JP2532513B2 - Object presence inspection method - Google Patents
Object presence inspection methodInfo
- Publication number
- JP2532513B2 JP2532513B2 JP62245186A JP24518687A JP2532513B2 JP 2532513 B2 JP2532513 B2 JP 2532513B2 JP 62245186 A JP62245186 A JP 62245186A JP 24518687 A JP24518687 A JP 24518687A JP 2532513 B2 JP2532513 B2 JP 2532513B2
- Authority
- JP
- Japan
- Prior art keywords
- histogram
- inspection
- shadow
- inspection object
- luminance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Geophysics And Detection Of Objects (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は製造工程中の検査工程において、検査対象物
である部品等がある特定の位置に存在することを判断す
る物体有無検査方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an object presence / absence inspecting method for deciding that a part or the like to be inspected is present at a specific position in an inspecting process during a manufacturing process. .
従来の技術 検査対象物がある特定の位置に存在する事を検査する
方法の一つとして検査対象物の影を用いる方法が提案さ
れていた。検査対象物の斜め上方に設置した照明装置に
て対象物を照らしたときに生じる影の範囲に２値画によ
る面積計測領域を設定し、前記照明を照らして得られる
面積計測領域内の面積値が予め設定されている値より小
さい場合は影が生じているとして検査対象物が存在して
いると判断し、面積値が予め設定されている値以上なら
ば影が生じていないとして検査対象物が存在していない
と判断する方法である。2. Description of the Related Art A method of using a shadow of an inspection object has been proposed as one of methods for inspecting that the inspection object exists at a specific position. An area value within the area measurement area obtained by illuminating the illumination by setting an area measurement area based on a binary image in a range of a shadow generated when the object is illuminated by an illumination device installed obliquely above the inspection object. Is smaller than a preset value, it is determined that a shadow is present and the inspection object is present. If the area value is equal to or larger than a preset value, a shadow is not generated and the inspection object is Is a method of determining that there is not.
発明が解決しようとする問題点 しかしながら上記の従来の方法では、検査対象物の背
景に材質による反射状態のバラツキがある場合や、検査
対象物の近傍にある他の検査対象物等による反射光によ
り検査対象物の影がうすくなる場合、また背景が反射し
にくい材質，色である場合には、検査対象物が存在して
いるにもかかわらず面積値が大きく検査対象物が無いと
検出したり、逆に検査対象物が存在していなくとも面積
値が小さく検査対象物が有ると検出してしまうという問
題点を有していた。Problems to be Solved by the Invention However, in the above-mentioned conventional method, when there is variation in the reflection state due to the material in the background of the inspection object, or due to the reflected light from other inspection objects in the vicinity of the inspection object, etc. If the shadow of the inspection object is faint, or if the background is a material or color that is difficult to reflect, it may be detected that the area value is large and there is no inspection object even though the inspection object exists. On the contrary, there is a problem that even if the inspection object does not exist, the area value is small and it is detected that the inspection object exists.
問題点を解決するための手段 そこで本発明の物体有無検査方法では、検査対象物の
斜め上方に照明装置を設置し対象物の影を作りこの影が
できる範囲に輝度ヒストグラムを求めるヒストグラム領
域を設定し、かつ対象物をはさんで前記照明装置と相対
する位置に照明装置を設定し対象物を照らして前記の影
と相対する方向に影を作りこの影ができる範囲に輝度ヒ
ストグラム領域を設定し、前記２つの照明装置を片方ず
つ発光させて２つのヒストグラム領域のそれぞれにおい
て輝度ヒストグラムを２種類ずつ取込み、どちらのヒス
トグラム領域においても２種類の輝度ヒストグラムが異
なることを比較検出することで検査対象物が存在してい
ると判断する構成である。輝度ヒストグラムの比較はヒ
ストグラムの特微量である中央値，平均値，輝度の広が
りを求め行なう。Therefore, in the object presence / absence inspection method of the present invention, a lighting device is installed diagonally above the inspection object to form a shadow of the object, and a histogram area for obtaining a luminance histogram is set in a range where the shadow is formed. In addition, the illumination device is set at a position facing the illumination device with the object sandwiched, and the object is illuminated to form a shadow in the direction opposite to the shadow, and the brightness histogram area is set in the range where this shadow can be created. , The two illumination devices are made to emit light one by one, two types of luminance histograms are taken in each of the two histogram regions, and by comparing and detecting that the two types of luminance histograms are different in both histogram regions, the inspection object is detected. Is determined to exist. The brightness histograms are compared by finding the median value, the average value, and the spread of brightness, which are the features of the histograms.
作用 本発明は上記方法により、検査対象物の背景に材質に
よる反射状態のバラツキがある場合や、検査対象物近傍
の他の検査対象物の反射光により検査対象物の影がうす
くなる場合、そして背景が反射しにくい材質，色で２値
画の面積計測では背景像と影に差を見い出しにくい場合
においても、検査対象物の斜め上方に設置した２つの照
明装置を片方ずて発光させ得られる２種類の輝度ヒスト
グラムを比較するため、背景の反射状態のバラツキによ
る影響は打ち消されることとなり、かつ輝度ヒストグラ
ムで比較するため面積計測で見い出せない差を容易に検
出できるため、より正確な有無検査が可能である。また
ヒストグラム領域が２か所であるため検査結果を２か所
の積とすることで検査信頼生も高いものとなる。Effect The present invention, by the above method, when there is a variation in the reflection state due to the material on the background of the inspection object, or when the shadow of the inspection object becomes thin due to the reflected light of other inspection objects in the vicinity of the inspection object, and Even if it is difficult to find the difference between the background image and the shadow by measuring the area of a binary image with a material and color in which the background is difficult to reflect, it is possible to use one of the two lighting devices installed diagonally above the inspection object to emit light. Since the two types of luminance histograms are compared, the influence of variations in the reflection state of the background is canceled out, and the comparison with the luminance histogram makes it possible to easily detect differences that cannot be found by area measurement, so a more accurate presence / absence test can be performed. It is possible. Further, since there are two histogram regions, the inspection reliability is high by multiplying the inspection result by two.
実 施 例 本発明の一実施例を図を用いて説明する。第１図は本
実施例の物体有無検査方法のフローチャート、第２図は
実施例であるチップ部品装着検査装置の概略の構成図、
第３図はチップ部品装置検査装置（以下、チップ検査装
置と略す）における輝度ヒストグラム例である。本実施
例のチップ検査装置は回路基板６上に装着されたチップ
部品７の有無を検査するもので、本発明の物体有無検出
方法をそのまま用いている。検査対象物であるチップ部
品７と照明装置8,9と輝度ヒストグラムを取込むためのT
Vカメラ12との位置関係は第２図の通りであり、他のチ
ップ部品の検査のために照明装置とTVカメラは回路基板
上をロボットにより平行移動する。Example An example of the present invention will be described with reference to the drawings. FIG. 1 is a flow chart of an object presence / absence inspection method according to the present embodiment, and FIG. 2 is a schematic configuration diagram of a chip component mounting inspection device according to the embodiment.
FIG. 3 is an example of a luminance histogram in a chip component device inspection device (hereinafter abbreviated as chip inspection device). The chip inspection apparatus of this embodiment inspects the presence or absence of the chip component 7 mounted on the circuit board 6, and uses the object presence / absence detection method of the present invention as it is. T for capturing the chip part 7 which is the inspection object, the lighting devices 8 and 9, and the brightness histogram
The positional relationship with the V camera 12 is as shown in FIG. 2, and the illumination device and the TV camera are moved in parallel on the circuit board by the robot in order to inspect other chip parts.
さて実施例のチップ検査装置の動作を第１図に基づき
説明する。前処理としてチップ検査装置としての画像処
理等の処理全体を行なう画像認識装置13にチップ部品の
位置，外形寸法，種類等のデータを入力しヒストグラム
領域の位置，大きさを設定しておく。検査のステップ１
では、照明装置８を発光しチップ部品の影10を生じさせ
ヒストグラム領域14,15において輝度ヒストグラムA1,B1
を取込む。ステップ２では照明装置９を発光しチップ部
品の影11を生じさせヒストグラム領域14,15において輝
度ヒストグラムA2,B2を取込む。ステップ３では取込ん
だ輝度ヒストグラムA1とA2,B1とB2を比較する。比較に
は取込んだ輝度ヒストグラムを数学的に処理し、ヒスト
グラムの中央値，平均値，輝度の広がりを求めて比較す
る。第３図の輝度ヒストグラムはヒストグラム領域14に
おける例でその平均値はヒストグラムA1でm1,ヒストグ
ラムA2でm2と求まる。比較結果の判定は予め定めた許容
値をもとにし、中央値，平均値の差が許容値を越えた場
合に輝度ヒストグラムが異なると判定するものとする。
これは輝度ヒストグラムを取込む際の丸め誤差と２つの
照明装置の光量差を考慮するためである。比較の結果、
輝度ヒストグラムA1とA2,B1とB2のどちらも差がある場
合は検査対象物が存在すると判断し（ステップ４）、輝
度ヒストグラムA1とA2,B1とB2のどちらか一方でも差が
ない場合は検査対象物が無いと判断する（ステップ
５）。第３図の例では輝度ヒストグラムの平均値に注目
しており、それぞれの輝度ヒストグラムの平均値の差が
予め設定された許容値Ｍより大きいと判断され、検査対
象物が存在していると検出できている。Now, the operation of the chip inspection apparatus of the embodiment will be described with reference to FIG. Data such as the position, external dimensions, and type of chip parts are input to the image recognition device 13 that performs the entire processing such as image processing as a chip inspection device as preprocessing, and the position and size of the histogram area are set. Inspection step 1
Then, the illuminating device 8 is caused to emit light to generate the shadow 10 of the chip component, and the luminance histograms A 1 and B 1 are generated in the histogram regions 14 and 15.
Take in. In step 2, the illumination device 9 emits light to generate a shadow 11 of the chip component, and the luminance histograms A 2 and B 2 are captured in the histogram regions 14 and 15. In step 3, the captured brightness histograms A 1 and A 2 , and B 1 and B 2 are compared. For comparison, the captured luminance histogram is mathematically processed, and the median value, average value, and luminance spread of the histogram are obtained and compared. The average value in the example in the luminance histogram of FIG. 3 is a histogram region 14 m 1 histogram A 1, obtained and m 2 in the histogram A 2. The comparison result is determined based on a predetermined allowable value, and it is determined that the brightness histograms are different when the difference between the median and the average value exceeds the allowable value.
This is because the rounding error when capturing the brightness histogram and the light amount difference between the two lighting devices are taken into consideration. As a result of the comparison,
If there is a difference between the brightness histograms A 1 and A 2 , and B 1 and B 2 , it is judged that the inspection object exists (step 4), and either of the brightness histograms A 1 and A 2 or B 1 and B 2 If there is no difference even on the one hand, it is judged that there is no inspection object (step 5). In the example of FIG. 3, attention is paid to the average value of the luminance histograms, it is determined that the difference between the average values of the luminance histograms is larger than a preset allowable value M, and it is detected that an inspection target object exists. is made of.
発明の効果 以上のように本発明によれば、予め設定されたヒスト
グラム領域における照明方向の異なる２種類の輝度ヒス
トグラムを取込み、その差から検査対象物の有無を判断
するため、従来の面積計測による方法では誤検出してい
た場合でも正確な物体有無検査が可能となる。また判定
に用いられるとヒストグラム領域は２か所であり検査結
果は２か所の積とするため検査の信頼性向上にもつなが
る。更に照明装置を２つ追加し検査対象物の四方にヒス
トグラム領域を設定することで、検査対象の多様化によ
り一層の検査信頼性向上が可能である。EFFECTS OF THE INVENTION As described above, according to the present invention, two types of luminance histograms having different illumination directions in a preset histogram region are captured, and the presence or absence of the inspection object is determined based on the difference between them. With the method, it is possible to accurately inspect the presence or absence of an object even if it is erroneously detected. Further, when it is used for determination, the histogram area is two places and the inspection result is the product of two places, which leads to improvement of the reliability of the inspection. Furthermore, by adding two illuminating devices and setting histogram areas on all four sides of the inspection object, it is possible to further improve the inspection reliability by diversifying the inspection object.
第１図は本発明の一実施例における物体有無検査方法の
フローチャート、第２図（ａ），（ｂ）はチップ検査装
置の概略の側面図，平面図、第３図（ａ），（ｂ）は本
発明の一実施例における物体有無検査方法の輝度ヒスト
グラムの例を示した図である。 ６……回路基板、７……チップ部品、8,9……照明装
置、10,11……影、12……TVカメラ、13……画像認識装
置。FIG. 1 is a flow chart of an object presence / absence inspection method according to an embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are schematic side views, plan views, and FIGS. 3 (a) and 3 (b) of a chip inspection apparatus. 8] is a diagram showing an example of a luminance histogram of the object presence / absence inspection method according to the embodiment of the present invention. 6 ... Circuit board, 7 ... Chip parts, 8,9 ... Illumination device, 10,11 ... Shadow, 12 ... TV camera, 13 ... Image recognition device.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 森本 敏夫 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭59−138974（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshio Morimoto 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-59-138974 (JP, A)
Claims (1)
し、対象物を照らして対象物の影を作り、この影ができ
る範囲に輝度ヒストグラムを求めるヒストグラム領域を
設定し、かつ対象物をはさんで前記照明装置と相対する
位置に照明装置を設定し対象物を照らして前記の影と相
対する方向に対象物の影を作り、この影ができる範囲に
輝度ヒストグラムを求めるヒストグラム領域を設定し、
これら２つのヒストグラム領域について前記の各々の照
明で照らしたときに得られる２種類のヒストグラムの違
いにより検査対象の存在を検査する物体有無検査方法。1. An illuminating device is installed diagonally above an object to be inspected, the object is illuminated to form a shadow of the object, and a histogram area for obtaining a luminance histogram is set in a range where the shadow is formed, and the object is Set a lighting device at a position opposite to the lighting device by sandwiching it, illuminate the object, create a shadow of the object in a direction opposite to the shadow, and set a histogram area to obtain a luminance histogram in the range where this shadow can be created. Then
An object presence / absence inspection method for inspecting the existence of an inspection object by the difference between two types of histograms obtained when these two histogram regions are illuminated by each of the above-mentioned illuminations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62245186A JP2532513B2 (en) | 1987-09-29 | 1987-09-29 | Object presence inspection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62245186A JP2532513B2 (en) | 1987-09-29 | 1987-09-29 | Object presence inspection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6486090A JPS6486090A (en) | 1989-03-30 |
| JP2532513B2 true JP2532513B2 (en) | 1996-09-11 |
Family
ID=17129892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62245186A Expired - Fee Related JP2532513B2 (en) | 1987-09-29 | 1987-09-29 | Object presence inspection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2532513B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6024349B2 (en) * | 2012-09-28 | 2016-11-16 | サクサ株式会社 | Monitoring device and monitoring system |
| CN114128418B (en) * | 2019-07-26 | 2023-10-20 | 株式会社富士 | Inspection apparatus |
-
1987
- 1987-09-29 JP JP62245186A patent/JP2532513B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6486090A (en) | 1989-03-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |