JP2022519055A - 耐衝撃性改良射出成形ポリアミド - Google Patents
耐衝撃性改良射出成形ポリアミド Download PDFInfo
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- JP2022519055A JP2022519055A JP2021544324A JP2021544324A JP2022519055A JP 2022519055 A JP2022519055 A JP 2022519055A JP 2021544324 A JP2021544324 A JP 2021544324A JP 2021544324 A JP2021544324 A JP 2021544324A JP 2022519055 A JP2022519055 A JP 2022519055A
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- polyamide
- polyamide composition
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- 229920002647 polyamide Polymers 0.000 title claims abstract description 311
- 239000004952 Polyamide Substances 0.000 title claims abstract description 308
- 238000002347 injection Methods 0.000 title description 2
- 239000007924 injection Substances 0.000 title description 2
- 239000000203 mixture Substances 0.000 claims abstract description 216
- 229920000642 polymer Polymers 0.000 claims abstract description 146
- 239000003381 stabilizer Substances 0.000 claims abstract description 99
- 239000003365 glass fiber Substances 0.000 claims abstract description 63
- 239000000155 melt Substances 0.000 claims abstract description 47
- 239000012760 heat stabilizer Substances 0.000 claims description 43
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 38
- 239000003795 chemical substances by application Substances 0.000 claims description 27
- 239000006229 carbon black Substances 0.000 claims description 20
- 150000001336 alkenes Chemical class 0.000 claims description 19
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 15
- 235000021355 Stearic acid Nutrition 0.000 claims description 14
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 14
- 239000008117 stearic acid Substances 0.000 claims description 14
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 13
- 150000004671 saturated fatty acids Chemical class 0.000 claims description 12
- 230000009477 glass transition Effects 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical class [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 8
- 235000003441 saturated fatty acids Nutrition 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical class C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical class CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 3
- 229920006397 acrylic thermoplastic Chemical class 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Chemical class 0.000 claims description 3
- 230000001747 exhibiting effect Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 abstract 1
- -1 stearic acid Chemical class 0.000 description 34
- 229920002292 Nylon 6 Polymers 0.000 description 33
- 239000000463 material Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 14
- 238000005452 bending Methods 0.000 description 12
- 150000003839 salts Chemical class 0.000 description 11
- 238000010561 standard procedure Methods 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 8
