JP2542416B2 - Manufacturing method of mold circuit board - Google Patents
Manufacturing method of mold circuit boardInfo
- Publication number
- JP2542416B2 JP2542416B2 JP63094431A JP9443188A JP2542416B2 JP 2542416 B2 JP2542416 B2 JP 2542416B2 JP 63094431 A JP63094431 A JP 63094431A JP 9443188 A JP9443188 A JP 9443188A JP 2542416 B2 JP2542416 B2 JP 2542416B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- circuit board
- circuit pattern
- mold
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、樹脂成形体の表面に銅箔回路パターンを一
体に設けたモールド回路基板の製造方法に関するもので
ある。The present invention relates to a method for producing a molded circuit board in which a copper foil circuit pattern is integrally provided on the surface of a resin molded body.
従来、樹脂成形体の表面に銅の回路パターンを形成す
るには、樹脂成形体の表面に紫外線硬化型の触媒層を設
け、その上にマスクをかけて紫外線を照射することによ
り回路パターンに相当する部分だけ触媒層を残し、その
後、無電解メッキにより触媒層の上に銅を付着させ、銅
の回路パターンを形成するという方法がとられている。Conventionally, in order to form a copper circuit pattern on the surface of a resin molded body, an ultraviolet curing type catalyst layer is provided on the surface of the resin molded body, and a mask is placed on the catalyst layer to irradiate ultraviolet rays to obtain a circuit pattern. A method of leaving a catalyst layer only in a desired portion and then depositing copper on the catalyst layer by electroless plating to form a copper circuit pattern is adopted.
しかしこの方法は、銅の回路パターンを無電解メッキ
により形成しているため、回路パターンの形成に長時間
を必要とし、生産性がわるく、かつ無電解メッキ液の管
理が難しいという欠点がある。また回路パターンの形成
後にソルダーレジストを印刷することになるため、樹脂
成形体が立体形状の場合、ソルダーレジストの印刷が困
難である。However, this method has the drawbacks that the circuit pattern of copper is formed by electroless plating, so that it takes a long time to form the circuit pattern, the productivity is poor, and the management of the electroless plating solution is difficult. Further, since the solder resist is printed after the circuit pattern is formed, it is difficult to print the solder resist when the resin molding has a three-dimensional shape.
本発明は、上記のような課題を解決するモールド回路
基板の製造方法を提供するもので、その方法は、銅箔の
片面にソルダーレジストを印刷する工程、その上にキャ
リアフィルムをラミネートする工程、上記銅箔の他面に
エッチングレジストを印刷する工程、銅箔をエッチング
して回路パターンを形成する工程、以上のようにして形
成された回路転写フィルムをキャリアフィルム側の面が
金型内面に接するように金型内にセットしてモールド成
形を行い、樹脂成形体を形成する工程、上記キャリアフ
ィルムを剥離する工程を含むことを特徴とする。The present invention provides a method for manufacturing a molded circuit board that solves the above problems, which is a step of printing a solder resist on one surface of a copper foil, a step of laminating a carrier film thereon, The step of printing an etching resist on the other surface of the copper foil, the step of etching the copper foil to form a circuit pattern, the surface of the circuit transfer film formed as described above is in contact with the inner surface of the mold. As described above, the method is characterized by including a step of forming a resin molded body by setting in a mold and molding, and a step of peeling the carrier film.
このようにすると無電解メッキによることなく、表面
にソルダーレジストが印刷された状態の銅箔回路パター
ンを、樹脂成形体と一体化できることになる。In this way, the copper foil circuit pattern with the solder resist printed on the surface can be integrated with the resin molded body without electroless plating.
以下、本発明の一実施例を図面を参照して詳細に説明
する。Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
まず図−１に示すように、通常のプリント回路基板用
の銅箔１の片面にソルダーレジスト２をスクリーン印刷
する。この印刷により、あとで回路パターンのパッド部
となる部分以外の所にソルダーレジスト２が被せられ
る。First, as shown in FIG. 1, a solder resist 2 is screen-printed on one surface of an ordinary copper foil 1 for a printed circuit board. By this printing, the solder resist 2 is covered on the portion other than the portion which will be the pad portion of the circuit pattern later.
次いで図−２に示すように、ソルダーレジスト２の上
から全面にキャリアフィルム３をラミネートする。キャ
リアフィルム３は後述する樹脂のモールド成形時の温度
に耐え得る程度の耐熱性が要求されるので、例えばポリ
エチレンテレフタレートフィルムなどを使用することが
好ましい。キャリアフィルム３の片面には図示してない
がソルダーレジスト２および銅箔１との粘着剤が塗布さ
れている。この粘着剤はあとでキャリアフィルム３が剥
離できる程度の粘着性を有するものであればよい。Next, as shown in FIG. 2, the carrier film 3 is laminated on the entire surface of the solder resist 2. Since the carrier film 3 is required to have heat resistance high enough to withstand the temperature at the time of resin molding described below, it is preferable to use, for example, a polyethylene terephthalate film. Although not shown, one surface of the carrier film 3 is coated with an adhesive for the solder resist 2 and the copper foil 1. This pressure-sensitive adhesive may be any pressure-sensitive adhesive that allows the carrier film 3 to be peeled off later.
次いで図−３に示すように銅箔１のもう一方の面に形
成すべき回路パターンのとおりにエッチングレジスト４
をスクリーン印刷する。エッチングレジスト４としては
接着性、電気絶縁性のよいものを使用することが好まし
く、例えば住友スリーエム社のJA−7437などが適当であ
る。Next, as shown in FIG. 3, the etching resist 4 is formed according to the circuit pattern to be formed on the other surface of the copper foil 1.
Screen print. As the etching resist 4, it is preferable to use one having good adhesiveness and electric insulation, and for example, JA-7437 manufactured by Sumitomo 3M Ltd. is suitable.
次いで銅箔１のエッチングを行い、図−４に示すよう
に回路パターン５を形成する。その後、図−５に示すよ
うに回路パターン５側の面に接着剤６を塗布すれば、回
路転写フィルム７が出来あがる。Next, the copper foil 1 is etched to form a circuit pattern 5 as shown in FIG. After that, as shown in FIG. 5, the adhesive 6 is applied to the surface on the circuit pattern 5 side, whereby the circuit transfer film 7 is completed.
次いでこの回路転写フィルム７を図−６に示すように
モールド成形用の金型8A・8Bの一方の内面にセットす
る。回路転写フィルム７のセットは、真空吸着法あるい
は粘着剤などにより、キャリアフィルム５側の面が一方
の金型8Aの内面に接するように行われる。この状態で金
型8A・8B内に樹脂を注入してモールド成形を行えば、図
−７に示すように回路転写フィルム７と一体の樹脂成形
体９が得られるから、その後、キャリアフィルム３を剥
離すれば、樹脂成形体９上に銅箔回路パターン５が一体
に設けられ、しかもその表面にソルダーレジスト２が印
刷されたモールド回路基板が出来あがる。Next, the circuit transfer film 7 is set on one of the inner surfaces of the molds 8A and 8B for molding as shown in FIG. The circuit transfer film 7 is set by a vacuum suction method or an adhesive so that the surface on the carrier film 5 side is in contact with the inner surface of one mold 8A. If resin is injected into the molds 8A and 8B in this state and molding is performed, a resin molded body 9 integrated with the circuit transfer film 7 is obtained as shown in FIG. When peeled off, a copper foil circuit pattern 5 is integrally provided on the resin molded body 9, and a molded circuit board having the solder resist 2 printed on the surface thereof is completed.
なお上記実施例では、回路転写フィルム７の裏面に接
着剤６の層を設けたが、モールド成形される樹脂が接着
性を有する場合はこれを省略することができる。またエ
ッチングレジストは、感光性ドライフィルムを用いてフ
ォトリソグラフィーにより形成することも可能であり、
この場合はエッチング後、レジスト剥離工程が必要であ
る。Although the layer of the adhesive 6 is provided on the back surface of the circuit transfer film 7 in the above embodiment, it can be omitted if the resin to be molded has adhesiveness. The etching resist can also be formed by photolithography using a photosensitive dry film,
In this case, a resist stripping step is necessary after etching.
以上説明したように本発明によれば、樹脂成形体に銅
箔回路パターンが一体に設けられ、しかもその表面にソ
ルダーレジストが印刷されたモールド回路基板を、無電
解メッキ法によらずに効率よく製造することができ、こ
の種のモールド回路基板のコスト低減に顕著な効果があ
る。As described above, according to the present invention, a copper foil circuit pattern is integrally provided on a resin molded body, and a molded circuit board having a solder resist printed on the surface thereof can be efficiently used without using an electroless plating method. It can be manufactured and has a significant effect on the cost reduction of this type of molded circuit board.
図−１ないし図−７は本発明の一実施例に係るモールド
回路基板の製造方法を工程順に示す断面図である。 1:銅箔、2:ソルダーレジスト、3:キャリアフィルム、4:
エッチングレジスト、5:銅箔回路パターン、6:接着剤、
7:回路転写フィルム、8A・8B:金型、9:樹脂成形体。1 to 7 are cross-sectional views showing a method of manufacturing a molded circuit board according to an embodiment of the present invention in the order of steps. 1: Copper foil, 2: Solder resist, 3: Carrier film, 4:
Etching resist, 5: Copper foil circuit pattern, 6: Adhesive,
7: Circuit transfer film, 8A / 8B: Mold, 9: Resin molded product.
Claims (1)
工程、その上にキャリアフィルムをラミネートする工
程、上記銅箔の他面にエッチングレジストを印刷する工
程、銅箔をエッチングして回路パターンを形成する工
程、以上のようにして形成された回路転写フィルムをキ
ャリアフィルム側の面が金型内面に接するように金型内
にセットしてモールド成形を行い、樹脂成形体を形成す
る工程、上記キャリアフィルムを剥離する工程を含むこ
とを特徴とするモールド回路基板の製造方法。1. A step of printing a solder resist on one side of a copper foil, a step of laminating a carrier film thereon, a step of printing an etching resist on the other side of the copper foil, and a circuit pattern by etching the copper foil. Forming step, the circuit transfer film formed as described above is set in the mold so that the surface on the side of the carrier film is in contact with the inner surface of the mold and mold-molded to form a resin molded body, A method of manufacturing a molded circuit board, comprising a step of peeling a carrier film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63094431A JP2542416B2 (en) | 1988-04-19 | 1988-04-19 | Manufacturing method of mold circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63094431A JP2542416B2 (en) | 1988-04-19 | 1988-04-19 | Manufacturing method of mold circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01266789A JPH01266789A (en) | 1989-10-24 |
| JP2542416B2 true JP2542416B2 (en) | 1996-10-09 |
Family
ID=14110052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63094431A Expired - Fee Related JP2542416B2 (en) | 1988-04-19 | 1988-04-19 | Manufacturing method of mold circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2542416B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4036592A1 (en) * | 1990-11-16 | 1992-05-21 | Bayer Ag | INJECTION MOLDED CIRCUITS BY INJECTING FLEXIBLE CIRCUITS WITH THERMOPLASTIC MATERIALS |
| US6085414A (en) * | 1996-08-15 | 2000-07-11 | Packard Hughes Interconnect Company | Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom |
-
1988
- 1988-04-19 JP JP63094431A patent/JP2542416B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01266789A (en) | 1989-10-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |