JP2022185716A - Adhesive composition, adhesive film, connection structure and method for producing connection structure - Google Patents
Adhesive composition, adhesive film, connection structure and method for producing connection structure Download PDFInfo
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- JP2022185716A JP2022185716A JP2021093498A JP2021093498A JP2022185716A JP 2022185716 A JP2022185716 A JP 2022185716A JP 2021093498 A JP2021093498 A JP 2021093498A JP 2021093498 A JP2021093498 A JP 2021093498A JP 2022185716 A JP2022185716 A JP 2022185716A
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- Prior art keywords
- adhesive composition
- adhesive
- film
- coupling agent
- silane coupling
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- 239000000853 adhesive Substances 0.000 title claims abstract description 95
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 95
- 239000000203 mixture Substances 0.000 title claims abstract description 86
- 239000002313 adhesive film Substances 0.000 title claims description 46
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 34
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 23
- 239000002253 acid Substances 0.000 claims abstract description 17
- 150000003242 quaternary ammonium salts Chemical group 0.000 claims abstract description 13
- 125000002091 cationic group Chemical group 0.000 claims abstract description 9
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 9
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 9
- 239000011230 binding agent Substances 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims description 39
- 150000001875 compounds Chemical class 0.000 claims description 33
- 239000004593 Epoxy Substances 0.000 claims description 27
- 125000002723 alicyclic group Chemical group 0.000 claims description 19
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 15
- 238000002788 crimping Methods 0.000 claims description 11
- 238000003860 storage Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 description 30
- 239000012790 adhesive layer Substances 0.000 description 26
- -1 glycidyl ether compound Chemical class 0.000 description 23
- 239000011521 glass Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 20
- 125000004432 carbon atom Chemical group C* 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- 239000010408 film Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 150000001925 cycloalkenes Chemical class 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 125000003700 epoxy group Chemical group 0.000 description 8
- 239000013039 cover film Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 6
- 150000001450 anions Chemical class 0.000 description 5
- 230000001588 bifunctional effect Effects 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000013034 phenoxy resin Substances 0.000 description 4
- 229920006287 phenoxy resin Polymers 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229920001893 acrylonitrile styrene Polymers 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- URSLCTBXQMKCFE-UHFFFAOYSA-N dihydrogenborate Chemical compound OB(O)[O-] URSLCTBXQMKCFE-UHFFFAOYSA-N 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bisphenol F Natural products C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 229940071161 dodecylbenzenesulfonate Drugs 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 125000005369 trialkoxysilyl group Chemical group 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Adhesive Tapes (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
本発明は、接着剤組成物、接着フィルム、接続構造体および接続構造体の製造方法に関する。 TECHNICAL FIELD The present invention relates to an adhesive composition, an adhesive film, a bonded structure, and a method for manufacturing a bonded structure.
電子部品と回路基板等とを接着する手段として、異方性導電ペースト（ＡＣＰ：Anisotropic Conductive Paste）や異方性導電フィルム（ＡＣＦ：Anisotropic Conductive Film）などの接着剤組成物やそのフィルム状物（接着フィルム）が広く用いられている。例えば、異方性導電フィルムは、フレキシブルプリント基板（ＦＰＣ）の端子と、ＦＰＤパネルのガラス基板の端子とを接続する場合（所謂、ＦＯＧ）をはじめとして、種々の端子同士を接着すると共に電気的に接続する場合に用いられている。 Adhesive compositions such as anisotropic conductive paste (ACP: Anisotropic Conductive Paste) and anisotropic conductive film (ACF: Anisotropic Conductive Film) and their film-like materials ( adhesive films) are widely used. For example, the anisotropic conductive film adheres various terminals together and electrically It is used when connecting to
このような接着剤組成物には、低温速硬化性を実現するために、重合性化合物として、汎用のグリシジルエーテル系化合物よりもカチオン重合反応性の高い脂環式エポキシ化合物を使用すると共に、酸素による重合阻害がなく、暗反応性を示す重合開始剤として、熱によりプロトンを発生するスルホニウム塩系熱酸発生剤を使用することが提案されている（特許文献１～３）。 In such an adhesive composition, an alicyclic epoxy compound having higher cationic polymerization reactivity than a general-purpose glycidyl ether compound is used as a polymerizable compound in order to achieve low-temperature rapid curing, and oxygen It has been proposed to use a sulfonium salt-based thermal acid generator that generates protons by heat as a polymerization initiator that exhibits dark reactivity without polymerization inhibition by heat (Patent Documents 1 to 3).
また、接着剤組成物については、商取引の国際化等により製造から実使用に至るまでの保管・運搬に係る期間が長期化する傾向にある。脂環式エポキシ化合物とスルホニウム塩系熱酸発生剤を組み合わせて使用する接着剤組成物は、製造直後に使用する場合には優れた接着性を呈するものの、保管条件に伴う製品ライフの管理が難しいため、第４級アンモニウム塩系熱酸発生剤をカチオン重合開始剤として使用する技術も提案されている（例えば、特許文献４参照）。 Moreover, with regard to adhesive compositions, the period of storage and transportation from production to actual use tends to become longer due to the internationalization of commercial transactions and the like. An adhesive composition that uses a combination of an alicyclic epoxy compound and a sulfonium salt-based thermal acid generator exhibits excellent adhesiveness when used immediately after production, but it is difficult to manage the product life due to storage conditions. Therefore, a technique of using a quaternary ammonium salt-based thermal acid generator as a cationic polymerization initiator has also been proposed (see, for example, Patent Document 4).
特許文献４に示すような第４級アンモニウム塩系熱酸発生剤の使用により、接着剤組成物の経時的な変化を抑制でき、保管ライフを向上することができるが、ＦＰＣとガラス基板等の異なる基材を接合する場合、接着強度が十分でなく、配線間または配線上に接着剤組成物の浮きが発生し、接続信頼性を担保できないおそれがあった。 By using a quaternary ammonium salt-based thermal acid generator as shown in Patent Document 4, it is possible to suppress the change over time of the adhesive composition and improve the storage life. When bonding different base materials, the bonding strength is not sufficient, and the adhesive composition may float between or on the wirings, and there is a risk that connection reliability cannot be ensured.
本発明の課題は、ＦＰＣをガラス基板に実装するＦＯＧ実装等の基材違いにより高い接着強度が必要とされる接合にも使用可能であり、保管ライフ性にも優れる接着剤組成物を提供することにある。 An object of the present invention is to provide an adhesive composition that can be used for bonding where high adhesive strength is required due to different base materials such as FOG mounting for mounting FPC on a glass substrate, and that has excellent storage life. That's what it is.
本発明者らは、上記課題につき鋭意検討した結果、下記構成を有する接着剤組成物によって上記課題を解決できることを見出し、本発明を完成するに至った。 As a result of intensive studies on the above problems, the present inventors have found that the above problems can be solved by an adhesive composition having the following structure, and have completed the present invention.
すなわち、本発明は以下の内容を含む。
［１］ カチオン重合性成分と成膜用成分を含有するバインダ組成物と、
第４級アンモニウム塩系熱酸発生剤であるカチオン重合開始剤と、
１分子中に２以上のメルカプト基を有し、主鎖が有機鎖であるシランカップリング剤と、を含み、前記シランカップリング剤の含有量が０．３質量％以上３質量％以下である、接着剤組成物。
［２］ 前記カチオン重合性成分は２官能脂環式エポキシ化合物である、請求項１に記載の接着剤組成物。
［３］ 前記シランカップリング剤の分子量は、５００以上である請求項１または２に記載の接着剤組成物。
［４］ 前記シランカップリング剤は、１分子中に１つ以上のアルコキシシリル基と、２つ以上のメルカプト基を有する請求項１～３のいずれか一つに記載の接着剤組成物。
［５］ 前記シランカップリング剤は、アルコキシシリル基の基数に対するメルカプト基の基数の割合が２以上である、請求項４に記載の接着剤組成物。
［６］ 請求項１～５のいずれか一つに記載の接着剤組成物と、導電性粒子と、を含む接着フィルム。
［７］ 第１の電子部品と第２の電子部品とが請求項６に記載の接着フィルムにより接続されている接続構造体。
［８］ 第１の電子部品と第２の電子部品とを、請求項６に記載の接着フィルムを介在させて、圧着する工程を含む、接続構造体の製造方法。
That is, the present invention includes the following contents.
[1] a binder composition containing a cationic polymerizable component and a film-forming component;
a cationic polymerization initiator that is a quaternary ammonium salt-based thermal acid generator;
and a silane coupling agent having two or more mercapto groups in one molecule and having an organic main chain, and the content of the silane coupling agent is 0.3% by mass or more and 3% by mass or less. , an adhesive composition.
[2] The adhesive composition according to [1], wherein the cationic polymerizable component is a bifunctional alicyclic epoxy compound.
[3] The adhesive composition according to [1] or [2], wherein the silane coupling agent has a molecular weight of 500 or more.
[4] The adhesive composition according to any one of [1] to [3], wherein the silane coupling agent has one or more alkoxysilyl groups and two or more mercapto groups in one molecule.
[5] The adhesive composition according to [4], wherein the silane coupling agent has a ratio of the number of mercapto groups to the number of alkoxysilyl groups of 2 or more.
[6] An adhesive film comprising the adhesive composition according to any one of [1] to [5] and conductive particles.
[7] A connected structure in which a first electronic component and a second electronic component are connected by the adhesive film according to [6].
[8] A method for manufacturing a connection structure, comprising the step of press-bonding a first electronic component and a second electronic component with the adhesive film according to claim 6 interposed therebetween.
本発明によれば、ＦＰＣをガラス基板に実装するＦＯＧ実装等の高い接着強度が必要とされる接合にも使用可能であり、常温・冷蔵環境下での保管を経たとしても高い接着性を保持しうる接着剤組成物を提供することができる。 According to the present invention, it can also be used for bonding that requires high adhesive strength, such as FOG mounting, which mounts FPC to a glass substrate, and maintains high adhesiveness even after being stored at room temperature and in a refrigerated environment. It is possible to provide an adhesive composition capable of
本明細書において、「脂環式エポキシ化合物」とは、分子中に脂環を有するエポキシ化合物を意味する。脂環式エポキシ化合物において、オキシラン環は、脂環を構成する２個の炭素原子と１個の酸素原子で形成されていてもよく、脂環とは離れてグリシジル基として形成されていてもよい。 As used herein, "alicyclic epoxy compound" means an epoxy compound having an alicyclic ring in the molecule. In the alicyclic epoxy compound, the oxirane ring may be formed by two carbon atoms and one oxygen atom constituting the alicyclic ring, or may be formed as a glycidyl group apart from the alicyclic ring. .
以下、本発明をその好適な実施形態に即して詳細に説明する。本発明は以下の記述によって限定されるものではなく、各構成要素は本発明の要旨を逸脱しない範囲において適宜変更可能である。 BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be described in detail with reference to its preferred embodiments. The present invention is not limited by the following description, and each component can be changed as appropriate without departing from the gist of the present invention.
［接着剤組成物］
本発明の接着剤組成物は、カチオン重合性成分と成膜用成分を含有するバインダ組成物と、第４級アンモニウム塩系熱酸発生剤であるカチオン重合開始剤と、１分子中に２以上のメルカプト基を有し、主鎖が有機鎖であるシランカップリング剤と、を含み、前記シランカップリング剤の含有量が０．３質量％以上３質量％以下であることを特徴とする。
以下、各構成について詳細に説明する。
[Adhesive composition]
The adhesive composition of the present invention comprises a binder composition containing a cationic polymerizable component and a film-forming component, a cationic polymerization initiator which is a quaternary ammonium salt-based thermal acid generator, and two or more in one molecule. and a silane coupling agent whose main chain is an organic chain, and the content of the silane coupling agent is 0.3% by mass or more and 3% by mass or less.
Each configuration will be described in detail below.
＜バインダ組成物＞
本発明の接着剤組成物は、カチオン重合性成分と成膜用成分を含有するバインダ組成物を含む。
<Binder composition>
The adhesive composition of the present invention comprises a binder composition containing a cationically polymerizable component and a film-forming component.
（カチオン重合性成分）
本発明の接着剤組成物で使用するカチオン重合性成分は、カチオン種により重合する官能基を有する化合物であり、エポキシ化合物、ビニルエーテル化合物、環状エーテル化合物、などが例示される。中でも、１分子中にエポキシ基を２個以上有するエポキシ化合物が好ましく、高い反応性を有する脂環式エポキシ化合物を好適に使用することができる。
(Cationically polymerizable component)
The cationically polymerizable component used in the adhesive composition of the present invention is a compound having a functional group capable of being polymerized by cationic species, and examples thereof include epoxy compounds, vinyl ether compounds, and cyclic ether compounds. Among them, an epoxy compound having two or more epoxy groups in one molecule is preferable, and an alicyclic epoxy compound having high reactivity can be preferably used.
脂環式エポキシ化合物としては、１分子中にエポキシ基を２個有する２官能脂環式エポキシ化合物、１分子中にエポキシ基を３個有する３官能脂環式エポキシ化合物、１分子中にエポキシ基を４個有する４官能脂環式エポキシ化合物、１分子中にエポキシ基を５個有する５官能脂環式エポキシ化合物等が例示される。また、脂環式エポキシ化合物は、シクロアルケンオキサイド型エポキシ化合物、及び、脂環式アルコールのジグリシジルエーテル化合物から適宜選択することができる。 The alicyclic epoxy compounds include bifunctional alicyclic epoxy compounds having two epoxy groups in one molecule, trifunctional alicyclic epoxy compounds having three epoxy groups in one molecule, and epoxy groups in one molecule. and a pentafunctional alicyclic epoxy compound having 5 epoxy groups in one molecule. In addition, the alicyclic epoxy compound can be appropriately selected from cycloalkene oxide type epoxy compounds and diglycidyl ether compounds of alicyclic alcohols.
シクロアルケンオキサイド型エポキシ化合物は、エポキシシクロアルキル基を有する化合物である。エポキシシクロアルキル基の炭素原子数は、好ましくは３～１０である。好適な一実施形態として、エポキシシクロアルキル基の炭素原子数は、より好ましくは４～１０、さらに好ましくは６～１０、さらにより好ましくは６～８であり、特に好ましくは６である。 A cycloalkene oxide type epoxy compound is a compound having an epoxycycloalkyl group. The number of carbon atoms in the epoxycycloalkyl group is preferably 3-10. In one preferred embodiment, the epoxycycloalkyl group preferably has 4 to 10 carbon atoms, more preferably 6 to 10 carbon atoms, still more preferably 6 to 8 carbon atoms, and particularly preferably 6 carbon atoms.
シクロアルケンオキサイド型エポキシ化合物は、例えば、２個以上のシクロアルケン骨格を有する化合物を直接エポキシ化したり、重合性官能基（例えば、（メタ）アクリル基、アリル基、シラノール基等）を有する１官能以上のシクロアルケンオキサイド型エポキシ化合物を重合して２官能以上とすることにより製造することができる。 Cycloalkene oxide-type epoxy compounds are, for example, directly epoxidized compounds having two or more cycloalkene skeletons, or monofunctional compounds having a polymerizable functional group (e.g., (meth)acrylic group, allyl group, silanol group, etc.). It can be produced by polymerizing the above cycloalkene oxide type epoxy compound to make it bifunctional or higher.
シクロアルケンオキサイド型エポキシ化合物において、エポキシシクロアルキル基以外の構造は特に限定されず、反応性を阻害しない限りにおいて任意の構造としてよい。優れた接着性を呈する接着剤組成物を実現する観点から、エポキシ当量が、好ましくは５００以下、より好ましくは４００以下、さらに好ましくは３５０以下、さらにより好ましくは３００以下、特に好ましくは２５０以下、特により好ましくは２００以下となるような構造を有することが好適である。シクロアルケンオキサイド型エポキシ化合物のエポキシ当量の下限は、特に限定されないが、好ましくは７０以上、より好ましくは８０以上、さらに好ましくは９０以上、さらにより好ましくは９５以上である。 In the cycloalkene oxide type epoxy compound, the structure other than the epoxycycloalkyl group is not particularly limited, and may be any structure as long as it does not inhibit reactivity. From the viewpoint of realizing an adhesive composition exhibiting excellent adhesiveness, the epoxy equivalent is preferably 500 or less, more preferably 400 or less, still more preferably 350 or less, even more preferably 300 or less, and particularly preferably 250 or less. More preferably, it is preferable to have a structure of 200 or less. Although the lower limit of the epoxy equivalent weight of the cycloalkene oxide type epoxy compound is not particularly limited, it is preferably 70 or more, more preferably 80 or more, even more preferably 90 or more, and even more preferably 95 or more.
２官能のシクロアルケンオキサイド型エポキシ化合物の具体例としては、３，４－エポキシシクロヘキセニルメチル－３’，４’－エポキシシクロヘキセンカルボキシレート、ジエポキシビシクロヘキシル等が挙げられる。 Specific examples of bifunctional cycloalkene oxide type epoxy compounds include 3,4-epoxycyclohexenylmethyl-3',4'-epoxycyclohexene carboxylate and diepoxybicyclohexyl.
脂環式アルコールのジグリシジルエーテル化合物は、１分子中に脂環と２個以上のグリシジル基を有する化合物である。脂環は、反応性を阻害しない限りにおいて任意の構造としてよく、単環であっても縮合環であってもよく、１分子中に１個含まれてもよく、２個以上含まれていてもよい。優れた接着性を呈する接着剤組成物を実現する観点から、エポキシ当量が、上記シクロアルケンオキサイド型エポキシ化合物について説明したものと同じ範囲となるような構造を有することが好適である。 A diglycidyl ether compound of an alicyclic alcohol is a compound having an alicyclic ring and two or more glycidyl groups in one molecule. The alicyclic ring may have any structure as long as it does not inhibit reactivity, may be a single ring or a condensed ring, may be contained in one molecule, or may be contained in two or more. good too. From the viewpoint of realizing an adhesive composition exhibiting excellent adhesiveness, it is preferable to have a structure in which the epoxy equivalent is in the same range as described for the cycloalkene oxide type epoxy compound.
脂環式アルコールのジグリシジルエーテル化合物は、例えば、芳香族アルコールジグリシジルエーテル（例えば、ビスフェノールＡジグリシジルエーテル等のビスフェノール型ジグリシジルエーテル）の芳香環を水添処理して脂環化したり、脂肪族アルコール（例えば、水添ビスフェノールＡ等の水添ビスフェノール）をグリシジルエーテル化したりすることにより製造することができる。脂環式アルコールのジグリシジルエーテル化合物の具体例としては、ヘキサヒドロビスフェノールＡジグリシジルエーテル等が挙げられる。 Diglycidyl ether compounds of alicyclic alcohols are produced, for example, by hydrogenating the aromatic rings of aromatic alcohol diglycidyl ethers (for example, bisphenol-type diglycidyl ethers such as bisphenol A diglycidyl ether) to alicyclicize them, It can be produced by glycidyl-etherifying a group alcohol (for example, hydrogenated bisphenol such as hydrogenated bisphenol A). Specific examples of diglycidyl ether compounds of alicyclic alcohols include hexahydrobisphenol A diglycidyl ether.
カチオン重合性成分は、１種単独で又は２種以上を組み合わせて用いてよい。 The cationic polymerizable component may be used singly or in combination of two or more.
本発明の接着剤組成物において、カチオン重合性成分の含有量は、接着剤組成物中の不揮発成分を１００質量％としたとき、好ましくは１０質量％以上、より好ましくは１５質量％以上、さらに好ましくは１８質量％以上、さらにより好ましくは２０質量％以上である。該含有量の上限は、特に限定されないが、好ましくは６０質量％以下、より好ましくは５５質量％以下又は５０質量％以下である。 In the adhesive composition of the present invention, the content of the cationic polymerizable component is preferably 10% by mass or more, more preferably 15% by mass or more, when the non-volatile component in the adhesive composition is 100% by mass. It is preferably 18% by mass or more, and more preferably 20% by mass or more. The upper limit of the content is not particularly limited, but is preferably 60% by mass or less, more preferably 55% by mass or less or 50% by mass or less.
（成膜用成分）
成膜用成分は、膜形成能を有する限り特に限定されない。成膜用成分は、目的に応じて適宜選択すればよく、例えば、フェノキシ樹脂、エポキシ樹脂（重量平均分子量が１００００以上）、ポリビニルアセタール樹脂、不飽和ポリエステル樹脂、飽和ポリエステル樹脂、ウレタン樹脂、ブタジエン樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリオレフィン樹脂が挙げられる。成膜用成分は１種単独で又は２種以上を組み合わせて用いてよい。
中でも、成膜性、加工性、接続信頼性の観点から、フェノキシ樹脂を好適に用いることができる。
(component for film formation)
The film-forming component is not particularly limited as long as it has film-forming ability. The film-forming component may be appropriately selected depending on the purpose. Examples include phenoxy resin, epoxy resin (weight average molecular weight of 10000 or more), polyvinyl acetal resin, unsaturated polyester resin, saturated polyester resin, urethane resin, and butadiene resin. , polyimide resins, polyamide resins, and polyolefin resins. The film-forming components may be used singly or in combination of two or more.
Among them, a phenoxy resin can be preferably used from the viewpoint of film formability, workability, and connection reliability.
成膜性の観点から、成膜用成分のポリスチレン換算の重量平均分子量（Ｍｗ）は、好ましくは１００００以上、より好ましくは１５０００以上、さらに好ましくは２００００以上である。該Ｍｗの上限は、特に限定されないが、好ましくは８００００以下、より好ましくは７００００以下、６００００以下であってもよい。他の配合物や使用目的に応じて適宜選択すればよい。成膜用成分が、Ｍｗ５００００以下のフェノキシ樹脂を含むと、高温高湿環境下における信頼性試験後においても接続構造体の接続箇所に浮きが発生することを顕著に抑制することができるため好適である。成膜用成分のポリスチレン換算のＭｗは、ゲルパーミエーションクロマトグラフィー（ＧＰＣ）法で測定し、標準ポリスチレンの検量線を用いて算出することができる。 From the viewpoint of film-forming properties, the polystyrene equivalent weight average molecular weight (Mw) of the film-forming component is preferably 10,000 or more, more preferably 15,000 or more, and even more preferably 20,000 or more. The upper limit of Mw is not particularly limited, but may be preferably 80,000 or less, more preferably 70,000 or less, and 60,000 or less. It may be appropriately selected according to other formulations and purposes of use. When the film-forming component contains a phenoxy resin having an Mw of 50000 or less, it is preferable because it is possible to remarkably suppress the occurrence of floating at the connection point of the connection structure even after a reliability test in a high-temperature and high-humidity environment. be. The polystyrene-equivalent Mw of the film-forming component can be measured by a gel permeation chromatography (GPC) method and calculated using a standard polystyrene calibration curve.
接着剤組成物中の成膜用成分の含有量は、特に限定されず目的に応じて適宜決定してよいが、接着剤組成物中の不揮発成分を１００質量％としたとき、好ましくは１０質量％以上、より好ましくは２０質量％以上、さらに好ましくは３０質量％以上、さらにより好ましくは４０質量％以上である。該含有量の上限は、特に限定されないが、好ましくは７０質量％以下、より好ましくは６０質量％以下である。 The content of the film-forming component in the adhesive composition is not particularly limited and may be appropriately determined according to the purpose. % or more, more preferably 20 mass % or more, still more preferably 30 mass % or more, still more preferably 40 mass % or more. The upper limit of the content is not particularly limited, but is preferably 70% by mass or less, more preferably 60% by mass or less.
＜カチオン重合開始剤＞
本発明の接着剤組成物は、カチオン重合開始剤として、第４級アンモニウム塩系熱酸発生剤を含む。
カチオン重合開始剤として第４級アンモニウム塩系熱酸発生剤を用いた本発明の接着剤組成物は、常温・冷蔵環境下で一定期間保管した場合であっても、接着性の低下を抑制することができる。
<Cationic polymerization initiator>
The adhesive composition of the present invention contains a quaternary ammonium salt-based thermal acid generator as a cationic polymerization initiator.
The adhesive composition of the present invention, which uses a quaternary ammonium salt-based thermal acid generator as a cationic polymerization initiator, suppresses deterioration of adhesiveness even when stored for a certain period of time under normal temperature and refrigerated conditions. be able to.
第４級アンモニウム塩系熱酸発生剤としては、第４級アンモニウムカチオンと、酸アニオン又はボレートアニオンとの塩を好適に用いることができる。
第４級アンモニウムカチオンとしては、式：ＮＲａＲｂＲｃＲｄ＋で表されるカチオンを挙げることができる。式中、Ｒａ、Ｒｂ、Ｒｃ及びＲｄは、直鎖、分岐鎖若しくは環状の炭素数１～１２のアルキル基又は炭素数６～１２のアリール基であり、それぞれ水酸基、ハロゲン原子、アルコキシ基、アミノ基、エステル基等を有していてもよい。
As the quaternary ammonium salt-based thermal acid generator, a salt of a quaternary ammonium cation and an acid anion or a borate anion can be preferably used.
Examples of quaternary ammonium cations include cations represented by the formula: NR a R b R c R d+ . In the formula, R a , R b , R c and R d are linear, branched or cyclic alkyl groups having 1 to 12 carbon atoms or aryl groups having 6 to 12 carbon atoms, and are each a hydroxyl group, a halogen atom, It may have an alkoxy group, an amino group, an ester group, or the like.
酸アニオンとしては、無機酸アニオン及び有機酸アニオンの何れであってもよく、例えば、６フッ化アンチモン酸アニオン、６フッ化リン酸アニオン、トリフルオロメタンスルホン酸アニオン、パーフルオロブタンスルホン酸アニオン、ジノニルナフタレンスルホン酸アニオン、ジノニルナフタレンスルホン酸アニオン、ｐ－トルエンスルホン酸アニオン、ドデシルベンゼンスルホン酸アニオンが挙げられる。 The acid anion may be either an inorganic acid anion or an organic acid anion. Examples include nonylnaphthalenesulfonate anion, dinonylnaphthalenesulfonate anion, p-toluenesulfonate anion, and dodecylbenzenesulfonate anion.
ボレートアニオンとしては、アルキルボレートアニオン及びアリールボレートアニオンが挙げられる。ボレートアニオンは、ハロゲン原子を有していてもよい。中でも、フッ素原子（Ｆ－；フルオロ基）を有するアリールボレートアニオンが好ましく、テトラキス（ペンタフルオロフェニル）ボレートアニオンが特に好ましい。 Borate anions include alkylborate anions and arylborate anions. The borate anion may have a halogen atom. Among them, arylborate anions having a fluorine atom (F-; fluoro group) are preferred, and tetrakis(pentafluorophenyl)borate anions are particularly preferred.
第４級アンモニウム塩系熱酸発生剤は１種単独で又は２種以上を組み合わせて用いてよい。 The quaternary ammonium salt-based thermal acid generator may be used alone or in combination of two or more.
第４級アンモニウム塩系熱酸発生剤の具体例としては、Ｋｉｎｇ Ｉｎｄｕｓｔｒｉｅｓ，Ｉｎｃ．製造のＣＸＣ－１６１２、ＣＸＣ－１７３３、ＣＸＣ－１７３８、ＴＡＧ－２６７８、ＣＸＣ－１６１４、ＴＡＧ－２６８９、ＴＡＧ－２６９０、ＴＡＧ－２７００、ＣＸＣ－１８０２－６０、ＣＸＣ－１８２１等が挙げられる。これらは、楠本化成（株）から入手可能である。 Specific examples of the quaternary ammonium salt-based thermal acid generator include those available from King Industries, Inc.; Manufacturing CXC-1612, CXC-1733, CXC-1738, TAG-2678, CXC-1614, TAG-2689, TAG-2690, TAG-2700, CXC-1802-60, CXC-1821 and the like. These are available from Kusumoto Kasei Co., Ltd.
接着剤組成物中の第４級アンモニウム塩系熱酸発生剤の含有量は、カチオン重合性成分の不揮発成分の合計を１００質量％としたとき、好ましくは１質量％以上、より好ましくは３質量％以上、さらに好ましくは５質量％以上、さらにより好ましくは７質量％以上である。該含有量の上限は、特に限定されないが、好ましくは３０質量％以下、より好ましくは２０質量％以下、さらに好ましくは１５質量％以下である。 The content of the quaternary ammonium salt-based thermal acid generator in the adhesive composition is preferably 1% by mass or more, more preferably 3% by mass, when the total of the non-volatile components of the cationic polymerizable components is 100% by mass. % or more, more preferably 5 mass % or more, and even more preferably 7 mass % or more. The upper limit of the content is not particularly limited, but is preferably 30% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less.
＜シランカップリング剤＞
本発明の接着剤組成物は、１分子中に２以上のメルカプト基を有し、主鎖が有機鎖であるシランカップリング剤を含む。
<Silane coupling agent>
The adhesive composition of the present invention contains a silane coupling agent having two or more mercapto groups in one molecule and having an organic main chain.
本発明の接着剤組成物で使用するシランカップリング剤は、１分子中に２以上のメルカプト基と、１以上のアルコキシシリル基と、メルカプト基およびアルコキシシリル基を側鎖または末端基として有する有機鎖を有するものであれば特に限定されるものではない。メルカプト基を２以上有するシランカップリング剤は、ＦＰＣの金属配線との接着性を向上することができるため、接着強度を向上することができる。
シランカップリング剤のアルコキシシリル基は、トリアルコキシシリル基であることが好ましく、トリメトキシシリル基がさらに好ましい。
The silane coupling agent used in the adhesive composition of the present invention is an organic compound having two or more mercapto groups, one or more alkoxysilyl groups, and a mercapto group and an alkoxysilyl group in one molecule as side chains or terminal groups. It is not particularly limited as long as it has a chain. A silane coupling agent having two or more mercapto groups can improve the adhesiveness of the FPC to the metal wiring, thus improving the adhesive strength.
The alkoxysilyl group of the silane coupling agent is preferably a trialkoxysilyl group, more preferably a trimethoxysilyl group.
シランカップリング剤の好適な一実施形態として、下記式（１）で表される化合物を例示することができる。 A compound represented by the following formula (1) can be exemplified as a preferred embodiment of the silane coupling agent.
また、シランカップリング剤の好適な一実施形態として、下記式（３）で表される化合物を例示することができる。
本発明の接着剤組成物で使用するシランカップリング剤において、アルコキシシリル基の基数に対するメルカプト基の基数の割合は、２以上であることが好ましく、３以上がより好ましい。また、アルコキシシリル基の基数に対するメルカプト基の基数の割合は、１０以下であることが好ましく、７以下がより好ましい。アルコキシシリル基の基数に対するメルカプト基の基数の割合が２以上であることにより、有機成分であるバインダ組成物への相溶性に優れ、バインダ組成物やＦＰＣの絶縁性樹脂と結合することで密着性を向上することができる。一方、アルコキシシリル基の基数に対するメルカプト基の基数の割合が１０以下であることにより、ガラス基板等の無機成分への接着強度を向上することができる。 In the silane coupling agent used in the adhesive composition of the present invention, the ratio of the number of mercapto groups to the number of alkoxysilyl groups is preferably 2 or more, more preferably 3 or more. The ratio of the number of mercapto groups to the number of alkoxysilyl groups is preferably 10 or less, more preferably 7 or less. Since the ratio of the number of mercapto groups to the number of alkoxysilyl groups is 2 or more, the compatibility with the binder composition, which is an organic component, is excellent. can be improved. On the other hand, when the ratio of the number of mercapto groups to the number of alkoxysilyl groups is 10 or less, the adhesive strength to an inorganic component such as a glass substrate can be improved.
本発明の接着剤組成物で使用するシランカップリング剤は、主鎖が有機鎖であるため、バインダ組成物との相溶性、密着性に優れる。
本発明の接着剤組成物で使用するシランカップリング剤の具体例としては、信越化学工業（株）製造のＸ－１２－１１５４、Ｘ－１２－１１５６等が挙げられる。
Since the main chain of the silane coupling agent used in the adhesive composition of the present invention is an organic chain, it has excellent compatibility and adhesion with the binder composition.
Specific examples of the silane coupling agent used in the adhesive composition of the present invention include X-12-1154 and X-12-1156 manufactured by Shin-Etsu Chemical Co., Ltd.
本発明の接着剤組成物で使用するシランカップリング剤は、ポリスチレン換算の重量平均分子量が５００～３０００であることが好ましい。ポリスチレン換算の重量平均分子量が５００未満であると製造が困難となるおそれがあり、ポリスチレン換算の重量平均分子量が３０００より大きくなると、製造の際の作業性が悪くなるおそれがある。 The silane coupling agent used in the adhesive composition of the present invention preferably has a polystyrene equivalent weight average molecular weight of 500 to 3,000. If the polystyrene-equivalent weight average molecular weight is less than 500, production may become difficult, and if the polystyrene-equivalent weight average molecular weight is greater than 3,000, workability during production may deteriorate.
本発明の接着剤組成物において、シランカップリング剤の含有量は、接着剤組成物中の不揮発成分を１００質量％としたとき、０．３質量％以上３質量％以下である。シランカップリング剤の含有量が０．３質量％未満または３質量％を超えると、接着強度が低下し、基材との間に剥離が発生するおそれがある。 In the adhesive composition of the present invention, the content of the silane coupling agent is 0.3% by mass or more and 3% by mass or less when the non-volatile component in the adhesive composition is 100% by mass. If the content of the silane coupling agent is less than 0.3% by mass or more than 3% by mass, the adhesive strength may be lowered, and peeling from the substrate may occur.
＜導電性粒子＞
本発明の接着剤組成物は、導電性粒子を含んでいてもよい。導電性粒子を含むことにより、接着剤組成物及びそのフィルム状物は、導電性ペースト及び導電性フィルム、異方性導電ペースト及び異方性導電フィルムとして用いることができる。
<Conductive particles>
The adhesive composition of the present invention may contain conductive particles. By containing conductive particles, the adhesive composition and its film-like material can be used as a conductive paste, a conductive film, an anisotropic conductive paste, and an anisotropic conductive film.
導電性粒子としては、異方性導電フィルムにおいて用いられる公知の導電性粒子を用いてよい。導電性粒子としては、例えば、ニッケル、鉄、銅、アルミニウム、錫、鉛、クロム、コバルト、銀、金等の金属の粒子；これら金属の合金の粒子；金属酸化物、カーボン、グラファイト、ガラス、セラミック、樹脂等の粒子の表面に金属を被覆した被覆粒子等が挙げられる。樹脂粒子の表面に金属を被覆した金属被覆樹脂粒子を用いる場合、樹脂粒子の材料としては、例えば、エポキシ樹脂、フェノール樹脂、アクリル樹脂、アクリロニトリル・スチレン（ＡＳ）樹脂、ベンゾグアナミン樹脂、ジビニルベンゼン系樹脂、スチレン系樹脂等が挙げられる。なお、導電性粒子は、接続後の導通性能に支障を来さなければ、端子間でのショートリスクの回避のために、上記粒子の表面に更に絶縁薄膜を被覆したものや、絶縁粒子を表面に付着させたものなど絶縁処理を施したものであってもよい。これら導電性粒子は１種単独で又は２種以上を組み合わせて用いてよい。 As the conductive particles, known conductive particles used in anisotropic conductive films may be used. Examples of conductive particles include particles of metals such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, and gold; particles of alloys of these metals; metal oxides, carbon, graphite, glass, Covered particles obtained by coating the surfaces of particles of ceramics, resins, etc. with metals, and the like can be mentioned. When using metal-coated resin particles in which the surface of resin particles is coated with metal, examples of resin particle materials include epoxy resins, phenol resins, acrylic resins, acrylonitrile-styrene (AS) resins, benzoguanamine resins, and divinylbenzene resins. , styrene-based resins, and the like. In addition, if the conductive particles do not interfere with the conduction performance after connection, in order to avoid the risk of shorting between terminals, the surface of the above particles is further coated with an insulating thin film, or the surface of the particles is covered with an insulating film. It may also be subjected to an insulating treatment such as one adhered to the surface. These conductive particles may be used alone or in combination of two or more.
導電性粒子の平均粒子径は、特に限定されず目的に応じて適宜決定してよいが、好ましくは４０μｍ以下、より好ましくは３０μｍ以下、さらに好ましくは２５μｍ以下、さらにより好ましくは２０μｍ以下である。該平均粒子径の下限は、特に限定されないが、好ましくは１μｍ以上、より好ましくは２μｍ以上、さらに好ましくは３μｍ以上である。導電性粒子の平均粒子径は、例えば、走査型電子顕微鏡観察（ＳＥＭ）により観察し、複数個（ｎ≧１０）の導電性粒子について粒子径を測定し、その平均値を算出すればよい。もしくは、画像型粒度分布測定装置（例として、ＦＰＩＡ－３０００（マルバーン社））を用いて測定した測定値（Ｎ＝１０００以上）であってもよい。 The average particle size of the conductive particles is not particularly limited and may be appropriately determined according to the purpose, but is preferably 40 μm or less, more preferably 30 μm or less, still more preferably 25 μm or less, and even more preferably 20 μm or less. Although the lower limit of the average particle size is not particularly limited, it is preferably 1 µm or more, more preferably 2 µm or more, and still more preferably 3 µm or more. The average particle size of the conductive particles can be obtained by observing, for example, a scanning electron microscope (SEM), measuring the particle size of a plurality of (n≧10) conductive particles, and calculating the average value. Alternatively, it may be a measured value (N=1000 or more) measured using an image type particle size distribution analyzer (for example, FPIA-3000 (Malvern)).
導電性粒子を用いる場合、接着剤組成物中の導電性粒子の含有量は、特に限定されず目的に応じて適宜決定してよいが、好ましくは１質量％以上、より好ましくは２質量％以上、さらに好ましくは３質量％以上である。該含有量の上限は、所期の異方導電性を得る観点から、好ましくは３０質量％以下、より好ましくは３０質量％以下、さらに好ましくは２５質量％以下、さらにより好ましくは２０質量％以下である。 When using conductive particles, the content of the conductive particles in the adhesive composition is not particularly limited and may be appropriately determined according to the purpose, but is preferably 1% by mass or more, more preferably 2% by mass or more. , more preferably 3% by mass or more. From the viewpoint of obtaining the desired anisotropic conductivity, the upper limit of the content is preferably 30% by mass or less, more preferably 30% by mass or less, even more preferably 25% by mass or less, and even more preferably 20% by mass or less. is.
本発明の接着剤組成物は、必要に応じてさらに他の成分を含んでもよい。かかる成分としては、例えば、有機充填材（例えば、ブタジエン系ゴム粒子、アクリル系ゴム粒子、シリコーン系ゴム粒子）、絶縁性無機フィラー（例えば、シリカフィラー）などの導通を阻害しない充填剤、表面改質剤、難燃剤、カップリング剤、着色剤等の、接着剤組成物の製造において使用される公知の添加剤が挙げられる。 The adhesive composition of the present invention may further contain other components as necessary. Such components include, for example, organic fillers (e.g., butadiene-based rubber particles, acrylic-based rubber particles, silicone-based rubber particles), insulating inorganic fillers (e.g., silica fillers) and other fillers that do not inhibit electrical conduction, and surface-modifying fillers. Known additives used in the manufacture of adhesive compositions such as stabilizing agents, flame retardants, coupling agents, colorants and the like are included.
本発明の接着剤組成物は、高い接着強度を有し、常温・冷蔵環境下で一定期間保管した場合であっても、接着性の低下を抑制し得る。したがって、本発明の接着剤組成物は、ＦＰＣをガラス基板に実装するＦＯＧ実装等の基材違いにより高い接着強度が必要とされる接合にも好適に使用することができる。また、導電性粒子を含む場合、導電性ペーストや異方性導電ペーストとして用いることが可能である。 INDUSTRIAL APPLICABILITY The adhesive composition of the present invention has a high adhesive strength, and can suppress a decrease in adhesiveness even when stored for a certain period of time under a normal temperature/refrigerated environment. Therefore, the adhesive composition of the present invention can also be suitably used for bonding where high adhesive strength is required due to differences in base materials, such as FOG mounting, in which FPC is mounted on a glass substrate. Moreover, when it contains conductive particles, it can be used as a conductive paste or an anisotropic conductive paste.
［接着フィルム］
本発明の接着剤組成物は、成膜性が良好であり、好適にフィルム状物（接着フィルム）とし得る。本発明は、本発明の接着剤組成物からなる接着フィルムも包含するものである。
[Adhesive film]
The adhesive composition of the present invention has good film-forming properties and can be suitably used as a film-like product (adhesive film). The present invention also includes an adhesive film comprising the adhesive composition of the present invention.
本発明の接着フィルムは、単層からなっても複数層からなってもよい。複数層からなる場合、接着フィルムは、本発明の接着剤組成物からなる第１接着剤層と、該第１接着剤層上に設けられた、本発明の接着剤組成物からなる第２接着剤層とを少なくとも含む。第１接着剤層と第２接着剤層の少なくとも一方は、導電性粒子を含むことが好ましい。また本発明の接着剤層に、本発明とは異なる層を設けてもよい。その層の前後を本発明の接着剤層で挟持してもよい。このとき、導電性粒子は本発明の接着剤層の少なくともいずれか一方に含まれてもよく、異なる層に含まれてもよい。この異なる層は、本発明とは異なる接着剤組成物からなる層であってもよく、接着剤層ではない（接着に寄与しない）樹脂層であってもよい。本発明とは異なる層は絶縁性であることが好ましい。 The adhesive film of the present invention may consist of a single layer or multiple layers. When the adhesive film consists of multiple layers, the adhesive film comprises a first adhesive layer made of the adhesive composition of the present invention and a second adhesive layer made of the adhesive composition of the present invention provided on the first adhesive layer. at least an agent layer. At least one of the first adhesive layer and the second adhesive layer preferably contains conductive particles. Further, the adhesive layer of the present invention may be provided with a layer different from that of the present invention. The layer may be sandwiched between the adhesive layers of the present invention on the front and rear of the layer. At this time, the conductive particles may be contained in at least one of the adhesive layers of the present invention, or may be contained in different layers. This different layer may be a layer made of an adhesive composition different from that of the present invention, or may be a resin layer that is not an adhesive layer (that does not contribute to adhesion). The layer, which differs from the invention, is preferably insulating.
接着フィルムは、例えば、本発明の接着剤組成物を、必要に応じて有機溶剤と混合した後に、剥離基材上に塗布し、更に乾燥させて接着剤層を形成させることにより製造することができる。接着剤組成物の塗布は、バーコーター等の塗布装置を用いて実施すればよい。ドクターブレード法など、公知の接着フィルムの塗布方式を用いることができる。複数層からなる接着フィルムを製造する場合、上記塗布、乾燥の工程を繰り返し複数回実施すればよい。もしくは個別に製造し、ラミネートなどで積層すればよい。 The adhesive film can be produced, for example, by mixing the adhesive composition of the present invention with an organic solvent, if necessary, applying it on a release substrate, and drying it to form an adhesive layer. can. Application of the adhesive composition may be carried out using a coating device such as a bar coater. A known adhesive film coating method such as a doctor blade method can be used. When manufacturing an adhesive film consisting of multiple layers, the coating and drying steps may be repeated multiple times. Alternatively, they may be manufactured individually and laminated by lamination or the like.
剥離基材は、接着フィルムを支持することができ、所期のタイミングにて接着フィルムから剥離することができるフィルム状物である限り特に限定されない。剥離基材の材料としては、例えば、ポリエチレンテレフタレート（ＰＥＴ）等のポリエステル、ポリプロピレン（ＰＰ）等のポリオレフィン、ポリ－４－メチルペンテン－１（ＰＭＰ）、ポリテトラフルオロエチレン（ＰＴＦＥ）等のプラスチック材料を用いてよい。剥離基材はまた、接着フィルムと接合する側の表面に剥離層を有する基材であってよく、剥離層は、例えば、シリコーン樹脂やポリオレフィン樹脂等の剥離剤を含んでよい。 The release base material is not particularly limited as long as it is a film-like material that can support the adhesive film and can be released from the adhesive film at the desired timing. Examples of materials for the release substrate include polyesters such as polyethylene terephthalate (PET), polyolefins such as polypropylene (PP), and plastic materials such as poly-4-methylpentene-1 (PMP) and polytetrafluoroethylene (PTFE). can be used. The release base material may also be a base material having a release layer on the surface to be bonded to the adhesive film, and the release layer may contain a release agent such as silicone resin or polyolefin resin, for example.
