JP2513052B2 - Flip chip mounting equipment - Google Patents

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は集積回路装置用のバンプ電極を備えるフリッ
プチップを配線基板に実装するための装置であって、と
くに多数個の微細なバンプ電極がごく狭い配列ピッチで
設けられるフリップチップの実装に適する装置に関す
る。Description: TECHNICAL FIELD The present invention relates to a device for mounting a flip chip equipped with bump electrodes for an integrated circuit device on a wiring board. The present invention relates to a device suitable for flip chip mounting provided with an extremely narrow array pitch.

〔従来の技術〕[Conventional technology]

表示パネルやプリンタを駆動する集積回路装置では、
できるだけ小さなチップサイズで画素や印字素子である
負荷をできるだけ多数個駆動できることが要求され、か
つ負荷ごとに接続が必要になるので、数mm角の小形チッ
プに数百個の接続点を配列しなければならない。かかる
多端子の集積回路装置では、従来からのワイヤボンディ
ング用の接続パッドは狭いピッチで配列するのが困難で
かつ接続作業が非常に厄介になるので、外部接続点とし
て金やはんだのバンプ電極を用いるフリップチップとす
るのが、チップの製作面とその実装面から見て非常に有
利になる。In integrated circuit devices that drive display panels and printers,
Since it is required to drive as many loads as pixels or printing elements with a chip size as small as possible, and connections are required for each load, hundreds of connection points must be arranged on a small chip of several mm square. I have to. In such a multi-terminal integrated circuit device, it is difficult to arrange the connection pads for wire bonding in the related art at a narrow pitch and the connection work becomes very troublesome, so bump electrodes of gold or solder are used as external connection points. The flip chip to be used is very advantageous in terms of chip manufacturing and mounting.

かかる多端子のフリップチップに適する実装の要領を
第３図を参照して概要説明する。The outline of mounting suitable for such a multi-terminal flip chip will be outlined with reference to FIG.

第３図（ａ）はバンプ電極がはんだの場合で、このバ
ンプ電極2aを多数個備えるフリップチップ１を絶縁基板
４に配線導体５が配列された配線基板３上に実装するに
は、はんだの溶融温度に加熱された配線基板３にフリッ
プチップ１を軽く押し付けることによりはんだバンプ電
極2aを対応する配線導体５に接触させて溶融させた後
に、押し付け力を取り除くことにより、溶融はんだの表
面張力を利用してチップ１を配線基板３と自己整合させ
た状態で冷却してはんだを固化させる。FIG. 3 (a) shows a case where the bump electrode is solder. To mount the flip chip 1 having a large number of bump electrodes 2a on the wiring substrate 3 in which the wiring conductors 5 are arranged on the insulating substrate 4, solder is used. After the flip chip 1 is lightly pressed against the wiring substrate 3 heated to the melting temperature to bring the solder bump electrode 2a into contact with the corresponding wiring conductor 5 to melt it, the pressing force is removed to reduce the surface tension of the molten solder. The chips 1 are used to cool the chips 1 in a state of being self-aligned with the wiring board 3 to solidify the solder.

第３図（ｂ）はバンプ電極が金や銅の場合で、まず配
線基板３上に樹脂６を微量付けて置いた後に、フリップ
チップ１をこれに強く押し付けて金等のバンプ電極2bを
配線導体５によく導電接触させた状態で樹脂６を光硬化
ないしは熱硬化させることにより、樹脂６の硬化時の収
縮力と接着力を利用して導電接触状態を維持させるとと
もに、接触部を樹脂封止によって保護する。FIG. 3 (b) shows a case where the bump electrode is gold or copper. First, a small amount of resin 6 is put on the wiring board 3, and then the flip chip 1 is strongly pressed against this to wire the bump electrode 2b such as gold. The resin 6 is photo-cured or heat-cured in a state where it is in good conductive contact with the conductor 5 to maintain the conductive contact state by utilizing the shrinkage force and the adhesive force when the resin 6 is cured, and seal the contact portion with the resin. Protect by stopping.

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

しかし上述の従来の方法では、フリップチップの接続
点数を増やし、これに応じてバンプ電極の配列ピッチを
狭めようとすると、接続の均一性を保証するのがむつか
しく、かつ実装時のチップの位置合わせが困難になって
来る。However, in the above-mentioned conventional method, if the number of connection points of the flip chip is increased and the arrangement pitch of the bump electrodes is narrowed accordingly, it is difficult to ensure the uniformity of connection, and the chip alignment during mounting is difficult. Becomes difficult.

フリップチップのバンプ電極数が百個程度を越えると
バンプの高さのばらつきの最大幅が大きくなるので、実
装の際にはかなりの圧力でフリップチップを配線基板に
押し付けて高さの大なバンプ電極を変形させることによ
り配線導体との接触を均一化させるが、それでもフリッ
プチップの反りや配線基板の凹凸の影響が重なると、高
さの小なバンプ電極では配線導体との接触が不完全にな
りやすい。バンプ電極がはんだの場合はその溶融時にか
かる不均一性はかなり軽減されるが、バンプ電極が金等
の場合は接触圧力の不均一がそのまま接続の不完全とし
て最後まで残ってしまうので、極端な場合にはバンプ電
極が配線導体と全く接続されない接続不良が発生する。If the number of bump electrodes on a flip chip exceeds about 100, the maximum width of bump height variation increases, so when mounting, the flip chip is pressed against the wiring board with considerable pressure and the bumps with a large height are pressed. Although the contact with the wiring conductor is made uniform by deforming the electrode, if the influence of the warp of the flip chip or the unevenness of the wiring board overlaps, the contact with the wiring conductor will be incomplete in the bump electrode with a small height. Prone. When the bump electrode is solder, the non-uniformity that occurs when it is melted is considerably reduced, but when the bump electrode is gold, etc., the non-uniform contact pressure remains as an imperfect connection until the end, so it is extremely extreme. In that case, a connection failure occurs in which the bump electrode is not connected to the wiring conductor at all.

バンプ電極数が多くなるとその配列ピッチがこれに応
じて狭くなり、配列ピッチが50μｍ以下になると実装時
のフリップチップの配線基板との位置ずれを10μｍ程度
以下に抑える必要がある。従来からこの位置合わせはフ
リップチップの外形を配線基板上のマークに合わせるこ
とによって行なうのがふつうであるが、ずれを確実に10
μｍ以下にするのは必ずしも容易でない。はんだバンプ
電極の場合は位置ずれがあると溶融はんだが流れて接続
点間の短絡が発生しやすく、上述の自己整合による位置
合わせを利用してもバンプ電極の配列ピッチを40μｍ以
下にするのは困難である。金バンプ電極の場合は短絡の
問題はないが、位置ずれによって接続の不均一性が当然
増大する。When the number of bump electrodes increases, the arrangement pitch becomes narrower accordingly, and when the arrangement pitch becomes 50 μm or less, it is necessary to suppress the positional deviation between the flip chip and the wiring substrate during mounting to about 10 μm or less. Conventionally, this alignment is usually performed by aligning the outer shape of the flip chip with the mark on the wiring board.
It is not always easy to reduce the thickness to μm or less. In the case of solder bump electrodes, if there is misalignment, molten solder will flow and short circuits between connection points will easily occur. Even if the alignment by self-alignment described above is used, the array pitch of bump electrodes should be 40 μm or less. Have difficulty. In the case of the gold bump electrode, there is no problem of short circuit, but the nonuniformity of the connection naturally increases due to the displacement.

なお、バンプ電極の配列ピッチが狭い場合いわゆるTA
B法ないしインナーリードボンディング法も利用できる
が、リードとそのためのスペースが余分に必要になるの
で、第３図のようにフリップチップを直接フエースダウ
ンボンディングするのがやはり最も有利である。When the bump electrode array pitch is narrow, the so-called TA
Although the B method or the inner lead bonding method can be used, the leads and the space therefor are additionally required, so that the face-down bonding of the flip chip is most advantageous as shown in FIG.

本発明の目的は、かかる問題点を解決して接続点が多
い場合にも接続の均一性と位置合わせ精度を向上できる
実装装置を提供することにある。An object of the present invention is to provide a mounting apparatus that solves such problems and can improve the uniformity of connection and the alignment accuracy even when there are many connection points.

〔課題を解決するための手段〕[Means for solving the problem]

本発明によれば、第１段動作と第２段動作を行なう加
圧手段と、これにより加圧方向以外には移動自在に操作
される加圧ロッドとその先端面へのフリップチップの保
持手段を備えるチップ加圧機構と、透明な基板受台と配
線基板の保持手段を備える基板保持機構と、基板受台を
通してフリップチップと配線基板の位置を検出する光学
手段と、チップ加圧機構と基板保持機構の相対位置を調
整する位置調整手段とを実装装置に設け、フリップチッ
プを加圧ロッドの先端面に配線基板を基板受台上にそれ
ぞれ保持させかつ加圧手段を第１段動作させ両者を近接
させた状態で光学手段により両者の位置を検出しながら
位置調整手段により位置合わせし、次に加圧手段を第２
段動作させた状態でバンプ電極を配線導体と固定接続す
ることにより上述の目的が達成される。According to the present invention, the pressing means for performing the first-step operation and the second-step operation, the pressing rod movably operated by the pressing means in a direction other than the pressing direction, and the holding means for holding the flip chip on the tip surface thereof. A chip pressing mechanism, a substrate holding mechanism having a transparent substrate pedestal and a wiring board holding means, an optical means for detecting the positions of the flip chip and the wiring board through the substrate pedestal, a chip pressing mechanism and a substrate. Positioning means for adjusting the relative position of the holding mechanism is provided in the mounting device, the flip chip is held by the tip end surface of the pressure rod on the board pedestal, and the pressure means is operated in the first stage. Position is adjusted by the position adjusting means while detecting the positions of both by the optical means in the state where they are brought close to each other, and then the pressing means is moved to the second position.
The above-mentioned object is achieved by fixedly connecting the bump electrode to the wiring conductor in the staged operation.

なお、加圧手段に上記構成にいう第１段動作とそれよ
り移動量の小な第２段動作を行なわせるには、１段目の
シリンダとそれよりストロークの小な２段目のシリンダ
を組み合わせた空気圧ないし油圧操作の二重シリンダ機
構を用いるのが有利であり、とくに２段目のシリンダに
は圧力調整弁等により操作圧力を所定速度で上昇させた
後に所定値に保つ制御を施すのが望ましい。In order to cause the pressurizing means to perform the first-stage operation described above and the second-stage operation having a smaller movement amount, the first-stage cylinder and the second-stage cylinder having a smaller stroke are used. It is advantageous to use a combined dual pneumatic or hydraulic cylinder mechanism. Especially, the second-stage cylinder is controlled by a pressure regulating valve or the like to raise the operating pressure at a predetermined speed and then maintain it at a predetermined value. Is desirable.

この加圧手段とチップ加圧機構の間の加圧方向以外に
移動自在な結合には、例えば鋼球を用いる自在結合とす
るのが最も簡単である。チップ加圧機構の加圧ロッドの
先端の面積はフリップチップの面積以上にするのがよい
が、この先端面は焼き入れや高硬度金属ないし超硬合金
の取り付け等により硬度を高めて置くのが接続の均一性
を長期間に亘って維持する上で望ましい。The simplest connection between the pressing means and the chip pressing mechanism, which is movable in directions other than the pressing direction, is a free connection using steel balls, for example. The area of the tip of the pressure rod of the chip pressure mechanism should be larger than the area of the flip chip, but this tip surface should be hardened or hardened by mounting a high-hardness metal or cemented carbide. It is desirable to maintain the uniformity of the connection over a long period of time.

チップ加圧機構のフリップチップ保持手段および基板
保持機構の配線基板保持手段としては、例えば真空吸着
法を利用するのが簡単でありしかも実用性が高い。As the flip chip holding means of the chip pressing mechanism and the wiring board holding means of the substrate holding mechanism, for example, a vacuum suction method is easy to use and highly practical.

本発明では上記構成にいうよう基板保持機構の基板受
台に透明なものが用いられるが、フリップチップのバン
プ電極が金等であってその実装時に紫外線硬化樹脂が利
用される場合には、この基板受台に紫外線透過率の高い
石英ガラスを用いるのが有利である。In the present invention, a transparent substrate is used as the substrate holder of the substrate holding mechanism as described above. However, when the bump electrodes of the flip chip are gold or the like and the ultraviolet curable resin is used at the time of mounting, It is advantageous to use quartz glass having a high ultraviolet transmittance for the substrate pedestal.

光学手段には焦点深度の深い実体顕微鏡を用いるのが
好適で、ビデオカメラやモニタテレビ等をこれに組み合
わせるのが実装作業の能率を上げる上で有利であり、さ
らにはパターン認識装置をも利用することにより実装工
程の完全自動化を図ることができる。It is preferable to use a stereomicroscope with a deep depth of focus as the optical means, and it is advantageous to combine it with a video camera or monitor TV in order to improve the efficiency of the mounting work, and also to use a pattern recognition device. As a result, the mounting process can be fully automated.

位置調整手段には、通例のようにx-y操作機や角度操
作機を適宜組み合わせて利用することができ、これをチ
ップ加工機構および基板保持機構の一方側に設けて両者
間の相対位置を調整させることでよい。As the position adjusting means, an xy operating device or an angle operating device can be appropriately combined and used as usual, and this is provided on one side of the chip processing mechanism and the substrate holding mechanism to adjust the relative position between them. That's fine.

なお、本発明のフリップチップ用実装装置は、はん
だ，金，銅等のバンプ電極を備えるフリップチップの実
装一般に適用できる。The flip-chip mounting apparatus of the present invention can be applied to general flip-chip mounting including bump electrodes made of solder, gold, copper or the like.

〔作用〕[Action]

前項の構成にいうように本発明によるフリップチップ
用実装装置では、加圧手段に第１段動作とそれより移動
量の小な第２段動作をするものを用い、この加圧手段に
まず第１段動作をさせて、これにより操作されるチップ
加圧機構の加圧ロッドの先端面に保持したフリップチッ
プを基板保持機構の透明な基板受台上に保持した配線基
板に近接させたいわば実装寸前の状態で、透明な基板受
台を通して光学手段によってフリップチップと配線基板
の位置ないし相対的な位置ずれを正確に検出できるよう
にする。As described in the configuration of the preceding paragraph, in the flip-chip mounting apparatus according to the present invention, the pressing means that performs the first-stage operation and the second-stage operation with a smaller movement amount is used. The flip chip held on the tip surface of the pressure rod of the chip pressure mechanism operated by the one-step operation is brought close to the wiring board held on the transparent substrate holder of the substrate holding mechanism. In the imminent state, it is possible to accurately detect the position or relative positional deviation between the flip chip and the wiring board by the optical means through the transparent board support.

位置調整手段はこの正確な検出結果に基づいてチップ
加圧機構と基板保持機構の相対位置を調整するもので、
本発明ではフリップチップと配線基板の間のずれが最大
でも10μｍ以下になるように、これによって両者が精密
に位置合わせされ、そのままの状態で加圧手段を第２段
動作させることによりフリップチップのバンプ電極を配
線基板の配線導体に接触させる。The position adjusting means adjusts the relative position of the chip pressing mechanism and the substrate holding mechanism based on the accurate detection result.
In the present invention, the displacement between the flip chip and the wiring board is adjusted to 10 μm or less at the maximum so that the two are precisely aligned, and the pressurizing means is operated in the second stage without changing the position of the flip chip. The bump electrode is brought into contact with the wiring conductor of the wiring board.

この際、フリップチップを保持しているチップ加圧機
構の加圧ロッドがこの加圧手段によってその加圧方向以
外には移動自在に操作されるので、加圧手段が第２段動
作時に加圧方向に対し横方向に多少動いても、加圧ロッ
ドはこれに影響されることなくフリップチップのバンプ
電極を上述の精密に位置合わせされた状態のまま配線基
板の配線導体に接触させ、かついわゆる片押しを発生す
ることなくフリップチップ内のバンプ電極を均一な圧力
で配線導体に押し付けることができる。At this time, since the pressure rod of the chip pressure mechanism that holds the flip chip is movably operated by this pressure means in a direction other than the pressure direction, the pressure means applies pressure during the second stage operation. Even if the pressure rod moves a little in the lateral direction, the pressure rod makes the bump electrode of the flip chip contact the wiring conductor of the wiring substrate in the above-described precisely aligned state without being affected by this, and the so-called The bump electrode in the flip chip can be pressed against the wiring conductor with uniform pressure without causing one-sided pressing.

かかる押圧状態では、配線基板の実装面が多少傾いて
いても、それにフリップチップを押し付ける加圧ロッド
はそれに応じた姿勢をとることができる。本発明装置で
は配線基板に対するフリップチップの傾きをチップサイ
ズが10mmのときに数μｍ以内に抑えることができ、従っ
てフリップチップの片押しは実際上ないといってよい。
なお、この押圧状態ではフリップチップ中の高さの大な
バンプ電極を例えば最大20％程度変形させることにより
バンプ電極の高さが揃えられる。In this pressing state, even if the mounting surface of the wiring board is slightly inclined, the pressure rod that presses the flip chip thereon can take a posture corresponding thereto. In the device of the present invention, the inclination of the flip chip with respect to the wiring board can be suppressed to within several μm when the chip size is 10 mm, and therefore, it can be said that the flip chip is not actually pushed.
In this pressed state, the bump electrodes having a large height in the flip chip are deformed by, for example, about 20% at the maximum, so that the heights of the bump electrodes are made uniform.

この加圧手段を第２段動作させた状態でバンプ電極と
配線導体を固定接続する要領はバンプ電極の種類により
異なり、金バンプの場合は加圧状態のままで樹脂が光硬
化ないし熱硬化され、はんだバンプの場合は押圧状態を
一旦釈放して溶融はんだによりフリップチップと配線基
板を前述のように自己整合させた上で、望ましくはもう
一度押圧した状態で冷却によりはんだを固化させる。The procedure for fixedly connecting the bump electrode and the wiring conductor in the state where the pressurizing means is operated in the second stage differs depending on the type of the bump electrode. In the case of the gold bump, the resin is photo-cured or thermo-cured in the pressed state. In the case of solder bumps, the pressed state is once released, the flip chip and the wiring board are self-aligned as described above with molten solder, and preferably, the solder is solidified by cooling again in the pressed state.

〔実施例〕〔Example〕

以下、図を参照しながら本発明の実施例を具体的に説
明する。第１図は本発明のフリップチップ用実装装置の
要部の構成例を主な動作状態ごとに示すもので、同図
（ａ）にフリップチップと配線基板を各所定個所に保持
させる時の，同図（ｂ）には加圧手段の第１段動作時
の，同図（ｃ）には第２段動作時の状態がそれぞれ示さ
れている。以下、この実施例では、フリップチップ１は
金のバンプ電極２を備え、その配線基板３への実装には
紫外線硬化形樹脂６が利用され、配線基板３には透明な
ガラスの絶縁基板４が用いられるものとする。Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. FIG. 1 shows a configuration example of a main part of a flip-chip mounting apparatus of the present invention for each main operating state. FIG. 1 (a) shows a case where a flip chip and a wiring board are held at respective predetermined locations. FIG. 2B shows the state of the pressurizing means during the first stage operation, and FIG. 7C shows the state during the second stage operation. Hereinafter, in this embodiment, the flip chip 1 is provided with a gold bump electrode 2, an ultraviolet curable resin 6 is used to mount it on the wiring board 3, and the wiring board 3 is provided with a transparent glass insulating substrate 4. Shall be used.

第１図（ａ）の上部に簡略に示された加圧手段10はこ
の実施例では空気圧ないし油圧操作される２段のシリン
ダ機構からなるが、この図では便宜上そのごく一部の操
作ロッドにより代表して示されている。その下側に示さ
れたチップ加圧機構20の加圧ロッド21は図で簡略に示さ
れた位置調整手段50により図の上下方向に移動自在に案
内され、かつ図示しないばね等の手段によりその上端面
の凹み内の鋼球22が加圧機構10の操作ロッドの下端面に
常に接触するよう付勢されており、加圧機構10からは図
の下方に向かう加圧方向のみに力を受けるようになって
いる。加圧ロッド21のこの例では下側先端面21aがフリ
ップチップ１に対する押圧面と保持面を兼ねており、保
持手段としてその中央部に真空ポンプに接続された吸着
孔23を備える。また、この押圧用の先端面21aには長期
使用中にフリップチップ１による凹みが発生しないよう
にこの実施例では焼き入れ処理が施される。なお、上述
の位置調整手段50には例えばｘとｙとθ方向に対する位
置操作機が用いられる。The pressurizing means 10 shown in the upper part of FIG. 1 (a) is composed of a two-stage cylinder mechanism which is pneumatically or hydraulically operated in this embodiment. It is shown as a representative. The pressure rod 21 of the tip pressure mechanism 20 shown on the lower side thereof is guided movably in the vertical direction of the figure by the position adjusting means 50 simply shown in the figure, and by a means such as a spring (not shown). The steel ball 22 in the recess of the upper end surface is urged so as to always come into contact with the lower end surface of the operating rod of the pressurization mechanism 10, and receives a force from the pressurization mechanism 10 only in the downward pressurizing direction in the drawing. It is like this. In this example of the pressure rod 21, the lower end surface 21a serves both as a pressing surface and a holding surface for the flip chip 1, and a suction hole 23 connected to a vacuum pump is provided at the center thereof as a holding means. Further, in this embodiment, the pressing tip surface 21a is subjected to a quenching treatment so as not to be dented by the flip chip 1 during long-term use. It should be noted that the position adjusting means 50 is, for example, a position operation device in the x, y and θ directions.

第１図（ａ）の下部に示された基板保持機構30は、こ
の例では石英ガラスである透明な基板受台31を支持板32
の上面の凹所32aにごく僅か突出するよう嵌め込んだも
ので、基板受台31上に配線基板３を保持するためその周
囲に吸着孔33が複数個配置され、支持板32の基板受台31
の下側は開口とされてその錐状面が鏡面32bに仕上げら
れる。The substrate holding mechanism 30 shown in the lower part of FIG. 1 (a) includes a transparent substrate pedestal 31, which is quartz glass in this example, and a support plate 32.
It is fitted into a recess 32a on the upper surface of the board so as to project only slightly, and a plurality of suction holes 33 are arranged around the board pedestal 31 to hold the wiring board 3, and the board pedestal of the support plate 32 is provided. 31
The lower side is an opening, and its conical surface is finished as a mirror surface 32b.

第１図（ａ）の中央部にはアーム84により支承された
装入ヘッド85が示されている。このヘッド85はフリップ
チップ１をその上面に装着されたテフロン等の受座86の
上に置き、かつ配線基板３をその下面に吸着孔88により
真空吸着した状態で図示の位置に装入される。次に、ヘ
ッド85の位置を基板受台31に近付けた上で吸着孔88から
の吸引を切ることにより、配線基板３を基板受台31上に
移して吸着保持させ、かつその位置を加圧ロッド21に近
付けた上で噴出孔87から圧搾空気を噴出させることによ
り、フリップチップ１を受座86から浮かせて加圧ロッド
21の先端面21aに移し、それに吸着保持させるようにな
っている。A charging head 85 supported by an arm 84 is shown in the center of FIG. In this head 85, the flip chip 1 is placed on a receiving seat 86 made of Teflon or the like mounted on the upper surface thereof, and the wiring board 3 is mounted on the lower surface thereof at a position shown in the drawing by vacuum suction by a suction hole 88. . Next, by moving the position of the head 85 close to the board pedestal 31 and cutting off the suction from the suction holes 88, the wiring board 3 is transferred onto the board pedestal 31 to be adsorbed and held, and the position is pressed. By pressing the rod 21 close to the rod 21 and ejecting the compressed air from the ejection hole 87, the flip chip 1 is floated from the seat 86 and the pressure rod.
It is adapted to be moved to the tip surface 21a of 21 and to be adsorbed and held by it.

第１図（ｂ）は加圧手段10を第１段動作させた状態を
示す。上述のように、フリップチップ１を加圧ロッド21
の先端面21aに配線基板３を基板受台31にそれぞれ保持
させた後、ヘッド85を第１図（ａ）の状態から例えば図
の左方に引き込め、かつ微量の樹脂６をこの例では配線
基板３の表面上に滴下した上で、加圧手段10を第１段動
作させて図の状態とすることによりフリップチップ１を
配線基板３に近接させる。この際、バンプ電極２の先端
と配線導体５との間隙が充分小さく例えば0.5mm程度に
なるように、加圧手段10の第１段動作の行程が設定され
る。FIG. 1 (b) shows a state in which the pressing means 10 is operated in the first stage. As described above, the flip chip 1 is attached to the pressure rod 21.
After the wiring board 3 is held on the board pedestal 31 on the front end surface 21a of each of the heads, the head 85 is retracted from the state of FIG. After being dropped on the surface of the wiring board 3, the pressing means 10 is operated in the first stage to bring it into the state shown in the drawing, whereby the flip chip 1 is brought close to the wiring board 3. At this time, the stroke of the first stage operation of the pressing means 10 is set so that the gap between the tip of the bump electrode 2 and the wiring conductor 5 is sufficiently small, for example, about 0.5 mm.

この例では配線基板３の絶縁基板４が透明なので基板
受台31を通して配線基板３のほかフリップチップ１を見
ることができ、それらの位置検出に図では簡略に示され
た光学手段40が用いられる。この光学手段40には実体顕
微鏡が好適で、これにビデオカメラを組み合わせること
により、モニタテレビ上に配線基板３とフリップチップ
１の映像が重なった拡大画像を写すことができる。In this example, since the insulating substrate 4 of the wiring board 3 is transparent, the wiring board 3 and the flip chip 1 can be seen through the board pedestal 31, and the optical means 40, which is simply shown in the figure, is used to detect their positions. . A stereomicroscope is suitable for the optical means 40. By combining this with a video camera, a magnified image in which the images of the wiring board 3 and the flip chip 1 are overlapped can be displayed on the monitor TV.

従って、この実施例ではこの拡大画像を見ながら位置
調整手段50により加圧ロッド21の位置を調整して、例え
ば各バンプ電極２の映像を対応する配線導体５の先端の
映像と重ね合わせることにより、フリップチップ１を配
線基板３と相互ずれが数μｍ程度になるように精密に位
置合わせできる。なお、位置調整手段50としては例えば
ｘステージとｙステージとθステージを組み合わせた３
方向の位置操作機が用いられる。Therefore, in this embodiment, the position of the pressure rod 21 is adjusted by the position adjusting means 50 while looking at the enlarged image, and the image of each bump electrode 2 is superimposed on the image of the tip of the corresponding wiring conductor 5, for example. The flip chip 1 and the wiring board 3 can be precisely aligned with each other so that the mutual displacement is about several μm. The position adjusting means 50 is, for example, a combination of an x stage, ay stage and a θ stage.
Directional position controls are used.

第１図（ｃ）は加圧手段10を第２段動作させた状態を
示す。この第２段動作は0.5mm程度のごく僅かな行程で
よく、バンプ電極２の先端が配線導体５に当たってから
押圧力を漸次高めることにより、高さの大なバンプ電極
２を最大20％程度変形させて、すべてのバンプ電極２を
対応する配線導体５に接触させた後に、押圧力を一定に
保つ。かかる加圧手段10の押圧力制御は、例えば第２段
動作用のシリンダ機構への作動流体の供給路に、通例の
ように圧力調整弁や絞りを挿入することによって容易に
行なうことができる。FIG. 1 (c) shows a state in which the pressing means 10 is operated in the second stage. This second-stage operation requires only a very small stroke of about 0.5 mm, and by gradually increasing the pressing force after the tip of the bump electrode 2 hits the wiring conductor 5, the bump electrode 2 having a large height is deformed by about 20% at the maximum. Then, after all the bump electrodes 2 are brought into contact with the corresponding wiring conductors 5, the pressing force is kept constant. The pressing force control of the pressurizing means 10 can be easily performed by, for example, inserting a pressure regulating valve or a throttle in the supply passage of the working fluid to the cylinder mechanism for the second stage operation as usual.

この際、加圧ロッド21は鋼球22を介して加圧手段10か
ら押圧力をその加圧方向にのみ受け、かつ第２段動作の
行程がごく僅かなので、第１図（ｂ）の状態で精密に位
置合わせされた状態のままバンプ電極２を配線導体５に
接触させることができる。また、この接触後の押圧状態
では、配線基板３が多少傾いていても加圧ロッド21はそ
れに応じた姿勢でフリップチップ１を配線基板３に押し
付けるので、両者間の傾きを最小に抑えて片押し不良の
発生をほぼ皆無にすることができる。At this time, the pressing rod 21 receives the pressing force from the pressing means 10 through the steel ball 22 only in the pressing direction, and the stroke of the second stage operation is very small. Therefore, the state of FIG. The bump electrode 2 can be brought into contact with the wiring conductor 5 while being precisely aligned. Further, in the pressed state after this contact, even if the wiring board 3 is slightly tilted, the pressing rod 21 presses the flip chip 1 against the wiring board 3 in a posture corresponding thereto, so that the tilt between the two is minimized. It is possible to almost completely eliminate the occurrence of push failure.

このようにバンプ電極２を対応する配線導体５に均一
に押圧した状態で、この例では図の下部に簡略に示され
た光投射手段70の例えば光ファイバ先端の投射ヘッドか
ら、透明な基板受台31と絶縁基板４とを通して樹脂６に
紫外線を短時間当て、それを紫外線硬化させることによ
り実装を完了させる。以後は、第１図（ａ）の装入ヘッ
ド85と同様に構成された装出ヘッドにより、フリップチ
ップ１を実装済みの配線基板３を真空吸着等の手段によ
り基板受台31上から取り出せばよい。In this state, the bump electrodes 2 are evenly pressed against the corresponding wiring conductors 5, and in this example, from the projection head at the tip of the optical fiber of the light projection means 70, which is simply shown in the lower part of the drawing, the transparent substrate receiving member Ultraviolet rays are applied to the resin 6 for a short time through the base 31 and the insulating substrate 4, and the ultraviolet rays are cured to complete the mounting. After that, by using the loading head configured in the same manner as the loading head 85 of FIG. 1A, the wiring board 3 on which the flip chip 1 is mounted can be taken out from the board pedestal 31 by means such as vacuum suction. Good.

なお、基板受台31が石英ガラスで配線基板３の絶縁基
板４がパイレックスの場合、365nmの波長の紫外線に対
し80％程度以上の透過率が得られ、樹脂６に対して250
〜300mW/cm²の強度で紫外線を照射することができる。
この際、基板受台31の下側の支持板32の鏡面32bは散乱
紫外線を有効に利用する役目を果たす。When the substrate pedestal 31 is made of quartz glass and the insulating substrate 4 of the wiring substrate 3 is Pyrex, a transmittance of about 80% or more with respect to ultraviolet rays having a wavelength of 365 nm can be obtained, and a transmittance of 250 with respect to the resin 6.
Ultraviolet rays can be irradiated with an intensity of ~ 300 mW / cm ² .
At this time, the mirror surface 32b of the support plate 32 below the substrate pedestal 31 plays a role of effectively utilizing scattered ultraviolet rays.

第２図は、第１図では要部のみが示されていた本発明
装置の全体構成を例示するもので、同図（ａ）にその正
面図，同図（ｂ）に一部の上面図，同図（ｃ）に側面図
がそれぞれ示されている。FIG. 2 exemplifies the overall configuration of the device of the present invention, of which only the main parts are shown in FIG. 1, and FIG. 2 (a) is a front view thereof and FIG. 2 (b) is a partial top view thereof. A side view is shown in FIG.

第２図（ａ）の上部の中央には第１図で説明した要部
が示されている。加圧手段10は直列に結合された第１段
シリンダ機構11と第２段シリンダ機構12とからなり、こ
れらのストロークは例えば前者が50mm,後者が0.5mmとさ
れる。この加圧手段10は同図（ｃ）のように位置調整手
段50の可動台51に位置操作機52とともに搭載され、位置
操作機52により案内された加圧ロッド21に前述の鋼球等
を介して加圧力を賦与する。At the center of the upper part of FIG. 2 (a), the main part described in FIG. 1 is shown. The pressurizing means 10 is composed of a first-stage cylinder mechanism 11 and a second-stage cylinder mechanism 12 which are connected in series, and the strokes thereof are, for example, 50 mm for the former and 0.5 mm for the latter. This pressurizing means 10 is mounted on a movable base 51 of the position adjusting means 50 together with a position operation device 52 as shown in FIG. 7C, and the above-mentioned steel balls and the like are attached to the pressure rod 21 guided by the position operation device 52. A pressure force is applied through.

同図（ｃ）のように、基板保持機構30の支持板32は複
数の脚を介して台枠等に強固に取り付けられ、その下側
に光学手段40が配置される。光学手段40実体顕微鏡41は
可動台42上の位置操作機43により位置制御される支柱44
に支承され、位置操作機43によりその視野を微調整でき
る。実体顕微鏡41は倍率が数十程度の同軸照明付きのも
のが好適で、これにビデオカメラが組み合わされて、そ
の視野が同図（ａ）のモニタテレビ45上の映像として表
示される。このモニタテレビ45には、ビデオカメラと同
様に400〜500本の水平解像度のものを用いるのが適当で
ある。位置操作機43用にはｘステージとｙステージが組
み合わされる。As shown in FIG. 7C, the support plate 32 of the substrate holding mechanism 30 is firmly attached to the underframe or the like via a plurality of legs, and the optical means 40 is arranged below it. Optical means 40 Stereomicroscope 41 is a column 44 whose position is controlled by a position controller 43 on a movable table 42.
The position control device 43 allows the field of view to be finely adjusted. The stereomicroscope 41 is preferably equipped with a coaxial illumination having a magnification of about several tens, and a video camera is combined with this to display the field of view as an image on the monitor television 45 of FIG. As the monitor television 45, it is suitable to use one having a horizontal resolution of 400 to 500 similarly to a video camera. An x stage and a y stage are combined for the position operation device 43.

同図（ａ）のモニタテレビ45の上側の樹脂供給系60の
ディスペンサ61は、前述の紫外線硬化形樹脂を0.1mg程
度の精度で微量ずつ供給可能なもので、可撓性ホース62
を介して位置操作機52に担持されたキャピラリ状の樹脂
供給用ノズル63と接続される。シリンダ64は可動台51を
介してこのノズル63を樹脂供給位置に操作するものであ
る。The dispenser 61 of the resin supply system 60 on the upper side of the monitor TV 45 in FIG. 7A is capable of supplying the ultraviolet curable resin described above in minute amounts with an accuracy of about 0.1 mg.
It is connected to the capillary-shaped resin supply nozzle 63 carried by the position operation device 52 via the. The cylinder 64 operates the nozzle 63 to the resin supply position via the movable table 51.

同図（ａ）の右下部に示された光投射系70の紫外線源
71で発生される紫外線光は、光ファイバ72を介して実体
顕微鏡41に担持された投射ヘッド73に送られる。この光
投射系70に対してもシリンダ74が設けられ、可動台42を
介して投射ヘッド73を投射位置に操作できるようになっ
ている。Ultraviolet source of the light projection system 70 shown in the lower right part of FIG.
The ultraviolet light generated at 71 is sent to the projection head 73 carried by the stereomicroscope 41 via the optical fiber 72. A cylinder 74 is also provided for the light projection system 70, and the projection head 73 can be operated to the projection position via the movable table 42.

フリップチップおよび配線基板を実装位置に装入する
前述の装入ヘッド85の操作用にロボット80が設けられ
る。このロボット80は、同図（ｂ）に示すようにｘ方向
操作機81とｙ方向操作機82により、前述のアーム84を介
して装入ヘッド85を支承する操作ヘッド83の位置をプロ
グラム制御により操作するものである。なお、操作ヘッ
ド83内には前に第１図で説明したように装入ヘッド85を
加圧ロッド21の下端面21aまたは基板受台31に近付ける
ようにアーム84を上下方向に僅かずつ操作する簡単な機
構が組み込まれる。A robot 80 is provided for operating the above-described loading head 85 for loading the flip chip and the wiring board at the mounting position. As shown in FIG. 2B, this robot 80 uses a x-direction operating device 81 and a y-direction operating device 82 to program-control the position of the operation head 83 that supports the charging head 85 via the arm 84 described above. It is something to operate. In the operation head 83, the arm 84 is operated little by little in the vertical direction so as to bring the charging head 85 close to the lower end surface 21a of the pressure rod 21 or the substrate pedestal 31, as previously described in FIG. A simple mechanism is incorporated.

また、フリップチップや配線基板の吸着用に、真空ポ
ンプ91と駆動モータ92からなる真空系90が本発明装置に
付属して設けられる。A vacuum system 90 including a vacuum pump 91 and a drive motor 92 is attached to the device of the present invention for attracting flip chips and wiring boards.

このほか本発明装置内には、その各部の動作をシーケ
ンス制御するプログラム制御装置100と、その指令によ
り装置内の各部を制御ないしは操作する操作制御装置10
1が組み込まれる。In addition, in the device of the present invention, a program control device 100 for sequence-controlling the operation of each part thereof, and an operation control device 10 for controlling or operating each part in the device according to the command thereof.
1 is incorporated.

このプログラム制御装置100の制御下で行なわれるフ
リップチップの実装手順例を順序を追って述べると次の
とおりである。An example of a flip-chip mounting procedure performed under the control of the program control device 100 will be described in order.

（１）まず装入ヘッド85を実装位置の外側の所定位置に
置いた状態で、フリップチップを図示しない設備ないし
手によってその上側に載せ、ついで装入ヘッド85をロボ
ット80により第２図（ａ）に示すような適当な台上に置
かれた基板トレイ７の上に移動させて、その中に並べら
れている配線基板を装入ヘッド85の下側に真空吸着す
る。(1) First, with the charging head 85 placed at a predetermined position outside the mounting position, the flip chip is placed on the upper side by equipment or hands (not shown), and then the charging head 85 is moved by the robot 80 as shown in FIG. ) Is moved onto a substrate tray 7 placed on an appropriate table as shown in FIG. 2), and the wiring substrates arranged therein are vacuum-sucked to the lower side of the loading head 85.

（２）ロボット80により装入ヘッド85を第１図（ａ）の
位置まで移動させ、かつそれを操作ヘッド83により上下
方向に僅かずつ操作しながら、前に説明した要領に従っ
てフリップチップ１を加圧ロッド21の下端面21aに，配
線基板３を基板受台31上にそれぞれ移して保持させる。(2) The loading head 85 is moved to the position shown in FIG. 1 (a) by the robot 80, and the flip chip 1 is added according to the procedure described above while operating the operation head 83 little by little in the vertical direction. The wiring board 3 is transferred to and held by the lower end surface 21a of the pressure rod 21 on the board pedestal 31.

（３）装入ヘッド85をロボット80により当初の位置に復
帰させた後、シリンダ64を付勢してノズル63を配線基板
３の上に移動させた上でディスペンサ61からあらかじめ
これに設定された数mg程度の微量の樹脂６を配線基板３
上に滴下させる。(3) After the charging head 85 is returned to the initial position by the robot 80, the cylinder 64 is urged to move the nozzle 63 onto the wiring board 3 and then the dispenser 61 sets it in advance. A few milligrams of resin 6 is added to the wiring board 3
Drop it on top.

（４）加圧手段10を第１段動作させて第１図（ｂ）の状
態とし、前に説明したように実体顕微鏡41が捉えたモニ
タテレビ45上の映像を見ながら位置操作機52を用いてフ
リップチップ１と配線基板２とずれが10μｍ以下になる
まで位置合わせする。(4) The pressurizing means 10 is operated in the first stage to bring it to the state of FIG. 1 (b), and the position operation device 52 is operated while watching the image on the monitor TV 45 captured by the stereomicroscope 41 as described above. The flip chip 1 and the wiring board 2 are aligned by using them until the displacement becomes 10 μm or less.

（５）加圧手段10を第２段動作させて第１図（ｃ）の状
態とし、バンプ電極２を配線導体５と均一に接触させた
後、シリンダ74を付勢して光投射ヘッド73を投射位置に
置いた状態で紫外線源71からの紫外線を樹脂６にふつう
は数十秒間程度照射してそれを硬化させる。(5) The pressurizing means 10 is operated in the second stage to bring it to the state of FIG. 1 (c), the bump electrode 2 is brought into uniform contact with the wiring conductor 5, and then the cylinder 74 is urged to project the light projection head 73. Is placed at the projection position, the resin 6 is normally irradiated with ultraviolet rays from the ultraviolet source 71 for about several tens of seconds to cure it.

（６）以上で実装が完了するので、フリップチップ１が
実装された配線基板３を図示しない適宜な手段によって
実装位置から取り出し、以後は同じ動作を繰り返えす。(6) Since the mounting is completed as described above, the wiring board 3 on which the flip chip 1 is mounted is taken out from the mounting position by an appropriate means (not shown), and the same operation is repeated thereafter.

なお、この実施例における上述の手順中で（４）の位
置合わせに入手が掛かるが、実体顕微鏡41が捉える映像
信号をパターン認識動作をする計算機に与え、それに位
置操作機52を制御させるようにすれば全手順を完全自動
化することができる。Although it is necessary to obtain the position alignment in (4) in the above procedure in this embodiment, the video signal captured by the stereomicroscope 41 is given to the computer that performs the pattern recognition operation, and the position operation device 52 is controlled by the computer. Then the whole procedure can be fully automated.

以上説明した本発明による実装装置により実装された
フリップチップは、配線基板との間に認め得る程度の傾
きがなく、実装前のチップに若干の反りがあってもバン
プ電極と配線導体の間の接触抵抗のばらつきが少なく、
バンプ電極数が100個以上の場合でも最大ばらつきは20
％以下である。また実装品の使用期間中にも、長期に亘
りかかる接触の均一性を保つことができる。The flip chip mounted by the mounting apparatus according to the present invention described above has no appreciable inclination with the wiring board, and even if the chip before mounting has a slight warp, the flip chip is mounted between the bump electrode and the wiring conductor. There is little variation in contact resistance,
The maximum variation is 20 even when the number of bump electrodes is 100 or more.
% Or less. Further, even during the use period of the mounted product, it is possible to maintain the uniformity of the contact over a long period of time.

なお、かかる均一な接触ないし接続を保証するには、
加圧ロッドの下端面や基板受台の面，とくに前者の平坦
度をサブミクロンの精度に維持する必要があり、従来は
装置の運転中にこの平坦度が次第に悪化しやすいなやみ
があったが、本発明による実装装置では長期間中かかる
押圧面の平坦度を維持することができる。In order to ensure such uniform contact or connection,
It is necessary to maintain the flatness of the lower end surface of the pressure rod and the surface of the substrate pedestal, especially the flatness of the former with submicron accuracy, and in the past, this flatness tended to deteriorate during operation of the device. The mounting apparatus according to the present invention can maintain the flatness of the pressing surface for a long period of time.

本発明によるフリップチップ用実装装置は、各サイズ
が10〜50μｍ角，配列ピッチが20〜100μｍのバンプ電
極を100個以上備えるフリップチップの実装に適用可能
で、配線基板との位置合わせ精度は10μｍ以下を，それ
との傾きは10mm角のチップに対して３μｍ以下をそれぞ
れ保証できる。INDUSTRIAL APPLICABILITY The flip-chip mounting apparatus according to the present invention can be applied to the mounting of a flip-chip having 100 or more bump electrodes each having a size of 10 to 50 μm square and an array pitch of 20 to 100 μm, and the alignment accuracy with a wiring board is 10 μm. The following can be guaranteed with an inclination of 3 μm or less for a 10 mm square chip.

以上説明した実施例に限らず、本発明は種々の態様で
実施をすることができる。実施例ではバンプ電極を金と
したが、銅やはんだのバンプ電極に対しても適用可能で
ある。また、配線基板の絶縁基板も必ずしも透明である
必要はなく、実装作業の手順等を適宜変更することによ
り本発明をその要旨内で実施できる。本発明装置の第１
図の要部の構成や第２図の全体の具体構成はあくまで例
示であって、バンプ電極の種類や実装作業の自動化要求
等に合わせて、種々な実用上の構成や形態をこれに与え
ることができる。実装作業の具体的な手順や条件につい
ても同様であって、必要ないしは場合に応じて種々な変
形を加えないしは選択を行なうことができる。The present invention is not limited to the embodiments described above, and can be implemented in various modes. In the embodiment, the bump electrode is gold, but the bump electrode made of copper or solder can also be applied. Further, the insulating substrate of the wiring board does not necessarily have to be transparent, and the present invention can be implemented within the scope of the invention by appropriately changing the procedure of mounting work and the like. First of the device of the present invention
The configuration of the main part of the figure and the overall specific configuration of FIG. 2 are merely examples, and various practical configurations and forms should be given to them in accordance with the type of bump electrode and the automation requirement of mounting work. You can The same applies to the specific procedures and conditions of the mounting work, and various modifications can be added or selected as necessary or necessary.

〔発明の効果〕〔The invention's effect〕

以上説明したとおり本発明では、フリップチップ用実
装装置に対して、第１段動作とこれより移動量の小な第
２段動作を行なう加圧手段と、これによって加圧方向以
外には移動自在に操作される加圧ロッドとその先端面へ
のフリップチップの保持手段とを備えるチップ加圧機構
と、透明な基板受台と配線基板の保持手段を備える基板
保持機構と、基板受台を通してフリップチップと配線基
板の位置を検出する光学手段と、チップ加圧機構と基板
保持機構の相対位置を調整する位置調整手段とを設け、
フリップチップを加圧ロッドの先端面に配線基板を基板
受台上にそれぞれ保持させかつ加圧手段を第１段動作さ
せ両者を近接させた状態で光学手段により両者の位置を
検出しながら位置調整手段により位置合わせし、つぎに
加圧手段を第２段動作させた状態でバンプ電極を配線導
体と固定接続するようにすることにより、従来技術のも
っていた問題点を解決して、次の効果を奏することがで
きる。As described above, according to the present invention, the flip-chip mounting apparatus performs the first-stage operation and the second-stage operation with a smaller movement amount, and the movable means is movable in a direction other than the pressing direction. Chip pressing mechanism that includes a pressure rod that is operated in the above manner and a holding means for holding a flip chip on the tip end surface thereof, a substrate holding mechanism that includes a transparent substrate pedestal and a wiring substrate holding means, and a flip through the substrate pedestal. Optical means for detecting the positions of the chip and the wiring board, and position adjusting means for adjusting the relative positions of the chip pressing mechanism and the substrate holding mechanism are provided.
The flip chip is held on the tip surface of the pressure rod, the wiring substrate is held on the substrate pedestal respectively, and the pressure means is operated in the first stage to bring the two into proximity, and the position is adjusted while the position of the both is detected by the optical means. The bump electrode is fixedly connected to the wiring conductor in a state where the pressing means is operated in the second stage, thereby solving the problems of the prior art and achieving the following effects. Can be played.

（ａ）加圧手段にまず第１段動作をさせて、フリップチ
ップを配線基板に近接させた実装寸前の状態で透明な基
板受台を通して光学手段によりフリップチップと配線基
板の相対的な位置を検出し、これに基づいて位置調整手
段により両者を正確に位置合わせできる。(A) First, the pressurizing unit is caused to perform the first stage operation, and the relative position of the flip chip and the wiring substrate is determined by the optical unit through the transparent substrate pedestal in the state of mounting the flip chip close to the wiring substrate. It is possible to detect them, and based on this, the both can be accurately aligned by the position adjusting means.

（ｂ）この位置合わせ後に加圧手段を第２段動作させて
フリップチップのバンプ電極を配線基板の配線導体に接
触させる際、フリップチップを保持する加圧ロッドが加
圧手段によって加圧方向以外には移動自在に操作され、
加圧手段が位置ずれを起こす方向に多少動いても加圧ロ
ッドはこの影響を受けず、しかも第２段動作の行程がご
くわずかなので、バンプ電極を精密に位置合わせされた
ままの状態で対応する配線導体に正確に接触させること
ができる。(B) After this positioning, when the pressing means is operated in the second stage to bring the bump electrode of the flip chip into contact with the wiring conductor of the wiring board, the pressing rod holding the flip chip is not in the pressing direction by the pressing means. Is operated to move freely,
The pressure rod is not affected by this even if the pressure means moves a little in the direction of displacement, and since the stroke of the second stage operation is very small, it is possible to deal with the bump electrode precisely aligned. The wiring conductor can be accurately contacted.

この（ａ）と（ｂ）の効果により、本発明ではフリッ
プチップと配線基板の間のずれを最大でも10μｍ以下
に、さらに画像処理やパターン認識の技術を利用すれば
５μｍ以下に抑えることができる。Due to the effects of (a) and (b), in the present invention, the displacement between the flip chip and the wiring board can be suppressed to 10 μm or less at the maximum, and further to 5 μm or less by using the technology of image processing and pattern recognition. .

（ｃ）バンプ電極を配線導体に接触させた後に実装用の
押圧を掛ける際、フリップチップの反りや配線基板面の
傾き等の接続不均一の要因があっても、加圧ロッドが押
圧方向以外には移動自在でかかる要因に応じた姿勢でフ
リップチップを配線基板に押圧するので、いわゆる片押
し等の不都合の発生を有効に防止しながら多数個のバン
プ電極を配線導体に均一に固定接続できる。これによ
り、配線基板に対するフリップチップの実装姿勢の傾き
をチップサイズが10mm角のときも数μｍ以内に抑え、百
個以上の金バンプ電極をもつフリップチップを樹脂接着
力を利用して実装する場合でも、バンプ電極と配線導体
の間の接触抵抗のばらつきを20％以内に抑え、実装品の
使用中この接触の均一性を長期に亘って保つことができ
る。(C) When the bump electrode is brought into contact with the wiring conductor and then the mounting pressure is applied, even if there are factors such as warpage of the flip chip and inclination of the wiring substrate surface that cause uneven connection, the pressure rod is not in the pressing direction. Since the flip chip is pressed against the wiring board in such a manner that it can move freely and in a posture according to such factors, it is possible to uniformly and fixedly connect a large number of bump electrodes to the wiring conductor while effectively preventing the occurrence of inconvenience such as so-called one-sided pressing. . As a result, the inclination of the mounting attitude of the flip chip with respect to the wiring board is suppressed to within a few μm even when the chip size is 10 mm square, and when flip chips with 100 or more gold bump electrodes are mounted using resin adhesive force. However, the variation of the contact resistance between the bump electrode and the wiring conductor can be suppressed within 20%, and the uniformity of this contact can be maintained for a long time during the use of the mounted product.

かかる本発明の特長は、数十μｍのサイズの小形バン
プ電極が狭いピッチで配列される多接続点のフリップチ
ップの実装にとくに有用で、この種の集積回路装置のチ
ップの小形化とその動作信頼性の向上に貢献することが
できる。The features of the present invention are particularly useful for mounting flip-chips at multiple connection points in which small bump electrodes having a size of several tens of μm are arranged at a narrow pitch, and miniaturization and operation of the chip of this kind of integrated circuit device. It can contribute to the improvement of reliability.

【図面の簡単な説明】[Brief description of drawings]

図はすべて本発明に関し、第１図は本発明によるフリッ
プチップ用実装装置の要部の構成例を主な動作状態ごと
に示す断面図、第２図は本発明装置の全体構成を例示す
る正面図，一部の上面図，および側面図、第３図は配線
基板に対しフリップチップを実装する要領を示す側面図
である。これらの図において、 1:フリップチップ、2:バンプ電極、2a:はんだバンプ電
極、2b:金バンプ電極、3:配線基板、4:絶縁基板、5:配
線導体、6:樹脂、7:基板トレイ、10:加圧手段、11:第１
段シリンダ機構、12:第２段シリンダ機構、20:チップ加
圧機構、21:加圧ロッド、21a:加圧ロッドの先端面、22:
鋼球、23:フリップチップの保持手段としての吸着孔、3
0:基板保持機構、31:基板受台、32:支持板、32a:凹所、
32b:鏡面、33:配線基板の保持手段としての吸着孔、40:
光学手段、41:実体顕微鏡、42:可動台、43:位置操作
機、44:支柱、45:モニタテレビ、50:位置調整手段、51:
可動台、52:位置調整機、60:樹脂供給系、61:ディスペ
ンサ、62:ホース、63:樹脂供給ノズル、64:ノズル位置
操作用シリンダ、70:光投射系、71:紫外線源、72:光フ
ァイバ、73:投射ヘッド、74:ヘッド位置操作用シリン
ダ、80:ロボット、81:x方向操作機、82:y方向操作機、8
3:操作ヘッド、84:アーム、85:装入ヘッド、86:フリッ
プチップ用受座、87:空気噴出孔、88:吸着孔、90:真空
系、91:真空ポンプ、92:駆動モータ、100:プログラム制
御装置、101:操作制御装置、である。The drawings are all related to the present invention. FIG. 1 is a sectional view showing an example of the configuration of a main part of a flip-chip mounting device according to the present invention for each main operating state, and FIG. 2 is a front view illustrating the overall configuration of the device of the present invention. FIG. 3, a partial top view, and a side view, and FIG. 3 are side views showing a procedure for mounting a flip chip on a wiring board. In these figures, 1: flip chip, 2: bump electrode, 2a: solder bump electrode, 2b: gold bump electrode, 3: wiring substrate, 4: insulating substrate, 5: wiring conductor, 6: resin, 7: substrate tray , 10: pressurizing means, 11: first
Step cylinder mechanism, 12: Second step cylinder mechanism, 20: Tip pressurizing mechanism, 21: Pressurizing rod, 21a: Tip surface of pressurizing rod, 22:
Steel ball, 23: Suction hole as a means to hold flip chip, 3
0: substrate holding mechanism, 31: substrate pedestal, 32: support plate, 32a: recess,
32b: mirror surface, 33: suction hole as a holding means for the wiring board, 40:
Optical means, 41: stereomicroscope, 42: movable table, 43: position control device, 44: support, 45: monitor TV, 50: position adjustment means, 51:
Movable table, 52: Position adjuster, 60: Resin supply system, 61: Dispenser, 62: Hose, 63: Resin supply nozzle, 64: Nozzle position operating cylinder, 70: Light projection system, 71: Ultraviolet source, 72: Optical fiber, 73: Projection head, 74: Head position operating cylinder, 80: Robot, 81: x direction operating device, 82: y direction operating device, 8
3: Operation head, 84: Arm, 85: Loading head, 86: Flip chip seat, 87: Air ejection hole, 88: Adsorption hole, 90: Vacuum system, 91: Vacuum pump, 92: Drive motor, 100 : Program control device 101: Operation control device.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】第１段動作とそれより移動量の小な第２段
動作を行なう加圧手段と、これにより加圧方向以外には
移動自在に操作される加圧ロッドとその先端面にフリッ
プチップを保持する手段を備えるチップ加圧機構と、透
明な基板受台とその上に配線基板を保持する手段を備え
る基板保持機構と、基板受台を通してフリップチップと
配線基板の位置を検出する光学手段と、チップ加圧機構
と基板保持機構の一方に対する他方の位置を調整可能な
位置調整手段とを備え、フリップチップを加圧ロッドの
先端面に配線基板を基板受台上にそれぞれ保持させかつ
加圧手段を第１段動作させて両者を近接させた状態で光
学手段によって両者の位置を検出しながら位置調整手段
によって位置合わせし、加圧手段を第２段動作させた状
態でフリップチップのバンプ電極を配線基板の配線導体
と固定接続するようにしたフリップチップ用実装装置。1. A pressurizing means for performing a first step operation and a second step operation having a smaller movement amount than that, a pressurizing rod which is movably operated in a direction other than the pressurizing direction and a tip end surface thereof. A chip pressing mechanism having a means for holding a flip chip, a substrate holding mechanism having a transparent substrate pedestal and means for holding a wiring substrate thereon, and a position of the flip chip and the wiring substrate are detected through the substrate pedestal. An optical means and a position adjusting means capable of adjusting the position of the chip pressing mechanism and the other of the board holding mechanism are provided, and the flip chip is held on the tip end surface of the pressing rod and the wiring board is held on the board pedestal. In addition, the pressure adjusting means is operated in the first stage to bring them close to each other, while the optical adjusting means detects the positions of the both, they are aligned by the position adjusting means, and the pressurizing means is operated in the second stage to perform flip-chip operation. Flip chip mounting apparatus that the bump electrode fixed connected to the wiring board of the wiring conductor of the.