JP2503907B2 - Chip component mounting structure and chip component mounting method - Google Patents
Chip component mounting structure and chip component mounting methodInfo
- Publication number
- JP2503907B2 JP2503907B2 JP5207294A JP20729493A JP2503907B2 JP 2503907 B2 JP2503907 B2 JP 2503907B2 JP 5207294 A JP5207294 A JP 5207294A JP 20729493 A JP20729493 A JP 20729493A JP 2503907 B2 JP2503907 B2 JP 2503907B2
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- printed board
- fitted
- press
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント板に対するチ
ップ部品の実装に関し、特にはんだ付けによる電極の接
合を必要としないチップ部品の実装構造及び実装方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to mounting a chip component on a printed board, and more particularly to a mounting structure and a mounting method for a chip component which does not require electrode joining by soldering.
【０００２】[0002]
【従来の技術】従来のチップ部品の実装方法は、チップ
部品の電極部分をプリント板の導体パターンに直接はん
だ付けするか、又は端子金具等を介してプリント板に間
接的にはんだ付けする表面実装が一般に行われていた。
例えば、実開平３ー３３９６８号公報に記載のものは、
図２に示したように、チップ部品４をプリント板１上に
直接載置せず、端子金具２５を用いて実装する構造であ
り、チップ部品４が端子金具２５の間接的はんだ付けに
よって実装される実装方法である。この端子金具２５
は、プリント板１のパッド２７にはんだ付け固着する下
部水平板部材２２と、チップ部品４の電極５をはんだ付
けする上部水平板部材２１と、両水平板部材２１，２２
を平行に連結する細幅の１本又は複数本の垂直バー２３
とからなり、側面視がコ形である。そして、一対の端子
金具２５が対抗して直方体状の合成樹脂体２６によって
一体に固定され、はんだ２８によってチップ部品４とプ
リント板１とに接合されている。2. Description of the Related Art A conventional chip component mounting method is surface mounting in which an electrode portion of the chip component is directly soldered to a conductor pattern of a printed board or indirectly soldered to the printed board through a terminal fitting or the like. Was generally done.
For example, the one described in Japanese Utility Model Publication No. 3-33968 is
As shown in FIG. 2, the chip component 4 is not directly placed on the printed board 1 but is mounted by using the terminal metal fitting 25. The chip component 4 is mounted by indirect soldering of the terminal metal fitting 25. It is a mounting method. This terminal fitting 25
Is a lower horizontal plate member 22 soldered and fixed to the pad 27 of the printed board 1, an upper horizontal plate member 21 soldered to the electrodes 5 of the chip component 4, and both horizontal plate members 21 and 22.
One or more vertical bars 23 that connect the two in parallel
It consists of and, and the side view is U-shaped. The pair of terminal fittings 25 are integrally fixed to each other by a rectangular parallelepiped synthetic resin body 26 and joined to the chip component 4 and the printed board 1 by solder 28.
【０００３】[0003]
【発明が解決しようとする課題】従来のはんだ付けによ
るチップ部品の実装方法では、チップ部品の下部におけ
るはんだブリッジ及び電極に対するはんだの過不足が生
じ易い。このため、はんだ付け状態の外観検査及び手直
し等が必要となり、はんだ付けの品質管理に多くの労力
を要していた。また、はんだ付けには、樹脂系フラック
スを用いるため、装置の使用環境条件によっては、フラ
ックス残渣を除去する必要がある。このため、洗浄用有
機溶剤を多量に消費するという地球環境的負荷の増大を
まねくという問題点があった。In the conventional method of mounting a chip component by soldering, excess or deficiency of solder on the solder bridge and the electrode under the chip component is likely to occur. For this reason, visual inspection and rework of the soldering state are required, and much labor is required for quality control of soldering. Further, since resin-based flux is used for soldering, it is necessary to remove the flux residue depending on the environmental conditions of use of the apparatus. For this reason, there is a problem in that a large amount of the cleaning organic solvent is consumed, which leads to an increase in global environmental load.
【０００４】本発明は、上記問題点にかんがみなされた
もので、プリント板に対するチップ部品の実装におい
て、はんだ付け接合を不要としてフラックスの溶剤洗浄
も不要とするチップ部品の実装構造及び実装方法の提供
を目的とする。The present invention has been made in view of the above problems, and provides a mounting structure and mounting method for a chip component that does not require soldering and flux solvent cleaning when mounting a chip component on a printed board. With the goal.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するた
め、請求項１の本発明のチップ部品の実装構造は、導体
パターンのパッドにプレイテッドスルーホールを設けた
プリント板と、長手方向にスリット及び先端部分にテー
パがそれぞれ備えられ、前記プレイテッドスルーホール
に圧入されて嵌合できる円筒状の基部と、前記基部の上
端から立ち上がって、逆Ｕ字状に成形された先端部によ
って後述するチップ部品の電極を上方から保持するキャ
ッチ部とからなる端子金具と、前記キャッチ部に保持さ
れて前記プリント板に実装され、前記端子金具を介して
前記プリント板の導体パターンと電気的に接続されるチ
ップ部品とで構成される。In order to achieve the above object, the chip component mounting structure of the present invention according to claim 1 is a printed board having a plated through hole in a pad of a conductor pattern and a slit in the longitudinal direction. And a tip portion, each of which has a taper at its tip portion, can be press-fitted into the plated through hole to be fitted thereto, and a tip portion which will be described later by a tip portion which is raised from an upper end of the base portion and formed into an inverted U shape. A terminal fitting including a catch portion that holds the electrode of the component from above, and a terminal fitting that is held by the catch portion and mounted on the printed board, and is electrically connected to the conductor pattern of the printed board through the terminal fitting. It is composed of chip parts.
【０００６】また、請求項２の本発明のチップ部品の実
装方法は、プリント板の導体パターンのパッド間に、チ
ップ部品を接着剤で仮止めする第１工程と、長手方向に
スリット及び先端部分にテーパがそれぞれ備えられ、前
記パッドに設けたプレイテッドスルーホールに圧入され
て嵌合できる円筒状の基部と、前記基部の上端から立ち
上がって、逆Ｕ字状に成形された先端部によってチップ
部品の電極を上方から保持するキャッチ部とからなる端
子金具を、前記一方のパッドに設けられたプレイテッド
スルーホールにテーパ側から圧入する第２工程と、他方
のパッドに設けられたプレイテッドスルーホールに、前
記第２工程と同様に他の端子金具を圧入し、前記端子金
具のキャッチ部によってチップ部品をプリント板に保持
し、同時にチップ部品とプリント板の導体パターンとを
電気的接続させる第３工程とで構成される。According to a second aspect of the present invention, there is provided a method of mounting a chip component, comprising: a first step of temporarily fixing the chip component with an adhesive between pads of a conductor pattern of a printed board; and a slit and a tip portion in a longitudinal direction. And a taper, each of which is provided with a taper, can be press-fitted into a plated through hole provided in the pad and can be fitted, and a tip part formed by rising from the upper end of the base and forming an inverted U shape. Second step of press-fitting a terminal fitting made up of a catch portion for holding the electrode from above from the tapered side into the plated through hole provided in the one pad, and a plated through hole provided in the other pad In the same manner as in the second step, another terminal metal fitting is press-fitted, and the chip part is held on the printed board by the catch portion of the terminal metal fitting, and at the same time, the chip is mounted. It constituted a conductor pattern of the goods and the printed board in a third step of electrical connection.
【０００７】また、請求項３の本発明のチップ部品の実
装方法は、プリント板の導体パターンのパッド間に、チ
ップ部品を接着剤で仮止めする第１工程と、長手方向に
スリット及び先端部分にテーパがそれぞれ備えられ、前
記パッドに設けたプレイテッドスルーホールに圧入され
て嵌合できる円筒状の基部と、前記基部の上端から立ち
上がって、逆Ｕ字状に成形された先端部によってチップ
部品の電極を上方から保持するキャッチ部とからなる端
子金具を、前記両パッドに設けられたプレイテッドスル
ーホールにテーパ側から二つ同時に圧入する第２工程
と、前記端子金具のキャッチ部によってチップ部品をプ
リント板に保持し、同時にチップ部品とプリント板の導
体パターンとを電気的接続させる第３工程とで構成され
る。According to a third aspect of the chip component mounting method of the present invention, there is provided a first step of temporarily fixing the chip component with an adhesive between the pads of the conductor pattern of the printed board, and a slit and a tip portion in the longitudinal direction. And a taper, each of which is provided with a taper, can be press-fitted into a plated through hole provided in the pad, and can be fitted into the cylindrical base portion, and a tip portion that rises from the upper end of the base portion and is shaped into an inverted U shape. A second step of simultaneously press-fitting two terminal fittings, each of which has a catch portion for holding the electrode from above, into the plated through holes provided in the pads from the taper side, and a chip part by the catch portion of the terminal fitting. Is held on the printed board, and at the same time, the chip part and the conductor pattern of the printed board are electrically connected.
