JP2023029488A - Gas suction device and laser processing device - Google Patents

Gas suction device and laser processing device Download PDF

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JP2023029488A
JP2023029488A JP2022211076A JP2022211076A JP2023029488A JP 2023029488 A JP2023029488 A JP 2023029488A JP 2022211076 A JP2022211076 A JP 2022211076A JP 2022211076 A JP2022211076 A JP 2022211076A JP 2023029488 A JP2023029488 A JP 2023029488A
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gas
cylindrical portion
suction
suction device
laser
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JP7430424B2 (en
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明伸 長谷川
Akinobu Hasegawa
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AFLAIR Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a gas suction device which can inhibit deterioration of the processing quality, and to provide a laser processing device.
SOLUTION: One embodiment of the invention relates to a gas suction device which is disposed between an object and a radiation device which radiates energy to the object and suctions a gas. The gas suction device includes: a first cylinder part extending in an energy radiation direction; a second cylinder part which is disposed so as to enclose an outer periphery of the first cylinder part; a first suction passage which suctions the gas at the inner side of the first cylinder part; and a second suction passage which suctions the gas along an inner periphery of the second cylinder part.
SELECTED DRAWING: Figure 1
COPYRIGHT: (C)2023,JPO&INPIT

Description

本発明は、気体吸引装置およびレーザ処理装置に関するものである。 The present invention relates to a gas suction device and a laser processing device.

エネルギーとしてレーザ光を利用したレーザ処理装置は、対象物にレーザ光を照射して表面処理、溶接、切断などの加工を行う装置である。例えば、レーザ溶接装置では、対象物の接合箇所にレーザ光をレンズで集束させて照射する。これにより、レーザ光が照射された部分を加熱して溶融接合を行う。この際、溶接箇所の酸化を防止するため、レーザ光の照射とともに溶接箇所に不活性ガス（シールドガス）を吹き付けるようにしている。また、レーザ処理装置において、処理箇所から粉塵等の飛散物が発生するため、これを吸引しながら処理を行う必要がある。 2. Description of the Related Art A laser processing apparatus using laser light as energy is an apparatus that irradiates an object with laser light to perform processing such as surface treatment, welding, and cutting. For example, in a laser welding apparatus, a laser beam is converged by a lens and irradiated onto a joint of an object. As a result, the portion irradiated with the laser beam is heated to perform fusion bonding. At this time, in order to prevent oxidation of the welded portion, an inert gas (shielding gas) is blown to the welded portion together with irradiation of the laser beam. In addition, in the laser processing apparatus, scattered matter such as dust is generated from the processing location, so it is necessary to perform the processing while sucking the dust.

特許文献１には、ビードの断面形状にばらつきが生じることを抑制するレーザ溶接装置が開示される。このレーザ溶接装置は、溶接部にシールドガスを供給するシールドガス供給手段と、溶接部から放射されたプラズマ光の光強度を測定する光強度測定手段と、光強度測定手段で測定された光強度の変化率を算出する変化率算出手段とを備え、ガス供給量制御手段によって、算出された光強度の変化率に応じて溶接部に供給するシールドガスの流量を制御している。 Patent Literature 1 discloses a laser welding device that suppresses variations in the cross-sectional shape of a bead. This laser welding apparatus includes shield gas supply means for supplying shield gas to the welded portion, light intensity measuring means for measuring the light intensity of the plasma light emitted from the welded portion, and light intensity measured by the light intensity measuring means. and a rate of change calculation means for calculating the rate of change of the light intensity, and the flow rate of the shielding gas supplied to the weld zone is controlled according to the calculated rate of change of the light intensity by the gas supply amount control means.

特許文献２，３には、レーザ光を横切る方向に不活性ガスを供給するレーザ溶接装置が開示される。特許文献４～７には、レーザ光によって溶接を行う際にシールドガスを供給するとともに、溶接箇所から蒸発して飛散する材料を吸引するレーザ溶接装置が開示される。 Patent Literatures 2 and 3 disclose laser welding devices that supply an inert gas in a direction that traverses the laser beam. Patent Documents 4 to 7 disclose a laser welding apparatus that supplies a shielding gas when performing welding with a laser beam and sucks material that evaporates and scatters from the welded portion.

特許文献８，９には、被溶接材の溶接部に酸化膜が生成したり、ガスを巻き込んだりすることを抑制するため、レーザ溶接ヘッドの集束レーザ照射口に、被溶接材に向かうイナートガスノズルを同軸状に設け、このイナートガスノズルの外周側に、１個以上のシールドガスノズルを設ける構成が開示されている。 In Patent Documents 8 and 9, in order to suppress the formation of an oxide film on the welded part of the welded material and the entrainment of gas, an inert gas nozzle directed to the welded material is provided at the focused laser irradiation port of the laser welding head. are provided coaxially, and one or more shield gas nozzles are provided on the outer peripheral side of the inert gas nozzle.

特開２０１６－０９３８２５号公報JP 2016-093825 A 特開２０１８－０２３９８６号公報JP 2018-023986 A 特開２０１８－０６５１５４号公報JP 2018-065154 A 特開２０１１－１９４４４２号公報JP 2011-194442 A 特開平１０－３０５３７６号公報JP-A-10-305376 特開平１０－３０９９００号公報JP-A-10-309900 特開平１０－３０９９００号公報JP-A-10-309900 特開２００１－３１４９８５号公報JP-A-2001-314985 特開２００１－３２１９７６号公報JP-A-2001-321976

しかしながら、レーザ光などのエネルギーを照射して処理を行う際、処理箇所から発生する粉塵等の飛散物を効率良く吸引できないと、飛散物によってエネルギーが遮られてしまう。また、不活性ガスの供給と飛散物の吸引との両方を行う場合、気体の供給および吸引といった全く逆の動作を行う必要がある。このような気体の供給と吸引とが同じ空間内で同時に行われることで、それぞれの役目を十分に果たせない状態になり得る。例えば、不活性ガスの供給よりも吸引が強いと、処理箇所に十分な不活性ガスが到達する前に吸引されてしまい、酸化抑制作用を低下させてしまう。一方、吸引が弱いと処理箇所周辺に飛散材料などによる粉塵や煙が充満し、周辺部材への不純物の付着やレーザ光の減衰による加工品質の低下の原因となる。 However, when processing is performed by irradiating energy such as laser light, if scattered matter such as dust generated from the processing location cannot be efficiently sucked, the energy is blocked by the scattered matter. Moreover, when performing both the supply of the inert gas and the suction of the scattered matter, it is necessary to perform completely opposite operations of supplying and sucking the gas. If such gas supply and suction are simultaneously performed in the same space, the respective roles may not be sufficiently fulfilled. For example, if the suction is stronger than the supply of the inert gas, the inert gas will be sucked in before it reaches the treatment site sufficiently, thus reducing the oxidation suppressing action. On the other hand, if the suction is weak, dust and smoke from the scattered material fills the area around the processing area, which causes the adhesion of impurities to the surrounding members and the attenuation of the laser beam, thereby degrading the processing quality.

本発明は、加工品質の低下を抑制することができる気体供給吸引装置、吸引装置およびレーザ処理装置を提供することを目的とする。 SUMMARY OF THE INVENTION An object of the present invention is to provide a gas supply suction device, a suction device, and a laser processing device capable of suppressing deterioration of processing quality.

上記課題を解決するため、本発明の一形態は、対象物と、この対象物にエネルギーを照射する照射装置との間に配置され、気体の供給および吸引を行う気体供給吸引装置であって、エネルギーの照射方向に延在する第１筒部と、第１筒部の外周を囲むように配置される第２筒部と、第１筒部の内周に沿って第１気体を供給する供給路と、第２筒部の内周に沿って気体を吸引する吸引路と、を備える。 In order to solve the above problems, one aspect of the present invention is a gas supply and suction device that is arranged between an object and an irradiation device that irradiates the object with energy and that supplies and sucks gas, A first cylindrical portion extending in an energy irradiation direction, a second cylindrical portion disposed so as to surround the outer periphery of the first cylindrical portion, and a supply for supplying the first gas along the inner periphery of the first cylindrical portion. and a suction path for sucking gas along the inner periphery of the second tubular portion.

このような構成によれば、対象物にエネルギーを照射する際、供給路から第１気体を供給し、吸引路により気体吸引を行う。第１気体は第１筒部の内周に沿って供給されるため、第１筒部内に第１気体による内側回転気流が形成される。また、吸引路での気体吸引によって第２筒部の内周に沿って気体が回転する外側回転気流が形成される。したがって、第１筒部内に形成される内側回転気流によって第１気体を対象物に向けて吹き付けることができるとともに、その外側に形成される外側回転気流によって気体を吸引路に吸引できるようになる。 According to such a configuration, when irradiating the object with energy, the first gas is supplied from the supply path and the gas is sucked from the suction path. Since the first gas is supplied along the inner periphery of the first tubular portion, an inner rotating airflow is formed by the first gas in the first tubular portion. In addition, an outer rotating airflow is formed in which the gas rotates along the inner circumference of the second cylindrical portion by gas suction in the suction path. Therefore, the first gas can be blown toward the object by the inner rotating airflow formed inside the first cylindrical portion, and the gas can be sucked into the suction path by the outer rotating airflow formed outside.

上記気体供給吸引装置において、エネルギーを通過させる窓部を有し、第１筒部および第２筒部の一端側に設けられ、第１筒部と第２筒部との間を塞ぐ壁部材をさらに備えていてもよい。これにより、第１筒部および第２筒部の一端側が壁部材によって塞がれるため、一端側から他端側に向けて第１気体を効率良く噴射できるとともに、他端側から一端側に向けて効率良く気体吸引を行うことができる。 In the above-mentioned gas supply suction device, a wall member having a window for passing energy, provided on one end side of the first cylindrical portion and the second cylindrical portion, and closing the gap between the first cylindrical portion and the second cylindrical portion. You may have more. As a result, one end side of the first cylindrical portion and the second cylindrical portion is blocked by the wall member, so that the first gas can be efficiently injected from one end side to the other end side, and the first gas can be efficiently injected from the other end side to the one end side. gas can be efficiently sucked.

上記気体供給吸引装置において、第２筒部の他端は、第１筒部の他端よりも対象物に近い位置に配置されていてもよい。これにより、対象物の処理箇所周辺を第２筒部で覆うとともに、第１筒部の他端側に気体の供給および吸引を行う空間を確保することができる。 In the above gas supply suction device, the other end of the second cylindrical portion may be arranged at a position closer to the object than the other end of the first cylindrical portion. As a result, it is possible to cover the area around the object to be processed with the second cylindrical portion, and secure a space for supplying and sucking the gas on the other end side of the first cylindrical portion.

上記気体供給吸引装置において、第１筒部の内側に配置される第３筒部をさらに備え、照射方向にみて、第１筒部と第３筒部との隙間である第１隙間は、第１筒部と第２筒部との隙間である第２隙間よりも狭く設けられていてもよい。これにより、第３筒部と第１筒部との隙間である第１隙間に第１気体を供給することで、第１筒部内に形成される内側回転気流の流速を高めることができる。 The gas supply and suction device described above further includes a third tubular portion disposed inside the first tubular portion, and the first gap, which is a gap between the first tubular portion and the third tubular portion when viewed in the irradiation direction, is a It may be provided narrower than the second gap, which is the gap between the first cylindrical portion and the second cylindrical portion. Accordingly, by supplying the first gas to the first gap, which is the gap between the third cylindrical portion and the first cylindrical portion, the flow velocity of the inner rotating airflow formed in the first cylindrical portion can be increased.

上記気体供給吸引装置において、供給路での第１気体の流速は、吸引路での気体吸引の流速よりも速いことが好ましい。さらにこの場合、供給路での第１気体の流量を、吸引路での気体吸引の流量よりも少なくすることが好ましい。これにより、第１気体による内側回転気流の流速を高めるとともに、外側回転気流によって十分な量の気体吸引を行うことができる。 In the gas supply suction device, the flow velocity of the first gas in the supply path is preferably faster than the flow velocity of gas suction in the suction path. Furthermore, in this case, it is preferable that the flow rate of the first gas in the supply path is lower than the flow rate of gas suction in the suction path. As a result, the flow velocity of the inner rotating airflow by the first gas can be increased, and a sufficient amount of gas can be sucked by the outer rotating airflow.

本発明の一態様は、対象物と、対象物にエネルギーを照射する照射装置との間に配置され、気体の吸引を行う吸引装置であって、エネルギーの照射方向に延在する第１筒部と、第１筒部の外周を囲むように配置される第２筒部と、第１筒部の内側の気体を吸引する第１吸引路と、第２筒部の内周に沿って気体を吸引する第２吸引路と、を備えた吸引装置である。 One aspect of the present invention is a suction device that is arranged between a target object and an irradiation device that applies energy to the target object and that suctions gas, and includes a first cylindrical portion that extends in the energy irradiation direction. a second cylindrical portion arranged to surround the outer periphery of the first cylindrical portion; a first suction path for sucking gas inside the first cylindrical portion; and gas along the inner periphery of the second cylindrical portion. and a second suction path for suction.

このような構成によれば、対象物にエネルギーを照射する際、第１吸引路および第２吸引路により気体吸引を行う。第１吸引路での気体吸引によって第１筒部の内側の気体が吸引される内側吸引気流が形成される。内側吸引気流は、第１筒部の内周に沿って回転する内側回転気流や、第１筒部の内側を直線的に吸引される内側直線気流である。また、吸引路での気体吸引によって第２筒部の内周に沿って気体が回転する外側回転気流が形成される。したがって、第１筒部内に形成される内側吸引気流によって気体を第１吸引路に吸引するとともに、その外側に形成される外側回転気流によって気体を第２吸引路に吸引できるようになる。 According to such a configuration, gas is sucked by the first suction path and the second suction path when irradiating the object with energy. An inner suction airflow is formed in which the gas inside the first tubular portion is sucked by gas suction in the first suction passage. The inner suction airflow is an inner rotational airflow that rotates along the inner circumference of the first cylindrical portion, or an inner linear airflow that linearly suctions the inner side of the first cylindrical portion. In addition, an outer rotating airflow is formed in which the gas rotates along the inner circumference of the second cylindrical portion by gas suction in the suction path. Therefore, the gas can be sucked into the first suction passage by the inner suction airflow formed inside the first cylindrical portion, and the gas can be sucked into the second suction passage by the outer rotating airflow formed outside.

上記吸引装置において、第１筒部の他端は、第２筒部の他端よりも対象物に近い位置に配置されていてもよい。これにより、対象物の処理箇所近傍から発生した粉塵等を第１筒部で効果的に吸引し、周辺に拡がった粉塵等を第２筒部で吸引できるようになる。 In the suction device described above, the other end of the first tubular portion may be arranged at a position closer to the object than the other end of the second tubular portion. As a result, the first cylindrical portion can effectively suck dust and the like generated from the vicinity of the processing location of the object, and the second cylindrical portion can suction the dust and the like spread around.

本発明の一態様は、対象物に照射するレーザ光を出射するレーザ出射ヘッドと、対象物の上方に配置された上記気体供給吸引装置と、を備えたレーザ処理装置である。このレーザ処理装置において、レーザ光を第１筒部の筒内を通して対象物に照射する際、供給路から第１気体を供給して第１筒部内に第１気体による内側回転気流が形成されるとともに、吸引路での気体吸引によって第２筒部内に外側回転気流が形成される。 One aspect of the present invention is a laser processing apparatus that includes a laser emitting head that emits laser light to irradiate an object, and the gas supply suction device that is arranged above the object. In this laser processing apparatus, when the object is irradiated with the laser beam through the inside of the cylinder of the first cylinder, the first gas is supplied from the supply passage, and an inner rotating air current is formed in the first cylinder by the first gas. At the same time, an outer rotating air current is formed in the second cylindrical portion by gas suction in the suction path.

このような構成によれば、対象物にレーザ光を照射する際、第１筒部内に形成される内側回転気流によって第１気体を対象物に向けて吹き付けることができるとともに、その外側に形成される外側回転気流によって照射箇所から発生する粉塵等の飛散物質を含む気体を効率良く吸引路に吸引できるようになる。 According to such a configuration, when irradiating the object with the laser beam, the first gas can be blown toward the object by the inner rotating airflow formed in the first cylindrical portion, and the Due to the outer rotating airflow, the gas containing scattered substances such as dust generated from the irradiated area can be efficiently sucked into the suction path.

本発明の一態様は、対象物に照射するレーザ光を出射するレーザ出射ヘッドと、対象物の上方に配置された上記吸引装置と、を備えたレーザ処理装置である。このレーザ処理装置において、レーザ光を第１筒部の筒内を通して対象物に照射する際、第１吸引路での気体吸引によって第１筒部内に内側回転気流が形成されるとともに、第２吸引路での気体吸引によって第２筒部内に外側回転気流が形成される。 One embodiment of the present invention is a laser processing apparatus that includes a laser emission head that emits laser light to irradiate an object, and the suction device that is arranged above the object. In this laser processing apparatus, when the object is irradiated with the laser beam through the interior of the first cylinder, an inner rotating air current is formed in the first cylinder by gas suction in the first suction passage, and the second suction is performed. An outer rotating airflow is formed in the second tube by gas suction in the passage.

このような構成によれば、対象物にレーザ光を照射する際、第１筒部内に形成される内側回転気流によってレーザ光の照射箇所の直上に舞い上がった粉塵等の飛散物質を含む気体を効率良く吸引できるとともに、その外側に漏れた粉塵等の飛散物質を含む気体を外側回転気流によって効率良く吸引できるようになる。 According to such a configuration, when irradiating an object with a laser beam, the inner rotating air current formed in the first cylindrical portion efficiently removes the gas containing scattered substances such as dust that rises directly above the laser beam irradiation location. In addition to being able to suck well, it is possible to efficiently suck the gas containing scattered substances such as dust leaked to the outside by the outer rotating air current.

本発明によれば、加工品質の低下を抑制することができる気体供給吸引装置、吸引装置およびレーザ処理装置を提供するが可能になる。 According to the present invention, it is possible to provide a gas supply suction device, a suction device, and a laser processing device capable of suppressing deterioration of processing quality.

レーザ処理装置の構成例を示す模式斜視図である。It is a model perspective view which shows the structural example of a laser processing apparatus. レーザ処理装置の構成例を示す模式断面図である。It is a schematic cross section which shows the structural example of a laser processing apparatus. 気体供給吸引装置を例示する模式断面図（その１）である。1 is a schematic cross-sectional view (part 1) illustrating a gas supply suction device; FIG. 気体供給吸引装置を例示する模式断面図（その２）である。FIG. 2 is a schematic cross-sectional view (part 2) illustrating the gas supply suction device; 気体供給吸引装置による気体の流れを例示する模式断面図（その１）である。FIG. 3 is a schematic cross-sectional view (Part 1) illustrating the flow of gas by the gas supply suction device; 気体供給吸引装置による気体の流れを例示する模式断面図（その２）である。FIG. 2 is a schematic cross-sectional view (part 2) illustrating the flow of gas by the gas supply suction device; 第２実施形態に係る気体供給吸引装置を例示する模式断面図である。FIG. 5 is a schematic cross-sectional view illustrating a gas supply suction device according to a second embodiment; 第３実施形態に係る気体供給吸引装置を例示する模式断面図である。FIG. 11 is a schematic cross-sectional view illustrating a gas supply suction device according to a third embodiment; 第４実施形態に係る吸引装置を例示する模式断面図である。It is a schematic cross section which illustrates the suction device which concerns on 4th Embodiment. 第５実施形態に係る吸引装置を例示する模式断面図である。FIG. 11 is a schematic cross-sectional view illustrating a suction device according to a fifth embodiment;

以下、本発明の実施形態を図面に基づいて説明する。なお、以下の説明では、同一の部材には同一の符号を付し、一度説明した部材については適宜その説明を省略する。 BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. In the following description, the same members are denoted by the same reference numerals, and the description of members that have already been described will be omitted as appropriate.

（第１実施形態）
図１は、レーザ処理装置の構成例を示す模式斜視図である。
図２は、レーザ処理装置の構成例を示す模式断面図である。
図１に示すレーザ処理装置１００は、レーザ光ＬＳのエネルギーを利用して対象物Ｗに所定の加工を行う装置である。本実施形態では、対象物Ｗを溶接するレーザ溶接装置を例とする。 (First embodiment)
FIG. 1 is a schematic perspective view showing a configuration example of a laser processing apparatus.
FIG. 2 is a schematic cross-sectional view showing a configuration example of a laser processing apparatus.
A laser processing apparatus 100 shown in FIG. 1 is an apparatus that performs predetermined processing on an object W using the energy of a laser beam LS. In this embodiment, a laser welding apparatus for welding a target object W is taken as an example.

レーザ処理装置１００は、対象物Ｗに照射するレーザ光ＬＳを出射するレーザ出射ヘッド１１０と、対象物Ｗとレーザ出射ヘッド１１０との間に配置された気体供給吸引装置１とを備える。レーザ出射ヘッド１１０は、対象物Ｗにエネルギー（レーザ光ＬＳ）を照射する照射装置の一例である。レーザ出射ヘッド１１０は、レーザ光ＬＳを発生させる光源１１１と、光源１１１から放出されたレーザ光ＬＳを集束させる光学系１１２とを有する。 The laser processing apparatus 100 includes a laser emission head 110 that emits a laser beam LS to irradiate an object W, and a gas supply suction device 1 that is arranged between the object W and the laser emission head 110 . The laser emission head 110 is an example of an irradiation device that irradiates the object W with energy (laser light LS). The laser emitting head 110 has a light source 111 that generates a laser beam LS and an optical system 112 that converges the laser beam LS emitted from the light source 111 .

