JP2021535615A - シリコン含有層を形成する方法 - Google Patents
シリコン含有層を形成する方法 Download PDFInfo
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- JP2021535615A JP2021535615A JP2021511612A JP2021511612A JP2021535615A JP 2021535615 A JP2021535615 A JP 2021535615A JP 2021511612 A JP2021511612 A JP 2021511612A JP 2021511612 A JP2021511612 A JP 2021511612A JP 2021535615 A JP2021535615 A JP 2021535615A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 121
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 121
- 239000010703 silicon Substances 0.000 title claims abstract description 121
- 238000000034 method Methods 0.000 title claims abstract description 104
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 8
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 26
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 26
- 229920001296 polysiloxane Polymers 0.000 claims description 25
- 238000000151 deposition Methods 0.000 claims description 16
- 230000001590 oxidative effect Effects 0.000 claims description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 9
- 230000007547 defect Effects 0.000 claims description 7
- 230000006837 decompression Effects 0.000 claims description 6
- 239000007800 oxidant agent Substances 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 abstract description 23
- 238000007254 oxidation reaction Methods 0.000 abstract description 23
- 238000010586 diagram Methods 0.000 abstract 1
- 238000006467 substitution reaction Methods 0.000 abstract 1
- 230000008569 process Effects 0.000 description 47
- 238000012545 processing Methods 0.000 description 35
- 238000004140 cleaning Methods 0.000 description 13
- 238000012546 transfer Methods 0.000 description 11
- 230000008021 deposition Effects 0.000 description 7
- 239000007789 gas Substances 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
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Abstract
Description
基板自体の表面上で直接膜処理することに加えて、本開示では、開示された任意の膜処理ステップは、以下でより詳細に開示される基板上に形成された下層にも実行され得る。「基板表面」という用語は、文脈が示すように、かかる下層を含むことが意図される。したがって、例えば、膜/層または部分的な膜/層が基板表面上に堆積している場合、新たに堆積した膜/層の曝露面が基板表面となる。
いくつかの実施形態では、シリコン層は、実質的に酸素原子を含まない。いくつかの実施形態では、シリコンキャップは、動作106の間、いかなる酸化剤にも曝露されない。いくつかの実施形態では、シリコンキャップは、実質的に酸素原子を含まない。
いくつかの実施形態では、中央搬送ステーション910に接続された2つの予洗浄/バッファチャンバ920がある。
第1の処理チャンバ930は、シリコン堆積チャンバとして構成され得、反応性ガスの一以上の流れを第1の処理チャンバ930に供給するために、一以上の反応性ガス源と流体連通し得る。基板は、絶縁バルブ914を通過するロボット912によって、堆積チャンバ930を出入りするように移動し得る。
したがって、この明細書全体の様々な箇所での「一以上の実施形態で」、「特定の実施形態で」、「一実施形態で」、または「実施形態で」などの表現は、必ずしも本開示の同一の実施形態に言及するものではない。さらに、特定の特徴、構造、材料、または特性は、一以上の実施形態において任意の適した様態で組み合わせることができる。
Claims (15)
- シリコンキャップを形成する方法であって、
第1の温度で維持された基板材料の表面上にシリコン層を堆積させること、および
減圧を壊すことなく第2の温度で前記シリコン層を処理して、実質的に酸素原子を含まないシリコンキャップを形成すること
を含む、方法。 - 前記基板材料が、SiGeを含む、請求項1に記載の方法。
- 前記シリコンキャップが、実質的にゲルマニウムを含まない、請求項2に記載の方法。
- 前記表面には3次元の特徴が形成され、前記シリコンキャップが前記表面に対して共形である、請求項1に記載の方法。
- 前記第1の温度が約700℃以下である、請求項1に記載の方法。
- 前記シリコン層を処理することが、欠陥が低減され、または改良された電気特性を有するシリコンキャップを提供する、請求項1に記載の方法。
- 前記シリコンキャップを酸化することをさらに含む、請求項1に記載の方法。
- 前記シリコンキャップを酸化することが、実質的にプラズマを含まない酸化剤に前記シリコンキャップを曝露することを含む、請求項7に記載の方法。
- 前記シリコンキャップを曝露することが、約600℃から約700℃の範囲内の温度で実行される、請求項8に記載の方法。
- 前記シリコンキャップを酸化することが、酸化剤のプラズマに前記シリコンキャップを曝露することを含む、請求項7に記載の方法。
- 前記シリコンキャップを曝露することが、約450℃から約500℃の範囲内の温度で実行される、請求項10に記載の方法。
- 前記シリコンキャップが所定の深さまで酸化される、請求項7に記載の方法。
- 前記シリコンキャップが原子状酸素の所定の濃度まで酸化される、請求項7に記載の方法。
- 前記シリコンキャップが共形に酸化される、請求項7に記載の方法。
- 置換金属ゲートを形成する方法であって、
SiGeを含む基板材料の、3次元の特徴が形成された表面上に、約1nmから約3nmの範囲内の厚さを有し、実質的にゲルマニウム原子を含まないシリコン層を共形に堆積させること、
減圧を壊さずに前記シリコン層を処理して、前記シリコン層に対して欠陥が低減され、改良された電気特性を有し、実質的に酸素原子もゲルマニウム原子も含まないシリコンキャップを形成すること、
前記シリコンキャップを酸化して、前記シリコンキャップ上に酸化ケイ素キャッピング層を形成すること、
前記酸化ケイ素キャッピング層上にダミーポリ層を堆積させること、
前記ダミーポリ層および前記酸化ケイ素キャッピング層を除去すること、および
前記シリコンキャップ上に置換金属ゲートを形成すること
を含む、方法。
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