剥離基材の厚さは、特に限定されないが、好ましくは１００μｍ以下、より好ましくは８０μｍ以下、さらに好ましくは６０μｍ以下、さらにより好ましくは５０μｍ以下である。剥離基材の厚さの下限は、特に限定されないが、接着フィルムの製造時、スリット加工時の取り扱い性の観点から、好ましくは８μｍ以上である。 The thickness of the release substrate is not particularly limited, but is preferably 100 μm or less, more preferably 80 μm or less, still more preferably 60 μm or less, and even more preferably 50 μm or less. Although the lower limit of the thickness of the release base material is not particularly limited, it is preferably 8 μm or more from the viewpoint of handleability during production of the adhesive film and slitting.
本発明の接着フィルムの厚さは、特に限定されず目的に応じて適宜決定してよいが、好ましくは１μｍ以上、より好ましくは３μｍ以上、さらに好ましくは５μｍ以上である。接着剤層の厚さの上限は、特に限定されないが、好ましくは１００μｍ以下、より好ましくは８０μｍ以下、さらに好ましくは６０μｍ以下、さらにより好ましくは５０μｍ以下、特に好ましくは４０μｍ以下である。複数層で積層している場合は、合計の厚みとする。 The thickness of the adhesive film of the present invention is not particularly limited and may be appropriately determined according to the purpose, but is preferably 1 µm or more, more preferably 3 µm or more, and still more preferably 5 µm or more. Although the upper limit of the thickness of the adhesive layer is not particularly limited, it is preferably 100 μm or less, more preferably 80 μm or less, still more preferably 60 μm or less, even more preferably 50 μm or less, and particularly preferably 40 μm or less. If it is laminated with multiple layers, it is the total thickness.
接着フィルムは、所期の幅を有するようにスリット加工してよい。スリット加工の際、切削屑等により接着剤層が汚染されるのを防止すべく、その露出表面にカバーフィルムを設けてよい。この場合の厚みは、目的に応じて適宜選択すればよい。カバーフィルムは、接着フィルムのスリット加工時に使用される公知のフィルムを用いてよい。カバーフィルムはスリットなどの製造工程の他、接続使用に用いる製品として、使用時の汚染防止のために剥離基材とは別に設けられていてもよい。この場合、カバーフィルムは剥離性があることが好ましく、厚みは剥離基材と同じか、より薄いことが好ましい。 The adhesive film may be slit to have the desired width. A cover film may be provided on the exposed surface in order to prevent the adhesive layer from being contaminated by cutting debris or the like during slitting. The thickness in this case may be appropriately selected depending on the purpose. As the cover film, a known film used for slitting adhesive films may be used. The cover film may be provided separately from the release base material in order to prevent contamination during use as a product to be used for connecting, in addition to the manufacturing process such as the slit. In this case, the cover film preferably has releasability, and its thickness is preferably the same as or thinner than the release substrate.
本発明の接着フィルムは、高い接着強度を有し、常温・冷蔵環境下で一定期間保管した場合であっても、接着性の低下を抑制し得る。したがって、本発明の接着剤組成物は、ＦＰＣをガラス基板に実装するＦＯＧ実装等の基材違いにより高い接着強度が必要とされる接合にも好適に使用することができる。また、導電性粒子を含む場合、導電性ペーストや異方性導電ペーストとして用いることが可能である。 The adhesive film of the present invention has a high adhesive strength, and can suppress a decrease in adhesiveness even when stored for a certain period of time under a normal temperature/refrigerated environment. Therefore, the adhesive composition of the present invention can also be suitably used for bonding where high adhesive strength is required due to differences in base materials, such as FOG mounting, in which FPC is mounted on a glass substrate. Moreover, when it contains conductive particles, it can be used as a conductive paste or an anisotropic conductive paste.
［接続構造体］
本発明の接着剤組成物又は接着フィルムを用いて、電子部品同士を接着した接続構造体を製造することができる。本発明は、第１の電子部品と第２の電子部品とが本発明の接着剤組成物又は本発明の接着フィルムにより接続されている接続構造体を包含する。
[Connection structure]
Using the adhesive composition or adhesive film of the present invention, a connection structure in which electronic components are bonded together can be produced. The present invention includes a connected structure in which a first electronic component and a second electronic component are connected by the adhesive composition of the present invention or the adhesive film of the present invention.
第１の電子部品としては、例えば、一般的なＰＷＢでよく、リジッド基板、ガラス基板、セラミック基板、プラスチック基板、ＦＰＣ等が挙げられ、また、第２の電子部品としては、ＦＰＣ、ＩＣチップ、ＩＣチップ以外の半導体素子等が挙げられる。電子部品の制約は特になく、接続構造体の用途も特に制限はない。例えば、携帯情報端末に使用してもよく、車載用の電気的実装に用いてもよい。本発明においては、一例として、ＦＯＢ、ＦＯＧ、ＦＯＰ、ＦＯＦ、ＣＯＧ、ＣＯＰ等の多用な接続構造体を製造し得る。特に、ＦＯＧ、ＦＯＰに好ましく適用できる。 The first electronic component may be, for example, a general PWB such as a rigid substrate, glass substrate, ceramic substrate, plastic substrate, FPC, etc., and the second electronic component may be an FPC, IC chip, Examples include semiconductor elements other than IC chips. There are no particular restrictions on the electronic components, and there are no particular restrictions on the use of the connection structure. For example, it may be used for a mobile information terminal, or may be used for electrical mounting on a vehicle. In the present invention, as an example, various connection structures such as FOB, FOG, FOP, FOF, COG, and COP can be manufactured. In particular, it can be preferably applied to FOG and FOP.
［接続構造体の製造方法］
本発明の接続構造体の製造方法は、本発明の接着剤組成物又は接着フィルムにより第１の電子部品と第２の電子部品とが接続されている接続構造体を製造し得る限り特に限定されない。以下、本発明の接続構造体を製造する方法について一例を示す。
[Method for manufacturing connection structure]
The method for manufacturing the bonded structure of the present invention is not particularly limited as long as it can manufacture a bonded structure in which the first electronic component and the second electronic component are connected by the adhesive composition or the adhesive film of the present invention. . An example of the method for manufacturing the connection structure of the present invention is shown below.
一実施形態において、本発明の接続構造体の製造方法は、第１の電子部品と第２の電子部品とを、本発明の接着剤組成物又は接着フィルムを介在させて、圧着する工程を含む。 In one embodiment, the method for manufacturing a bonded structure of the present invention includes a step of pressure bonding a first electronic component and a second electronic component with the adhesive composition or adhesive film of the present invention interposed therebetween. .
はじめに第１の電子部品をステージに載置し、その上に本発明の接着剤組成物又は接着フィルムを設け、次いで第２の電子部品を載置する。ここで、ステージに載置した第１の電子部品上に本発明の接着剤組成物又は接着フィルムを設けた後、第１の電子部品の電極と第２の電子部品の電極が対向するように位置合わせし、第２の電子部品側から圧着ツールにて仮圧着を実施する。仮圧着時の温度、圧力及び時間は、具体的な設計に応じて適宜決定してよく、例えば６０～８０℃、０．５～２ＭＰａ、０．５～２秒間とし得る。後述する本圧着を実施するに先立ち、斯かる仮圧着を実施することにより、電子部品同士（それぞれの部品の導通部同士）をより精確に位置合わせして接続することができ好適である。仮圧着を行うことで、より高圧力で押圧する本圧着時の位置ずれの抑制が期待できる。 First, a first electronic component is placed on a stage, the adhesive composition or adhesive film of the present invention is provided thereon, and then a second electronic component is placed. Here, after the adhesive composition or adhesive film of the present invention is provided on the first electronic component placed on the stage, the electrodes of the first electronic component and the electrodes of the second electronic component are arranged to face each other. After alignment, temporary crimping is performed from the side of the second electronic component using a crimping tool. The temperature, pressure and time during temporary compression may be appropriately determined according to the specific design, and may be, for example, 60 to 80° C., 0.5 to 2 MPa, and 0.5 to 2 seconds. It is preferable that the electronic components (conducting portions of the respective components) can be aligned and connected more accurately by performing such temporary pressure bonding prior to performing the main pressure bonding described later. By performing the temporary pressure bonding, it is expected that the positional displacement at the time of the final pressure bonding in which a higher pressure is applied is suppressed.
仮圧着の後、第２の電子部品側から圧着ツールにて本圧着を実施する。本圧着時の温度、圧力及び時間は、接着フィルムを用いて電子部品を接着する際に用いられる公知の任意の条件としてよく、具体的な設計に応じて適宜決定してよい。例えば、低温（例えば、２００℃以下、１８０℃以下、１６０℃以下）かつ短時間（例えば、１０秒間以下、８秒間以下、６秒間以下）の圧着であっても、第１の電子部品と第２の電子部品を良好に接着することが可能である。 After the temporary crimping, the main crimping is performed from the side of the second electronic component using a crimping tool. The temperature, pressure, and time during the final pressure bonding may be any known conditions used when bonding electronic components using an adhesive film, and may be appropriately determined according to a specific design. For example, even with low temperature (e.g., 200° C. or less, 180° C. or less, 160° C. or less) and short time (e.g., 10 seconds or less, 8 seconds or less, 6 seconds or less), the first electronic component and the second 2 electronic components can be adhered well.
なお、仮圧着、本圧着の別を問わず、第２の電子部品と圧着ツールの間に緩衝材（例えば緩衝シート）を設けてよい。緩衝材は、その使用の有無も含めて、電子部品の組み合わせに応じて適宜調整、決定すればよい。 A cushioning material (for example, a cushioning sheet) may be provided between the second electronic component and the crimping tool regardless of whether it is temporary crimping or final crimping. The cushioning material may be appropriately adjusted and determined depending on the combination of electronic components, including whether or not it is used.
本発明の接着剤組成物又は接着フィルムは、常温・冷蔵環境下で一定期間保管した場合であっても、接着性の低下を抑制することができる。例えば、１６０℃、３ＭＰａ、５秒間という接着条件にて接着した場合に、本発明の接着剤組成物又は接着フィルムを用いて製造されたＦＰＣとガラス基板との接続構造体は、製造直後の接着剤組成物（接着フィルム）を用いたか常温・冷蔵環境下で一定期間保管した接着剤組成物（接着フィルム）を用いたかによらず、９０度剥離試験において１０Ｎ／ｃｍ以上の接着強度を呈することができる。 ADVANTAGE OF THE INVENTION The adhesive composition or adhesive film of this invention can suppress the deterioration of adhesiveness, even when it is stored for a certain period of time in a normal temperature and refrigeration environment. For example, when the bonding is performed under the bonding conditions of 160° C., 3 MPa, and 5 seconds, the connection structure between the FPC and the glass substrate manufactured using the adhesive composition or the adhesive film of the present invention does not adhere immediately after manufacturing. Regardless of whether the adhesive composition (adhesive film) is used or the adhesive composition (adhesive film) stored for a certain period of time in a room temperature/refrigerated environment is used, it exhibits an adhesive strength of 10 N/cm or more in a 90 degree peel test. can be done.
以下、本発明について、実施例を示して具体的に説明する。ただし、本発明は、以下に示す実施例に限定されるものではない。以下の説明において、量を表す「部」及び「％」は、別途明示のない限り、「質量部」及び「質量％」をそれぞれ意味する。 EXAMPLES Hereinafter, the present invention will be specifically described with reference to Examples. However, the present invention is not limited to the examples shown below. In the following description, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified.
［実施例１］
－接着剤組成物の調製－
ビスフェノールＦ型エポキシ樹脂（商品名：エピコート４００７Ｐ、三菱ケミカル（株）製、Ｍｗ＝２０，０００～３０，０００）２６．４部、フェノキシ樹脂（商品名：ＦＸ２９３、日鉄ケミカル＆マテリアル（株）製、Ｍｗ＝４０，０００～５０，０００）２６．４部、２官能脂環式エポキシ化合物（商品名：セロキサイド２０２１Ｐ、（株）ダイセル製、下記式（５）で表される化合物）１８．９部、ビスフェノールＡ型エポキシ樹脂（商品名：ＹＬ９８０、三菱ケミカル（株）製、Ｍｗ＝３００～２，２００）７．６部、シランカップリング剤（商品名：Ｘ－１２－１１５４、信越化学工業（株）製）０．８部、第４級アンモニウム塩系熱酸発生剤（商品名：ＣＸＣ－１８２１、Ｋｉｎｇ Ｉｎｄｕｓｔｒｉｅｓ，Ｉｎｃ．製）２．３部、導電性粒子（商品名：ミクロパール、積水化学工業（株）製、平均粒径４μｍのＮｉ樹脂粒子）５．０部、ブタジエン系ゴム（商品名：ＲＫＢ－５５１５Ｂ、レジナス化成（株）製）１２．６部を、溶媒としてＰＭＡを全体の固形分が４３．４％になるよう加え、均一に混合して、接着剤組成物を得た。
[Example 1]
-Preparation of adhesive composition-
Bisphenol F type epoxy resin (trade name: Epicoat 4007P, manufactured by Mitsubishi Chemical Corporation, Mw = 20,000 to 30,000) 26.4 parts, phenoxy resin (trade name: FX293, Nippon Steel Chemical & Materials Co., Ltd.) (Mw=40,000 to 50,000) 26.4 parts, bifunctional alicyclic epoxy compound (trade name: Celoxide 2021P, manufactured by Daicel Corporation, compound represented by the following formula (5))18. 9 parts, bisphenol A type epoxy resin (trade name: YL980, manufactured by Mitsubishi Chemical Corporation, Mw = 300 to 2,200) 7.6 parts, silane coupling agent (trade name: X-12-1154, Shin-Etsu Chemical Kogyo Co., Ltd.) 0.8 parts, quaternary ammonium salt-based thermal acid generator (trade name: CXC-1821, King Industries, Inc.) 2.3 parts, conductive particles (trade name: Micropearl , Sekisui Chemical Co., Ltd., Ni resin particles with an average particle size of 4 μm) 5.0 parts, butadiene rubber (trade name: RKB-5515B, manufactured by Resinus Kasei Co., Ltd.) 12.6 parts, PMA as a solvent was added so that the total solid content was 43.4% and mixed uniformly to obtain an adhesive composition.
－接着フィルムの作製－
剥離基材として、ＰＥＴフィルム（厚さ５０μｍ）を用意した。この剥離基材上に、乾燥後の接着フィルム（接着剤層）の厚さが１８μｍとなるように、接着剤組成物を均一に塗布した。その後、７０℃のオーブン中で５分間乾燥させて、剥離基材上に接着剤層を形成した。次いで、接着剤層の露出面に、カバーフィルムを４５℃でラミネート処理した。
-Preparation of adhesive film-
A PET film (thickness: 50 μm) was prepared as a release substrate. The adhesive composition was evenly applied onto this release base material so that the thickness of the adhesive film (adhesive layer) after drying was 18 μm. After that, it was dried in an oven at 70° C. for 5 minutes to form an adhesive layer on the release substrate. A cover film was then laminated at 45° C. to the exposed surface of the adhesive layer.
［実施例２および３、比較例１および２］
シランカップリング剤等の配合量を表１に示すとおり変更した以外は、実施例１と同様にして、接着剤組成物を調製し、接着フィルムを作製した。
[Examples 2 and 3, Comparative Examples 1 and 2]
An adhesive composition was prepared and an adhesive film was produced in the same manner as in Example 1, except that the amounts of the silane coupling agent and the like were changed as shown in Table 1.
［比較例３～６］
シランカップリング剤を、１分子中にエポキシ基を１つ有するもの（商品名：Ａ１８７、東レ・ダウコーニング（株）製）、１分子中にエポキシ基を２以上有するもの（商品名：Ｘ－１２－９８１Ｓ、信越化学工業（株）製）、１分子中にイソシアネート基を２以上有するもの（商品名：Ｘ－１２－１１５９Ｌ、信越化学工業（株）製）、１分子中にアミノ基を２以上有するもの（商品名：Ｘ－１２－９７２Ｆ、信越化学工業（株）製）に変更し、各成分の配合量を表１に示す通り変更した以外は、実施例１と同様にして、接着剤組成物を調製し、接着フィルムを作製した。
[Comparative Examples 3 to 6]
A silane coupling agent having one epoxy group in one molecule (trade name: A187, manufactured by Dow Corning Toray Co., Ltd.), one having two or more epoxy groups in one molecule (trade name: X- 12-981S, manufactured by Shin-Etsu Chemical Co., Ltd.), those having two or more isocyanate groups in one molecule (trade name: X-12-1159L, manufactured by Shin-Etsu Chemical Co., Ltd.), amino groups in one molecule 2 or more (trade name: X-12-972F, manufactured by Shin-Etsu Chemical Co., Ltd.) in the same manner as in Example 1, except that the blending amount of each component was changed as shown in Table 1. An adhesive composition was prepared and an adhesive film was produced.
［実施例４、比較例７～１０］
４官能チオール化合物（商品名：カレンズＭＴ ＰＥ１、昭和電工（株）製）を配合し、シランカップリング剤の種類、各成分の配合量を表１に示すとおり変更した以外は、実施例１と同様にして、接着剤組成物を調製し、接着フィルムを作製した。
[Example 4, Comparative Examples 7 to 10]
A tetrafunctional thiol compound (trade name: Karenz MT PE1, manufactured by Showa Denko Co., Ltd.) was blended, and the type of silane coupling agent and the amount of each component were changed as shown in Table 1, except that Example 1 was used. Similarly, an adhesive composition was prepared and an adhesive film was produced.
以下、試験・評価方法について説明する。 The test/evaluation method will be described below.
＜圧着状態＞
－接続構造体の作製－
実施例及び比較例で作製した接着フィルムを幅１．０ｍｍにスリット加工した後、カバーフィルムを剥離した。次いで、接着剤層の露出面がＡｌＭｏＩＺＯガラス基板（厚さ０．７ｍｍ）と接合するように、接着フィルムをガラス基板のエッジに貼り、４５℃のホットプレート上で均一に力を加えた。その後、剥離基材を剥離し、接着剤層の露出面が完全に覆われるようにフレキシブルプリント基板（ＦＰＣ；厚さ５０μｍ）の金配線部分を接続し貼り合わせた。接着剤層を介在させてＦＰＣとガラス基板とを熱圧着し、ＦＰＣとガラス基板の対向した導通部を全て接着剤層の硬化物により接着することで接続された接続構造体を得た。熱圧着の条件は、１６０℃、３ＭＰａ、５秒間であった。
<Crimp state>
-Production of connection structure-
After slitting the adhesive films produced in Examples and Comparative Examples to a width of 1.0 mm, the cover film was peeled off. Then, the adhesive film was applied to the edge of the glass substrate so that the exposed surface of the adhesive layer was bonded to the AlMoIZO glass substrate (thickness 0.7 mm), and a uniform force was applied on a hot plate at 45°C. After that, the release base material was peeled off, and the gold wiring portion of the flexible printed circuit board (FPC; thickness 50 μm) was connected and pasted so that the exposed surface of the adhesive layer was completely covered. The FPC and the glass substrate were thermo-compressed with an adhesive layer interposed therebetween, and all of the facing conduction portions of the FPC and the glass substrate were adhered by the cured adhesive layer to obtain a connected structure. The thermocompression bonding conditions were 160° C., 3 MPa, and 5 seconds.
得られた接続構造体について、接着直後と、プレッシャークッカー装置（１１０℃、８５％ＲＨ）内に３２時間保持した後に、微分干渉顕微鏡を用いてＡｌＭｏＩＺＯガラス基板上の金属薄膜を観察した。評価は、極微小な凹凸状態が強く観察され圧着が強い（〇）、凹凸状態が弱く圧着が弱い（△）、凹凸が確認できず接合が不十分（×）の３段階で判断した。 The metal thin film on the AlMoIZO glass substrate was observed with a differential interference microscope immediately after bonding and after holding in a pressure cooker (110° C., 85% RH) for 32 hours. The evaluation was made on a three-point scale: strongly observed microscopic irregularities and strong crimping (○), weak irregularities and weak crimping (Δ), and insufficient bonding with no irregularities (x).
＜接着剤層の浮き＞
－接続構造体の作製－
実施例及び比較例で作製した接着フィルムを幅１．０ｍｍにスリット加工した後、カバーフィルムを剥離した。次いで、接着剤層の露出面がＳｉＮガラス基板またはＩＴＯガラス基板（厚さ各０．７ｍｍ）と接合するように、接着フィルムをガラス基板のエッジに貼り、４５℃のホットプレート上で均一に力を加えた。その後、剥離基材を剥離し、接着剤層の露出面が完全に覆われるようにフレキシブルプリント基板（ＦＰＣ；厚さ５０μｍ）の金配線部分を接続し貼り合わせた。接着剤層を介在させてＦＰＣとガラス基板とを熱圧着し、ＦＰＣとガラス基板の対向した導通部を全て接着剤層の硬化物により接着することで接続された接続構造体を得た。熱圧着の条件は、１６０℃、３ＭＰａ、５秒間であった。
<Float of adhesive layer>
-Production of connection structure-
After slitting the adhesive films produced in Examples and Comparative Examples to a width of 1.0 mm, the cover film was peeled off. Next, the adhesive film was attached to the edge of the glass substrate so that the exposed surface of the adhesive layer was bonded to the SiN glass substrate or the ITO glass substrate (thickness: 0.7 mm each), and the adhesive film was uniformly applied on a hot plate at 45°C. was added. After that, the release base material was peeled off, and the gold wiring portion of the flexible printed circuit board (FPC; thickness 50 μm) was connected and pasted so that the exposed surface of the adhesive layer was completely covered. The FPC and the glass substrate were thermo-compressed with an adhesive layer interposed therebetween, and all of the facing conduction portions of the FPC and the glass substrate were adhered by the cured adhesive layer to obtain a connected structure. The thermocompression bonding conditions were 160° C., 3 MPa, and 5 seconds.
得られた接続構造体について、接着直後と、プレッシャークッカー装置（１１０℃、８５％ＲＨ）内に３２時間保持した後に、視認により接着剤層の浮き状態を確認した。評価は、浮きがない（〇）、わずかに浮きあり（△）、浮きあり（×）の３段階で行った。 Immediately after adhesion and after holding for 32 hours in a pressure cooker (110° C., 85% RH), the bonding structure obtained was visually checked for floating state of the adhesive layer. Evaluation was carried out in three stages: no lift (◯), slight lift (Δ), and lift (×).
＜導通抵抗の評価＞
接着剤層の浮きを評価したＩＴＯガラス基板とＦＰＣとの接続構造体について、接着直後と、プレッシャークッカー装置（１１０℃、８５％ＲＨ）内に３２時間保持した後に、導通抵抗を測定した。
<Evaluation of conduction resistance>
The conduction resistance of the connection structure between the ITO glass substrate and the FPC for which floating of the adhesive layer was evaluated was measured immediately after adhesion and after holding for 32 hours in a pressure cooker (110° C., 85% RH).
＜接着強度の評価＞
圧着状態を評価した接続構造体について、９０度剥離試験により接着強度を測定した。詳細には、ＦＰＣおよび硬化物を長さ１．０ｃｍになるよう切り込み、その長さ１．０ｃｍのＦＰＣをつかみ具で掴み、室温（２５℃）下、５０ｍｍ／分の速度で垂直方向にＦＰＣがガラス基板から剥離するまで引き剥がした時の荷重（Ｎ／ｃｍ）を測定した。なお、測定には、テンシロン試験機（株式会社オリエンテック製：ＳＴＡ－１１５０）を使用した。また、５５℃、１２時間保管した接続構造体についても、同様に接着強度について評価した。
<Evaluation of adhesive strength>
The bonding strength was measured by a 90-degree peeling test for the connection structure for which the crimped state was evaluated. Specifically, the FPC and the cured product were cut to a length of 1.0 cm, the FPC with a length of 1.0 cm was gripped with a gripper, and the FPC was cut vertically at a speed of 50 mm / min at room temperature (25 ° C.). The load (N/cm) when peeled off from the glass substrate was measured. For the measurement, a Tensilon tester (manufactured by Orientec Co., Ltd.: STA-1150) was used. In addition, the bonding strength was similarly evaluated for the connection structure stored at 55° C. for 12 hours.
実施例及び比較例の構成成分および評価結果を表１に示す。 Table 1 shows the constituent components and evaluation results of Examples and Comparative Examples.
表１の結果から、１分子中に２以上のメルカプト基を有するシランカップリング剤を使用した場合、ガラスとＦＰＣの異なる基材を接合する際にも、１０Ｎ／ｃｍという高い接着強度が発現することが確認された。 From the results in Table 1, when a silane coupling agent having two or more mercapto groups in one molecule is used, a high adhesive strength of 10 N/cm is exhibited even when bonding different substrates such as glass and FPC. was confirmed.
また、比較例３～６によれば、主鎖が有機鎖であって、メルカプト基以外の反応基、例えば、エポキシ基、イソシアネート基、およびアミノ基を１分子中に２以上有するシランカップリング剤を使用した場合、接着強度が十分でなく、圧着状態や浮きの問題が発生し、導通抵抗も高くなることが確認された。 Further, according to Comparative Examples 3 to 6, a silane coupling agent having an organic main chain and two or more reactive groups other than a mercapto group, such as an epoxy group, an isocyanate group, and an amino group, in one molecule. was used, it was confirmed that the adhesive strength was not sufficient, problems of crimped state and floating occurred, and the conduction resistance increased.
さらに、メルカプト基の影響を確認するために４官能チオール化合物を配合した接着剤組成物（比較例７～１０、実施例４）では、４官能チオール化合物を配合しない接着剤組成物（比較例３～６、実施例２）と、接着強度や圧着状態等に大きな相違が認められず、１分子中に２以上のメルカプト基を有するシランカップリング剤が接着強度当の向上に有用であることが確認された。 Furthermore, in the adhesive composition containing a tetrafunctional thiol compound (Comparative Examples 7 to 10, Example 4) to confirm the influence of the mercapto group, the adhesive composition containing no tetrafunctional thiol compound (Comparative Example 3 ~ 6, Example 2) and no significant difference in adhesive strength, crimped state, etc., and it is confirmed that a silane coupling agent having two or more mercapto groups in one molecule is useful for improving adhesive strength. confirmed.
Claims (8)
第４級アンモニウム塩系熱酸発生剤であるカチオン重合開始剤と、
１分子中に２以上のメルカプト基を有し、主鎖が有機鎖であるシランカップリング剤と、を含み、前記シランカップリング剤の含有量が０．３質量％以上３質量％以下である、接着剤組成物。 a binder composition containing a cationic polymerizable component and a film-forming component;
a cationic polymerization initiator that is a quaternary ammonium salt-based thermal acid generator;
and a silane coupling agent having two or more mercapto groups in one molecule and having an organic main chain, and the content of the silane coupling agent is 0.3% by mass or more and 3% by mass or less. , an adhesive composition.
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| KR1020237034295A KR20230153475A (en) | 2021-06-03 | 2022-04-27 | Adhesive compositions, adhesive films, bonded structures and methods for producing bonded structures |
| CN202280036926.9A CN117355591A (en) | 2021-06-03 | 2022-04-27 | Adhesive composition, adhesive film, connection structure, and method for producing connection structure |
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