JP2553538Y2 - Polishing liquid stirring mechanism of immersion type polishing equipment - Google Patents
Polishing liquid stirring mechanism of immersion type polishing equipmentInfo
- Publication number
- JP2553538Y2 JP2553538Y2 JP1103592U JP1103592U JP2553538Y2 JP 2553538 Y2 JP2553538 Y2 JP 2553538Y2 JP 1103592 U JP1103592 U JP 1103592U JP 1103592 U JP1103592 U JP 1103592U JP 2553538 Y2 JP2553538 Y2 JP 2553538Y2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- liquid
- tool
- workpiece
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本考案は、被加工物と回転駆動さ
れる研磨工具を研磨材が混入された研磨液中に配置し、
研磨液中で研磨作業を行なう液浸式研磨装置に於て、研
磨液を攪拌する液浸式研磨装置の研磨液攪拌機構に関す
る。In the present invention, a workpiece and a polishing tool driven to rotate are arranged in a polishing liquid mixed with an abrasive,
The present invention relates to a polishing liquid stirring mechanism of a liquid immersion polishing apparatus that stirs a polishing liquid in a liquid immersion polishing apparatus that performs a polishing operation in a polishing liquid.
【０００２】[0002]
【従来の技術】樹脂成形金型の成形面等を平滑面に研磨
する方法として、近時、被加工物と回転駆動される研磨
工具を精製水にアルミナ等の研磨材を混入した研磨液中
に配置し、研磨液中で研磨作業を行なう液浸式と呼ばれ
る研磨方法がある。例えばＥＥＭ(Elastic Emission Ma
chining)と呼ばれるものでは、弾性体で形成された研磨
工具と被加工物の間に研磨液層が介在して研磨工具と被
加工物は非接触状態となり、研磨液に混入された研磨材
で被加工物表面を研磨するものである。このような液浸
式研磨方法では、研磨工具と被加工物を所定の圧力で近
接する方向に加圧した状態で研磨工具と被加工物を相対
移動させることによって研磨を行なうが、研磨量は研磨
工具と被加工物の相対移動速度によって制御される。つ
まり、被加工物の研磨面の形状を予め測定して研磨量を
設定し、この設定された研磨量に基いて、研磨工具と被
加工物の相対移動速度を研磨量が多い部位では遅く、研
磨量が少ない部位では速くするものである。2. Description of the Related Art As a method of polishing a molding surface or the like of a resin molding die to a smooth surface, recently, a workpiece and a polishing tool which is rotationally driven are polished in a polishing liquid obtained by mixing an abrasive such as alumina with purified water. And a polishing method called a liquid immersion method in which a polishing operation is performed in a polishing liquid. For example, EEM (Elastic Emission Ma
In what is called chining, a polishing liquid layer is interposed between the polishing tool and the workpiece formed of an elastic body, and the polishing tool and the workpiece are in a non-contact state, and the polishing material mixed with the polishing liquid This is for polishing the surface of the workpiece. In such a liquid immersion type polishing method, polishing is performed by relatively moving the polishing tool and the workpiece in a state where the polishing tool and the workpiece are pressed in a direction close to each other with a predetermined pressure. It is controlled by the relative movement speed between the polishing tool and the workpiece. In other words, the shape of the polished surface of the workpiece is measured in advance to set the amount of polishing, and based on the set amount of polishing, the relative movement speed between the polishing tool and the workpiece is slow in a portion where the amount of polishing is large, The speed is increased in a portion having a small polishing amount.
【０００３】[0003]
【考案が解決しようとする課題】しかし乍ら、研磨作用
中に研磨液中の研磨材が比重差から沈殿することによっ
て研磨作用部位に供給される研磨材の量（濃度）が徐々
に変化し、その結果、研磨能率が低下したり、研磨量に
ムラを生じて精度の高い研磨が行なえないという問題が
ある。つまり、研磨量は研磨工具と被加工物の相対速度
以外に研磨作用部位に供給される研磨材の量によっても
左右されるものであり、研磨工具と被加工物の相対移動
速度によって研磨量を制御して精度の高い研磨を行なう
為には、研磨作用部位に於る研磨材の濃度を一定とする
必要があるものである。However, during the polishing operation, the amount (concentration) of the abrasive supplied to the polishing operation site gradually changes due to the abrasive in the polishing liquid settling out of the difference in specific gravity during the polishing operation. As a result, there is a problem that the polishing efficiency is reduced or the polishing amount is uneven, so that highly accurate polishing cannot be performed. In other words, the amount of polishing depends not only on the relative speed of the polishing tool and the workpiece, but also on the amount of abrasive supplied to the polishing portion, and the amount of polishing is determined by the relative moving speed of the polishing tool and the workpiece. In order to perform high-precision polishing by controlling, it is necessary to keep the concentration of the abrasive at the polishing action site constant.
【０００４】この為、研磨液を十分攪拌した後研磨作業
を行なったり、図２に示す如く研磨液槽２０内に攪拌羽
根６１を備えた攪拌軸６０を設けて研磨作業中継続して
攪拌を行なう構成が考えられているが、研磨作業前に攪
拌するものでは作業中に研磨材が沈殿することによる濃
度変化は避けられず、又、研磨液水槽に攪拌軸を設けた
構成では、構成が複雑となると共に、研磨材の沈殿は防
げるものの攪拌流に沿って研磨材の濃淡が生じてその濃
度分布は均一化せず、この研磨材の濃度分布が異なる研
磨液中を研磨作用部位が移動することから結果的に研磨
作用部位に於る研磨材の濃度が変化し、依然として安定
した研磨量が得られないものであった。尚、図２に於
て、１は被加工物，３０は工具軸，３１は研磨工具，５
０は研磨液，５１は研磨材粒子である。For this reason, the polishing operation is performed after the polishing liquid is sufficiently stirred, or a stirring shaft 60 provided with a stirring blade 61 is provided in the polishing liquid tank 20 as shown in FIG. Although it is conceivable to carry out a configuration in which the agitation is performed before the polishing operation, a change in concentration due to precipitation of the abrasive during the operation is inevitable. Although it becomes complicated, it can prevent the abrasive from sedimenting, but the density of the abrasive is generated along the stirring flow, and the concentration distribution is not uniform, and the polishing action site moves in the polishing liquid having a different concentration distribution of the abrasive. As a result, the concentration of the abrasive at the polishing action site changes, and a stable polishing amount cannot be obtained. In FIG. 2, 1 is a workpiece, 30 is a tool shaft, 31 is a polishing tool, 5
0 is a polishing liquid and 51 is abrasive particles.
【０００５】[0005]
【考案の目的】本考案は、上記の如き事情に鑑み、簡単
な構成で研磨作用部位に於る研磨材の濃度を一定として
単位時間当りの研磨材供給量を一定化することができ、
研磨工具と被加工物の相対速度制御によって精度の高い
研磨量制御を行なうことのできる液浸式研磨装置の研磨
液攪拌機構の提供、を目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-described circumstances, and has a simple structure to make the concentration of the abrasive at the polishing action portion constant and to stabilize the amount of the abrasive supplied per unit time.
It is an object of the present invention to provide a polishing liquid stirring mechanism of a liquid immersion type polishing apparatus capable of controlling a polishing amount with high precision by controlling a relative speed between a polishing tool and a workpiece.
【０００６】[0006]
【課題を解決する為の手段】上記目的達成の為、本考案
に係る液浸式研磨装置の研磨液攪拌機構は、研磨工具が
装着される回転軸に、研磨液の攪拌羽根が装着されて構
成されている。これにより、研磨液は研磨作用部位と常
に相対位置が一定の攪拌羽根によって攪拌されることと
なり、研磨作用部位に於る研磨材の濃度が一定化され、
安定した研磨量が得られる。In order to achieve the above object, a polishing liquid stirring mechanism of a liquid immersion type polishing apparatus according to the present invention has a polishing liquid stirring blade mounted on a rotating shaft on which a polishing tool is mounted. It is configured. As a result, the polishing liquid is always stirred by the constant stirring blade at a relative position to the polishing action portion, and the concentration of the abrasive in the polishing action portion is stabilized,
A stable polishing amount can be obtained.
【０００７】[0007]
【考案の実施例】次に、図面に基いて本考案の実施例を
説明する。図１は本考案を適用した液浸式研磨装置の主
要部の概略構成図である。図示液浸式研磨装置は、例え
ば光学プラスチックによって非球面レンズを成形する為
の金型１の、成形するレンズの非球面と対応する凹状非
球面に形成されるレンズ成形面１Ａを超鏡面に研磨する
ものであり、直交する水平二方向（Ｘ，Ｙ軸方向）及び
鉛直方向（Ｚ軸方向）の三方向に移動駆動可能なテーブ
ル１０上に、研磨液を収容する上方に開放した液槽２０
が配設されると共に、テーブル１０の側方に該テーブル
１０とは独立して立設配置された図示しない固定コラム
の上端から水平なアーム（図示せず）が液槽２０の上側
迄延設され、このアームに工具軸３０が鉛直に支持され
ている。工具軸３０の下端部は、テーブル１０の昇降
（Ｚ軸方向の移動）によって液槽２０内に位置し得るよ
うになっている。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic configuration diagram of a main part of a liquid immersion type polishing apparatus to which the present invention is applied. The illustrated liquid immersion type polishing apparatus polishes a lens forming surface 1A of a mold 1 for molding an aspherical lens with, for example, optical plastic, which is formed on a concave aspherical surface corresponding to the aspherical surface of a lens to be molded, to a super mirror surface. An upwardly open liquid tank 20 containing a polishing liquid is placed on a table 10 that can be driven to move in three directions, that is, two horizontal directions (X and Y axis directions) and a vertical direction (Z axis direction).
And a horizontal arm (not shown) extends from the upper end of a fixed column (not shown), which is provided upright independently of the table 10, to the side of the table 10 to the upper side of the liquid tank 20. The tool shaft 30 is supported vertically by the arm. The lower end of the tool shaft 30 can be positioned in the liquid tank 20 by moving the table 10 up and down (moving in the Z-axis direction).
【０００８】液槽２０には、被加工物を支持する支持ア
ーム２１が、その先端の被加工物装着部２１Ａを液槽２
０内に位置させて設けられ、その被加工物装着部２１Ａ
には、被加工物である金型１が装着されている。本実施
例に於る金型１は、真鍮素材又は型面（レンズ成形面１
Ａ）に無電解ニッケルメッキが施され、予め所定の非球
面に切削加工されているものである。又、液槽２０内に
は、精製水に所定粒径のアルミナ等の研磨材５１を所定
の割合で混入した研磨液５０が、略一杯に収容されてい
る。[0008] A support arm 21 for supporting a workpiece is provided in the liquid tank 20, and a workpiece mounting portion 21 A at the tip thereof is connected to the liquid tank 2.
0, and the workpiece mounting portion 21A
Is mounted with a mold 1 which is a workpiece. The mold 1 in this embodiment is made of a brass material or a mold surface (lens molding surface 1).
Electroless nickel plating is applied to the A), those which are machined in advance to a predetermined aspherical. In the liquid tank 20, a polishing liquid 50 in which a polishing material 51 such as alumina having a predetermined particle diameter is mixed at a predetermined ratio in purified water is substantially filled.
【０００９】工具軸３０は、図示しない駆動源により所
定の回転数で回転駆動されるようになっており、先端
（下端）部には球状の研磨工具３１が固定されると共
に、先端端面に螺着された所定長さの連結棒３２を介し
て所定枚数の所定外形の攪拌羽根３３が装着され、該攪
拌羽根３３は研磨工具３１の下方に所定間隔離れて配置
されている。研磨工具３１は、所定の弾性（硬度６０〜
９０°）を有する弾性体（例えばポリウレタンゴム）に
より、研磨対象面（レンズ成形面１Ａ）の曲率より小さ
な曲率を有する球状に形成されている。そして、工具軸
３０の、テーブル１０の昇降によって研磨液５０中に没
し得、水平方向の移動によって支持アーム２１の被加工
物装着部２１Ａに装着された金型１のレンズ成形面１Ａ
の全面に隈無く接し得るようになっている。The tool shaft 30 is driven to rotate at a predetermined number of revolutions by a drive source (not shown). A spherical polishing tool 31 is fixed at the tip (lower end), and a screw is attached to the tip end face. A predetermined number of stirring blades 33 having a predetermined outer shape are mounted via the attached connecting rod 32 having a predetermined length, and the stirring blades 33 are arranged below the polishing tool 31 at predetermined intervals. The polishing tool 31 has a predetermined elasticity (hardness 60 to 60).
An elastic body (for example, polyurethane rubber) having a curvature of 90 °) is formed into a spherical shape having a curvature smaller than the curvature of the surface to be polished (the lens forming surface 1A). The tool shaft 30 can be immersed in the polishing liquid 50 by raising and lowering the table 10, and the lens forming surface 1A of the mold 1 mounted on the workpiece mounting portion 21A of the support arm 21 by horizontal movement.
It can come in contact with the entire surface of the house.
【００１０】攪拌羽根３３は、回転によってその回転平
面と直交する方向の液流を形成する所謂スクリュウ状で
あって、研磨作用時の研磨工具３１の回転に伴う回転に
よって上側（研磨工具３１側）に向けて液流を形成する
ように設けられている。液槽２０は、図示しない加圧機
構によって図中矢印Ｐで示す如く常時支持アーム２１の
被加工物装着部２１Ａが工具軸３０に近接する側に付勢
され、これによって、研磨工具３１と支持アーム２１の
被加工物装着部２１Ａに装着された金型１の研磨面（レ
ンズ成形面１Ａ）とが一定の圧力で圧接されるようにな
っている。テーブル１０は、当該液浸式研磨装置の図示
しない制御装置によって制御移動され、これによって支
持アーム２１の被加工物装着部２１Ａに装着された金型
１のレンズ成形面１Ａの研磨工具３１との接触位置（即
ち研磨工具３１によるレンズ成形面１Ａの研磨部位）が
移動するようになっている。The stirring blade 33 has a so-called screw shape that forms a liquid flow in a direction perpendicular to the plane of rotation by rotation, and is rotated upward (on the side of the polishing tool 31) by the rotation of the polishing tool 31 during the polishing operation. To form a liquid flow. In the liquid tank 20, the workpiece mounting portion 21A of the support arm 21 is constantly urged toward the side close to the tool shaft 30 by a pressing mechanism (not shown) as shown by an arrow P in the figure, whereby the polishing tool 31 and the polishing tool 31 are supported. The polished surface (lens forming surface 1A) of the mold 1 mounted on the workpiece mounting portion 21A of the arm 21 is pressed against the surface with a constant pressure. The table 10 is controlled and moved by a control device (not shown) of the liquid immersion type polishing apparatus, so that the table 10 and the polishing tool 31 of the lens forming surface 1A of the mold 1 mounted on the workpiece mounting portion 21A of the support arm 21 are moved. The contact position (that is, the polishing portion of the lens forming surface 1A by the polishing tool 31) moves.
【００１１】而して、上記の如く構成された液浸式研磨
装置では、工具軸３０を所定の回転数で回転駆動すると
共に、予め測定された金型１のレンズ成形面１Ａの切削
加工形状から求められた部位毎に必要な研磨量から導出
された部位毎の金型１と研磨工具３１の移動相対速度に
基いて、制御装置がテーブル１０を制御移動させ、研磨
を行なう。例えば、旋盤等による回転切削によって研磨
前形状に形成された図示の如き凹状の金型１では、切削
加工時に於る回転中心に所謂ヘソと呼ばれる微小突起
（図示せず）が不可避的に残存するが、このような微小
突起等を削除する必要のある部位は削除し得るゆっくり
した速度で、形状は正しく表面あらさを平滑として超鏡
面に仕上るのみの部位はそれに対応した比較的速い速度
で移動させる。In the liquid immersion type polishing apparatus constructed as described above, the tool shaft 30 is driven to rotate at a predetermined number of rotations, and at the same time, the cutting shape of the lens molding surface 1A of the mold 1 is measured in advance. The controller controls and moves the table 10 to perform polishing based on the relative movement speed of the mold 1 and the polishing tool 31 for each part derived from the required polishing amount for each part obtained from the above. For example, in a concave mold 1 as shown in the figure, which is formed into a pre-polishing shape by rotary cutting with a lathe or the like, minute projections (not shown) so-called indentations remain at the center of rotation during cutting. However, the parts that need to remove such minute projections etc. are moved at a slow speed that can be removed, and the parts that only have a correct shape and smooth surface roughness and finish only the super mirror surface move at a relatively high speed corresponding to it .
【００１２】ここで、この研磨作用時、工具軸３０の回
転に伴ってその先端に装着された攪拌羽根３３が回転
し、図中矢印で示す如く液槽２０の底部から上方に向か
う（即ち研磨工具３１に向かう）液流を形成する。これ
により、比重差によって沈殿している又は沈殿しようと
する研磨材５１は液流に沿って流動して研磨工具３１と
金型１のレンズ成形面１Ａとの接触位置（研磨作用部
位）に至り、この研磨作用部位に常に研磨材５１を供給
するよう作用する。つまり、攪拌羽根３３の回転によっ
て研磨工具３１に対して常に一定の液流が形成され、こ
の液流によって常に一定濃度の研磨材５１が研磨作用部
位に供給される（単位時間当り一定量の研磨材５１が研
磨作用部位に供給される）こととなり、これによって、
金型１と研磨工具３１の移動相対速度と研磨量との関係
が高精度で一定化し、金型１と研磨工具３１の移動相対
速度を制御することによって研磨量を高精度に規定する
ことができる。Here, during this polishing operation, the stirring blade 33 mounted on the tip of the tool shaft 30 rotates with the rotation of the tool shaft 30, and moves upward from the bottom of the liquid tank 20 as shown by the arrow in the drawing (that is, polishing). A liquid flow (toward the tool 31) is formed. As a result, the abrasive material 51 that has settled or is about to settle due to a difference in specific gravity flows along the liquid flow and reaches the contact position (polishing action site) between the polishing tool 31 and the lens molding surface 1A of the mold 1. The polishing material 51 always acts to supply the polishing material 51 to the polishing action portion. In other words, a constant liquid flow is always formed with respect to the polishing tool 31 by the rotation of the stirring blade 33, and the polishing material 51 having a constant concentration is always supplied to the polishing action portion by this liquid flow (a constant amount of polishing per unit time). The material 51 is supplied to the polishing action portion), whereby
The relationship between the relative movement speed of the mold 1 and the polishing tool 31 and the amount of polishing can be fixed with high accuracy, and the amount of polishing can be defined with high accuracy by controlling the relative movement speed of the mold 1 and the polishing tool 31. it can.
【００１３】尚、上記実施例では、工具軸３０の先端に
攪拌羽根３３を固定装着したものであるが、工具軸３０
の内部に攪拌羽根３３用の軸を挿通し、工具軸３０と異
なる回転数で回転させたり、研磨部位の上下方向の移動
（テーブル１０のＺ方向移動）に伴なって、液槽２０の
底部と攪拌羽根３３の相対位置が変らないように昇降さ
せる等の構成も考えられるものである。In the above embodiment, the stirring blade 33 is fixedly mounted on the tip of the tool shaft 30.
The shaft for the stirring blade 33 is inserted into the inside of the liquid tank 20, and is rotated at a different rotation speed from the tool shaft 30, and the polishing portion is moved vertically (movement in the Z direction of the table 10). It is also conceivable to raise and lower the relative position of the stirring blade 33 and the stirring blade 33 so as not to change.
【００１４】[0014]
【考案の効果】以上述べたように、本考案に係る液浸式
研磨装置の研磨液攪拌機構によれば、簡単な構成で研磨
作用部位に於る研磨材の濃度を一定とすることができ、
研磨工具と被加工物の相対速度制御によって安定した研
磨量を得ることができる。As described above, according to the polishing liquid stirring mechanism of the liquid immersion type polishing apparatus according to the present invention, it is possible to keep the concentration of the polishing material at the polishing action site constant with a simple structure. ,
A stable polishing amount can be obtained by controlling the relative speed between the polishing tool and the workpiece.
【図１】本考案に係る液浸式研磨装置の研磨液攪拌機構
を適用した液浸式研磨装置の主要部の概略図。FIG. 1 is a schematic view of a main part of an immersion polishing apparatus to which a polishing liquid stirring mechanism of the immersion polishing apparatus according to the present invention is applied.
【図２】従来例である液浸式研磨装置の主要部の概略構
成図。FIG. 2 is a schematic configuration diagram of a main part of a conventional liquid immersion polishing apparatus.
１…金型（被加工物） ３０…回転軸 ３１…研磨工具 ３３…攪拌羽根 ５０…研磨液 ５１…研磨材 DESCRIPTION OF SYMBOLS 1 ... Die (workpiece) 30 ... Rotation axis 31 ... Polishing tool 33 ... Stirring blade 50 ... Polishing liquid 51 ... Abrasive
Claims (1)
材が混入された研磨液中に配置し、前記研磨液中で研磨
作業を行なう液浸式研磨装置に於て、 研磨工具が装着される回転軸に、研磨液の攪拌羽根が装
着されていること、を特徴とする液浸式研磨装置の研磨
液攪拌機構。An immersion polishing apparatus for arranging a polishing tool which is driven to rotate with a workpiece in a polishing liquid mixed with an abrasive and performing a polishing operation in the polishing liquid. A polishing liquid stirring mechanism for a liquid immersion type polishing apparatus, wherein a polishing liquid stirring blade is mounted on a rotating shaft to be mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1103592U JP2553538Y2 (en) | 1992-02-04 | 1992-02-04 | Polishing liquid stirring mechanism of immersion type polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1103592U JP2553538Y2 (en) | 1992-02-04 | 1992-02-04 | Polishing liquid stirring mechanism of immersion type polishing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0563753U JPH0563753U (en) | 1993-08-24 |
| JP2553538Y2 true JP2553538Y2 (en) | 1997-11-05 |
Family
ID=11766813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1103592U Expired - Fee Related JP2553538Y2 (en) | 1992-02-04 | 1992-02-04 | Polishing liquid stirring mechanism of immersion type polishing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2553538Y2 (en) |
-
1992
- 1992-02-04 JP JP1103592U patent/JP2553538Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563753U (en) | 1993-08-24 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |