JP2023004123A

JP2023004123A - Electronic device housing

Info

Publication number: JP2023004123A
Application number: JP2021105634A
Authority: JP
Inventors: 望鄭; Wang Zheng; 浩幸酒向; Hiroyuki Sako; 知弥奥野; Tomoya Okuno; 友紀小宮; Tomonori Komiya; 良英川島; Yoshihide Kawashima
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2021-06-25
Filing date: 2021-06-25
Publication date: 2023-01-17
Also published as: WO2022270145A1

Abstract

To efficiently exhaust heat in an electronic device housing.SOLUTION: An electronic device housing includes: a body case composed by including a first surface and a second surface opposite to each other and each having an air passage hole; a substrate housed in the body case and extending from the first surface toward the second surface; an electronic device mounted in the substrate; a plate-shaped first heat conducting member directly or indirectly in contact with an entire surface of the electronic device opposite to the substrate, the first heat conducting member configured to conduct heat generated by the electronic device; a second heat conducting member bonded to the surface of the first heat conducting member opposite to the surface in contact with the electronic device, the second heat conducting member having a predetermined thickness in a direction perpendicular to the substrate and having at least one through hole passing through from the first surface toward the second surface, the second heat conducting member configured to conduct the heat conducted from the first heat conducting member; a plate-shaped third heat conducting member bonded to a side of the second heat conducting member opposite to the bonded side with the first heat conducting member and extending from the first surface toward the second surface, the third heat conducting member configured to conduct the heat conducted from the second heat conducting member; and an attaching member for attaching the body case to a predetermined rail.SELECTED DRAWING: Figure 5

Description

本開示は、電子機器用筐体に関する。 TECHNICAL FIELD The present disclosure relates to an electronic device housing.

電子機器は駆動すると発熱するため、電子機器を収容する筐体内に生じた熱を放熱することが求められる。 Since an electronic device generates heat when driven, it is required to dissipate the heat generated within a housing that accommodates the electronic device.

特許文献１には、次の構成が記載される。基板に発熱部品である回路デバイスが搭載されている。基板の回路デバイスが搭載された領域に対応する中間筐体の面の領域に基板方向に突出する凸部が形成され、凸部の先端部が回路デバイスと接触している。したがって、回路デバイスの発熱は中間筐体に伝導されて放熱される。筐体と中間筐体の面との間の間隙は空気層により構成される。 Patent Literature 1 describes the following configuration. A circuit device, which is a heat-generating component, is mounted on the board. A projection projecting toward the substrate is formed in a region of the surface of the intermediate housing corresponding to the region of the substrate where the circuit device is mounted, and the tip of the projection is in contact with the circuit device. Therefore, the heat generated by the circuit device is conducted to the intermediate housing and dissipated. A gap between the housing and the surface of the intermediate housing is constituted by an air layer.

特開２０１１－１５５０８９号公報JP 2011-155089 A

電子機器の性能向上に伴い、電子機器の発熱も増加傾向にある。そのため、電子機器を収容する筐体内に生じた熱をより効率的に放熱することが求められている。 As the performance of electronic devices improves, heat generation of electronic devices tends to increase. Therefore, it is required to dissipate the heat generated in the housing housing the electronic device more efficiently.

本開示は、電子機器を収容する筐体内に生じた熱をより効率的に放熱できる技術の提供を目的とする。 An object of the present disclosure is to provide a technology capable of more efficiently dissipating heat generated within a housing that accommodates an electronic device.

本開示は、互いに対向し、空気が通過する穴を有する第１面及び第２面を含んで構成される直方体の本体ケースと、前記本体ケースに収容され、前記第１面から前記第２面に向かって延出する基板と、前記基板に載置される電子機器と、前記電子機器の前記基板と反対の面全体に直接的又は間接的に接触し、前記電子機器が発する熱を伝導する板状の第１熱伝導部材と、前記第１熱伝導部材の前記電子機器と接触する面と反対の面に固着し、前記基板に垂直な方向に所定の厚みを有すると共に前記第１面から前記第２面に向かって貫通する少なくとも１つの貫通孔を有し、前記第１熱伝導部材から伝導される熱を伝導する第２熱伝導部材と、前記第２熱伝導部材の前記第１熱伝導部材と固着する側と反対側に固着し、前記第１面から前記第２面に向かって延出し、前記第２熱伝導部材から伝導される熱を伝導する板状の第３熱伝導部材と、前記本体ケースを所定のレールに取り付けるための取付部材と、を備える、電子機器用筐体を提供する。 The present disclosure includes a rectangular parallelepiped main body case including a first surface and a second surface facing each other and having holes through which air passes; and an electronic device mounted on the substrate, and the entire surface of the electronic device opposite the substrate is in direct or indirect contact to conduct heat generated by the electronic device. A plate-like first heat-conducting member is fixed to a surface of the first heat-conducting member opposite to the surface in contact with the electronic device, has a predetermined thickness in a direction perpendicular to the substrate, and extends from the first surface. a second heat-conducting member having at least one through-hole penetrating toward the second surface and conducting heat conducted from the first heat-conducting member; and the first heat of the second heat-conducting member. A plate-shaped third heat-conducting member that is fixed to the side opposite to the side that is fixed to the heat-conducting member, extends from the first surface toward the second surface, and conducts heat conducted from the second heat-conducting member. and an attachment member for attaching the main body case to a predetermined rail.

本開示によれば、電子機器を収容する筐体内に生じた熱をより効率的に放熱できる。 According to the present disclosure, it is possible to more efficiently dissipate heat generated within a housing that accommodates an electronic device.

本実施の形態に係る電子機器用筐体を斜め上から見た外観斜視図FIG. 1 is an external perspective view of an electronic device housing according to the present embodiment, viewed obliquely from above; 本実施の形態に係る電子機器用筐体を斜め下から見た外観斜視図FIG. 1 is an external perspective view of an electronic device housing according to the present embodiment, viewed obliquely from below. 図１に示す電子機器用筐体のＡ－Ａ断面図AA sectional view of the housing for electronic equipment shown in FIG. 本実施の形態に係る電子機器用筐体を斜め上から見た内部斜視図FIG. 1 is an internal perspective view of an electronic device housing according to the present embodiment, viewed obliquely from above. 本実施の形態に係る熱伝導部材を斜め下から見た斜視図The perspective view of the heat-conducting member according to the present embodiment as viewed diagonally from below. 本実施の形態に係る熱伝導部材の第１の構成例を説明するためのＡ－Ａ断面の模式図Schematic diagram of AA cross section for explaining the first configuration example of the heat conduction member according to the present embodiment 本実施の形態に係る熱伝導部材の第２の構成例を説明するためのＡ－Ａ断面の模式図Schematic diagram of AA cross section for explaining a second configuration example of the heat conducting member according to the present embodiment 本実施の形態に係る熱伝導部材の第３の構成例を説明するためのＡ－Ａ断面の模式図Schematic diagram of AA cross section for explaining the third configuration example of the heat conducting member according to the present embodiment 本実施の形態に係る熱伝導部材の第４の構成例を示す斜視図A perspective view showing a fourth configuration example of the thermally conductive member according to the present embodiment. 本実施の形態に係る第４の構成例の熱伝導部材を含む電子機器用筐体の内部斜視図The internal perspective view of the electronic device housing including the heat-conducting member of the fourth configuration example according to the present embodiment.

