突起部の研磨や導体の露出がなくな
り、信頼性の高いサーマルヘッドを得ることができる。As described above, according to the present invention, the thermal transfer ink ribbon can be prevented from being cut, and the projections and the like are formed after the formation of the chamfered portions. Therefore, the formation of the chamfered portions is facilitated, and the formation of the projections is facilitated. Polishing and exposure of the conductor are eliminated, and a highly reliable thermal head can be obtained.
第１図はこの発明の一実施例によるサーマルヘツドを示
す斜視図（第１図（Ａ））及びＬ−Ｍ断面図（第１図
（Ｂ））、第２図はこの発明の他の実施例のサーマルヘ
ツドを示す斜視図（第２図（Ａ））、及びＬ−Ｍ断面図
（第２図（Ｂ））、第３図は従来のサーマルヘツドを示
す斜視図（第３図（Ａ））、及びＬ−Ｍ断面図（第３図
（Ｂ））、第４図はサーマルヘツドの等価回路を示す
図、第５図，第６図は熱転写方式のシリアルプリンタを
示す図である。（１）は絶縁基板、（２）は突起部、
（３）は発熱素子、（４）は面取り部、（５）は共通電
極。なお、図中同一符号は同一、又は相当部分を示す。FIG. 1 is a perspective view (FIG. 1 (A)) and LM sectional view (FIG. 1 (B)) showing a thermal head according to an embodiment of the present invention, and FIG. 2 is another embodiment of the present invention. A perspective view (FIG. 2 (A)) showing the example thermal head, a sectional view taken along line LM (FIG. 2 (B)), and FIG. 3 is a perspective view showing a conventional thermal head (FIG. 3 (A)). )), LM cross section (FIG. 3 (B)), FIG. 4 is a diagram showing an equivalent circuit of a thermal head, and FIGS. 5 and 6 are diagrams showing a thermal transfer type serial printer. (1) is an insulating substrate, (2) is a protrusion,
(3) is a heating element, (4) is a chamfer, and (5) is a common electrode. In the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (1)
平面と所定の傾きの面取り部を形成する工程と、この工
程後に前記絶縁基板の平面における前記面取り部の近傍
にガラス層の突起部を設ける工程と、この突起部上に複
数個の発熱素子を配設する工程と、これらの発熱素子に
接続される導体パターンを前記面取り部に延設する工程
と、前記導体パターンを保護膜により覆う工程とを備
え、前記発熱素子上を通過する熱転写インクリボンを前
記面取り部の方向に走行させることを特徴とするサーマ
ルヘッドの製造方法。1. A step of forming a chamfer at an end of an insulating substrate made of ceramic at a predetermined inclination with respect to a plane thereof, and after this step, forming a projection of a glass layer near the chamfer on the plane of the insulating substrate. Providing, arranging a plurality of heating elements on the projections, extending a conductor pattern connected to the heating elements to the chamfered portion, and covering the conductor pattern with a protective film. And causing the thermal transfer ink ribbon passing over the heating element to run in the direction of the chamfered portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60251790A JP2586008B2 (en) | 1985-11-09 | 1985-11-09 | Manufacturing method of thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60251790A JP2586008B2 (en) | 1985-11-09 | 1985-11-09 | Manufacturing method of thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62111765A JPS62111765A (en) | 1987-05-22 |
| JP2586008B2 true JP2586008B2 (en) | 1997-02-26 |
Family
ID=17227971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60251790A Expired - Lifetime JP2586008B2 (en) | 1985-11-09 | 1985-11-09 | Manufacturing method of thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2586008B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2578140B2 (en) * | 1987-11-18 | 1997-02-05 | ローム株式会社 | Manufacturing method of thermal head |
| DE69005014T2 (en) * | 1989-04-26 | 1994-08-18 | Seiko Epson Corp | Thermal print head and process for its manufacture. |
| JP2651724B2 (en) * | 1989-10-04 | 1997-09-10 | 日本特殊陶業株式会社 | Glaze substrate for thermal head and method of manufacturing the same |
| TW212157B (en) * | 1991-01-30 | 1993-09-01 | Rohm Co Ltd | |
| US5483736A (en) * | 1993-06-08 | 1996-01-16 | Rohm Co., Ltd. | Method of manufacturing a corner head type thermal head |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876745U (en) * | 1981-11-18 | 1983-05-24 | エプソン株式会社 | thermal head |
| JPS6038178A (en) * | 1983-08-11 | 1985-02-27 | Mitsubishi Electric Corp | Thermal head |
| JPH0446929Y2 (en) * | 1985-04-10 | 1992-11-05 |
-
1985
- 1985-11-09 JP JP60251790A patent/JP2586008B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62111765A (en) | 1987-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |