JP2502577Y2 - Power semiconductor module - Google Patents
Power semiconductor moduleInfo
- Publication number
- JP2502577Y2 JP2502577Y2 JP1991110066U JP11006691U JP2502577Y2 JP 2502577 Y2 JP2502577 Y2 JP 2502577Y2 JP 1991110066 U JP1991110066 U JP 1991110066U JP 11006691 U JP11006691 U JP 11006691U JP 2502577 Y2 JP2502577 Y2 JP 2502577Y2
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- case
- semiconductor module
- terminal members
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この考案は電力用半導体モジュー
ルに係り、金属ベース基板上の複数個の電力用半導体素
子に電気的に接続される端子部材の改良に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power semiconductor module, and relates to improvement of a terminal member electrically connected to a plurality of power semiconductor elements on a metal base substrate.
【０００２】[0002]
【従来の技術】従来、金属ベース基板上に取り付けた２
つの電力用半導体素子の夫々に互いに左右対称の形状の
端子部材を取り付け、この２つの端子部材が対向し接触
する部分の上方に外部配線用取付穴を設けた電力用半導
体モジュールとしては、例えば図４に示す構造のものが
ある。2. Description of the Related Art Conventionally, 2 mounted on a metal base substrate
For example, a power semiconductor module in which terminal members having symmetrical shapes are attached to each of the two power semiconductor elements, and an external wiring mounting hole is provided above a portion where the two terminal members face and contact each other is shown in FIG. There is a structure shown in FIG.
【０００３】即ち、銅、鉄などの金属ベース基板１上に
２つの半導体素子２、３がモリブデン、タングステンな
どの熱緩衝材４、５を介して半田６によって取り付けら
れている。そして電力用半導体素子２、３には端子部材
７、８が半田９によって取り付けられている。この２つ
の端子部材７、８は左右対称の形状で対向しており、そ
の上方で両者は接触してケース１０外部に引き出され、
かつ引き出された上方部分には外部配線用取付穴１１、
１２が設けられている。そしてケース１０内には上部か
ら注入したシリコーンゴムを加熱硬化してシリコーンゴ
ム層１３が形成され、その上にエポキシ樹脂を注入し、
加熱硬化してエポキシ樹脂層１４が形成されている。That is, two semiconductor elements 2 and 3 are mounted on a metal base substrate 1 such as copper or iron with solder 6 via thermal buffer materials 4 and 5 such as molybdenum or tungsten. Terminal members 7 and 8 are attached to the power semiconductor elements 2 and 3 with solder 9. The two terminal members 7 and 8 are symmetrically opposed to each other, and are in contact with each other above the terminal members 7 and drawn out of the case 10.
In addition, the external wiring mounting hole 11,
12 are provided. Then, in the case 10, the silicone rubber injected from the upper portion is heated and cured to form the silicone rubber layer 13, and the epoxy resin is injected onto the silicone rubber layer 13.
The epoxy resin layer 14 is formed by heating and curing.
【０００４】[0004]
【考案が解決しようとする課題】このような従来の電力
用半導体モジュールでは電力用半導体素子、端子部材を
搭載したのち、シリコーンゴムやエポキシ樹脂を注入し
てシリコーンゴム層、エポキシ樹脂層を形成する時に、
２つの端子部材が接触している部分に溶融状態のシリコ
ーンゴムやエポキシ樹脂が表面張力によって上昇して入
りこんでいく。特に２つの端子部材の接触部分がエポキ
シ樹脂を充填する部分にあると、エポキシ樹脂の粘着力
が弱いために、接触部分の上方にまでエポキシ樹脂が上
昇する結果、遂には２つの端子部材が互いに絶縁状態と
なってしまうのである。In such a conventional power semiconductor module, a power semiconductor element and a terminal member are mounted, and then silicone rubber or epoxy resin is injected to form a silicone rubber layer or an epoxy resin layer. Sometimes
The silicone rubber or epoxy resin in a molten state rises due to surface tension into the portion where the two terminal members are in contact with each other. In particular, if the contact portion of the two terminal members is in the portion filled with the epoxy resin, the adhesive force of the epoxy resin is weak, and as a result, the epoxy resin rises above the contact portion. It becomes an insulating state.
【０００５】このような状態で外部配線が端子部材に接
続されると、電気的な接触面積が不足し、接触部分が発
熱して半導体素子を熱破損するという問題がある。When the external wiring is connected to the terminal member in such a state, there is a problem that the electrical contact area is insufficient and the contact portion generates heat to thermally damage the semiconductor element.
【０００６】[0006]
【課題を解決するための手段】この考案は電力用半導体
素子を搭載したケース内を樹脂封止する際に、左右対称
の形状をなす２つの端子部材の接触部分に対して封止樹
脂が及ぼす上記の問題点を、２つの端子部材の接触部分
に樹脂溜りを設けることにより解決したものである。According to the present invention, when a case in which a power semiconductor element is mounted is sealed with a resin, a sealing resin exerts on a contact portion of two terminal members having a symmetrical shape. The above problem is solved by providing a resin reservoir at the contact portion between two terminal members.
【０００７】即ち、この考案は金属ベース基板上の隣り
合う電力用半導体素子に電気的に接続される左右対称の
形状の２つの端子部材が対向し接触する部分でケース外
部に引出されている部分の任意の位置に樹脂溜りを設け
たことを特徴とするものである。That is, according to the present invention, a portion where two terminal members having a symmetrical shape which are electrically connected to adjacent power semiconductor elements on a metal base substrate are opposed to and in contact with each other and are drawn out of the case. Is characterized in that a resin reservoir is provided at any position.
【０００８】[0008]
【作用および効果】この考案は、上記のように左右対称
形状の２つの端子部材が対向し接触する部分でケース外
部に引出されている部分の任意の位置に樹脂溜りを設け
たことによって、電力用半導体素子、端子部材を搭載し
たケース内をシリコーンゴムおよびエポキシ樹脂で封止
しようとする時、溶融したエポキシ樹脂の表面張力の上
昇をこの樹脂溜りによって押さえることができるので、
端子部材の上方に設けた外部配線取付穴に外部配線を接
続する時に接触面積が不足することがなく、従って接触
部分の発熱を生ずることもなく、十分に電力用半導体モ
ジュールを機能させることができる。FUNCTION AND EFFECT According to the present invention, since the resin reservoir is provided at an arbitrary position in the portion where the two terminal members having the symmetrical shape are opposed to each other and contact with each other as described above, the portion is drawn out of the case. When you try to seal the inside of the case where the semiconductor element for semiconductor and the terminal member are mounted with silicone rubber and epoxy resin, the rise of the surface tension of the molten epoxy resin can be suppressed by this resin reservoir,
When connecting the external wiring to the external wiring mounting hole provided above the terminal member, the contact area does not become insufficient, and therefore, heat generation at the contact portion does not occur, and the power semiconductor module can fully function. .
【０００９】[0009]
【実施例】次に、この考案の一実施例を図１〜３により
説明する。なお、図１〜３において従来例を示す図４と
同一の部位については同一の符号を付した。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, one embodiment of the present invention will be described with reference to FIGS. In FIGS. 1 to 3, the same parts as those in FIG. 4 showing the conventional example are designated by the same reference numerals.
【００１０】図１において、金属ベース基板１上に２個
の電力用半導体素子２、３が熱緩衝材４、５を介して半
田６によって取り付けられている。また電力用半導体素
子２、３には夫々端子部材７、８が半田９によって取り
付けられており、この端子部材７、８は左右対称形状を
なして対向しており、その上部は両者が接触してケース
１０外部に引出され、上方部分には外部配線用の取付穴
１１、１２が設けられている。In FIG. 1, two power semiconductor elements 2 and 3 are mounted on a metal base substrate 1 with solder 6 via thermal buffer materials 4 and 5. Further, terminal members 7 and 8 are attached to the power semiconductor elements 2 and 3 by solder 9, respectively. The terminal members 7 and 8 are symmetrically opposed to each other, and the upper portions thereof are in contact with each other. And the mounting holes 11 and 12 for external wiring are provided in the upper part.
【００１１】ケース１０外部に引出されている端子部材
７、８の外部配線用取付穴１１、１２の下方の１５は端
子部材７、８によって作られた樹脂溜りである。この樹
脂溜り１５は図２（ａ）に示すように、端子部材７、８
として両者の接触部分のケース外部に引出される任意の
位置に切り込み１５ａ、１５ｂを入れたものを使用する
ことにより図２（ｂ）のように形成することができる。
この場合、例えば端子部材７、８の厚みｔが１ｍｍのも
のにその約１／２の切り込みｔ1 を設ければよい。A lower portion 15 of the external wiring mounting holes 11 and 12 of the terminal members 7 and 8 drawn out of the case 10 is a resin pool formed by the terminal members 7 and 8. As shown in FIG. 2A, the resin pool 15 is provided with the terminal members 7, 8
As shown in FIG. 2 (b), by using notches 15a and 15b at arbitrary positions where the contact portions of the two are drawn out of the case.
In this case, for example, the terminal member 7, 8 having a thickness t of 1 mm may be provided with a cut t 1 which is about ½ thereof.
【００１２】また、接触部分のケース外部に引出される
任意の位置を外側にコ字状に折り曲げて凹みを設けた端
子部材７ａ、８ａを用いることによって図２（ｃ）のよ
うな樹脂溜り１５ｃを作成するようにしてもよい。Further, by using the terminal members 7a and 8a, which are provided by forming a recess by bending an arbitrary position of the contact portion outside the case into a U shape, a resin pool 15c as shown in FIG. 2C is used. May be created.
【００１３】かくして電力用半導体素子、端子部材を搭
載したケース１０内にシリコーンゴムを注入し、加熱硬
化してシリコーンゴム層１３を形成した後に、さらにエ
ポキシ樹脂を注入し、加熱硬化してエポキシ樹脂層１４
を形成することにより図１の電力用半導体モジュールが
得られる。Thus, after the silicone rubber is injected into the case 10 in which the power semiconductor element and the terminal member are mounted and cured by heating to form the silicone rubber layer 13, epoxy resin is further injected and cured by heating to obtain the epoxy resin. Layer 14
By forming the above, the power semiconductor module of FIG. 1 is obtained.
【００１４】図３は他の実施例を示すものであって、金
属ベース基板１上に４個の電力用半導体素子２、２ａ、
３、３ａを設けたものであり、２、２ａと３、３ａの隣
り合う半導体素子を夫々１組として図２（ｃ）に示す端
子部材７ａ、８ａを用いて樹脂溜り１５ｃを設けたもの
である。その他の構成は図１と同様である。FIG. 3 shows another embodiment, in which four power semiconductor elements 2, 2a, and
3 and 3a are provided, and the resin pool 15c is provided by using the terminal members 7a and 8a shown in FIG. 2C as a set of adjacent semiconductor elements of 2 and 2a and 3, 3a, respectively. is there. Other configurations are the same as those in FIG.
【００１５】なお、この考案において隣り合う電力用半
導体素子に接続する端子部材の接触部分による一体化
は、例えば接触部分の所定の位置に予め突起と係合孔を
設けておき、互いに突起を係合孔に係止してかしめるな
どして固定することにより行えばよい。In the present invention, the terminal members connected to the adjacent power semiconductor elements are integrated by the contact portions. For example, a protrusion and an engaging hole are provided in advance at a predetermined position of the contact portion, and the protrusions are engaged with each other. It may be carried out by locking it in the dowel and fixing it by caulking.
【図１】この考案の一実施例を示す電力用半導体モジュ
ールの断面図である。FIG. 1 is a sectional view of a power semiconductor module showing an embodiment of the present invention.
【図２】（ａ）乃至（ｃ）は端子部材により作成する樹
脂溜りの説明図である。2A to 2C are explanatory views of a resin pool formed by a terminal member.
【図３】この考案の他の実施例を示す電力用半導体モジ
ュールの断面図である。FIG. 3 is a sectional view of a power semiconductor module according to another embodiment of the present invention.
【図４】従来の電力用半導体モジュールの断面図であ
る。FIG. 4 is a cross-sectional view of a conventional power semiconductor module.
１ 金属ベース基板 ２ 電力用半導体素子 ３ 電力用半導体素子 ７ 端子部材 ８ 端子部材 １０ ケース １１ 外部配線用取付穴 １２ 外部配線用取付穴 １５ 樹脂溜り １５ａ 切り込み １５ｂ 切り込み １５ｃ 樹脂溜り 1 Metal Base Substrate 2 Power Semiconductor Element 3 Power Semiconductor Element 7 Terminal Member 8 Terminal Member 10 Case 11 External Wiring Mounting Hole 12 External Wiring Mounting Hole 15 Resin Reservoir 15a Notch 15b Notch 15c Resin Reservoir
───────────────────────────────────────────────────── フロントページの続き (72)考案者 岩本 峰吉 大阪府大阪市東淀川区淡路２丁目14番３ 号 株式会社三社電機製作所内 (56)参考文献 実開 平３−45653（ＪＰ，Ｕ) 実開 平５−5743（ＪＰ，Ｕ) 実開 昭63−105352（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Creator Mineyoshi Iwamoto 2-14-3 Awaji, Higashiyodogawa-ku, Osaka City, Osaka Prefecture Sansha Electric Manufacturing Co., Ltd. (56) References: Kaikaihei 3-45653 (JP, U ) Actually open 5-5743 (JP, U) Actually open 63-105352 (JP, U)
Claims (3)
体素子が取り付けられ、該電力用半導体素子と電気的に
接続された端子部材の一方端をケース外部に引出し、ケ
ース内の電力用半導体素子をシリコーンゴム層およびエ
ポキシ樹脂層で封止した電力用半導体モジュールにおい
て、隣り合う電力用半導体素子に接続される２つの端子
部材が左右対称の形状からなり、それらが対向し接触す
る部分のケース外部に引出されている部分に樹脂溜りを
設けてなる電力用半導体モジュール。1. A plurality of power semiconductor elements are mounted on a metal base substrate, and one end of a terminal member electrically connected to the power semiconductor elements is pulled out to the outside of the case, and the power semiconductor in the case is formed. In a power semiconductor module in which an element is sealed with a silicone rubber layer and an epoxy resin layer, two terminal members connected to adjacent power semiconductor elements have a bilaterally symmetrical shape, and a case where they face each other and are in contact with each other. A power semiconductor module in which a resin reservoir is provided in the portion that is drawn out to the outside.
する部分であって、ケースの外部に引出されている部分
の夫々同一位置に一部切り込みを入れて形成される請求
項１記載の電力用半導体モジュール。2. The resin reservoir according to claim 1, wherein the resin reservoir is a portion of the two terminal members facing each other and in contact with each other. Power semiconductor module.
する部分であって、ケースの外部に引出されている部分
の夫々同一位置に端子部材を外側にコ字状に折曲げて形
成される請求項１記載の電力用半導体モジュール。3. A resin reservoir is formed by bending the terminal member outward in a U-shape at the same position of the two terminal members facing each other and in contact with each other, each of which is pulled out to the outside of the case. The power semiconductor module according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991110066U JP2502577Y2 (en) | 1991-12-12 | 1991-12-12 | Power semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991110066U JP2502577Y2 (en) | 1991-12-12 | 1991-12-12 | Power semiconductor module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0550742U JPH0550742U (en) | 1993-07-02 |
| JP2502577Y2 true JP2502577Y2 (en) | 1996-06-26 |
Family
ID=14526200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991110066U Expired - Fee Related JP2502577Y2 (en) | 1991-12-12 | 1991-12-12 | Power semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2502577Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6861622B2 (en) * | 2017-12-19 | 2021-04-21 | 三菱電機株式会社 | Semiconductor equipment and power conversion equipment |
-
1991
- 1991-12-12 JP JP1991110066U patent/JP2502577Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0550742U (en) | 1993-07-02 |
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