JP2551463Y2 - Electronic control unit - Google Patents
Electronic control unitInfo
- Publication number
- JP2551463Y2 JP2551463Y2 JP1991095654U JP9565491U JP2551463Y2 JP 2551463 Y2 JP2551463 Y2 JP 2551463Y2 JP 1991095654 U JP1991095654 U JP 1991095654U JP 9565491 U JP9565491 U JP 9565491U JP 2551463 Y2 JP2551463 Y2 JP 2551463Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- case
- resin
- substrate
- electronic control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Casings For Electric Apparatus (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この考案は電子制御装置に関し、
特に防湿、放熱、耐振動等を必要とする電子制御装置に
関する。BACKGROUND OF THE INVENTION This invention relates to an electronic control unit.
In particular, the present invention relates to an electronic control device that requires moisture proof, heat radiation, vibration resistance, and the like.
【０００２】[0002]
【従来の技術】車輛等に使用されているＰＤＵ（Power
Drive Unit）等は、高温、多湿、高振動等の過酷な環境
にさらされる。また、ＰＤＵ等の電子制御装置は発熱量
が大きい。このため、ＰＤＵ等を収容するケースは、防
湿、放熱、および耐振動に十分に配慮することが必要に
なる。また、ＰＤＵは車輛に搭載されるから、コンパク
トな構成にする必要がある。2. Description of the Related Art PDUs (Power
Drive Unit) is exposed to severe environments such as high temperature, high humidity and high vibration. An electronic control unit such as a PDU generates a large amount of heat. For this reason, it is necessary to give sufficient consideration to moisture proof, heat radiation, and vibration resistance in the case for housing the PDU and the like. Further, since the PDU is mounted on the vehicle, it is necessary to make the PDU compact.
【０００３】この種の従来装置の構成を、図４を参照し
て説明する。図は、従来の電子制御装置の一部の断面図
を示す。The configuration of this type of conventional device will be described with reference to FIG. The figure shows a sectional view of a part of a conventional electronic control device.
【０００４】図において、１はケース、２はＬＳＩ等の
集積回路、ハイブリッド集積回路等の電子部品を保持す
る基板、３はコネクタである。前記基板２はケース１に
ねじ４で固着されており、コネクタ３は基板２にねじ５
で固着されている。また、ケース１とコネクタ３との当
接部はＯリング６で密封されている。コネクタ中の端子
７は基板２の方に延びており、その端部が半田８で基板
２に電気的に接続されている。In FIG. 1, reference numeral 1 denotes a case, 2 denotes a substrate for holding an electronic component such as an integrated circuit such as an LSI or a hybrid integrated circuit, and 3 denotes a connector. The board 2 is fixed to the case 1 with screws 4, and the connector 3 is
It is fixed with. The contact portion between the case 1 and the connector 3 is sealed with an O-ring 6. The terminal 7 in the connector extends toward the substrate 2, and its end is electrically connected to the substrate 2 by solder 8.
【０００５】なお、従来装置の他の例として、例えば特
開昭５２−７０３６５号に開示されているものがある。As another example of the conventional apparatus, there is one disclosed in, for example, Japanese Patent Application Laid-Open No. 52-70365.
【０００６】[0006]
【考案が解決しようとする課題】従来の電子制御装置
は、上記のように、ねじ、Ｏリングや別体のコネクタ等
が必要となるため、部品点数が多く、コストや製造工程
の増大を招いていた。As described above, the conventional electronic control device requires screws, O-rings, separate connectors, and the like, so that the number of components is large, and the cost and the manufacturing process are increased. I was
【０００７】この考案の目的は、簡単な構成で前記の問
題点を除去することのできる電子制御装置を提供するこ
とにある。An object of the present invention is to provide an electronic control device capable of eliminating the above-mentioned problems with a simple configuration.
【０００８】[0008]
【課題を解決するための手段】前記目的を達成するため
に、請求項１の考案は、本体部とコネクタ部とからな
り、これらを樹脂で一体成型して作成されたケースと、
前記本体部の中央部に接着され、該本体部を密封すると
共に、裏面が外部に露出された基板とからなり、前記コ
ネクタ部に端子を埋設し、前記基板の内面に電子部品を
配設した点に特徴がある。In order to achieve the above object, according to the present invention, there is provided a case comprising a main body part and a connector part, which are integrally molded with a resin,
The main body was adhered to the center of the main body, sealed the main body, and was made of a substrate whose back surface was exposed to the outside. Terminals were embedded in the connector, and electronic components were provided on the inner surface of the substrate. There is a feature in the point.
【０００９】請求項２の考案は、前記端子の樹脂埋設部
に、凸部又は凹部を形成した点に特徴がある。The invention according to claim 2 is characterized in that a convex portion or a concave portion is formed in the resin embedded portion of the terminal.
【００１０】また、請求項３の考案は、前記端子のケー
ス内の端部を折曲し、該折曲部を前記樹脂中に埋設した
点に特徴がある。The invention according to claim 3 is characterized in that an end of the terminal in the case is bent and the bent portion is embedded in the resin.
【００１１】[0011]
【作用】請求項１の考案によれば、モールドによりケー
スを構成し、これに基板を接着すればよいので、簡単か
つ安価に作成することができる。また、基板の裏面が外
部に露出しているので、これを装置本体の熱良導体に取
付けることにより、放熱効果を大幅に向上することがで
きる。また、接着によりケースと基板とを密封している
ので、Ｏリング等の別部品を必要としなくなる。According to the first aspect of the present invention, the case can be formed by molding, and the substrate can be adhered to the case. In addition, since the back surface of the substrate is exposed to the outside, the heat radiation effect can be greatly improved by attaching this to the heat conductor of the device body. Further, since the case and the substrate are hermetically sealed by bonding, another component such as an O-ring is not required.
【００１２】請求項２の考案によれば、端子の樹脂埋設
部に、凸部又は凹部が形成されているので、モールド時
に樹脂が該凸部又は凹部に流れ込み、端子を樹脂中に強
固に埋めることができる。According to the second aspect of the present invention, since the convex portion or the concave portion is formed in the resin embedding portion of the terminal, the resin flows into the convex portion or the concave portion during molding, and the terminal is firmly embedded in the resin. be able to.
【００１３】請求項３の考案によれば、端子のケース内
側端部を折曲して、樹脂中に埋設しているので、耐振動
性が向上する。According to the third aspect of the present invention, since the terminal inside the case is bent and embedded in the resin, the vibration resistance is improved.
【００１４】[0014]
【実施例】以下に、図面を参照して、本考案を詳細に説
明する。図１は本考案の電子制御装置の一実施例の平面
図を示す。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 is a plan view of an embodiment of the electronic control device of the present invention.
【００１５】図において、１１はケースであり、基板１
２を接着する本体部１１ａとコネクタ部１１ｂとが樹脂
により一体成型されている。基板１２は放熱を良くする
ために、アルミ等により形成されている。In the figure, reference numeral 11 denotes a case,
The main body 11a and the connector 11b to which the second 2 is bonded are integrally formed of resin. The substrate 12 is formed of aluminum or the like to improve heat radiation.
【００１６】１３はコネクタの挿入を容易にするための
ガイドである。また、１５の斜線部は、前記本体部１１
ａと基板１２との接着部である。なお、本体部１１ａの
接着面は面粗度を荒くして接着性を向上しているため、
接着面積を減らして小形化を図ることができる。また、
本体部１１ａの基板取付部の４隅には、逃げ部１６が形
成され、基板１２の組付け性向上が図られている。Reference numeral 13 is a guide for facilitating insertion of the connector. The hatched portion 15 is the main body portion 11.
a is a bonding portion between the substrate a and the substrate 12. In addition, since the bonding surface of the main body 11a is roughened to improve the bonding property,
The size can be reduced by reducing the bonding area. Also,
Relief portions 16 are formed at the four corners of the board mounting portion of the main body 11a to improve the assemblability of the board 12.
【００１７】本実施例においては、ケース１１が樹脂を
モールドすることにより一体成型され、その後、基板１
２を該ケースの接着部１５上に乗せて接着される。この
結果、本実施例の電子制御装置は簡単かつ安価に作成す
ることができる。また、従来装置のように、Ｏリングの
ような別部品を使用せずに、ケース１１と基板１２を密
封することができる。In the present embodiment, the case 11 is integrally molded by molding a resin,
2 is placed on the bonding portion 15 of the case and bonded. As a result, the electronic control device of the present embodiment can be easily and inexpensively manufactured. Further, unlike the conventional device, the case 11 and the substrate 12 can be sealed without using another component such as an O-ring.
【００１８】次に、図２は前記ケース１１の内部の構造
を説明するための平面図である。また、図３は図２のＡ
−Ａ線断面図を示す。Next, FIG. 2 is a plan view for explaining the internal structure of the case 11. Also, FIG.
FIG.
【００１９】前記コネクタ部１１ｂの内部には、複数の
端子１４が配設されており、各端子１４には、強固に固
定するために凸部１４ａ（又は、凹部）が形成されてい
る。また、前記基板１２の内面には、ベアチップ１７が
配設されており、前記端子１４とベアチップ１７間は、
ワイヤ１８により電気的に接続されている。A plurality of terminals 14 are provided inside the connector portion 11b, and each terminal 14 has a convex portion 14a (or a concave portion) for firmly fixing the terminal. A bare chip 17 is provided on the inner surface of the substrate 12, and a space between the terminal 14 and the bare chip 17 is provided.
They are electrically connected by wires 18.
【００２０】また、端子１４のケース１１内の端部は、
図３に示されているように、折り曲げられており、該折
曲部はコネクタ部１１ｂを形成する樹脂１９の中に埋め
込まれている。このため、耐振動性が向上する。The end of the terminal 14 in the case 11 is
As shown in FIG. 3, it is bent, and the bent portion is embedded in the resin 19 forming the connector portion 11b. For this reason, the vibration resistance is improved.
【００２１】以上のように、本実施例によれば、図１か
ら明らかなように、放熱効果のよい基板１２が外面に露
出しているので、該基板１２を熱良導体の図示されてい
ない装置本体に取付けることにより、基板１２に固定さ
れた電気部品が発生する熱を良好に放出することができ
る。As described above, according to this embodiment, as is apparent from FIG. 1, the substrate 12 having a good heat radiation effect is exposed on the outer surface. By attaching to the main body, heat generated by the electric components fixed to the substrate 12 can be satisfactorily released.
【００２２】また、端子１４に凸部１４ａが形成されて
いるので、モールド時に、樹脂が該凸部に流れ込み、端
子１４を樹脂の中に強固に埋設することができる。さら
に、端子１４のケース内側の端部は折曲され、樹脂１９
中に埋め込まれているので、耐振動性が向上する。Further, since the convex portion 14a is formed on the terminal 14, the resin flows into the convex portion at the time of molding, and the terminal 14 can be firmly embedded in the resin. Furthermore, the end of the terminal 14 inside the case is bent, and
Since it is embedded inside, the vibration resistance is improved.
【００２３】[0023]
【考案の効果】以上の説明から明らかなように、本考案
によれば、下記のような効果を期待することができる。[Effects of the Invention] As is clear from the above description, according to the present invention, the following effects can be expected.
【００２４】ケースが樹脂により一体成型され、該ケー
スに基板が接着され、また、該ケースの接着部は面粗度
が粗くされていると共に、ケースの基板取付部の隅部に
逃げ部が設けられている。このため、本考案の電子制御
装置を簡単かつ安価に作成することができ、また該ケー
スの接着面積を小さくできると共に、組付け性の向上を
図ることができる。The case is integrally formed of resin, the substrate is bonded to the case, and the bonding portion of the case has a roughened surface and a relief portion is provided at a corner of the substrate mounting portion of the case. Have been. For this reason, the electronic control device of the present invention can be easily and inexpensively manufactured, and the bonding area of the case can be reduced, and the assembling property can be improved.
【００２５】(2) 基板の裏面が外部に露出しているの
で、これを装置本体の熱良導体に取付けることにより、
放熱効果を大幅に向上することができる。(2) The back surface of the substrate is exposed to the outside.
The heat radiation effect can be greatly improved.
【００２６】(3) また、接着によりケースと基板とを密
封しているので、Ｏリング等の別部品を必要としない。(3) Since the case and the substrate are hermetically sealed by bonding, no separate components such as an O-ring are required.
【００２７】(4) 端子の樹脂埋設部に、凸部又は凹部が
形成されているので、モールド時に樹脂が該凸部又は凹
部に流れ込み、端子を樹脂中に強固に埋めることができ
る。(4) Since the convex portion or the concave portion is formed in the resin buried portion of the terminal, the resin flows into the convex portion or the concave portion during molding, and the terminal can be firmly embedded in the resin.
【００２８】(5) 端子のケース内側端部を折曲して、樹
脂中に埋設しているので、耐振動性が向上する。(5) Since the terminal inside the case is bent and buried in the resin, the vibration resistance is improved.
【図１】 本考案の一実施例の電子制御装置の平面図で
ある。FIG. 1 is a plan view of an electronic control device according to an embodiment of the present invention.
【図２】 本考案の一実施例の内部構成を説明するため
の平面図である。FIG. 2 is a plan view illustrating an internal configuration of an embodiment of the present invention.
【図３】 図２のＡ−Ａ線断面図である。FIG. 3 is a sectional view taken along line AA of FIG. 2;
【図４】 従来の電子制御装置の一部断面図である。FIG. 4 is a partial cross-sectional view of a conventional electronic control device.
１１…ケース、１１ａ…本体部、１１ｂ…コネクタ部、
１２…基板、１３…誤組防止用ガイド、１４…端子、１
５…接着部、１８…ワイヤ11 ... case, 11a ... body part, 11b ... connector part,
12 ... board, 13 ... mis-assembly prevention guide, 14 ... terminal, 1
5 ... adhesion part, 18 ... wire
Claims (3)
樹脂で一体成型して作成されたケースと、 前記本体部の中央部であって、所定の形状の面粗度の粗
い接着部に接着され、該本体部を密封すると共に、裏面
が外部に露出された基板と、 前記本体部の基板取付部の隅部に設けられた逃げ部 とか
らなり、 前記コネクタ部に端子が埋設され、前記基板の内面に前
記端子と電気的に接続された電子部品が配設されている
ことを特徴とする電子制御装置。1. A case comprising a main body portion and a connector portion, which are formed by integrally molding them with a resin; and a central portion of the main body portion having a predetermined surface roughness.
Is bonded to the bonding portion have, as well as sealing the body portion, the rear surface is composed of a substrate exposed to the outside, a relief portion provided in a corner portion of the substrate mounting portion of the main body portion, the terminal in the connector portion And an electronic component electrically connected to the terminal is disposed on an inner surface of the substrate.
形成したことを特徴とする請求項１記載の電子制御装
置。2. The electronic control device according to claim 1, wherein a convex portion or a concave portion is formed in the resin embedded portion of the terminal.
曲部を前記樹脂中に埋設することにより、該端子の端部
を固定したことを特徴とする請求項１記載の電子制御装
置。3. The terminal according to claim 1, wherein the end of the terminal is fixed by bending an end of the terminal in the case and embedding the bent part in the resin. Electronic control unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991095654U JP2551463Y2 (en) | 1991-10-25 | 1991-10-25 | Electronic control unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991095654U JP2551463Y2 (en) | 1991-10-25 | 1991-10-25 | Electronic control unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0538779U JPH0538779U (en) | 1993-05-25 |
| JP2551463Y2 true JP2551463Y2 (en) | 1997-10-22 |
Family
ID=14143492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991095654U Expired - Fee Related JP2551463Y2 (en) | 1991-10-25 | 1991-10-25 | Electronic control unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2551463Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2794527B2 (en) * | 1994-03-18 | 1998-09-10 | 日本航空電子工業株式会社 | Case integrated connector |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2554747A1 (en) * | 1975-12-05 | 1977-06-16 | Bosch Gmbh Robert | ELECTRONIC CONTROL UNIT |
| US4029388A (en) * | 1976-04-02 | 1977-06-14 | Illinois Tool Works Inc. | Electrical terminal constructed to prevent insert molding flash |
| JPS63155273U (en) * | 1987-03-31 | 1988-10-12 |
-
1991
- 1991-10-25 JP JP1991095654U patent/JP2551463Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0538779U (en) | 1993-05-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |