JP2579195B2 - Copper-clad insulating film for printed wiring boards - Google Patents
Copper-clad insulating film for printed wiring boardsInfo
- Publication number
- JP2579195B2 JP2579195B2 JP63209341A JP20934188A JP2579195B2 JP 2579195 B2 JP2579195 B2 JP 2579195B2 JP 63209341 A JP63209341 A JP 63209341A JP 20934188 A JP20934188 A JP 20934188A JP 2579195 B2 JP2579195 B2 JP 2579195B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- insulating film
- insulating layer
- clad
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は、サブトラクティブ法によって配線板を製造
する際に使用される銅張り絶縁フィルムに関し、具体的
には、エッチング処理により回路が形成される銅箔層と
内層回路に対し絶縁機能を有する有機層（以下、絶縁層
という）から構成される銅張り絶縁フィルムに関する。Description: TECHNICAL FIELD The present invention relates to a copper-clad insulating film used when manufacturing a wiring board by a subtractive method, and more specifically, a circuit is formed by an etching process. The present invention relates to a copper-clad insulating film composed of a copper foil layer and an organic layer having an insulating function for an inner circuit (hereinafter, referred to as an insulating layer).
近年、サブトラクティブ法によって得られる配線板
は、複数層の導電回路を絶縁層を介して積層させたもの
で、電気製品等の部品として種々利用されている。この
配線板の製造は、例えば、第２図（Ａ）に示される絶縁
基板１の両面に銅パターン２を設けたプリント回路板３
の両面に、第２図（Ｂ）に示されるようにガラスエポキ
シプリプレグ７（ガラス繊維にエポキシ樹脂を含浸させ
たプリプレグ）を介して銅箔５を配して成形することに
より行われる。この銅箔５にはエッチング処理により回
路が形成される。なお、第２図（Ａ）に示されるプリン
ト回路板３としては、通常の銅張り積層板でサブトラク
ティブ法により作製されたものが一般的である。2. Description of the Related Art In recent years, wiring boards obtained by a subtractive method are obtained by laminating a plurality of conductive circuits with an insulating layer interposed therebetween, and are variously used as components of electric products and the like. This wiring board is manufactured by, for example, a printed circuit board 3 having copper patterns 2 provided on both sides of an insulating substrate 1 shown in FIG. 2 (A).
As shown in FIG. 2 (B), a copper foil 5 is arranged and molded on both sides of a glass epoxy prepreg 7 (prepreg in which glass fiber is impregnated with an epoxy resin) as shown in FIG. 2 (B). A circuit is formed on the copper foil 5 by an etching process. The printed circuit board 3 shown in FIG. 2 (A) is generally a copper-clad laminate manufactured by a subtractive method.
しかしながら、このように配線板を製造する場合、ガ
ラスエポキシプリプレグ７内から空気を除去しなければ
ならないために、高温高圧下（例えば、170℃、40kg/cm
2）で成形が行われるので、得られる配線板に熱歪や加
圧歪が残留したり、最終的に得られる回路板に回路パタ
ーン不良が生じたりするなどの問題がある。However, when the wiring board is manufactured in this manner, since air must be removed from the inside of the glass epoxy prepreg 7, high temperature and high pressure (for example, 170 ° C., 40 kg / cm)
Since the molding is performed in 2 ), there are problems such as heat distortion and pressure distortion remaining in the obtained wiring board and circuit pattern defects in the finally obtained circuit board.
本発明は、上述したサブトラクティブ法の従来技術に
おける問題点を排除するためになされたものであって、
配線板の製造に際し第２図（Ａ）に示されるようなプリ
ント回路板に積層させて用いる銅張り絶縁フィルムを提
供することを目的とする。The present invention has been made in order to eliminate the problems in the prior art of the subtractive method described above,
An object of the present invention is to provide a copper-clad insulating film which is used by being laminated on a printed circuit board as shown in FIG. 2 (A) when manufacturing a wiring board.
このため、本発明は、エポキシ樹脂およびアクリロニ
トリル・ブタジエンゴムを主成分とする絶縁層に銅箔を
積層させてなり、前記絶縁層は未硬化であってかつ80℃
〜120℃の温度範囲での粘度が103〜105ポイズであるプ
リント配線板用銅張り絶縁フィルムを要旨とするもので
ある。For this reason, the present invention is obtained by laminating a copper foil on an insulating layer mainly composed of an epoxy resin and acrylonitrile-butadiene rubber, and the insulating layer is uncured and 80 ° C.
