JP2561992B2 - Electromagnetic wave shield plastic molding - Google Patents
Electromagnetic wave shield plastic moldingInfo
- Publication number
- JP2561992B2 JP2561992B2 JP4298940A JP29894092A JP2561992B2 JP 2561992 B2 JP2561992 B2 JP 2561992B2 JP 4298940 A JP4298940 A JP 4298940A JP 29894092 A JP29894092 A JP 29894092A JP 2561992 B2 JP2561992 B2 JP 2561992B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- copper
- electromagnetic wave
- plastic molded
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、電磁波シールドプラ
スチック成形品に関するものである。さらに詳しくは、
電信機器、計算機、計測機器等の電磁波シールド効果に
優れ、しかも簡便で、低コスト生産が可能な、高性能電
磁波シールドプラスチック成形品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shielding plastic molded product. For more information,
The present invention relates to a high-performance electromagnetic shielding plastic molded product which is excellent in electromagnetic shielding effect for telegraph equipment, calculators, measuring instruments, etc., is simple, and can be produced at low cost.
【０００２】[0002]
【従来の技術とその課題】従来より、各種の電気・電子
機器、通信機器等には、様々な電磁波シールド構造が採
用されてきており、このような構造の一つとして、プラ
スチック成形品の表面に銅、ニッケル、アルミニウム等
の薄膜を真空成膜等により配設したものが知られてい
る。2. Description of the Related Art Conventionally, various electromagnetic wave shield structures have been adopted for various electric / electronic devices, communication devices, etc. One of such structures is the surface of a plastic molded product. It is known that a thin film of copper, nickel, aluminum or the like is provided by vacuum film formation or the like.
【０００３】この従来のものは、たとえば「表面技術」
Ｖｏｌ．４２、Ｎｏ．１、１９９１年１月号、ｐ．２２
〜４３にも記載されているように、 １）導電性塗料の塗布、 ２）真空蒸着、 ３）無電解メッキ、 ４）片面無電解メッキ、 等による成膜構造体が知られている。This conventional one is, for example, "surface technology".
Vol. 42, No. 1, January 1991, p. 22
As described in No. 43 to No. 43, a film forming structure is known which includes 1) application of a conductive paint, 2) vacuum deposition, 3) electroless plating, 4) single-sided electroless plating, and the like.
【０００４】しかしながら、これら従来の電磁波シール
ドプラスチック成形品の場合には、いずれの方式や構造
によるものであっても、依然として充分に満足できる状
況になく、改善すべき多くの課題があった。たとえば、
１）導電性塗料の塗布の場合には、コスト的に安価であ
るものの、シールド効果が低く、特に、周波数が５００
ＭＨｚ以上ではその効果は急速に低下してしまう。３）
無電解メッキによるものは、シールド効果は比較的良好
であるものの、外面化粧塗装を省くことができず、コス
ト高になる。４）片面無電解メッキの場合には、工程が
極めて複雑となり、コスト高は著しいという欠点があ
る。However, in the case of these conventional electromagnetic wave shielding plastic molded products, whichever method or structure, they are still not in a satisfactory condition, and there are many problems to be improved. For example,
1) In the case of applying a conductive paint, the cost is low, but the shield effect is low, and the frequency is 500 in particular.
Above MHz, the effect drops off rapidly. 3)
With the electroless plating, although the shielding effect is relatively good, the external decorative coating cannot be omitted and the cost becomes high. 4) In the case of single-sided electroless plating, the process is extremely complicated and the cost is extremely high.
【０００５】一方、２）真空蒸着によるものは、気相成
膜としての特徴を有しており、今後の発展が期待されて
いるが、電気回路の小型化、高密度化が進む今日、無電
解メッキによるものと同等のシールド特性を得るために
は３〜４μｍの膜厚のアルミニウム等の成膜が必要とさ
れている。しかしながら、この真空蒸着によるシールド
構造においては、３μｍ厚以上の膜厚にすると柱状構造
が著しく成長し、実際には、鉛筆硬度２Ｈ以上の強度が
必要とされるにもかかわらず、この水準の強度を実現す
ることは極めて困難な状況にある。On the other hand, 2) the vacuum vapor deposition has the characteristics of vapor phase film formation and is expected to develop in the future. In order to obtain the same shield characteristics as those obtained by electrolytic plating, it is necessary to form a film of aluminum or the like having a film thickness of 3 to 4 μm. However, in this shield structure formed by vacuum vapor deposition, the columnar structure grows remarkably when the film thickness is 3 μm or more, and although the pencil hardness of 2H or more is actually required, this level of strength is required. It is extremely difficult to realize.
