JP2021190534A - 電子部品 - Google Patents
電子部品 Download PDFInfo
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- JP2021190534A JP2021190534A JP2020093568A JP2020093568A JP2021190534A JP 2021190534 A JP2021190534 A JP 2021190534A JP 2020093568 A JP2020093568 A JP 2020093568A JP 2020093568 A JP2020093568 A JP 2020093568A JP 2021190534 A JP2021190534 A JP 2021190534A
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- 239000003990 capacitor Substances 0.000 abstract description 108
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 238000009434 installation Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000005192 partition Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- -1 and for example Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/14—Protection against electric or thermal overload
- H01G2/16—Protection against electric or thermal overload with fusing elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/236—Terminals leading through the housing, i.e. lead-through
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/0241—Structural association of a fuse and another component or apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/08—Fusible members characterised by the shape or form of the fusible member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
- H01H85/175—Casings characterised by the casing shape or form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/20—Bases for supporting the fuse; Separate parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/20—Bases for supporting the fuse; Separate parts thereof
- H01H85/205—Electric connections to contacts on the base
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fuses (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
端子電極が形成された複数のチップ部品と、
前記チップ部品を収容可能な収容凹部を複数有するケースと、
前記ケースに固定され、複数の前記チップ部品の前記端子電極にそれぞれ接続される複数の導電性端子と、
複数の前記チップ部品同士を電気的に接続するヒューズと、を有する。
端子電極が形成されたチップ部品と、
前記チップ部品を収容可能な収容凹部を複数有するケースと、
前記ケースに固定され、前記チップ部品の前記端子電極に接続される導電性端子と、
前記チップ部品に電気的に接続されるヒューズと、を有する。
図1に示すように、本発明の第1実施形態に係る電子部品10は、2つのコンデンサチップ(チップ部品)20a,20bと、一対の導電性端子30a,30bと、絶縁ケース70と、ヒューズ80とを有する。電子部品10は、例えばノイズフィルタとして用いられる。
本発明の第2実施形態に係る電子部品10Aは、以下に示す点を除いて、第1実施形態に係る電子部品10と同様な構成を有し、同様な作用効果を奏する。図5〜図8において、第1実施形態の電子部品10における各部材と共通する部材には、共通の符号を付し、その説明は一部省略する。
本発明の第3実施形態に係る電子部品10Bは、以下に示す点を除いて、第1実施形態に係る電子部品10と同様な構成を有し、同様な作用効果を奏する。図9〜図11において、第1実施形態の電子部品10における各部材と共通する部材には、共通の符号を付し、その説明は一部省略する。
本発明の第4実施形態に係る電子部品10Cは、以下に示す点を除いて、第2実施形態に係る電子部品10Aと同様な構成を有し、同様な作用効果を奏する。図12〜図14において、第2実施形態の電子部品10Aにおける各部材と共通する部材には、共通の符号を付し、その説明は一部省略する。
20a,20b…コンデンサチップ
21…第1端面
23…第2端面
22…第1端子電極
24…第2端子電極
26…内部電極層
28…誘電体層
30a,30b,30a’,30b’,40a,40b…第1導電性端子,第2導電性端子
32,42…内側電極部
320…湾曲部
34,44…開口縁電極部
36,46…側面電極部
60…連結導電性端子
62…内側電極部
620…湾曲部
64…接続部
70,70A,70B,70C,70C’…絶縁ケース
71…外壁
71a,71b,71c,71d…側面
72a,72b…収容凹部
73…底壁
74…仕切壁
75…連絡溝
76…開口縁面
760…段差部
77…ヒューズ用孔
78…端子設置溝
79…連結部
790…係合凸部
791…係合凹部
80,80A,80B…ヒューズ
81,82…電極
Claims (13)
- 端子電極が形成された複数のチップ部品と、
前記チップ部品を収容可能な収容凹部を複数有するケースと、
前記ケースに固定され、複数の前記チップ部品の前記端子電極にそれぞれ接続される複数の導電性端子と、
複数の前記チップ部品同士を電気的に接続するヒューズと、を有する電子部品。 - 前記ヒューズは、複数の前記導電性端子のいずれかを介して、複数の前記チップ部品同士を接続している請求項1に記載の電子部品。
- 前記ヒューズは、複数の前記チップ部品同士を直接接続している請求項1に記載の電子部品。
- 前記ケースには、前記ヒューズが内部に収容される凹状のヒューズ用孔が形成されている請求項1〜3のいずれかに記載の電子部品。
- 前記ヒューズ用孔は、複数の前記収容凹部の各々の開口面の周囲の開口縁面に形成されており、隣接する一方の前記収容凹部と他方の前記収容凹部とに跨っている請求項4に記載の電子部品。
- 前記ヒューズ用孔は、前記ケースの側部に形成されており、隣接する一方の前記収容凹部が形成された領域と、他方の前記収容凹部が形成された領域とに跨っている請求項4に記載の電子部品。
- 前記ヒューズは棒状からなる請求項6に記載の電子部品。
- 前記ヒューズは、複数の前記導電性端子のいずれかの弾性力で押し付けられることによって、前記ヒューズ用孔の内部に固定されている請求項6または7に記載の電子部品。
- 前記ヒューズは、前記ケースの表面に固定される請求項1または2に記載の電子部品。
- 前記ヒューズの少なくとも一部は、複数の前記導電性端子の間に配置されている請求項9に記載の電子部品。
- 前記ヒューズは、チップ形状からなる請求項1〜10のいずれかに記載の電子部品。
- 複数の前記ケースの各々を連結する連結部をさらに有する請求項1〜11のいずれかに記載の電子部品。
- 端子電極が形成されたチップ部品と、
前記チップ部品を収容可能な収容凹部を複数有するケースと、
前記ケースに固定され、前記チップ部品の前記端子電極に接続される導電性端子と、
前記チップ部品に電気的に接続されるヒューズと、を有する電子部品。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020093568A JP2021190534A (ja) | 2020-05-28 | 2020-05-28 | 電子部品 |
US17/229,393 US11798743B2 (en) | 2020-05-28 | 2021-04-13 | Electronic device |
CN202110452626.6A CN113745003B (zh) | 2020-05-28 | 2021-04-26 | 电子部件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020093568A JP2021190534A (ja) | 2020-05-28 | 2020-05-28 | 電子部品 |
Publications (1)
Publication Number | Publication Date |
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JP2021190534A true JP2021190534A (ja) | 2021-12-13 |
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Family Applications (1)
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JP2020093568A Pending JP2021190534A (ja) | 2020-05-28 | 2020-05-28 | 電子部品 |
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US (1) | US11798743B2 (ja) |
JP (1) | JP2021190534A (ja) |
CN (1) | CN113745003B (ja) |
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JP2024001707A (ja) * | 2022-06-22 | 2024-01-10 | Tdk株式会社 | 電子部品 |
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