以下、図面を適宜参照して、本開示の実施の形態について、詳細に説明する。ただし、必要以上に詳細な説明は省略する場合がある。例えば、すでによく知られた事項の詳細説明及び実質的に同一の構成に対する重複説明を省略する場合がある。これは、以下の説明が不必要に冗長になるのを避け、当業者の理解を容易にするためである。なお、添付図面及び以下の説明は、当業者が本開示を十分に理解するために提供されるのであって、これらにより特許請求の記載の主題を限定することは意図されていない。 Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially the same configurations may be omitted. This is to avoid unnecessary verbosity in the following description and to facilitate understanding by those skilled in the art. It should be noted that the accompanying drawings and the following description are provided to allow those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter of the claims.

（本実施の形態）
図１は、本実施の形態に係る電子機器用筐体１を斜め上から見た外観斜視図を示す。図２は、本実施の形態に係る電子機器用筐体１を斜め下から見た外観斜視図を示す。 (this embodiment)
FIG. 1 shows an external perspective view of an electronic device housing 1 according to the present embodiment as seen obliquely from above. FIG. 2 shows an external perspective view of the electronic equipment housing 1 according to the present embodiment as viewed obliquely from below.

図１及び図２に示すように、電子機器用筐体１は、略直方体の本体ケース２を備える。本体ケース２は、互いに対向する給気面３及び排気面４を含む。給気面３及び排気面４は、空気が通過する少なくとも１つの穴を有する。詳細については後述するが、図面の点線矢印に示すように、給気面３の穴から自然給気された空気が、排気面４の穴から自然排気される。なお、給気面３は第１面と、排気面４は第２面と読み替えられてもよい。 As shown in FIGS. 1 and 2, the electronic device housing 1 includes a substantially rectangular parallelepiped body case 2 . The body case 2 includes an air supply surface 3 and an exhaust surface 4 facing each other. The intake surface 3 and the exhaust surface 4 have at least one hole through which air passes. Although the details will be described later, as indicated by dotted line arrows in the drawing, the air naturally supplied through the holes in the air supply surface 3 is naturally exhausted through the holes in the exhaust surface 4 . The air supply surface 3 may be read as the first surface, and the exhaust surface 4 may be read as the second surface.

説明の便宜上、図１に示すように、給気面３から排気面４に向けて延びる軸をＺ軸とする。Ｚ軸に垂直な軸をＸ軸とする。Ｘ軸及びＺ軸に垂直な軸をＹ軸とする。また、説明の便宜上、Ｚ軸の正方向を「上」、Ｚ軸の負方向を「下」、Ｘ軸の正方向を「前」、Ｘ軸の負方向を「後」、Ｙ軸の正方向を「左」、Ｙ軸の負方向を「右」と称する場合がある。なお、これらの方向に係る表現は、説明の便宜上用いられるものであって、当該構造の実使用時における姿勢を限定する意図ではない。 For convenience of explanation, as shown in FIG. 1, the axis extending from the air supply surface 3 toward the exhaust surface 4 is defined as the Z axis. The axis perpendicular to the Z-axis is defined as the X-axis. An axis perpendicular to the X-axis and the Z-axis is defined as the Y-axis. For convenience of explanation, the positive direction of the Z-axis is "up", the negative direction of the Z-axis is "down", the positive direction of the X-axis is "forward", the negative direction of the X-axis is "back", and the positive direction of the Y-axis is The direction may be called "left" and the negative direction of the Y-axis may be called "right". It should be noted that these directions are used for convenience of explanation, and are not intended to limit the attitude of the structure in actual use.

本体ケース２は、給気面３及び排気面４のＸ軸の正方向の辺につながりＸ軸に垂直な前面５と、給気面３及び排気面４のＸ軸の負方向の辺につながり前面５に対向する背面６とを含む。加えて、本体ケース２は、給気面３及び排気面４のＹ軸の負方向の辺につながりＹ軸に垂直な左側面７と、給気面３及び排気面４のＹ軸の正方向の辺につながり左側面７に対向する右側面８とを含む。 The main body case 2 is connected to the positive side of the X-axis of the air supply surface 3 and the exhaust surface 4 and connected to the front surface 5 perpendicular to the X-axis, and the negative side of the X-axis of the air supply surface 3 and the exhaust surface 4. a rear surface 6 opposite the front surface 5; In addition, the main body case 2 has a left side 7 connected to the side of the air supply surface 3 and the exhaust surface 4 in the negative direction of the Y axis and perpendicular to the Y axis, and a positive direction of the Y axis of the air supply surface 3 and the exhaust surface 4. and a right side face 8 connected to the side of the left side face 7 facing the left side face 7 .

また、本体ケース２の背面６には、本体ケース２をレール９（例えばＤＩＮレール）に取り付けるための取付部材１０（図３、図４、図９参照）が設けられる。 A mounting member 10 (see FIGS. 3, 4, and 9) for mounting the main body case 2 on a rail 9 (for example, a DIN rail) is provided on the rear surface 6 of the main body case 2. As shown in FIG.

図３は、図１に示す電子機器用筐体１のＡ－Ａ断面図を示す。図４は、本実施の形態に係る電子機器用筐体１を斜め上から見た内部斜視図を示す。なお、図４では、説明をわかり易くするために、電子機器用筐体１の本体ケース２及び本体ケース２に収容される部品の一部の描画を省略している。図５は、本実施の形態に係る熱伝導部材３０を斜め下から見た斜視図である。 FIG. 3 shows a cross-sectional view of the electronic equipment housing 1 shown in FIG. 1 along the line AA. FIG. 4 shows an internal perspective view of the electronic equipment housing 1 according to the present embodiment as seen obliquely from above. In FIG. 4, for the sake of easy understanding of the explanation, the illustration of the body case 2 of the electronic device housing 1 and part of the components housed in the body case 2 is omitted. FIG. 5 is a perspective view of the heat-conducting member 30 according to the present embodiment as viewed obliquely from below.

図３及び図４に示すように、電子機器用筐体１の本体ケース２には、基板２０と、電子機器２１と、伝熱シート２２と、熱伝導部材３０とが収容される。 As shown in FIGS. 3 and 4, the body case 2 of the electronic device housing 1 accommodates a substrate 20 , an electronic device 21 , a heat transfer sheet 22 , and a heat transfer member 30 .

基板２０は、いわゆるプリント基板であり、給気面３から排気面４に向かって延出する板形状を呈する。基板２０は、本体ケース２の左側面７又は右側面８に沿って（例えば略平行に）配置されてよい。本実施の形態では、基板２０の２つの主面のうち、本体ケース２の左側面７に近い方の面を表面と称し、本体ケース２の右側面８に近い方を裏面と称する。 The substrate 20 is a so-called printed circuit board and has a plate shape extending from the air supply surface 3 toward the exhaust surface 4 . The board 20 may be arranged along the left side 7 or the right side 8 of the main body case 2 (for example, substantially parallel). In the present embodiment, of the two main surfaces of the substrate 20, the surface closer to the left side 7 of the body case 2 is called the front side, and the side closer to the right side 8 of the body case 2 is called the back side.

電子機器２１は、基板２０の表面に載置される。電子機器２１の例として、ＰＬＣ（Programmable Logic Controller）、ＳｏＣ（System on a Chip）、ＣＰＵ（Central Processing Unit）、又は、プロセッサが挙げられる。本実施の形態では、電子機器２１の２つの主面のうち、基板２０に近い方の面を裏面と称し、基板２０から遠い方の面を表面と称する。電子機器２１は、駆動すると発熱する。よって、電子機器２１は、発熱部材、発熱体、又は、熱源と読み替えられてもよい。 Electronic equipment 21 is placed on the surface of substrate 20 . Examples of the electronic device 21 include a PLC (Programmable Logic Controller), a SoC (System on a Chip), a CPU (Central Processing Unit), or a processor. In the present embodiment, of the two main surfaces of electronic device 21, the surface closer to substrate 20 is referred to as the back surface, and the surface farther from substrate 20 is referred to as the front surface. The electronic device 21 generates heat when driven. Therefore, the electronic device 21 may be read as a heat-generating member, a heat-generating body, or a heat source.

伝熱シート２２は、絶縁性及び高い熱伝導性を有する薄型のシートである。伝熱シート２２の熱伝導率は、電子機器２１の熱伝導率よりも高くてよい。伝熱シート２２は、電子機器２１の表面全体に接触するように配置される。本実施の形態では、伝熱シート２２の２つの主面のうち、電子機器２１に接触する方の面を裏面と称し、電子機器２１に接触しない方の面を表面と称する。 The heat transfer sheet 22 is a thin sheet having insulating properties and high thermal conductivity. The thermal conductivity of the heat transfer sheet 22 may be higher than that of the electronic device 21 . The heat transfer sheet 22 is arranged so as to contact the entire surface of the electronic device 21 . In the present embodiment, of the two main surfaces of the heat transfer sheet 22, the surface that contacts the electronic device 21 is referred to as the back surface, and the surface that does not contact the electronic device 21 is referred to as the front surface.

熱伝導部材３０は、高い熱伝導性を有し、電子機器２１及び／又は伝熱シート２２から伝導される熱を伝導し、周囲の空気に放熱する部材である。熱伝導部材３０の熱伝導率は、電子機器２１又は伝熱シート２２の熱伝導率よりも高くてよい。例えば、熱伝導部材３０は、高い熱伝導率を有する金属材質によって構成される。熱伝導部材３０は、図３、図４及び図５に示すように、第１熱伝導部材３１と、第２熱伝導部材３２と、第３熱伝導部材３３とを含んで構成される。 The heat-conducting member 30 is a member that has high thermal conductivity, conducts heat conducted from the electronic device 21 and/or the heat-conducting sheet 22, and dissipates the heat to the surrounding air. The thermal conductivity of the thermally conductive member 30 may be higher than that of the electronic device 21 or the thermally conductive sheet 22 . For example, the heat conducting member 30 is made of a metal material having high thermal conductivity. The heat conducting member 30 includes a first heat conducting member 31, a second heat conducting member 32, and a third heat conducting member 33, as shown in FIGS.

第１熱伝導部材３１は、給気面３から排気面４に向かって（つまりＺ軸方向に）延出する板形状の部材である。熱伝導部材３０は、第１熱伝導部材３１が伝熱シート２２の表面全体に接触するように配置される。つまり、第１熱伝導部材３１は、間接的に電子機器２１の表面と接触する。第１熱伝導部材３１の主面のサイズは、伝熱シート２２の表面のサイズ以上であってよい。本実施の形態では、第１熱伝導部材３１の２つの主面のうち、伝熱シート２２に接触する方の面を裏面と称し、伝熱シート２２に接触しない方の面を表面と称する。 The first heat conducting member 31 is a plate-shaped member extending from the air supply surface 3 toward the exhaust surface 4 (that is, in the Z-axis direction). The heat conducting member 30 is arranged such that the first heat conducting member 31 is in contact with the entire surface of the heat conducting sheet 22 . That is, the first thermally conductive member 31 indirectly contacts the surface of the electronic device 21 . The size of the main surface of the first heat transfer member 31 may be equal to or larger than the size of the surface of the heat transfer sheet 22 . In the present embodiment, of the two main surfaces of the first thermally conductive member 31, the surface that contacts the heat transfer sheet 22 is referred to as the back surface, and the surface that does not contact the heat transfer sheet 22 is referred to as the front surface.

第２熱伝導部材３２は、第１熱伝導部材３１の表面に固着し、基板２０に垂直な方向（つまりＹ軸方向）に所定の厚みを有する。加えて、第２熱伝導部材３２は、給気面３から排気面４に向かって（つまりＺ軸方向に）貫通する貫通孔３４を有する。貫通孔３４の数は、１つであってもよいし、図３、図４及び図５に示すように複数であってもよい。 The second thermally conductive member 32 is fixed to the surface of the first thermally conductive member 31 and has a predetermined thickness in the direction perpendicular to the substrate 20 (that is, the Y-axis direction). In addition, the second heat conducting member 32 has a through hole 34 penetrating from the air supply surface 3 toward the exhaust surface 4 (that is, in the Z-axis direction). The number of through-holes 34 may be one, or may be plural as shown in FIGS.

第３熱伝導部材３３は、給気面３から排気面４に向かって（つまりＺ軸方向に）延出する板形状の部材である。第３熱伝導部材３３は、第２熱伝導部材３２の第１熱伝導部材３１と固着する側と反対側に固着する。第３熱伝導部材３３は、第１熱伝導部材３１又は基板２０に沿って（例えば略平行に）配置されてよい。本実施の形態では、第３熱伝導部材３３の２つの主面のうち、第２熱伝導部材３２と固着する方の面を裏面と称し、第２熱伝導部材３２と固着しない方の面を表面と称する。 The third heat conducting member 33 is a plate-shaped member extending from the air supply surface 3 toward the exhaust surface 4 (that is, in the Z-axis direction). The third heat-conducting member 33 is fixed to the opposite side of the second heat-conducting member 32 to the first heat-conducting member 31 . The third heat-conducting member 33 may be arranged along (for example, substantially parallel to) the first heat-conducting member 31 or the substrate 20 . In the present embodiment, of the two main surfaces of the third thermally conductive member 33, the surface that is fixed to the second thermally conductive member 32 is referred to as the back surface, and the surface that is not fixed to the second thermally conductive member 32 is referred to as the back surface. called surface.

第１熱伝導部材３１、第２熱伝導部材３２、及び、第３熱伝導部材３３は、１つの部材として構成されてよい。あるいは、第１熱伝導部材３１及び第２熱伝導部材３２は１つの部材として構成され、第３熱伝導部材３３は別の部材として構成されてもよい。あるいは、第２熱伝導部材３２及び第３熱伝導部材３３は１つの部材として構成され、第１熱伝導部材３１は別の部材として構成されてもよい。 The first heat-conducting member 31, the second heat-conducting member 32, and the third heat-conducting member 33 may be configured as one member. Alternatively, the first heat-conducting member 31 and the second heat-conducting member 32 may be configured as one member, and the third heat-conducting member 33 may be configured as a separate member. Alternatively, the second heat-conducting member 32 and the third heat-conducting member 33 may be configured as one member, and the first heat-conducting member 31 may be configured as a separate member.

あるいは、第１熱伝導部材３１、第２熱伝導部材３２、及び、第３熱伝導部材３３は、それぞれ別の部材として構成されてもよい。この場合、第２熱伝導部材３２の熱伝導率は、第１熱伝導部材３１の熱伝導率よりも低く、第３熱伝導部材３３の熱伝導率は、第２熱伝導部材３２の熱伝導率よりも低くてもよい。熱源である電子機器２１から離れるほど、放熱すべき熱量が減少するためである。なお、熱源から遠ざかるほど伝熱すべき熱量（伝熱面積×熱伝導率）は小さくできる。また、伝熱面積を小さくする場合、熱伝導率の大きな材料が用いられてよい。一方、伝熱面積を大きく取ることができる場合、熱伝導率の小さい材料が用いられてよい。 Alternatively, the first thermally conductive member 31, the second thermally conductive member 32, and the third thermally conductive member 33 may be configured as separate members. In this case, the thermal conductivity of the second thermally conductive member 32 is lower than the thermal conductivity of the first thermally conductive member 31 , and the thermal conductivity of the third thermally conductive member 33 is less than the thermal conductivity of the second thermally conductive member 32 . rate may be lower than This is because the amount of heat to be dissipated decreases as the distance from the electronic device 21, which is the heat source, decreases. The amount of heat to be transferred (heat transfer area x thermal conductivity) can be reduced as the distance from the heat source increases. Moreover, when reducing the heat transfer area, a material with high thermal conductivity may be used. On the other hand, if a large heat transfer area can be secured, a material with low thermal conductivity may be used.

図３及び図４に示すように、本実施の形態に係る電子機器用筐体１では、Ｙ軸の負方向から正方向に向けて順に、本体ケース２の右側面８、基板２０、伝熱シート２２、第１熱伝導部材３１、第２熱伝導部材３２、第３熱伝導部材３３、及び、本体ケース２の左側面７が配置される。 As shown in FIGS. 3 and 4, in the electronic device housing 1 according to the present embodiment, the right side surface 8 of the main body case 2, the substrate 20, the heat transfer element 20, and the heat transfer element are arranged in order from the negative direction to the positive direction of the Y axis. The sheet 22, the first heat conducting member 31, the second heat conducting member 32, the third heat conducting member 33, and the left side surface 7 of the main body case 2 are arranged.

なお、電子機器用筐体１は、伝熱シート２２を備えなくてもよい。この場合、第１熱伝導部材３１の裏面は、電子機器２１の表面全体に直接的に接触してよい。 Note that the electronic device housing 1 may not include the heat transfer sheet 22 . In this case, the back surface of the first thermally conductive member 31 may be in direct contact with the entire surface of the electronic device 21 .

次に、図１から図４を参照して、熱伝導部材３０によって電子機器２１が冷却される仕組みを説明する。 Next, a mechanism for cooling the electronic device 21 by the thermally conductive member 30 will be described with reference to FIGS. 1 to 4. FIG.

電子機器２１は駆動すると発熱する。この電子機器２１から発生した熱は、伝熱シート２２を通じて第１熱伝導部材３１に伝導する。第１熱伝導部材３１に伝導された熱は、第２熱伝導部材３２に伝導する。 The electronic device 21 generates heat when driven. The heat generated from the electronic device 21 is conducted to the first heat conducting member 31 through the heat transfer sheet 22 . The heat conducted to the first heat conducting member 31 is conducted to the second heat conducting member 32 .

第２熱伝導部材３２に伝導された熱は、貫通孔３４の中の空気に放熱されると共に、第３熱伝導部材３３に伝導する。 The heat conducted to the second heat conducting member 32 is radiated to the air in the through hole 34 and conducted to the third heat conducting member 33 .

第３熱伝導部材３３に伝導された熱は、第３熱伝導部材３３の表面及び裏面から空気に放熱される。 The heat conducted to the third heat-conducting member 33 is radiated to the air from the front and back surfaces of the third heat-conducting member 33 .

これにより、電子機器２１から生じた熱は、第１熱伝導部材３１、第２熱伝導部材３２、及び、第３熱伝導部材３３によって、本体ケース２内の空気中に放熱される。 As a result, the heat generated from the electronic device 21 is radiated into the air inside the main body case 2 by the first thermally conductive member 31 , the second thermally conductive member 32 , and the third thermally conductive member 33 .

加えて、第２熱伝導部材３２の貫通孔３４の中の空気が放熱によって温められるので、煙突効果により、本体ケース２の給気面３から自然給気され、当該貫通孔３４を通って、本体ケース２の排気面４から自然排気される気流が発生する（図面の点線矢印を参照）。この気流は、第３熱伝導部材３３の裏面上を通過する。このように、第１熱伝導部材３１、第２熱伝導部材３２及び第３熱伝導部材３３から空気中に放熱された熱は、気流によって本体ケース２の外に運ばれる。よって、本体ケース２内に生じた熱の排熱能力が高まる。つまり、電子機器２１を収容する電子機器用筐体１内に生じた熱を効率的に放熱できる。 In addition, since the air in the through-holes 34 of the second heat-conducting member 32 is warmed by heat radiation, the air is naturally supplied from the air-supply surface 3 of the main body case 2 due to the chimney effect, and passes through the through-holes 34 to A naturally discharged airflow is generated from the exhaust surface 4 of the main body case 2 (see the dotted arrow in the drawing). This airflow passes over the back surface of the third heat conducting member 33 . In this way, the heat radiated into the air from the first heat conducting member 31, the second heat conducting member 32, and the third heat conducting member 33 is carried out of the main body case 2 by the airflow. Therefore, the heat discharge capability of the heat generated in the main body case 2 is enhanced. In other words, the heat generated in the electronic device housing 1 that accommodates the electronic device 21 can be efficiently dissipated.

次に、本体ケース２内に生じた熱の排熱能力をさらに高める幾つかの熱伝導部材３０の構成例について説明する。 Next, several configuration examples of the heat conducting member 30 that further enhances the ability to dissipate the heat generated inside the main body case 2 will be described.

＜第１の構成例＞
図６は、本実施の形態に係る熱伝導部材３０の第１の構成例を説明するためのＡ－Ａ断面の模式図である。 <First configuration example>
FIG. 6 is a schematic diagram of the AA cross section for explaining the first structural example of the heat conducting member 30 according to the present embodiment.

図６に示すように、第２熱伝導部材３２に形成される貫通孔３４の基板２０に垂直な方向（つまりＹ軸方向）の長さ（以下、貫通孔３４の縦長Ｔと称する）は、第１熱伝導部材３１の板厚ｄ１よりも長くてよい。これにより、第１熱伝導部材３１から第２熱伝導部材３２に伝導した熱が、貫通孔３４の中の空気に十分に放熱される。 As shown in FIG. 6, the length of the through hole 34 formed in the second heat conducting member 32 in the direction perpendicular to the substrate 20 (that is, the Y-axis direction) (hereinafter referred to as the vertical length T of the through hole 34) is It may be longer than the plate thickness d1 of the first heat conducting member 31 . Thereby, the heat conducted from the first heat conducting member 31 to the second heat conducting member 32 is sufficiently radiated to the air inside the through hole 34 .

また、貫通孔３４の縦長Ｔは、貫通孔３４の基板２０に平行な方向の長さ（以下、貫通孔３４の横長Ｗと称する）以上であってよい。例えば、貫通孔３４の縦長Ｔは、貫通孔３４の横長Ｗの１．０～１．５倍であってよい。これにより、貫通孔３４の中の空気の流速が向上し、煙突効果が向上する。よって、本体ケース２内の排熱能力が向上する。 Also, the vertical length T of the through hole 34 may be equal to or greater than the length of the through hole 34 in the direction parallel to the substrate 20 (hereinafter referred to as the horizontal length W of the through hole 34). For example, the vertical length T of the through hole 34 may be 1.0 to 1.5 times the horizontal length W of the through hole 34 . As a result, the flow velocity of the air in the through hole 34 is improved, and the chimney effect is improved. Therefore, the heat exhausting ability in the main body case 2 is improved.

なお、図６では、貫通孔３４の断面形状が方形となっているが、貫通孔３４の断面形状は、図３～図５に示すように、角が丸められた形状であってよい。これは、後述する図７及び図８においても同様である。 Although the cross-sectional shape of the through-hole 34 is rectangular in FIG. 6, the cross-sectional shape of the through-hole 34 may be a shape with rounded corners as shown in FIGS. This also applies to FIGS. 7 and 8, which will be described later.

＜第２の構成例＞
図７は、本実施の形態に係る熱伝導部材３０の第２の構成例を説明するためのＡ－Ａ断面の模式図である。 <Second configuration example>
FIG. 7 is a schematic view of the AA cross section for explaining the second configuration example of the heat conducting member 30 according to the present embodiment.

図７に示すように、貫通孔３４における基板２０に平行な方向において、第３熱伝導部材３３に近い位置の横長Ｗ１の方が、第１熱伝導部材３１に近い位置の横長Ｗ２よりも長くてよい。例えば、図７に示すように、貫通孔３４の横長Ｗは、第１熱伝導部材３１から第３熱伝導部材３３に向かうにつれて広がってよい。これにより、貫通孔３４の中の空気の温度が上昇し、貫通孔３４の中の空気の流速が向上し、煙突効果が向上する。よって、本体ケース２内の排熱能力が向上する。 As shown in FIG. 7, in the through-hole 34 in the direction parallel to the substrate 20, the lateral length W1 near the third heat conducting member 33 is longer than the lateral length W2 near the first heat conducting member 31. you can For example, as shown in FIG. 7 , the lateral length W of the through-hole 34 may widen from the first heat conducting member 31 toward the third heat conducting member 33 . As a result, the temperature of the air in the through holes 34 rises, the flow velocity of the air in the through holes 34 increases, and the chimney effect improves. Therefore, the heat exhausting ability in the main body case 2 is improved.

なお、熱伝導部材３０は、図７に示すように、第２の構成例及び第１の構成例の両方の特徴を含む構成であってもよい。あるいは、熱伝導部材３０は、第２の構成例の特徴のみを含む構成であってもよい。 Note that the heat conducting member 30 may have a configuration including features of both the second configuration example and the first configuration example, as shown in FIG. Alternatively, the heat conducting member 30 may have a configuration including only the features of the second configuration example.

＜第３の構成例＞
図８は、本実施の形態に係る熱伝導部材３０の第３の構成例を説明するためのＡ－Ａ断面の模式図である。 <Third configuration example>
FIG. 8 is a schematic view of the AA cross section for explaining the third configuration example of the heat conducting member 30 according to the present embodiment.

図８に示すように、第３熱伝導部材３３は、給気面３から排気面４に向かう軸（つまりＺ軸）に垂直な方向（つまりＸ軸方向）において、基板２０に沿って（例えば略平行に）第２熱伝導部材３２から離れる方向に延出する第３延出部３５を含む。これにより、第３熱伝導部材３３の表面積が大きくなり、放熱能力が向上する。 As shown in FIG. 8, the third heat conducting member 33 extends along the substrate 20 (for example, and a third extension 35 extending away from the second heat conducting member 32 (substantially parallel). As a result, the surface area of the third heat conducting member 33 is increased, and the heat dissipation capability is improved.

また、図８に示すように、第３熱伝導部材３３の板厚ｄ２は、第１熱伝導部材３１の板厚ｄ１よりも、短くてよい。加えて、第３熱伝導部材３３の表面積は、第１熱伝導部材３１又は第２熱伝導部材３２の表面積よりも、大きくてよい。これにより、熱伝導部材３０の放熱能力が向上すると共に、熱伝導部材３０が軽量になる。 Further, as shown in FIG. 8 , the plate thickness d2 of the third heat conducting member 33 may be shorter than the plate thickness d1 of the first heat conducting member 31 . Additionally, the surface area of the third heat conducting member 33 may be greater than the surface area of the first heat conducting member 31 or the second heat conducting member 32 . This improves the heat dissipation capability of the heat conducting member 30 and reduces the weight of the heat conducting member 30 .

また、図８に示すように、第３熱伝導部材３３の第３延出部３５において、第２熱伝導部材３２から遠い位置の板厚ｄ３の方が、第２熱伝導部材３２に近い位置の板厚ｄ４よりも、短くてよい。例えば、図８に示すように、第３熱伝導部材３３の第３延出部３５の板厚は、第２熱伝導部材３２から離れるにつれて狭まってよい。これにより、熱伝導部材３０がより軽量になる。 Further, as shown in FIG. 8 , in the third extending portion 35 of the third heat conducting member 33 , the plate thickness d3 at the position farther from the second heat conducting member 32 is closer to the second heat conducting member 32 . It may be shorter than the plate thickness d4 of . For example, as shown in FIG. 8 , the plate thickness of the third extending portion 35 of the third heat conducting member 33 may narrow as the distance from the second heat conducting member 32 increases. This makes the heat conducting member 30 lighter.

なお、熱伝導部材３０は、図８に示すように、第３の構成例、第２の構成例及び第１の構成例のすべての特徴を含む構成であってもよい。あるいは、熱伝導部材３０は、第３の構成例、第２の構成例、及び、第１の構成例のうちの２つの特徴を含む構成であってもよい。あるいは、熱伝導部材３０は、第３の構成例の特徴のみを含む構成であってもよい。 Note that the heat conducting member 30 may have a configuration including all the features of the third configuration example, the second configuration example, and the first configuration example, as shown in FIG. Alternatively, the heat conducting member 30 may have a configuration including two features of the third configuration example, the second configuration example, and the first configuration example. Alternatively, the heat conducting member 30 may have a configuration including only the features of the third configuration example.

＜第４の構成例＞
図９は、本実施の形態に係る熱伝導部材３０の第４の構成例を示す斜視図である。図１０は、本実施の形態に係る、第４の構成例の熱伝導部材３０を含む電子機器用筐体１の内部斜視図である。なお、図１０では、説明をわかり易くするために、電子機器用筐体１の本体ケース２及び本体ケース２に収容される部品の一部の描画を省略している。 <Fourth configuration example>
FIG. 9 is a perspective view showing a fourth configuration example of the heat conducting member 30 according to this embodiment. FIG. 10 is an internal perspective view of the electronic device housing 1 including the thermally conductive member 30 of the fourth configuration example according to the present embodiment. It should be noted that in FIG. 10 , in order to make the explanation easier to understand, the main body case 2 of the electronic device housing 1 and part of the components accommodated in the main body case 2 are omitted.

図９及び図１０に示すように、第１熱伝導部材３１は、本体ケース２の排気面４に向けて延出されてよい。以下、第１熱伝導部材３１において、本体ケース２の排気面４に向けて延出された部分を第１延出部３６と称する。例えば、第１熱伝導部材３１における第１延出部３６の排気面４に近い方の辺Ｅ１は、第１熱伝導部材３１の第１延出部３６を除く部分と接触する伝熱シート２２の排気面４に近い方の辺Ｅ２よりも、排気面４に近くてよい。 As shown in FIGS. 9 and 10 , the first heat conducting member 31 may extend toward the exhaust surface 4 of the main body case 2 . Hereinafter, the portion of the first heat conducting member 31 that extends toward the exhaust surface 4 of the main body case 2 will be referred to as a first extending portion 36 . For example, the side E1 of the first heat conducting member 31 closer to the exhaust surface 4 of the first extending portion 36 is in contact with the portion of the first heat conducting member 31 excluding the first extending portion 36 of the heat transfer sheet 22. may be closer to the exhaust surface 4 than the side E2 closer to the exhaust surface 4 of .

加えて、第２熱伝導部材３２は、第１熱伝導部材３１の第１延出部３６の延出に合わせて、排気面４の方に延出してよい。例えば、第２熱伝導部材３２の排気面４に近い方の面Ｆは、伝熱シート２２の排気面４に近い方の辺Ｅ２と、第１熱伝導部材３１における第１延出部３６排気面４に近い方の辺Ｅ１との間に位置する。 In addition, the second heat-conducting member 32 may extend toward the exhaust surface 4 along with the extension of the first extension 36 of the first heat-conducting member 31 . For example, the surface F of the second heat transfer member 32 closer to the exhaust surface 4 is formed by the side E2 of the heat transfer sheet 22 closer to the exhaust surface 4 and the first extension 36 of the first heat transfer member 31. It is positioned between the side E1 closer to the surface 4 and the side E1.

これにより、貫通孔３４の高さ方向（つまりＺ軸方向）の長さ（つまり煙突としての長さ）が長くなるので、貫通孔３４の中の空気の温度が上昇し、貫通孔３４の中の空気の流速が向上し、煙突効果が向上する。よって、本体ケース２内の排熱能力が向上する。 As a result, the length of the through-hole 34 in the height direction (that is, the Z-axis direction) (that is, the length of the chimney) is increased, so that the temperature of the air inside the through-hole 34 rises, and the inside of the through-hole 34 becomes Increases the air velocity of the air and enhances the chimney effect. Therefore, the heat exhausting ability in the main body case 2 is improved.

また、図９及び図１０に示すように、第２熱伝導部材３２は、排気面４に近づくにつれて第３熱伝導部材３３に近づく方向に厚みが小さくなるリブ３７を構成してよい。この第２熱伝導部材３２のリブ３７により、第３熱伝導部材３３の剛性が高まる。 Further, as shown in FIGS. 9 and 10 , the second heat conducting member 32 may form ribs 37 whose thickness decreases in the direction of approaching the third heat conducting member 33 as it approaches the exhaust surface 4 . The ribs 37 of the second heat-conducting member 32 increase the rigidity of the third heat-conducting member 33 .

（本開示のまとめ）
本開示の内容は以下のように表現できる。 (Summary of this disclosure)
The content of the present disclosure can be expressed as follows.

＜表現１＞
電子機器用筐体１は、互いに対向し、空気が通過する穴を有する第１面（給気面３）及び第２面（排気面４）を含んで構成される直方体の本体ケース２と、本体ケース２に収容され、第１面から第２面に向かって延出する基板２０と、基板２０に載置される電子機器２１と、電子機器２１の基板２０と反対の面全体に直接的又は間接的に接触し、電子機器２１が発する熱を伝導する板状の第１熱伝導部材３１と、第１熱伝導部材３１の電子機器２１と接触する面と反対の面に固着し、基板２０に垂直な方向（例えば第１熱伝導部材３１から離れる方向）に所定の厚みを有すると共に第１面から第２面に向かって貫通する少なくとも１つの貫通孔３４を有し、第１熱伝導部材３１から伝導される熱を伝導する第２熱伝導部材３２と、第２熱伝導部材３２の第１熱伝導部材３１と固着する側と反対側に固着し、第１面から第２面に向かって延出し、第２熱伝導部材３２から伝導される熱を伝導する板状の第３熱伝導部材３３と、本体ケース２を所定のレール９に取り付けるための取付部材１０と、を備える。
これにより、電子機器２１から生じた熱は、第１熱伝導部材３１、第２熱伝導部材３２、及び、第３熱伝導部材３３に伝導し、第１熱伝導部材３１、第２熱伝導部材３２、及び、第３熱伝導部材３３から、本体ケース２内の空気に放熱される。加えて、貫通孔３４の中の空気の温度が上昇し、煙突効果により、第１面から給気された空気が貫通孔３４を通って第２面から排気される気流が発生する。よって、本体ケース２内の高温の空気を本体ケース２の外に効率的に排出することができる。すなわち、本体ケース２内の排熱能力が向上し、電子機器２１の冷却能力が高まる。 <Expression 1>
The electronic device housing 1 includes a rectangular parallelepiped body case 2 including a first surface (air supply surface 3) and a second surface (exhaust surface 4) facing each other and having holes through which air passes; A substrate 20 housed in the body case 2 and extending from the first surface to the second surface, an electronic device 21 mounted on the substrate 20, and a surface of the electronic device 21 opposite to the substrate 20. Alternatively, the plate-like first heat-conducting member 31 that indirectly contacts and conducts heat generated by the electronic device 21 is fixed to the surface of the first heat-conducting member 31 opposite to the surface that contacts the electronic device 21, and the substrate 20 (for example, the direction away from the first heat-conducting member 31) and has at least one through-hole 34 penetrating from the first surface to the second surface. A second heat-conducting member 32 that conducts heat conducted from the member 31, and a side of the second heat-conducting member 32 that is fixed to the first heat-conducting member 31 is fixed to the opposite side of the second heat-conducting member 32 from the first surface to the second surface. A plate-shaped third heat conducting member 33 extending toward and conducting heat conducted from the second heat conducting member 32 and a mounting member 10 for mounting the main body case 2 on a predetermined rail 9 are provided.
Thereby, the heat generated from the electronic device 21 is conducted to the first thermally conductive member 31, the second thermally conductive member 32, and the third thermally conductive member 33, and the first thermally conductive member 31 and the second thermally conductive member 32 and the third heat conducting member 33, the heat is radiated to the air inside the main body case 2. As shown in FIG. In addition, the temperature of the air in the through-holes 34 rises, and due to the chimney effect, an airflow is generated in which the air supplied from the first surface passes through the through-holes 34 and is exhausted from the second surface. Therefore, the high-temperature air inside the main body case 2 can be efficiently discharged to the outside of the main body case 2 . That is, the heat exhausting ability within the main body case 2 is improved, and the cooling ability of the electronic device 21 is enhanced.

＜表現２＞
表現１に記載の電子機器用筐体１において、電子機器２１と第１熱伝導部材３１との間に配置され、一方の面が電子機器２１に接触し、他方の面が第１熱伝導部材３１に接触し、電子機器２１が発する熱を第１熱伝導部材３１に伝導し、絶縁性を有する伝熱シート２２、をさらに備えてよい。
これにより、第１熱伝導部材３１と電子機器２１との間に絶縁性を確保すると共に、電子機器２１が発する熱を効率的に第１熱伝導部材３１に伝導できる。 <Expression 2>
In the electronic device housing 1 described in Expression 1, it is arranged between the electronic device 21 and the first thermally conductive member 31, one surface is in contact with the electronic device 21, and the other surface is the first thermally conductive member 31, conducts heat generated by the electronic device 21 to the first heat conducting member 31, and has an insulating property.
This ensures insulation between the first thermally conductive member 31 and the electronic device 21 and efficiently conducts heat generated by the electronic device 21 to the first thermally conductive member 31 .

＜表現３＞
表現２に記載の電子機器用筐体１において、第１熱伝導部材３１は、第２面に向けて延出された第１延出部３６を含み、第１延出部３６の第２面に近い方の辺は、伝熱シート２２の第２面に近い方の辺よりも、第２面に近く、第２熱伝導部材３２の第２面に近い方の面は、伝熱シート２２の第２面に近い方の辺と、第１熱伝導部材３１における第１延出部３６の第２面に近い方の辺との間に位置してよい。
これにより、第２熱伝導部材３２に形成される貫通孔３４の長さが長くなるので、煙突効果がさらに高まる。すなわち、本体ケース２内の排熱能力がさらに向上し、電子機器２１の冷却能力がさらに高まる。 <Expression 3>
In the electronic device housing 1 described in Expression 2, the first thermally conductive member 31 includes a first extension portion 36 extending toward the second surface, and the second surface of the first extension portion 36 is closer to the second surface than the side closer to the second surface of the heat transfer sheet 22, and the surface of the second heat transfer member 32 closer to the second surface is closer to the heat transfer sheet 22 and the side of the first extension portion 36 of the first thermally conductive member 31 closer to the second surface.
As a result, the length of the through hole 34 formed in the second heat conducting member 32 is increased, thereby further enhancing the chimney effect. That is, the heat exhausting ability in the main body case 2 is further improved, and the cooling ability of the electronic device 21 is further improved.

＜表現４＞
表現１から３のいずれか１つに記載の電子機器用筐体１において、貫通孔３４における基板２０に垂直な方向（例えば第１熱伝導部材３１から離れる方向）の長さは、第１熱伝導部材３１の板厚の長さよりも、長くてよい。
これにより、貫通孔３４の中の空気の流速が向上し、煙突効果がさらに高まる。すなわち、本体ケース２内の排熱能力がさらに向上し、電子機器２１の冷却能力がさらに高まる。 <Expression 4>
In the electronic device housing 1 according to any one of Expressions 1 to 3, the length of the through hole 34 in the direction perpendicular to the substrate 20 (for example, the direction away from the first heat conduction member 31) is It may be longer than the thickness of the conductive member 31 .
As a result, the flow velocity of the air in the through hole 34 is improved, further enhancing the chimney effect. That is, the heat exhausting ability in the main body case 2 is further improved, and the cooling ability of the electronic device 21 is further improved.

＜表現５＞
表現１から４のいずれか１つに記載の電子機器用筐体１において、貫通孔３４における、基板２０に垂直な方向（例えば第１熱伝導部材３１から離れる方向）の長さ（縦長Ｔ）は、基板２０に平行な方向の長さ（横長Ｗ）よりも、長くてよい。
これにより、貫通孔３４の中の空気の流速が向上し、煙突効果がさらに高まる。すなわち、本体ケース２内の排熱能力がさらに向上し、電子機器２１の冷却能力がさらに高まる。 <Expression 5>
In the electronic device housing 1 according to any one of Expressions 1 to 4, the length (longitudinal length T) of the through hole 34 in the direction perpendicular to the substrate 20 (for example, the direction away from the first heat conducting member 31) may be longer than the length in the direction parallel to the substrate 20 (horizontal length W).
As a result, the flow velocity of the air in the through hole 34 is improved, further enhancing the chimney effect. That is, the heat exhausting ability in the main body case 2 is further improved, and the cooling ability of the electronic device 21 is further improved.

＜表現６＞
表現１から５のいずれか１つに記載の電子機器用筐体１において、貫通孔３４における基板２０に平行な方向（例えば第１熱伝導部材３１に沿う方向）において、第３熱伝導部材３３に近い位置の長さ（横長Ｗ１）の方が、第１熱伝導部材３１に近い位置の長さ（横長Ｗ２）よりも、長くてよい。
これにより、貫通孔３４の中の空気の流速が向上し、煙突効果がさらに高まる。すなわち、本体ケース２内の排熱能力がさらに向上し、電子機器２１の冷却能力がさらに高まる。 <Expression 6>
In the electronic device housing 1 according to any one of Expressions 1 to 5, in a direction parallel to the substrate 20 in the through hole 34 (for example, a direction along the first heat conduction member 31), the third heat conduction member 33 The length (horizontal length W1) at the position closer to the first heat conducting member 31 (horizontal length W2) may be longer than the length (horizontal length W2) at the position closer to the first heat conducting member 31 .
As a result, the flow velocity of the air in the through hole 34 is improved, further enhancing the chimney effect. That is, the heat exhausting ability in the main body case 2 is further improved, and the cooling ability of the electronic device 21 is further improved.

＜表現７＞
表現１から６のいずれか１つに記載の電子機器用筐体１において、第３熱伝導部材３３は、第１面（給気面３）から第２面（排気面４）に向かう軸に垂直な方向において、基板２０に沿って第２熱伝導部材３２から離れる方向に延出する第３延出部３５を含んでよい。
これにより、第３熱伝導部材３３の表面積が大きくなり、第３熱伝導部材３３の放熱能力が高まる。 <Expression 7>
In the electronic device housing 1 according to any one of Expressions 1 to 6, the third heat-conducting member 33 is axially directed from the first surface (air supply surface 3) to the second surface (exhaust surface 4). A third extension 35 may be included that extends away from the second thermally conductive member 32 along the substrate 20 in the vertical direction.
As a result, the surface area of the third heat conducting member 33 is increased, and the heat dissipation capability of the third heat conducting member 33 is enhanced.

＜表現８＞
表現７に記載の電子機器用筐体１において、第３延出部３５における、第２熱伝導部材３２から遠い位置の板厚の方が、第２熱伝導部材３２に近い位置の板厚よりも、短くてよい。
これにより、第３熱伝導部材３３を軽量化できる。 <Expression 8>
In the electronic device housing 1 according to expression 7, the plate thickness of the third extension 35 at a position farther from the second thermally conductive member 32 is greater than the plate thickness at a position closer to the second thermally conductive member 32 is also short.
Thereby, the weight of the third heat conducting member 33 can be reduced.

以上、添付図面を参照しながら実施の形態について説明したが、本開示はかかる例に限定されない。当業者であれば、特許請求の範囲に記載された範疇内において、各種の変更例、修正例、置換例、付加例、削除例、均等例に想到し得ることは明らかであり、それらについても本開示の技術的範囲に属すると了解される。また、発明の趣旨を逸脱しない範囲において、上述した実施の形態における各構成要素を任意に組み合わせてもよい。 Although the embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is obvious that a person skilled in the art can conceive of various modifications, modifications, substitutions, additions, deletions, and equivalents within the scope of the claims. It is understood that it belongs to the technical scope of the present disclosure. Also, the components in the above-described embodiments may be combined arbitrarily without departing from the spirit of the invention.

本開示は、電子機器を収容する筐体内に生じる熱を効率的に排熱できるので、筐体内の温度上昇の抑制に有用である。 INDUSTRIAL APPLICABILITY The present disclosure can efficiently exhaust heat generated within a housing that accommodates an electronic device, and is therefore useful for suppressing temperature rise within the housing.

１電子機器用筐体
２本体ケース
３給気面
４排気面
５前面
６背面
７左側面
８右側面
９レール
１０取付部材
２０基板
２１電子機器
２２伝熱シート
３０熱伝導部材
３１第１熱伝導部材
３２第２熱伝導部材
３３第３熱伝導部材
３４貫通孔
３５第３延出部
３６第１延出部
３７リブ 1 electronic device housing 2 main body case 3 air supply surface 4 exhaust surface 5 front surface 6 rear surface 7 left side surface 8 right side surface 9 rail 10 mounting member 20 board 21 electronic device 22 heat transfer sheet 30 heat conduction member 31 first heat conduction member 32 Second heat conducting member 33 Third heat conducting member 34 Penetration hole 35 Third extension 36 First extension 37 Rib

Claims

互いに対向し、空気が通過する穴を有する第１面及び第２面を含んで構成される直方体の本体ケースと、
前記本体ケースに収容され、前記第１面から前記第２面に向かって延出する基板と、
前記基板に載置される電子機器と、
前記電子機器の前記基板と反対の面全体に直接的又は間接的に接触し、前記電子機器が発する熱を伝導する板状の第１熱伝導部材と、
前記第１熱伝導部材の前記電子機器と接触する面と反対の面に固着し、前記基板に垂直な方向に所定の厚みを有すると共に、前記第１面から前記第２面に向かって貫通する少なくとも１つの貫通孔を有し、前記第１熱伝導部材から伝導される熱を伝導する第２熱伝導部材と、
前記第２熱伝導部材の前記第１熱伝導部材と固着する側と反対側に固着し、前記第１面から前記第２面に向かって延出し、前記第２熱伝導部材から伝導される熱を伝導する板状の第３熱伝導部材と、
前記本体ケースを所定のレールに取り付けるための取付部材と、を備える、
電子機器用筐体。 a rectangular parallelepiped body case including a first surface and a second surface facing each other and having holes through which air passes;
a substrate housed in the body case and extending from the first surface toward the second surface;
an electronic device mounted on the substrate;
a plate-shaped first heat-conducting member that directly or indirectly contacts the entire surface of the electronic device opposite to the substrate and conducts heat generated by the electronic device;
It is fixed to the surface of the first thermally conductive member opposite to the surface in contact with the electronic device, has a predetermined thickness in a direction perpendicular to the substrate, and penetrates from the first surface to the second surface. a second thermally conductive member having at least one through hole and conducting heat conducted from the first thermally conductive member;
fixed to the side opposite to the side fixed to the first thermally conductive member of the second thermally conductive member, extending from the first surface toward the second surface, and conducting heat from the second thermally conductive member; a plate-shaped third heat-conducting member that conducts
a mounting member for mounting the main body case to a predetermined rail,
Enclosure for electronics.

前記電子機器と前記第１熱伝導部材との間に配置され、一方の面が前記電子機器に接触し、他方の面が前記第１熱伝導部材に接触し、前記電子機器が発する熱を前記第１熱伝導部材に伝導し、絶縁性を有する伝熱シート、をさらに備える、
請求項１に記載の電子機器用筐体。 is disposed between the electronic device and the first thermally conductive member, one surface is in contact with the electronic device and the other surface is in contact with the first thermally conductive member, and the heat generated by the electronic device is transferred to the Further comprising a heat transfer sheet that conducts to the first heat transfer member and has insulation,
The housing for electronic equipment according to claim 1 .

前記第１熱伝導部材は、前記第２面に向けて延出された第１延出部を含み、前記第１延出部の前記第２面に近い方の辺は、前記伝熱シートの前記第２面に近い方の辺よりも、前記第２面に近く、
前記第２熱伝導部材の前記第２面に近い方の面は、前記伝熱シートの前記第２面に近い方の辺と、前記第１熱伝導部材における前記第１延出部の前記第２面に近い方の辺との間に位置する、
請求項２に記載の電子機器用筐体。 The first thermally conductive member includes a first extension portion extending toward the second surface, and a side of the first extension portion closer to the second surface is the heat transfer sheet. closer to the second surface than the side closer to the second surface,
The side of the heat transfer sheet closer to the second surface and the side of the heat transfer sheet closer to the second surface of the second heat conduction member and the first extension portion of the first heat conduction member located between the side closer to the two faces,
The housing for electronic equipment according to claim 2 .

前記貫通孔の前記基板に垂直な方向の長さは、前記第１熱伝導部材の板厚の長さよりも、長い、
請求項１から３のいずれか１項に記載の電子機器用筐体。 the length of the through-hole in the direction perpendicular to the substrate is longer than the length of the plate thickness of the first thermally conductive member;
The housing for electronic equipment according to any one of claims 1 to 3.

前記貫通孔において、前記基板に垂直な方向の長さは、前記基板に平行な方向の長さよりも、長い、
請求項１から４のいずれか１項に記載の電子機器用筐体。 In the through hole, the length in the direction perpendicular to the substrate is longer than the length in the direction parallel to the substrate,
The housing for electronic equipment according to any one of claims 1 to 4.

前記貫通孔における前記基板に平行な方向において、前記第３熱伝導部材に近い位置の長さの方が、前記第１熱伝導部材に近い位置の長さよりも、長い、
請求項１から５のいずれか１項に記載の電子機器用筐体。 In the direction parallel to the substrate in the through hole, the length of the position closer to the third heat conduction member is longer than the length of the position near the first heat conduction member,
The housing for electronic equipment according to any one of claims 1 to 5.

前記第３熱伝導部材は、前記第１面から前記第２面に向かう軸に垂直な方向において、前記基板に沿って前記第２熱伝導部材から離れる方向に延出する第３延出部を含む、
請求項１から６のいずれか１項に記載の電子機器用筐体。 The third heat-conducting member has a third extension that extends away from the second heat-conducting member along the substrate in a direction perpendicular to an axis extending from the first surface to the second surface. include,
The housing for electronic equipment according to any one of claims 1 to 6.

前記第３延出部において、前記第２熱伝導部材から遠い位置の板厚の方が、前記第２熱伝導部材に近い位置の板厚よりも、短い、
請求項７に記載の電子機器用筐体。 In the third extending portion, the plate thickness at a position farther from the second heat conducting member is shorter than the plate thickness at a position closer to the second heat conducting member,
The housing for electronic equipment according to claim 7 .