JP2023523758A - 積層構造体、表示スクリーン、および表示装置 - Google Patents
積層構造体、表示スクリーン、および表示装置 Download PDFInfo
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- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
本出願は、2020年4月30日に中国国家知識産権局に出願された「STACKED STRUCTURE,DISPLAY SCREEN,AND DISPLAY APPARATUS」と題する中国特許出願第202010362184.1号の優先権を主張し、全体が参照により本明細書に組み込まれる。
Claims (12)
- 積層された、基板と、少なくとも1つの駆動チップと、各駆動チップに対応する少なくとも1つの画素ユニットとを備える積層構造体であって、
前記基板は第1の表面を有し、配線層が前記第1の表面上に配置され、
各駆動チップは、前記配線層の表面であって前記第1の表面から離れる方に面する前記表面上に配置され、
各画素ユニットおよび対応する駆動チップが積層され、
各画素ユニット内に位置するサブ画素が、前記配線層および前記対応する駆動チップに別々に電気的に接続されて発光ループを形成する、
積層構造体。 - 前記配線層上に前記駆動チップが配置された領域は、前記駆動チップから絶縁されている請求項1に記載の積層構造体。
- 各駆動チップの表面であって前記配線層から離れる方に面する前記表面上に結合ポストが配置され、前記結合ポストは、前記駆動チップおよび前記配線層に電気的に接続される請求項2に記載の積層構造体。
- 各駆動チップに対応する前記サブ画素は、前記対応する駆動チップの前記表面であって前記配線層から離れる方に面する前記表面上に配置される請求項1乃至3のいずれか一項に記載の積層構造体。
- 各駆動チップに対応する第1のパッケージング層をさらに備え、各第1のパッケージング層は、前記対応する駆動チップをパッケージングし、
各駆動チップに対応する前記サブ画素は、前記第1のパッケージング層上に配置される請求項4に記載の積層構造体。 - 各駆動チップに対応する第2のパッケージング層をさらに備え、各第2のパッケージング層は、前記対応する駆動チップおよび前記複数のサブ画素をパッケージングする請求項1乃至5のいずれか一項に記載の積層構造体。
- 分離層をさらに備え、前記分離層は、前記配線層と前記基板との間に配置される請求項1乃至6のいずれか一項に記載の積層構造体。
- 各サブ画素は、発光層と、前記発光層に別々に接続されたP極およびN極とを備え、前記P極は、前記対応する駆動チップに接続され、前記N極は、前記配線層に接続されるか、または、前記P極は、前記配線層に接続され、前記N極は、前記対応する駆動チップに接続される請求項1乃至7のいずれか一項に記載の積層構造体。
- 前記P極、前記発光層、および前記N極が積層され、前記発光層は、前記P極と前記N極との間に位置する請求項8に記載の積層構造体。
- 前記P極、前記発光層、および前記N極が積層され、前記P極および前記N極は、同じ層上に配置される請求項8に記載の積層構造体。
- ハウジングと、前記ハウジングの内部に配置され、請求項1乃至10のいずれか一項に記載された前記積層構造体とを備える表示スクリーン。
- 本体と、前記本体の内部に配置され、請求項1乃至10のいずれか一項に記載された前記積層構造体とを備える表示装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010362184.1A CN113594194A (zh) | 2020-04-30 | 2020-04-30 | 一种堆叠结构、显示屏及显示装置 |
CN202010362184.1 | 2020-04-30 | ||
PCT/CN2021/090892 WO2021219069A1 (zh) | 2020-04-30 | 2021-04-29 | 一种堆叠结构、显示屏及显示装置 |
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Publication Number | Publication Date |
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JP2023523758A true JP2023523758A (ja) | 2023-06-07 |
JP7477647B2 JP7477647B2 (ja) | 2024-05-01 |
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Country Status (6)
Country | Link |
---|---|
US (1) | US12020630B1 (ja) |
EP (1) | EP4131385A4 (ja) |
JP (1) | JP7477647B2 (ja) |
KR (1) | KR20230006528A (ja) |
CN (1) | CN113594194A (ja) |
WO (1) | WO2021219069A1 (ja) |
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CN116469971B (zh) * | 2023-04-18 | 2023-09-15 | 上海聚跃检测技术有限公司 | 一种集成电路堆叠芯片的封装方法及装置 |
CN116995072B (zh) * | 2023-09-27 | 2023-12-08 | 惠科股份有限公司 | 显示背板及其制作方法和转移方法 |
CN118213363A (zh) * | 2024-05-22 | 2024-06-18 | 华引芯(武汉)科技有限公司 | 发光器件、灯板和显示装置 |
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- 2020-04-30 CN CN202010362184.1A patent/CN113594194A/zh active Pending
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- 2021-04-29 EP EP21797561.4A patent/EP4131385A4/en active Pending
- 2021-04-29 KR KR1020227041264A patent/KR20230006528A/ko unknown
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JP7477647B2 (ja) | 2024-05-01 |
EP4131385A4 (en) | 2023-12-06 |
WO2021219069A1 (zh) | 2021-11-04 |
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US12020630B1 (en) | 2024-06-25 |
CN113594194A (zh) | 2021-11-02 |
KR20230006528A (ko) | 2023-01-10 |
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