- 238000009472 formulation Methods 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 8
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 8
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 8
- 239000007983 Tris buffer Substances 0.000 description 7
- 230000006872 improvement Effects 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 229920006119 nylon 10T Polymers 0.000 description 6
- 235000021357 Behenic acid Nutrition 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229940116226 behenic acid Drugs 0.000 description 5
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011152 fibreglass Substances 0.000 description 4
- 235000019253 formic acid Nutrition 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000011885 synergistic combination Substances 0.000 description 4
- 239000004594 Masterbatch (MB) Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- HEAMQYHBJQWOSS-UHFFFAOYSA-N ethene;oct-1-ene Chemical class C=C.CCCCCCC=C HEAMQYHBJQWOSS-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229920006131 poly(hexamethylene isophthalamide-co-terephthalamide) Polymers 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- GPOGLVDBOFRHDV-UHFFFAOYSA-N (2-nonylphenyl) dihydrogen phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(O)O GPOGLVDBOFRHDV-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- GXURZKWLMYOCDX-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.OCC(CO)(CO)CO GXURZKWLMYOCDX-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- CARJPEPCULYFFP-UHFFFAOYSA-N 5-Sulfo-1,3-benzenedicarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(S(O)(=O)=O)=C1 CARJPEPCULYFFP-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 239000004970 Chain extender Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 229920006153 PA4T Polymers 0.000 description 2
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 229920003231 aliphatic polyamide Polymers 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 230000000181 anti-adherent effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 2
- 239000008116 calcium stearate Substances 0.000 description 2
- 235000013539 calcium stearate Nutrition 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical group NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
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- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 235000002639 sodium chloride Nutrition 0.000 description 2
- ZBFCSRYSLRPAOY-UHFFFAOYSA-M sodium;hydroxy(phenyl)methanesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(O)C1=CC=CC=C1 ZBFCSRYSLRPAOY-UHFFFAOYSA-M 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
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- 239000004753 textile Substances 0.000 description 2
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- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- ZDPHROOEEOARMN-UHFFFAOYSA-N undecanoic acid Chemical compound CCCCCCCCCCC(O)=O ZDPHROOEEOARMN-UHFFFAOYSA-N 0.000 description 2
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 2
- GGISPEWAEPDJDE-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) 2-phenylacetate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CC1=CC=CC=C1 GGISPEWAEPDJDE-UHFFFAOYSA-N 0.000 description 1
- OKRSVCKJPLEHEY-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) acetate Chemical compound CC(=O)OC1CC(C)(C)NC(C)(C)C1 OKRSVCKJPLEHEY-UHFFFAOYSA-N 0.000 description 1
- YEYCMBWKTZNPDH-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) benzoate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=CC=C1 YEYCMBWKTZNPDH-UHFFFAOYSA-N 0.000 description 1
- GSTKDOVQEARANU-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) n-phenylcarbamate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)NC1=CC=CC=C1 GSTKDOVQEARANU-UHFFFAOYSA-N 0.000 description 1
- JMUOXOJMXILBTE-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 JMUOXOJMXILBTE-UHFFFAOYSA-N 0.000 description 1
- BUFCQVRLKYIQJP-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) prop-2-enoate Chemical compound CC1(C)CC(OC(=O)C=C)CC(C)(C)N1 BUFCQVRLKYIQJP-UHFFFAOYSA-N 0.000 description 1
- BRTNWPWZQXHESZ-UHFFFAOYSA-N 1,1'-biphenyl;phosphorous acid Chemical compound OP(O)O.C1=CC=CC=C1C1=CC=CC=C1.C1=CC=CC=C1C1=CC=CC=C1.C1=CC=CC=C1C1=CC=CC=C1 BRTNWPWZQXHESZ-UHFFFAOYSA-N 0.000 description 1
- NWHNXXMYEICZAT-UHFFFAOYSA-N 1,2,2,6,6-pentamethylpiperidin-4-ol Chemical compound CN1C(C)(C)CC(O)CC1(C)C NWHNXXMYEICZAT-UHFFFAOYSA-N 0.000 description 1
- FIDRAVVQGKNYQK-UHFFFAOYSA-N 1,2,3,4-tetrahydrotriazine Chemical compound C1NNNC=C1 FIDRAVVQGKNYQK-UHFFFAOYSA-N 0.000 description 1
- QFMZQPDHXULLKC-UHFFFAOYSA-N 1,2-bis(diphenylphosphino)ethane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCP(C=1C=CC=CC=1)C1=CC=CC=C1 QFMZQPDHXULLKC-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- ASHKHZIFMXDITF-UHFFFAOYSA-N 1-(2,6-ditert-butyl-4-methylphenyl)-1-(2,4-ditert-butylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)C)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C ASHKHZIFMXDITF-UHFFFAOYSA-N 0.000 description 1
- OWRRYAWDLVMPFD-UHFFFAOYSA-N 1-(2-cyclohexylphenyl)-1-(2,6-ditert-butyl-4-methylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)C)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)C1CCCCC1 OWRRYAWDLVMPFD-UHFFFAOYSA-N 0.000 description 1
- UYQYZZUTISCQHW-UHFFFAOYSA-N 1-[2,4-bis(2,4,4-trimethylpentan-2-yl)phenyl]-1-(2,6-ditert-butyl-4-methylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)C)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)CC(C)(C)C)C(C)(C)CC(C)(C)C UYQYZZUTISCQHW-UHFFFAOYSA-N 0.000 description 1
- XQMHLQCMMWBAPP-UHFFFAOYSA-N 2,2,6,6-tetramethyl-4-[2-(2,2,6,6-tetramethylpiperidin-4-yl)oxyethoxy]piperidine Chemical compound C1C(C)(C)NC(C)(C)CC1OCCOC1CC(C)(C)NC(C)(C)C1 XQMHLQCMMWBAPP-UHFFFAOYSA-N 0.000 description 1
