JP2022545365A - オプトエレクトロニクス素子 - Google Patents
オプトエレクトロニクス素子 Download PDFInfo
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- 230000005693 optoelectronics Effects 0.000 title claims abstract description 75
- 238000006243 chemical reaction Methods 0.000 claims abstract description 107
- 239000004065 semiconductor Substances 0.000 claims abstract description 81
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 27
- 238000010168 coupling process Methods 0.000 claims abstract description 11
- 238000005859 coupling reaction Methods 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims description 23
- 239000011248 coating agent Substances 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 11
- 238000009826 distribution Methods 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000002019 doping agent Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000010287 polarization Effects 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 230000001427 coherent effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/0607—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature
- H01S5/0608—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by light, e.g. optical switch
- H01S5/0609—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by light, e.g. optical switch acting on an absorbing region, e.g. wavelength convertors
- H01S5/0611—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by light, e.g. optical switch acting on an absorbing region, e.g. wavelength convertors wavelength convertors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0087—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for illuminating phosphorescent or fluorescent materials, e.g. using optical arrangements specifically adapted for guiding or shaping laser beams illuminating these materials
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/16—Laser light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/176—Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
- F21S41/24—Light guides
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
- F21W2102/10—Arrangement or contour of the emitted light
- F21W2102/13—Arrangement or contour of the emitted light for high-beam region or low-beam region
- F21W2102/135—Arrangement or contour of the emitted light for high-beam region or low-beam region the light having cut-off lines, i.e. clear borderlines between emitted regions and dark regions
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
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- H—ELECTRICITY
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- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4056—Edge-emitting structures emitting light in more than one direction
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
-第1波長範囲の電磁ビームを放射するように構成された活性領域を有する少なくとも1つの半導体エミッタと、
-出力結合面、およびこれに対して側方に配置されておりかつこれと交わる方向に配向された側面を有する少なくとも1つの波長変換プレートと、
-半導体エミッタおよび波長変換プレートが配置されている支持体と、を有し、
-出力結合面は、支持体とは反対側を向いており、
-半導体エミッタは、電磁ビームにより、波長変換プレートを側面において照射するように構成されており、
-波長変換プレートは、第1波長範囲のビームの少なくとも一部と、第2波長範囲の変換されたビームとを含む混合ビームを出力結合面から放射するように構成されている。
10 半導体エミッタ
100 活性領域
20 波長変換プレート
20A 出力結合面
20B 側面
201 部分領域
30 支持体
301 補助支持体
40 導光体
50 保護層
60 反射増大コーティング
70 光学コーティング
Claims (16)
- オプトエレクトロニクス素子(1)であって、前記オプトエレクトロニクス素子(1)は、
第1波長範囲の電磁ビームを放射するように構成された活性領域(100)を有する少なくとも1つの半導体エミッタ(10)と、
出力結合面(20A)、および前記出力結合面(20A)に対して側方に配置されておりかつ前記出力結合面(20A)と交わる方向に配向された側面(20B)を有する少なくとも1つの波長変換プレート(20)と、
前記半導体エミッタ(10)および前記波長変換プレート(20)が配置されている支持体(30)と、を有し、
前記出力結合面(20A)は、前記支持体(30)とは反対側を向いており、
前記半導体エミッタ(10)は、電磁ビームにより、前記波長変換プレート(20)を前記側面(20B)において照射するように構成されており、
前記波長変換プレート(20)は、前記第1波長範囲の前記ビームの少なくとも一部と、第2波長範囲の変換されたビームとを含む混合ビームを前記出力結合面(20A)から放射するように構成されている、オプトエレクトロニクス素子(1)。 - 前記半導体エミッタ(10)は、レーザダイオードである、請求項1記載のオプトエレクトロニクス素子(1)。
- 前記半導体エミッタ(10)は、放射楕円錐を有し、前記放射楕円錐の断面は、前記放射楕円錐の軸線に対して垂直方向に楕円形をしており、前記半導体エミッタ(10)は、楕円の長軸が、前記側面(20B)の主延在方向に対して平行に配向されるように前記支持体(30)に配置されている、請求項1または2記載のオプトエレクトロニクス素子(1)。
- 前記側面(20B)は、前記放射楕円錐の前記軸線に対してブリュースター角で配向されている、請求項3記載のオプトエレクトロニクス素子(1)。
- 前記側面(20B)には、光学コーティング(70)が被着されている、請求項3または4記載のオプトエレクトロニクス素子(1)。
- 前記半導体エミッタ(10)と前記波長変換プレート(20)との間に、前記半導体エミッタ(10)の前記ビームを前記波長変換プレート(20)に導く導光体が配置されている、請求項1から5までのいずれ1項記載のオプトエレクトロニクス素子(1)。
- 前記側面(20B)を照射する少なくとも2つの半導体エミッタ(10)が設けられている、請求項1から6までのいずれか1項記載のオプトエレクトロニクス素子(1)。
- 少なくとも2つの半導体エミッタ(10)の前記放射楕円錐は、少なくとも部分的に重なり合っている、請求項7記載のオプトエレクトロニクス素子(1)。
- 前記波長変換プレート(20)は、前記波長変換プレート(20)の放射特性に所期のように影響を及ぼすための少なくとも1つの吸収性または反射性を具備する部分領域(201)を有する、請求項1から8までのいずれか1項記載のオプトエレクトロニクス素子(1)。
- 前記波長変換プレート(20)は、変換粒子および散乱粒子を有する、請求項1から9までのいずれか1項記載のオプトエレクトロニクス素子(1)。
- 前記波長変換プレート(20)の前記出力結合面(20A)にわたる前記混合ビームの所望の強度分布は、前記波長変換プレート(20)における散乱作用の変化によって調整される、請求項10記載のオプトエレクトロニクス素子(1)。
- 前記波長変換プレート(20)の前記出力結合面(20A)にわたる前記混合ビームの所望の強度分布および/または色分布は、前記波長変換プレート(20)における変換作用の変化によって調整される、請求項10または11記載のオプトエレクトロニクス素子(1)。
- 前記波長変換プレート(20)は、両端の値を含めて3μm~500μm、好ましくは両端の値を含めて70μm~150μmの厚さを有する、請求項1から12までのいずれか1項記載のオプトエレクトロニクス素子(1)。
- 前記半導体エミッタ(10)の前記第1波長範囲は、両端の値を含めて380nm~500nmの範囲、好ましくは両端の値を含めて440nm~460nmの範囲を含む、請求項1から13までのいずれか1項記載のオプトエレクトロニクス素子(1)。
- 前記支持体(30)は、次の材料、すなわち、窒化アルミニウム、金属および/または炭化ケイ素のうちの1つによって形成される、請求項1から14までのいずれか1項記載のオプトエレクトロニクス素子(1)。
- 前記支持体(30)と前記波長変換プレート(20)との間に、前記波長変換プレート(20)によって放射されるビームに対する反射増大コーティング(60)が配置される、請求項1から15までのいずれか1項記載のオプトエレクトロニクス素子(1)。
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Application Number | Priority Date | Filing Date | Title |
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DE102019121896.9A DE102019121896A1 (de) | 2019-08-14 | 2019-08-14 | Optoelektronisches bauelement |
DE102019121896.9 | 2019-08-14 | ||
PCT/EP2020/072292 WO2021028352A1 (de) | 2019-08-14 | 2020-08-07 | Optoelektronisches bauelement |
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JP2022545365A true JP2022545365A (ja) | 2022-10-27 |
JP7331244B2 JP7331244B2 (ja) | 2023-08-22 |
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WO2021028352A1 (de) | 2021-02-18 |
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