JP2023108190A - Processing device - Google Patents

Processing device Download PDF

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JP2023108190A
JP2023108190A JP2022009174A JP2022009174A JP2023108190A JP 2023108190 A JP2023108190 A JP 2023108190A JP 2022009174 A JP2022009174 A JP 2022009174A JP 2022009174 A JP2022009174 A JP 2022009174A JP 2023108190 A JP2023108190 A JP 2023108190A
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panel
various means
opened
workpiece
closed
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Japanese (ja)
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晋也 山田
Shinya Yamada
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2022009174A priority Critical patent/JP2023108190A/en
Priority to CN202310031459.7A priority patent/CN116494044A/en
Priority to KR1020230005813A priority patent/KR20230114709A/en
Priority to TW112101699A priority patent/TW202331830A/en
Publication of JP2023108190A publication Critical patent/JP2023108190A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/0009—Energy-transferring means or control lines for movable machine parts; Control panels or boxes; Control parts
    • B23Q1/0045—Control panels or boxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/08—Protective coverings for parts of machine tools; Splash guards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Numerical Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

To provide a processing device which can resolve a problem that an operator operates a grinding device without knowing an occurrence of a failure to damage a workpiece or break other means.SOLUTION: A processing device includes: a housing 52 which covers each means 4; an openable and closable panel 54 which is formed at the housing 52 and enables access to each means 4; and a monitor 56 which at least displays a pattern diagram S including the panel 54 and each means 4. Control means shows the panel 54 which is opened or closed in the pattern diagram S when the panel 54 is opened or closed and shows each means 4, in which a failure occurs, in the pattern diagram S when the failure occurs in each means 4.SELECTED DRAWING: Figure 3

Description

本発明は、被加工物を保持する保持手段および保持手段に保持された被加工物を加工する加工手段を含む各種手段と、各種手段を制御する制御手段と、を備えた加工装置に関する。 The present invention relates to a processing apparatus having various means including holding means for holding a workpiece, processing means for machining the workpiece held by the holding means, and control means for controlling the various means.

ＩＣ、ＬＳＩ等の複数のデバイスが分割予定ラインによって区画され表面に形成されたウエーハは、研削装置によって所望の厚みに形成された後、ダイシング装置、レーザー加工装置によって個々のデバイスチップに分割され、分割された各デバイスチップは携帯電話、パソコン等の電気機器に利用される。 A wafer in which a plurality of devices such as ICs and LSIs are partitioned by dividing lines and formed on the surface thereof is formed to a desired thickness by a grinding device, and then divided into individual device chips by a dicing device and a laser processing device, Each of the divided device chips is used in electrical equipment such as mobile phones and personal computers.

研削装置は、ウエーハを保持する保持手段と、保持手段に隣接して配設されウエーハの厚みを計測する厚み計測手段と、保持手段に保持されたウエーハを研削する研削砥石が環状に配設された研削ホイールを回転可能に備えた加工手段と、複数のウエーハを収容したカセットが載置されるカセットテーブルと、カセットテーブルに載置されたカセットからウエーハを搬出入する搬出入手段と、搬出入手段によって搬出されたウエーハを仮受けする仮受けテーブルと、仮受けテーブルから保持手段にウエーハを搬送する第一の搬送手段と、保持手段からウエーハを搬出し洗浄手段まで搬送する第二の搬送手段とを含み、ウエーハを全自動で所望の厚みに加工することができる（たとえば、特許文献１参照）。 The grinding apparatus includes holding means for holding the wafer, thickness measuring means arranged adjacent to the holding means for measuring the thickness of the wafer, and a grinding wheel for grinding the wafer held by the holding means. a cassette table on which a cassette containing a plurality of wafers is mounted; a loading/unloading means for loading/unloading the wafers from the cassette placed on the cassette table; a temporary receiving table for temporarily receiving the wafer unloaded by the means; a first transport means for transporting the wafer from the temporary receiving table to the holding means; and a second transport means for unloading the wafer from the holding means and transporting it to the cleaning means. and the wafer can be fully automatically processed to a desired thickness (see, for example, Patent Document 1).

特開２００６－２３７３３３号公報JP-A-2006-237333

しかし、搬出入手段、第一・第二の搬送手段、厚み計測手段等の各種手段に不具合（トラブル）が発生した場合、オペレータは、各種手段を覆う筐体に設けられたパネルを開放して、不具合が発生した各種手段にアクセスして不具合の状況を確認した後、修理・交換に必要な工具・部品を取りに行くため、研削装置から離れることがある。 However, if trouble occurs in various means such as loading/unloading means, first and second conveying means, and thickness measuring means, the operator must open the panel provided on the housing that covers the various means. , After confirming the status of the problem by accessing various means where the problem occurred, there are times when I leave the grinding machine to pick up the tools and parts necessary for repair or replacement.

