JP2520434Y2 - Board fixing chip fittings - Google Patents
Board fixing chip fittingsInfo
- Publication number
- JP2520434Y2 JP2520434Y2 JP4189591U JP4189591U JP2520434Y2 JP 2520434 Y2 JP2520434 Y2 JP 2520434Y2 JP 4189591 U JP4189591 U JP 4189591U JP 4189591 U JP4189591 U JP 4189591U JP 2520434 Y2 JP2520434 Y2 JP 2520434Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- board
- board fixing
- portions
- fixing chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【0001】[0001]
【産業上の利用分野】この考案は基板固定用チップ金具
に関し、特に、回路基板の固定を容易にするとともに、
回路基板の固定により生じる応力集中を防止することが
できる基板固定用チップ金具に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board fixing chip metal fitting, and particularly, to facilitate fixing of a circuit board,
The present invention relates to a board fixing chip fitting that can prevent stress concentration caused by fixing a circuit board.
【0002】[0002]
【従来技術および解決しようとする課題】従来、ハイブ
リッドICおよびプリント配線基板等の回路基板を装置
本体等に固定するには、ねじ、半田付け、または、軟質
性のゴム系接着剤等により直接固定する方法が採用され
ている。2. Description of the Related Art Conventionally, in order to fix a circuit board such as a hybrid IC and a printed wiring board to an apparatus main body or the like, it is directly fixed with screws, soldering, or a soft rubber adhesive. Has been adopted.
【0003】しかしながら、前記の固定方法において
は、回路基板の材質がアルミナ、ガラエポ材等であるた
め、回路基板と装置本体等とは雰囲気温度の変化に対す
る線膨張が相違するため、回路基板に機械的応力を生じ
るとともに、回路基板の出力特性にも悪影響をおよぼす
おそれがある。However, in the fixing method described above, since the circuit board is made of alumina, glass epoxy, or the like, the circuit board and the main body of the apparatus have different linear expansions with respect to changes in ambient temperature. There is a risk that the output stress of the circuit board may be adversely affected as well as the dynamic stress is generated.
【0004】また、外部からの振動、衝撃が直接回路基
板に伝わる構造であるため、この振動、衝撃によって、
回路基板が破損するという問題点を有していた。Further, since the external vibration and shock are directly transmitted to the circuit board, the vibration and shock cause
There is a problem that the circuit board is damaged.
【0005】この考案の目的は、回路基板に機械的応力
を生じさせることなく、回路基板を固定することができ
るとともに、外部からの振動、衝撃に対してもこれらを
吸収して、回路基板の回路特性に悪影響を与えない基板
固定用チップ金具を提供することにある。The object of the present invention is to fix the circuit board without causing mechanical stress to the circuit board, and also to absorb the external vibration and shock so that the circuit board can An object of the present invention is to provide a board fixing chip fitting that does not adversely affect circuit characteristics.
【0006】[0006]
【課題を解決するための手段】上記の目的を達成するた
めに、この考案は装置本体に回路基板を固定する基板固
定用チップ金具であって、この基板固定用チップ金具
は、所定の幅となっている板材を、その両端部をほぼ平
行な状態に折り返して中央部を湾曲状に形成し、この湾
曲状の中央部を内方に折り込んで両端部間に位置する湾
曲部を形成し、この湾曲部の一端部側でバネ部を形成す
るとともに、前記湾曲部の他端部側で前記バネ部よりも
外方に位置するささえ部を形成し、前記板材の一端部で
半田付け部を形成し、この半田付け部を前記回路基板に
固定するとともに、前記ささえ部を前記装置本体に設け
たささえ溝に嵌合させ、これにより、前記回路基板を装
置本体に固定するという手段を採用したものであり、前
記板材の一端から幅方向に直交する方向に所定の長さの
スリットを設け、また、前記ささえ部の周面は前記装置
本体に設けられたささえ溝の形状に応じた形状となって
いるという手段を採用したものである。In order to achieve the above object, the present invention is a board fixing chip fitting for fixing a circuit board to an apparatus body, wherein the board fixing chip fitting has a predetermined width. The both ends of the plate material are folded back in a substantially parallel state to form a curved central portion, and the curved central portion is folded inward to form a curved portion located between both end portions. A spring portion is formed on one end side of the curved portion, and a supporting portion located outside the spring portion is formed on the other end side of the curved portion, and a soldering portion is formed on one end portion of the plate material. The soldering portion is formed and fixed to the circuit board, and the supporting portion is fitted into the supporting groove provided in the device body, whereby the circuit board is fixed to the device body. Width from one end of the plate A slit having a predetermined length is provided in a direction orthogonal to the direction, and the peripheral surface of the support portion has a shape corresponding to the shape of the support groove provided in the device body. is there.
【0007】[0007]
【作用】この考案は上記の手段を採用したことにより、
回路基板に機械的応力を生じさせることなく、回路基板
を固定することができる。また、外部からの振動、衝撃
を吸収して回路基板の出力特性を向上させることができ
る。The present invention adopts the above means,
The circuit board can be fixed without causing mechanical stress to the circuit board. Further, it is possible to improve the output characteristics of the circuit board by absorbing external vibration and shock.
【0008】[0008]
【実施例】以下、図面に示すこの考案の実施例について
説明する。図1〜図3にはこの考案による基板固定用チ
ップ金具の一の実施例が示され、図4には基板固定用チ
ップ金具を使用して装置本体に回路基板を固定した状態
が示されている。この基板固定用チップ金具2は、図3
に示すように所定の幅となっている鉄系または銅系等の
弾性を有する板材1から図1、図2に示すように一体に
形成したものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention shown in the drawings will be described below. 1 to 3 show an embodiment of a board fixing chip fitting according to the present invention, and FIG. 4 shows a state in which a circuit board is fixed to an apparatus main body using the board fixing tip fitting. There is. This board fixing chip fitting 2 is shown in FIG.
As shown in FIG. 1, the elastic plate material 1 having a predetermined width such as iron or copper is integrally formed as shown in FIGS.
【0009】すなわち、この基板固定用チップ金具2
は、所定の幅となっている板材1を、その両端部をほぼ
平行な状態に折り返して中央部を湾曲状に形成し、この
湾曲状の中央部を内方に折り込んで両端部間に位置する
湾曲部5を形成し、この湾曲部5の一端部側でバネ部4
を形成するとともに、前記湾曲部5の他端部側で前記バ
ネ部4よりも外方に位置するささえ部6を形成する。That is, this board fixing chip fitting 2
Is a plate material 1 having a predetermined width, which is folded back in such a manner that both ends thereof are substantially parallel to each other to form a curved central portion, and the curved central portion is folded inward to locate between the both end portions. The curved portion 5 is formed, and the spring portion 4 is formed on one end side of the curved portion 5.
And a supporting portion 6 located outside the spring portion 4 on the other end side of the bending portion 5.
【0010】このように、基板固定用チップ金具2は、
図2に示すように所定の曲率で湾曲する断面略S字形状
に形成され、前記板材1の一端部で半田付け部7が形成
される。また、この半田付け部7には、前記板材1の一
端から幅方向に直交する方向にスリット3が設けられ、
このスリット3の先端部分は円形に形成されている。さ
らに、前記ささえ部6の周面はこれが嵌合するささえ溝
11の形状に対応した形状をし、この実施例においては
直線状となっている。As described above, the board fixing chip metal fitting 2 is
As shown in FIG. 2, it is formed in a substantially S-shaped cross section that is curved with a predetermined curvature, and a soldering portion 7 is formed at one end of the plate material 1. Further, the soldering portion 7 is provided with a slit 3 in a direction orthogonal to the width direction from one end of the plate material 1,
The tip portion of this slit 3 is formed in a circular shape. Further, the peripheral surface of the support portion 6 has a shape corresponding to the shape of the support groove 11 into which the support portion 6 fits, and is linear in this embodiment.
【0011】上記構成による基板固定用チップ金具2を
使用して回路基板8を装置本体9に固定するには、ま
ず、回路基板8の周縁部の所定の箇所に、基板固定用チ
ップ金具2の半田付け部7を半田付けして固定する。一
方、装置本体9の内壁には段部10を設け、この段部1
0の上部にささえ溝11を設ける。In order to fix the circuit board 8 to the main body 9 of the apparatus by using the board fixing chip fitting 2 having the above structure, first, the board fixing chip fitting 2 is fixed at a predetermined position on the peripheral portion of the circuit board 8. The soldering part 7 is soldered and fixed. On the other hand, a step portion 10 is provided on the inner wall of the apparatus body 9, and the step portion 1
A support groove 11 is provided on the upper part of 0.
【0012】そして、図4に示すように、前記基板固定
用チップ金具2を固定した回路基板8を装置本体9内部
に位置させ、基板固定用チップ金具2のささえ部6を装
置本体9のささえ溝11に嵌合させ、回路基板8を前記
段部10に当接させる。Then, as shown in FIG. 4, the circuit board 8 to which the board fixing chip fitting 2 is fixed is positioned inside the apparatus main body 9, and the supporting portion 6 of the board fixing chip fitting 2 is held in the apparatus main body 9. The circuit board 8 is brought into contact with the step portion 10 by fitting in the groove 11.
【0013】上記のように回路基板8を基板固定用チッ
プ金具2で固定すると、雰囲気温度の変化により回路基
板8に生じる機械的応力を湾曲部5およびバネ部4が緩
和して、回路基板8の出力特性に悪影響を与えない。ま
た、外部からの振動、衝撃を前記湾曲部5およびバネ部
4が吸収するため、この振動、衝撃によって、回路基板
8が破損するおそれがない。When the circuit board 8 is fixed by the board fixing chip fitting 2 as described above, the bending portion 5 and the spring portion 4 relieve the mechanical stress generated in the circuit board 8 due to the change in the ambient temperature, and the circuit board 8 Does not adversely affect the output characteristics of the. Further, since the bending portion 5 and the spring portion 4 absorb external vibrations and shocks, there is no possibility that the circuit board 8 is damaged by the vibrations and shocks.
【0014】そして、基板固定用チップ金具2の半田付
け部7には、スリット3が設けられているため、半田付
け時の半田12の逃げを容易にするとともに、接合面積
を少なくすることができるため、半田12による応力集
中や半田12内のボイド等を極力少なくすることができ
る。Since the slit 3 is provided in the soldering portion 7 of the board fixing chip fitting 2, the solder 12 can easily escape during soldering and the joint area can be reduced. Therefore, stress concentration due to the solder 12 and voids in the solder 12 can be minimized.
【0015】また、この基板固定用チップ金具2にはバ
ネ部4、湾曲部5、ささえ部6が設けられているため、
高さを低くすることができる構造であり、表面実装部品
として使用することができる。さらに、装置本体9に基
板固定用チップ金具2を使用して回路基板8を固定する
と、前記装置本体9と回路基板8とが基板固定用チップ
金具2を介して接続されるため、前記基板固定用チップ
金具2はアースの接点として使用することができる。Further, since the board fixing chip fitting 2 is provided with the spring portion 4, the bending portion 5 and the supporting portion 6,
It has a structure that can be reduced in height and can be used as a surface mount component. Furthermore, when the circuit board 8 is fixed to the device body 9 by using the board fixing chip fitting 2, the device body 9 and the circuit board 8 are connected via the board fixing chip fitting 2, so that the board fixing is performed. The tip fitting 2 can be used as a ground contact.
【0016】図5にはこの考案による基板固定用チップ
金具の他の実施例が示され、図6には基板固定用チップ
金具を使用して装置本体に回路基板を固定した状態が示
されている。この基板固定用チップ金具22は、前記一
の実施例の板材1と同様の鉄系または銅系等の弾性を有
する板材から図5に示すように一体に形成したものであ
る。FIG. 5 shows another embodiment of the board fixing chip fitting according to the present invention, and FIG. 6 shows a state in which the circuit board is fixed to the apparatus main body using the board fixing chip fitting. There is. This board fixing chip metal fitting 22 is integrally formed from a plate material having elasticity such as iron or copper similar to the plate material 1 of the first embodiment as shown in FIG.
【0017】すなわち、この基板固定用チップ金具22
は、所定の幅となっている板材を、その両端部をほぼ平
行な状態に折り返して中央部を湾曲状に形成し、この湾
曲状の中央部を内方に折り込んで両端部間に位置する湾
曲部25を形成し、この湾曲部25の一端部側でバネ部
24を形成するとともに、前記湾曲部25の他端部側で
前記バネ部24よりも外方に位置するささえ部26を形
成する。That is, this board fixing chip fitting 22
Is a plate member having a predetermined width, which is folded back in such a manner that both ends thereof are substantially parallel to each other, and a central portion is formed into a curved shape. A curved portion 25 is formed, a spring portion 24 is formed on one end side of the curved portion 25, and a supporting portion 26 located outside the spring portion 24 is formed on the other end side of the curved portion 25. To do.
【0018】このように、基板固定用チップ金具22は
所定の曲率で湾曲する断面略S字形状に形成され、前記
板材の一端部で半田付け部27が形成される。また、こ
の半田付け部27には、前記板材の一端から幅方向に直
交する方向にスリット23が設けられ、このスリット2
3の先端部分は湾曲状に形成されている。さらに、前記
ささえ部26の周面はこれが嵌合するささえ溝31の形
状に対応した形状をし、この実施例においては湾曲状と
なっている。As described above, the board fixing chip metal fitting 22 is formed in a substantially S-shaped cross section which is curved with a predetermined curvature, and the soldering portion 27 is formed at one end of the plate member. Further, the soldering portion 27 is provided with a slit 23 in a direction orthogonal to the width direction from one end of the plate material.
The tip portion of 3 is formed in a curved shape. Further, the peripheral surface of the support portion 26 has a shape corresponding to the shape of the support groove 31 into which the support portion 26 is fitted, and is curved in this embodiment.
【0019】上記構成による基板固定用チップ金具22
を使用して回路基板28を円筒状の装置本体29に固定
するには、まず、回路基板28の周縁部の所定の箇所
に、基板固定用チップ金具22の半田付け部27を半田
付けして固定する。一方、装置本体29の内壁には段部
30を設け、この段部30の上部にささえ溝31を設け
る。A board fixing chip metal member 22 having the above-mentioned structure
In order to fix the circuit board 28 to the cylindrical device body 29 by using, the soldering portion 27 of the board fixing chip metal fitting 22 is first soldered to a predetermined position on the peripheral edge of the circuit board 28. Fix it. On the other hand, a step portion 30 is provided on the inner wall of the apparatus main body 29, and a support groove 31 is provided on the upper portion of the step portion 30.
【0020】そして、図6に示すように、前記基板固定
用チップ金具22を固定した回路基板28を装置本体2
9内部に位置させ、基板固定用チップ金具22のささえ
部26を装置本体29のささえ溝31に嵌合させ、回路
基板28を前記段部30に当接させる。Then, as shown in FIG. 6, the circuit board 28 to which the board fixing chip metal fitting 22 is fixed is attached to the main body 2 of the apparatus.
9, the supporting portion 26 of the board fixing chip metal fitting 22 is fitted into the supporting groove 31 of the apparatus main body 29, and the circuit board 28 is brought into contact with the step portion 30.
【0021】上記のように回路基板28を基板固定用チ
ップ金具22で固定すると、雰囲気温度の変化により回
路基板28に生じる機械的応力を湾曲部25およびバネ
部24が緩和して、回路基板28の出力特性に悪影響を
与えない。また、外部からの振動、衝撃を前記湾曲部2
5およびバネ部24が吸収するため、この振動、衝撃に
よって、回路基板28が破損するおそれがない。When the circuit board 28 is fixed by the board fixing chip metal fittings 22 as described above, the bending portion 25 and the spring portion 24 relieve the mechanical stress generated in the circuit board 28 due to the change in the ambient temperature, and the circuit board 28. Does not adversely affect the output characteristics of the. Further, the bending portion 2 is protected from external vibrations and impacts.
5 and the spring portion 24 absorb it, so that there is no risk of the circuit board 28 being damaged by this vibration or impact.
【0022】そして、基板固定用チップ金具22の半田
付け部27には、スリット23が設けられているため、
半田付け時の半田32の逃げを容易にするとともに、接
合面積を少なくすることができるため、半田32による
応力集中や半田32内のボイド等を極力少なくすること
ができる。Since the soldering portion 27 of the board fixing chip fitting 22 is provided with the slit 23,
Since the escape of the solder 32 at the time of soldering can be facilitated and the joint area can be reduced, stress concentration due to the solder 32 and voids in the solder 32 can be reduced as much as possible.
【0023】また、この基板固定用チップ金具22には
バネ部24、湾曲部25、ささえ部26が設けられて、
折り曲げられているため、高さを低くすることができる
構造であり、表面実装部品として使用することができ
る。さらに、装置本体29に基板固定用チップ金具22
を使用して回路基板28を固定すると、前記装置本体2
9と回路基板28とが基板固定用チップ金具22を介し
て接続されるため、前記基板固定用チップ金具22はア
ースの接点として使用することができる。Further, the board fixing chip fitting 22 is provided with a spring portion 24, a bending portion 25, and a supporting portion 26,
Since it is bent, it has a structure that can be reduced in height and can be used as a surface mount component. In addition, the device main body 29 is provided with a board fixing chip fitting 22
When the circuit board 28 is fixed using the
Since 9 and the circuit board 28 are connected via the board fixing chip fitting 22, the board fixing chip fitting 22 can be used as a ground contact.
【0024】[0024]
【考案の効果】この考案は前記のように構成したことに
より、回路基板の周縁部の所定の箇所に、基板固定用チ
ップ金具を半田付けし、この基板固定用チップ金具が取
付けられた回路基板を装置本体に、基板固定用チップ金
具のささえ部を装置本体のささえ溝に嵌合させることに
より容易に取付けることができる。また、回路基板と装
置本体との雰囲気温度の変化により回路基板に生じる機
械的応力を湾曲部およびバネ部が緩和して、回路基板の
出力特性に悪影響を与えない。そして、外部からの振
動、衝撃を前記湾曲部およびバネ部が吸収するため、こ
の振動、衝撃によって、回路基板が破損するおそれがな
い。The present invention is configured as described above, so that a board fixing chip metal fitting is soldered to a predetermined position on the peripheral portion of the circuit board and the circuit board fixing chip metal fitting is attached. Can be easily attached to the main body of the apparatus by fitting the support portion of the chip fixing metal fitting for the substrate into the support groove of the main body of the apparatus. Further, the bending portion and the spring portion relieve the mechanical stress generated in the circuit board due to the change in the ambient temperature between the circuit board and the apparatus main body, and the output characteristics of the circuit board are not adversely affected. Further, since the bending portion and the spring portion absorb vibrations and impacts from the outside, there is no possibility of damaging the circuit board due to the vibrations and impacts.
【0025】また、基板固定用チップ金具の半田付け部
には、スリットが設けられているため、半田付け時の半
田の逃げを容易にするとともに、接合面積を少なくする
ことができるため、半田による応力集中や半田内のボイ
ド等を極力少なくすることができる。そして、この基板
固定用チップ金具にはバネ部、湾曲部およびささえ部が
設けられて、折り曲げられているため、高さを低くする
ことができる構造であり、表面実装部品として使用する
ことができる。Further, since the slits are provided in the soldering portion of the board fixing chip fitting, the solder can easily escape during soldering, and the joint area can be reduced. Stress concentration and voids in the solder can be reduced as much as possible. The board fixing chip fitting is provided with a spring portion, a bending portion, and a supporting portion and is bent, so that the height can be reduced and it can be used as a surface mount component. .
【0026】さらに、装置本体に基板固定用チップ金具
を使用して回路基板を固定すると、前記装置本体と回路
基板とが基板固定用チップ金具を介して接続されるた
め、前記基板固定用チップ金具はアースの接点として使
用することができるというすぐれた効果を有するもので
ある。Further, when the circuit board is fixed to the main body of the apparatus by using the board fixing chip fitting, the apparatus main body and the circuit board are connected through the board fixing chip fitting, so that the board fixing chip fitting is connected. Has an excellent effect that it can be used as a ground contact.
【図1】この考案による基板固定用チップ金具の一の実
施例を示す概略平面図である。FIG. 1 is a schematic plan view showing an embodiment of a substrate fixing chip fitting according to the present invention.
【図2】この考案による基板固定用チップ金具の一の実
施例を示す概略正面図である。FIG. 2 is a schematic front view showing one embodiment of a board fixing chip fitting according to the present invention.
【図3】この考案による基板固定用チップ金具の一の実
施例の板材を示す概略図である。FIG. 3 is a schematic view showing a plate member of one embodiment of a chip fixing metal fitting for a substrate according to the present invention.
【図4】この考案による一の実施例の基板固定用チップ
金具を使用して、回路基板を装置本体に取付けた状態を
示す概略断面図である。FIG. 4 is a schematic cross-sectional view showing a state in which a circuit board is attached to the apparatus main body by using the board fixing chip fitting of one embodiment according to the present invention.
【図5】この考案による基板固定用チップ金具の他の実
施例を示す概略平面図である。FIG. 5 is a schematic plan view showing another embodiment of the substrate fixing chip fitting according to the present invention.
【図6】この考案による他の実施例の基板固定用チップ
金具を使用して、回路基板を装置本体に取付けた状態を
示す概略断面図である。FIG. 6 is a schematic cross-sectional view showing a state in which a circuit board is attached to an apparatus main body using a board fixing chip fitting of another embodiment according to the present invention.
1……板材 2、22……基板固定用チップ金具 3、23……スリット 4、24……バネ部 5、25……湾曲部 6、26……ささえ部 7、27……半田付け部 8、28……回路基板 9、29……装置本体 10、30……段部 11、31……ささえ溝 12、32……半田 1 ... Plate material 2, 22 ... Chip fixing member for substrate 3, 23 ... Slit 4, 24 ... Spring portion 5, 25 ... Curved portion 6, 26 ... Support portion 7, 27 ... Soldering portion 8 , 28 ...... Circuit board 9, 29 ...... Device body 10, 30 ...... Step portion 11, 31 ...... Support groove 12, 32 ...... Solder
Claims (3)
(8)(28)を固定する基板固定用チップ金具(2)
(22)であって、該基板固定用チップ金具(2)(2
2)は、所定の幅となっている板材(1)を、その両端
部をほぼ平行な状態に折り返して中央部を湾曲状に形成
し、この湾曲状の中央部を内方に折り込んで両端部間に
位置する湾曲部(5)(25)を形成し、該湾曲部
(5)(25)の一端部側でバネ部(4)(24)を形
成するとともに、前記湾曲部(5)(25)の他端部側
で前記バネ部(4)(24)よりも外方に位置するささ
え部(6)(26)を形成し、前記板材(1)の一端部
で半田付け部(7)(27)を形成し、該半田付け部
(7)(27)を前記回路基板(8)(28)に固定す
るとともに、前記ささえ部(6)(26)を前記装置本
体(9)(29)に設けたささえ溝(11)(31)に
嵌合させ、これにより、前記回路基板(8)(28)を
装置本体(9)(29)に固定することを特徴とする基
板固定用チップ金具。1. A board fixing chip fitting (2) for fixing a circuit board (8) (28) to an apparatus body (9) (29).
(22), wherein the board fixing chip fittings (2) (2
In 2), the plate material (1) having a predetermined width is folded back so that both ends thereof are substantially parallel to each other to form a curved central portion, and the curved central portion is folded inward to form both ends. Bending portions (5) (25) located between the portions are formed, and spring portions (4) (24) are formed at one end side of the bending portions (5) (25), and the bending portion (5) is formed. Supporting portions (6) and (26) located outside the spring portions (4) and (24) are formed on the other end side of (25), and soldering portions (6) and (26) are formed at one end of the plate material (1). 7) and (27) are formed, the soldering portions (7) and (27) are fixed to the circuit boards (8) and (28), and the supporting portions (6) and (26) are attached to the device body (9). The support boards (8) and (28) are fitted into the support grooves (11) and (31) provided in the device body (29). Board fixing tip fittings, characterized in that the fixing.
する方向に所定の長さのスリット(3)(23)を設け
た請求項1記載の基板固定用チップ金具。2. The board fixing chip fitting according to claim 1, wherein slits (3) (23) having a predetermined length are provided from one end of the plate material (1) in a direction orthogonal to the width direction.
記装置本体(9)(29)に設けられたささえ溝(1
1)(31)の形状に応じた形状となっている請求項1
記載の基板固定用チップ金具。3. The supporting groove (1) provided in the device body (9) (29) is provided on the peripheral surface of the supporting portion (6) (26).
1) The shape corresponding to the shape of (31).
Chip fittings for fixing the board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4189591U JP2520434Y2 (en) | 1991-05-09 | 1991-05-09 | Board fixing chip fittings |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4189591U JP2520434Y2 (en) | 1991-05-09 | 1991-05-09 | Board fixing chip fittings |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04127691U JPH04127691U (en) | 1992-11-20 |
JP2520434Y2 true JP2520434Y2 (en) | 1996-12-18 |
Family
ID=31922549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4189591U Expired - Lifetime JP2520434Y2 (en) | 1991-05-09 | 1991-05-09 | Board fixing chip fittings |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2520434Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7383442B2 (en) * | 2019-10-08 | 2023-11-20 | 矢崎総業株式会社 | electrical junction box |
-
1991
- 1991-05-09 JP JP4189591U patent/JP2520434Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH04127691U (en) | 1992-11-20 |
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