【０００６】しかもまた、環境信頼性試験、たとえば耐
湿試験（６５℃×９５％ＲＨ、１６８時間）、耐湿水噴
霧（ＪＩＳ Ｚ２３７１に準拠：５％ＮａＣｌ溶液、３
５℃、８時間噴霧、１６時間休止のサイクルを４サイク
ル実施）に耐えられない状況にあり、密着性試験（ＡＳ
ＴＭ Ｄ３５５９−７８）においてもクラス３以下にな
ってしまう。In addition, environmental reliability tests such as humidity resistance test (65 ° C. × 95% RH, 168 hours), wet water spray (according to JIS Z2371: 5% NaCl solution, 3)
It is in a situation where it cannot withstand 4 cycles of 5 ° C, 8 hours of spraying, 16 hours of rest), and the adhesion test (AS
Even in TM D3559-78), the class is 3 or less.
【０００７】そして真空蒸着の場合には、導電性塗料の
塗布あるいは無電解メッキの場合に比べてはるかに薬液
の使用は少ないものの、それでも、蒸着に先立ってプラ
スチック成形品の表面をフロン等によって洗浄すること
や、さらにはその表面にプライマーコート層を設けるこ
とが欠かせないため、これらの化学品の廃液、廃ガス処
理が考慮されねばならないという問題もあった。Further, in the case of vacuum vapor deposition, although the use of a chemical solution is far less than in the case of applying a conductive paint or electroless plating, nevertheless, the surface of a plastic molded product is cleaned with flon or the like prior to vapor deposition. In addition, since it is indispensable to provide a primer coat layer on the surface, treatment of waste liquid and waste gas of these chemicals must be considered.
【０００８】この発明は、以上の通りの事情に鑑みてな
されたものであって、従来の電磁波シールド構造体の欠
点を解消し、気相成膜の特徴を生かしつつ、しかも、厚
膜シールド構造においても、その付着強度や耐久性、耐
水性等の特性に優れ、かつ、生産性も良好で、廃液、廃
ガス等の処理負荷も小さい新規な電磁波シールドプラス
チック成形品を提供することを目的としている。The present invention has been made in view of the above circumstances, and solves the drawbacks of the conventional electromagnetic wave shield structure, makes the best use of the characteristics of vapor phase film formation, and yet provides a thick film shield structure. Also in, in order to provide a new electromagnetic wave shielding plastic molded product, which has excellent properties such as adhesion strength, durability, water resistance, and good productivity, and has a small processing load on waste liquid, waste gas, etc. There is.
【０００９】[0009]
【課題を解決するための手段】この発明は、上記の課題
を解決するものとして、あらかじめ洗浄することなく、
フライマーコート層を配設せずにプラスチック成形品表
面に高周波励起プラズマによる0.7 〜5.0 μｍの膜厚の
銅膜を配設し、次いで１０〜３０μｍ厚の銅電メッキ膜
を配設してなる電磁波シールドプラスチック成形品を提
供する。SUMMARY OF THE INVENTION The present invention is to solve the above-mentioned problems, without washing in advance,
Electromagnetic waves obtained by disposing a copper film having a thickness of 0.7 to 5.0 μm by high frequency excitation plasma on the surface of a plastic molded product without disposing a flyer coat layer, and then disposing a copper electroplating film having a thickness of 10 to 30 μm. Provide a shield plastic molded product.
【００１０】また、この発明は、あらかじめ洗浄するこ
となく、プライマーコート層を配設せずにプラスチック
成形品表面に高周波励起プラズマによる0.7 〜5.0 μｍ
の膜厚の銅膜を配設し、次いで１０〜３０μｍ厚の銅電
解メッキ膜を、さらに保護膜を配設してなる電磁波シー
ルドプラスチック成形品をも提供する。この発明の電磁
波シールドプラスチック成形品は、各種のプラスチック
の射出成形、押出成形、注型成形、あるいはそれらの表
面成形したものを含み、その目的、用途に応じて、表面
に配設する高周波励起プラズマによる銅の厚みを0.7 〜
5.0 μｍの適宜なものとする。Further, according to the present invention, the surface of the plastic molded product is 0.7 to 5.0 μm on the surface of the plastic molded product by the high frequency excitation plasma without cleaning in advance and without providing the primer coat layer.