上記のような場合に、次に研削装置の使用を予約していたオペレータが、不具合の発生を知らずに研削装置を稼働してウエーハを損傷させたり、さらに他の手段を故障させてしまうという問題がある。 In the above case, the operator who has reserved the next use of the grinding machine operates the grinding machine without knowing that the problem has occurred, damaging the wafer or causing other means to malfunction. There is

このような問題は、研削装置に限らず、ダイシング装置、レーザー加工装置を含む各種の加工装置において起こり得る。 Such problems can occur not only in grinding machines but also in various processing machines including dicing machines and laser processing machines.

本発明の課題は、オペレータが不具合の発生を知らずに加工装置を稼働してウエーハ等の被加工物を損傷させ、あるいは、他の手段を故障させてしまうという問題を解消することができる加工装置を提供することである。 SUMMARY OF THE INVENTION An object of the present invention is to solve the problem that an operator operates a processing apparatus without knowing that a problem has occurred, thereby damaging a workpiece such as a wafer or causing other means to malfunction. is to provide

本発明によれば、上記課題を解決する以下の加工装置が提供される。すなわち、
「被加工物を保持する保持手段および該保持手段に保持された被加工物を加工する加工手段を含む各種手段と、該各種手段を制御する制御手段と、を備えた加工装置であって、
該各種手段を覆う筐体と、該筐体に形成され該各種手段へのアクセスを可能にする開閉自在なパネルと、該パネルおよび該各種手段を含む模式図を少なくとも表示するモニターと、を備え、
該制御手段は、該パネルが開閉された場合、開閉された該パネルを該模式図に示し、該各種手段に不具合が生じた場合、不具合が生じた該各種手段を該模式図に示す加工装置」が提供される。 According to the present invention, the following processing apparatus for solving the above problems is provided. i.e.
"A processing apparatus comprising various means including holding means for holding a workpiece and processing means for processing the workpiece held by the holding means, and control means for controlling the various means,
A housing that covers the various means, an openable and closable panel formed in the housing that enables access to the various means, and a monitor that displays at least a schematic diagram including the panel and the various means. ,
When the panel is opened and closed, the control means indicates the opened and closed panel in the schematic diagram, and when a problem occurs in the various means, the processing device indicates the various means in which the problem occurs in the schematic diagram. ” is provided.

好ましくは、該模式図は、該パネルが開閉されておらず該各種手段に不具合が生じていない場合は１色で表示され、該パネルが開閉された場合、開閉された該パネルの色が変更されて表示され、該各種手段に不具合が生じた場合、不具合が生じた該各種手段の色が変更されて表示される。 Preferably, the schematic diagram is displayed in one color when the panel is not opened and closed and no trouble occurs in the various means, and when the panel is opened and closed, the color of the opened and closed panel changes. When a trouble occurs in the various means, the color of the troubled means is changed and displayed.

該パネルの開閉および該各種手段の不具合がなかった状態に該模式図を戻すためのリセットボタンを備えるのが望ましい。 It is desirable to provide a reset button for returning the schematic to a state in which the panel has not been opened or closed and the various means have not malfunctioned.

本発明の加工装置は、
被加工物を保持する保持手段および該保持手段に保持された被加工物を加工する加工手段を含む各種手段と、該各種手段を制御する制御手段と、を備えた加工装置であって、
該各種手段を覆う筐体と、該筐体に形成され該各種手段へのアクセスを可能にする開閉自在なパネルと、該パネルおよび該各種手段を含む模式図を少なくとも表示するモニターと、を備え、
該制御手段は、該パネルが開閉された場合、開閉された該パネルを該模式図に示し、該各種手段に不具合が生じた場合、不具合が生じた該各種手段を該模式図に示すので、オペレータが不具合の発生を知らずに加工装置を稼働して被加工物を損傷させ、あるいは、他の手段を故障させてしまうという問題を解消することができる。 The processing device of the present invention is
A processing apparatus comprising various means including holding means for holding a workpiece and processing means for processing the workpiece held by the holding means, and control means for controlling the various means,
A housing that covers the various means, an openable and closable panel formed in the housing that enables access to the various means, and a monitor that displays at least a schematic diagram including the panel and the various means. ,
When the panel is opened and closed, the control means indicates the opened and closed panel in the schematic diagram, and when a problem occurs in the various means, the various means in which the problem occurs are indicated in the schematic diagram. It is possible to solve the problem that the operator operates the processing apparatus without knowing the occurrence of the problem, damaging the workpiece or causing other means to malfunction.

