JP2021507208A - カーボンナノチューブセンサが第1および第2の基板上に位置付けられた感知デバイス - Google Patents
カーボンナノチューブセンサが第1および第2の基板上に位置付けられた感知デバイス Download PDFInfo
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Abstract
Description
本出願は、2017年12月19日に出願された米国仮特許出願第62/607,503号の利益を主張する。この出願の内容は、その全体が参照により組み込まれている。
Claims (35)
- 感知デバイスであって、
内部を通って延伸する複数のTSVを有する第1の基板と、
前記第1の基板に隣接して位置付けられた第2の基板であって、前記TSVが、前記第2の基板に電気的に接続されている、第2の基板と、
前記第1の基板上に位置付けられた少なくとも1つのカーボンナノチューブセンサと、
複数の接触パッドであって、各接触パッドが、前記TSVのうちの1つに、かつ前記カーボンナノチューブセンサのうちの1つに電気的に接続されるように、ならびに前記カーボンナノチューブセンサのうちの前記1つの端部が、前記接触パッドに埋め込まれるように、各接触パッドが、前記第1の基板上に、かつ前記カーボンナノチューブセンサのうちの前記1つの上に位置付けられる、複数の接触パッドと、を備える、感知デバイス。 - 前記第1の基板が、シリコンまたはガラスで構築される、請求項1に記載の感知デバイス。
- 前記第2の基板が、PCBである、請求項1に記載の感知デバイス。
- 前記第2の基板が、前記第1の基板が隣接する、前記第2の基板の側面とは反対の前記第2の基板の側面にゲートを含む、請求項3に記載の感知デバイス。
- はんだバンプが、前記TSVと前記第2の基板との間に提供されている、請求項4に記載の感知デバイス。
- 前記第1の基板と前記第2の基板との間の界面の周りに位置付けられた封止材をさらに備える、請求項1に記載の感知デバイス。
- 前記封止材が、エポキシ、プラスチック、およびシリコーンのうちの1つである、請求項6に記載の感知デバイス。
- 前記接触パッドが、Ti、TiN、Pd、Au、およびPtのうちの1つで形成される、請求項1に記載の感知デバイス。
- 前記第1の基板と前記第2の基板との間に絶縁層をさらに備える、請求項1に記載の感知デバイス。
- 前記絶縁層が、SiO2およびSiNのうちの1つから形成される、請求項9に記載の感知デバイス。
- 前記第1の基板上に複数のさらなるカーボンナノチューブセンサをさらに備える、請求項1に記載の感知デバイス。
- 各接触パッドから外向きに延伸する延伸部をさらに備える、請求項1に記載の感知デバイス。
- 感知デバイスを形成する方法であって、
第1の基板に複数のTSVを形成するステップと、
前記第1の基板上に少なくとも1つのカーボンナノチューブセンサを堆積させるステップと、
前記第1の基板上に、かつ前記カーボンナノチューブセンサのうちの1つに一対の接触パッドを形成するステップであって、それによって各接触パッドが、前記TSVのうちの1つに、かつ前記カーボンナノチューブセンサのうちの前記1つに電気的に接続される、ならびにそれによって前記カーボンナノチューブセンサのうちの前記1つの端部が、前記各接触パッドに埋め込まれる、ステップと、
前記第1の基板を第2の基板に隣接して位置付けるステップと、
前記TSVと前記第2の基板との間に電気的接続を形成するステップと、を含む、感知デバイスを形成する方法。 - 前記第1の基板と前記第2の基板との間の界面を封入するステップをさらに含む、請求項13に記載の方法。
- 前記封入するステップが、エポキシ、プラスチック、およびシリコーンのうちの1つで実践される、請求項14に記載の方法。
- 前記第1の基板上に前記カーボンナノチューブセンサを堆積させる前に、前記第1の基板上に絶縁層を位置付けるステップをさらに含む、請求項13に記載の方法。
- 絶縁層が、SiO2およびSiNのうちの1つから形成される、請求項13に記載の方法。
- 前記第1の基板が隣接する前記第2の基板の側面と反対の前記第2の基板の側面にゲートを提供するステップをさらに含む、請求項13に記載の方法。
- 前記第1の基板が、シリコンまたはガラスで構築される、請求項13に記載の方法。
- 前記第2の基板が、PCBである、請求項13に記載の方法。
- 前記TSVと前記第2の基板との間に電気的接続を形成する前記ステップが、
前記TSVと前記第2の基板との間に、はんだバンプを位置付けるステップと、
前記デバイスを加熱して、前記はんだバンプを溶融し、前記電気的接続を形成するステップと、を含む、請求項13に記載の方法。 - 前記接触パッドが、Ti、TiN、Pd、Au、およびPtのうちの1つで形成される、請求項13に記載の方法。
- 複数のカーボンナノチューブセンサが、前記第1の基板上に堆積される、請求項13に記載の方法。
- 各接触パッドが、外向きに延伸する延伸部を含む、請求項13に記載の方法。
- 感知デバイスを形成する方法であって、
第1の基板に複数のTSVを形成するステップと、
前記第1の基板上に複数のカーボンナノチューブセンサを堆積させるステップと、
前記第1の基板上に、かつ前記カーボンナノチューブセンサのうちの1つに複数の接触パッドの対を形成するステップであって、それによって各接触パッドが、前記TSVのうちの1つに、かつ前記カーボンナノチューブセンサのうちの前記1つに電気的に接続される、ならびにそれによって前記カーボンナノチューブセンサのうちの前記1つの端部が、前記各接触パッドに埋め込まれる、ステップと、
前記第1の基板をダイシングして、複数の第1の基板を形成するステップであって、前記複数の第1の基板の各々が、複数のカーボンナノチューブセンサ、TSV、および接触パッドを含む、ステップと、
各第1の基板を第2の基板に隣接して位置付けるステップと、
前記TSVと前記第2の基板との間に電気的接続を形成するステップと、を含む、方法。 - 前記第1の基板と前記第2の基板との間の界面を封入するステップをさらに含む、請求項25に記載の方法。
- 前記封入するステップが、エポキシ、プラスチック、およびシリコーンのうちの1つで実践される、請求項26に記載の方法。
- 前記第1の基板上に前記カーボンナノチューブセンサを堆積させる前に、前記第1の基板上に絶縁層を位置付けるステップをさらに含む、請求項25に記載の方法。
- 絶縁層が、SiO2およびSiNのうちの1つで形成される、請求項25に記載の方法。
- 前記第1の基板のうちの1つが隣接する各第2の基板の側面と反対の各第2の基板の側面上にゲートを提供するステップをさらに含む、請求項25に記載の方法。
- 前記第1の基板がシリコンまたはガラスで構築される、請求項25に記載の方法。
- 前記第2の基板が、PCBである、請求項25に記載の方法。
- 前記TSVと前記第2の基板との間に電気的接続を形成する前記ステップが、
前記TSVと前記第2の基板との間に、はんだバンプを位置付けるステップと、
前記デバイスを加熱して、前記はんだバンプを溶融し、前記電気的接続を形成するステップと、を含む、請求項25に記載の方法。 - 前記接触パッドが、Ti、TiN、Pd、Au、およびPtのうちの1つで形成される、請求項25に記載の方法。
- 各接触パッドが、外向きに延伸する延伸部を含む、請求項25に記載の方法。
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