There is also provided an electromagnetic wave shielding plastic molded article comprising a copper film having a thickness of 10 .mu.m, a copper electrolytic plating film having a thickness of 10 to 30 .mu.m, and a protective film. The electromagnetic wave shielded plastic molded product of the present invention includes injection molded, extruded molded, cast molded, or surface-molded products of various plastics, and high-frequency excited plasma to be disposed on the surface according to its purpose and application. Copper thickness from 0.7 to
It shall be 5.0 μm as appropriate.
【００１１】たとえば、１６ビットノートパソコン用の
成形品の場合には、0.7 μｍでよく、３２ビットパソコ
ンの場合には３μｍ以上とすることなどがある。プラス
チック成形品は、この発明の場合には、従来のようにフ
ロン洗浄をあらかじめ行う必要は全くない。高周波励起
プラズマによる表面ボンバード効果により、成形品に付
着している金型油、たとえば摺動油等の洗浄も容易に行
われるからである。オゾン層破壊の問題によって、その
使用が禁止されるフロン、あるいはその代替品に依存す
る必要は全くない。For example, in the case of a molded product for a 16-bit notebook personal computer, it may be 0.7 μm, and in the case of a 32-bit personal computer, it may be 3 μm or more. In the case of the present invention, the plastic molded article does not need to be previously subjected to chlorofluorocarbon cleaning as in the conventional case. This is because the surface bombarding effect of the high frequency excitation plasma facilitates cleaning of the mold oil adhering to the molded product, such as sliding oil. There is no need to rely on CFCs whose use is banned, or their substitutes, due to ozone depletion issues.
【００１２】さらに、従来は真空蒸着に先立って必須と
されていたプラスチック成形品表面へのプライマーコー
ト層の配設も必要がない。このプライマーコート層は、
プラスチック成形品表面と銅成膜との密着性の向上のた
めに欠かせないものであったが、この発明の電磁波シー
ルドプラスチック成形品の場合には、高周波励起プラズ
マによるボンバード粗面化効果、および励起イオン種に
よる活性化堆積作用によって、銅の密着強度は充分とな
る。３μｍ以上の厚膜においても、プライマーコート層
の配設は必要がない。Further, it is not necessary to dispose a primer coat layer on the surface of a plastic molded article which has been conventionally required prior to vacuum vapor deposition. This primer coat layer is
It was indispensable for improving the adhesion between the surface of the plastic molded product and the copper film, but in the case of the electromagnetic wave shielded plastic molded product of the present invention, the bombarded surface roughening effect by the high frequency excitation plasma, and The adhesion strength of copper is sufficient due to the activated deposition action by the excited ion species. It is not necessary to dispose the primer coat layer even in a thick film of 3 μm or more.
【００１３】高周波励起プラズマによる成膜は、たとえ
ば１×１０-4〜１×１０-5Torr水準の真空度とした真空
室において、高周波電源からの電圧印加によって１×１
０-4〜１×１０-3程度の分圧のアルゴン、ヘリウム等の
不活性ガス導入にともなうプラズマ励起によって可能と
なる。低圧グロー放電プラズマである。成膜材料として
の銅は、抵抗加熱、誘導加熱、電子ビーム照射、さらに
はホロカソード放電等による適宜な手段で蒸発させるこ
とができる。これらの蒸発粒子を高周波励起し、イオン
化してプラスチック成形品表面に付着成膜させることに
なる。Film formation by high-frequency excited plasma is performed by applying a voltage from a high-frequency power source in a vacuum chamber having a vacuum degree of 1 × 10 −4 to 1 × 10 −5 Torr, for example, 1 × 1.
This can be achieved by plasma excitation accompanied by the introduction of an inert gas such as argon or helium with a partial pressure of about 0 −4 to 1 × 10 −3 . It is a low-pressure glow discharge plasma. Copper as a film-forming material can be evaporated by an appropriate means such as resistance heating, induction heating, electron beam irradiation, and hollow cathode discharge. These vaporized particles are excited by high frequency, ionized, and adhered to the surface of the plastic molded product to form a film.
【００１４】この高周波励起プラズマについては、これ
まで公知の技術知識を踏まえつつ、適宜に実施すること
ができる。成膜はバッチ方式、あるいは連続方式のいず
れでも可能である。また、この発明においては、このプ
ラズマ蒸着による銅（Ｃｕ）成膜の上に、電解メッキに
より１０〜３０μｍのより厚膜の銅を配設する。この電
解メッキによって、厚膜の銅が容易に形成されることに
なる。The high-frequency excited plasma can be appropriately implemented while taking into consideration the publicly known technical knowledge. The film formation can be performed by either a batch method or a continuous method. Further, in the present invention, a thicker film of copper having a thickness of 10 to 30 μm is provided by electrolytic plating on the copper (Cu) film formed by the plasma deposition. This electrolytic plating facilitates the formation of thick film copper.
【００１５】この場合、プラスチック物品に、直接電解
メッキしようとしても無理であって、化学メッキによる
場合でも、密着性の向上は望めない。電解メッキについ
ては、従来公知の手法を採用することができる。さらに
また、この発明では、電解メッキ膜の上に、銅の錆止め
のためのＮｉ（ニッケル）等の保護膜を配設することも
できる。この保護膜は、耐久性の観点からは必須でもあ
る。電解メッキ、気相蒸着、いずれの方法によって形成
してもよい。In this case, it is impossible to directly electrolytically plate a plastic article, and improvement in adhesion cannot be expected even by chemical plating. A conventionally known method can be adopted for electrolytic plating. Furthermore, in the present invention, a protective film of Ni (nickel) or the like for preventing copper from rusting can be provided on the electrolytic plated film. This protective film is also essential from the viewpoint of durability. It may be formed by any of electrolytic plating and vapor deposition.
【００１６】以下、実施例を示し、さらに詳しくこの発
明について説明する。Hereinafter, the present invention will be described in more detail with reference to Examples.
【００１７】[0017]
【実施例】実施例１ プラスチック射出成形品としての、ＡＢＳ−ＰＣアロイ
材料から成形した自動車電話器の筐体に、フロン洗浄お
よびプライマーコート層の配設を行うことなく、直接高
周波励起プラズマによる銅成膜を行った。EXAMPLES Example 1 Copper by direct high-frequency excitation plasma was directly applied to a housing of an automobile telephone molded from an ABS-PC alloy material as a plastic injection-molded product without performing CFC cleaning and providing a primer coat layer. A film was formed.
【００１８】真空室の到達真空度を５×１０-5Torrと
し、アルゴンを、２×１０-4Torrの分圧として導入し、
コイル状高周波励起電極によって生成させたグロープラ
ズマによって銅蒸発粒子の励起とプラスチック射出成形
品表面への付着を行った。平面部の銅の膜厚が５μｍと
なるまで成膜した。次いで電解メッキにより約３０μｍ
の銅と、約２μｍのニッケルを成膜した。The ultimate vacuum in the vacuum chamber is 5 × 10 -5 Torr, and argon is introduced as a partial pressure of 2 × 10 -4 Torr,
The glow plasma generated by the coil-shaped high-frequency excitation electrode excited copper vaporized particles and attached them to the surface of plastic injection-molded products. Film formation was performed until the film thickness of copper on the flat surface became 5 μm. Then by electroplating about 30 μm
And copper of about 2 μm were deposited.
【００１９】得られた電磁波シールドプラスチック成形
品の特性は、次の表１の通りであり、非常に良好であっ
た。The characteristics of the obtained electromagnetic wave shielding plastic molded product are shown in Table 1 below and were very good.
【００２０】[0020]
【表１】 [Table 1]
【００２１】実施例２ ＡＢＳ樹脂による２００×３００mmの大きさで、厚み３
mmの射出成形試料に対し、フロン洗浄、プライマーコー
ト層の配設を行うことなく、直接、真空室において４μ
ｍ厚の銅成膜を高周波励起プラズマによって行った。こ
の場合の銅は、電子ビームによって蒸発させた。到達真
空度は４×１０-5Torrとし、アルゴン分圧は４×１０-4
Torrとした。 Example 2 ABS resin 200 × 300 mm in size and thickness 3
mm injection-molded sample, 4μ directly in the vacuum chamber without CFC cleaning and primer coating layer
An m-thick copper film was formed by high frequency excitation plasma. The copper in this case was evaporated by the electron beam. The ultimate vacuum is 4 × 10 -5 Torr and the argon partial pressure is 4 × 10 -4.
Torr.