本発明に従って構成された加工装置（研削装置）の斜視図。1 is a perspective view of a processing device (grinding device) constructed according to the present invention; FIG. 図１に示すモニターに表示される模式図。The schematic diagram displayed on the monitor shown in FIG. 不具合が生じた場合にモニターに表示される模式図。Schematic diagram displayed on the monitor when a problem occurs.

以下、本発明に従って構成された加工装置の好適実施形態について、図面を参照しつつ説明する。 A preferred embodiment of a processing apparatus constructed according to the present invention will be described below with reference to the drawings.

（研削装置２）
図１には、本発明に従って構成された加工装置の一例としての研削装置２が示されている。なお、本発明の加工装置は、研削装置２に限定されず、たとえば、被加工物に切削加工を施す切削ブレードを回転可能に備えたダイシング装置や、被加工物にレーザー加工を施すレーザー加工装置等であってもよい。 (Grinding device 2)
FIG. 1 shows a grinding device 2 as an example of a processing device constructed according to the present invention. The processing apparatus of the present invention is not limited to the grinding apparatus 2. For example, a dicing apparatus having a rotatable cutting blade for cutting a workpiece, or a laser processing apparatus for performing laser processing on a workpiece. etc.

図示の実施形態の研削装置２は、被加工物の搬送、研削、洗浄等の各種動作を実行する各種手段４と、各種手段４を制御する制御手段６とを備えている。 The grinding apparatus 2 of the illustrated embodiment includes various means 4 for carrying out various operations such as transporting, grinding, and cleaning the workpiece, and control means 6 for controlling the various means 4 .

（各種手段４）
図１に示すとおり、各種手段４は、被加工物を保持する保持手段８と、保持手段８に保持された被加工物を加工する加工手段１０とを含む。 (Various means 4)
As shown in FIG. 1 , the various means 4 include holding means 8 for holding a workpiece and processing means 10 for machining the workpiece held by the holding means 8 .

（保持手段８）
保持手段８は、基台１２の上面に回転自在に支持された円形のターンテーブル１４と、ターンテーブル１４の上面周縁側に周方向に等間隔をおいて配置された３個のチャックテーブル１６とを有する。各チャックテーブル１６は、符号Ａで示す着脱位置と、符号Ｂで示す荒研削位置と、符号Ｃで示す仕上げ研削位置とにターンテーブル１４の回転によって順次位置づけられる。 (Holding means 8)
The holding means 8 includes a circular turntable 14 rotatably supported on the upper surface of the base 12, and three chuck tables 16 arranged at equal intervals in the circumferential direction on the peripheral side of the upper surface of the turntable 14. have Each chuck table 16 is sequentially positioned at a mounting/dismounting position indicated by symbol A, a rough grinding position indicated by symbol B, and a finish grinding position indicated by symbol C by rotation of the turntable 14 .

各チャックテーブル１６の上端部分には、吸引手段（図示していない。）に接続された多孔質の円形の吸着チャック１８が配置されている。そして、チャックテーブル１６においては、吸引手段で吸着チャック１８の上面に吸引力を生成し、吸着チャック１８の上面に載せられた被加工物を吸引保持する。また、チャックテーブル１６は、チャックテーブル用モータ（図示していない。）によって、上下方向を軸心として回転されるようになっている。 A porous circular suction chuck 18 connected to suction means (not shown) is arranged at the upper end portion of each chuck table 16 . In the chuck table 16 , the suction means generates a suction force on the upper surface of the suction chuck 18 to suck and hold the workpiece placed on the upper surface of the suction chuck 18 . Further, the chuck table 16 is rotated around the vertical direction by a chuck table motor (not shown).

（加工手段１０）
図示の実施形態の加工装置は、本発明の加工装置の一例としての研削装置２であり、図示の実施形態の加工手段１０は、チャックテーブル１６に保持された被加工物の上面を研削する研削手段として構成されている。加工手段１０は、基台１２の端部（図１における奥側端部）に配置されている。 (Processing means 10)
The processing apparatus of the illustrated embodiment is a grinding apparatus 2 as an example of the processing apparatus of the present invention, and the processing means 10 of the illustrated embodiment grinds the upper surface of the workpiece held on the chuck table 16. configured as a means. The processing means 10 is arranged at the end of the base 12 (the far end in FIG. 1).

図示の実施形態の加工手段１０は、荒研削用の研削砥石２０を有する荒研削ユニット２２と、仕上げ研削用の研削砥石２４を有する仕上げ研削ユニット２６とを備える。 The processing means 10 of the illustrated embodiment comprises a rough grinding unit 22 having a grinding wheel 20 for rough grinding and a finish grinding unit 26 having a grinding wheel 24 for finish grinding.

そして、チャックテーブル１６に保持された被加工物は、ターンテーブル１４の回転によって荒研削位置Ｂに位置づけられた際に、荒研削ユニット２２により荒研削加工が施され、次いで、ターンテーブル１４の回転によって仕上げ研削位置Ｃに位置づけられた際に、仕上げ研削ユニット２６により仕上げ研削加工が施されるようになっている。 The workpiece held on the chuck table 16 is rough-ground by the rough-grinding unit 22 when it is positioned at the rough-grinding position B by the rotation of the turntable 14, and then the turntable 14 rotates. Finish grinding is performed by the finish grinding unit 26 when positioned at the finish grinding position C by the .

図示の実施形態の各種手段４は、第一のカセット２８が載置される第一のカセットテーブル３０と、第二のカセット３２が載置される第二のカセットテーブル３４と、第一のカセットテーブル３０と第二のカセットテーブル３４との間に配置された搬出入手段３６とを含む。第一のカセット２８には、研削加工前の複数の被加工物Ｗが収容されている。第二のカセット３２には、研削加工後の複数の被加工物Ｗが収容される。なお、被加工物Ｗとしては、たとえば、シリコン等の半導体材料から形成される円板状のウエーハが挙げられる。 The various means 4 in the illustrated embodiment comprise a first cassette table 30 on which the first cassette 28 is placed, a second cassette table 34 on which the second cassette 32 is placed, and a first cassette table 34 on which the second cassette 32 is placed. It includes loading/unloading means 36 arranged between the table 30 and the second cassette table 34 . A first cassette 28 accommodates a plurality of workpieces W before grinding. The second cassette 32 accommodates a plurality of workpieces W after grinding. In addition, as the workpiece W, for example, a disk-shaped wafer formed of a semiconductor material such as silicon can be used.

搬出入手段３６は、多関節アーム３８と、多関節アーム３８の先端に付設されたＵ字状の吸着片４０とを含む。搬出入手段３６においては、研削加工前の被加工物Ｗを吸着片４０で吸引保持し第一のカセット２８から搬出すると共に、研削加工後の被加工物Ｗを吸着片４０で吸引保持し第二のカセット３２へ搬入するようになっている。 The loading/unloading means 36 includes a multi-joint arm 38 and a U-shaped suction piece 40 attached to the tip of the multi-joint arm 38 . In the loading/unloading means 36, the workpiece W before grinding is sucked and held by the suction pieces 40 and carried out from the first cassette 28, and the workpiece W after grinding is sucked and held by the suction pieces 40 and held by the suction piece 40. It is designed to be carried into the second cassette 32 .

また、各種手段４は、搬出入手段３６によって第一のカセット２８から搬出された研削加工前の被加工物Ｗが仮置きされる仮置きテーブル４２と、仕上げ研削後に着脱位置Ａに位置づけられた被加工物Ｗの上面（研削面）に向かって洗浄水を噴射する洗浄水噴射ノズル４４とを含む。 Further, the various means 4 are positioned at a temporary placement table 42 on which the unground workpiece W carried out from the first cassette 28 by the carry-in/out means 36 is temporarily placed, and at a loading/unloading position A after finish grinding. and a cleaning water injection nozzle 44 for injecting cleaning water toward the upper surface of the workpiece W (grinding surface).