A gist of the present invention is a copper-clad insulating film for a printed wiring board having a viscosity of 10 3 to 10 5 poise in a temperature range of up to 120 ° C.
以下、図を参照して本発明の構成につき詳しく説明す
る。Hereinafter, the configuration of the present invention will be described in detail with reference to the drawings.
第１図は、本発明のプリント配線板用銅張り絶縁フィ
ルムの一例の断面説明図である。第１図において、銅張
り絶縁フィルムＭは絶縁層４と銅箔５からなる。FIG. 1 is an explanatory sectional view of an example of a copper-clad insulating film for a printed wiring board according to the present invention. In FIG. 1, the copper-clad insulating film M includes an insulating layer 4 and a copper foil 5.
絶縁層４は、エポキシ樹脂とアクリロニトリル・ブタ
ジエンゴム（NBR）からなる配合物である。NBRとして
は、アクリロニトリル含量20〜50％、ムーニー粘度（ML
1+4、100℃）25〜80の範囲のものが好ましく用いられ
る。この配合物の配合割合は、エポキシ樹脂/NBR（重量
比）＝30/70〜90/10であるとよい。30/70未満では（エ
ポキシ樹脂30未満又はNBR70超）、層間絶縁性が低下す
ると共に流動性が低下するため、内層回路板（プリント
回路板）への積層に際して回路間への流れ込みが不十分
となる。90/10超では（エポキシ樹脂90超又はNBR10未
満）、内層回路板の銅パターンとの密着性が低下し、内
層回路板への積層に際して流動性が過大となり、さらに
加熱硬化時に樹脂流れが起こり層間の厚み保持が困難と
なる。The insulating layer 4 is a compound composed of an epoxy resin and acrylonitrile-butadiene rubber (NBR). As NBR, acrylonitrile content 20-50%, Mooney viscosity (ML
(1 + 4 , 100 ° C) in the range of 25 to 80 is preferably used. The compounding ratio of this compound is preferably epoxy resin / NBR (weight ratio) = 30/70 to 90/10. If it is less than 30/70 (epoxy resin less than 30 or more than NBR70), the interlayer insulation will decrease and the fluidity will decrease. Become. If it exceeds 90/10 (epoxy resin is more than 90 or less than NBR10), the adhesion to the copper pattern of the inner circuit board will be reduced, the fluidity will be excessive when laminating to the inner circuit board, and the resin will flow during heat curing. It becomes difficult to maintain the thickness between layers.
銅箔５としては、特に限定されるものではないが、一
般的には電解銅箔が用いられ、厚みは18μ（1/2オン
ス）が一般的である。The copper foil 5 is not particularly limited, but generally, an electrolytic copper foil is used, and the thickness is generally 18 μ (オ ン ounce).
絶縁層４は内層回路板への積層に際し内層回路板の銅
パターンとの密着性の向上のために未硬化の状態にあ
る。未硬化の状態の絶縁層４の内層回路板への積層時の
温度範囲（80℃〜120℃）の粘度は、103〜105ポイズの
範囲にある。103ポイズ未満では流動性が過大となり、
絶縁層としての厚み保持が困難となる。105ポイズ超で
は回路間への流れ込みが不十分となる。The insulating layer 4 is in an uncured state in order to improve the adhesion to the copper pattern of the inner layer circuit board when being laminated on the inner layer circuit board. The viscosity in the temperature range (80 ° C. to 120 ° C.) at the time of laminating the uncured insulating layer 4 on the inner circuit board is in the range of 10 3 to 10 5 poise. If less than 10 3 poise, the liquidity will be excessive,
It becomes difficult to maintain the thickness of the insulating layer. With more than 10 5 poise, the flow between the circuits is insufficient.
絶縁層４が未硬化であるので、銅張り絶縁フィルムＭ
の取り扱いの便宜のために、絶縁層４の銅箔５の反対側
の面に離型フィルムを積層させておくとよい。この離型
フィルムは、絶縁層４の内層回路板への積層時（すなわ
ち、銅張り絶縁フィルムＭの使用時）に剥がせばよい。
積層後、絶縁層４は加熱硬化される。この場合に用いる
離型フィルムとしては、例えば、シリコン処理したポリ
エチレンテレフタレートフィルム（PET）、シリコン処
理したポリエステルフィルム、離型紙、アルミ箔などの
金属箔にワックス等で離型処理したものなど離型性のあ
るものであればよい。Since the insulating layer 4 is uncured, the copper-clad insulating film M
For convenience of handling, a release film may be laminated on the surface of the insulating layer 4 opposite to the copper foil 5. This release film may be peeled off when the insulating layer 4 is laminated on the inner circuit board (that is, when the copper-clad insulating film M is used).
After lamination, the insulating layer 4 is cured by heating. The release film used in this case includes, for example, a silicon-treated polyethylene terephthalate film (PET), a silicon-treated polyester film, a release paper, and a film obtained by releasing a metal foil such as an aluminum foil with a wax or the like. Anything can be used.
また、絶縁層４と銅箔５との間に硬化した樹脂層を介
在させてもよい。これによって、銅箔５に対する絶縁性
をさらに高めることができる。この樹脂層としては、エ
ポキシ樹脂/NBRの層、エポキシ樹脂層、アクリル樹脂
層、ポリイミド樹脂層等である。当然、硬化した樹脂層
は絶縁層４と同じ組成のものでもよい。Further, a cured resin layer may be interposed between the insulating layer 4 and the copper foil 5. Thereby, the insulating property with respect to the copper foil 5 can be further enhanced. The resin layer includes an epoxy resin / NBR layer, an epoxy resin layer, an acrylic resin layer, a polyimide resin layer, and the like. Naturally, the cured resin layer may have the same composition as the insulating layer 4.
このようにして得られる本発明の銅張り積層フィルム
は、第２図（Ａ）に示されるようなプリント回路板に積
層させ、銅箔５を常法によりエッチング処理することに
より表面に回路パターンを形成させることができる。The copper-clad laminate film of the present invention thus obtained is laminated on a printed circuit board as shown in FIG. 2 (A), and a copper foil 5 is etched by a conventional method to form a circuit pattern on the surface. Can be formed.
以下に実施例を示す。 Examples will be described below.
実施例１ エポキシ樹脂（ビスフェノール・エピクロルヒドリンタ
イプ、エポキシ当量500） 100 重量部 NBR（ニトリル含量33％、ML1+4,100℃＝51）40 重量部 炭酸カルシウム 50 重量部 イミダゾール化合物 ８ 重量部 パーオキシド １ 重量部 添加剤 0.5重量部 上記配合の45％MEK溶液（メチルエチルケトン溶液）
をつくり、この溶液を外層用銅箔TC（厚さ18μ、日鉱グ
ールド・フォイル社製）に乾燥厚み200μとなるように
２度に分けてコートし、銅張り絶縁フィルムを作製し
た。絶縁層について、内層回路板への積層時の温度範囲
（80℃〜120℃）にてDMA（Dynamic Mechanical Analysi
s）により粘度を測定したところ、120℃で5000ポイズ、
100℃で35000ポイズ、80℃で80000ポイズであった。Example 1 Epoxy resin (bisphenol / epichlorohydrin type, epoxy equivalent 500) 100 parts by weight NBR (nitrile content 33%, ML 1 + 4 , 100 ° C. = 51) 40 parts by weight Calcium carbonate 50 parts by weight Imidazole compound 8 parts by weight Peroxide 1 Parts by weight Additives 0.5 parts by weight 45% MEK solution (Methyl ethyl ketone solution)
This solution was coated twice on an outer layer copper foil TC (18 μm thick, manufactured by Nikko Gould Foil Co., Ltd.) so as to have a dry thickness of 200 μm, thereby producing a copper-clad insulating film. For the insulating layer, use a DMA (Dynamic Mechanical Analysi) in the temperature range (80 ° C to 120 ° C) when laminating to the inner circuit board.
The viscosity was measured according to s).
It was 35,000 poise at 100 ° C and 80,000 poise at 80 ° C.
この銅張り絶縁フィルムをラインアンドスペース（L/
S）0.5mmの櫛歯回路（70μ厚電解銅）を有する回路板へ
絶縁層が該回路板に接するように真空ラミネーションし
（100℃、40トール）、回路間への流れ込み性を確認し
たところ、ボイドレスで良好なものが得られた。This copper-clad insulating film is line and space (L /
S) Vacuum lamination (100 ° C, 40 Torr) on a circuit board having a 0.5 mm comb-tooth circuit (70μ thick electrolytic copper) so that the insulating layer is in contact with the circuit board, and the flowability between the circuits was confirmed. , A good thing was obtained with a void dress.
つぎに、この銅張り絶縁フィルム−ラミネーション基
板をアルミ製のカールプレート上に置き、内部を５トー
ルまで減圧状態にしたオートクレーブ中で7kg/cm2の加
圧下で１時間硬化処理した。得られた積層成形品は、絶
縁層の厚みが均一で、外層銅箔の密着性、260℃におけ
るはんだ耐熱性が共に良好であった。Next, the copper-clad insulating film-lamination substrate was placed on an aluminum curl plate, and cured for 1 hour under a pressure of 7 kg / cm 2 in an autoclave in which the pressure was reduced to 5 Torr. The obtained laminated molded product had a uniform thickness of the insulating layer, and had good adhesion to the outer layer copper foil and good solder heat resistance at 260 ° C.
実施例２ エポキシ樹脂（クレゾールノボラックタイプ、エポキシ
当量220） 100 重量部 NBR（ニトリル含量41％、ML1+4,100℃＝63）30 重量部 α型半水石膏 40 重量部 イミダゾール化合物 10 重量部 パーオキシド １ 重量部 添加剤 0.5重量部 上記配合の47％MEK溶液をつくり、この配合物の乾燥
フィルムにつき、内層回路板への積層時の温度範囲（80
℃〜120℃）にてDMA（Dynamic Mechanical Analysis）
により粘度を測定したところ、120℃で3500ポイズ、100
℃で28000ポイズ、80℃で60000ポイズであった。Example 2 Epoxy resin (cresol novolak type, epoxy equivalent 220) 100 parts by weight NBR (nitrile content 41%, ML 1 + 4 , 100 ° C = 63) 30 parts by weight α-type hemihydrate gypsum 40 parts by weight Imidazole compound 10 parts by weight Peroxide 1 part by weight Additive 0.5 part by weight A 47% MEK solution of the above formulation was prepared, and the dry film of this formulation was subjected to a temperature range (80
DMA (Dynamic Mechanical Analysis)
The viscosity was measured at 3500 poise at 120 ° C, 100
It was 28,000 poise at 80 ° C and 60,000 poise at 80 ° C.
上記溶液を実施例１におけると同様に外層用銅箔TC
（厚さ18μ、日鉱グールド・フォイル社製）に乾燥厚み
200μとなるように２度に分けてコートし、銅張り絶縁
フィルムを作製した。The above solution was applied to the outer layer copper foil TC in the same manner as in Example 1.
(18μ thick, manufactured by Nikko Gould Foil Co.)
Coating was performed twice so as to have a thickness of 200 μm, thereby producing a copper-clad insulating film.
この銅張り絶縁フィルムを実施例１におけると同様に
真空ラミネーションし（80℃、20トール）、回路間への
流れ込み性を確認したところ、ポイドレスで良好なもの
が得られた。This copper-clad insulating film was subjected to vacuum lamination (80 ° C., 20 Torr) in the same manner as in Example 1 and the flowability between the circuits was confirmed.
つぎに、この銅張り絶縁フィルム−ラミネーション基
板を真空プレスを用い、50トールの真空下で150℃、１
時間プレス圧10kg/cm2の条件で硬化処理した。得られた
積層成形品は、絶縁層の厚みが均一で、外層銅箔の密着
性、260℃におけるはんだ耐熱性が共に良好であった。Next, the copper-clad insulating film-lamination substrate was heated at 150 ° C. under a vacuum of 50 torr using a vacuum press.
Curing was performed under the conditions of a time press pressure of 10 kg / cm 2 . The obtained laminated molded product had a uniform thickness of the insulating layer, good adhesion of the outer layer copper foil, and good solder heat resistance at 260 ° C.
以上説明したように本発明によれば、絶縁層にボイド
の発生のない品質の安定した銅張り絶縁フィルムが得ら
れる。配線板の製造に際しては、第２図（Ａ）に示され
るようなプリント回路板にこの銅張り絶縁フィルムを積
層させればよいので、従来に比し配線板の製造工程を簡
略化できると共に信頼性の高い配線板を得ることができ
る。また、本発明の銅張り絶縁フィルムは銅箔と絶縁層
とからなるため、絶縁層の厚さを変更することにより層
間絶縁特性を容易に調整することが可能となる。As described above, according to the present invention, a stable copper-clad insulating film having no voids in the insulating layer can be obtained. When the wiring board is manufactured, the copper-clad insulating film may be laminated on a printed circuit board as shown in FIG. 2 (A). It is possible to obtain a high-performance wiring board. Further, since the copper-clad insulating film of the present invention is composed of a copper foil and an insulating layer, the interlayer insulating characteristics can be easily adjusted by changing the thickness of the insulating layer.
第１図は本発明のプリント配線板用銅張り絶縁フィルム
の一例の断面説明図、第２図（Ａ）〜第２図（Ｂ）はサ
ブトラクティブ法による従来の配線板の製造工程を示す
説明図である。 １……絶縁基板、２……銅パターン、３……プリント回
路板、４……絶縁層、５……銅箔、７……ガラスエポキ
シプリプレグ。FIG. 1 is a cross-sectional explanatory view of an example of a copper-clad insulating film for a printed wiring board according to the present invention, and FIGS. 2 (A) to 2 (B) show a conventional wiring board manufacturing process by a subtractive method. FIG. DESCRIPTION OF SYMBOLS 1 ... Insulating board, 2 ... Copper pattern, 3 ... Printed circuit board, 4 ... Insulating layer, 5 ... Copper foil, 7 ... Glass epoxy prepreg.
Claims (2)
タジエンゴムを主成分とする絶縁層に銅箔を積層させて
なり、前記絶縁層は未硬化であってかつ80℃〜120℃の
温度範囲での粘度が103〜105ポイズであるプリント配線
板用銅張り絶縁フィルム。1. An insulating layer mainly composed of an epoxy resin and acrylonitrile-butadiene rubber laminated with a copper foil, said insulating layer being uncured and having a viscosity in a temperature range of 80 ° C. to 120 ° C. 10 3 to 10 5 poise copper-clad insulating film for printed wiring boards.
在させた請求項１記載のプリント配線板用銅張り絶縁フ
ィルム。2. The copper-clad insulating film for a printed wiring board according to claim 1, wherein a cured resin layer is interposed between the insulating layer and the copper foil.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63209341A JP2579195B2 (en) | 1988-08-25 | 1988-08-25 | Copper-clad insulating film for printed wiring boards |
| US07/397,790 US4985294A (en) | 1988-08-25 | 1989-08-24 | Printed wiring board |
| KR1019890012090A KR0158199B1 (en) | 1988-08-25 | 1989-08-24 | Printed wiring board |
| GB8919429A GB2224464B (en) | 1988-08-25 | 1989-08-25 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63209341A JP2579195B2 (en) | 1988-08-25 | 1988-08-25 | Copper-clad insulating film for printed wiring boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0258885A JPH0258885A (en) | 1990-02-28 |
| JP2579195B2 true JP2579195B2 (en) | 1997-02-05 |
Family
ID=16571346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63209341A Expired - Lifetime JP2579195B2 (en) | 1988-08-25 | 1988-08-25 | Copper-clad insulating film for printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2579195B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2257707B (en) * | 1991-05-27 | 1995-11-01 | Nippon Zeon Co | Adhesive composition |
| EP0843509B1 (en) * | 1995-07-04 | 2003-08-27 | MITSUI MINING & SMELTING CO., LTD. | Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil |
| US6129998A (en) * | 1998-04-10 | 2000-10-10 | R.E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
| US6355360B1 (en) | 1998-04-10 | 2002-03-12 | R.E. Service Company, Inc. | Separator sheet laminate for use in the manufacture of printed circuit boards |
| US6129990A (en) * | 1998-04-10 | 2000-10-10 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
| US6127051A (en) * | 1998-04-10 | 2000-10-03 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
| US6783860B1 (en) | 2001-05-11 | 2004-08-31 | R. E. Service Company, Inc. | Laminated entry and exit material for drilling printed circuit boards |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5420657B2 (en) * | 1972-06-19 | 1979-07-24 | ||
| JPS53101051A (en) * | 1977-02-15 | 1978-09-04 | Matsushita Electric Works Ltd | Epoxy resin composition |
-
1988
- 1988-08-25 JP JP63209341A patent/JP2579195B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0258885A (en) | 1990-02-28 |
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