- BWJKLDGAAPQXGO-UHFFFAOYSA-N 2,2,6,6-tetramethyl-4-octadecoxypiperidine Chemical compound CCCCCCCCCCCCCCCCCCOC1CC(C)(C)NC(C)(C)C1 BWJKLDGAAPQXGO-UHFFFAOYSA-N 0.000 description 1
- IUKIOUVQRQCBOX-UHFFFAOYSA-N 2,2,6,6-tetramethyl-4-phenoxypiperidine Chemical compound C1C(C)(C)NC(C)(C)CC1OC1=CC=CC=C1 IUKIOUVQRQCBOX-UHFFFAOYSA-N 0.000 description 1
- WDYYJEFALNLPOT-UHFFFAOYSA-N 2,2,6,6-tetramethyl-4-phenylmethoxypiperidine Chemical compound C1C(C)(C)NC(C)(C)CC1OCC1=CC=CC=C1 WDYYJEFALNLPOT-UHFFFAOYSA-N 0.000 description 1
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 1
- MKTJWUMCSNLAOX-UHFFFAOYSA-N 2,2-bis(2,2,6,6-tetramethylpiperidin-4-yl)propanedioic acid Chemical compound C1C(C)(C)NC(C)(C)CC1C(C(O)=O)(C(O)=O)C1CC(C)(C)NC(C)(C)C1 MKTJWUMCSNLAOX-UHFFFAOYSA-N 0.000 description 1
- ACHSSZBFQZOESE-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)-1,1-bis[4-methyl-2,6-bis(2,4,4-trimethylpentan-2-yl)phenyl]propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(CC(C)(C)C)C1=C(C(=CC(=C1)C)C(C)(C)CC(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1C(C)(C)CC(C)(C)C)C)C(C)(C)CC(C)(C)C ACHSSZBFQZOESE-UHFFFAOYSA-N 0.000 description 1
- QWXSEJUVCWFLON-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)-1-[4-methyl-2,6-bis(2-methylbutan-2-yl)phenyl]-1-phenylpropane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(CC)C1=C(C(=CC(=C1)C)C(C)(C)CC)C(O)(C(CO)(CO)CO)C1=CC=CC=C1 QWXSEJUVCWFLON-UHFFFAOYSA-N 0.000 description 1
- IXNXCCLDPLCSJK-UHFFFAOYSA-N 2,4,6-tris(2,2,6,6-tetramethylpiperidin-4-yl)benzene-1,3,5-tricarboxylic acid Chemical compound C1C(C)(C)NC(C)(C)CC1C1=C(C(O)=O)C(C2CC(C)(C)NC(C)(C)C2)=C(C(O)=O)C(C2CC(C)(C)NC(C)(C)C2)=C1C(O)=O IXNXCCLDPLCSJK-UHFFFAOYSA-N 0.000 description 1
- DMHHYBUEZRZGDK-UHFFFAOYSA-N 2-(3,5-ditert-butyl-4-hydroxyphenyl)propanamide Chemical compound NC(=O)C(C)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 DMHHYBUEZRZGDK-UHFFFAOYSA-N 0.000 description 1
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- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- OGVJEUDMQQIAPV-UHFFFAOYSA-N diphenyl tridecyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCCCCCCC)OC1=CC=CC=C1 OGVJEUDMQQIAPV-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
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- 239000000446 fuel Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
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- 230000000977 initiatory effect Effects 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000006166 lysate Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
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- 229910052618 mica group Inorganic materials 0.000 description 1
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- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
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- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- AXRSHKZFNKUGQB-UHFFFAOYSA-N octyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC)OC1=CC=CC=C1 AXRSHKZFNKUGQB-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- URLKBWYHVLBVBO-UHFFFAOYSA-N p-dimethylbenzene Natural products CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006139 poly(hexamethylene adipamide-co-hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920006117 poly(hexamethylene terephthalamide)-co- polycaprolactam Polymers 0.000 description 1
- 229920006181 poly(hexamethylene terephthalamide)-co-poly(hexamethylene dodecanediamide) Polymers 0.000 description 1
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 150000003385 sodium Chemical class 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 235000019794 sodium silicate Nutrition 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- BWPNIANVWARHPR-UHFFFAOYSA-N tridecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCOP(O)O BWPNIANVWARHPR-UHFFFAOYSA-N 0.000 description 1
- IVIIAEVMQHEPAY-UHFFFAOYSA-N tridodecyl phosphite Chemical compound CCCCCCCCCCCCOP(OCCCCCCCCCCCC)OCCCCCCCCCCCC IVIIAEVMQHEPAY-UHFFFAOYSA-N 0.000 description 1
- SUXIKHBBPQWLHO-UHFFFAOYSA-N trihydroxy-(8-methylnonyl)-(8-methyl-1-phenylnonyl)-lambda5-phosphane Chemical compound CC(C)CCCCCCCP(O)(O)(O)C(CCCCCCC(C)C)C1=CC=CC=C1 SUXIKHBBPQWLHO-UHFFFAOYSA-N 0.000 description 1
- QOQNJVLFFRMJTQ-UHFFFAOYSA-N trioctyl phosphite Chemical compound CCCCCCCCOP(OCCCCCCCC)OCCCCCCCC QOQNJVLFFRMJTQ-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- LTXMJHWSYUANCC-UHFFFAOYSA-N tris(2,4-ditert-butyl-5-methylphenyl) phosphite Chemical compound C1=C(C(C)(C)C)C(C)=CC(OP(OC=2C(=CC(=C(C)C=2)C(C)(C)C)C(C)(C)C)OC=2C(=CC(=C(C)C=2)C(C)(C)C)C(C)(C)C)=C1C(C)(C)C LTXMJHWSYUANCC-UHFFFAOYSA-N 0.000 description 1
- URRFGQHFJDWCFM-UHFFFAOYSA-N tris(2-butoxyethyl) phosphite Chemical compound CCCCOCCOP(OCCOCCCC)OCCOCCCC URRFGQHFJDWCFM-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- LUUMBHMWFNNZPH-UHFFFAOYSA-N tris(3,5-ditert-butyl-4-hydroxyphenyl) phosphite Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(OP(OC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)OC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 LUUMBHMWFNNZPH-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3462—Six-membered rings
- C08K5/3465—Six-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2077/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/06—Polymer mixtures characterised by other features having improved processability or containing aids for moulding methods
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L2205/08—Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers
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- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本出願は2019年1月31日に出願された米国仮特許出願第62/799,490号への優先権およびその出願利益を主張し、その全体は参照により本明細書に組み込まれる。
ポリアミドポリマー
[0016]開示された組成物のポリアミドは、広く変動することができ、1種のポリアミドポリマーまたは2種以上のポリアミドを含むことができる。例示的なポリアミドおよびポリアミド組成物は、Kirk-Othmer,Encyclopedia of Chemical Technology,Vol.18,pp.328-371(Wiley 1982)に記述されており、その開示は、参照により組み込まれる。手短に言えば、ポリアミドは、ポリマー主鎖の必須パーツとしてアミド反復基を含有する製品である。直鎖ポリアミドは特に興味深く、当該技術分野で周知のように、二官能性モノマーの縮合から形成され得る。ポリアミドは、しばしばナイロンと呼ばれる。特定のポリアミドポリマーおよびコポリマーならびにそれらの調製物は、例えば、米国特許第2,071,250号;米国特許第2,071,251号;米国特許第2,130,523号;米国特許第2,130,948号;米国特許第2,241,322号;米国特許第2,312,966号;米国特許第2,512,606号;米国特許第3,236,914号;米国特許第3,472,916号;米国特許第3,373,223号;米国特許第3,393,210号;米国特許第3,984,497号;米国特許第3,546,319号;米国特許第4,031,164号;米国特許第4,320,213号;米国特許第4,346,200号;米国特許第4,713,415号;米国特許第4,760,129号;米国特許第4,981,906号;米国特許第5,504,185号;米国特許第5,543,495号;米国特許第5,698,658号;米国特許第6,011,134号;米国特許第6,136,947号;米国特許第6,169,162号;米国特許第6,197,855号;米国特許第7,138,482号;米国特許第7,381,788号;および米国特許第8,759,475号に記述されており、これらのそれぞれは、すべての目的のために、参照によりすべてが組み込まれる。
[0032]ポリアミド組成物は、強化充填剤、例えば、ガラス繊維を含む。ガラス繊維は、ソーダ石灰ケイ酸塩、ケイ酸ジルコニウム、ホウケイ酸カルシウム、アルミナ-ホウケイ酸カルシウム(alumina-calcium borosilicate)、アルミノケイ酸カルシウム、アルミノケイ酸マグネシウム、またはそれらの組み合わせを含むことができる。ガラス繊維は、長繊維、例えば、6mm超、短繊維、例えば、6mm未満、またはそれらの組み合わせを含むことができる。ガラス繊維は、粉砕され得る。
[0035]本明細書に開示されるポリアミド組成物は、1種または複数の耐衝撃性改良剤を含む。本発明者らは、これらの耐衝撃性改良剤は有利にも、組成物の1種または複数のポリアミドポリマーと良好な相互作用および適合性を有し、組成物の1種または複数のポリアミドポリマーの中に分散を有するように選択される、エラストマー材料またはゴム状材料であり得ることを見出した。耐衝撃性改良剤は、アクリレート-ブタジエン-スチレンまたはメチルメタクリレート-ブタジエン-スチレンなどのスチレンコポリマーを含むことができる。耐衝撃性改良剤は、アクリルポリマーまたは塩素化ポリエチレンなどのポリエチレンポリマーを含むことができる。一部の実施形態では、耐衝撃性改良剤は、エチレン-オクテン-コポリマーを含む。一部の場合では、(任意選択で、開示された量および比率での)耐衝撃性改良剤と溶融安定剤との組み合わせは、性能特性、例えば、引張/曲げ性能と耐衝撃性との驚くべき相乗的な組み合わせを提供する。
[0041]ポリアミド組成物の1種または複数の熱安定剤は、例えば、より高い使用温度で、材料の強度または延性に著しくマイナスに影響を及ぼすことなく、組成物の性能を改善するように選択され得る。熱安定剤は、例えば、ヒンダードフェノール安定剤、ホスファイト系安定剤、ヒンダードアミン系安定剤、トリアジン系安定剤、硫黄系安定剤、銅安定剤、またはそれらの組み合わせを含むことができる。
[0054]ポリアミド組成物は、1種または複数の可溶性染料、例えば、ニグロシンまたはsolvent black7を含むことができる。ポリアミド組成物中のニグロシンの濃度は、例えば、0.1wt%~5wt%、例えば、0.1wt%~1wt%、0.15wt%~1.5wt%、0.22wt%~2.3wt%、0.32wt%~3.4wt%、または0.48wt%~5wt%の範囲であり得る。一部の実施形態では、ニグロシンの濃度は、1wt%~2wt%、例えば、1wt%~1.6wt%、1.1wt%~1.7wt%、1.2wt%~1.8wt%、1.3wt%~1.9wt%、または1.4wt%~2wt%の範囲である。上限に関しては、ニグロシンの濃度は、5wt%未満、例えば、3.4wt%未満、2.3wt%未満、2wt%未満、1.9wt%未満、1.8wt%未満、1.7wt%未満、1.6wt%未満、1.5wt%未満、1.4wt%未満、1.3wt%未満、1.2wt%未満、1.1wt%未満、1wt%未満、0.71wt%未満、0.48wt%未満、0.32wt%未満、0.22wt%未満、または0.15wt%未満であり得る。下限に関しては、ニグロシンの濃度は、0.1wt%超、例えば、0.15wt%超、0.22wt%超、0.32wt%超、0.48wt%超、0.71wt%超、1wt%超、1.1wt%超、1.2wt%超、1.3wt%超、1.4wt%超、1.5wt%超、1.6wt%超、1.7wt%超、1.8wt%超、1.9wt%超、2wt%超、2.3wt%超、または3.4wt%超であり得る。より低い濃度、例えば、0.1wt%未満、およびより高い濃度、例えば、5wt%超も考えられる。一部の場合では、ニグロシンはマスターバッチで提供され、マスターバッチ中および得られた組成物中のニグロシンの濃度は、容易に計算することができる。
[0060]ポリアミド組成物は、1種または複数の溶融安定剤(潤滑剤)を含むことができる。溶融安定剤のタイプおよび相対量は、組成物の加工を改善し、材料の高強度および高延性に同時に貢献するように選択され得る。ポリアミド組成物中の溶融安定剤の濃度は、例えば、0.1wt~5wt%、例えば、0.1wt%~0.6wt%、0.2wt%~0.7wt%、0.3wt%~0.8wt%、0.1wt%~3wt%、0.4wt%~0.9wt%、0.5wt%~1wt%、0.15wt%~1.5wt%、0.22wt%~2.3wt%、0.32wt%~3.4wt%、または0.48wt%~5wt%の範囲であり得る。上限に関しては、溶融安定剤濃度は、5wt%未満、例えば、3.4wt%未満、2.3wt%未満、1.5wt%未満、1wt%未満で、0.9wt%未満、0.8wt%未満、0.7wt%未満、0.6wt%未満、0.5wt%未満、0.4wt%未満、0.3wt%未満、0.2wt%未満、または0.1wt%未満であり得る。下限に関しては、溶融安定剤濃度は、0.1wt%超、例えば、0.2wt%超、0.3w%超、0.4wt%超、0.5wt%超、0.6wt%超、0.7wt%超、0.8wt%超、0.9wt%超、1wt%超、1.5wt%超、2.3wt%超、または3.4wt%超であり得る。より低い濃度、例えば0.1wt%未満、およびより高い濃度、例えば、5wt%超も考えられる。
[0068]ポリアミド組成物は、1種または複数の連鎖停止剤、粘度調整剤、可塑剤、紫外線安定剤、触媒、他のポリマー、難燃剤、艶消し剤、抗菌剤、帯電防止剤、蛍光増白剤、増量剤、加工助剤、タルク、マイカ、セッコウ、ウォラストナイトおよび当業者に公知の他の通常使用される添加剤も含むことができる。追加の好適な添加剤は、Plastics Additives,An A-Z reference,Edited by Geoffrey Pritchard(1998)に見出され得る。安定剤を添加剤分散液へ任意選択で添加することは、例示的実施形態に存在する。添加剤分散液に好適な安定剤としては、限定されるものではないが、ポリエトキシレート(例えば、ポリエトキシル化アルキルフェノールTriton X-100)、ポリプロポキシレート、ブロックコポリマーポリエーテル、長鎖アルコール、多価アルコール、アルキルスルフェート、アルキルスルホネート、アルキルベンゼンスルホネート、アルキルホスフェート、アルキルホスホネート、アルキルナフタレンスルホネート、カルボン酸およびペルフルオロネートが挙げられる。
[0074]ポリアミド組成物は、例えば、2500MPa~25000MPa、例えば、2500MPa~16000MPa、4750MPa~18250MPa、7000MPa~20500MPa、5000MPa~17000MPa、7000MPa~15000MPa、8000MPa~12000MPa、8600MPa~11500MPa、9250MPa~22750MPa、または11500MPa~25000MPaの範囲である引張弾性率を示し得る。上限に関しては、引張弾性率は、25000MPa未満、例えば、22750MPa未満、20500MPa未満、18250MPa未満、17000MPa未満、16000MPa未満、15000MPa未満、13750MPa未満、12000MPa未満、11500MPa未満、9250MPa未満、7000MPa未満、または4750MPa未満であり得る。下限に関しては、引張弾性率は、2500MPa超、例えば、4750MPa超、5000MPa超、7000MPa超、8000MPa超、8600MPa超、9250MPa超、11500MPa超、13750MPa超、16000MPa超、18250MPa超、20500MPa超、または22750MPa超であり得る。より高い引張弾性率、例えば、25000MPa超、およびより低い引張弾性率、例えば、2500MPa未満も考えられる。ポリアミド組成物の引張弾性率は、ISO527-1(2019)などの標準的手順を使用して測定され得る。
[0091]本開示は、提供される耐衝撃性改良ポリアミド組成物を製造する方法にも関する。この方法は、1種または複数のポリアミドポリマー、ガラス繊維、1種または複数の耐衝撃性改良剤、および任意選択で1種または複数の熱安定剤を用意するステップを含む。この方法は、得られるポリアミド組成物に所望の機械的特性を提供するために、1種または複数のポリアミドポリマー、ガラス繊維、1種または複数の耐衝撃性改良剤、および1種または複数の熱安定剤のタイプおよび相対量を選択するステップをさらに含むことができる。この方法は、1種または複数のポリアミドポリマー、ガラス繊維、1種または複数の耐衝撃性改良剤、および1種または複数の熱安定剤を組み合わせて、ポリアミド組成物を生成させるステップをさらに含む。一部の実施形態では、この方法は、ニグロシンなどの1種もしくは複数の染料、カーボンブラックなどの1種もしくは複数の顔料、ならびに/または1種もしくは複数の溶融安定剤を、選択する、用意する、かつ/または組み合わせるステップをさらに含む。
[0093]本開示は、いずれかの提供された耐衝撃性改良ポリアミド組成物を含む物品にも関する。物品は、例えば、従来の射出成形、押し出し成形、ブロー成形、プレス成形、圧縮成形、またはガスアシスト成形技術によって製造され得る。開示された組成物の使用および物品にとって好適な成形プロセスは、米国特許第8,658,757号;米国特許第4,707,513号;米国特許第7,858,172号;および米国特許第8,192,664号に記述されており、これらのそれぞれは、その全体がすべての目的のために参照により本明細書に組み込まれる。提供されたポリアミド組成物で製造され得る物品の例としては、電気的用途および電子的用途で使用されるもの(例えば、限定されるものではないが、回路遮断器、端子ブロック、コネクター等)、自動車用途(例えば、限定されるものではないが、空気処理システム、ラジエーターエンドタンク、ファン、シュラウド等)、家具および家庭電気器具部品、ならびにケーブルタイなどのワイヤー位置決め装置が挙げられる。
[00101]以下の実施形態が考えられる。特性と実施形態とのすべての組み合わせが考えられる。
[00104]実施形態3:耐衝撃性改良剤に対する1種または複数のポリアミドポリマーの重量比率が、0.2~30の範囲である、実施形態1または2の実施形態。
[00106]実施形態5:耐衝撃性改良剤に対するガラス繊維の重量比率が、0.3~20の範囲である、実施形態1~4の実施形態のいずれかの実施形態。
[00108]実施形態7:熱安定剤に対する耐衝撃性改良剤の重量比率が、0.5~300の範囲である、実施形態1~6の実施形態のいずれかの実施形態。
[00110]実施形態9:1種または複数のポリアミドポリマーが、PA6ポリマーを含む、実施形態1~8の実施形態のいずれかの実施形態。
[00114]実施形態13:耐衝撃性改良剤が、エチレン-オクテンコポリマーを含む、実施形態1~12の実施形態のいずれかの実施形態。
[00118]実施形態17:ニグロシンに対する1種または複数のポリアミドポリマーの重量比率が1~85の範囲である、実施形態16の実施形態。
[00120]実施形態19:ニグロシンに対する耐衝撃性改良剤の重量比率が0.5~30の範囲である、実施形態15~17の実施形態のいずれかの実施形態。
[00122]実施形態21:5wt%未満の濃度でカーボンブラックをさらに含む、実施形態1~20の実施形態のいずれかの実施形態。
[00124]実施形態23:溶融安定剤がイオン性溶融安定剤を含まない、実施形態22の実施形態。
[00126]実施形態25:13wt%~68wt%のPA66ポリアミドポリマー;25wt%~40wt%のガラス繊維;6wt%~20wt%の耐衝撃性改良剤;1wt%~2wt%のニグロシン;0.1wt%~1wt%の熱安定剤;20wt%未満のPA6ポリアミドポリマー;3wt%未満のカーボンブラック;および、1wt%未満の溶融安定剤を含む、実施形態1~24の実施形態のいずれかの実施形態。
[00134]実施形態33:5wt%~85wt%のポリアミドポリマー;10wt%~60wt%のガラス繊維;3wt%~30wt%の耐衝撃性改良剤;および5wt%未満の濃度の溶融安定剤を含み;耐衝撃性改良剤と溶融安定剤との重量比が、1.0:1~100:1の範囲であり;ポリアミド組成物が、80kJ/m2超である23℃でのノッチなしシャルピー衝撃エネルギー損失、および135MPa超の引張強度を示す、耐衝撃性改良ポリアミド組成物。
[00141]実施形態40:ポリアミド組成物が0.04超の60°タンデルタを示す、実施形態1~25、および33~39の実施形態のいずれかの実施形態。
[00143]実施形態42:耐衝撃性改良剤が変性オレフィンを含む、実施形態1~25、および33~41の実施形態のいずれかの実施形態。
[00146]実施形態45:耐衝撃性改良剤が0℃未満のガラス転移温度を有する、実施形態1~25、および33~44の実施形態のいずれかの実施形態。
[00148]実施形態47:溶融安定剤がステアリン酸を含む、実施形態1~25、および33~46の実施形態のいずれかの実施形態。
[00150]実施形態49:熱安定剤に対する耐衝撃性改良剤の重量比率が0.5~300の範囲である、実施形態1~25、および33~48の実施形態のいずれかの実施形態。
[00153]実施形態52:それぞれのポリアミドポリマーの数平均分子量が、独立して100,000未満である、実施形態1~25、および33~51の実施形態のいずれかの実施形態。
[00157]実施形態56:耐衝撃性改良ポリアミド組成物が、PA-6および/またはPA-6,6を含む、45wt%~60wt%のポリアミドポリマー;20wt%~50wt%のガラス繊維;2wt%~25wt%の耐衝撃性改良剤;0.1wt%~3wt%の溶融安定剤(溶融安定剤に対する耐衝撃性改良剤の重量比率は、10~40の範囲である)を含み、組成物が、80kJ/m2超である23℃でのノッチなしシャルピー衝撃エネルギー損失;70kJ/m2超である-40℃でのノッチなしシャルピー衝撃エネルギー損失;11kJ/m2超である23℃でのノッチ付きシャルピー衝撃エネルギー損失;10kJ/m2超である-40℃でのノッチ付きシャルピー衝撃エネルギー損失;135MPa超の引張強度、および0.175au超であるタンデルタ(90℃)を示す、実施形態1~25、および33~54の実施形態のいずれかの実施形態。
Claims (20)
- 5wt%~85wt%のポリアミドポリマー、
10wt%~60wt%のガラス繊維、
3wt%~30wt%の耐衝撃性改良剤、および
5wt%未満の濃度の溶融安定剤
を含む、耐衝撃性改良ポリアミド組成物であって、
耐衝撃性改良剤と溶融安定剤との重量比が、1.0:1~100:1の範囲であり、
ポリアミド組成物が、80kJ/m2超である23℃でのノッチなしシャルピー衝撃エネルギー損失、および135MPa超の引張強度を示す、
ポリアミド組成物。 - ガラス繊維に対するポリアミドポリマーの重量比率が、0.1~10の範囲である、請求項1に記載のポリアミド組成物。
- 耐衝撃性改良剤に対するポリアミドポリマーの重量比率が、0.2~30の範囲である、請求項1に記載のポリアミド組成物。
- 耐衝撃性改良剤と溶融安定剤との重量比が、1:1~40:1の範囲である、請求項1に記載のポリアミド組成物。
- 0.04超の60°タンデルタを示す、請求項1に記載のポリアミド組成物。
- 0.1超の90°タンデルタを示す、請求項1に記載のポリアミド組成物。
- 耐衝撃性改良剤が、変性オレフィンを含む、請求項1に記載のポリアミド組成物。
- 耐衝撃性改良剤が、無水マレイン酸変性オレフィン、アクリレート、もしくはアクリル、またはそれらの組み合わせを含む、請求項1に記載のポリアミド組成物。
- 耐衝撃性改良剤が、無水マレイン酸変性オレフィンを含む、請求項1に記載のポリアミド組成物。
- 耐衝撃性改良剤が、0℃未満のガラス転移温度を有する、請求項1に記載のポリアミド組成物。
- 溶融安定剤が、飽和脂肪酸を含む、請求項1に記載のポリアミド組成物。
- 溶融安定剤が、ステアリン酸を含む、請求項1に記載のポリアミド組成物。
- 耐衝撃性改良剤に対するガラス繊維の重量比率が、0.3~20の範囲である、請求項1に記載のポリアミド組成物。
- 熱安定剤に対する耐衝撃性改良剤の重量比率が、0.5~300の範囲である、請求項1に記載のポリアミド組成物。
- 耐衝撃性改良剤が、無水マレイン酸変性オレフィン、アクリレート、もしくはアクリル、またはそれらの組み合わせを含み;溶融安定剤に対する耐衝撃性改良剤の重量比率が、5~50の範囲であり;溶融安定剤が、飽和脂肪酸を含み、ポリアミド組成物が;ポリアミド組成物が、2.5%超の引張伸び、および65kJ/m2超である-40℃でのノッチなしシャルピー衝撃エネルギー損失を示す、請求項1に記載のポリアミド組成物。
- ポリアミドポリマーが、PA66ポリマーを含む、請求項1に記載のポリアミド組成物。
- それぞれのポリアミドポリマーの数平均分子量が、独立して100,000未満である、請求項1に記載のポリアミド組成物。
- 13wt%~68wt%のPA66ポリアミドポリマー、
25wt%~40wt%のガラス繊維
を含み、
ポリアミド組成物が、11kJ/m2超の23℃でのノッチ付きシャルピー衝撃エネルギー損失を有する、
請求項1に記載のポリアミド組成物。 - 13wt%~68wt%のPA66ポリアミドポリマー、
25wt%~40wt%のガラス繊維、
耐衝撃性改良剤、
1wt%~2wt%のニグロシン、
0.1wt%~1wt%の熱安定剤、
20wt%未満のPA6ポリアミドポリマー、
3wt%未満のカーボンブラック、および
1wt%未満の溶融安定剤
を含む、請求項1に記載のポリアミド組成物。 - 請求項1のポリアミド組成物を含む、射出成形品。
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KR102624953B1 (ko) | 2024-01-12 |
US20200247993A1 (en) | 2020-08-06 |
CN113677497A (zh) | 2021-11-19 |
CA3128002A1 (en) | 2020-08-06 |
EP3917748A1 (en) | 2021-12-08 |
KR20210122822A (ko) | 2021-10-12 |
SG11202108158YA (en) | 2021-08-30 |
MX2021009284A (es) | 2021-11-12 |
WO2020160400A1 (en) | 2020-08-06 |
US11485858B2 (en) | 2022-11-01 |
CN113677497B (zh) | 2024-02-23 |
BR112021014747A2 (pt) | 2021-09-28 |
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