さらに、各種手段４は、仮受けテーブル４２から保持手段８に被加工物Ｗを搬送する第一の搬送手段４６と、研削加工後の被加工物Ｗに洗浄水を噴射して被加工物Ｗをさらに洗浄すると共に、洗浄した被加工物Ｗに乾燥エアーを噴射して被加工物Ｗを乾燥させる洗浄手段４８と、保持手段８から洗浄手段４８に被加工物Ｗを搬送する第二の搬送手段５０とを含む。 Further, the various means 4 include a first conveying means 46 for conveying the workpiece W from the temporary receiving table 42 to the holding means 8, and a washing water jetting to the workpiece W after the grinding process. and cleaning means 48 for drying the workpiece W by blowing dry air onto the cleaned workpiece W, and a second conveying means for conveying the workpiece W from the holding means 8 to the cleaning means 48 means 50;

第一の搬送手段４６は、仮置きテーブル４２に仮置きされた研削加工前の被加工物Ｗを、着脱位置Ａに位置づけられたチャックテーブル１６に搬送する。また、第二の搬送手段５０は、着脱位置Ａに位置づけられた研削加工後の被加工物Ｗを洗浄手段４８に搬送する。なお、洗浄手段４８によって洗浄された被加工物Ｗは、搬出入手段３６によって第二のカセット３２に搬入される。 The first conveying means 46 conveys the workpiece W before grinding temporarily placed on the temporary placement table 42 to the chuck table 16 positioned at the attachment/detachment position A. As shown in FIG. Further, the second conveying means 50 conveys the ground workpiece W positioned at the mounting/dismounting position A to the cleaning means 48 . The workpiece W cleaned by the cleaning means 48 is carried into the second cassette 32 by the carry-in/out means 36 .

（制御手段６）
制御手段６は、制御プログラムに従って演算処理する中央処理装置（ＣＰＵ）と、制御プログラム等を格納するリードオンリメモリ（ＲＯＭ）と、演算結果等を格納する読み書き可能なランダムアクセスメモリ（ＲＡＭ）とを含むコンピュータから構成されている。 (Control means 6)
The control means 6 includes a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores control programs and the like, and a readable and writable random access memory (RAM) that stores arithmetic results and the like. It consists of a computer including

図示の実施形態の研削装置２は、図１に示すとおり、各種手段４を覆う筐体５２と、筐体５２に形成され各種手段４へのアクセスを可能にする開閉自在なパネル５４と、パネル５４および各種手段４を含む模式図Ｓ（図２および図３参照）を少なくとも表示するモニター５６と、を備える。 As shown in FIG. 1, the grinding apparatus 2 of the illustrated embodiment includes a housing 52 that covers various means 4, an openable and closable panel 54 that is formed in the housing 52 and enables access to the various means 4, a panel 54 and a monitor 56 for displaying at least a schematic diagram S (see FIGS. 2 and 3) including various means 4 .

（筐体５２）
筐体５２は、複数の板材が直方体状に組み合わされて形成されている。各種手段４を覆う筐体５２は、筐体５２内の空間を外部から遮断することにより、外部からの粉塵等の侵入を防止すると共に、筐体５２内から外部へ被加工物Ｗから生じる研削屑の飛散等を防止するようになっている。また、筐体５２は、研削装置２によって被加工物Ｗが研削加工されている間、オペレータの安全を確保する役割も果たしている。 (Case 52)
The housing 52 is formed by combining a plurality of plate members in a rectangular parallelepiped shape. The housing 52 covering the various means 4 blocks the space inside the housing 52 from the outside, thereby preventing dust from entering from the outside and also preventing the grinding from the workpiece W from the inside of the housing 52 to the outside. It is designed to prevent the scattering of dust and the like. The housing 52 also serves to ensure the safety of the operator while the workpiece W is being ground by the grinding device 2 .

（パネル５４）
パネル５４は、蝶番（図示していない。）を介して筐体５２に開閉自在に取り付けられている。図１を参照することによって理解されるとおり、図示の実施形態のパネル５４は４カ所に設けられている。４カ所に設けられているパネル５４のそれぞれは、観音開き式の一対の扉から構成されている。 (Panel 54)
The panel 54 is attached to the housing 52 via hinges (not shown) so that it can be opened and closed. As will be understood by referring to FIG. 1, the panels 54 in the illustrated embodiment are provided at four locations. Each of the panels 54 provided at four locations is composed of a pair of double doors.

各パネル５４には、各パネル５４の開閉を検出する開閉検出手段（図示していない。）が付設されている。パネル５４が開閉されたことが開閉検出手段によって検出されると、開閉検出手段から制御手段５に、開閉されたパネル５４の情報が送信される。 Each panel 54 is provided with opening/closing detection means (not shown) for detecting opening/closing of each panel 54 . When the opening/closing detection means detects that the panel 54 has been opened or closed, information on the opened/closed panel 54 is transmitted from the opening/closing detection means to the control means 5 .

（モニター５６）
図１に示すとおり、モニター５６は、筐体５２の外面に取り付けられている。図示の実施形態のモニター５６には、パネル５４が開閉されておらず各種手段４に不具合が生じていない場合には、図２に示すような模式図Ｓが表示される。一方、パネル５４が開閉された場合、開閉されたパネル５４が模式図Ｓに示され、各種手段４に不具合が生じた場合、不具合が生じた各種手段４が模式図Ｓに示されるようになっている（図３参照）。 (monitor 56)
As shown in FIG. 1, monitor 56 is attached to the outer surface of housing 52 . 2 is displayed on the monitor 56 of the illustrated embodiment when the panel 54 is not opened and closed and the various means 4 are not malfunctioning. On the other hand, when the panel 54 is opened and closed, the opened and closed panel 54 is shown in the schematic drawing S, and when trouble occurs in the various means 4, the troubled various means 4 are shown in the schematic diagram S. (See Figure 3).

モニター５６には、パネル５４および各種手段４を含む模式図Ｓのほか、研削装置２の加工条件等が表示される。モニター５６は、タッチパネル式でよく、この場合には、加工条件等を入力するための入力画面もモニター５６に表示される。なお、研削装置２には、加工条件等を入力するための入力手段５８（たとえば、キーボード）が設けられていてもよい。 The monitor 56 displays a schematic diagram S including the panel 54 and various means 4, as well as processing conditions of the grinding device 2 and the like. The monitor 56 may be of a touch panel type. In this case, an input screen for inputting processing conditions and the like is also displayed on the monitor 56 . The grinding apparatus 2 may be provided with input means 58 (for example, a keyboard) for inputting processing conditions and the like.

（リセットボタン）
また、研削装置２には、開閉されたパネル５４または不具合が生じた各種手段４が模式図Ｓ中に示された後、パネル５４の開閉および各種手段４の不具合がなかった状態に模式図Ｓを戻すためのリセットボタン（図示していない。）を備えている。 (reset button)
In the grinding machine 2, after the opened/closed panel 54 or the various means 4 in which the trouble occurred are shown in the schematic diagram S, the schematic diagram S shows the state in which the panel 54 is opened and closed and the various means 4 are not malfunctioning. It has a reset button (not shown) for resetting.

リセットボタンは、モニター５６がタッチパネル式である場合には、モニター５６に設けられ得る。あるいは、モニター５６とは別に、たとえば入力手段５８に設けられていてもよい。 A reset button may be provided on the monitor 56 if the monitor 56 is of a touch panel type. Alternatively, it may be provided, for example, in the input means 58 separately from the monitor 56 .

次に、上述の研削装置２の作動について説明する。 Next, the operation of the grinding device 2 described above will be described.

被加工物Ｗに研削加工を施す際は、まず、第一のカセットテーブル３０に近いパネル５４を開放して、研削加工前の被加工物Ｗが収容された第一のカセット２８を第一のカセットテーブル３０に載置する。次いで、第二のカセットテーブル３４に近いパネル５４を開放して、研削加工後の被加工物Ｗを収容するための空の第二のカセット３２を第二のカセットテーブル３４に載置する。 When grinding the workpiece W, first, the panel 54 near the first cassette table 30 is opened, and the first cassette 28 containing the workpiece W before grinding is placed in the first cassette. It is placed on the cassette table 30 . Next, the panel 54 near the second cassette table 34 is opened, and the empty second cassette 32 for containing the workpiece W after grinding is placed on the second cassette table 34 .

また、パネル５４を開放したことから、リセットボタンを押して、パネル５４の開閉がなかった状態に模式図Ｓの表示を戻す。そして、加工条件を適宜入力して研削装置２を稼働させる。 Also, since the panel 54 has been opened, the reset button is pressed to return the display of the schematic diagram S to the state in which the panel 54 was not opened or closed. Then, the grinding device 2 is operated by appropriately inputting the machining conditions.

そうすると、制御手段６は、第一のカセット２８から被加工物Ｗを搬出入手段３６によって搬出して仮置きテーブル４２に仮置きする仮置き工程と、仮置きテーブル４２に仮置きされた被加工物Ｗを第一の搬送手段４６で着脱位置Ａのチャックテーブル１６に搬送する第一の搬送工程と、チャックテーブル１６に保持された被加工物Ｗの上面に加工手段１０によって荒研削加工および仕上げ研削加工を施す研削工程と、研削済みの被加工物Ｗの上面に洗浄水噴射ノズル４４から洗浄水を噴射する洗浄水噴射工程と、研削済みの被加工物Ｗを第二の搬送手段５０でチャックテーブル１６から洗浄手段４８に搬送する第二の搬送工程と、研削済みの被加工物Ｗを洗浄手段４８で洗浄すると共に乾燥させる洗浄・乾燥工程と、洗浄済みの被加工物Ｗを搬出入手段３６で洗浄手段４８から第二のカセット３２に搬入するカセット搬入工程とを順次実行させる。 Then, the control means 6 performs a temporary placement step of carrying out the workpiece W from the first cassette 28 by the loading/unloading means 36 and temporarily placing it on the temporary placement table 42, and A first conveying step of conveying the workpiece W to the chuck table 16 at the attachment/detachment position A by the first conveying means 46, and rough grinding and finishing of the upper surface of the workpiece W held on the chuck table 16 by the processing means 10. A grinding step of performing a grinding process, a cleaning water spraying step of spraying cleaning water from a cleaning water spray nozzle 44 onto the upper surface of the ground workpiece W, and a ground workpiece W by the second conveying means 50. A second transfer step of transferring from the chuck table 16 to the cleaning means 48, a cleaning/drying step of cleaning and drying the ground workpiece W by the cleaning means 48, and loading and unloading of the cleaned workpiece W. A cassette loading step of loading the second cassette 32 from the cleaning means 48 by the means 36 is sequentially executed.

また、制御手段６は、パネル５４が開閉されておらず各種手段４に不具合が生じていない場合には、模式図表示が選択されたときに、図２に示すような、パネル５４および各種手段４を含む模式図Ｓをモニター５６に表示させるようになっている。パネル５４が開閉されておらず各種手段４に不具合が生じていない場合、模式図Ｓは１色で表示され得る。 When the panel 54 is not opened and closed and the various means 4 are not malfunctioning, the control means 6 displays the panel 54 and the various means as shown in FIG. 2 when the schematic diagram display is selected. 4 is displayed on the monitor 56. FIG. When the panel 54 is not opened and closed and the various means 4 are not malfunctioning, the schematic diagram S can be displayed in one color.

一方、制御手段６は、パネル５４が開閉された場合、開閉されたパネル５４を模式図Ｓに示し、各種手段４に不具合が生じた場合、不具合が生じた各種手段４を模式図Ｓに示すようになっている。 On the other hand, when the panel 54 is opened and closed, the control means 6 shows the opened and closed panel 54 in the schematic diagram S, and when trouble occurs in the various means 4, the various means 4 in which the trouble occurs are shown in the schematic diagram S. It's like

たとえば、図３に示すように、不具合が生じた各種手段４（図３に示す例では、仮置きテーブル４２）が模式図Ｓ中において強調されて表示される。この場合、不具合が生じた各種手段４の色が変更されて表示され得る。あるいは、不具合が生じた各種手段４が点滅表示されるようになっていてもよい。 For example, as shown in FIG. 3, the malfunctioning means 4 (in the example shown in FIG. 3, the temporary placement table 42) is highlighted in the schematic diagram S and displayed. In this case, the color of the various means 4 in which the trouble occurred may be changed and displayed. Alternatively, the malfunctioning means 4 may be displayed blinking.

そして、モニター５６上の模式図Ｓにおいて仮置きテーブル４２に不具合が生じていることが示されると、オペレータは、不具合の内容を確認するため、仮置きテーブル４２に近いパネル５４を開放することになる。そうすると、開閉検出手段によってパネル５４の開放が検出され、その旨が制御手段６に出力される。このため、図３に示すとおり、仮置きテーブル４２と共に、開放されたパネル５４も模式図Ｓ中において強調して表示されることになる。 Then, when the schematic diagram S on the monitor 56 indicates that the temporary placement table 42 has a problem, the operator decides to open the panel 54 near the temporary placement table 42 in order to confirm the details of the problem. Become. Then, opening of the panel 54 is detected by the open/close detection means, and the fact is output to the control means 6 . Therefore, as shown in FIG. 3, the opened panel 54 is also highlighted in the schematic diagram S together with the temporary placement table 42 .

これによって、仮置きテーブル４２に不具合が発生したことを確認したオペレータが、修理・交換に必要な工具・部品を取りに行くため、研削装置２から離れてしまっても、研削装置２の仮置きテーブル４２に不具合が発生したことを他のオペレータに知らせることができる。したがって、他のオペレータが、不具合の発生している研削装置２を稼働させてしまい、被加工物Ｗを損傷させたり、他の各種手段４を故障させたりするという問題が解消される。 As a result, even if the operator, who has confirmed that the temporary placement table 42 has a problem, moves away from the grinding apparatus 2 to pick up the tools/parts necessary for repair or replacement, the temporary placement of the grinding apparatus 2 is possible. It is possible to inform other operators that a problem has occurred in the table 42 . Therefore, the problem that another operator operates the grinding device 2 in which trouble occurs, damages the workpiece W, or causes other various means 4 to malfunction can be solved.

上記のとおり、研削装置２においては、パネル５４が開閉された場合、開閉されたパネル５４が模式図Ｓに示され、各種手段４に不具合が生じた場合、不具合が生じた各種手段４が模式図Ｓに示される。このため、オペレータが研削装置２から離れている際に、仮置きテーブル４２に近いパネル５４以外のパネル５４が開閉されたか否か、および、仮置きテーブル４２以外の他の各種手段４に不具合が発生したか否かを、オペレータが研削装置２に戻ってきた時に模式図Ｓによって確認することができる。 As described above, in the grinding device 2, when the panel 54 is opened and closed, the opened and closed panel 54 is shown in the schematic diagram S. It is shown in FIG. For this reason, when the operator is away from the grinding machine 2, whether or not the panel 54 other than the panel 54 near the temporary placement table 42 is opened or closed, and whether or not the various means 4 other than the temporary placement table 42 malfunction. When the operator returns to the grinding machine 2, he or she can confirm whether or not it has occurred by referring to the schematic diagram S.

２：研削装置（加工装置）
４：各種手段
６：制御手段
８：保持手段
１０：加工手段
５２：筐体
５４：パネル
５６：モニター
Ｓ：模式図
Ｗ：被加工物
2: Grinding device (processing device)
4: Various means 6: Control means 8: Holding means 10: Processing means 52: Housing 54: Panel 56: Monitor S: Schematic diagram W: Workpiece

Claims (3)

被加工物を保持する保持手段および該保持手段に保持された被加工物を加工する加工手段を含む各種手段と、該各種手段を制御する制御手段と、を備えた加工装置であって、
該各種手段を覆う筐体と、該筐体に形成され該各種手段へのアクセスを可能にする開閉自在なパネルと、該パネルおよび該各種手段を含む模式図を少なくとも表示するモニターと、を備え、
該制御手段は、該パネルが開閉された場合、開閉された該パネルを該模式図に示し、該各種手段に不具合が生じた場合、不具合が生じた該各種手段を該模式図に示す加工装置。 A processing apparatus comprising various means including holding means for holding a workpiece and processing means for processing the workpiece held by the holding means, and control means for controlling the various means,
A housing that covers the various means, an openable and closable panel formed in the housing that enables access to the various means, and a monitor that displays at least a schematic diagram including the panel and the various means. ,
When the panel is opened and closed, the control means indicates the opened and closed panel in the schematic diagram, and when a problem occurs in the various means, the processing device indicates the various means in which the problem occurs in the schematic diagram. . 該模式図は、
該パネルが開閉されておらず該各種手段に不具合が生じていない場合は１色で表示され、
該パネルが開閉された場合、開閉された該パネルの色が変更されて表示され、
該各種手段に不具合が生じた場合、不具合が生じた該各種手段の色が変更されて表示される請求項１記載の加工装置。 The schematic diagram is
When the panel is not opened and closed and there is no problem with the various means, it is displayed in one color,
When the panel is opened and closed, the color of the opened and closed panel is changed and displayed,
2. The processing apparatus according to claim 1, wherein when a problem occurs in said various means, the color of said various means in which the problem occurs is changed and displayed. 該パネルの開閉および該各種手段の不具合がなかった状態に該模式図を戻すためのリセットボタンを備える請求項１または２に記載の加工装置。 3. The processing apparatus according to claim 1, further comprising a reset button for returning the schematic diagram to a state in which the panel is opened and closed and the various means are free from malfunction.
JP2022009174A 2022-01-25 2022-01-25 Processing device Pending JP2023108190A (en)

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JP2022009174A JP2023108190A (en) 2022-01-25 2022-01-25 Processing device
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KR1020230005813A KR20230114709A (en) 2022-01-25 2023-01-16 Processing apparatus
TW112101699A TW202331830A (en) 2022-01-25 2023-01-16 Processing device including a frame, a panel that is free to open or close, and a monitor

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