【００２２】実施例１と同様にして、電解メッキし、優
れた特性の電磁波シールドプラスチック成形品が得られ
た。実施例３ 実施例１において、まず３μｍ厚の銅を成膜し、次いで
２０μｍ厚の電解銅メッキを施した。Electrolytic plating was carried out in the same manner as in Example 1 to obtain an electromagnetic wave shielding plastic molded product having excellent characteristics. Example 3 In Example 1, first, a copper film having a thickness of 3 μm was formed, and then electrolytic copper plating having a thickness of 20 μm was applied.
【００２３】得られた製品は優れた特性を示した。特性
試験の結果は、表２の通りであった。The product obtained has excellent properties. The results of the characteristic test are shown in Table 2.
【００２４】[0024]
【表２】 [Table 2]
【００２５】[0025]
【発明の効果】この発明によって、気相成膜の特徴を生
かしつつ、 （１）電磁気シールド効果に優れ、 （２）厚膜銅の成膜が効率よく可能で、 （３）フロン洗浄を行うことなく、プライマーコート層
の配設を必要とすることなく、廃液、廃気による汚染を
心配することのない電磁気シールドプラスチック成形品
が提供される。According to the present invention, while making the best use of the characteristics of vapor phase film formation, (1) it has an excellent electromagnetic shielding effect, (2) it is possible to efficiently form a thick film of copper, and (3) chlorofluorocarbon cleaning is performed. In other words, there is provided an electromagnetic shield plastic molded product which does not require the provision of the primer coat layer and does not worry about the contamination by waste liquid or waste air.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ２３Ｃ 14/22 Ｃ２３Ｃ 14/22 Ｚ 14/24 14/24 Ｓ Ｈ０５Ｋ 9/00 Ｈ０５Ｋ 9/00 Ｗ (56)参考文献 特開 昭51−130687（ＪＰ，Ａ) 特開 昭61−246361（ＪＰ，Ａ)─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location C23C 14/22 C23C 14/22 Z 14/24 14/24 S H05K 9/00 H05K 9/00 W (56) References JP-A-51-130687 (JP, A) JP-A-61-246361 (JP, A)
Claims (2)
ライマーコート層を配設せずにプラスチック成形品表面
に高周波励起プラズマによる0.7 〜5.0 μｍの膜厚の銅
膜を配設し、次いで１０〜３０μｍ厚の銅電解メッキ膜
を配設してなる電磁波シールドプラスチック成形品。1. A copper film having a thickness of 0.7 to 5.0 μm is provided on the surface of a plastic molded product by washing with high frequency excitation plasma without pre-cleaning and without providing a primer coat layer, and then a thickness of 10 to 30 μm. Electromagnetic wave shielding plastic molded product with the copper electroplating film.
を配設してなる電磁波シールドプラスチック成形品。2. An electromagnetic wave shielding plastic molded article comprising a protective film provided on the copper electrolytic plating film according to claim 1.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4298940A JP2561992B2 (en) | 1992-11-09 | 1992-11-09 | Electromagnetic wave shield plastic molding |
| EP93308934A EP0597670B1 (en) | 1992-11-09 | 1993-11-09 | Method of manufacturing electromagnetic wave shielding plastic molding |
| DE69317035T DE69317035T2 (en) | 1992-11-09 | 1993-11-09 | Manufacturing process of a molded plastic body with electromagnetic shielding |
| US08/149,533 US5462771A (en) | 1992-11-09 | 1993-11-09 | Method of manufacturing electromagnetic wave shielding plastic molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4298940A JP2561992B2 (en) | 1992-11-09 | 1992-11-09 | Electromagnetic wave shield plastic molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06145396A JPH06145396A (en) | 1994-05-24 |
| JP2561992B2 true JP2561992B2 (en) | 1996-12-11 |
Family
ID=17866159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4298940A Expired - Lifetime JP2561992B2 (en) | 1992-11-09 | 1992-11-09 | Electromagnetic wave shield plastic molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2561992B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU1686999A (en) | 1997-12-24 | 1999-07-19 | Gunze Limited | Transparent member for shielding electromagnetic waves and method of producing the same |
| CN109852933A (en) * | 2018-12-17 | 2019-06-07 | 山东长宇新材料有限公司 | A kind of copper plating film and its production method |
-
1992
- 1992-11-09 JP JP4298940A patent/JP2561992B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06145396A (en) | 1994-05-24 |
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