JP2508800B2 - Electronic component mounting device - Google Patents
Electronic component mounting deviceInfo
- Publication number
- JP2508800B2 JP2508800B2 JP63116386A JP11638688A JP2508800B2 JP 2508800 B2 JP2508800 B2 JP 2508800B2 JP 63116386 A JP63116386 A JP 63116386A JP 11638688 A JP11638688 A JP 11638688A JP 2508800 B2 JP2508800 B2 JP 2508800B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- pawl
- component mounting
- positioning
- leaf spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ この発明は電子部品の装着位置の位置決めをする装置
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to an apparatus for positioning a mounting position of an electronic component.
［従来の技術］ 第２図〜第４図は従来の電子部品装着装置を示す図
で、第２図は平面図、第３図は正面図、第４図は動作説
明用斜視図である。[Prior Art] FIGS. 2 to 4 are views showing a conventional electronic component mounting apparatus. FIG. 2 is a plan view, FIG. 3 is a front view, and FIG. 4 is a perspective view for explaining the operation.
図中、（１）は位置決め台、（２）は位置決め台
（１）に載置され側方に薄板状のリード（３）が突出し
ている電子部品、（４）は矢印で示す方向へ移動する移
動台、（５）は移動台（４）に固定された支持体、
（６）は支持体（５）の先端に支持されたつめである。In the figure, (1) is a positioning table, (2) is an electronic component that is placed on the positioning table (1) and has thin plate-shaped leads (3) protruding laterally, (4) is moved in the direction indicated by the arrow A movable table, (5) a support fixed to the movable table (4),
(6) is a pawl supported at the tip of the support (5).
従来の電子部品装着装置は上記のように構成され、位
置決め台（１）の上に電子部品（２）が載置される。次
に、移動台（４）を移動させてつめ（６）の下面を位置
決め台（１）に当接させた状態で、電子部品（２）のリ
ード（３）の先端に接近当接させることにより、電子部
品（２）の位置決めが行われる。The conventional electronic component mounting apparatus is configured as described above, and the electronic component (2) is placed on the positioning table (1). Next, the movable table (4) is moved so that the lower surface of the pawl (6) is brought into contact with the positioning table (1) and brought into close contact with the tips of the leads (3) of the electronic component (2). Thus, the electronic component (2) is positioned.
［発明が解決しようとする課題］ 上記のような従来の電子部品装着装置では、支持体
（５）に固定されたつめ（６）を移動させて電子部品
（２）のリード（３）の先端に当接させるようにしてい
るため、つめ（６）の下面は位置決め台（１）に正しく
当接し、すき間が生じないようにしなければならない。
しかし、支持体（５）は剛体であるため、つめ（６）を
上記のような状態に管理するのは極めて困難である。も
し、つめ（６）の下面と位置決め台（１）の間にすき間
が生じると、第４図に示すように、このすき間にリード
（３）の先端が入り込み、安定した位置決めができな
い。また、つめ（６）の下面を位置決め台（１）に押圧
し過ぎると、つめ（６）は動くことができなくなるとい
う問題点がある。[Problems to be Solved by the Invention] In the conventional electronic component mounting apparatus as described above, the pawls (6) fixed to the support (5) are moved to move the tips of the leads (3) of the electronic component (2). Therefore, the lower surface of the pawl (6) must properly abut the positioning base (1) so that no gap is generated.
However, since the support body (5) is a rigid body, it is extremely difficult to manage the pawl (6) in the above state. If there is a gap between the lower surface of the pawl (6) and the positioning table (1), the tip of the lead (3) will enter into this gap as shown in FIG. 4, and stable positioning cannot be performed. Further, if the lower surface of the pawl (6) is pressed against the positioning base (1) too much, the pawl (6) cannot move.
この発明は上記問題点を解決するためになされたもの
で、つめを位置決め台とのすき間がない状態に保って、
電子部品の安定した位置決めができるようにした電子部
品装着装置を提供することを目的とする。The present invention has been made to solve the above-mentioned problems, and keeps the pawl in a state where there is no gap with the positioning base,
An object of the present invention is to provide an electronic component mounting device that enables stable positioning of electronic components.
［課題を解決するための手段］ この発明に係る電子部品装着装置は、電子部品のリー
ドの先端に当接させるつめを板ばねにより移動台に支持
し、この板ばねによりつめを位置決め台に押圧させて横
方向へ移動させるようにしたものである。[Means for Solving the Problems] In the electronic component mounting apparatus according to the present invention, a pawl that is brought into contact with the tip of the lead of the electronic component is supported by a movable base by a leaf spring, and the pawl is pressed by the leaf spring against the positioning base. It is designed to be moved laterally.
［作用］ この発明においては、つめは板ばねにより位置決め台
に押圧されているため、つめの下面と位置決め台とのす
き間は零となる。[Operation] In the present invention, since the pawl is pressed against the positioning base by the leaf spring, the clearance between the lower surface of the pawl and the positioning base is zero.
［実施例］ 第１図はこの発明の一実施例を示す正面図であり、従
来装置と同様の部分は同一符号で示す。[Embodiment] FIG. 1 is a front view showing an embodiment of the present invention, and the same parts as those in the conventional apparatus are designated by the same reference numerals.
図中、（８）は板ばねで、つめ（６）は板ばね（８）
で移動台（４）に支持されており、つめ（６）の下面は
軽く位置決め台（１）に押圧されている。In the figure, (8) is a leaf spring, and the pawl (6) is a leaf spring (8).
Is supported by the movable table (4), and the lower surface of the pawl (6) is lightly pressed by the positioning table (1).
上記のように構成された電子部品装着装置において
は、つめ（６）は板ばね（８）により位置決め台（１）
に軽く押圧されているため、つめ（６）と位置決め台
（１）の間にすき間は生じない。そのため、つめ（６）
は常に位置決め台（１）に接触した状態で、電子部品
（２）のリード（３）の先端に接近してこれに当接する
ため、リード（３）がつめ（６）の下面に入り込むこと
はなく、電子部品（２）は安定した状態で位置決めされ
る。In the electronic component mounting apparatus configured as described above, the pawl (6) is made up of the leaf spring (8) and the positioning base (1).
Since it is lightly pressed against, there is no gap between the pawl (6) and the positioning table (1). Therefore, claws (6)
Is always in contact with the positioning table (1) and approaches the tip of the lead (3) of the electronic component (2) and abuts against it, so that the lead (3) does not enter the lower surface of the pawl (6). Instead, the electronic component (2) is positioned in a stable state.
［発明の効果］ 以上説明したとおりこの発明では、つめを板ばねによ
り移動台に支持し、この板ばねによりつめを位置決め台
に押圧させて横方向へ移動させるようにしたので、つめ
と位置決め台とのすき間を管理しなくても、上記すき間
を常に零に保って、電子部品の安定した位置決めをする
ことができる効果がある。[Effects of the Invention] As described above, according to the present invention, the pawl is supported by the movable base by the leaf spring, and the pawl is pressed against the positioning base to move laterally. There is an effect that the above-mentioned gap can be always maintained at zero and stable positioning of electronic components can be performed without managing the gap.
第１図はこの発明による電子部品装着装置の一実施例を
示す正面図、第２図は従来の電子部品装着装置を示す平
面図、第３図は第２図の正面図、第４図は動作説明用斜
視図である。 図中、（１）は位置決め台、（２）は電子部品、（３）
はリード、（４）は移動台、（６）はつめ、（８）は板
ばねである。 なお、図中同一符号は同一部分を示す。FIG. 1 is a front view showing an embodiment of an electronic component mounting apparatus according to the present invention, FIG. 2 is a plan view showing a conventional electronic component mounting apparatus, FIG. 3 is a front view of FIG. 2, and FIG. It is a perspective view for operation explanation. In the figure, (1) is a positioning table, (2) is electronic parts, and (3)
Is a lead, (4) is a moving base, (6) is a pawl, and (8) is a leaf spring. The same reference numerals in the drawings denote the same parts.
Claims (1)
れ、このリードの先端部に、横方向へ移動する移動台に
結合されたつめを当接させて上記電子部品の位置決めを
するものにおいて、上記つめを板ばねにより上記移動台
に支持し、上記板ばねにより上記つめを上記位置決め台
に押圧させて上記横方向へ移動させるようにしたことを
特徴とする電子部品装着装置。1. A lead for electronic component is placed on a positioning base, and a tip of the lead is brought into contact with a pawl connected to a moving base that moves in the lateral direction to position the electronic component. 3. The electronic component mounting apparatus according to claim 1, wherein the pawl is supported on the moving base by a leaf spring, and the pawl is pressed against the positioning base by the leaf spring to move in the lateral direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63116386A JP2508800B2 (en) | 1988-05-13 | 1988-05-13 | Electronic component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63116386A JP2508800B2 (en) | 1988-05-13 | 1988-05-13 | Electronic component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01286500A JPH01286500A (en) | 1989-11-17 |
| JP2508800B2 true JP2508800B2 (en) | 1996-06-19 |
Family
ID=14685737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63116386A Expired - Lifetime JP2508800B2 (en) | 1988-05-13 | 1988-05-13 | Electronic component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2508800B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58155793A (en) * | 1982-03-11 | 1983-09-16 | 株式会社東芝 | Method of mounting flat package electronic part and device therefor |
| JPH0632436B2 (en) * | 1983-07-08 | 1994-04-27 | 株式会社日立製作所 | Positioning method |
| JPS6375905A (en) * | 1986-09-19 | 1988-04-06 | Hitachi Ltd | Positioning device for parts |
-
1988
- 1988-05-13 JP JP63116386A patent/JP2508800B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01286500A (en) | 1989-11-17 |
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