レーザ溶接装置における光源１１１としては、例えばＹＡＧレーザ（固体レーザ）が用いられる。光源１１１と光学系１１２との間に光ファイバが設けられていてもよい。また、光源１１１は、ファイバレーザ、ＣＯ２レーザ（気体レーザ）や半導体レーザなど、ＹＡＧレーザ（固体レーザ）以外であってもよい。光源１１１から放出されたレーザ光ＬＳは光学系１１２を通過することで対象物Ｗの処理箇所Ｐに集束する。レーザ溶接装置では、処理箇所Ｐである接合箇所にレーザ光ＬＳを照射して溶融接合する。対象物Ｗとレーザ光ＬＳの照射位置との相対的な位置を変更することで連続的な処理を行ってもよい。 A YAG laser (solid-state laser), for example, is used as the light source 111 in the laser welding apparatus. An optical fiber may be provided between the light source 111 and the optical system 112 . Also, the light source 111 may be a fiber laser, a CO 2 laser (gas laser), a semiconductor laser, etc., other than a YAG laser (solid-state laser). The laser beam LS emitted from the light source 111 is converged on the processing location P of the object W by passing through the optical system 112 . The laser welding apparatus irradiates a laser beam LS to a joint portion, which is the processing portion P, to melt and join. Continuous processing may be performed by changing the relative positions of the object W and the irradiation position of the laser beam LS.

（気体供給吸引装置の構成）
レーザ処理装置１００に用いられる気体供給吸引装置１は、レーザ出射ヘッド１１０と対象物Ｗとの間に配置される。すなわち、気体供給吸引装置１は、レーザ出射ヘッド１１０の対象物Ｗの側に取り付けられ、レーザ光ＬＳによる処理を行う際には処理箇所Ｐの周りを囲むように配置される。 (Configuration of gas supply suction device)
The gas supply suction device 1 used in the laser processing device 100 is arranged between the laser emission head 110 and the object W. As shown in FIG. That is, the gas supply/suction device 1 is attached to the object W side of the laser emitting head 110, and arranged so as to surround the processing location P when performing processing with the laser beam LS.

レーザ溶接装置では、溶接箇所の酸化等を抑制するためレーザ光ＬＳが照射される処理箇所Ｐに向けて不活性ガス（窒素（Ｎ２）、アルゴン（Ａｒ）、ヘリウム（Ｈｅ）など）が供給される。気体供給吸引装置１は、例えば不活性ガスである第１気体Ａ１を処理箇所Ｐに向けて供給するとともに、処理箇所Ｐおよびその周辺の気体を吸引する。説明の便宜上、吸引される気体を第２気体Ａ２とも言う。第２気体Ａ２には、処理箇所Ｐの周辺の空気、溶接の際に対象物Ｗから飛散する材料、煙、粉塵などが含まれる。また、第２気体Ａ２には、処理箇所Ｐに向けて噴射され、対象物Ｗで跳ね返る第１気体Ａ１も含まれる。 In the laser welding apparatus, an inert gas (nitrogen (N 2 ), argon (Ar), helium (He), etc.) is supplied toward the processing location P irradiated with the laser beam LS in order to suppress oxidation of the welding location. be done. The gas supply/suction device 1 supplies a first gas A1, which is, for example, an inert gas, toward the processing location P and sucks the gas at the processing location P and its surroundings. For convenience of explanation, the sucked gas is also referred to as a second gas A2. The second gas A2 includes air around the processing location P, material scattered from the object W during welding, smoke, dust, and the like. The second gas A2 also includes the first gas A1 that is jetted toward the processing location P and bounces off the object W. As shown in FIG.

気体供給吸引装置１は、レーザ光ＬＳの照射方向に延在する第１筒部１０と、第１筒部１０の外周１０ｂを囲むように配置される第２筒部２０と、第１筒部１０の内周１０ａに沿って第１気体Ａ１を供給する供給路５０と、第２筒部２０の内周２０ａに沿って気体を吸引する吸引路６０とを備える。 The gas supply suction device 1 includes a first cylindrical portion 10 extending in the irradiation direction of the laser beam LS, a second cylindrical portion 20 disposed so as to surround the outer circumference 10b of the first cylindrical portion 10, and the first cylindrical portion. A supply path 50 for supplying the first gas A1 along the inner circumference 10a of the second tubular portion 20 and a suction path 60 for sucking the gas along the inner circumference 20a of the second cylindrical portion 20 are provided.

第１筒部１０は円筒型または円錐型、第２筒部２０は円筒型が好ましく、レーザ光ＬＳの光軸を中心とした同心円状に配置される。第１筒部１０および第２筒部２０の一端側（対象物Ｗから遠い側）は壁部材４０に接続され、他端１０ｃ、２０ｃ側（対象物Ｗに近い側）は開放されている。これにより、第１筒部１０および第２筒部２０の一端側において、第１筒部１０と第２筒部２０との間は壁部材４０によって塞がれている。 The first cylindrical portion 10 is preferably cylindrical or conical, and the second cylindrical portion 20 is preferably cylindrical, and they are arranged concentrically around the optical axis of the laser beam LS. One end side (the side far from the object W) of the first tubular portion 10 and the second tubular portion 20 is connected to the wall member 40, and the other ends 10c and 20c (the side close to the object W) are open. As a result, the wall member 40 blocks the space between the first tubular portion 10 and the second tubular portion 20 at one end sides of the first tubular portion 10 and the second tubular portion 20 .

壁部材４０の中央部分には窓部４５が設けられる。窓部４５は開口であってもよいし、レーザ光ＬＳを透過する素材で封止されていてもよい。レーザ光ＬＳはこの窓部４５から気体供給吸引装置１内に入射され、開放端側から対象物Ｗの処理箇所Ｐに照射される。第１筒部１０はこの窓部４５を中心としてレーザ光ＬＳの照射方向に延びる筒型に設けられる。また、第２筒部２０は、第１筒部１０の外径よりも大きな内径を有し、第１筒部１０と同様、レーザ光ＬＳの照射方向に延びる筒型に設けられる。これにより、第１筒部１０と第２筒部２０とによる多重の筒構造となり、第１筒部１０の外周１０ｂと第２筒部２０の内周２０ａとの間にはドーナツ状の空間が構成される。 A window portion 45 is provided in the central portion of the wall member 40 . The window portion 45 may be an opening, or may be sealed with a material that transmits the laser beam LS. The laser beam LS enters the gas supply/suction device 1 through the window 45, and irradiates the processing location P of the object W from the open end side. The first cylindrical portion 10 is provided in a cylindrical shape extending in the irradiation direction of the laser beam LS with the window portion 45 as the center. The second cylindrical portion 20 has a larger inner diameter than the outer diameter of the first cylindrical portion 10, and is provided in a cylindrical shape extending in the irradiation direction of the laser light LS, similarly to the first cylindrical portion 10. As shown in FIG. As a result, a multiple tubular structure is formed by the first tubular portion 10 and the second tubular portion 20, and a doughnut-shaped space is formed between the outer circumference 10b of the first tubular portion 10 and the inner circumference 20a of the second tubular portion 20. Configured.

第１筒部１０の筒内には供給路５０から第１気体Ａ１が供給される。供給路５０は例えばパイプ状になっており、外部から第１筒部１０の筒内に第１気体Ａ１を送り込む役目を果たす。第１筒部１０には第１ポート１０ｐが設けられ、この第１ポート１０ｐに供給路５０が接続される。供給路５０は例えば第２筒部２０を貫通して第１筒部１０の第１ポート１０ｐに接続される。供給路５０は第１筒部１０の内周１０ａの接線方向に延在するように第１ポート１０ｐに接続される。 The first gas A<b>1 is supplied from the supply passage 50 into the cylinder of the first cylinder part 10 . The supply path 50 has a pipe shape, for example, and serves to send the first gas A1 into the cylinder of the first cylinder portion 10 from the outside. The first cylindrical portion 10 is provided with a first port 10p, and the supply passage 50 is connected to the first port 10p. The supply passage 50 is connected to the first port 10p of the first tubular portion 10 through the second tubular portion 20, for example. The supply passage 50 is connected to the first port 10p so as to extend in the tangential direction of the inner circumference 10a of the first cylindrical portion 10. As shown in FIG.

第２筒部２０には第２ポート２０ｐが設けられる。この第２筒部２０の第２ポート２０ｐに吸引路６０が接続される。吸引路６０は第２筒部２０の内周２０ａの接線方向に延在するように第２ポート２０ｐに接続される。第２ポート２０ｐの開口径は第１ポート１０ｐの開口径よりも大きい。第２筒部２０内の第２気体Ａ２は、第２ポート２０ｐから吸引路６０へ吸引され、外部に排出される。 The second cylindrical portion 20 is provided with a second port 20p. A suction path 60 is connected to the second port 20p of the second tubular portion 20 . The suction path 60 is connected to the second port 20p so as to extend in the tangential direction of the inner circumference 20a of the second tubular portion 20. As shown in FIG. The opening diameter of the second port 20p is larger than the opening diameter of the first port 10p. The second gas A2 inside the second cylindrical portion 20 is sucked from the second port 20p into the suction passage 60 and discharged to the outside.

第１ポート１０ｐおよび第２ポート２０ｐのいずれにおいても、第１筒部１０および第２筒部２０の一端側（対象物Ｗから遠い側、壁部材４０が設けられている側）に設けられていることが好ましい。 In both the first port 10p and the second port 20p, the preferably.

本実施形態に係る気体供給吸引装置１のように、第１筒部１０の内側に第３筒部３０が設けられていてもよい。第３筒部３０の一端側は壁部材４０に接続される。第３筒部３０の壁部材４０からの長さは、第２筒部２０の壁部材４０からの長さよりも短い。第３筒部３０は第１ポート１０ｐと対向する位置に設けられる。これにより、第１ポート１０ｐから供給される第１気体Ａ１は、第１筒部１０の内周１０ａと第３筒部３０の外周３０ｂとの間に送り込まれる。第３筒部３０の形状は円筒型または円錐型が望ましい。 The third cylinder portion 30 may be provided inside the first cylinder portion 10 as in the gas supply suction device 1 according to this embodiment. One end side of the third tubular portion 30 is connected to the wall member 40 . The length from the wall member 40 of the third tubular portion 30 is shorter than the length from the wall member 40 of the second tubular portion 20 . The third cylindrical portion 30 is provided at a position facing the first port 10p. As a result, the first gas A1 supplied from the first port 10p is sent between the inner periphery 10a of the first tubular portion 10 and the outer periphery 30b of the third tubular portion 30. As shown in FIG. The shape of the third cylindrical portion 30 is preferably cylindrical or conical.

図３は、気体供給吸引装置を例示する模式断面図（その１）である。
図３には、第１筒部１０および第２筒部２０の他端側（開放端側）からみた断面図が示される。
第１筒部１０の第１ポート１０ｐの位置と、第２筒部２０の第２ポート２０ｐの位置とは、中心（筒の中心、窓部４５の中心およびレーザ光ＬＳの光軸のいずれか）に対して互いに反対側に設けられている。すなわち、第１ポート１０ｐは中心に対して一方側にオフセットして設けられ、第２ポート２０ｐは中心に対して他方側にオフセットして設けられる。 FIG. 3 is a schematic cross-sectional view (Part 1) illustrating the gas supply suction device.
FIG. 3 shows a cross-sectional view of the first tubular portion 10 and the second tubular portion 20 as seen from the other end side (open end side).
The position of the first port 10p of the first cylindrical portion 10 and the position of the second port 20p of the second cylindrical portion 20 are the center (the center of the cylinder, the center of the window portion 45, or the optical axis of the laser beam LS). ) on opposite sides of each other. That is, the first port 10p is offset to one side from the center, and the second port 20p is offset to the other side from the center.

供給路５０から第１気体Ａ１を供給して第１ポート１０ｐから第１筒部１０内に送り込むと、第１気体Ａ１は第１筒部１０の内周１０ａに沿って回転しながら他端側（開放端側）に向けて送り出される。すなわち、第１気体Ａ１は第１筒部１０の内周１０ａの接線方向の延長上から第１筒部１０内に送り込まれ、内周１０ａに当たって渦を巻くように回転しながら供給される。 When the first gas A1 is supplied from the supply path 50 and sent into the first cylindrical portion 10 from the first port 10p, the first gas A1 rotates along the inner circumference 10a of the first cylindrical portion 10 and rotates toward the other end side. (Open end side). That is, the first gas A1 is fed into the first cylindrical portion 10 from the extension of the inner circumference 10a of the first cylindrical portion 10 in the tangential direction, and is supplied while hitting the inner circumference 10a and rotating in a vortex.

一方、吸引路６０により気体吸引を行うと、第２筒部２０の他端側（開放端側）から第２気体Ａ２が吸い込まれ、第２筒部２０の内周２０ａに沿って回転しながら第２ポート２０ｐに向けて吸い上げられる。すなわち、吸引路６０により第２気体Ａ２を第２筒部２０の内周２０ａの接線方向に吸引することで、第２筒部２０内では第２気体Ａ２が内周２０ａに沿って渦を巻くように回転しながら吸い上げられることになる。そして、第２ポート２０ｐから吸引路６０を介して外部に排出される。 On the other hand, when gas is sucked through the suction path 60, the second gas A2 is sucked from the other end side (open end side) of the second cylindrical portion 20, and rotates along the inner circumference 20a of the second cylindrical portion 20. It is sucked up towards the second port 20p. That is, by sucking the second gas A2 in the tangential direction of the inner circumference 20a of the second tubular portion 20 through the suction path 60, the second gas A2 swirls along the inner circumference 20a in the second tubular portion 20. It will be sucked up while rotating like this. Then, it is discharged outside through the suction path 60 from the second port 20p.

図４は、気体供給吸引装置を例示する模式断面図（その２）である。
図４には、気体供給吸引装置１の側面側からみた断面図が示される。
気体供給吸引装置１において、第２筒部２０の他端２０ｃは、第１筒部１０の他端１０ｃよりも対象物Ｗに近い位置に配置される。すなわち、第２筒部２０の延出長さは第１筒部１０の延出長さよりも短い。これにより、第２筒部２０の他端２０ｃと対象物Ｗとの間隔ｈ１は、第１筒部１０の他端１０ｃと対象物Ｗとの間隔ｈ２よりも狭くなる。その結果、対象物Ｗの処理箇所Ｐの周辺を第２筒部２０で覆うとともに、第１筒部１０の他端１０ｃ側の筒内に気体の供給および吸引を行う空間を確保することができる。 FIG. 4 is a schematic cross-sectional view (No. 2) illustrating the gas supply suction device.
FIG. 4 shows a cross-sectional view of the gas supply suction device 1 as seen from the side.
In the gas supply suction device 1 , the other end 20 c of the second cylindrical portion 20 is arranged at a position closer to the object W than the other end 10 c of the first cylindrical portion 10 . That is, the extension length of the second tubular portion 20 is shorter than the extension length of the first tubular portion 10 . As a result, the distance h1 between the other end 20c of the second tubular portion 20 and the object W becomes narrower than the distance h2 between the other end 10c of the first tubular portion 10 and the object W. As a result, it is possible to cover the periphery of the processing location P of the object W with the second cylindrical portion 20 and secure a space for supplying and sucking gas in the cylindrical portion on the side of the other end 10c of the first cylindrical portion 10. .

また、第１筒部１０と第３筒部３０との隙間である第１隙間ｄ１は、第１筒部１０と第２筒部２０との隙間である第２隙間ｄ２よりも狭く設けられていてもよい。これにより、第３筒部３０と第１筒部１０との隙間である第１隙間ｄ１に第１気体Ａ１を供給することで、第１筒部１０内で回転する気流の速度を高めることができる。 A first gap d1 between the first cylindrical portion 10 and the third cylindrical portion 30 is narrower than a second gap d2 between the first cylindrical portion 10 and the second cylindrical portion 20. may Accordingly, by supplying the first gas A1 to the first gap d1, which is the gap between the third cylindrical portion 30 and the first cylindrical portion 10, the speed of the airflow rotating in the first cylindrical portion 10 can be increased. can.

（気体供給吸引装置による気体流れ）
次に、気体供給吸引装置１による気体の流れについて詳細に説明する。
図５は、気体供給吸引装置による気体の流れを例示する模式断面図（その１）である。図５には、気体供給吸引装置１の側面側からみた断面図による気体の流れが例示される。
図６は、気体供給吸引装置による気体の流れを例示する模式断面図（その２）である。図６には、第１筒部１０および第２筒部２０の他端側（開放端側）からみた断面図による気体の流れが例示される。 (Gas flow by gas supply suction device)
Next, the gas flow by the gas supply suction device 1 will be described in detail.
FIG. 5 is a schematic cross-sectional view (Part 1) illustrating the flow of gas by the gas supply suction device. FIG. 5 illustrates the gas flow in a cross-sectional view of the gas supply suction device 1 viewed from the side.
FIG. 6 is a schematic cross-sectional view (Part 2) illustrating the flow of gas by the gas supply suction device. FIG. 6 illustrates the flow of gas in a cross-sectional view of the first cylindrical portion 10 and the second cylindrical portion 20 viewed from the other end side (open end side).

先ず、気体を供給した際の流れについて説明する。
供給路５０から第１気体Ａ１を供給すると、第１気体Ａ１は第１ポート１０ｐから第１筒部１０内に送り込まれる。ここで、第１ポート１０ｐは第１筒部１０の中心に対してオフセットしているため、第１気体Ａ１は第１筒部１０の内周１０ａに沿って回転しながら供給される。図６に示す例では、第１気体Ａ１は第１筒部１０内で反時計回りに回転し、内側回転気流ＲＡ１となる。 First, the flow when gas is supplied will be described.
When the first gas A1 is supplied from the supply path 50, the first gas A1 is sent into the first cylindrical portion 10 from the first port 10p. Here, since the first port 10p is offset with respect to the center of the first tubular portion 10, the first gas A1 is supplied while rotating along the inner periphery 10a of the first tubular portion 10. As shown in FIG. In the example shown in FIG. 6, the first gas A1 rotates counterclockwise within the first cylindrical portion 10 and becomes the inner rotating airflow RA1.

なお、第１筒部１０の内側に第３筒部３０が設けられていると、第１気体Ａ１の供給流路が狭くなり、第１筒部１０内に供給される第１気体Ａ１の流速を高めることができる。これにより、第３筒部３０が設けられていない場合に比べ、第１筒部１０内に形成される内側回転気流ＲＡ１の流速（回転速度）を高めることができる。 In addition, when the third cylinder portion 30 is provided inside the first cylinder portion 10, the supply flow path of the first gas A1 becomes narrow, and the flow velocity of the first gas A1 supplied into the first cylinder portion 10 is can increase As a result, the flow velocity (rotational speed) of the inner rotating airflow RA1 formed in the first tubular portion 10 can be increased compared to the case where the third tubular portion 30 is not provided.

第１筒部１０の一端側の第３筒部３０との間は壁部材４０によって塞がれているため、供給路５０から第１気体Ａ１を供給することで、第１気体Ａ１による内側回転気流ＲＡ１は第１筒部１０の開放端である他端側（対象物Ｗ側）へ進むことになる。すなわち、第１気体Ａ１は、螺旋状の内側回転気流ＲＡ１になって他端側へ吹き出すことになる。 Since the space between the first cylindrical portion 10 and the third cylindrical portion 30 on the one end side is blocked by the wall member 40, by supplying the first gas A1 from the supply path 50, the inner rotation by the first gas A1 is performed. The airflow RA1 advances to the other end side (target object W side) that is the open end of the first tubular portion 10 . That is, the first gas A1 becomes a spiral inner rotating airflow RA1 and blows out to the other end side.

次に、気体を吸引した際の流れについて説明する。
吸引路６０により気体吸引を行うと、第２気体Ａ２が第２ポート２０ｐから吸引路６０に引き込まれる。ここで、第２ポート２０ｐは第２筒部２０の中心に対してオフセットしているため、第２気体Ａ２は第２筒部２０の内周２０ａに沿って回転しながら吸引される。第２ポート２０ｐは、中心に対して第１ポート１０ｐとは反対側にオフセットしていることから、第２気体Ａ２の吸引による回転方向は、第１気体Ａ１の供給による回転方向と同じ反時計回りに回転し、外側回転気流ＲＡ２となる。 Next, the flow when gas is sucked will be described.
When gas is sucked through the suction path 60, the second gas A2 is drawn into the suction path 60 from the second port 20p. Here, since the second port 20p is offset with respect to the center of the second tubular portion 20, the second gas A2 is sucked while rotating along the inner periphery 20a of the second tubular portion 20. As shown in FIG. Since the second port 20p is offset to the side opposite to the first port 10p with respect to the center, the direction of rotation due to the suction of the second gas A2 is the same as the direction of rotation due to the supply of the first gas A1, counterclockwise. It rotates around and becomes an outer rotating airflow RA2.

第２筒部２０の一端側は壁部材４０によって塞がれているため、開放端である他端２０ｃ側から第２気体Ａ２が吸引され、第２筒部２０内で外側回転気流ＲＡ２となって第２筒部２０の他端２０ｃ側（対象物Ｗ側）から一端側へ進むことになる。すなわち、第２気体Ａ２は、螺旋状の外側回転気流ＲＡ２になって一端側へ吸い上げられることになる。 Since one end side of the second cylindrical portion 20 is closed by the wall member 40, the second gas A2 is sucked from the other end 20c side, which is the open end, and becomes the outer rotating airflow RA2 inside the second cylindrical portion 20. Then, it advances from the other end 20c side (object W side) of the second tubular portion 20 to the one end side. That is, the second gas A2 becomes a spiral outer rotating airflow RA2 and is sucked up to the one end side.

気体供給吸引装置１において、第１気体Ａ１の供給および第２気体Ａ２の吸引は制御部８０によって制御される。この際、制御部８０は、供給路５０からの第１気体Ａ１の流速を、吸引路６０での第２気体Ａ２の吸引の流速よりも速くする制御を行うことが好ましい。これにより、第１気体Ａ１による内側回転気流ＲＡ１の流速を、第２気体Ａ２による外側回転気流ＲＡ２の流速よりも高めることができる。 In the gas supply suction device 1, the supply of the first gas A1 and the suction of the second gas A2 are controlled by the controller 80. FIG. At this time, the control unit 80 preferably controls the flow velocity of the first gas A1 from the supply path 50 to be faster than the flow velocity of the suction of the second gas A2 in the suction path 60 . Thereby, the flow velocity of the inner rotating airflow RA1 by the first gas A1 can be made higher than the flow velocity of the outer rotating airflow RA2 by the second gas A2.

また、制御部８０は、上記の第１気体Ａ１および第２気体Ａ２のそれぞれの流速制御に加え、供給路５０での第１気体Ａ１の流量を、吸引路６０での第２気体Ａ２の吸引の流量よりも少なくする制御を行うことが好ましい。これにより、第１気体Ａ１による内側回転気流の流速を第２気体Ａ２による外側回転気流の流速よりも高めるとともに、外側回転気流によって十分な量の第２気体Ａ２を吸引することができる。 In addition to controlling the flow rate of each of the first gas A1 and the second gas A2, the control unit 80 controls the flow rate of the first gas A1 in the supply path 50 and the suction of the second gas A2 in the suction path 60. It is preferable to control the flow rate to be less than the flow rate of As a result, the flow velocity of the inner rotating airflow of the first gas A1 can be made higher than the flow velocity of the outer rotating airflow of the second gas A2, and a sufficient amount of the second gas A2 can be sucked by the outer rotating airflow.

このような制御部８０による第１気体Ａ１の供給および第２気体Ａ２の吸引のバランス制御によって、第１筒部１０内の気圧が第２筒部２０内の気圧に対して相対的に高くなる。また、第２筒部２０内の気圧は、気体供給吸引装置１の外側の気圧（例えば大気圧）に対して負圧となる。これにより、第１筒部１０内に供給された第１気体Ａ１は旋回する内側回転気流ＲＡ１になって他端１０ｃ側から処理箇所Ｐに向けて吹き出す。すなわち、第１筒部１０の他端１０ｃから吹き出した第１気体Ａ１が処理箇所Ｐに到達する前に外側回転気流ＲＡ２に引き込まれることなく、確実に処理箇所Ｐまで到達する。 Due to such balance control of the supply of the first gas A1 and the suction of the second gas A2 by the control unit 80, the air pressure in the first cylinder part 10 becomes relatively higher than the air pressure in the second cylinder part 20. . Also, the pressure inside the second cylindrical portion 20 is negative with respect to the pressure outside the gas supply/suction device 1 (for example, the atmospheric pressure). As a result, the first gas A1 supplied into the first cylindrical portion 10 becomes a swirling inner rotating airflow RA1 and blows out toward the processing location P from the other end 10c side. That is, the first gas A1 blown out from the other end 10c of the first tubular portion 10 reaches the processing location P without being drawn into the outer rotating airflow RA2 before reaching the processing location P.

また、第２筒部２０の他端２０ｃ側の筒内の第２気体Ａ２は、外側回転気流ＲＡ２となって吸い上げられる。この際、第１筒部１０の他端１０ｃから出て処理箇所Ｐに吹きつけられた第１気体Ａ１は、対象物Ｗ（処理箇所Ｐ）に当たった後に外側に拡がり、第２筒部２０の外側回転気流ＲＡ２に巻き込まれていく。第２気体Ａ２による外側回転気流ＲＡ２は、第２筒部２０の内周２０ａに沿って螺旋状に吸い上げられ、吸引路６０から外部へ排出されることになる。 Further, the second gas A2 in the cylinder on the side of the other end 20c of the second cylinder part 20 is sucked up as the outer rotating airflow RA2. At this time, the first gas A1 emitted from the other end 10c of the first cylindrical portion 10 and sprayed onto the processing location P hits the target object W (processing location P) and then spreads outward. is caught in the outer rotating airflow RA2. The outer rotating airflow RA2 of the second gas A2 is spirally sucked up along the inner circumference 20a of the second cylindrical portion 20, and discharged from the suction passage 60 to the outside.

（レーザ溶接動作）
次に、レーザ処理装置１００によるレーザ溶接動作（レーザ処理方法）について説明する。
先ず、先に説明したように、気体供給吸引装置１によって第１気体Ａ１の供給と、第２気体Ａ２の吸引とを行う。次に、気体供給吸引装置１の中心位置の下方に処理箇所Ｐが位置するように配置する。これにより、処理箇所Ｐには内側回転気流ＲＡ１によって第１気体Ａ１が吹き付けられ、処理箇所Ｐの周辺の第２気体Ａ２が外側回転気流ＲＡ２によって吸い上げられる。 (laser welding operation)
Next, a laser welding operation (laser processing method) by the laser processing apparatus 100 will be described.
First, as described above, the gas supply/suction device 1 supplies the first gas A1 and sucks the second gas A2. Next, the gas supply/suction device 1 is arranged so that the processing location P is located below the center position. As a result, the first gas A1 is blown onto the processing location P by the inner rotating airflow RA1, and the second gas A2 around the processing location P is sucked up by the outer rotating airflow RA2.

次に、この状態でレーザ出射ヘッド１１０からレーザ光ＬＳを出射する。レーザ光ＬＳは窓部４５を通過して第１筒部１０（第３筒部３０）の中心を進み、処理箇所Ｐに照射される。これにより、処理箇所Ｐの対象物Ｗがレーザ光ＬＳのエネルギーによって溶接される。 Next, the laser beam LS is emitted from the laser emitting head 110 in this state. The laser beam LS passes through the window portion 45, advances through the center of the first cylindrical portion 10 (the third cylindrical portion 30), and is irradiated onto the processing location P. As shown in FIG. As a result, the object W at the processing location P is welded by the energy of the laser beam LS.

溶接によって処理箇所Ｐからは対象物Ｗの材料の飛散、煙、粉塵などの飛散物質が発生する。処理箇所Ｐから発生したこれらの飛散物質は第２気体Ａ２として外側回転気流に巻き込まれ、第２筒部２０内を旋回しながら吸い上げられる。そして、第２ポート２０ｐから吸引路６０へ吸い込まれ、外部に排出される。 Welding causes the material of the object W to scatter, smoke, dust, and other scattering substances from the processing location P. As shown in FIG. These scattered substances generated from the processing location P are caught in the outer rotating air current as the second gas A2, and sucked up while swirling inside the second cylindrical portion 20. As shown in FIG. Then, it is sucked into the suction path 60 from the second port 20p and discharged to the outside.

また、必要に応じてレーザ光ＬＳの照射位置と処理箇所Ｐとの相対的な位置を移動しながら連続した溶接が行われる。 In addition, continuous welding is performed while moving the relative positions of the irradiation position of the laser beam LS and the processing location P as necessary.

このような処理において、レーザ光ＬＳは第１気体Ａ１による内側回転気流ＲＡ１の中心を通過して処理箇所Ｐへ到達する。この際、内側回転気流ＲＡ１は外側回転気流ＲＡ２に比べて流速が速いため、第１気体Ａ１は外側回転気流ＲＡ２に吸い込まれる前に処理箇所Ｐへ到達する。つまり、第１筒部１０と処理箇所Ｐとの間は不活性ガスによる第１気体Ａ１によって支配的に満たされた状態となる。これにより、レーザ光ＬＳによる溶接の際の酸化等を抑制することができる。 In such processing, the laser beam LS reaches the processing location P through the center of the inner rotating airflow RA1 of the first gas A1. At this time, since the inner rotating airflow RA1 has a higher flow velocity than the outer rotating airflow RA2, the first gas A1 reaches the processing location P before being sucked into the outer rotating airflow RA2. In other words, the space between the first tubular portion 10 and the processing location P is predominantly filled with the first gas A1, which is an inert gas. As a result, oxidation or the like during welding by the laser beam LS can be suppressed.

また、第１筒部１０の内側に対して第２筒部２０の内側のほうが負圧になっているため、処理箇所Ｐから発生した飛散物質は処理箇所Ｐから速やかに外側回転気流ＲＡ２に吸い込まれていくことになる。これにより、処理箇所Ｐから発生した飛散物質がレーザ光ＬＳの光路や処理箇所Ｐに留まることはない。 Further, since the inner side of the second cylindrical portion 20 has a negative pressure with respect to the inner side of the first cylindrical portion 10, the scattered substances generated from the processing point P are quickly sucked into the outer rotating airflow RA2 from the processing point P. It will be lost. As a result, the scattered substances generated from the processing location P do not remain in the optical path of the laser beam LS or the processing location P.

したがって、このレーザ溶接動作（レーザ処理方法）によれば、不活性ガス等の第１気体Ａ１を確実に処理箇所Ｐに供給できるとともに、処理箇所から発生した飛散物質を効果的に吸引して外部へ排出できるようになる。これにより、飛散物質によってレーザ光ＬＳが減衰したり、飛散物質が光学系１１２などの周辺部材に付着したりすることを抑制でき、加工品質の低下を抑制することが可能となる。 Therefore, according to this laser welding operation (laser processing method), the first gas A1, such as an inert gas, can be reliably supplied to the processing location P, and the scattered substances generated from the processing location can be effectively sucked to the outside. can be discharged to As a result, it is possible to prevent the laser beam LS from attenuating due to the scattering substance and the scattering substance from adhering to the peripheral members such as the optical system 112, thereby suppressing deterioration of the processing quality.

（第２実施形態）
図７は、第２実施形態に係る気体供給吸引装置を例示する模式断面図である。
図７には、第２実施形態に係る気体供給吸引装置１Ｂの側面側からみた断面図が示される。
第２実施形態に係る気体供給吸引装置１Ｂでは、第１筒部１０の長さを変更できる構成になっている。例えば、第１筒部１０が一端側（壁部材４０側）の第１部分１１と、他端１０ｃ側（開放端側）の第２部分１２とを有しており、第１部分１１に対して第２部分１２をスライドさせて伸縮できるようになっている。これにより、第１筒部１０の延出方向の長さを調整できる。 (Second embodiment)
FIG. 7 is a schematic cross-sectional view illustrating the gas supply suction device according to the second embodiment.
FIG. 7 shows a cross-sectional view of the gas supply suction device 1B according to the second embodiment as viewed from the side.
The gas supply and suction device 1B according to the second embodiment is configured such that the length of the first cylindrical portion 10 can be changed. For example, the first cylindrical portion 10 has a first portion 11 on one end side (wall member 40 side) and a second portion 12 on the other end 10c side (open end side). The second portion 12 can be slid and contracted. Thereby, the length of the extension direction of the 1st cylinder part 10 can be adjusted.

第１筒部１０の延出方向の長さが長いほど他端１０ｃの位置が処理箇所Ｐに近くなり、第１気体Ａ１を処理箇所Ｐに供給しやすくなる。一方、第１筒部１０の延出方法の長さが短いほど他端１０ｃの位置が処理箇所Ｐから遠くなり、飛散物質を吸い込みやすくなる。この第１筒部１０の延出方向の長さを調節することで、第１気体Ａ１の供給と第２気体Ａ２の吸引とのバランスを変化させることができる。 The position of the other end 10c becomes closer to the processing location P as the length of the extending direction of the first cylindrical portion 10 increases, and the first gas A1 can be supplied to the processing location P more easily. On the other hand, the shorter the length of the extension method of the first cylindrical portion 10, the farther the position of the other end 10c from the processing location P, and the easier it is to absorb the scattered substances. The balance between the supply of the first gas A1 and the suction of the second gas A2 can be changed by adjusting the length of the first cylindrical portion 10 in the extending direction.

なお、本実施形態では第１筒部１０の延出方向の長さを調節可能とする構成を例示したが、第２筒部２０の延出方向の長さを調整可能とする構成でもよいし、第１筒部１０および第２筒部２０の両方の長さを調整可能とする構成でもよい。また、第３筒部３０の延出方向の長さを調節可能に構成してもよい。 In addition, although the configuration in which the length in the extending direction of the first cylindrical portion 10 is adjustable is illustrated in the present embodiment, a configuration in which the length in the extending direction of the second cylindrical portion 20 is adjustable may be used. , the length of both the first tubular portion 10 and the second tubular portion 20 may be adjustable. Further, the length in the extending direction of the third tubular portion 30 may be configured to be adjustable.

（第３実施形態）
図８は、第３実施形態に係る気体供給吸引装置を例示する模式断面図である。
図８には、第３実施形態に係る気体供給吸引装置１Ｃの側面側からみた断面図が示される。
第３実施形態に係る気体供給吸引装置１Ｃでは、第２筒部２０の他端２０ｃの形状を対象物Ｗの形状に対応させた構成となっている。例えば、対象物Ｗが湾曲していたり、曲面になっていたりした場合、この形状に合わせて第２筒部２０の他端２０ｃを曲面に構成している。これにより、第２筒部２０の他端２０ｃと対象物Ｗの表面との間隔Ｇ１がほぼ一定となり、この間隔Ｇ１から第２筒部２０内への第２気体Ａ２の吸い込みばらつきを抑制することができる。吸い込みのばらつきが抑制されると、第２気体Ａ２による外側回転気流を安定して形成することができる。 (Third Embodiment)
FIG. 8 is a schematic cross-sectional view illustrating a gas supply suction device according to the third embodiment.
FIG. 8 shows a cross-sectional view of the gas supply suction device 1C according to the third embodiment as viewed from the side.
In the gas supply/suction device 1C according to the third embodiment, the shape of the other end 20c of the second cylindrical portion 20 is made to correspond to the shape of the object W. As shown in FIG. For example, when the target object W is curved or has a curved surface, the other end 20c of the second cylindrical portion 20 is configured to have a curved surface according to this shape. As a result, the gap G1 between the other end 20c of the second cylindrical portion 20 and the surface of the object W becomes substantially constant, and the variation in suction of the second gas A2 into the second cylindrical portion 20 from this gap G1 can be suppressed. can be done. When the variation in suction is suppressed, the outer rotating airflow can be stably formed by the second gas A2.

なお、第２筒部２０の他端２０ｃを対象物Ｗの形状に対応させるほか、第１筒部１０の他端１０ｃも同様に対象物Ｗの形状に対応させてもよい。また、第３筒部３０の他端３０ｃも同様に対象物Ｗの形状に対応させてもよい。 In addition to making the other end 20c of the second tubular portion 20 correspond to the shape of the object W, the other end 10c of the first tubular portion 10 may correspond to the shape of the object W in the same way. In addition, the other end 30c of the third tubular portion 30 may also correspond to the shape of the object W in the same manner.

以上説明したように、第１～第３実施形態によれば、処理箇所Ｐへの第１気体Ａ１の十分な供給と飛散物質を含む第２気体Ａ２の効率の良い吸引とを両立することができ、加工品質の低下を抑制することができる気体供給吸引装置１およびレーザ処理装置１００を提供することが可能になる。 As described above, according to the first to third embodiments, it is possible to achieve both sufficient supply of the first gas A1 to the processing location P and efficient suction of the second gas A2 containing the scattered substance. It is possible to provide the gas supply/suction device 1 and the laser processing device 100 that can suppress deterioration in processing quality.

（第４実施形態）
図９は、第４実施形態に係る吸引装置を例示する模式断面図である。
図９に示す吸引装置２は、第１筒部１０および第２筒部２０の両方で気体の吸引を行う装置である。吸引装置２は、例えばレーザ処理装置１００に用いられる。この場合、吸引装置２は、対象物Ｗとレーザ出射ヘッド１１０との間に配置される。
吸引装置２の構成は、先に説明した気体供給吸引装置１、１Ｂおよび１Ｃと同様であるが、第１筒部１０の第１ポート１０ｐには供給路５０の代わりに吸引路６５が接続される。ここで、第１筒部１０の第１ポート１０ｐに接続される吸引路６５は第１吸引路であり、第２筒部２０の第２ポート２０ｐに接続される吸引路６０は第２吸引路である。 (Fourth embodiment)
FIG. 9 is a schematic cross-sectional view illustrating the suction device according to the fourth embodiment.
The suction device 2 shown in FIG. 9 is a device that suctions gas with both the first cylindrical portion 10 and the second cylindrical portion 20 . The suction device 2 is used, for example, in a laser processing device 100 . In this case, the suction device 2 is arranged between the object W and the laser emission head 110 .
The structure of the suction device 2 is similar to the gas supply suction devices 1, 1B and 1C described above, but the first port 10p of the first cylindrical portion 10 is connected to the suction path 65 instead of the supply path 50. be. Here, the suction path 65 connected to the first port 10p of the first tubular portion 10 is the first suction path, and the suction path 60 connected to the second port 20p of the second tubular portion 20 is the second suction path. is.

これにより、第１筒部１０内の気体は、第１ポート１０ｐから吸引路６５へ吸引され、外部に排出される。これと同時に、第２筒部２０内の気体は、第２ポート２０ｐから吸引路６０へ吸引され、外部に排出される。 As a result, the gas in the first tubular portion 10 is sucked from the first port 10p to the suction passage 65 and discharged to the outside. At the same time, the gas in the second cylindrical portion 20 is sucked from the second port 20p into the suction passage 60 and discharged to the outside.

吸引装置２において、吸引路６５により気体吸引を行うと、気体が第１ポート１０ｐから吸引路６５に引き込まれる。ここで、第１ポート１０ｐは第１筒部１０の中心に対してオフセットしているため、気体は第１筒部１０の内周１０ａに沿って回転しながら吸引される。図９に示す例では、気体は第１筒部１０内で反時計回りに回転し、内側回転気流ＲＡ１となる。 In the suction device 2, when gas is sucked through the suction path 65, the gas is drawn into the suction path 65 from the first port 10p. Here, since the first port 10p is offset with respect to the center of the first cylindrical portion 10, the gas is sucked while rotating along the inner circumference 10a of the first cylindrical portion 10. As shown in FIG. In the example shown in FIG. 9, the gas rotates counterclockwise within the first cylindrical portion 10 and becomes the inner rotating airflow RA1.

なお、第１筒部１０の内側に第３筒部３０が設けられていると、気体の吸引流路が狭くなり、第１筒部１０で吸引される気体の流速を高めることができる。これにより、第３筒部３０が設けられていない場合に比べ、第１筒部１０内に形成される内側回転気流ＲＡ１の流速（回転速度）を高めることができる。また、レーザ溶接やレーザ切断加工のように処理箇所Ｐからスパッタが大量に発生する処理の場合、第１筒部１０の延出長さを第２筒部２０の延出長さよりも長くするほうが有利な場合もある。すなわち、第１筒部１０で処理箇所Ｐから発生するスパッタを効果的に吸引し、処理箇所Ｐから周辺に拡がる煙を含む粉塵を第２筒部２０で効果的に吸引できるようになる。 In addition, when the third cylinder portion 30 is provided inside the first cylinder portion 10, the gas suction flow path becomes narrow, and the flow velocity of the gas sucked by the first cylinder portion 10 can be increased. As a result, the flow velocity (rotational speed) of the inner rotating airflow RA1 formed in the first tubular portion 10 can be increased compared to the case where the third tubular portion 30 is not provided. Also, in the case of processing such as laser welding or laser cutting, in which a large amount of spatter is generated from the processing location P, it is better to make the extending length of the first cylindrical portion 10 longer than the extending length of the second cylindrical portion 20. It can be advantageous. That is, the first cylindrical portion 10 can effectively absorb the spatter generated from the processing location P, and the second cylindrical portion 20 can effectively absorb dust including smoke spreading from the processing location P to the surroundings.

吸引路６５による気体吸引とともに、吸引路６０により気体吸引を行うと、第２筒部２０内の気体が第２ポート２０ｐから吸引路６０に引き込まれる。ここで、第２ポート２０ｐは第２筒部２０の中心に対してオフセットしているため、気体は第２筒部２０の内周２０ａに沿って回転しながら吸引される。第２ポート２０ｐは、中心に対して第１ポート１０ｐとは反対側にオフセットしていることから、第２筒部２０での気体の回転方向は、第１筒部１０での気体の回転方向と同じ反時計回りに回転し、外側回転気流ＲＡ２となる。 When the gas is sucked by the suction path 60 together with the gas suction by the suction path 65, the gas in the second cylindrical portion 20 is drawn into the suction path 60 from the second port 20p. Here, since the second port 20p is offset with respect to the center of the second tubular portion 20, the gas is sucked while rotating along the inner circumference 20a of the second tubular portion 20. As shown in FIG. Since the second port 20p is offset to the side opposite to the first port 10p with respect to the center, the direction of rotation of the gas in the second tubular portion 20 is the same as the direction of rotation of the gas in the first tubular portion 10. It rotates in the same counterclockwise direction as the outer rotating airflow RA2.

このように、吸引装置２では第１筒部１０および第２筒部２０の両方で気体吸引を行うことになる。この際、第１筒部１０の内径は第２筒部２０の内径よりも小さいため、内側回転気流ＲＡ１による吸引圧力が外側回転気流ＲＡ２による吸引圧力よりも高くなる。
したがって、処理箇所Ｐの上方で発生する内側回転気流ＲＡ１による吸引が主となり、この周囲で発生する外側回転気流ＲＡ２による吸引が従となって、全体として効率のよい吸引を行うことができる。 Thus, in the suction device 2, both the first cylinder portion 10 and the second cylinder portion 20 perform gas suction. At this time, since the inner diameter of the first cylindrical portion 10 is smaller than the inner diameter of the second cylindrical portion 20, the suction pressure by the inner rotating airflow RA1 becomes higher than the suction pressure by the outer rotating airflow RA2.
Therefore, the suction by the inner rotating airflow RA1 generated above the processing location P is the main suction, and the suction by the outer rotating airflow RA2 generated around it is secondary, so that efficient suction can be performed as a whole.

例えば、レーザ光ＬＳを使用したアブレーション加工や被膜除去加工を行う場合、処理箇所Ｐから発生する微細な粉塵を対象物Ｗの表面に付着させないため、吸引装置２による粉塵吸引が有効となる。吸引装置２では、レーザ加工の際に舞い上がった粉塵等の飛散物質を処理箇所Ｐの真上に発生させた内側回転気流ＲＡ１によって強力に引き上げ、これで除去しきれない飛散物質を外側回転気流ＲＡ２によって引き上げることができる。 For example, when performing ablation processing or coating removal processing using the laser beam LS, dust suction by the suction device 2 is effective in order to prevent fine dust generated from the processing location P from adhering to the surface of the object W. In the suction device 2, scattered substances such as dust particles that are blown up during laser processing are strongly pulled up by the inner rotating air current RA1 generated directly above the processing point P, and the scattered substances that cannot be completely removed are removed by the outer rotating air current RA2. can be raised by

電子部品やディスプレイ等の製造工程では、レーザ光ＬＳを使用しての素材の被膜除去を行う場合がある。レーザ加工の際に発生する粉塵等が素材の表面に落下し、表面に残ってしまうことが問題となる。本実施形態に係る吸引装置２を用いることで、レーザ加工時に舞い上がった粉塵等をそのまま真上方向に吸引することができ、粉塵等が素材に付着すること防止することができる。 2. Description of the Related Art In the manufacturing process of electronic components, displays, and the like, there are cases in which a laser beam LS is used to remove a film from a material. The problem is that dust and the like generated during laser processing fall on the surface of the material and remain on the surface. By using the suction device 2 according to the present embodiment, dust and the like that are blown up during laser processing can be sucked directly upward, and dust and the like can be prevented from adhering to the material.

上記説明した第４実施形態によれば、処理箇所Ｐから発生する粉塵等の飛散物質を効率の良く吸引することができ、加工品質の低下を抑制することができる吸引装置２およびレーザ処理装置１００を提供することが可能になる。 According to the fourth embodiment described above, the suction device 2 and the laser processing device 100 are capable of efficiently sucking scattered substances such as dust generated from the processing location P and suppressing deterioration in processing quality. can be provided.

なお、第４実施形態に係る吸引装置２において、第１筒部１０による気体吸引の量を増加したい場合、第１ポート１０ｐおよび吸引路６５の内径を第１筒部１０の内径と同等程度に大きくしてもよい。この場合、第３筒部３０の他端３０ｃは、第１ポート１０ｐおよび吸引路６５よりも対象物Ｗに近い側まで伸ばしておく。この構成では、第１筒部１０の内側吸引気流は、回転成分（内側回転気流ＲＡ１）よりも直接的に吸引路６５まで引き込まれる成分（内側直線気流）が優勢となる。 In addition, in the suction device 2 according to the fourth embodiment, if it is desired to increase the amount of gas suctioned by the first cylindrical portion 10, the inner diameters of the first port 10p and the suction path 65 are made approximately equal to the inner diameter of the first cylindrical portion 10. You can make it bigger. In this case, the other end 30c of the third tubular portion 30 is extended to the side closer to the object W than the first port 10p and the suction path 65 are. In this configuration, in the inner suction airflow of the first tubular portion 10, the component (inner linear airflow) drawn directly to the suction passage 65 is dominant over the rotating component (inner rotating airflow RA1).

また、吸引装置２では、第１筒部１０の他端１０ｃおよび第３筒部３０の他端３０ｃ少なくとも一方が、第２筒部２０の他端２０ｃよりも対象物Ｗに近い位置に配置されていてもよい。これにより、処理箇所Ｐから発生するスパッタなどの粉塵を第１筒部１０で効果的に吸引し、周辺への拡散を抑制することができる。 In the suction device 2, at least one of the other end 10c of the first cylindrical portion 10 and the other end 30c of the third cylindrical portion 30 is arranged at a position closer to the object W than the other end 20c of the second cylindrical portion 20. may be As a result, dust such as spatter generated from the processing location P can be effectively sucked by the first cylindrical portion 10, and diffusion to the surroundings can be suppressed.

（第５実施形態）
図１０は、第５実施形態に係る吸引装置を例示する模式断面図である。
図１０に示す吸引装置２Ｂは、図９に示す吸引装置２と同様に、第１筒部１０および第２筒部２０の両方で気体の吸引を行う装置である。吸引装置２Ｂは、例えばレーザ処理装置１００に用いられる。
吸引装置２Ｂでは、第１筒部１０に接続される吸引路６５の内径が吸引装置２における吸引路６５の内径よりも大きく設けられている。吸引装置２Ｂにおける吸引路６５の内径の最大は、第１筒部１０の内径である。 (Fifth embodiment)
FIG. 10 is a schematic cross-sectional view illustrating the suction device according to the fifth embodiment.
Similar to the suction device 2 shown in FIG. 9, the suction device 2B shown in FIG. 10 is a device that sucks gas with both the first cylindrical portion 10 and the second cylindrical portion 20. As shown in FIG. The suction device 2B is used in the laser processing device 100, for example.
In the suction device 2</b>B, the inner diameter of the suction path 65 connected to the first cylindrical portion 10 is set larger than the inner diameter of the suction path 65 in the suction device 2 . The maximum inner diameter of the suction path 65 in the suction device 2B is the inner diameter of the first tubular portion 10 .

これにより、第１筒部１０内の気体は筒内に沿って直線的に吸引され、第１ポート１０ｐを介して吸引路６５から外部に排出される。これと同時に、第２筒部２０内の気体は、第２ポート２０ｐから吸引路６０へ吸引され、外部に排出される。 As a result, the gas in the first cylinder portion 10 is sucked linearly along the inside of the cylinder and discharged to the outside from the suction passage 65 via the first port 10p. At the same time, the gas in the second cylindrical portion 20 is sucked from the second port 20p into the suction passage 60 and discharged to the outside.

吸引装置２Ｂでは、吸引路６５の内径が第１筒部１０の内径と同様であり、第１筒部１０の中心に対して第１ポート１０ｐがオフセットしていない。このため、第１筒部１０の内側吸引気流は、内側を直線的に吸引される内側直線気流ＲＡ３となる。したがって、第１筒部１０内の気体を真っ直ぐ吸引して効率良く吸引路６５から外部へ排出することができる。 In the suction device 2B, the inner diameter of the suction path 65 is the same as the inner diameter of the first tubular portion 10, and the first port 10p is not offset with respect to the center of the first tubular portion 10. FIG. Therefore, the inner suction airflow of the first cylindrical portion 10 becomes an inner linear airflow RA3 that linearly draws the inner side. Therefore, the gas in the first tubular portion 10 can be sucked straight and efficiently discharged from the suction passage 65 to the outside.

図１０に示す例では、第１筒部１０の他端１０ｃが、第２筒部２０の他端２０ｃよりも対象物Ｗに近い位置に配置されていることが好ましい。これにより、処理箇所Ｐから発生するスパッタなどの粉塵を第１筒部１０で効果的に吸引し、周辺への拡散を抑制することができる。また、第３筒部３０の他端３０ｃの位置は、第１筒部１０の他端１０ｃと、第１ポート１０ｐの対象物Ｗ側の端との間であることが好ましい。これにより、処理箇所Ｐから発生する粉塵等を吸引路６５に誘導しつつ、窓部４５からの吸気を最小限に抑制することができる。 In the example shown in FIG. 10, it is preferable that the other end 10c of the first tubular portion 10 is arranged at a position closer to the object W than the other end 20c of the second tubular portion 20 is. As a result, dust such as spatter generated from the processing location P can be effectively sucked by the first cylindrical portion 10, and diffusion to the surroundings can be suppressed. Further, the position of the other end 30c of the third cylindrical portion 30 is preferably between the other end 10c of the first cylindrical portion 10 and the end of the first port 10p on the object W side. As a result, the dust and the like generated from the processing location P can be guided to the suction path 65 while the intake air from the window portion 45 can be minimized.

上記説明した第５実施形態によれば、処理箇所Ｐに近い部分において直線的に気体吸引を行い、処理箇所Ｐから発生する粉塵等の飛散物質を効率の良く吸引することができる。また、処理箇所Ｐの周囲に拡がった粉塵等は第２筒部２０の外側回転気流ＲＡ２によって効率良く吸引することができる。これにより、加工品質の低下を抑制することができる吸引装置２Ｂおよびレーザ処理装置１００を提供することが可能になる。 According to the fifth embodiment described above, the gas is linearly sucked in the portion near the processing point P, and the scattering substances such as dust generated from the processing point P can be efficiently sucked. In addition, the dust and the like spread around the processing location P can be efficiently sucked by the outer rotating airflow RA2 of the second cylindrical portion 20. As shown in FIG. Accordingly, it is possible to provide the suction device 2B and the laser processing device 100 that can suppress deterioration in processing quality.

なお、上記に本実施形態およびその具体例を説明したが、本発明はこれらの例に限定されるものではない。例えば、第１筒部１０、第２筒部２０および第３筒部３０の形状は円柱形以外の例えば多角柱型や楕円柱型であってもよい。また、第１筒部１０、第２筒部２０および第３筒部３０は必ずしも同心円状に配置されていなくてもよい。また、内側回転気流ＲＡ１および外側回転気流ＲＡ２の回転方向を反時計回りとして説明したが、時計回りでもよいし、内側回転気流ＲＡ１および外側回転気流ＲＡ２の回転方向が互いに逆であってもよい。また、第１筒部１０に複数本の供給路５０を接続してもよいし、第２筒部２０に複数本の吸引路６０を接続してもよい。 Although the present embodiment and its specific examples have been described above, the present invention is not limited to these examples. For example, the shapes of the first cylindrical portion 10, the second cylindrical portion 20, and the third cylindrical portion 30 may be, for example, a polygonal columnar shape or an elliptical columnar shape other than the columnar shape. Also, the first tubular portion 10, the second tubular portion 20 and the third tubular portion 30 do not necessarily have to be arranged concentrically. Further, although the rotation directions of the inner rotating airflow RA1 and the outer rotating airflow RA2 have been described as counterclockwise, they may be clockwise, or the rotating directions of the inner rotating airflow RA1 and the outer rotating airflow RA2 may be opposite to each other. A plurality of supply paths 50 may be connected to the first cylindrical portion 10 , and a plurality of suction paths 60 may be connected to the second cylindrical portion 20 .

また、気体供給吸引装置１、１Ｂおよび１Ｃの実施形態では、第１筒部１０から第１気体Ａ１を供給し、第２筒部２０で第２気体Ａ２を吸引する例を示したが、反対に、第２筒部２０から第１気体Ａ１を供給し、第１筒部１０で第２気体Ａ２を吸引するようにしてもよい。この場合、第１筒部１０の第１ポート１０ｐに吸引路６０が接続され、第２筒部２０の第２ポート２０ｐに供給路５０が接続される。さらにまた、第１気体Ａ１や第２気体Ａ２には液体など気体以外の物質が含まれていてもよい。 Further, in the embodiments of the gas supply and suction devices 1, 1B and 1C, the first gas A1 is supplied from the first cylindrical portion 10 and the second gas A2 is sucked by the second cylindrical portion 20, but the opposite is true. Alternatively, the first gas A1 may be supplied from the second cylindrical portion 20, and the second gas A2 may be sucked by the first cylindrical portion 10. FIG. In this case, the suction path 60 is connected to the first port 10p of the first cylindrical portion 10, and the supply path 50 is connected to the second port 20p of the second cylindrical portion 20. As shown in FIG. Furthermore, the first gas A1 and the second gas A2 may contain substances other than gas such as liquid.

また、吸引装置２および２Ｂにおいて、第１筒部１０、第２筒部２０および第３筒部３０の少なくともいずれかの延出方向の長さを調整可能とする構成にしてもよい。 Further, in the suction devices 2 and 2B, the length in the extending direction of at least one of the first tubular portion 10, the second tubular portion 20 and the third tubular portion 30 may be adjustable.

また、前述の各実施形態またはその具体例に対して、当業者が適宜、構成要素の追加、削除、設計変更を行ったものや、各実施形態の特徴を適宜組み合わせたものも、本発明の要旨を備えている限り、本発明の範囲に包含される。 In addition, additions, deletions, and design changes of constituent elements to the above-described embodiments or specific examples thereof by those skilled in the art, and combinations of features of the embodiments as appropriate may also be included in the scope of the present invention. As long as it has the gist, it is included in the scope of the present invention.

本願は、以下の付記に記載の発明の構成を含む。
（付記）
第１筒部と、
前記第１筒部の外周を囲むように配置される第２筒部と、
前記第１筒部の内周に沿って第１媒体を供給または吸引する第１流路と、
前記第２筒部の内周に沿って第２媒体を吸引または供給する第２流路と、
を備えた媒体供給吸引装置。
ここで、媒体は気体、液体、ゲルなどの各種の状態の物質を含む。第１流路によって媒体を供給する場合は第２流路によって媒体を吸引し、第１流路によって媒体を吸引する場合は第２流路によって媒体を供給する。第２媒体は第２筒部内の媒体および第１媒体を含む。 The present application includes the configurations of the inventions described in the following supplementary notes.
(Appendix)
a first cylindrical portion;
a second cylindrical portion arranged to surround the outer periphery of the first cylindrical portion;
a first flow path for supplying or sucking the first medium along the inner circumference of the first cylindrical portion;
a second channel that sucks or supplies a second medium along the inner circumference of the second cylindrical portion;
A medium supply suction device with a
Here, the medium includes substances in various states such as gas, liquid, and gel. When the medium is supplied by the first channel, the medium is sucked by the second channel, and when the medium is sucked by the first channel, the medium is supplied by the second channel. The second medium includes the medium in the second cylinder and the first medium.

本実施形態に係る気体供給吸引装置１は、レーザ処理装置１００以外の装置、例えば、レーザ以外のエネルギーを用いた処理装置（加熱装置など）や、３次元造形装置（３Ｄプリンタ）など、加工処理の際に気体の供給および吸引を行う処理装置に好適に利用可能である。 The gas supply suction device 1 according to the present embodiment is a device other than the laser processing device 100, for example, a processing device using energy other than laser (heating device, etc.), a three-dimensional modeling device (3D printer), etc. It can be suitably used for a processing apparatus that supplies and sucks gas during the process.

１，１Ｂ，１Ｃ…気体供給吸引装置
２，２Ｂ…吸引装置
１０…第１筒部
１０ａ…内周
１０ｂ…外周
１０ｃ…他端
１０ｐ…第１ポート
１１…第１部分
１２…第２部分
２０…第２筒部
２０ａ…内周
２０ｃ…他端
２０ｐ…第２ポート
３０…第３筒部
３０ｂ…外周
３０ｃ…他端
４０…壁部材
４５…窓部
５０…供給路
６０，６５…吸引路
８０…制御部
１００…レーザ処理装置
１１０…レーザ出射ヘッド
１１１…光源
１１２…光学系
Ａ１…第１気体
Ａ２…第２気体
Ｇ１…間隔
ＬＳ…レーザ光
Ｐ…処理箇所
ＲＡ１…内側回転気流
ＲＡ２…外側回転気流
Ｗ…対象物
ｄ１…第１隙間
ｄ２…第２隙間
ｈ１，ｈ２…間隔 Reference Signs List 1, 1B, 1C Gas supply and suction devices 2, 2B Suction device 10 First tubular portion 10a Inner periphery 10b Outer periphery 10c Other end 10p First port 11 First portion 12 Second portion 20 Second cylindrical portion 20a Inner circumference 20c Other end 20p Second port 30 Third cylindrical portion 30b Outer circumference 30c Other end 40 Wall member 45 Window 50 Supply paths 60, 65 Suction path 80 Control unit 100 Laser processing device 110 Laser emitting head 111 Light source 112 Optical system A1 First gas A2 Second gas G1 Spacing LS Laser beam P Processing location RA1 Inner rotating airflow RA2 Outer rotating airflow W...Object d1...First gap d2...Second gap h1, h2...Interval

Claims (5)

対象物と、前記対象物にエネルギーを照射する照射装置との間に配置され、気体の吸引を行う気体吸引装置であって、
前記エネルギーの照射方向に延在する第１筒部と、
前記第１筒部の外周を囲むように配置される第２筒部と、
前記第１筒部の内側の気体を吸引する第１吸引路と、
前記第２筒部の内周に沿って気体を吸引する第２吸引路と、
を備えた気体吸引装置。 A gas suction device that is disposed between an object and an irradiation device that irradiates energy to the object and that sucks gas,
a first cylindrical portion extending in the irradiation direction of the energy;
a second cylindrical portion arranged to surround the outer periphery of the first cylindrical portion;
a first suction passage for sucking gas inside the first cylindrical portion;
a second suction passage for sucking gas along the inner periphery of the second cylindrical portion;
A gas suction device with a 前記第２筒部の他端は、前記第１筒部の他端よりも前記対象物に近い位置に配置された、請求項１記載の気体吸引装置。 2. The gas suction device according to claim 1, wherein the other end of said second cylindrical portion is arranged at a position closer to said object than the other end of said first cylindrical portion. 前記第１筒部の内側に配置され、前記エネルギーが通される第３筒部と、
前記エネルギーを通過させる窓部を有し、前記第１筒部、前記第２筒部および前記第３筒部の一端側に設けられ、前記第１筒部と前記第２筒部との間および前記第１筒部と前記第３筒部との間を塞ぐ壁部材と、をさらに備え、
前記第１吸引路は、前記第１筒部に設けられた第１ポートに接続され、
前記第２吸引路は、前記第２筒部に設けられた第２ポートに接続され、
前記第３筒部は、前記第１ポートと対向する位置に設けられ、
前記第１吸引路での気体吸引によって前記第３筒部と前記第１筒部との間で前記気体を旋回させて前記第１筒部内に内側回転気流を形成するとともに、前記第２吸引路での気体吸引によって前記第１筒部と前記第２筒部との間で前記気体を旋回させて前記第２筒部内に外側回転気流を形成する、請求項１記載の気体吸引装置。 a third tubular portion disposed inside the first tubular portion and through which the energy passes;
It has a window portion that allows the energy to pass through, is provided on one end side of the first cylindrical portion, the second cylindrical portion, and the third cylindrical portion, between the first cylindrical portion and the second cylindrical portion, and further comprising a wall member closing between the first tubular portion and the third tubular portion;
The first suction path is connected to a first port provided in the first cylinder,
The second suction path is connected to a second port provided in the second cylindrical portion,
The third cylindrical portion is provided at a position facing the first port,
The gas is swirled between the third cylindrical portion and the first cylindrical portion by gas suction in the first suction passage to form an inner rotating airflow in the first cylindrical portion, and the second suction passage. 2. The gas suction device according to claim 1, wherein said gas is swirled between said first cylinder portion and said second cylinder portion by said gas suction at said second cylinder portion to form an outer rotating airflow in said second cylinder portion. 前記第１ポートの位置と、前記第２ポートの位置とは、前記第１筒部および前記第２筒部における筒の中心に対して互いに反対側にオフセットしており、前記内側回転気流と前記外側回転気流の回転方向が互いに同じになる、請求項３記載の気体吸引装置。 The position of the first port and the position of the second port are offset to opposite sides with respect to the center of the cylinder in the first cylinder part and the second cylinder part, and the inner rotational airflow and the 4. The gas suction device according to claim 3, wherein the rotating directions of the outer rotating air currents are the same. 対象物に照射するレーザ光を出射するレーザ出射ヘッドと、
前記対象物と前記レーザ出射ヘッドとの間に配置された請求項１から４のいずれか１項に記載の気体吸引装置と、
を備えたレーザ処理装置。
a laser emitting head that emits a laser beam to irradiate an object;
a gas suction device according to any one of claims 1 to 4, disposed between the object and the laser emission head;
laser processing equipment.
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