【０００８】また、請求項４の本発明のチップ部品の実
装方法は、長手方向にスリット及び先端部分にテーパが
それぞれ備えられ、プリント板の導体パターンのパッド
に設けられたプレイテッドスルーホールに圧入されて嵌
合できる円筒状の基部と、前記基部の上端から立ち上が
って、逆Ｕ字状に成形された先端部によってチップ部品
の電極を上方から保持するキャッチ部とからなる端子金
具を、前記プレイテッドスルーホールにテーパ側から二
つ同時に、チップ部品を保持できる位置まで圧入する第
１工程と、前記キャッチ部の間に上方からチップ部品を
押し込め、前記チップ部品をプリント板に保持し、同時
に前記チップ部品とプリント板の導体パターンとを電気
的接続させる第２工程とで構成される。According to a fourth aspect of the present invention, there is provided a chip component mounting method, wherein a slit and a taper are provided at a tip portion in a longitudinal direction, respectively, and press-fitted into a plated through hole provided in a pad of a conductor pattern of a printed board. The terminal fitting is composed of a cylindrical base part that can be fitted and fitted, and a catch part that rises from the upper end of the base part and holds the electrode of the chip component from above by the tip part formed in an inverted U shape. The first step of press-fitting the two into the ted through hole from the taper side at the same time to a position where the chip component can be held, and pushing the chip component from above between the catch portions, holding the chip component on the printed board, and simultaneously The second step of electrically connecting the chip component and the conductor pattern of the printed board.
【０００９】[0009]
【作用】上記のように構成した請求項１にかかる本発明
においては、端子金具の基部がプリント板のプレイテッ
ドスルーホールに圧入され、端子金具のキャッチ部がチ
ップ部品の電極を上方から保持し、それぞれはんだ付け
することなく電気的に接続する。In the present invention according to claim 1 configured as described above, the base portion of the terminal fitting is press-fitted into the plated through hole of the printed board, and the catch portion of the terminal fitting holds the electrode of the chip component from above. , Electrically connect each without soldering.
【００１０】[0010]
【実施例】以下、本発明の一実施例を図１に基づいて説
明する。図１は、本発明に係る一実施例のチップ部品の
実装構造を示した斜視図である。プリント板１は表面に
導体パターン３及びその端部にパッド３ａ，３ｂを備
え、パッド３ａ，３ｂにプレイテッドスルーホール２を
設けている。プリント板１に実装されるチップ部品４
は、両端に電極５を有した一般的なチップ部品である。An embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a perspective view showing a mounting structure of a chip component according to an embodiment of the present invention. The printed board 1 is provided with a conductor pattern 3 on its surface and pads 3a and 3b on its ends, and plated through holes 2 are provided in the pads 3a and 3b. Chip component 4 mounted on printed board 1
Is a general chip component having electrodes 5 at both ends.
【００１１】端子金具６は、基部７とキャッチ部８とか
らなる。基部７は、プレイテッドスルーホール２内径よ
りやや大きい外径の円筒状で長手方向にスリット９を有
し、先端部分がテーパ１０となってプレイテッドスルー
ホール２に容易に圧入される。基部７は圧入されてプレ
ステッドスルーホール２内に嵌合可能となり、スリット
９を狭めて撓んだときの弾性力によって確実に保持され
るだけでなく、電気的に接続される。The terminal fitting 6 comprises a base portion 7 and a catch portion 8. The base 7 has a cylindrical shape having an outer diameter slightly larger than the inner diameter of the plated through hole 2 and has a slit 9 in the longitudinal direction, and a tip portion thereof has a taper 10 and is easily press-fitted into the plated through hole 2. The base portion 7 is press-fitted so that it can be fitted into the pressed through hole 2 and is not only securely held by the elastic force when the slit 9 is narrowed and bent but also electrically connected.
【００１２】キャッチ部８は、基部７の上端を立ち上
げ、その先端部１１が逆Ｕ字状に成形され、基部７がプ
レイテッドスルーホール２に圧入された際にチップ部品
４の電極５を上方から逆Ｕ字状の撓みによる弾性力によ
って保持し、かつ電気的に接続する。端子金具６はプレ
イテッドスルーホール２に対して一対で使用され、チッ
プ部品４の両電極５，５を保持する。The catch portion 8 is formed by raising the upper end of the base portion 7, and the tip portion 11 of the catch portion 8 is formed in an inverted U shape, and when the base portion 7 is press-fitted into the plated through hole 2, the electrode 5 of the chip component 4 is inserted. It is held and electrically connected by an elastic force due to an inverted U-shaped bending from above. The terminal fittings 6 are used as a pair with respect to the plated through hole 2 and hold both electrodes 5 and 5 of the chip component 4.
【００１３】次に、上述したチップ部品の実装構造につ
いての、請求項２に対応する実装方法を説明する。先
ず、第１工程は、プリント板１の両パッド３ａ，３ｂ間
に、チップ部品４が予め紫外線硬化性又は熱硬化性の接
着剤をごく少量塗布して載置され、接着剤を硬化させて
仮止めされる。Next, a mounting method corresponding to claim 2 for the mounting structure of the above-mentioned chip component will be described. First, in the first step, the chip component 4 is preliminarily applied with a very small amount of an ultraviolet-curable or thermosetting adhesive between the pads 3a and 3b of the printed board 1, and the adhesive is cured. It is temporarily stopped.
【００１４】次の第２工程は、一方のプレイテッドスル
ーホール２に、端子金具６の基部７がテーパ１０側から
圧入され、圧入の際スリット９を狭めながら弾性力を発
生させて基部７をプレイテッドスルーホール２内に確実
に嵌合され、この結果保持されると同時に電気的に接続
される。この圧入後、キャッチ部８の先端部１１は上方
からチップ部品４の電極５を保持し、かつ電気的に接続
される。In the next second step, the base portion 7 of the terminal fitting 6 is press-fitted into one of the plated through holes 2 from the taper 10 side, and when the press-fitting is performed, an elastic force is generated while the slit 9 is narrowed to form the base portion 7. It is securely fitted in the plated through hole 2 and, as a result, is held and at the same time electrically connected. After this press-fitting, the tip portion 11 of the catch portion 8 holds the electrode 5 of the chip component 4 from above and is electrically connected.
【００１５】さらに、第３工程は、他方のプレイテッド
スルーホール２に対しては、もう一つの端子金具６を前
述と同様に圧入し、キャッチ部８の先端部１１によって
チップ部品４をプリント板１に保持し、同時にチップ部
品４とプリント板１の導体パターン３とを電気的接続さ
せ、チップ部品４の実装が終了する。Further, in the third step, another terminal fitting 6 is press-fitted into the other plated through hole 2 in the same manner as described above, and the tip portion 11 of the catch portion 8 is used to mount the chip component 4 on the printed board. 1, and at the same time, the chip component 4 and the conductor pattern 3 of the printed board 1 are electrically connected, and the mounting of the chip component 4 is completed.
【００１６】請求項３に対応する実装方法の他の実施例
を説明する。前述の請求項２の実施例と第１工程は同じ
である。第２工程は、一対の端子金具６を自動装着機等
によって、プレイテッドスルーホール２に対して同時に
圧入する点が異なり、圧入手順は同じ要領で行われる。Another embodiment of the mounting method corresponding to claim 3 will be described. The first step is the same as the embodiment of claim 2 described above. The second step is different in that the pair of terminal fittings 6 are simultaneously press-fitted into the plated through hole 2 by an automatic mounting machine or the like, and the press-fitting procedure is performed in the same manner.
【００１７】そして、第３工程は、キャッチ部８の先端
部１１によってチップ部品４をプリント板１に保持し、
同時にチップ部品４とプリント板１の導体パターン３と
を電気的接続させ、チップ部品４の実装が終了する。Then, in the third step, the tip part 11 of the catch part 8 holds the chip component 4 on the printed board 1,
At the same time, the chip component 4 and the conductor pattern 3 of the printed board 1 are electrically connected, and the mounting of the chip component 4 is completed.
【００１８】請求項４に対応する実装方法の実施例を説
明する。先ず、第１工程は、一対の端子金具６を自動装
着機等によって、プレイテッドスルーホール２に対して
同時に圧入する。この圧入はキャッチ部８がチップ部品
４を保持できる位置まで行われ、上記請求項２の実施例
での圧入手順と同じ要領で行われる。An embodiment of a mounting method corresponding to claim 4 will be described. First, in the first step, the pair of terminal fittings 6 are simultaneously press-fitted into the plated through hole 2 by an automatic mounting machine or the like. This press-fitting is performed up to the position where the catch portion 8 can hold the chip component 4, and is carried out in the same manner as the press-fitting procedure in the embodiment of claim 2 above.
【００１９】次の第２工程は、キャッチ部８の間に上方
からチップ部品４を押し込め、キャッチ部８の先端部１
１によってチップ部品４をプリント板１に保持し、同時
にチップ部品４とプリント板１の導体パターン３とを電
気的接続させ、チップ部品４の実装が終了する。In the next second step, the tip part 1 of the catch portion 8 is pushed in by pushing the chip component 4 from above between the catch portions 8.
The chip component 4 is held on the printed board 1 by 1 and at the same time, the chip component 4 and the conductor pattern 3 of the printed board 1 are electrically connected, and the mounting of the chip component 4 is completed.
【００２０】[0020]
【発明の効果】以上のように本発明のチップ部品の実装
構造、及び、実装方法によれば、プリント板に対するチ
ップ部品の実装において、はんだ付け接合を不要とし、
フラックスの溶剤洗浄も不要とする。これにより、はん
だブリッジ並びにはんだの過不足等に対する外観検査並
びに手直し等のはんだ付けの品質管理が不要となり、か
つフラックス残渣洗浄用有機溶剤の使用量を大幅に削減
可能となり、省資源化及び地球環境の保護にも貢献でき
る。As described above, according to the mounting structure and mounting method for a chip component of the present invention, soldering is not required in mounting the chip component on the printed board,
No flux solvent cleaning is required. This eliminates the need for visual inspections for solder bridges and excess or deficiency of solder, and quality control of soldering such as reworking, and it is possible to significantly reduce the amount of organic solvent used for flux residue cleaning, saving resources and global environment. Can also contribute to the protection of.
【図１】本発明に係る実施例のチップ部品の実装構造を
示した斜視図である。FIG. 1 is a perspective view showing a mounting structure of a chip part according to an embodiment of the present invention.
【図２】従来の実装状態を示した斜視図である。FIG. 2 is a perspective view showing a conventional mounting state.
１ プリント板 ２ プレイテッドスルーホール ４ チップ部品 ６ 端子金具 ７ 基部 ８ キャッチ部 ９ スリット １０ テーパ １１ 先端部 1 Printed board 2 Plated through hole 4 Chip part 6 Terminal fitting 7 Base part 8 Catch part 9 Slit 10 Taper 11 Tip part
Claims (4)
ルーホールを設けたプリント板と、 長手方向にスリット及び先端部分にテーパがそれぞれ備
えられ、前記プレイテッドスルーホールに圧入されて嵌
合できる円筒状の基部と、 前記基部の上端から立ち上がって、逆Ｕ字状に成形され
た先端部によって後述するチップ部品の電極を上方から
保持するキャッチ部とからなる端子金具と、 前記キャッチ部に保持されて前記プリント板に実装さ
れ、前記端子金具を介して前記プリント板の導体パター
ンと電気的に接続されるチップ部品とで構成されること
を特徴とするチップ部品の実装構造。1. A printed board in which a plated through hole is provided in a pad of a conductor pattern, and a cylindrical shape which is provided with a slit in the longitudinal direction and a taper at a tip portion, and which can be press-fitted into and fitted into the plated through hole. A terminal metal fitting comprising a base portion and a catch portion that rises from the upper end of the base portion and holds an electrode of a chip component described later from above by a tip portion formed in an inverted U-shape; A mounting structure for a chip component, comprising a chip component mounted on the printed circuit board and electrically connected to a conductor pattern of the printed circuit board via the terminal fitting.
に、チップ部品を接着剤で仮止めする第１工程と、 長手方向にスリット及び先端部分にテーパがそれぞれ備
えられ、前記パッドに設けたプレイテッドスルーホール
に圧入されて嵌合できる円筒状の基部と、前記基部の上
端から立ち上がって、逆Ｕ字状に成形された先端部によ
ってチップ部品の電極を上方から保持するキャッチ部と
からなる端子金具を、前記一方のパッドに設けられたプ
レイテッドスルーホールにテーパ側から圧入する第２工
程と、 他方のパッドに設けられたプレイテッドスルーホール
に、前記第２工程と同様に他の端子金具を圧入し、前記
端子金具のキャッチ部によってチップ部品をプリント板
に保持し、同時にチップ部品とプリント板の導体パター
ンとを電気的接続させる第３工程とで構成されることを
特徴とするチップ部品の実装方法。2. A first step of temporarily fixing a chip component with an adhesive between pads of a conductor pattern of a printed board, and a slit provided in the pad, the slit being provided in the longitudinal direction and the taper being provided at the tip end portion, respectively. A terminal metal fitting including a cylindrical base portion that can be press-fitted into the through hole and fitted, and a catch portion that rises from the upper end of the base portion and holds the electrode of the chip component from above by the tip portion formed in an inverted U shape. In the second step of press-fitting into the plated through hole provided in the one pad from the taper side, and in the plated through hole provided in the other pad, another terminal metal fitting as in the second step. Press-fit and hold the chip component on the printed board by the catch of the terminal fitting, and at the same time, electrically connect the chip component and the conductor pattern of the printed board. Method for mounting chip components, characterized in that it is composed of a third step that.
に、チップ部品を接着剤で仮止めする第１工程と、 長手方向にスリット及び先端部分にテーパがそれぞれ備
えられ、前記パッドに設けたプレイテッドスルーホール
に圧入されて嵌合できる円筒状の基部と、前記基部の上
端から立ち上がって、逆Ｕ字状に成形された先端部によ
ってチップ部品の電極を上方から保持するキャッチ部と
からなる端子金具を、前記両パッドに設けられたプレイ
テッドスルーホールにテーパ側から二つ同時に圧入する
第２工程と、 前記端子金具のキャッチ部によってチップ部品をプリン
ト板に保持し、同時にチップ部品とプリント板の導体パ
ターンとを電気的接続させる第３工程とで構成されるこ
とを特徴とするチップ部品の実装方法。3. A first step of temporarily fixing a chip component with an adhesive between pads of a conductor pattern of a printed board; a slit provided in the longitudinal direction with a slit and a taper at a tip portion, respectively; A terminal metal fitting including a cylindrical base portion that can be press-fitted into the through hole and fitted, and a catch portion that rises from the upper end of the base portion and holds the electrode of the chip component from above by the tip portion formed in an inverted U shape. A second step of simultaneously press-fitting two into the plated through holes provided on both pads from the taper side, and holding the chip component on the printed board by the catch portion of the terminal fitting, and at the same time And a third step of electrically connecting the conductor pattern to the conductor pattern.
パがそれぞれ備えられ、プリント板の導体パターンのパ
ッドに設けられたプレイテッドスルーホールに圧入され
て嵌合できる円筒状の基部と、前記基部の上端から立ち
上がって、逆Ｕ字状に成形された先端部によってチップ
部品の電極を上方から保持するキャッチ部とからなる端
子金具を、前記プレイテッドスルーホールにテーパ側か
ら二つ同時に、チップ部品を保持できる位置まで圧入す
る第１工程と、 前記キャッチ部の間に上方からチップ部品を押し込め、
前記チップ部品をプリント板に保持し、同時に前記チッ
プ部品とプリント板の導体パターンとを電気的接続させ
る第２工程とで構成されることを特徴とするチップ部品
の実装方法。4. A cylindrical base portion, which is provided with a slit and a taper at a tip portion in the longitudinal direction, and can be press-fitted into and fitted into a plated through hole provided in a pad of a conductor pattern of a printed board, and a base portion of the base portion. Two terminal fittings, which stand up from the upper end and have a catch portion that holds the electrode of the chip component from above by the tip portion formed in an inverted U shape, are inserted into the plated through hole from the taper side at the same time. The first step of press-fitting to a position where it can be held, and the chip part is pushed in from above between the catch portions,
A chip component mounting method, comprising: a second step of holding the chip component on a printed board and, at the same time, electrically connecting the chip component and a conductor pattern of the printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5207294A JP2503907B2 (en) | 1993-07-29 | 1993-07-29 | Chip component mounting structure and chip component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5207294A JP2503907B2 (en) | 1993-07-29 | 1993-07-29 | Chip component mounting structure and chip component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0745925A JPH0745925A (en) | 1995-02-14 |
| JP2503907B2 true JP2503907B2 (en) | 1996-06-05 |
Family
ID=16537408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5207294A Expired - Lifetime JP2503907B2 (en) | 1993-07-29 | 1993-07-29 | Chip component mounting structure and chip component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2503907B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4532338B2 (en) * | 2005-05-18 | 2010-08-25 | 古河電気工業株式会社 | Press-fit terminal connection structure |
| JP5041893B2 (en) * | 2007-07-02 | 2012-10-03 | アルファーデザイン株式会社 | Board and connector terminals for preventing corrosion of current-carrying parts and connector dropout, and mounting method thereof |
-
1993
- 1993-07-29 JP JP5207294A patent/JP2503907B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0745925A (en) | 1995-02-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |