JP2021187893A - Resin composition - Google Patents
Resin composition Download PDFInfo
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- JP2021187893A JP2021187893A JP2020091680A JP2020091680A JP2021187893A JP 2021187893 A JP2021187893 A JP 2021187893A JP 2020091680 A JP2020091680 A JP 2020091680A JP 2020091680 A JP2020091680 A JP 2020091680A JP 2021187893 A JP2021187893 A JP 2021187893A
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- Prior art keywords
- resin composition
- component
- mass
- group
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims abstract description 193
- -1 amine compound Chemical class 0.000 claims abstract description 124
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 80
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000004305 biphenyl Substances 0.000 claims abstract description 15
- 235000010290 biphenyl Nutrition 0.000 claims abstract description 15
- 125000003118 aryl group Chemical group 0.000 claims description 47
- 229920005989 resin Polymers 0.000 claims description 44
- 239000011347 resin Substances 0.000 claims description 44
- 239000011256 inorganic filler Substances 0.000 claims description 33
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 33
- 150000001875 compounds Chemical class 0.000 claims description 32
- 229910052799 carbon Inorganic materials 0.000 claims description 29
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 23
- 125000003277 amino group Chemical group 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 17
- 125000001424 substituent group Chemical group 0.000 claims description 12
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims description 11
- 239000002648 laminated material Substances 0.000 claims description 8
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 5
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- 125000006367 bivalent amino carbonyl group Chemical group [H]N([*:1])C([*:2])=O 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 45
- 125000001931 aliphatic group Chemical group 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 183
- 239000003925 fat Substances 0.000 description 54
- 235000019197 fats Nutrition 0.000 description 54
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 39
- 238000000034 method Methods 0.000 description 39
- 239000000047 product Substances 0.000 description 36
- 229910052751 metal Inorganic materials 0.000 description 33
- 239000000758 substrate Substances 0.000 description 33
- 239000002184 metal Substances 0.000 description 32
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 30
- 125000004429 atom Chemical group 0.000 description 27
- 239000006087 Silane Coupling Agent Substances 0.000 description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 26
- 239000000243 solution Substances 0.000 description 25
- 125000000217 alkyl group Chemical group 0.000 description 24
- 125000000962 organic group Chemical group 0.000 description 22
- 125000006574 non-aromatic ring group Chemical group 0.000 description 21
- 150000001721 carbon Chemical group 0.000 description 18
- 239000000463 material Substances 0.000 description 18
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 18
- 239000011888 foil Substances 0.000 description 16
- 229920001955 polyphenylene ether Polymers 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 15
- 239000003960 organic solvent Substances 0.000 description 15
- 239000003795 chemical substances by application Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 14
- 206010042674 Swelling Diseases 0.000 description 13
- 239000000654 additive Substances 0.000 description 13
- 239000010408 film Substances 0.000 description 13
- 238000005259 measurement Methods 0.000 description 13
- 238000007788 roughening Methods 0.000 description 13
- 230000008961 swelling Effects 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 238000010030 laminating Methods 0.000 description 11
- 239000000377 silicon dioxide Substances 0.000 description 11
- 239000007787 solid Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 150000002430 hydrocarbons Chemical group 0.000 description 10
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical group C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 8
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 8
- 125000003342 alkenyl group Chemical group 0.000 description 8
- 238000005227 gel permeation chromatography Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000007800 oxidant agent Substances 0.000 description 8
- 239000003381 stabilizer Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000012756 surface treatment agent Substances 0.000 description 8
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 7
- 125000002947 alkylene group Chemical group 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 125000004433 nitrogen atom Chemical group N* 0.000 description 7
- 125000004430 oxygen atom Chemical group O* 0.000 description 7
- 229910052717 sulfur Inorganic materials 0.000 description 7
- 125000004434 sulfur atom Chemical group 0.000 description 7
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000002270 dispersing agent Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 239000011259 mixed solution Substances 0.000 description 6
- 125000002950 monocyclic group Chemical group 0.000 description 6
- 230000003472 neutralizing effect Effects 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 239000002518 antifoaming agent Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 150000001925 cycloalkenes Chemical group 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 125000004450 alkenylene group Chemical group 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000002788 crimping Methods 0.000 description 4
- 239000000539 dimer Substances 0.000 description 4
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Substances C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000005456 alcohol based solvent Substances 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000009499 grossing Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000007870 radical polymerization initiator Substances 0.000 description 3
- 229920005604 random copolymer Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229930195734 saturated hydrocarbon Natural products 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 125000005504 styryl group Chemical group 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 3
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 3
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- YBBLOADPFWKNGS-UHFFFAOYSA-N 1,1-dimethylurea Chemical compound CN(C)C(N)=O YBBLOADPFWKNGS-UHFFFAOYSA-N 0.000 description 2
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 description 2
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 2
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 2
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 2
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 2
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 108010054404 Adenylyl-sulfate kinase Proteins 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- 229940126062 Compound A Drugs 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 102100039024 Sphingosine kinase 1 Human genes 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
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- IIOSDXGZLBPOHD-UHFFFAOYSA-N tris(2-methoxyphenyl)phosphane Chemical compound COC1=CC=CC=C1P(C=1C(=CC=CC=1)OC)C1=CC=CC=C1OC IIOSDXGZLBPOHD-UHFFFAOYSA-N 0.000 description 1
- XRALRSQLQXKXKP-UHFFFAOYSA-N tris(3,5-dimethylphenyl)phosphane Chemical compound CC1=CC(C)=CC(P(C=2C=C(C)C=C(C)C=2)C=2C=C(C)C=C(C)C=2)=C1 XRALRSQLQXKXKP-UHFFFAOYSA-N 0.000 description 1
- RYXYUARTMQUYKV-UHFFFAOYSA-N tris(4-butylphenyl)phosphane Chemical compound C1=CC(CCCC)=CC=C1P(C=1C=CC(CCCC)=CC=1)C1=CC=C(CCCC)C=C1 RYXYUARTMQUYKV-UHFFFAOYSA-N 0.000 description 1
- SPNVODOGUAUMCA-UHFFFAOYSA-N tris(4-ethoxy-2,6-dimethylphenyl)phosphane Chemical compound CC1=CC(OCC)=CC(C)=C1P(C=1C(=CC(OCC)=CC=1C)C)C1=C(C)C=C(OCC)C=C1C SPNVODOGUAUMCA-UHFFFAOYSA-N 0.000 description 1
- LQEKTSMTEYLBLJ-UHFFFAOYSA-N tris(4-ethoxyphenyl)phosphane Chemical compound C1=CC(OCC)=CC=C1P(C=1C=CC(OCC)=CC=1)C1=CC=C(OCC)C=C1 LQEKTSMTEYLBLJ-UHFFFAOYSA-N 0.000 description 1
- PCCAGZSOGFNURV-UHFFFAOYSA-N tris(4-ethylphenyl)phosphane Chemical compound C1=CC(CC)=CC=C1P(C=1C=CC(CC)=CC=1)C1=CC=C(CC)C=C1 PCCAGZSOGFNURV-UHFFFAOYSA-N 0.000 description 1
- UYUUAUOYLFIRJG-UHFFFAOYSA-N tris(4-methoxyphenyl)phosphane Chemical compound C1=CC(OC)=CC=C1P(C=1C=CC(OC)=CC=1)C1=CC=C(OC)C=C1 UYUUAUOYLFIRJG-UHFFFAOYSA-N 0.000 description 1
- NTUMNRFLAZXNBW-UHFFFAOYSA-N tris(4-propan-2-ylphenyl)phosphane Chemical compound C1=CC(C(C)C)=CC=C1P(C=1C=CC(=CC=1)C(C)C)C1=CC=C(C(C)C)C=C1 NTUMNRFLAZXNBW-UHFFFAOYSA-N 0.000 description 1
- JTOQWGJGVSYTTN-UHFFFAOYSA-N tris(4-propylphenyl)phosphane Chemical compound C1=CC(CCC)=CC=C1P(C=1C=CC(CCC)=CC=1)C1=CC=C(CCC)C=C1 JTOQWGJGVSYTTN-UHFFFAOYSA-N 0.000 description 1
- UQHFPPSBVOIUFM-UHFFFAOYSA-N tris(4-tert-butylphenyl)phosphane Chemical compound C1=CC(C(C)(C)C)=CC=C1P(C=1C=CC(=CC=1)C(C)(C)C)C1=CC=C(C(C)(C)C)C=C1 UQHFPPSBVOIUFM-UHFFFAOYSA-N 0.000 description 1
- UGNAOCDIZFIEQK-UHFFFAOYSA-N tris[4-[(2-methylpropan-2-yl)oxy]phenyl]phosphane Chemical compound C1=CC(OC(C)(C)C)=CC=C1P(C=1C=CC(OC(C)(C)C)=CC=1)C1=CC=C(OC(C)(C)C)C=C1 UGNAOCDIZFIEQK-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001868 water Inorganic materials 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/121—Preparatory processes from unsaturated precursors and polyamines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2465/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
Description
本発明は、マレイミドを含む樹脂組成物に関する。さらには、当該樹脂組成物を用いて得られる硬化物、シート状積層材料、樹脂シート、プリント配線板、及び半導体装置に関する。 The present invention relates to a resin composition containing maleimide. Further, the present invention relates to a cured product obtained by using the resin composition, a sheet-like laminated material, a resin sheet, a printed wiring board, and a semiconductor device.
プリント配線板の製造技術として、絶縁層と導体層を交互に積み重ねるビルドアップ方式による製造方法が知られている。ビルドアップ方式による製造方法において、一般に、絶縁層は樹脂組成物を硬化させて形成される。近年、絶縁層の誘電率及び誘電正接等の誘電特性のさらなる向上、めっき導体層のピール強度のさらなる向上が求められている。 As a manufacturing technique for a printed wiring board, a manufacturing method by a build-up method in which insulating layers and conductor layers are alternately stacked is known. In the build-up manufacturing method, the insulating layer is generally formed by curing the resin composition. In recent years, it has been required to further improve the dielectric properties such as the dielectric constant and the dielectric loss tangent of the insulating layer, and further improve the peel strength of the plated conductor layer.
これまでに、様々なマレイミド化合物が知られている(特許文献1〜3)。 So far, various maleimide compounds are known (Patent Documents 1 to 3).
本発明の課題は、比誘電率(Dk)及び誘電正接(Df)が低く、且つめっき導体層のピール強度に優れた硬化物を得ることができる樹脂組成物を提供することにある。 An object of the present invention is to provide a resin composition capable of obtaining a cured product having a low relative permittivity (Dk) and dielectric loss tangent (Df) and excellent peel strength of a plated conductor layer.
本発明の課題を達成すべく、本発明者らは鋭意検討した結果、(A)ビフェニル骨格を有するアミン化合物、(B)炭素原子数が7以上の脂肪鎖を有するマレイミド化合物、及び(C)炭素原子数が7以上の脂肪鎖を有さないマレイミド化合物を含む樹脂組成物を使用することにより、意外にも、比誘電率(Dk)及び誘電正接(Df)が低く、且つめっき導体層のピール強度に優れた硬化物を得ることができることを見出し、本発明を完成させるに至った。 As a result of diligent studies to achieve the object of the present invention, (A) an amine compound having a biphenyl skeleton, (B) a maleimide compound having a fat chain having 7 or more carbon atoms, and (C). Surprisingly, by using a resin composition containing a maleimide compound having 7 or more carbon atoms and no fat chain, the relative permittivity (Dk) and the dielectric loss tangent (Df) are low, and the plated conductor layer We have found that a cured product having excellent peel strength can be obtained, and have completed the present invention.
すなわち、本発明は以下の内容を含む。
[1] (A)ビフェニル骨格を有するアミン化合物、
(B)炭素原子数が7以上の脂肪鎖を有するマレイミド化合物、及び
(C)炭素原子数が7以上の脂肪鎖を有さないマレイミド化合物
を含む樹脂組成物。
[2] (B)成分が、芳香環を構成しない炭素原子に直接結合したマレイミド基を有する、上記[1]に記載の樹脂組成物。
[3] (C)成分が、芳香環を構成する炭素原子に直接結合したマレイミド基を有する、上記[1]又は[2]に記載の樹脂組成物。
[4] (A)成分が、第一級アミノ基を有する、上記[1]〜[3]の何れかに記載の樹脂組成物。
[5] (A)成分が、芳香環を構成する炭素原子に直接結合したアミノ基を有する、上記[1]〜[4]の何れかに記載の樹脂組成物。
[6] (A)成分が、式(A1):
That is, the present invention includes the following contents.
[1] (A) Amine compound having a biphenyl skeleton,
A resin composition containing (B) a maleimide compound having a fat chain having 7 or more carbon atoms, and (C) a maleimide compound having no fat chain having 7 or more carbon atoms.
[2] The resin composition according to the above [1], wherein the component (B) has a maleimide group directly bonded to a carbon atom that does not form an aromatic ring.
[3] The resin composition according to the above [1] or [2], wherein the component (C) has a maleimide group directly bonded to a carbon atom constituting an aromatic ring.
[4] The resin composition according to any one of the above [1] to [3], wherein the component (A) has a primary amino group.
[5] The resin composition according to any one of the above [1] to [4], wherein the component (A) has an amino group directly bonded to a carbon atom constituting an aromatic ring.
[6] The component (A) is the formula (A1) :.
[式中、V及びWは、それぞれ独立して、−C(R’)2−、−O−、−CO−、−S−、−SO−、−SO2−、−CONH−、又は−NHCO−を示し、Rは、それぞれ独立して、置換基を示し、R’は、それぞれ独立して、水素原子又は置換基を示し、h、i及びjは、それぞれ独立して、0〜2の整数を示す。]
で表される繰り返し単位を有するアミン化合物を含む、上記[1]〜[5]の何れかに記載の樹脂組成物。
[7] (A)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、3質量%〜40質量%である、上記[1]〜[6]の何れかに記載の樹脂組成物。
[8] (B)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、3質量%〜40質量%である、上記[1]〜[7]の何れかに記載の樹脂組成物。
[9] (C)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、3質量%〜40質量%である、上記[1]〜[8]の何れかに記載の樹脂組成物。
[10] (B)成分に対する(C)成分の質量比((C)成分/(B)成分)が、0.5〜20である、上記[1]〜[9]の何れかに記載の樹脂組成物。
[11] (B)成分及び(C)成分の合計に対する(A)成分の質量比((A)成分/(B)成分及び(C)成分の合計)が、0.1〜0.5である、上記[1]〜[10]の何れかに記載の樹脂組成物。
[12] さらに(B)成分及び(C)成分以外の(D)ラジカル重合性化合物を含む、上記[1]〜[11]の何れかに記載の樹脂組成物。
[13] さらに(E)無機充填材を含む、上記[1]〜[12]の何れかに記載の樹脂組成物。
[14] (E)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、25質量%以上である、上記[13]に記載の樹脂組成物。
[15] 樹脂組成物の硬化物の誘電正接が、5.8GHz、23℃で測定した場合、0.004以下である、上記[1]〜[14]の何れかに記載の樹脂組成物。
[16] 樹脂組成物の硬化物の比誘電率が、5.8GHz、23℃で測定した場合、2.9以下である、上記[1]〜[15]の何れかに記載の樹脂組成物。
[17] 上記[1]〜[16]の何れかに記載の樹脂組成物の硬化物。
[18] 上記[1]〜[16]の何れかに記載の樹脂組成物を含有する、シート状積層材料。
[19] 支持体と、当該支持体上に設けられた上記[1]〜[16]の何れかに記載の樹脂組成物から形成される樹脂組成物層と、を有する樹脂シート。
[20] 上記[1]〜[16]の何れかに記載の樹脂組成物の硬化物からなる絶縁層を備えるプリント配線板。
[21] 上記[20]に記載のプリント配線板を含む、半導体装置。
Wherein, V and W are each independently, -C (R ') 2 - , - O -, - CO -, - S -, - SO -, - SO 2 -, - CONH-, or - Indicates NHCO-, R indicates a substituent independently, R'independently indicates a hydrogen atom or a substituent, and h, i, and j each independently indicate 0 to 2. Indicates an integer of. ]
The resin composition according to any one of the above [1] to [5], which comprises an amine compound having a repeating unit represented by.
[7] The content of the component (A) is 3% by mass to 40% by mass when the non-volatile component in the resin composition is 100% by mass, according to any one of the above [1] to [6]. Resin composition.
[8] The content of the component (B) is 3% by mass to 40% by mass when the non-volatile component in the resin composition is 100% by mass, according to any one of the above [1] to [7]. Resin composition.
[9] The content of the component (C) is 3% by mass to 40% by mass when the non-volatile component in the resin composition is 100% by mass, according to any one of the above [1] to [8]. Resin composition.
[10] The above-mentioned [1] to [9], wherein the mass ratio of the component (C) to the component (B) (component (C) / component (B)) is 0.5 to 20. Resin composition.
[11] The mass ratio of the component (A) to the total of the components (B) and (C) (the total of the components (A) / (B) and (C)) is 0.1 to 0.5. The resin composition according to any one of the above [1] to [10].
[12] The resin composition according to any one of [1] to [11] above, further comprising a component (B) and a radically polymerizable compound (D) other than the component (C).
[13] The resin composition according to any one of the above [1] to [12], further comprising (E) an inorganic filler.
[14] The resin composition according to the above [13], wherein the content of the component (E) is 25% by mass or more when the non-volatile component in the resin composition is 100% by mass.
[15] The resin composition according to any one of [1] to [14] above, wherein the dielectric loss tangent of the cured product of the resin composition is 0.004 or less when measured at 5.8 GHz and 23 ° C.
[16] The resin composition according to any one of [1] to [15] above, wherein the relative permittivity of the cured product of the resin composition is 2.9 or less when measured at 5.8 GHz and 23 ° C. ..
[17] A cured product of the resin composition according to any one of the above [1] to [16].
[18] A sheet-like laminated material containing the resin composition according to any one of the above [1] to [16].
[19] A resin sheet having a support and a resin composition layer formed from the resin composition according to any one of the above [1] to [16] provided on the support.
[20] A printed wiring board provided with an insulating layer made of a cured product of the resin composition according to any one of the above [1] to [16].
[21] A semiconductor device including the printed wiring board according to the above [20].
本発明の樹脂組成物によれば、比誘電率(Dk)及び誘電正接(Df)が低く、且つめっき導体層のピール強度に優れた硬化物を得ることができる。 According to the resin composition of the present invention, it is possible to obtain a cured product having a low relative permittivity (Dk) and dielectric loss tangent (Df) and excellent peel strength of the plated conductor layer.
以下、本発明をその好適な実施形態に即して詳細に説明する。ただし、本発明は、下記実施形態及び例示物に限定されるものではなく、本発明の特許請求の範囲及びその均等の範囲を逸脱しない範囲において任意に変更して実施され得る。 Hereinafter, the present invention will be described in detail according to the preferred embodiment thereof. However, the present invention is not limited to the following embodiments and examples, and may be arbitrarily modified and implemented without departing from the scope of claims of the present invention and the equivalent scope thereof.
<樹脂組成物>
本発明の樹脂組成物は、(A)ビフェニル骨格を有するアミン化合物、(B)炭素原子数が7以上の脂肪鎖を有するマレイミド化合物、及び(C)炭素原子数が7以上の脂肪鎖を有さないマレイミド化合物を含む。このような樹脂組成物を用いることにより、比誘電率(Dk)及び誘電正接(Df)が低く、且つめっき導体層のピール強度に優れた硬化物を得ることができる。
<Resin composition>
The resin composition of the present invention has (A) an amine compound having a biphenyl skeleton, (B) a maleimide compound having a fat chain having 7 or more carbon atoms, and (C) a fat chain having 7 or more carbon atoms. Contains maleimide compounds that do not. By using such a resin composition, it is possible to obtain a cured product having a low relative permittivity (Dk) and dielectric loss tangent (Df) and excellent peel strength of the plated conductor layer.
本発明の樹脂組成物は、(A)ビフェニル骨格を有するアミン化合物、(B)炭素原子数が7以上の脂肪鎖を有するマレイミド化合物、及び(C)炭素原子数が7以上の脂肪鎖を有さないマレイミド化合物の他に、さらに任意の成分を含んでいてもよい。任意の成分としては、例えば、(D)任意のラジカル重合性化合物、(E)無機充填材、(F)硬化促進剤、(G)その他の添加剤、及び(H)有機溶剤が挙げられる。以下、樹脂組成物に含まれる各成分について詳細に説明する。 The resin composition of the present invention has (A) an amine compound having a biphenyl skeleton, (B) a maleimide compound having a fat chain having 7 or more carbon atoms, and (C) a fat chain having 7 or more carbon atoms. In addition to the non-maleimide compound, any component may be further contained. Optional components include, for example, (D) any radically polymerizable compound, (E) an inorganic filler, (F) a curing accelerator, (G) other additives, and (H) an organic solvent. Hereinafter, each component contained in the resin composition will be described in detail.
<(A)ビフェニル骨格を有するアミン化合物>
本発明の樹脂組成物は、(A)ビフェニル骨格を有するアミン化合物を含有する。(A)成分は、1種類単独で用いてもよく、2種類以上を任意に組み合わせて用いてもよい。一実施形態において、(A)成分に含まれるアミノ基は、(B)成分及び(C)成分(並びに(D)成分が含まれる場合は(D)成分)等と付加反応し得る。一実施形態において、(A)成分は、1分子中に、2個以上のアミノ基を有することが好ましく、3個以上のアミノ基を有することがより好ましい。(A)成分は、アミノ基として、第一級アミノ基、第二級アミノ基、及び第三級アミノ基の何れを有していてもよいが、一実施形態において、第一級アミノ基を有することが好ましい。一実施形態において、(A)成分は、アミノ基として、芳香環を構成する炭素原子に直接結合したアミノ基(芳香族アミノ基)を有することが好ましく、第一級の芳香族アミノ基を有することがさらに好ましく、(A)成分に含まれるアミノ基が、第一級の芳香族アミノ基のみであることが特に好ましい。
<(A) Amine compound having a biphenyl skeleton>
The resin composition of the present invention contains (A) an amine compound having a biphenyl skeleton. As the component (A), one type may be used alone, or two or more types may be used in any combination. In one embodiment, the amino group contained in the component (A) can undergo an addition reaction with the component (B) and the component (C) (and the component (D) if the component (D) is contained). In one embodiment, the component (A) preferably has two or more amino groups in one molecule, and more preferably has three or more amino groups. The component (A) may have any of a primary amino group, a secondary amino group, and a tertiary amino group as the amino group, but in one embodiment, the primary amino group is used. It is preferable to have. In one embodiment, the component (A) preferably has an amino group (aromatic amino group) directly bonded to a carbon atom constituting an aromatic ring as an amino group, and has a primary aromatic amino group. It is more preferable that the amino group contained in the component (A) is only a primary aromatic amino group.
一実施形態において、(A)成分は、好ましくは、式(A1): In one embodiment, the component (A) is preferably the formula (A1) :.
[式中、V及びWは、それぞれ独立して、−C(R’)2−、−O−、−CO−、−S−、−SO−、−SO2−、−CONH−、又は−NHCO−(好ましくは−C(R’)2−)を示し、Rは、それぞれ独立して、置換基を示し、R’は、それぞれ独立して、水素原子又は置換基(好ましくは水素原子)を示し、h、i及びjは、それぞれ独立して、0〜2の整数(好ましくは0)を示す。]で表される繰り返し単位を有するアミン化合物を含む。なお、h単位、i単位及びj単位は、それぞれ、単位毎に同一であってもよいし、異なっていてもよい。 Wherein, V and W are each independently, -C (R ') 2 - , - O -, - CO -, - S -, - SO -, - SO 2 -, - CONH-, or - NHCO- (preferably −C (R') 2 −), where R indicates a substituent independently and R'independently indicates a hydrogen atom or a substituent (preferably a hydrogen atom). , H, i and j each independently represent an integer of 0 to 2 (preferably 0). ] Includes an amine compound having a repeating unit represented by. The h unit, the i unit, and the j unit may be the same or different for each unit.
本明細書中、置換基としては、特に限定されるものではないが、例えば、アルキル基、アルケニル基、アリール基、アルキル−アリール基(1個以上のアルキル基で置換されたアリール基)、アリール−アリール基(1個以上のアリール基で置換されたアリール基)、アリール−アルキル基(1個以上のアリール基で置換されたアルキル基)、アルキル−オキシ基、アルケニル−オキシ基、アリール−オキシ基、アルキル−カルボニル基、アルケニル−カルボニル基、アリール−カルボニル基、アルキル−オキシ−カルボニル基、アルケニル−オキシ−カルボニル基、アリール−オキシ−カルボニル基、アルキル−カルボニル−オキシ基、アルケニル−カルボニル−オキシ基、アリール−カルボニル−オキシ基等の1価の置換基が挙げられ、置換可能であれば、オキソ基(=O)等の2価の置換基も含み得る。 In the present specification, the substituent is not particularly limited, and is, for example, an alkyl group, an alkenyl group, an aryl group, an alkyl-aryl group (an aryl group substituted with one or more alkyl groups), and an aryl. -Aryl group (aryl group substituted with one or more aryl groups), aryl-alkyl group (alkyl group substituted with one or more aryl groups), alkyl-oxy group, alkenyl-oxy group, aryl-oxy Group, alkyl-carbonyl group, alkenyl-carbonyl group, aryl-carbonyl group, alkyl-oxy-carbonyl group, alkenyl-oxy-carbonyl group, aryl-oxy-carbonyl group, alkyl-carbonyl-oxy group, alkenyl-carbonyl-oxy Examples thereof include a monovalent substituent such as a group and an aryl-carbonyl-oxy group, and if substitutable, a divalent substituent such as an oxo group (= O) may also be included.
アルキル(基)とは、直鎖、分枝鎖及び/又は環状の1価の飽和炭化水素基をいう。アルキル(基)は、特に指定が無い限り、好ましくは炭素原子数1〜14、より好ましくは炭素原子数1〜10、さらに好ましくは炭素原子数1〜6又は4〜10のアルキル基である。アルキル(基)としては、例えば、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、sec−ブチル基、tert−ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、シクロペンチル基、シクロヘキシル基、メチルシクロヘキシル基、ジメチルシクロヘキシル基、トリメチルシクロヘキシル基、シクロペンチルメチル基、シクロヘキシルメチル基等が挙げられる。アルケニル(基)とは、少なくとも1つの炭素−炭素二重結合を有する直鎖、分枝鎖及び/又は環状の1価の脂肪族不飽和炭化水素基をいう。アルケニル(基)は、特に指定が無い限り、好ましくは炭素原子数2〜14、より好ましくは炭素原子数2〜10、さらに好ましくは炭素原子数2〜6又は4〜10のアルケニル基である。アルケニル(基)としては、例えば、ビニル基、プロペニル基、ブテニル基、ペンテニル基、ヘキセニル基、ヘプテニル基、オクテニル基、ノネニル基、デセニル基、シクロヘキセニル基等が挙げられる。アリール(基)とは、1価の芳香族炭化水素基をいう。アリール(基)は、炭素原子数6〜14のアリール(基)が好ましい。アリール(基)としては、例えば、フェニル基、1−ナフチル基、2−ナフチル基等が挙げられる。 Alkyl (group) refers to a linear, branched and / or cyclic monovalent saturated hydrocarbon group. Unless otherwise specified, the alkyl (group) is preferably an alkyl group having 1 to 14 carbon atoms, more preferably 1 to 10 carbon atoms, and further preferably 1 to 6 or 4 to 10 carbon atoms. Examples of the alkyl (group) include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group and a nonyl group. Examples thereof include a group, a decyl group, a cyclopentyl group, a cyclohexyl group, a methylcyclohexyl group, a dimethylcyclohexyl group, a trimethylcyclohexyl group, a cyclopentylmethyl group, a cyclohexylmethyl group and the like. Alkenyl (group) refers to a linear, branched and / or cyclic monovalent aliphatic unsaturated hydrocarbon group having at least one carbon-carbon double bond. Unless otherwise specified, the alkenyl (group) is preferably an alkenyl group having 2 to 14 carbon atoms, more preferably 2 to 10 carbon atoms, and further preferably 2 to 6 or 4 to 10 carbon atoms. Examples of the alkenyl (group) include a vinyl group, a propenyl group, a butenyl group, a pentenyl group, a hexenyl group, a heptenyl group, an octenyl group, a nonenyl group, a decenyl group, a cyclohexenyl group and the like. Aryl (group) refers to a monovalent aromatic hydrocarbon group. The aryl (group) is preferably an aryl (group) having 6 to 14 carbon atoms. Examples of the aryl (group) include a phenyl group, a 1-naphthyl group, a 2-naphthyl group and the like.
(A)成分の重量平均分子量(Mw)は、好ましくは300〜4000、より好ましくは300〜3000、さらに好ましくは300〜2000である。(A)成分の重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)法により、ポリスチレン換算の値として測定できる。 The weight average molecular weight (Mw) of the component (A) is preferably 300 to 4000, more preferably 300 to 3000, and even more preferably 300 to 2000. The weight average molecular weight of the component (A) can be measured as a polystyrene-equivalent value by a gel permeation chromatography (GPC) method.
(A)成分のアミノ基の官能基当量は、好ましくは100g/eq.〜1000g/eq.、より好ましくは100g/eq.〜500g/eq.である。(A)成分のアミノ基の官能基当量は、アミノ基1当量あたりの(A)成分の質量である。 The functional group equivalent of the amino group of the component (A) is preferably 100 g / eq. ~ 1000 g / eq. , More preferably 100 g / eq. ~ 500 g / eq. Is. The functional group equivalent of the amino group of the component (A) is the mass of the component (A) per one equivalent of the amino group.
(A)成分の具体例としては、例えば、式(A2): As a specific example of the component (A), for example, the formula (A2):
で表される繰り返し単位を有するアミン化合物が挙げられる。 Examples thereof include amine compounds having repeating units represented by.
(A)成分の市販品としては、例えば、日本化薬社製の「BAN」(上記式(A2)のアミン化合物)等が挙げられる。 Examples of commercially available products of the component (A) include "BAN" (amine compound of the above formula (A2)) manufactured by Nippon Kayaku Co., Ltd.
樹脂組成物中の(A)成分の含有量は、特に限定されるものではないが、樹脂組成物中の不揮発成分を100質量%とした場合、好ましくは60質量%以下、より好ましくは50質量%以下、さらに好ましくは40質量%以下、さらにより好ましくは30質量%以下、特に好ましくは25質量%以下である。樹脂組成物中の(A)成分の含有量の下限は、特に限定されるものではないが、樹脂組成物中の不揮発成分を100質量%とした場合、好ましくは0.1質量%以上、より好ましくは1質量%以上、さらに好ましくは3質量%以上、さらにより好ましくは5質量%以上、特に好ましくは7質量%以上である。 The content of the component (A) in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 60% by mass or less, more preferably 50% by mass. % Or less, more preferably 40% by mass or less, still more preferably 30% by mass or less, and particularly preferably 25% by mass or less. The lower limit of the content of the component (A) in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 0.1% by mass or more. It is preferably 1% by mass or more, more preferably 3% by mass or more, still more preferably 5% by mass or more, and particularly preferably 7% by mass or more.
<(B)炭素原子数が7以上の脂肪鎖を有するマレイミド化合物>
本発明の樹脂組成物は、(B)炭素原子数が7以上の脂肪鎖を有するマレイミド化合物を含有する。(B)成分は、1種類単独で用いてもよく、2種類以上を任意に組み合わせて用いてもよい。マレイミド化合物とは、1分子中に、少なくとも1個(好ましくは2個以上)のマレイミド基(2,5−ジヒドロ−2,5−ジオキソ−1H−ピロール−1−イル基)を含有する有機化合物である。一実施形態において、(B)成分は、芳香環を構成しない炭素原子に直接結合したマレイミド基を有することが好ましく、(B)成分に含まれるマレイミド基が、芳香環を構成しない炭素原子に直接結合したマレイミド基のみであることが特に好ましい。
<(B) Maleimide compound having a fat chain having 7 or more carbon atoms>
The resin composition of the present invention contains (B) a maleimide compound having a fat chain having 7 or more carbon atoms. As the component (B), one type may be used alone, or two or more types may be used in any combination. The maleimide compound is an organic compound containing at least one (preferably two or more) maleimide groups (2,5-dihydro-2,5-dioxo-1H-pyrrole-1-yl group) in one molecule. Is. In one embodiment, the component (B) preferably has a maleimide group directly bonded to a carbon atom that does not form an aromatic ring, and the maleimide group contained in the component (B) is directly attached to a carbon atom that does not form an aromatic ring. It is particularly preferable that only the bound maleimide group is used.
脂肪鎖とは、骨格原子が単結合、二重結合又は三重結合を介して連なった脂肪鎖を意味し、好ましくは、骨格原子が単結合又は二重結合を介して連なった脂肪鎖、特に好ましくは、骨格原子が単結合のみを介して連なった脂肪鎖である。また、脂肪鎖は、分枝鎖を有していてもよいが、環構造の一部又は全部を構成しない。 The fat chain means a fat chain in which skeletal atoms are connected via a single bond, a double bond or a triple bond, and preferably a fat chain in which skeletal atoms are connected via a single bond or a double bond, particularly preferably. Is a fat chain in which skeletal atoms are linked only through a single bond. Further, the fat chain may have a branched chain, but does not form a part or all of the ring structure.
脂肪鎖は、炭素原子のみを骨格原子とする脂肪族炭素鎖(例えば、アルキレン鎖、アルケニレン鎖など)であってもよいし、炭素原子に加えて酸素原子、窒素原子及び硫黄原子から選ばれるヘテロ原子を骨格原子とするヘテロ原子含有脂肪鎖(例えば、ポリアルキレンオキシド鎖、ポリアルキレンイミン鎖など)であってもよいが、一実施形態において、炭素原子のみを骨格原子とする脂肪族炭素鎖であることが好ましい。当該脂肪鎖の骨格原子のうち炭素原子数の上限は、特に限定されるものではないが、例えば、3000以下、1000以下、100以下、50以下等であり得る。炭素原子数が7以上の脂肪鎖は、脂肪鎖の主鎖の炭素原子数が7以上であることが好ましい。 The fatty chain may be an aliphatic carbon chain having only a carbon atom as a skeleton atom (for example, an alkylene chain, an alkenylene chain, etc.), or a hetero selected from an oxygen atom, a nitrogen atom, and a sulfur atom in addition to the carbon atom. It may be a heteroatom-containing fatty chain having an atom as a skeleton atom (for example, a polyalkylene oxide chain, a polyalkyleneimine chain, etc.), but in one embodiment, it is an aliphatic carbon chain having only a carbon atom as a skeleton atom. It is preferable to have. The upper limit of the number of carbon atoms in the skeleton atom of the fat chain is not particularly limited, but may be, for example, 3000 or less, 1000 or less, 100 or less, 50 or less, and the like. The fat chain having 7 or more carbon atoms preferably has 7 or more carbon atoms in the main chain of the fat chain.
一実施形態において、(B)成分のマレイミド化合物は、好ましくは、式(B1): In one embodiment, the maleimide compound of component (B) is preferably of formula (B1) :.
[式中、A1は、それぞれ独立して、炭素原子数が7以上の脂肪鎖を有する2価の有機基を示し、A2は、それぞれ独立して、炭素原子数が7以上の脂肪鎖を有さない2価の有機基を示し、B1は、それぞれ独立して、芳香環及び/又は非芳香環を有する4価の有機基を示し、n1及びn2は、0又は1以上の整数(好ましくは0又は1〜100の整数)を示し、m1及びm2は、いずれか一方が1を示し且つ他方が0を示し、n1とm1の合計が1以上である。]
で表されるマレイミド化合物を含む。なお、n1単位及びn2単位の順番及び個々の配置は任意であり、交互共重合体、ブロック共重合体、ランダム共重合体等を含む。また、n1単位及びn2単位は、それぞれ、単位毎に同一であってもよいし、異なっていてもよい。
[In the formula, A 1 independently represents a divalent organic group having a fat chain having 7 or more carbon atoms, and A 2 independently represents a fat chain having 7 or more carbon atoms. B 1 represents a divalent organic group having no aromatic ring and / or a non-aromatic ring, respectively, and n1 and n2 are 0 or an integer of 1 or more. (Preferably 0 or an integer of 1 to 100), m1 and m2 indicate 1 for one and 0 for the other, and the sum of n1 and m1 is 1 or more. ]
Includes maleimide compounds represented by. The order and individual arrangement of n1 units and n2 units are arbitrary, and include alternate copolymers, block copolymers, random copolymers, and the like. Further, the n1 unit and the n2 unit may be the same or different for each unit.
芳香環とは、環上のπ電子系に含まれる電子数が4n+2個(nは自然数)であるヒュッケル則に従う環を意味する。芳香環は、炭素原子を環構成原子とする炭素環、又は環構成原子として、炭素原子に加えて、酸素原子、窒素原子、硫黄原子等のヘテロ原子を有する複素環であり得るが、一実施形態において、炭素環であることが好ましい。芳香環には、単環式の芳香環、及び2個以上の単環式の芳香環が縮合した縮合環のみならず、1個以上の単環式の芳香環に1個以上の単環式の非芳香環が縮合した縮合環も含まれる。芳香環の具体例としては、ベンゼン環、ナフタレン環、アントラセン環、インダン環、フルオレン環、テトラリン環等が挙げられる。 The aromatic ring means a ring according to Hückel's law in which the number of electrons contained in the π-electron system on the ring is 4n + 2 (n is a natural number). The aromatic ring may be a carbon ring having a carbon atom as a ring-constituting atom, or a heterocyclic ring having a heteroatom such as an oxygen atom, a nitrogen atom, and a sulfur atom in addition to the carbon atom as the ring-constituting atom. In the form, it is preferably a carbocycle. Aromatic rings include not only monocyclic aromatic rings and fused rings in which two or more monocyclic aromatic rings are condensed, but also one or more monocyclic aromatic rings and one or more monocyclic aromatic rings. Also included is a fused ring in which the non-aromatic rings of the above are condensed. Specific examples of the aromatic ring include a benzene ring, a naphthalene ring, an anthracene ring, an indane ring, a fluorene ring, a tetralin ring and the like.
非芳香環とは、芳香環以外の環を意味する。非芳香環は、炭素環又は複素環であり得るが、一実施形態において、炭素環であることが好ましい。非芳香環は、飽和環であっても、不飽和環であってもよいが、一実施形態において、飽和環であることが好ましい。非芳香環には、シクロアルカン環、シクロアルケン環等の単環式の非芳香環、及び橋かけ炭化水素環等の2個以上の単環式の非芳香環が縮合した縮合非芳香環を含む。シクロアルカン環は、単環式の脂肪族飽和炭化水素環であり、例えば、シクロブタン環、シクロペンタン環、シクロヘキサン環、シクロヘプタン環、シクロオクタン環等の炭素原子数3〜8のシクロアルカン環が挙げられる。シクロアルケン環は、少なくとも1つの炭素−炭素二重結合を有する単環式の脂肪族不飽和炭化水素環であり、例えば、シクロブテン環、シクロペンテン環、シクロヘキセン環、シクロヘプテン環、シクロオクテン環、シクロペンタジエン環、シクロヘキサジエン環等の炭素原子数4〜8のシクロアルケン環が挙げられる。橋かけ炭化水素環は、2個以上の原子を共有する2個以上の環からなる非芳香環であり、例えば、ノルボルナン環、デカリン環、アダマンタン環、テトラヒドロジシクロペンタジエン環等の炭素原子数8〜15の橋かけ炭化水素環が挙げられる。 The non-aromatic ring means a ring other than the aromatic ring. The non-aromatic ring can be a carbocycle or a heterocycle, but in one embodiment, it is preferably a carbocycle. The non-aromatic ring may be a saturated ring or an unsaturated ring, but in one embodiment, it is preferably a saturated ring. The non-aromatic ring includes a fused non-aromatic ring obtained by condensing a monocyclic non-aromatic ring such as a cycloalkane ring or a cycloalkene ring, or two or more monocyclic non-aromatic rings such as a bridged hydrocarbon ring. include. The cycloalkane ring is a monocyclic aliphatic saturated hydrocarbon ring, and for example, a cycloalkane ring having 3 to 8 carbon atoms such as a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, and a cyclooctane ring can be used. Can be mentioned. The cycloalkene ring is a monocyclic aliphatic unsaturated hydrocarbon ring having at least one carbon-carbon double bond, and is, for example, a cyclobutene ring, a cyclopentene ring, a cyclohexene ring, a cycloheptene ring, a cyclooctene ring, or a cyclopentadiene. Examples thereof include cycloalkene rings having 4 to 8 carbon atoms such as rings and cyclohexadiene rings. The cross-linked hydrocarbon ring is a non-aromatic ring composed of two or more rings sharing two or more atoms, and has, for example, a norbornane ring, a decalin ring, an adamantane ring, a tetrahydrodicyclopentadiene ring, or the like having eight carbon atoms. Examples include ~ 15 bridged hydrocarbon rings.
n1が1以上の場合、n1とn2の比(n2/n1)は、好ましくは5.0以下、より好ましくは2.0以下、さらに好ましくは1.5以下、特に好ましくは1.2以下である。 When n1 is 1 or more, the ratio of n1 to n2 (n2 / n1) is preferably 5.0 or less, more preferably 2.0 or less, still more preferably 1.5 or less, and particularly preferably 1.2 or less. be.
A1は、それぞれ独立して、炭素原子数が7以上の脂肪鎖を有する2価の有機基を示す。A1で表される「2価の有機基」の骨格原子は、例えば、炭素原子、酸素原子、窒素原子、及び硫黄原子から選ばれ、骨格原子数は、特に限定されるものではないが、例えば、3000以下、1000以下、100以下、50以下等であり得る。 A 1 independently represents a divalent organic group having a fat chain having 7 or more carbon atoms. The skeleton atom of the "divalent organic group" represented by A 1 is selected from, for example, a carbon atom, an oxygen atom, a nitrogen atom, and a sulfur atom, and the number of skeleton atoms is not particularly limited. For example, it may be 3000 or less, 1000 or less, 100 or less, 50 or less, and the like.
A1は、一実施形態において、それぞれ独立して、好ましくは、ダイマージアミンから2個のアミノ基を除いてなる2価の基である。ダイマージアミンは、ダイマー酸の2個の末端カルボキシ基(−COOH)を、アミノ基又はアミノメチル基に置き換えた化合物を意味し、炭素原子数が7以上の脂肪族炭素鎖を有する。ダイマー酸は、例えば、不飽和脂肪酸(好ましくは炭素数11〜22の不飽和脂肪酸、特に好ましくはオレイン酸、リノール酸等の炭素数18の不飽和脂肪酸)の二量体又はその水素化物である。 A 1 is, in one embodiment, a divalent group each independently, preferably obtained by removing two amino groups from the dimer diamine. Dimerdiamine means a compound in which two terminal carboxy groups (-COOH) of dimer acid are replaced with amino groups or aminomethyl groups, and has an aliphatic carbon chain having 7 or more carbon atoms. The dimer acid is, for example, a dimer of an unsaturated fatty acid (preferably an unsaturated fatty acid having 11 to 22 carbon atoms, particularly preferably an unsaturated fatty acid having 18 carbon atoms such as oleic acid and linoleic acid) or a hydride thereof. ..
A1は、他の実施形態において、それぞれ独立して、好ましくは、炭素原子数が7以上の脂肪族炭素鎖を有する2価の非芳香族炭化水素基であり、より好ましくは、式(b1): In other embodiments, A 1 is a divalent non-aromatic hydrocarbon group independently and preferably having an aliphatic carbon chain having 7 or more carbon atoms, and more preferably the formula (b1). ):
[式中、Y1は、それぞれ独立して、原子数(好ましくはアルキレン主鎖の原子数)が7以上の直鎖又は分枝鎖(好ましくは直鎖)のアルキレン基、又は原子数(好ましくはアルケニレン主鎖の原子数)が7以上の直鎖又は分枝鎖(好ましくは直鎖)のアルケニレン基(好ましくは炭素原子数が7以上の直鎖又は分枝鎖(好ましくは直鎖)のアルキレン基)を示し、環Zy1は、アルキル基及びアルケニル基から選ばれる基を有していてもよいシクロアルカン環、又はアルキル基及びアルケニル基から選ばれる基を有していてもよいシクロアルケン環(好ましくはアルキル基を有していてもよいシクロヘキサン環)を示し;dは、0又は1(好ましくは1)を示し;*は、結合部位を示す。]
で表される2価の基である。
[In the formula, Y 1 is an alkylene group having 7 or more atoms (preferably the number of atoms in the alkylene main chain) or a branched alkylene group (preferably a straight chain), or the number of atoms (preferably). Is a straight-chain or branched (preferably straight-chain) alkenylene group (preferably a straight-chain or branched chain (preferably straight-chain) having 7 or more carbon atoms) having an alkaneylene main chain having 7 or more atoms. Alkylene group), and ring Z y1 may have a cycloalkene ring which may have a group selected from an alkyl group and an alkenyl group, or a cycloalkene which may have a group selected from an alkyl group and an alkenyl group. Indicates a ring (preferably a cyclohexane ring which may have an alkyl group); d indicates 0 or 1 (preferably 1); * indicates a binding site. ]
It is a divalent group represented by.
アルキレン基とは、2価の飽和炭化水素基であり、炭素原子数が7以上の直鎖又は分枝鎖のアルキレン基の炭素原子数は、例えば、7〜200であり、好ましくは7〜100、より好ましくは7〜50である。アルケニレン基とは、少なくとも1個の炭素−炭素二重結合を有する2価の脂肪族不飽和炭化水素基であり、炭素原子数が7以上の直鎖又は分枝鎖のアルケニレン基の炭素原子数は、例えば、7〜200であり、好ましくは7〜100、より好ましくは7〜50である。 The alkylene group is a divalent saturated hydrocarbon group, and the number of carbon atoms of a linear or branched alkylene group having 7 or more carbon atoms is, for example, 7 to 200, preferably 7 to 100. , More preferably 7 to 50. The alkenylene group is a divalent aliphatic unsaturated hydrocarbon group having at least one carbon-carbon double bond, and has a linear or branched alkenylene group having 7 or more carbon atoms. Is, for example, 7 to 200, preferably 7 to 100, and more preferably 7 to 50.
式(b1)で表される2価の基の具体例としては、下記式で表される2価の基が挙げられる: Specific examples of the divalent group represented by the formula (b1) include a divalent group represented by the following formula:
[式中、*は、結合部位を示す。]。 [In the formula, * indicates a binding site. ].
A2は、それぞれ独立して、炭素原子数が7以上の脂肪鎖を有さない2価の有機基(即ち脂肪鎖を有する場合それらの脂肪鎖のうち最も炭素原子数が多い脂肪鎖の炭素原子数が6以下である2価の有機基)を示す。A2で表される「2価の有機基」の骨格原子は、例えば、炭素原子、酸素原子、窒素原子、及び硫黄原子から選ばれ、骨格原子数は、特に限定されるものではないが、例えば、5〜3000、5〜1000、5〜100、5〜50等であり得る。A2は、例えば、ポリイミドの原料として一般的に使用される炭素原子数が7以上の脂肪鎖を有さないジアミン化合物から2個のアミノ基を除いてなる2価の基であり得るが、特に限定されない。 Each of A 2 is independently a divalent organic group having no fat chain having 7 or more carbon atoms (that is, if it has a fat chain, the carbon of the fat chain having the largest number of carbon atoms among those fat chains). A divalent organic group having 6 or less atoms) is shown. The skeleton atom of the "divalent organic group" represented by A 2 is selected from, for example, a carbon atom, an oxygen atom, a nitrogen atom, and a sulfur atom, and the number of skeleton atoms is not particularly limited. For example, it can be 5 to 3000, 5 to 1000, 5 to 100, 5 to 50 and the like. A 2 may be, for example, a divalent group generally used as a raw material for polyimide, which is obtained by removing two amino groups from a diamine compound having 7 or more carbon atoms and having no fat chain. Not particularly limited.
A2は、それぞれ独立して、好ましくは、炭素原子数が7以上の脂肪鎖を有さず且つ芳香環及び/又は非芳香環を有する2価の有機基(即ち脂肪鎖を有する場合それらの脂肪鎖のうち最も炭素原子数が多い脂肪鎖の炭素原子数が6以下であり且つ芳香環及び/又は非芳香環を有する2価の有機基)であり、より好ましくは、式(b2): Each of A 2 is independent and preferably a divalent organic group having no fatty chain having 7 or more carbon atoms and having an aromatic ring and / or a non-aromatic ring (that is, those having a fat chain). A divalent organic group having an aromatic ring and / or a non-aromatic ring and having 6 or less carbon atoms in the fat chain having the largest number of carbon atoms among the fat chains), more preferably the formula (b2) :.
[式中、Y21は、それぞれ独立して、単結合、又は−C(Rx)2−(好ましくは−C(Rx)2−)を示し;Y22は、それぞれ独立して、単結合、−C(Ry)2−、−O−、−CO−、−S−、−SO−、−SO2−、−CONH−、又は−NHCO−(好ましくは−C(Ry)2−又は−O−)を示し;Rx及びRyは、それぞれ独立して、水素原子、メチル基、エチル基又はフェニル基(好ましくは水素原子)を示し;環Zy2は、それぞれ独立して、炭素原子数1〜6のアルキル基及びフェニル基から選ばれる基を有していてもよい非芳香環、又は炭素原子数1〜6のアルキル基及びフェニル基から選ばれる基を有していてもよい芳香環を示し、eは、0又は1以上の整数(好ましくは0又は1〜5の整数)を示し;*は、結合部位を示す。]で表される2価の基である。なお、e単位は、単位毎に同一であってもよいし、異なっていてもよい。 [In the equation, Y 21 each independently indicates a single bond, or −C (R x ) 2 − (preferably −C (R x ) 2 −); Y 22 each independently, single. bond, -C (R y) 2 - , - O -, - CO -, - S -, - SO -, - SO 2 -, - CONH-, or -NHCO- (preferably -C (R y) 2 -Or -O-); R x and R y each independently represent a hydrogen atom, a methyl group, an ethyl group or a phenyl group (preferably a hydrogen atom); ring Z y 2 independently each. , A non-aromatic ring which may have a group selected from an alkyl group and a phenyl group having 1 to 6 carbon atoms, or a group selected from an alkyl group and a phenyl group having 1 to 6 carbon atoms. A good aromatic ring is shown, where e is 0 or an integer greater than or equal to 1 (preferably an integer of 0 or 1-5); * indicates a binding site. ] Is a divalent group represented by. The e-unit may be the same or different for each unit.
式(b2)で表される2価の基の具体例としては、下記式で表される2価の基が挙げられる: Specific examples of the divalent group represented by the formula (b2) include a divalent group represented by the following formula:
[式中、*は、結合部位を示す。]。 [In the formula, * indicates a binding site. ].
B1は、それぞれ独立して、芳香環及び/又は非芳香環を有する4価の有機基を示す。B1で表される「4価の有機基」の骨格原子は、例えば、炭素原子、酸素原子、窒素原子、及び硫黄原子から選ばれ、骨格原子数は、特に限定されるものではないが、例えば、5〜3000、5〜1000、5〜100、5〜50等であり得る。B1は、例えば、ポリイミドの原料として一般的に使用される芳香環及び/又は非芳香環を有するテトラカルボン酸無水物から2個の酸無水物基(−CO−O−CO−)を除いてなる4価の基であり得るが、特に限定されない。 B 1 independently represents a tetravalent organic group having an aromatic ring and / or a non-aromatic ring. The skeleton atom of the "tetravalent organic group" represented by B 1 is selected from, for example, a carbon atom, an oxygen atom, a nitrogen atom, and a sulfur atom, and the number of skeleton atoms is not particularly limited. For example, it can be 5 to 3000, 5 to 1000, 5 to 100, 5 to 50 and the like. B 1 excludes two acid anhydride groups (-CO-O-CO-) from, for example, a tetracarboxylic acid anhydride having an aromatic ring and / or a non-aromatic ring generally used as a raw material for polyimide. It can be a tetravalent group, but is not particularly limited.
B1は、それぞれ独立して、好ましくは、炭素原子数が7以上の脂肪鎖を有さず且つ芳香環及び/又は非芳香環を有する4価の有機基(即ち脂肪鎖を有する場合それらの脂肪鎖のうち最も炭素原子数が多い脂肪鎖の炭素原子数が6以下であり且つ芳香環及び/又は非芳香環を有する4価の有機基)であり、より好ましくは、式(b3): Each of B 1 is independently and preferably a tetravalent organic group having no fatty chain having 7 or more carbon atoms and having an aromatic ring and / or a non-aromatic ring (that is, those having a fat chain). A tetravalent organic group having an aromatic ring and / or a non-aromatic ring and having 6 or less carbon atoms in the fat chain having the largest number of carbon atoms among the fat chains), more preferably the formula (b3) :.
[式中、R1は、それぞれ独立して、炭素原子数1〜6のアルキル基又はフェニル基を示し;X1は、それぞれ独立して、単結合、−C(Rz)2−、−O−、−CO−、−S−、−SO−、−SO2−、−CONH−、又は−NHCO−(好ましくは−C(Rz)2−又は−O−)を示し;Rzは、それぞれ独立して、水素原子、メチル基、エチル基又はフェニル基(好ましくは水素原子)を示し;環Zx1は、それぞれ独立して、炭素原子数1〜6のアルキル基及びフェニル基から選ばれる基を有していてもよい非芳香環、又は炭素原子数1〜6のアルキル基及びフェニル基から選ばれる基を有していてもよい芳香環を示し;aは、それぞれ独立して、0〜2の整数(好ましくは0)を示し;bは、0又は1を示し;cは、0又は1以上の整数(好ましくは0又は1〜5の整数)を示し;*は、結合部位を示す。]
で表される4価の基である。なお、a単位及びc単位は、それぞれ、単位毎に同一であってもよいし、異なっていてもよい。
[In the formula, R 1 independently represents an alkyl group or a phenyl group having 1 to 6 carbon atoms; X 1 independently represents a single bond, −C (R z ) 2 −, −. O -, - CO -, - S -, - SO -, - SO 2 -, - CONH-, or -NHCO- (preferably -C (R z) 2 - or -O-) shows a; R z is Each independently represents a hydrogen atom, a methyl group, an ethyl group or a phenyl group (preferably a hydrogen atom); ring Z x1 is independently selected from an alkyl group and a phenyl group having 1 to 6 carbon atoms. Indicates a non-aromatic ring which may have a group, or an aromatic ring which may have a group selected from an alkyl group and a phenyl group having 1 to 6 carbon atoms; a is independently and independently of each other. An integer of 0 to 2 (preferably 0); b indicates 0 or 1; c indicates an integer of 0 or greater than 1 (preferably an integer of 0 or 1-5); * indicates a binding site. Is shown. ]
It is a tetravalent group represented by. The a unit and the c unit may be the same or different for each unit.
式(b3)で表される4価の基の具体例としては、下記式で表される4価の基が挙げられる: Specific examples of the tetravalent group represented by the formula (b3) include a tetravalent group represented by the following formula:
[式中、*は、結合部位を示す。]。 [In the formula, * indicates a binding site. ].
一実施形態において、(B)成分のマレイミド化合物は、より好ましくは、式(B2): In one embodiment, the maleimide compound of the component (B) is more preferably of the formula (B2) :.
[式中、各記号は、式(B1)、(b1)、(b2)及び(b3)と同様である。]
で表される2価の基(n1単位とn2単位の間は結合手)であり、さらに好ましくは、式(B3):
[In the formula, each symbol is the same as the formulas (B1), (b1), (b2) and (b3). ]
It is a divalent group represented by (a bond between n1 unit and n2 unit), and more preferably, the formula (B3) :.
[式中、各記号は、式(B1)、(b2)及び(b3)と同様である。]
で表される2価の基(n1単位とn2単位の間は結合手)である。
[In the formula, each symbol is the same as the formulas (B1), (b2) and (b3). ]
It is a divalent group represented by (a bond between n1 unit and n2 unit).
(B)成分の具体例としては、例えば、式(B4−1)〜(B4−5): Specific examples of the component (B) include, for example, the formulas (B4-1) to (B4-5) :.
[式中、n1’及びn2’は、それぞれ独立して、1〜20の整数(好ましくは1〜10の整数)を示す。]。
で表されるマレイミド化合物が挙げられる。なお、n1’単位及びn2’単位の順番及び個々の配置は任意であり、交互共重合体、ブロック共重合体、ランダム共重合体等を含む。
[In the formula, n1'and n2'independently indicate an integer of 1 to 20 (preferably an integer of 1 to 10). ].
The maleimide compound represented by is mentioned. The order and individual arrangement of n1'units and n2'units are arbitrary, and include alternate copolymers, block copolymers, random copolymers, and the like.
(B)成分の重量平均分子量(Mw)は、特に限定されるものではないが、好ましくは200〜50000、より好ましくは300〜40000、さらに好ましくは400〜20000である。(B)成分の重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)法により、ポリスチレン換算の値として測定できる。 The weight average molecular weight (Mw) of the component (B) is not particularly limited, but is preferably 200 to 50,000, more preferably 300 to 40,000, and even more preferably 400 to 20,000. The weight average molecular weight of the component (B) can be measured as a polystyrene-equivalent value by a gel permeation chromatography (GPC) method.
(B)成分の市販品としては、例えば、デザイナーモレキュールズ社製の「BMI−689」、「BMI−1500」、「BMI−1700」、「BMI−3000J」、「BMI−2500」等が挙げられる。 Examples of commercially available components (B) include "BMI-689", "BMI-1500", "BMI-1700", "BMI-3000J", and "BMI-2500" manufactured by Designer Moleculars. Can be mentioned.
樹脂組成物中の(B)成分の含有量は、特に限定されるものではないが、樹脂組成物中の不揮発成分を100質量%とした場合、好ましくは50質量%以下、より好ましくは40質量%以下、さらに好ましくは30質量%以下、さらにより好ましくは25質量%以下、特に好ましくは20質量%以下である。樹脂組成物中の(B)成分の含有量の下限は、特に限定されるものではないが、樹脂組成物中の不揮発成分を100質量%とした場合、好ましくは1質量%以上、より好ましくは3質量%以上、さらに好ましくは5質量%以上、さらにより好ましくは10質量%以上、特に好ましくは15質量%以上である。 The content of the component (B) in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 50% by mass or less, more preferably 40% by mass. % Or less, more preferably 30% by mass or less, still more preferably 25% by mass or less, and particularly preferably 20% by mass or less. The lower limit of the content of the component (B) in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 1% by mass or more, more preferably. It is 3% by mass or more, more preferably 5% by mass or more, still more preferably 10% by mass or more, and particularly preferably 15% by mass or more.
<(C)炭素原子数が7以上の脂肪鎖を有さないマレイミド化合物>
本発明の樹脂組成物は、(B)以外の成分として(C)炭素原子数が7以上の脂肪鎖を有さないマレイミド化合物を含有する。即ち(C)成分は、脂肪鎖を有する場合それらの脂肪鎖のうち最も炭素原子数が多い脂肪鎖の炭素原子数が6以下である。(C)成分は、1種類単独で用いてもよく、2種類以上を任意に組み合わせて用いてもよい。
<(C) Maleimide compound having no fat chain with 7 or more carbon atoms>
The resin composition of the present invention contains (C) a maleimide compound having no fat chain having 7 or more carbon atoms as a component other than (B). That is, when the component (C) has a fat chain, the fat chain having the largest number of carbon atoms among those fat chains has 6 or less carbon atoms. As the component (C), one type may be used alone, or two or more types may be used in any combination.
一実施形態において、(C)成分は、芳香環を構成する炭素原子に直接結合したマレイミド基を有することが好ましく、(C)成分に含まれるマレイミド基が、芳香環を構成する炭素原子に直接結合したマレイミド基のみであることが特に好ましい。 In one embodiment, the component (C) preferably has a maleimide group directly bonded to the carbon atom constituting the aromatic ring, and the maleimide group contained in the component (C) is directly attached to the carbon atom constituting the aromatic ring. It is particularly preferable that only the bound maleimide group is used.
一実施形態において、(C)成分のマレイミド化合物は、好ましくは、式(C1−1)又は(C1−2): In one embodiment, the maleimide compound of component (C) is preferably of the formula (C1-1) or (C1-2) :.
[式中、B2は、それぞれ独立して、炭素原子数が7以上の脂肪鎖を有さない4価の有機基を示し;nは、1以上の整数(好ましくは1〜100の整数)を示し;A3は、それぞれ独立して、炭素原子数が7以上の脂肪鎖を有さない2価の有機基を示し;R3は、それぞれ独立して、炭素原子数1〜6のアルキル基又はフェニル基を示し;sは、1又は1以上の整数(好ましくは1又は1〜100の整数、より好ましくは1又は1〜50の整数、さらに好ましくは1又は1〜20の整数)を示し;tは、それぞれ独立して、0〜2の整数(好ましくは0)を示し;その他の記号は、式(B1)と同様である。]
で表されるマレイミド化合物を含む。なお、n単位、s単位及びt単位は、それぞれ、単位毎に同一であってもよいし、異なっていてもよい。
[In the formula, B 2 independently represents a tetravalent organic group having no fat chain having 7 or more carbon atoms; n is an integer of 1 or more (preferably an integer of 1 to 100). A 3 independently indicate a divalent organic group having no fat chain having 7 or more carbon atoms; R 3 independently indicate an alkyl having 1 to 6 carbon atoms. Indicates a group or phenyl group; s is an integer of 1 or 1 or more (preferably an integer of 1 or 1 to 100, more preferably an integer of 1 or 1 to 50, still more preferably an integer of 1 or 1 to 20). Indicates; t independently indicates an integer of 0 to 2 (preferably 0); other symbols are the same as in equation (B1). ]
Includes maleimide compounds represented by. The n unit, the s unit, and the t unit may be the same or different for each unit.
B2は、それぞれ独立して、炭素原子数が7以上の脂肪鎖を有さない4価の有機基(即ち脂肪鎖を有する場合それらの脂肪鎖のうち最も炭素原子数が多い脂肪鎖の炭素原子数が6以下である4価の有機基)を示す。B2で表される「4価の有機基」の骨格原子は、例えば、炭素原子、酸素原子、窒素原子、及び硫黄原子から選ばれ、骨格原子数は、特に限定されるものではないが、例えば、5〜3000、5〜1000、5〜100、5〜50等であり得る。B2は、例えば、ポリイミドの原料として一般的に使用される炭素原子数が7以上の脂肪鎖を有さないテトラカルボン酸無水物から2個の酸無水物基(−CO−O−CO−)を除いてなる4価の基であり得るが、特に限定されない。 Each B 2 is independently a tetravalent organic group having no fat chain having 7 or more carbon atoms (that is, if it has a fat chain, the carbon of the fat chain having the largest number of carbon atoms among those fat chains). A tetravalent organic group having 6 or less atoms) is shown. The skeleton atom of the "tetravalent organic group" represented by B 2 is selected from, for example, a carbon atom, an oxygen atom, a nitrogen atom, and a sulfur atom, and the number of skeleton atoms is not particularly limited. For example, it can be 5 to 3000, 5 to 1000, 5 to 100, 5 to 50 and the like. B 2 is, for example, two acid anhydride groups (-CO-O-CO-) from a tetracarboxylic acid anhydride having no fat chain having 7 or more carbon atoms, which is generally used as a raw material for polyimide. ) Can be a tetravalent group, but is not particularly limited.
B2は、それぞれ独立して、好ましくは、炭素原子数が7以上の脂肪鎖を有さず且つ芳香環及び/又は非芳香環を有する4価の有機基(即ち脂肪鎖を有する場合それらの脂肪鎖のうち最も炭素原子数が多い脂肪鎖の炭素原子数が6以下であり且つ芳香環及び/又は非芳香環を有する4価の有機基)であり、より好ましくは、上記式(b3)で表される4価の基である。 Each of B 2 is independently and preferably a tetravalent organic group having no fatty chain having 7 or more carbon atoms and having an aromatic ring and / or a non-aromatic ring (that is, those having a fat chain). A tetravalent organic group having an aromatic ring and / or a non-aromatic ring and having 6 or less carbon atoms in the fat chain having the largest number of carbon atoms among the fat chains), more preferably the above formula (b3). It is a tetravalent group represented by.
A3は、それぞれ独立して、炭素原子数が7以上の脂肪鎖を有さない2価の有機基を示す。A3で表される「2価の有機基」の骨格原子は、例えば、炭素原子、酸素原子、窒素原子、及び硫黄原子から選ばれ、骨格原子数は、特に限定されるものではないが、例えば、1〜3000、1〜1000、1〜100、1〜50等であり得る。 A 3 each independently represents a divalent organic group having the number of carbon atoms has no more than 7 aliphatic chain. Backbone atoms of the "divalent organic group" represented by A 3, for example, a carbon atom, an oxygen atom, a nitrogen atom, and is selected from sulfur atom, the number of skeletal atoms include, but are not limited to, For example, it may be 1-3000, 1-1000, 1-100, 1-50 and the like.
式(C1−1)で表されるマレイミド化合物は、好ましくは、式(C2−1): The maleimide compound represented by the formula (C1-1) is preferably the formula (C2-1) :.
[式中、各記号は、式(C1−1)、(b2)及び(b3)と同様である。]
で表されるマレイミド化合物であり、より好ましくは、式(C3−1):
[In the formula, each symbol is the same as the formulas (C1-1), (b2) and (b3). ]
It is a maleimide compound represented by, more preferably the formula (C3-1) :.
[式中、R2は、それぞれ独立して、炭素原子数1〜6のアルキル基又はフェニル基を示し;fは、それぞれ独立して、0〜2の整数を示し;その他の記号は、式(C1−1)、(b2)及び(b3)と同様である。]
で表されるマレイミド化合物である。なお、f単位は、単位毎に同一であってもよいし、異なっていてもよい。
[In the formula, R 2 independently represents an alkyl group or a phenyl group having 1 to 6 carbon atoms; f independently represents an integer of 0 to 2; other symbols represent formulas. This is the same as (C1-1), (b2) and (b3). ]
It is a maleimide compound represented by. The f unit may be the same for each unit or may be different.
式(C1−2)で表されるマレイミド化合物は、好ましくは、式(C2−2): The maleimide compound represented by the formula (C1-2) is preferably the formula (C2-2) :.
[式中、X3は、それぞれ独立して、単結合、−C(Ra)2−、−O−、−CO−、−S−、−SO−、−SO2−、−CONH−、又は−NHCO−を示し;Raは、それぞれ独立して、水素原子、メチル基、エチル基又はフェニル基を示し;環Zx3は、炭素原子数1〜6のアルキル基及びフェニル基から選ばれる基を有していてもよい非芳香環、又は炭素原子数1〜6のアルキル基及びフェニル基から選ばれる基を有していてもよい芳香環を示し;uは、それぞれ独立して、0又は1以上の整数(好ましくは0又は1〜50の整数)を示し;その他の記号は、式(C1−2)と同様である。]
で表されるマレイミド化合物であり、より好ましくは、式(C3−2):
Wherein, X 3 are each independently a single bond, -C (R a) 2 - , - O -, - CO -, - S -, - SO -, - SO 2 -, - CONH-, or shows a -NHCO-; R a is independently, a hydrogen atom, a methyl group, an ethyl group or a phenyl group; the ring Z x3, selected from the group consisting of alkyl groups and phenyl groups having 1 to 6 carbon atoms Indicates a non-aromatic ring which may have a group, or an aromatic ring which may have a group selected from an alkyl group and a phenyl group having 1 to 6 carbon atoms; u is independently 0. Or an integer of 1 or more (preferably an integer of 0 or 1 to 50); other symbols are the same as in equation (C1-2). ]
It is a maleimide compound represented by, more preferably the formula (C3-2) :.
[式中、X4は、それぞれ独立して、単結合、−C(Rb)(Rc)−、−O−、−CO−、−S−、−SO−、−SO2−、−CONH−、又は−NHCO−を示し;R4及びRbは、それぞれ独立して、水素原子、メチル基又はフェニル基を示し;R5は、それぞれ独立して、水素原子、炭素原子数1〜6のアルキル基又はフェニル基を示し、Rcは、水素原子、メチル基又はフェニル基を示すか、或いはR5及びRcが一緒になって互いに結合し、アルキル基及びアルケニル基から選ばれる基を有していてもよい環(例えばインダン環)を形成し;R6は、それぞれ独立して、水素原子、炭素原子数1〜6のアルキル基又はフェニル基を示し;vは、0又は1以上の整数(好ましくは0又は1〜10の整数)を示し;その他の記号は、式(C1−2)と同様である。]
で表されるマレイミド化合物である。なお、u単位及びv単位は、それぞれ、単位毎に同一であってもよいし、異なっていてもよい。
[In the formula, X 4 are independently single-bonded, -C (R b ) (R c )-, -O-, -CO-, -S-, -SO-, -SO 2 -,-. CONH-, or -NHCO- indicates; R 4 and R b are each independently a hydrogen atom, a methyl group or a phenyl group; R 5 is independently hydrogen atom, 1 to carbon atoms 6 represents an alkyl or phenyl group, where R c represents a hydrogen atom, a methyl group or a phenyl group, or R 5 and R c are combined together to bond to each other and are selected from alkyl and alkenyl groups. Forming a ring (eg, an indan ring) which may have; R 6 independently represents a hydrogen atom, an alkyl group or a phenyl group having 1 to 6 carbon atoms; v is 0 or 1. The above integer (preferably an integer of 0 or 1 to 10) is shown; other symbols are the same as in the formula (C1-2). ]
It is a maleimide compound represented by. The u unit and the v unit may be the same or different for each unit.
(C)成分の具体例としては、例えば、式(C4−1)〜(C4−4): Specific examples of the component (C) include, for example, formulas (C4-1) to (C4-4) :.
[式中、n’及びn’’は、それぞれ独立して、1〜20の整数(好ましくは1〜10の整数)を示し;s’は、1〜100の整数(好ましくは1〜50の整数、より好ましくは1〜20の整数)を示し;v’は、それぞれ独立して、1〜10の整数(好ましくは1〜5の整数)を示す。]。
で表されるマレイミド化合物が挙げられる。なお、n’単位、n’’単位の順番及び個々の配置は任意であり、交互共重合体、ブロック共重合体、ランダム共重合体等を含む。
[In the formula, n'and n'' each independently represent an integer of 1 to 20 (preferably an integer of 1 to 10); s'is an integer of 1 to 100 (preferably 1 to 50). Integers, more preferably integers from 1 to 20); v'independently indicates integers from 1 to 10 (preferably integers from 1 to 5). ].
The maleimide compound represented by is mentioned. The order and individual arrangement of n'units and n'units are arbitrary, and include alternate copolymers, block copolymers, random copolymers, and the like.
(C)成分の重量平均分子量(Mw)は、特に限定されるものではないが、好ましくは200〜50000、より好ましくは300〜40000、さらに好ましくは400〜20000である。(C)成分の重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)法により、ポリスチレン換算の値として測定できる。 The weight average molecular weight (Mw) of the component (C) is not particularly limited, but is preferably 200 to 50,000, more preferably 300 to 40,000, and even more preferably 400 to 20,000. The weight average molecular weight of the component (C) can be measured as a polystyrene-equivalent value by a gel permeation chromatography (GPC) method.
(C)成分の市販品としては、例えば、デザイナーモレキュールズ社製の「BMI−6100」、日本化薬社製の「MIR−3000−70MT」等が挙げられる。 Examples of commercially available products of the component (C) include "BMI-6100" manufactured by Designer Molecule's Co., Ltd., "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd., and the like.
樹脂組成物中の(C)成分の含有量は、特に限定されるものではないが、樹脂組成物中の不揮発成分を100質量%とした場合、好ましくは50質量%以下、より好ましくは40質量%以下、さらに好ましくは30質量%以下、さらにより好ましくは25質量%以下、特に好ましくは20質量%以下である。樹脂組成物中の(C)成分の含有量の下限は、特に限定されるものではないが、樹脂組成物中の不揮発成分を100質量%とした場合、好ましくは1質量%以上、より好ましくは3質量%以上、さらに好ましくは5質量%以上、さらにより好ましくは10質量%以上、特に好ましくは15質量%以上である。 The content of the component (C) in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 50% by mass or less, more preferably 40% by mass. % Or less, more preferably 30% by mass or less, still more preferably 25% by mass or less, and particularly preferably 20% by mass or less. The lower limit of the content of the component (C) in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 1% by mass or more, more preferably. It is 3% by mass or more, more preferably 5% by mass or more, still more preferably 10% by mass or more, and particularly preferably 15% by mass or more.
樹脂組成物中の(B)成分に対する(C)成分の質量比((C)成分/(B)成分)は、特に限定されるものではないが、好ましくは0.01以上、より好ましくは0.1以上、さらに好ましくは0.5以上、特に好ましくは0.8以上である。(B)成分に対する(C)成分の質量比((C)成分/(B)成分)の上限値は、特に限定されるものではないが、好ましくは50以下、より好ましくは40以下、さらに好ましくは20以下、特に好ましくは5以下である。 The mass ratio of the component (C) to the component (B) in the resin composition (component (C) / component (B)) is not particularly limited, but is preferably 0.01 or more, more preferably 0. .1 or more, more preferably 0.5 or more, and particularly preferably 0.8 or more. The upper limit of the mass ratio of the component (C) to the component (B) (component (C) / component (B)) is not particularly limited, but is preferably 50 or less, more preferably 40 or less, still more preferable. Is 20 or less, particularly preferably 5 or less.
樹脂組成物中の(B)成分及び(C)成分の合計に対する(A)成分の質量比((A)成分/(B)成分及び(C)成分の合計)は、特に限定されるものではないが、好ましくは0.01以上、より好ましくは0.05以上、さらに好ましくは0.1以上、特に好ましくは0.2以上である。(B)成分及び(C)成分の合計に対する(A)成分の質量比((A)成分/(B)成分及び(C)成分の合計)の上限は、特に限定されるものではないが、好ましくは5以下、より好ましくは1以下、さらに好ましくは0.5以下、特に好ましくは0.3以下である。 The mass ratio of the component (A) to the total of the components (B) and (C) in the resin composition (the total of the components (A) / (B) and (C)) is not particularly limited. However, it is preferably 0.01 or more, more preferably 0.05 or more, still more preferably 0.1 or more, and particularly preferably 0.2 or more. The upper limit of the mass ratio of the component (A) to the total of the components (B) and (C) (the total of the components (A) / (B) and (C)) is not particularly limited, but is not particularly limited. It is preferably 5 or less, more preferably 1 or less, still more preferably 0.5 or less, and particularly preferably 0.3 or less.
<(D)任意のラジカル重合性化合物>
本発明の樹脂組成物は、任意成分として(B)成分及び(C)成分以外の(D)ラジカル重合性化合物を含む場合がある。(D)成分は、1種類単独で用いてもよく、2種類以上を任意に組み合わせて用いてもよい。
<(D) Arbitrary radically polymerizable compound>
The resin composition of the present invention may contain (D) radically polymerizable compounds other than the component (B) and the component (C) as optional components. As the component (D), one type may be used alone, or two or more types may be used in any combination.
(D)成分は、例えば、ラジカル重合性不飽和基を有する化合物であり得る。ラジカル重合性不飽和基としては、ラジカル重合可能である限り特に限定されるものではないが、末端又は内部に炭素−炭素二重結合を有するエチレン性不飽和基が好ましく、具体的に、アリル基、3−シクロヘキセニル基等の不飽和脂肪族基;p−ビニルフェニル基、m−ビニルフェニル基、スチリル基等の不飽和脂肪族基含有芳香族基;アクリロイル基、メタクリロイル基、マレオイル基、フマロイル基等のα,β−不飽和カルボニル基等であり得る。(D)成分は、ラジカル重合性不飽和基を1個以上有することが好ましく、2個以上有することがより好ましい。 The component (D) can be, for example, a compound having a radically polymerizable unsaturated group. The radically polymerizable unsaturated group is not particularly limited as long as it can be radically polymerizable, but an ethylenically unsaturated group having a carbon-carbon double bond at the terminal or inside is preferable, and specifically, an allyl group. , 3-Cyclohexenyl group and other unsaturated aliphatic groups; p-vinylphenyl group, m-vinylphenyl group, styryl group and other unsaturated aliphatic group-containing aromatic groups; acryloyl group, methacryloyl group, maleoil group, fumaroyl It can be an α, β-unsaturated carbonyl group such as a group. The component (D) preferably has one or more radically polymerizable unsaturated groups, and more preferably two or more radically polymerizable unsaturated groups.
(D)成分としては、公知のラジカル重合性化合物を広く使用することができ、特に限定されるものではないが、例えば、(D−1)ビニルフェニル系ラジカル重合性化合物、(D−2)(メタ)アクリル系ラジカル重合性化合物等が挙げられる。 As the component (D), a known radically polymerizable compound can be widely used, and the component is not particularly limited, but for example, (D-1) a vinylphenyl radically polymerizable compound, (D-2). Examples thereof include (meth) acrylic radically polymerizable compounds.
<(D−1)ビニルフェニル系ラジカル重合性化合物>
(D−1)ビニルフェニル系ラジカル重合性化合物は、ビニルフェニル基を有するラジカル重合性化合物である。ビニルフェニル系ラジカル重合性化合物は、1分子あたり2個以上のビニルフェニル基を有することが好ましい。
<(D-1) Vinyl Phenyl Radical Polymerizable Compound>
(D-1) The vinylphenyl radically polymerizable compound is a radically polymerizable compound having a vinylphenyl group. The vinylphenyl radically polymerizable compound preferably has two or more vinylphenyl groups per molecule.
一実施形態において、(D−1)ビニルフェニル系ラジカル重合性化合物は、ビニルベンジル基及びポリフェニレンエーテル骨格を有するビニルベンジル変性ポリフェニレンエーテルが好ましく、式(D1): In one embodiment, the (D-1) vinylphenyl radically polymerizable compound is preferably a vinylbenzyl-modified polyphenylene ether having a vinylbenzyl group and a polyphenylene ether skeleton, and the formula (D1)::
[式中、R11、R12、R13及びR14は、それぞれ独立して、水素原子又は置換基(好ましくは水素原子又はアルキル基、特に好ましくは水素原子又はメチル基)を示す。]
で表される繰り返し単位(繰り返し単位数は好ましくは2〜300、より好ましくは2〜100)及びビニルベンジル基を有するビニルベンジル変性ポリフェニレンエーテル(特にポリフェニレンエーテルの両末端水酸基の水素原子をビニルベンジル基に置き換えた両末端ビニルベンジル変性ポリフェニレンエーテル)であることが特に好ましい。
[In the formula, R 11 , R 12 , R 13 and R 14 independently represent a hydrogen atom or a substituent (preferably a hydrogen atom or an alkyl group, particularly preferably a hydrogen atom or a methyl group). ]
A vinylbenzyl-modified polyphenylene ether having a repeating unit represented by (the number of repeating units is preferably 2 to 300, more preferably 2 to 100) and a vinylbenzyl group (particularly, the hydrogen atoms of both terminal hydroxyl groups of the polyphenylene ether are vinylbenzyl groups. It is particularly preferable that it is a bi-terminal vinylbenzyl-modified polyphenylene ether) replaced with.
他の実施形態において、(D−1)ビニルフェニル系ラジカル重合性化合物は、式(D2): In other embodiments, the (D-1) vinyl phenyl radically polymerizable compound is of formula (D2) :.
[式中、R15、R16及びR17は、それぞれ独立して、水素原子又は置換基(好ましくは水素原子)を示す。]
で表される繰り返し単位(繰り返し単位数は好ましくは2〜200)を有するジビニルベンゼン重合体であることが好ましい。当該ジビニルベンゼン重合体は、さらに、スチレン単位、エチルスチレン単位等のその他のスチレン骨格単位を有する共重合体であってもよい。その他のスチレン骨格単位を有する場合、式(D2)の繰り返し単位の割合は、全スチレン骨格単位に対して5〜70モル%であることが好ましい。
[In the formula, R 15 , R 16 and R 17 each independently represent a hydrogen atom or a substituent (preferably a hydrogen atom). ]
It is preferably a divinylbenzene polymer having a repeating unit represented by (the number of repeating units is preferably 2 to 200). The divinylbenzene polymer may be a copolymer having other styrene skeleton units such as styrene unit and ethylstyrene unit. When having other styrene skeleton units, the ratio of the repeating unit of the formula (D2) is preferably 5 to 70 mol% with respect to the total styrene skeleton units.
(D−1)ビニルフェニル系ラジカル重合性化合物の数平均分子量は、特に限定されるものではないが、好ましくは500〜100000、より好ましくは700〜80000である。(D)成分の数平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)法により、ポリスチレン換算の値として測定できる。(D−1)ビニルフェニル系ラジカル重合性化合物のビニル基の官能基当量は、特に限定されるものではないが、好ましくは200g/eq.〜3000g/eq.、より好ましくは200g/eq.〜2000g/eq.である。 The number average molecular weight of the (D-1) vinylphenyl radically polymerizable compound is not particularly limited, but is preferably 500 to 100,000, more preferably 700 to 80,000. The number average molecular weight of the component (D) can be measured as a polystyrene-equivalent value by a gel permeation chromatography (GPC) method. (D-1) The functional group equivalent of the vinyl group of the vinyl phenyl radically polymerizable compound is not particularly limited, but is preferably 200 g / eq. ~ 3000 g / eq. , More preferably 200 g / eq. ~ 2000 g / eq. Is.
(D−1)ビニルフェニル系ラジカル重合性化合物の市販品としては、例えば、三菱ガス化学社製の「OPE−2St 1200」、「OPE−2St 2200」(ビニルベンジル変性ポリフェニレンエーテル);日鉄ケミカル&マテリアル株式会社製の「ODV−XET−X03」、「ODV−XET−X04」、「ODV−XET−X05」(ジビニルベンゼン重合体)等が挙げられる。 (D-1) Commercially available products of the vinylphenyl radically polymerizable compound include, for example, "OPE-2St 1200" and "OPE-2St 2200" (vinylbenzyl-modified polyphenylene ether) manufactured by Mitsubishi Gas Chemicals, Inc .; Nittetsu Chemicals. & "ODV-XET-X03", "ODV-XET-X04", "ODV-XET-X05" (divinylbenzene polymer) manufactured by Material Co., Ltd. and the like can be mentioned.
<(D−2)(メタ)アクリル系ラジカル重合性化合物>
(D−2)(メタ)アクリル系ラジカル重合性化合物は、アクリロイル基及び/又はメタクリロイル基を有するラジカル重合性化合物である。(D−2)(メタ)アクリル系ラジカル重合性化合物は、1分子あたり2個以上のアクリロイル基及び/又はメタクリロイル基を有することが好ましい。(D−2)(メタ)アクリル系ラジカル重合性化合物は、アクリロイル基及び/又はメタクリロイル基並びにポリフェニレンエーテル骨格を有する(メタ)アクリル変性ポリフェニレンエーテルが好ましく、式(D3):
<(D-2) (meth) acrylic radically polymerizable compound>
The (D-2) (meth) acrylic radically polymerizable compound is a radically polymerizable compound having an acryloyl group and / or a methacryloyl group. (D-2) The (meth) acrylic radically polymerizable compound preferably has two or more acryloyl groups and / or methacryloyl groups per molecule. (D-2) The (meth) acrylic radically polymerizable compound is preferably a (meth) acrylic-modified polyphenylene ether having an acryloyl group and / or a methacryloyl group and a polyphenylene ether skeleton, and formula (D3) :.
[式中、R21、R22、R23及びR24は、それぞれ独立して、水素原子又は置換基(好ましくは水素原子又はアルキル基、特に好ましくは水素原子又はメチル基)を示す。]
で表される繰り返し単位(繰り返し単位数は好ましくは2〜300、より好ましくは2〜100)並びにアクリロイル基及び/又はメタクリロイル基を有する(メタ)アクリル変性ポリフェニレンエーテル(特にポリフェニレンエーテルの両末端水酸基の水素原子をアクリロイル基及び/又はメタクリロイル基に置き換えた両末端(メタ)アクリル変性ポリフェニレンエーテル)であることが特に好ましい。
[In the formula, R 21 , R 22 , R 23 and R 24 each independently represent a hydrogen atom or a substituent (preferably a hydrogen atom or an alkyl group, particularly preferably a hydrogen atom or a methyl group). ]
(The number of repeating units is preferably 2 to 300, more preferably 2 to 100) and a (meth) acrylic-modified polyphenylene ether having an acryloyl group and / or a methacryloyl group (particularly, the hydroxyl groups at both ends of the polyphenylene ether). Both terminal (meth) acrylic-modified polyphenylene ethers in which the hydrogen atom is replaced with an acryloyl group and / or a methacryloyl group) are particularly preferable.
(D−2)(メタ)アクリル系ラジカル重合性化合物の数平均分子量は、特に限定されるものではないが、好ましくは500〜10000、より好ましくは700〜5000である。(D−2)(メタ)アクリル系ラジカル重合性化合物のアクリロイル基及びメタクリロイル基の官能基当量は、特に限定されるものではないが、好ましくは200g/eq.〜3000g/eq.、より好ましくは300g/eq.〜2000g/eq.である。 The number average molecular weight of the (D-2) (meth) acrylic radically polymerizable compound is not particularly limited, but is preferably 500 to 10000, more preferably 700 to 5000. (D-2) The functional group equivalents of the acryloyl group and the methacryloyl group of the (meth) acrylic radically polymerizable compound are not particularly limited, but are preferably 200 g / eq. ~ 3000 g / eq. , More preferably 300 g / eq. ~ 2000 g / eq. Is.
(D−2)(メタ)アクリル系ラジカル重合性化合物の市販品としては、例えば、SABICイノベーティブプラスチックス社製の「SA9000」、「SA9000−111」(メタクリル変性ポリフェニレンエーテル)等が挙げられる。 Examples of commercially available products of the (D-2) (meth) acrylic radically polymerizable compound include "SA9000" and "SA9000-111" (methacryl-modified polyphenylene ether) manufactured by SABIC Innovative Plastics Co., Ltd.
樹脂組成物中の(D)成分の含有量は、特に限定されるものではないが、樹脂組成物中の不揮発成分を100質量%とした場合、好ましくは60質量%以下、より好ましくは50質量%以下、さらに好ましくは40質量%以下、さらにより好ましくは30質量%以下、特に好ましくは20質量%以下である。樹脂組成物中の(D)成分の含有量の下限は、特に限定されるものではないが、樹脂組成物中の不揮発成分を100質量%とした場合、例えば、0質量%、0.1質量%以上、1質量%以上、3質量%以上、5質量%以上、7質量%以上等であり得る。 The content of the component (D) in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 60% by mass or less, more preferably 50% by mass. % Or less, more preferably 40% by mass or less, still more preferably 30% by mass or less, and particularly preferably 20% by mass or less. The lower limit of the content of the component (D) in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, for example, 0% by mass or 0.1% by mass. % Or more, 1% by mass or more, 3% by mass or more, 5% by mass or more, 7% by mass or more, and the like.
<(E)無機充填材>
本発明の樹脂組成物は、任意成分として(E)無機充填材を含む場合がある。(E)無機充填材は、粒子の状態で樹脂組成物に含まれる。
<(E) Inorganic filler>
The resin composition of the present invention may contain (E) an inorganic filler as an optional component. (E) The inorganic filler is contained in the resin composition in the form of particles.
(E)無機充填材の材料としては、無機化合物を用いる。(E)無機充填材の材料としては、例えば、シリカ、アルミナ、ガラス、コーディエライト、シリコン酸化物、硫酸バリウム、炭酸バリウム、タルク、クレー、雲母粉、酸化亜鉛、ハイドロタルサイト、ベーマイト、水酸化アルミニウム、水酸化マグネシウム、炭酸カルシウム、炭酸マグネシウム、酸化マグネシウム、窒化ホウ素、窒化アルミニウム、窒化マンガン、ホウ酸アルミニウム、炭酸ストロンチウム、チタン酸ストロンチウム、チタン酸カルシウム、チタン酸マグネシウム、チタン酸ビスマス、酸化チタン、酸化ジルコニウム、チタン酸バリウム、チタン酸ジルコン酸バリウム、ジルコン酸バリウム、ジルコン酸カルシウム、リン酸ジルコニウム、リン酸タングステン酸ジルコニウム、フェライト、鉄系合金等が挙げられる。これらの中でも、シリカが特に好適である。シリカとしては、例えば、無定形シリカ、溶融シリカ、結晶シリカ、合成シリカ、中空シリカ等が挙げられる。また、シリカとしては球形シリカが好ましい。(E)無機充填材は、1種類単独で用いてもよく、2種以上を任意の比率で組み合わせて用いてもよい。 (E) An inorganic compound is used as the material of the inorganic filler. Examples of the material of the inorganic filler (E) include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, and water. Aluminum oxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide , Zirconate oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconate phosphate, zirconate titanate, ferrite, iron-based alloys and the like. Of these, silica is particularly suitable. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica and the like. Further, as silica, spherical silica is preferable. (E) As the inorganic filler, one type may be used alone, or two or more types may be used in combination at any ratio.
(E)無機充填材の市販品としては、例えば、電化化学工業社製の「UFP−30」;新日鉄住金マテリアルズ社製の「SP60−05」、「SP507−05」;アドマテックス社製の「YC100C」、「YA050C」、「YA050C−MJE」、「YA010C」;デンカ社製の「UFP−30」;トクヤマ社製の「シルフィルNSS−3N」、「シルフィルNSS−4N」、「シルフィルNSS−5N」;アドマテックス社製の「SC2500SQ」、「SO−C4」、「SO−C2」、「SO−C1」;デンカ社製の「DAW−03」、「FB−105FD」などが挙げられる。 (E) Commercially available inorganic fillers include, for example, "UFP-30" manufactured by Denka Kagaku Kogyo Co., Ltd .; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumikin Materials Co., Ltd .; "YC100C", "YA050C", "YA050C-MJE", "YA010C"; "UFP-30" manufactured by Denka Corporation; "Silfil NSS-3N", "Silfil NSS-4N", "Silfil NSS-" manufactured by Tokuyama Corporation. 5N ”;“ SC2500SQ ”,“ SO-C4 ”,“ SO-C2 ”,“ SO-C1 ”manufactured by Admatex;“ DAW-03 ”,“ FB-105FD ”manufactured by Denka, and the like.
(E)無機充填材の平均粒径は、特に限定されるものではないが、好ましくは10μm以下、より好ましくは5μm以下、さらに好ましくは2μm以下、さらにより好ましくは1μm以下、特に好ましくは0.7μm以下である。(E)無機充填材の平均粒径の下限は、特に限定されるものではないが、好ましくは0.01μm以上、より好ましくは0.05μm以上、さらに好ましくは0.1μm以上、特に好ましくは0.2μm以上である。(E)無機充填材の平均粒径は、ミー(Mie)散乱理論に基づくレーザー回折・散乱法により測定することができる。具体的には、レーザー回折散乱式粒径分布測定装置により、無機充填材の粒径分布を体積基準で作成し、そのメディアン径を平均粒径とすることで測定することができる。測定サンプルは、無機充填材100mg、メチルエチルケトン10gをバイアル瓶に秤取り、超音波にて10分間分散させたものを使用することができる。測定サンプルを、レーザー回折式粒径分布測定装置を使用して、使用光源波長を青色及び赤色とし、フローセル方式で無機充填材の体積基準の粒径分布を測定し、得られた粒径分布からメディアン径として平均粒径を算出した。レーザー回折式粒径分布測定装置としては、例えば堀場製作所社製「LA−960」等が挙げられる。 The average particle size of the (E) inorganic filler is not particularly limited, but is preferably 10 μm or less, more preferably 5 μm or less, still more preferably 2 μm or less, still more preferably 1 μm or less, and particularly preferably 0. It is 7 μm or less. (E) The lower limit of the average particle size of the inorganic filler is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.05 μm or more, still more preferably 0.1 μm or more, and particularly preferably 0. .2 μm or more. (E) The average particle size of the inorganic filler can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, it can be measured by creating a particle size distribution of the inorganic filler on a volume basis by a laser diffraction / scattering type particle size distribution measuring device and using the median diameter as the average particle size. As the measurement sample, 100 mg of an inorganic filler and 10 g of methyl ethyl ketone can be weighed in a vial and dispersed by ultrasonic waves for 10 minutes. The measurement sample was measured using a laser diffraction type particle size distribution measuring device, the light source wavelengths used were blue and red, and the volume-based particle size distribution of the inorganic filler was measured by the flow cell method, and the obtained particle size distribution was used. The average particle size was calculated as the median diameter. Examples of the laser diffraction type particle size distribution measuring device include "LA-960" manufactured by HORIBA, Ltd.
(E)無機充填材の比表面積は、特に限定されるものではないが、好ましくは0.1m2/g以上、より好ましくは0.5m2/g以上、さらに好ましくは1m2/g以上、特に好ましくは3m2/g以上である。(E)無機充填材の比表面積の上限は、特に限定されるものではないが、好ましくは100m2/g以下、より好ましくは70m2/g以下、さらに好ましくは50m2/g以下、特に好ましくは40m2/g以下である。無機充填材の比表面積は、BET法に従って、比表面積測定装置(マウンテック社製Macsorb HM−1210)を使用して試料表面に窒素ガスを吸着させ、BET多点法を用いて比表面積を算出することで得られる。 (E) The specific surface area of the inorganic filler is not particularly limited, but is preferably 0.1 m 2 / g or more, more preferably 0.5 m 2 / g or more, still more preferably 1 m 2 / g or more. Particularly preferably, it is 3 m 2 / g or more. (E) The upper limit of the specific surface area of the inorganic filler is not particularly limited, but is preferably 100 m 2 / g or less, more preferably 70 m 2 / g or less, still more preferably 50 m 2 / g or less, and particularly preferably. Is 40 m 2 / g or less. For the specific surface area of the inorganic filler, nitrogen gas is adsorbed on the sample surface using a specific surface area measuring device (Maxorb HM-1210 manufactured by Mountech) according to the BET method, and the specific surface area is calculated using the BET multipoint method. It can be obtained by.
(E)無機充填材は、適切な表面処理剤で表面処理されていることが好ましい。表面処理されることにより、(E)無機充填材の耐湿性及び分散性を高めることができる。表面処理剤としては、例えば、ビニルトリメトキシシラン、ビニルトリエトキシシラン等のビニル系シランカップリング剤;2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、3−グリシドキシプロピルメチルジメトキシシラン、3−グリシドキシプロピルトリメトキシシラン、3−グリシドキシプロピルメチルジエトキシシラン、3−グリシドキシプロピルトリエトキシシラン等のエポキシ系シランカップリング剤;p−スチリルトリメトキシシラン等のスチリル系シランカップリング剤;3−メタクリロキシプロピルメチルジメトキシシラン、3−メタクリロキシプロピルトリメトキシシラン、3−メタクリロキシプロピルメチルジエトキシシラン、3−メタクリロキシプロピルトリエトキシシラン等のメタクリル系シランカップリング剤;3−アクリロキシプロピルトリメトキシシラン等のアクリル系シランカップリング剤;N−2−(アミノエチル)−3−アミノプロピルメチルジメトキシシラン、N−2−(アミノエチル)−3−アミノプロピルトリメトキシシラン、3−アミノプロピルトリメトキシシラン、3−アミノプロピルトリエトキシシラン、3−トリエトキシシリル−N−(1,3−ジメチル−ブチリデン)プロピルアミン、N−フェニル−3−アミノプロピルトリメトキシシラン、N−フェニル−8−アミノオクチルトリメトキシシラン、N−(ビニルベンジル)−2−アミノエチル−3−アミノプロピルトリメトキシシラン等のアミノ系シランカップリング剤;トリス-(トリメトキシシリルプロピル)イソシアヌレート等のイソシアヌレート系シランカップリング剤;3−ウレイドプロピルトリアルコキシシラン等の等のウレイド系シランカップリング剤;3−メルカプトプロピルメチルジメトキシシラン、3−メルカプトプロピルトリメトキシシラン等のメルカプト系シランカップリング剤;3−イソシアネートプロピルトリエトキシシラン等のイソシアネート系シランカップリング剤;3−トリメトキシシリルプロピルコハク酸無水物等の酸無水物系シランカップリング剤;等のシランカップリング剤;メチルトリメトキシシラン、ジメチルジメトキシシラン、フェニルトリメトキシシラン、メチルトリエトキシシラン、ジメチルジエトキシシラン、フェニルトリエトキシシラン、n−プロピルトリメトキシシラン、n−プロピルトリエトキシシラン、ヘキシルトリメトキシシラン、ヘキシルトリエトキシシラン、オクチルトリエトキシシラン、デシルトリメトキシシラン、1,6−ビス(トリメトキシシリル)ヘキサン、トリフルオロプロピルトリメトキシシラン等の非シランカップリング−アルコキシシラン化合物等が挙げられる。また、表面処理剤は、1種単独で用いてもよく、2種以上を任意の比率で組み合わせて用いてもよい。 (E) The inorganic filler is preferably surface-treated with an appropriate surface treatment agent. By surface treatment, the moisture resistance and dispersibility of the (E) inorganic filler can be enhanced. Examples of the surface treatment agent include vinyl-based silane coupling agents such as vinyltrimethoxysilane and vinyltriethoxysilane; 2- (3,4-epyloxycyclohexyl) ethyltrimethoxysilane and 3-glycidoxypropylmethyldimethoxysilane. , 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane and other epoxy-based silane coupling agents; p-styryltrimethoxysilane and other styryl-based Silane coupling agents; methacrylic silane coupling agents such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane; Acrylic silane coupling agents such as 3-acryloxypropyltrimethoxysilane; N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane , 3-Aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N Amino-based silane coupling agents such as −phenyl-8-aminooctyltrimethoxysilane, N- (vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane; tris- (trimethoxysilylpropyl) isocyanurate, etc. Isocyanurate-based silane coupling agent; ureido-based silane coupling agent such as 3-ureidopropyltrialkoxysilane; mercapto-based silane coupling agent such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane. An isocyanate-based silane coupling agent such as 3-isopropylpropyltriethoxysilane; an acid anhydride-based silane coupling agent such as 3-trimethoxysilylpropylsuccinic anhydride; a silane coupling agent such as; methyltrimethoxysilane, Dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimeth Examples thereof include non-silane coupling-alkoxysilane compounds such as xysilane, hexyltriethoxysilane, octyltriethoxysilane, decyltrimethoxysilane, 1,6-bis (trimethoxysilyl) hexane, and trifluoropropyltrimethoxysilane. Further, the surface treatment agent may be used alone or in combination of two or more at any ratio.
表面処理剤の市販品としては、例えば、信越化学工業社製の「KBM−1003」、「KBE−1003」(ビニル系シランカップリング剤);「KBM−303」、「KBM−402」、「KBM−403」、「KBE−402」、「KBE−403」(エポキシ系シランカップリング剤);「KBM−1403」(スチリル系シランカップリング剤);「KBM−502」、「KBM−503」、「KBE−502」、「KBE−503」(メタクリル系シランカップリング剤);「KBM−5103」(アクリル系シランカップリング剤);「KBM−602」、「KBM−603」、「KBM−903」、「KBE−903」、「KBE−9103P」、「KBM−573」、「KBM−575」(アミノ系シランカップリング剤);「KBM−9659」(イソシアヌレート系シランカップリング剤);「KBE−585」(ウレイド系シランカップリング剤);「KBM−802」、「KBM−803」(メルカプト系シランカップリング剤);「KBE−9007N」(イソシアネート系シランカップリング剤);「X−12−967C」(酸無水物系シランカップリング剤);「KBM−13」、「KBM−22」、「KBM−103」、「KBE−13」、「KBE−22」、「KBE−103」、「KBM−3033」、「KBE−3033」、「KBM−3063」、「KBE−3063」、「KBE−3083」、「KBM−3103C」、「KBM−3066」、「KBM−7103」(非シランカップリング−アルコキシシラン化合物)等が挙げられる。 Examples of commercially available surface treatment agents include "KBM-1003" and "KBE-1003" (vinyl-based silane coupling agents) manufactured by Shin-Etsu Chemical Industry Co., Ltd .; "KBM-303", "KBM-402", and "KBM-402". KBM-403 "," KBE-402 "," KBE-403 "(epoxy-based silane coupling agent);" KBM-1403 "(styryl-based silane coupling agent);" KBM-502 "," KBM-503 " , "KBE-502", "KBE-503" (methacrylic silane coupling agent); "KBM-5103" (acrylic silane coupling agent); "KBM-602", "KBM-603", "KBM-" 903 ”,“ KBE-903 ”,“ KBE-9103P ”,“ KBM-573 ”,“ KBM-575 ”(amino silane coupling agent);“ KBM-9569 ”(isocyanurate-based silane coupling agent); "KBE-585" (ureido-based silane coupling agent); "KBM-802", "KBM-803" (mercapto-based silane coupling agent); "KBE-9007N" (isocyanate-based silane coupling agent); "X" -12-967C "(acid anhydride-based silane coupling agent);" KBM-13 "," KBM-22 "," KBM-103 "," KBE-13 "," KBE-22 "," KBE-103 " , "KBM-3033", "KBE-3033", "KBM-3063", "KBE-3063", "KBE-3083", "KBM-3103C", "KBM-3066", "KBM-7103" ( Non-silane coupling-alkoxysilane compound) and the like.
表面処理剤による表面処理の程度は、無機充填材の分散性向上の観点から、所定の範囲に収まることが好ましい。具体的には、無機充填材100質量%は、0.2質量%〜5質量%の表面処理剤で表面処理されていることが好ましく、0.2質量%〜3質量%で表面処理されていることがより好ましく、0.3質量%〜2質量%で表面処理されていることがさらに好ましい。 The degree of surface treatment with the surface treatment agent is preferably within a predetermined range from the viewpoint of improving the dispersibility of the inorganic filler. Specifically, 100% by mass of the inorganic filler is preferably surface-treated with 0.2% by mass to 5% by mass of a surface treatment agent, and is surface-treated with 0.2% by mass to 3% by mass. It is more preferable that the surface is treated with 0.3% by mass to 2% by mass.
表面処理剤による表面処理の程度は、無機充填材の単位表面積当たりのカーボン量によって評価することができる。無機充填材の単位表面積当たりのカーボン量は、無機充填材の分散性向上の観点から、0.02mg/m2以上が好ましく、0.1mg/m2以上がより好ましく、0.2mg/m2以上がさらに好ましい。一方、樹脂組成物の溶融粘度やシート形態での溶融粘度の上昇を防止する観点から、1.0mg/m2以下が好ましく、0.8mg/m2以下がより好ましく、0.5mg/m2以下がさらに好ましい。 The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic filler. Carbon content per unit surface area of the inorganic filler, from the viewpoint of improving dispersibility of the inorganic filler is preferably 0.02 mg / m 2 or more, 0.1 mg / m 2 or more preferably, 0.2 mg / m 2 The above is more preferable. On the other hand, from the viewpoint of preventing an increase in the melt viscosity at the melt viscosity or sheet form a resin composition, preferably from 1.0 mg / m 2 or less, more preferably 0.8 mg / m 2 or less, 0.5 mg / m 2 The following is more preferable.
(E)無機充填材の単位表面積当たりのカーボン量は、表面処理後の無機充填材を溶剤(例えば、メチルエチルケトン(MEK))により洗浄処理した後に測定することができる。具体的には、溶剤として十分な量のMEKを表面処理剤で表面処理された無機充填材に加えて、25℃で5分間超音波洗浄する。上澄液を除去し、固形分を乾燥させた後、カーボン分析計を用いて無機充填材の単位表面積当たりのカーボン量を測定することができる。カーボン分析計としては、堀場製作所社製「EMIA−320V」等を使用することができる。 (E) The amount of carbon per unit surface area of the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (for example, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with the surface treatment agent, and ultrasonic cleaning is performed at 25 ° C. for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, "EMIA-320V" manufactured by HORIBA, Ltd. or the like can be used.
樹脂組成物中の(E)無機充填材の含有量は、特に限定されるものではないが、樹脂組成物中の不揮発成分を100質量%とした場合、好ましくは90質量%以下、より好ましくは80質量%以下、さらに好ましくは75質量%以下、特に好ましくは70質量%以下であり得る。樹脂組成物中の(E)無機充填材の含有量の下限は、特に限定されるものではないが、樹脂組成物中の不揮発成分を100質量%とした場合、例えば0質量%以上、1質量%以上、5質量%以上、10質量%以上等であり得、好ましくは20質量%以上、より好ましくは25質量%以上、さらに好ましくは35質量%以上、特に好ましくは40質量%以上等であり得る。 The content of the (E) inorganic filler in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 90% by mass or less, more preferably 90% by mass or less. It can be 80% by mass or less, more preferably 75% by mass or less, and particularly preferably 70% by mass or less. The lower limit of the content of the (E) inorganic filler in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, for example, 0% by mass or more and 1% by mass. % Or more, 5% by mass or more, 10% by mass or more, preferably 20% by mass or more, more preferably 25% by mass or more, still more preferably 35% by mass or more, particularly preferably 40% by mass or more. obtain.
<(F)硬化促進剤>
本発明の樹脂組成物は、任意成分として(F)硬化促進剤を含む場合がある。一実施形態において、(F)硬化促進剤は、(A)成分と、(B)成分及び(C)成分(並びに(D)成分が含まれる場合は(D)成分)等との付加反応を促進する触媒としての機能を有し得る。
<(F) Curing accelerator>
The resin composition of the present invention may contain (F) a curing accelerator as an optional component. In one embodiment, the (F) curing accelerator undergoes an addition reaction between the component (A), the component (B) and the component (C) (and the component (D) if the component (D) is contained). It may have a function as a facilitating catalyst.
(F)硬化促進剤としては、例えば、(F−1)イミダゾール系硬化促進剤、(F−2)リン系硬化促進剤、(F−3)ウレア系硬化促進剤、(F−4)グアニジン系硬化促進剤、(F−5)金属系硬化促進剤、(F−6)アミン系硬化促進剤等が挙げられる。一実施形態において、(F)硬化促進剤は、(F−1)イミダゾール系硬化促進剤を含むことが好ましい。(F)硬化促進剤は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。 Examples of the (F) curing accelerator include (F-1) imidazole-based curing accelerator, (F-2) phosphorus-based curing accelerator, (F-3) urea-based curing accelerator, and (F-4) guanidine. Examples thereof include a system curing accelerator, (F-5) a metal-based curing accelerator, and (F-6) an amine-based curing accelerator. In one embodiment, the (F) curing accelerator preferably contains (F-1) an imidazole-based curing accelerator. (F) The curing accelerator may be used alone or in combination of two or more.
(F−1)イミダゾール系硬化促進剤としては、例えば、2−メチルイミダゾール、2−ウンデシルイミダゾール、2−ヘプタデシルイミダゾール、1,2−ジメチルイミダゾール、2−エチル−4−メチルイミダゾール、1,2−ジメチルイミダゾール、2−エチル−4−メチルイミダゾール、2−フェニルイミダゾール、2−フェニル−4−メチルイミダゾール、1−ベンジル−2−メチルイミダゾール、1−ベンジル−2−フェニルイミダゾール、1−シアノエチル−2−メチルイミダゾール、1−シアノエチル−2−ウンデシルイミダゾール、1−シアノエチル−2−エチル−4−メチルイミダゾール、1−シアノエチル−2−フェニルイミダゾール、1−シアノエチル−2−ウンデシルイミダゾリウムトリメリテイト、1−シアノエチル−2−フェニルイミダゾリウムトリメリテイト、2,4−ジアミノ−6−[2’−メチルイミダゾリル−(1’)]−エチル−s−トリアジン、2,4−ジアミノ−6−[2’−ウンデシルイミダゾリル−(1’)]−エチル−s−トリアジン、2,4−ジアミノ−6−[2’−エチル−4’−メチルイミダゾリル−(1’)]−エチル−s−トリアジン、2,4−ジアミノ−6−[2’−メチルイミダゾリル−(1’)]−エチル−s−トリアジンイソシアヌル酸付加物、2−フェニルイミダゾールイソシアヌル酸付加物、2−フェニル−4,5−ジヒドロキシメチルイミダゾール、2−フェニル−4−メチル−5−ヒドロキシメチルイミダゾール、2,3−ジヒドロ−1H−ピロロ[1,2−a]ベンズイミダゾール、1−ドデシル−2−メチル−3−ベンジルイミダゾリウムクロライド、2−メチルイミダゾリン、2−フェニルイミダゾリン等のイミダゾール化合物及びイミダゾール化合物とエポキシ樹脂とのアダクト体が挙げられる。 Examples of the (F-1) imidazole-based curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1, 2-Dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl- 2-Methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate , 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [ 2'-Undecylimidazolyl- (1')] -ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-s-triazine , 2,4-Diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxy Methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride , 2-Methylimidazoline, 2-phenylimidazoline and other imidazole compounds, and imidazole compounds and epoxy resins are adducts.
(F−1)イミダゾール系硬化促進剤としては、市販品を用いてもよく、例えば、四国化成工業社製の「1B2PZ」、「2MZA−PW」、「2PHZ−PW」、三菱ケミカル社製の「P200−H50」等が挙げられる。 (F-1) As the imidazole-based curing accelerator, a commercially available product may be used, for example, "1B2PZ", "2MZA-PW", "2PHZ-PW" manufactured by Shikoku Chemicals Corporation, and manufactured by Mitsubishi Chemical Corporation. Examples thereof include "P200-H50".
(F−2)リン系硬化促進剤としては、例えば、テトラブチルホスホニウムブロマイド、テトラブチルホスホニウムクロライド、テトラブチルホスホニウムアセテート、テトラブチルホスホニウムデカノエート、テトラブチルホスホニウムラウレート、ビス(テトラブチルホスホニウム)ピロメリテート、テトラブチルホスホニウムハイドロジェンヘキサヒドロフタレート、テトラブチルホスホニウム2,6−ビス[(2−ヒドロキシ−5−メチルフェニル)メチル]−4−メチルフェノラート、ジ−tert−ブチルメチルホスホニウムテトラフェニルボレート等の脂肪族ホスホニウム塩;メチルトリフェニルホスホニウムブロマイド、エチルトリフェニルホスホニウムブロマイド、プロピルトリフェニルホスホニウムブロマイド、ブチルトリフェニルホスホニウムブロマイド、ベンジルトリフェニルホスホニウムクロライド、テトラフェニルホスホニウムブロマイド、p−トリルトリフェニルホスホニウムテトラ−p−トリルボレート、テトラフェニルホスホニウムテトラフェニルボレート、テトラフェニルホスホニウムテトラp−トリルボレート、トリフェニルエチルホスホニウムテトラフェニルボレート、トリス(3−メチルフェニル)エチルホスホニウムテトラフェニルボレート、トリス(2−メトキシフェニル)エチルホスホニウムテトラフェニルボレート、(4−メチルフェニル)トリフェニルホスホニウムチオシアネート、テトラフェニルホスホニウムチオシアネート、ブチルトリフェニルホスホニウムチオシアネート等の芳香族ホスホニウム塩;トリフェニルホスフィン・トリフェニルボラン等の芳香族ホスフィン・ボラン複合体;トリフェニルホスフィン・p−ベンゾキノン付加反応物等の芳香族ホスフィン・キノン付加反応物;トリブチルホスフィン、トリ−tert−ブチルホスフィン、トリオクチルホスフィン、ジ−tert−ブチル(2−ブテニル)ホスフィン、ジ−tert−ブチル(3−メチル−2−ブテニル)ホスフィン、トリシクロヘキシルホスフィン等の脂肪族ホスフィン;ジブチルフェニルホスフィン、ジ−tert−ブチルフェニルホスフィン、メチルジフェニルホスフィン、エチルジフェニルホスフィン、ブチルジフェニルホスフィン、ジフェニルシクロヘキシルホスフィン、トリフェニルホスフィン、トリ−o−トリルホスフィン、トリ−m−トリルホスフィン、トリ−p−トリルホスフィン、トリス(4−エチルフェニル)ホスフィン、トリス(4−プロピルフェニル)ホスフィン、トリス(4−イソプロピルフェニル)ホスフィン、トリス(4−ブチルフェニル)ホスフィン、トリス(4−tert−ブチルフェニル)ホスフィン、トリス(2,4−ジメチルフェニル)ホスフィン、トリス(2,5−ジメチルフェニル)ホスフィン、トリス(2,6−ジメチルフェニル)ホスフィン、トリス(3,5−ジメチルフェニル)ホスフィン、トリス(2,4,6−トリメチルフェニル)ホスフィン、トリス(2,6−ジメチル−4−エトキシフェニル)ホスフィン、トリス(2−メトキシフェニル)ホスフィン、トリス(4−メトキシフェニル)ホスフィン、トリス(4−エトキシフェニル)ホスフィン、トリス(4−tert−ブトキシフェニル)ホスフィン、ジフェニル−2−ピリジルホスフィン、1,2−ビス(ジフェニルホスフィノ)エタン、1,3−ビス(ジフェニルホスフィノ)プロパン、1,4−ビス(ジフェニルホスフィノ)ブタン、1,2−ビス(ジフェニルホスフィノ)アセチレン、2,2’−ビス(ジフェニルホスフィノ)ジフェニルエーテル等の芳香族ホスフィン等が挙げられる。 Examples of the (F-2) phosphorus-based curing accelerator include tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, and bis (tetrabutylphosphonium) pyromeritate. , Triphenylphosphinehydrogen hexahydrophthalate, tetrabutylphosphonium 2,6-bis [(2-hydroxy-5-methylphenyl) methyl] -4-methylphenorate, di-tert-butylmethylphosphonium tetraphenylborate, etc. Aliphatic phosphonium salts; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-triltriphenylphosphonium tetra-p- Triphenylphosphine, tetraphenylphosphonium tetraphenylphosphine, tetraphenylphosphonium tetrap-trilborate, triphenylethylphosphonium tetraphenylborate, tris (3-methylphenyl) ethylphosphonium tetraphenylborate, tris (2-methoxyphenyl) ethylphosphonium tetra Arophenylphosphine salts such as phenylphosphine, (4-methylphenyl) triphenylphosphonium thiocineate, tetraphenylphosphine thiosianate, butyltriphenylphosphonium thiosianate; aromatic phosphine-boran complex such as triphenylphosphine / triphenylborane; triphenyl Arophenylphosphine-quinone addition reactants such as phosphine-p-benzosphine addition reactants; tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl (2-butenyl) phosphine, di-tert-butyl (3-Methyl-2-butenyl) aliphatic phosphine such as phosphine, tricyclophenylphosphine; dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexinephosphine, triphenyl Tri-o-triphenylphosphine, tri-m-trilphosphine, tri-p -Trill phosphine, tris (4-ethylphenyl) phosphine, tris (4-propylphenyl) phosphine, tris (4-isopropylphenyl) phosphine, tris (4-butylphenyl) phosphine, tris (4-tert-butylphenyl) phosphine , Tris (2,4-dimethylphenyl) phosphine, Tris (2,5-dimethylphenyl) phosphine, Tris (2,6-dimethylphenyl) phosphine, Tris (3,5-dimethylphenyl) phosphine, Tris (2,4) , 6-trimethylphenyl) phosphine, tris (2,6-dimethyl-4-ethoxyphenyl) phosphine, tris (2-methoxyphenyl) phosphine, tris (4-methoxyphenyl) phosphine, tris (4-ethoxyphenyl) phosphine, Tris (4-tert-butoxyphenyl) phosphine, diphenyl-2-pyridylphosphine, 1,2-bis (diphenylphosphine) ethane, 1,3-bis (diphenylphosphine) propane, 1,4-bis (diphenylphosphine) Examples thereof include aromatic phosphines such as fino) butane, 1,2-bis (diphenylphosphino) acetylene, and 2,2'-bis (diphenylphosphino) diphenyl ether.
(F−3)ウレア系硬化促進剤としては、例えば、1,1−ジメチル尿素;1,1,3−トリメチル尿素、3−エチル−1,1−ジメチル尿素、3−シクロヘキシル−1,1−ジメチル尿素、3−シクロオクチル−1,1−ジメチル尿素等の脂肪族ジメチルウレア;3−フェニル−1,1−ジメチル尿素、3−(4−クロロフェニル)−1,1−ジメチル尿素、3−(3,4−ジクロロフェニル)−1,1−ジメチル尿素、3−(3−クロロ−4−メチルフェニル)−1,1−ジメチル尿素、3−(2−メチルフェニル)−1,1−ジメチル尿素、3−(4−メチルフェニル)−1,1−ジメチル尿素、3−(3,4−ジメチルフェニル)−1,1−ジメチル尿素、3−(4−イソプロピルフェニル)−1,1−ジメチル尿素、3−(4−メトキシフェニル)−1,1−ジメチル尿素、3−(4−ニトロフェニル)−1,1−ジメチル尿素、3−[4−(4−メトキシフェノキシ)フェニル]−1,1−ジメチル尿素、3−[4−(4−クロロフェノキシ)フェニル]−1,1−ジメチル尿素、3−[3−(トリフルオロメチル)フェニル]−1,1−ジメチル尿素、N,N−(1,4−フェニレン)ビス(N’,N’−ジメチル尿素)、N,N−(4−メチル−1,3−フェニレン)ビス(N’,N’−ジメチル尿素)〔トルエンビスジメチルウレア〕等の芳香族ジメチルウレア等が挙げられる。 (F-3) Examples of the urea-based curing accelerator include 1,1-dimethylurea; 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-. Alibo dimethylurea such as dimethylurea, 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3- (4-chlorophenyl) -1,1-dimethylurea, 3-( 3,4-Dichlorophenyl) -1,1-dimethylurea, 3- (3-chloro-4-methylphenyl) -1,1-dimethylurea, 3- (2-methylphenyl) -1,1-dimethylurea, 3- (4-Methylphenyl) -1,1-dimethylurea, 3- (3,4-dimethylphenyl) -1,1-dimethylurea, 3- (4-isopropylphenyl) -1,1-dimethylurea, 3- (4-methoxyphenyl) -1,1-dimethylurea, 3- (4-nitrophenyl) -1,1-dimethylurea, 3- [4- (4-methoxyphenoxy) phenyl] -1,1- Dimethylurea, 3- [4- (4-chlorophenoxy) phenyl] -1,1-dimethylurea, 3- [3- (trifluoromethyl) phenyl] -1,1-dimethylurea, N, N- (1) , 4-Phenylene) bis (N', N'-dimethylurea), N, N- (4-methyl-1,3-phenylene) bis (N', N'-dimethylurea) [toluenebis dimethylurea], etc. Fragrant dimethylurea and the like.
(F−4)グアニジン系硬化促進剤としては、例えば、ジシアンジアミド、1−メチルグアニジン、1−エチルグアニジン、1−シクロヘキシルグアニジン、1−フェニルグアニジン、1−(o−トリル)グアニジン、ジメチルグアニジン、ジフェニルグアニジン、トリメチルグアニジン、テトラメチルグアニジン、ペンタメチルグアニジン、1,5,7−トリアザビシクロ[4.4.0]デカ−5−エン、7−メチル−1,5,7−トリアザビシクロ[4.4.0]デカ−5−エン、1−メチルビグアニド、1−エチルビグアニド、1−n−ブチルビグアニド、1−n−オクタデシルビグアニド、1,1−ジメチルビグアニド、1,1−ジエチルビグアニド、1−シクロヘキシルビグアニド、1−アリルビグアニド、1−フェニルビグアニド、1−(o−トリル)ビグアニド等が挙げられる。 Examples of the (F-4) guanidine-based curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1- (o-tolyl) guanidine, dimethylguanidine, and diphenyl. Guanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo [4.4.0] deca-5-ene, 7-methyl-1,5,7-triazabicyclo [4] 4.0] Deca-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1 -Cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, 1- (o-tolyl) biguanide and the like can be mentioned.
(F−5)金属系硬化促進剤としては、例えば、コバルト、銅、亜鉛、鉄、ニッケル、マンガン、スズ等の金属の、有機金属錯体又は有機金属塩が挙げられる。有機金属錯体の具体例としては、コバルト(II)アセチルアセトナート、コバルト(III)アセチルアセトナート等の有機コバルト錯体、銅(II)アセチルアセトナート等の有機銅錯体、亜鉛(II)アセチルアセトナート等の有機亜鉛錯体、鉄(III)アセチルアセトナート等の有機鉄錯体、ニッケル(II)アセチルアセトナート等の有機ニッケル錯体、マンガン(II)アセチルアセトナート等の有機マンガン錯体等が挙げられる。有機金属塩としては、例えば、オクチル酸亜鉛、オクチル酸錫、ナフテン酸亜鉛、ナフテン酸コバルト、ステアリン酸スズ、ステアリン酸亜鉛等が挙げられる。 Examples of the (F-5) metal-based curing accelerator include organic metal complexes or organic metal salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of the organic metal complex include an organic cobalt complex such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate, an organic copper complex such as copper (II) acetylacetonate, and zinc (II) acetylacetonate. Examples thereof include organic zinc complexes such as iron (III) acetylacetonate, organic nickel complexes such as nickel (II) acetylacetonate, and organic manganese complexes such as manganese (II) acetylacetonate. Examples of the organic metal salt include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate and the like.
(F−6)アミン系硬化促進剤としては、例えば、トリエチルアミン、トリブチルアミン等のトリアルキルアミン、4−ジメチルアミノピリジン、ベンジルジメチルアミン、2,4,6,−トリス(ジメチルアミノメチル)フェノール、1,8−ジアザビシクロ(5,4,0)−ウンデセン等が挙げられる。 Examples of the (F-6) amine-based curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6, -tris (dimethylaminomethyl) phenol, and the like. 1,8-diazabicyclo (5,4,0) -undecene and the like can be mentioned.
(F−6)アミン系硬化促進剤としては、市販品を用いてもよく、例えば、味の素ファインテクノ社製の「MY−25」等が挙げられる。 As the (F-6) amine-based curing accelerator, a commercially available product may be used, and examples thereof include “MY-25” manufactured by Ajinomoto Fine-Techno Co., Ltd.
樹脂組成物中の(F)硬化促進剤の含有量は、特に限定されるものではないが、樹脂組成物中の不揮発成分を100質量%とした場合、好ましくは10質量%以下、より好ましくは5質量%以下、さらに好ましくは3質量%以下、特に好ましくは1質量%以下である。樹脂組成物中の(F)硬化促進剤の含有量の下限は、特に限定されるものではないが、樹脂組成物中の不揮発成分を100質量%とした場合、例えば、0質量%以上、0.001質量%以上、0.01質量%以上、0.1質量%以上、0.5質量%以上等であり得る。 The content of the (F) curing accelerator in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 10% by mass or less, more preferably. It is 5% by mass or less, more preferably 3% by mass or less, and particularly preferably 1% by mass or less. The lower limit of the content of the (F) curing accelerator in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, for example, 0% by mass or more, 0. It can be 001% by mass or more, 0.01% by mass or more, 0.1% by mass or more, 0.5% by mass or more, and the like.
<(G)その他の添加剤>
本発明の樹脂組成物は、不揮発成分として、さらに任意の添加剤を含んでいてもよい。このような添加剤としては、例えば、フェノール系硬化剤、チオール系硬化剤等の(A)成分以外の硬化剤;エポキシ樹脂、エポキシアクリレート樹脂、ウレタンアクリレート樹脂、ウレタン樹脂、シアネート樹脂、ベンゾオキサジン樹脂、不飽和ポリエステル樹脂、フェノール樹脂、メラミン樹脂、シリコーン樹脂、フェノキシ樹脂等の熱硬化性樹脂;過酸化物系ラジカル重合開始剤、アゾ系ラジカル重合開始剤等のラジカル重合開始剤;ポリビニルアセタール樹脂、ポリオレフィン樹脂、ポリスルホン樹脂、ポリエーテルスルホン樹脂、ポリフェニレンエーテル樹脂、ポリカーボネート樹脂、ポリエーテルエーテルケトン樹脂、ポリエステル樹脂等の熱可塑性樹脂;ゴム粒子等の有機充填材;有機銅化合物、有機亜鉛化合物、有機コバルト化合物等の有機金属化合物;フタロシアニンブルー、フタロシアニングリーン、アイオディングリーン、ジアゾイエロー、クリスタルバイオレット、酸化チタン、カーボンブラック等の着色剤;ハイドロキノン、カテコール、ピロガロール、フェノチアジン等の重合禁止剤;シリコーン系レベリング剤、アクリルポリマー系レベリング剤等のレベリング剤;ベントン、モンモリロナイト等の増粘剤;シリコーン系消泡剤、アクリル系消泡剤、フッ素系消泡剤、ビニル樹脂系消泡剤等の消泡剤;ベンゾトリアゾール系紫外線吸収剤等の紫外線吸収剤;尿素シラン等の接着性向上剤;トリアゾール系密着性付与剤、テトラゾール系密着性付与剤、トリアジン系密着性付与剤等の密着性付与剤;ヒンダードフェノール系酸化防止剤、ヒンダードアミン系酸化防止剤等の酸化防止剤;スチルベン誘導体等の蛍光増白剤;フッ素系界面活性剤、シリコーン系界面活性剤等の界面活性剤;リン系難燃剤(例えばリン酸エステル化合物、ホスファゼン化合物、ホスフィン酸化合物、赤リン)、窒素系難燃剤(例えば硫酸メラミン)、ハロゲン系難燃剤、無機系難燃剤(例えば三酸化アンチモン)等の難燃剤;リン酸エステル系分散剤、ポリオキシアルキレン系分散剤、アセチレン系分散剤、シリコーン系分散剤、アニオン性分散剤、カチオン性分散剤等の分散剤;ボレート系安定剤、チタネート系安定剤、アルミネート系安定剤、ジルコネート系安定剤、イソシアネート系安定剤、カルボン酸系安定剤、カルボン酸無水物系安定剤等の安定剤等が挙げられる。(G)その他の添加剤は、1種を単独で用いてもよく、2種以上を任意の比率で組み合わせて用いてもよい。(G)その他の添加剤の含有量は当業者であれば適宜設定できる。
<(G) Other additives>
The resin composition of the present invention may further contain any additive as a non-volatile component. Examples of such an additive include a curing agent other than the component (A) such as a phenol-based curing agent and a thiol-based curing agent; an epoxy resin, an epoxy acrylate resin, a urethane acrylate resin, a urethane resin, a cyanate resin, and a benzoxazine resin. , Unsaturated polyester resin, phenol resin, melamine resin, silicone resin, phenoxy resin and other heat curable resins; peroxide-based radical polymerization initiators, azo-based radical polymerization initiators and other radical polymerization initiators; polyvinyl acetal resin, Thermoplastic resins such as polyolefin resins, polysulfone resins, polyether sulfone resins, polyphenylene ether resins, polycarbonate resins, polyether ether ketone resins, polyester resins; organic fillers such as rubber particles; organic copper compounds, organic zinc compounds, organic cobalt Organic metal compounds such as compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodin green, diazo yellow, crystal violet, titanium oxide, carbon black; polymerization retardants such as hydroquinone, catechol, pyrogallol, phenothiazine; silicone leveling agents , Leveling agents such as acrylic polymer leveling agents; thickeners such as Benton and montmorillonite; defoaming agents such as silicone defoaming agents, acrylic defoaming agents, fluorine defoaming agents, vinyl resin defoaming agents; Ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers; Adhesive improvers such as ureasilane; Adhesion-imparting agents such as triazole-based adhesion-imparting agents, tetrazole-based adhesion-imparting agents, and triazine-based adhesion-imparting agents; Antioxidants such as phenol-based antioxidants and hindered amine-based antioxidants; Fluorescent whitening agents such as stylben derivatives; Surface active agents such as fluorine-based surfactants and silicone-based surfactants; Phosphorus-based flame retardants (eg, phosphorus) Flame retardants such as acid ester compounds, phosphazene compounds, phosphinic acid compounds, red phosphorus), nitrogen-based flame retardants (eg melamine sulfate), halogen-based flame retardants, inorganic flame retardants (eg antimony trioxide); Dispersants such as agents, polyoxyalkylene dispersants, acetylene dispersants, silicone dispersants, anionic dispersants, cationic dispersants; borate stabilizers, titanate stabilizers, aluminate stabilizers, zirconates Examples thereof include stabilizers such as system stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic acid anhydride-based stabilizers. (G) As the other additives, one type may be used alone, or two or more types may be used in combination at any ratio. (G) The content of other additives can be appropriately set by those skilled in the art.
<(H)有機溶剤>
本発明の樹脂組成物は、上述した不揮発成分以外に、揮発性成分として、さらに任意の有機溶剤を含有する場合がある。(H)有機溶剤としては、公知のものを適宜用いることができ、その種類は特に限定されるものではない。(H)有機溶剤としては、例えば、アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノン等のケトン系溶剤;酢酸メチル、酢酸エチル、酢酸ブチル、酢酸イソブチル、酢酸イソアミル、プロピオン酸メチル、プロピオン酸エチル、γ-ブチロラクトン等のエステル系溶剤;テトラヒドロピラン、テトラヒドロフラン、1,4−ジオキサン、ジエチルエーテル、ジイソプロピルエーテル、ジブチルエーテル、ジフェニルエーテル等のエーテル系溶剤;メタノール、エタノール、プロパノール、ブタノール、エチレングリコール等のアルコール系溶剤;酢酸2−エトキシエチル、プロピレングリコールモノメチルエーテルアセテート、ジエチレングリコールモノエチルエーテルアセテート、エチルジグリコールアセテート、γ−ブチロラクトン、メトキシプロピオン酸メチル等のエーテルエステル系溶剤;乳酸メチル、乳酸エチル、2−ヒドロキシイソ酪酸メチル等のエステルアルコール系溶剤;2−メトキシプロパノール、2−メトキシエタノール、2−エトキシエタノール、プロピレングリコールモノメチルエーテル、ジエチレングリコールモノブチルエーテル(ブチルカルビトール)等のエーテルアルコール系溶剤;N,N−ジメチルホルムアミド、N,N−ジメチルアセトアミド、N−メチル−2−ピロリドン等のアミド系溶剤;ジメチルスルホキシド等のスルホキシド系溶剤;アセトニトリル、プロピオニトリル等のニトリル系溶剤;ヘキサン、シクロペンタン、シクロヘキサン、メチルシクロヘキサン等の脂肪族炭化水素系溶剤;ベンゼン、トルエン、キシレン、エチルベンゼン、トリメチルベンゼン等の芳香族炭化水素系溶剤等を挙げることができる。(H)有機溶剤は、1種単独で用いてもよく、2種以上を任意の比率で組み合わせて用いてもよい。
<(H) Organic solvent>
The resin composition of the present invention may further contain an arbitrary organic solvent as a volatile component in addition to the above-mentioned non-volatile component. As the (H) organic solvent, a known solvent can be appropriately used, and the type thereof is not particularly limited. (H) Examples of the organic solvent include ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone; methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate and γ-. Ester-based solvents such as butyrolactone; ether-based solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether and diphenyl ether; alcohol-based solvents such as methanol, ethanol, propanol, butanol and ethylene glycol; Ether ester solvents such as 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, methyl methoxypropionate; methyl lactate, ethyl lactate, methyl 2-hydroxyisobutyrate Ester alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, diethylene glycol monobutyl ether (butyl carbitol) and the like; ether alcohol solvents; N, N-dimethylformamide, N , N-dimethylacetamide, N-methyl-2-pyrrolidone and other amide solvents; dimethylsulfoxide and other sulfoxide solvents; acetonitrile, propionitrile and other nitrile solvents; hexane, cyclopentane, cyclohexane, methylcyclohexane and other fats Group hydrocarbon-based solvent; Examples thereof include aromatic hydrocarbon-based solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. (H) The organic solvent may be used alone or in combination of two or more at any ratio.
一実施形態において、(H)有機溶剤の含有量は、特に限定されるものではないが、樹脂組成物中の全成分を100質量%とした場合、例えば、60質量%以下、40質量%以下、30質量%以下、20質量%以下、15質量%以下、10質量%以下等であり得る。 In one embodiment, the content of the (H) organic solvent is not particularly limited, but when all the components in the resin composition are 100% by mass, for example, 60% by mass or less and 40% by mass or less. , 30% by mass or less, 20% by mass or less, 15% by mass or less, 10% by mass or less, and the like.
<樹脂組成物の製造方法>
本発明の樹脂組成物は、例えば、任意の調製容器に、(A)ビフェニル骨格を有するアミン化合物、(B)炭素原子数が7以上の脂肪鎖を有するマレイミド化合物、(C)炭素原子数が7以上の脂肪鎖を有さないマレイミド化合物、必要に応じて(D)任意のラジカル重合性化合物、必要に応じて(E)無機充填材、必要に応じて(F)硬化促進剤、必要に応じて(G)その他の添加剤、及び必要に応じて(H)有機溶剤を、任意の順で及び/又は一部若しくは全部同時に加えて混合することによって、製造することができる。また、各成分を加えて混合する過程で、温度を適宜設定することができ、一時的に又は終始にわたって、加熱及び/又は冷却してもよい。また、加えて混合する過程において又はその後に、樹脂組成物を、例えば、ミキサーなどの撹拌装置又は振盪装置を用いて撹拌又は振盪し、均一に分散させてもよい。また、撹拌又は振盪と同時に、真空下等の低圧条件下で脱泡を行ってもよい。
<Manufacturing method of resin composition>
The resin composition of the present invention has, for example, (A) an amine compound having a biphenyl skeleton, (B) a maleimide compound having a fat chain having 7 or more carbon atoms, and (C) a maleimide compound having 7 or more carbon atoms in an arbitrary preparation container. Maleimide compound having no fat chain of 7 or more, (D) any radically polymerizable compound as needed, (E) inorganic filler as needed, (F) curing accelerator as needed, as needed It can be produced by adding (G) other additives and, if necessary, (H) an organic solvent in any order and / or partially or all at the same time and mixing them. Further, in the process of adding and mixing each component, the temperature can be appropriately set, and heating and / or cooling may be performed temporarily or from beginning to end. Further, the resin composition may be uniformly dispersed by stirring or shaking using, for example, a stirring device such as a mixer or a shaking device in the process of adding and mixing, or thereafter. Further, at the same time as stirring or shaking, defoaming may be performed under low pressure conditions such as under vacuum.
<樹脂組成物の特性>
本発明の樹脂組成物は、(A)ビフェニル骨格を有するアミン化合物、(B)炭素原子数が7以上の脂肪鎖を有するマレイミド化合物、及び(C)炭素原子数が7以上の脂肪鎖を有さないマレイミド化合物を含む。このような樹脂組成物を用いることにより、比誘電率(Dk)及び誘電正接(Df)が低く、且つめっき導体層のピール強度に優れた硬化物を得ることができる。
<Characteristics of resin composition>
The resin composition of the present invention has (A) an amine compound having a biphenyl skeleton, (B) a maleimide compound having a fat chain having 7 or more carbon atoms, and (C) a fat chain having 7 or more carbon atoms. Contains maleimide compounds that do not. By using such a resin composition, it is possible to obtain a cured product having a low relative permittivity (Dk) and dielectric loss tangent (Df) and excellent peel strength of the plated conductor layer.
本発明の樹脂組成物の硬化物は、誘電正接(Df)が低いという特徴を有し得る。したがって、一実施形態において、下記試験例1のように5.8GHz、23℃で測定した場合の樹脂組成物の硬化物の誘電正接(Df)は、好ましくは0.020以下、0.010以下、より好ましくは0.008以下、0.007以下、さらに好ましくは0.006以下、0.005以下、特に好ましくは0.004以下、0.003以下となり得る。 The cured product of the resin composition of the present invention may have a feature of low dielectric loss tangent (Df). Therefore, in one embodiment, the dielectric loss tangent (Df) of the cured product of the resin composition when measured at 5.8 GHz and 23 ° C. as in Test Example 1 below is preferably 0.020 or less and 0.010 or less. , More preferably 0.008 or less, 0.007 or less, still more preferably 0.006 or less, 0.005 or less, and particularly preferably 0.004 or less, 0.003 or less.
本発明の樹脂組成物の硬化物は、比誘電率(Dk)が低いという特徴を有し得る。したがって、一実施形態において、下記試験例1のように5.8GHz、23℃で測定した場合の樹脂組成物の硬化物の比誘電率(Dk)は、好ましくは5.0以下、より好ましくは4.0以下、さらに好ましくは3.5以下、さらにより好ましくは3.0以下、特に好ましくは2.9以下となり得る。 The cured product of the resin composition of the present invention may have a feature of having a low relative permittivity (Dk). Therefore, in one embodiment, the relative permittivity (Dk) of the cured product of the resin composition when measured at 5.8 GHz and 23 ° C. as in Test Example 1 below is preferably 5.0 or less, more preferably. It can be 4.0 or less, more preferably 3.5 or less, even more preferably 3.0 or less, and particularly preferably 2.9 or less.
本発明の樹脂組成物の硬化物は、優れためっき導体層のピール強度を有し得る。したがって、一実施形態において、下記試験例2のように硬化物に銅めっき導体層の形成し、垂直方向に銅めっき導体層を引き剥がした時の荷重から算出される銅めっきピール強度が、好ましくは0.2kgf/cm以上、より好ましくは0.3kgf/cm以上、さらに好ましくは0.35kgf/cm以上、特に好ましくは0.4kgf/cm以上となり得る。上限については特に限定されるものではないが、例えば、10kgf/cm以下等とし得る。 The cured product of the resin composition of the present invention may have excellent peel strength of the plated conductor layer. Therefore, in one embodiment, the copper plating peel strength calculated from the load when the copper-plated conductor layer is formed on the cured product and the copper-plated conductor layer is peeled off in the vertical direction as in Test Example 2 below is preferable. Can be 0.2 kgf / cm or more, more preferably 0.3 kgf / cm or more, still more preferably 0.35 kgf / cm or more, and particularly preferably 0.4 kgf / cm or more. The upper limit is not particularly limited, but may be, for example, 10 kgf / cm or less.
一実施形態において、本発明の樹脂組成物の硬化物は、粗化処理後の表面の算術平均粗さ(Ra)が低いという特徴を有し得る。したがって、一実施形態において、下記試験例2のように測定される粗化処理後の硬化物表面の算術平均粗さ(Ra)が、好ましくは300nm以下、より好ましくは200nm以下、さらに好ましくは150nm以下、さらにより好ましくは120nm以下、特に好ましくは100nm以下となり得る。下限については特に限定されるものではなく、例えば、1nm以上、2nm以上等とし得る。 In one embodiment, the cured product of the resin composition of the present invention may have a feature that the arithmetic average roughness (Ra) of the surface after the roughening treatment is low. Therefore, in one embodiment, the arithmetic average roughness (Ra) of the surface of the cured product after the roughening treatment measured as in Test Example 2 below is preferably 300 nm or less, more preferably 200 nm or less, still more preferably 150 nm. Below, it may be even more preferably 120 nm or less, and particularly preferably 100 nm or less. The lower limit is not particularly limited and may be, for example, 1 nm or more and 2 nm or more.
<樹脂組成物の用途>
本発明の樹脂組成物は、絶縁用途の樹脂組成物、特に、絶縁層を形成するための樹脂組成物として好適に使用することができる。具体的には、絶縁層上に形成される導体層(再配線層を含む)を形成するための当該絶縁層を形成するための樹脂組成物(導体層を形成するための絶縁層形成用樹脂組成物)として好適に使用することができる。また、後述するプリント配線板において、プリント配線板の絶縁層を形成するための樹脂組成物(プリント配線板の絶縁層形成用樹脂組成物)として好適に使用することができる。本発明の樹脂組成物はまた、樹脂シート、プリプレグ等のシート状積層材料、ソルダーレジスト、アンダーフィル材、ダイボンディング材、半導体封止材、穴埋め樹脂、部品埋め込み樹脂等、樹脂組成物が必要とされる用途で広範囲に使用できる。
<Use of resin composition>
The resin composition of the present invention can be suitably used as a resin composition for insulating use, particularly as a resin composition for forming an insulating layer. Specifically, a resin composition for forming the insulating layer for forming the conductor layer (including the rewiring layer) formed on the insulating layer (resin for forming the insulating layer for forming the conductor layer). It can be suitably used as a composition). Further, in a printed wiring board described later, it can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for forming an insulating layer of a printed wiring board). The resin composition of the present invention also requires a resin composition such as a resin sheet, a sheet-like laminated material such as a prepreg, a solder resist, an underfill material, a die bonding material, a semiconductor encapsulant, a hole filling resin, and a component embedding resin. Can be used in a wide range of applications.
また、例えば、以下の(1)〜(6)工程を経て半導体チップパッケージが製造される場合、本発明の樹脂組成物は、再配線層を形成するための絶縁層としての再配線形成層用の樹脂組成物(再配線形成層形成用の樹脂組成物)、及び半導体チップを封止するための樹脂組成物(半導体チップ封止用の樹脂組成物)としても好適に使用することができる。半導体チップパッケージが製造される際、封止層上に更に再配線層を形成してもよい。
(1)基材に仮固定フィルムを積層する工程、
(2)半導体チップを、仮固定フィルム上に仮固定する工程、
(3)半導体チップ上に封止層を形成する工程、
(4)基材及び仮固定フィルムを半導体チップから剥離する工程、
(5)半導体チップの基材及び仮固定フィルムを剥離した面に、絶縁層としての再配線形成層を形成する工程、及び
(6)再配線形成層上に、導体層としての再配線層を形成する工程
Further, for example, when the semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition of the present invention is for a rewiring forming layer as an insulating layer for forming the rewiring layer. Can also be suitably used as a resin composition (resin composition for forming a rewiring forming layer) and a resin composition for encapsulating a semiconductor chip (resin composition for encapsulating a semiconductor chip). When the semiconductor chip package is manufactured, a rewiring layer may be further formed on the sealing layer.
(1) Step of laminating a temporary fixing film on a base material,
(2) A process of temporarily fixing a semiconductor chip on a temporary fixing film,
(3) Step of forming a sealing layer on a semiconductor chip,
(4) Step of peeling the base material and the temporary fixing film from the semiconductor chip,
(5) A step of forming a rewiring forming layer as an insulating layer on the surface from which the base material and the temporary fixing film of the semiconductor chip are peeled off, and (6) a rewiring layer as a conductor layer is formed on the rewiring forming layer. Forming process
また、本発明の樹脂組成物は、部品埋め込み性に良好な絶縁層をもたらすことから、プリント配線板が部品内蔵回路板である場合にも好適に使用することができる。 Further, since the resin composition of the present invention provides an insulating layer having good component embedding property, it can be suitably used even when the printed wiring board is a component built-in circuit board.
<シート状積層材料>
本発明の樹脂組成物は、ワニス状態で塗布して使用することもできるが、工業的には一般に、該樹脂組成物を含有するシート状積層材料の形態で用いることが好適である。
<Sheet-like laminated material>
The resin composition of the present invention can be applied and used in a varnished state, but industrially, it is generally preferable to use the resin composition in the form of a sheet-like laminated material containing the resin composition.
シート状積層材料としては、以下に示す樹脂シート、プリプレグが好ましい。 As the sheet-shaped laminated material, the following resin sheets and prepregs are preferable.
一実施形態において、樹脂シートは、支持体と、該支持体上に設けられた樹脂組成物層とを含んでなり、樹脂組成物層は本発明の樹脂組成物から形成される。 In one embodiment, the resin sheet comprises a support and a resin composition layer provided on the support, and the resin composition layer is formed from the resin composition of the present invention.
樹脂組成物層の厚さは、プリント配線板の薄型化、及び当該樹脂組成物の硬化物が薄膜であっても絶縁性に優れた硬化物を提供できるという観点から、好ましくは50μm以下、より好ましくは40μm以下である。樹脂組成物層の厚さの下限は、特に限定されないが、通常、5μm以上、10μm以上等とし得る。 The thickness of the resin composition layer is preferably 50 μm or less from the viewpoint of reducing the thickness of the printed wiring board and providing a cured product having excellent insulating properties even if the cured product of the resin composition is a thin film. It is preferably 40 μm or less. The lower limit of the thickness of the resin composition layer is not particularly limited, but may be usually 5 μm or more, 10 μm or more, or the like.
支持体としては、例えば、プラスチック材料からなるフィルム、金属箔、離型紙が挙げられ、プラスチック材料からなるフィルム、金属箔が好ましい。 Examples of the support include a film made of a plastic material, a metal foil, and a release paper, and a film made of a plastic material and a metal foil are preferable.
支持体としてプラスチック材料からなるフィルムを使用する場合、プラスチック材料としては、例えば、ポリエチレンテレフタレート(以下「PET」と略称することがある。)、ポリエチレンナフタレート(以下「PEN」と略称することがある。)等のポリエステル、ポリカーボネート(以下「PC」と略称することがある。)、ポリメチルメタクリレート(PMMA)等のアクリル、環状ポリオレフィン、トリアセチルセルロース(TAC)、ポリエーテルサルファイド(PES)、ポリエーテルケトン、ポリイミド等が挙げられる。中でも、ポリエチレンテレフタレート、ポリエチレンナフタレートが好ましく、安価なポリエチレンテレフタレートが特に好ましい。 When a film made of a plastic material is used as a support, the plastic material may be, for example, polyethylene terephthalate (hereinafter abbreviated as "PET") or polyethylene naphthalate (hereinafter abbreviated as "PEN"). ) And other polyesters, polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylics such as polymethylmethacrylate (PMMA), cyclic polyolefins, triacetylcellulose (TAC), polyethersulfide (PES), polyethers. Examples thereof include ketones and polyimides. Of these, polyethylene terephthalate and polyethylene naphthalate are preferable, and inexpensive polyethylene terephthalate is particularly preferable.
支持体として金属箔を使用する場合、金属箔としては、例えば、銅箔、アルミニウム箔等が挙げられ、銅箔が好ましい。銅箔としては、銅の単金属からなる箔を用いてもよく、銅と他の金属(例えば、スズ、クロム、銀、マグネシウム、ニッケル、ジルコニウム、ケイ素、チタン等)との合金からなる箔を用いてもよい。 When a metal foil is used as the support, examples of the metal foil include copper foil, aluminum foil, and the like, and copper foil is preferable. As the copper foil, a foil made of a single metal of copper may be used, and a foil made of an alloy of copper and another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used. You may use it.
支持体は、樹脂組成物層と接合する面にマット処理、コロナ処理、帯電防止処理を施してあってもよい。 The support may be matted, corona-treated, or antistatic-treated on the surface to be joined to the resin composition layer.
また、支持体としては、樹脂組成物層と接合する面に離型層を有する離型層付き支持体を使用してもよい。離型層付き支持体の離型層に使用する離型剤としては、例えば、アルキド樹脂、ポリオレフィン樹脂、ウレタン樹脂、及びシリコーン樹脂からなる群から選択される1種以上の離型剤が挙げられる。離型層付き支持体は、市販品を用いてもよく、例えば、アルキド樹脂系離型剤を主成分とする離型層を有するPETフィルムである、リンテック社製の「SK−1」、「AL−5」、「AL−7」、東レ社製の「ルミラーT60」、帝人社製の「ピューレックス」、ユニチカ社製の「ユニピール」等が挙げられる。 Further, as the support, a support with a release layer having a release layer on the surface to be joined to the resin composition layer may be used. Examples of the release agent used for the release layer of the support with the release layer include one or more release agents selected from the group consisting of alkyd resin, polyolefin resin, urethane resin, and silicone resin. .. As the support with a release layer, a commercially available product may be used. For example, "SK-1" and "SK-1" manufactured by Lintec Corporation, which are PET films having a release layer containing an alkyd resin-based mold release agent as a main component. Examples include "AL-5", "AL-7", "Lumilar T60" manufactured by Toray Industries, "Purex" manufactured by Teijin Ltd., and "Unipee" manufactured by Unitika Ltd.
支持体の厚さは、特に限定されないが、5μm〜75μmの範囲が好ましく、10μm〜60μmの範囲がより好ましい。なお、離型層付き支持体を使用する場合、離型層付き支持体全体の厚さが上記範囲であることが好ましい。 The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. When a support with a release layer is used, the thickness of the entire support with a release layer is preferably in the above range.
一実施形態において、樹脂シートは、さらに必要に応じて、任意の層を含んでいてもよい。斯かる任意の層としては、例えば、樹脂組成物層の支持体と接合していない面(即ち、支持体とは反対側の面)に設けられた、支持体に準じた保護フィルム等が挙げられる。保護フィルムの厚さは、特に限定されるものではないが、例えば、1μm〜40μmである。保護フィルムを積層することにより、樹脂組成物層の表面へのゴミ等の付着やキズを抑制することができる。 In one embodiment, the resin sheet may further contain any layer, if desired. Examples of such an arbitrary layer include a protective film similar to the support provided on a surface of the resin composition layer that is not bonded to the support (that is, a surface opposite to the support). Be done. The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, it is possible to suppress the adhesion and scratches of dust and the like on the surface of the resin composition layer.
樹脂シートは、例えば、液状の樹脂組成物をそのまま、或いは有機溶剤に樹脂組成物を溶解した樹脂ワニスを調製し、これを、ダイコーター等を用いて支持体上に塗布し、更に乾燥させて樹脂組成物層を形成させることにより製造することができる。 For the resin sheet, for example, a resin varnish prepared by dissolving the resin composition as it is in a liquid resin composition or in an organic solvent is applied onto a support using a die coater or the like, and further dried. It can be produced by forming a resin composition layer.
有機溶剤としては、樹脂組成物の成分として説明した有機溶剤と同様のものが挙げられる。有機溶剤は1種単独で使用してもよく、2種以上を組み合わせて使用してもよい。 Examples of the organic solvent include the same organic solvents as those described as the components of the resin composition. The organic solvent may be used alone or in combination of two or more.
乾燥は、加熱、熱風吹きつけ等の公知の方法により実施してよい。乾燥条件は特に限定されないが、樹脂組成物層中の有機溶剤の含有量が10質量%以下、好ましくは5質量%以下となるように乾燥させる。樹脂組成物又は樹脂ワニス中の有機溶剤の沸点によっても異なるが、例えば30質量%〜60質量%の有機溶剤を含む樹脂組成物又は樹脂ワニスを用いる場合、50℃〜150℃で3分間〜10分間乾燥させることにより、樹脂組成物層を形成することができる。 Drying may be carried out by a known method such as heating or blowing hot air. The drying conditions are not particularly limited, but the resin composition layer is dried so that the content of the organic solvent is 10% by mass or less, preferably 5% by mass or less. Depending on the boiling point of the organic solvent in the resin composition or resin varnish, for example, when a resin composition or resin varnish containing 30% by mass to 60% by mass of an organic solvent is used, the temperature is 50 ° C. to 150 ° C. for 3 minutes to 10 minutes. The resin composition layer can be formed by drying for a minute.
樹脂シートは、ロール状に巻きとって保存することが可能である。樹脂シートが保護フィルムを有する場合、保護フィルムを剥がすことによって使用可能となる。 The resin sheet can be rolled up and stored. If the resin sheet has a protective film, it can be used by peeling off the protective film.
一実施形態において、プリプレグは、シート状繊維基材に本発明の樹脂組成物を含浸させて形成される。 In one embodiment, the prepreg is formed by impregnating a sheet-like fiber substrate with the resin composition of the present invention.
プリプレグに用いるシート状繊維基材は特に限定されず、ガラスクロス、アラミド不織布、液晶ポリマー不織布等のプリプレグ用基材として常用されているものを用いることができる。プリント配線板の薄型化の観点から、シート状繊維基材の厚さは、好ましくは50μm以下、より好ましくは40μm以下、さらに好ましくは30μm以下、特に好ましくは20μm以下である。シート状繊維基材の厚さの下限は特に限定されない。通常、10μm以上である。 The sheet-like fiber base material used for the prepreg is not particularly limited, and those commonly used as the base material for the prepreg such as glass cloth, aramid non-woven fabric, and liquid crystal polymer non-woven fabric can be used. From the viewpoint of reducing the thickness of the printed wiring board, the thickness of the sheet-shaped fiber base material is preferably 50 μm or less, more preferably 40 μm or less, still more preferably 30 μm or less, and particularly preferably 20 μm or less. The lower limit of the thickness of the sheet-shaped fiber base material is not particularly limited. Usually, it is 10 μm or more.
プリプレグは、ホットメルト法、ソルベント法等の公知の方法により製造することができる。 The prepreg can be produced by a known method such as a hot melt method or a solvent method.
プリプレグの厚さは、上述の樹脂シートにおける樹脂組成物層と同様の範囲とし得る。 The thickness of the prepreg may be in the same range as the resin composition layer in the above-mentioned resin sheet.
本発明のシート状積層材料は、プリント配線板の絶縁層を形成するため(プリント配線板の絶縁層用)に好適に使用することができ、プリント配線板の層間絶縁層を形成するため(プリント配線板の層間絶縁層用)により好適に使用することができる。 The sheet-shaped laminated material of the present invention can be suitably used for forming an insulating layer of a printed wiring board (for an insulating layer of a printed wiring board), and for forming an interlayer insulating layer of a printed wiring board (printed). It can be more preferably used for the interlayer insulating layer of the wiring board).
<プリント配線板>
本発明のプリント配線板は、本発明の樹脂組成物を硬化して得られる硬化物からなる絶縁層を含む。
<Printed wiring board>
The printed wiring board of the present invention includes an insulating layer made of a cured product obtained by curing the resin composition of the present invention.
プリント配線板は、例えば、上述の樹脂シートを用いて、下記(I)及び(II)の工程を含む方法により製造することができる。
(I)内層基板上に、樹脂シートを、樹脂シートの樹脂組成物層が内層基板と接合するように積層する工程
(II)樹脂組成物層を硬化(例えば熱硬化)して絶縁層を形成する工程
The printed wiring board can be manufactured, for example, by using the above-mentioned resin sheet by a method including the following steps (I) and (II).
(I) A step of laminating a resin sheet on an inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate (II) The resin composition layer is cured (for example, thermosetting) to form an insulating layer. Process to do
工程(I)で用いる「内層基板」とは、プリント配線板の基板となる部材であって、例えば、ガラスエポキシ基板、金属基板、ポリエステル基板、ポリイミド基板、BTレジン基板、熱硬化型ポリフェニレンエーテル基板等が挙げられる。また、該基板は、その片面又は両面に導体層を有していてもよく、この導体層はパターン加工されていてもよい。基板の片面または両面に導体層(回路)が形成された内層基板は「内層回路基板」ということがある。またプリント配線板を製造する際に、さらに絶縁層及び/又は導体層が形成されるべき中間製造物も本発明でいう「内層基板」に含まれる。プリント配線板が部品内蔵回路板である場合、部品を内蔵した内層基板を使用してもよい。 The "inner layer substrate" used in the step (I) is a member that becomes a substrate of a printed wiring board, and is, for example, a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate. And so on. Further, the substrate may have a conductor layer on one side or both sides thereof, and the conductor layer may be patterned. An inner layer board in which a conductor layer (circuit) is formed on one side or both sides of the board may be referred to as an "inner layer circuit board". Further, an intermediate product in which an insulating layer and / or a conductor layer should be further formed when the printed wiring board is manufactured is also included in the "inner layer substrate" in the present invention. When the printed wiring board is a circuit board with built-in components, an inner layer board containing built-in components may be used.
内層基板と樹脂シートの積層は、例えば、支持体側から樹脂シートを内層基板に加熱圧着することにより行うことができる。樹脂シートを内層基板に加熱圧着する部材(以下、「加熱圧着部材」ともいう。)としては、例えば、加熱された金属板(SUS鏡板等)又は金属ロール(SUSロール)等が挙げられる。なお、加熱圧着部材を樹脂シートに直接プレスするのではなく、内層基板の表面凹凸に樹脂シートが十分に追随するよう、耐熱ゴム等の弾性材を介してプレスするのが好ましい。 The inner layer substrate and the resin sheet can be laminated, for example, by heat-pressing the resin sheet to the inner layer substrate from the support side. Examples of the member for heat-pressing the resin sheet to the inner layer substrate (hereinafter, also referred to as “heat-bonding member”) include a heated metal plate (SUS end plate or the like) or a metal roll (SUS roll). It is preferable not to press the heat-bonded member directly onto the resin sheet, but to press it through an elastic material such as heat-resistant rubber so that the resin sheet sufficiently follows the surface irregularities of the inner layer substrate.
内層基板と樹脂シートの積層は、真空ラミネート法により実施してよい。真空ラミネート法において、加熱圧着温度は、好ましくは60℃〜160℃、より好ましくは80℃〜140℃の範囲であり、加熱圧着圧力は、好ましくは0.098MPa〜1.77MPa、より好ましくは0.29MPa〜1.47MPaの範囲であり、加熱圧着時間は、好ましくは20秒間〜400秒間、より好ましくは30秒間〜300秒間の範囲である。積層は、好ましくは圧力26.7hPa以下の減圧条件下で実施され得る。 The inner layer substrate and the resin sheet may be laminated by a vacuum laminating method. In the vacuum laminating method, the heat crimping temperature is preferably in the range of 60 ° C. to 160 ° C., more preferably 80 ° C. to 140 ° C., and the heat crimping pressure is preferably 0.098 MPa to 1.77 MPa, more preferably 0. It is in the range of .29 MPa to 1.47 MPa, and the heat crimping time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. Lamination can be carried out under reduced pressure conditions preferably with a pressure of 26.7 hPa or less.
積層は、市販の真空ラミネーターによって行うことができる。市販の真空ラミネーターとしては、例えば、名機製作所社製の真空加圧式ラミネーター、ニッコー・マテリアルズ社製のバキュームアップリケーター、バッチ式真空加圧ラミネーター等が挙げられる。 Lamination can be performed by a commercially available vacuum laminator. Examples of the commercially available vacuum laminator include a vacuum pressurizing laminator manufactured by Meiki Co., Ltd., a vacuum applicator manufactured by Nikko Materials, and a batch type vacuum pressurizing laminator.
積層の後に、常圧下(大気圧下)、例えば、加熱圧着部材を支持体側からプレスすることにより、積層された樹脂シートの平滑化処理を行ってもよい。平滑化処理のプレス条件は、上記積層の加熱圧着条件と同様の条件とすることができる。平滑化処理は、市販のラミネーターによって行うことができる。なお、積層と平滑化処理は、上記の市販の真空ラミネーターを用いて連続的に行ってもよい。 After laminating, the laminated resin sheet may be smoothed by pressing under normal pressure (under atmospheric pressure), for example, from the support side. The press conditions for the smoothing treatment can be the same as the heat-bonding conditions for the above-mentioned lamination. The smoothing process can be performed by a commercially available laminator. The laminating and smoothing treatment may be continuously performed using the above-mentioned commercially available vacuum laminator.
支持体は、工程(I)と工程(II)の間に除去してもよく、工程(II)の後に除去してもよい。 The support may be removed between steps (I) and step (II) or after step (II).
工程(II)において、樹脂組成物層を硬化(例えば熱硬化)して、樹脂組成物の硬化物からなる絶縁層を形成する。樹脂組成物層の硬化条件は特に限定されず、プリント配線板の絶縁層を形成するに際して通常採用される条件を使用してよい。 In step (II), the resin composition layer is cured (for example, thermosetting) to form an insulating layer made of a cured product of the resin composition. The curing conditions of the resin composition layer are not particularly limited, and the conditions usually adopted when forming the insulating layer of the printed wiring board may be used.
例えば、樹脂組成物層の熱硬化条件は、樹脂組成物の種類等によっても異なるが、一実施形態において、硬化温度は好ましくは120℃〜240℃、より好ましくは150℃〜220℃、さらに好ましくは170℃〜210℃である。硬化時間は好ましくは5分間〜120分間、より好ましくは10分間〜100分間、さらに好ましくは15分間〜100分間とすることができる。 For example, the thermosetting conditions of the resin composition layer differ depending on the type of the resin composition and the like, but in one embodiment, the curing temperature is preferably 120 ° C. to 240 ° C., more preferably 150 ° C. to 220 ° C., still more preferable. Is 170 ° C to 210 ° C. The curing time can be preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, still more preferably 15 minutes to 100 minutes.
樹脂組成物層を熱硬化させる前に、樹脂組成物層を硬化温度よりも低い温度にて予備加熱してもよい。例えば、樹脂組成物層を熱硬化させるのに先立ち、50℃〜120℃、好ましくは60℃〜115℃、より好ましくは70℃〜110℃の温度にて、樹脂組成物層を5分間以上、好ましくは5分間〜150分間、より好ましくは15分間〜120分間、さらに好ましくは15分間〜100分間予備加熱してもよい。 Before the resin composition layer is thermally cured, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermosetting the resin composition layer, the resin composition layer is heated at a temperature of 50 ° C. to 120 ° C., preferably 60 ° C. to 115 ° C., more preferably 70 ° C. to 110 ° C. for 5 minutes or more. Preheating may be preferably 5 to 150 minutes, more preferably 15 to 120 minutes, still more preferably 15 to 100 minutes.
プリント配線板を製造するに際しては、(III)絶縁層に穴あけする工程、(IV)絶縁層を粗化処理する工程、(V)導体層を形成する工程をさらに実施してもよい。これらの工程(III)乃至工程(V)は、プリント配線板の製造に用いられる、当業者に公知の各種方法に従って実施してよい。なお、支持体を工程(II)の後に除去する場合、該支持体の除去は、工程(II)と工程(III)との間、工程(III)と工程(IV)の間、又は工程(IV)と工程(V)との間に実施してよい。また、必要に応じて、工程(II)〜工程(V)の絶縁層及び導体層の形成を繰り返して実施し、多層配線板を形成してもよい。 In manufacturing the printed wiring board, (III) a step of drilling a hole in the insulating layer, (IV) a step of roughening the insulating layer, and (V) a step of forming a conductor layer may be further carried out. These steps (III) to (V) may be carried out according to various methods known to those skilled in the art used for manufacturing a printed wiring board. When the support is removed after the step (II), the support may be removed between the steps (II) and the step (III), between the steps (III) and the step (IV), or the step ( It may be carried out between IV) and step (V). Further, if necessary, the formation of the insulating layer and the conductor layer in steps (II) to (V) may be repeated to form a multilayer wiring board.
他の実施形態において、本発明のプリント配線板は、上述のプリプレグを用いて製造することができる。製造方法は基本的に樹脂シートを用いる場合と同様である。 In another embodiment, the printed wiring board of the present invention can be manufactured using the above-mentioned prepreg. The manufacturing method is basically the same as when a resin sheet is used.
工程(III)は、絶縁層に穴あけする工程であり、これにより絶縁層にビアホール、スルーホール等のホールを形成することができる。工程(III)は、絶縁層の形成に使用した樹脂組成物の組成等に応じて、例えば、ドリル、レーザー、プラズマ等を使用して実施してよい。ホールの寸法や形状は、プリント配線板のデザインに応じて適宜決定してよい。 The step (III) is a step of drilling holes in the insulating layer, whereby holes such as via holes and through holes can be formed in the insulating layer. The step (III) may be carried out by using, for example, a drill, a laser, a plasma, or the like, depending on the composition of the resin composition used for forming the insulating layer. The dimensions and shape of the holes may be appropriately determined according to the design of the printed wiring board.
工程(IV)は、絶縁層を粗化処理する工程である。通常、この工程(IV)において、スミアの除去も行われる。粗化処理の手順、条件は特に限定されず、プリント配線板の絶縁層を形成するに際して通常使用される公知の手順、条件を採用することができる。例えば、膨潤液による膨潤処理、酸化剤による粗化処理、中和液による中和処理をこの順に実施して絶縁層を粗化処理することができる。 Step (IV) is a step of roughening the insulating layer. Usually, in this step (IV), smear removal is also performed. The procedure and conditions for the roughening treatment are not particularly limited, and known procedures and conditions usually used for forming the insulating layer of the printed wiring board can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order.
粗化処理に用いる膨潤液としては特に限定されないが、アルカリ溶液、界面活性剤溶液等が挙げられ、好ましくはアルカリ溶液であり、該アルカリ溶液としては、水酸化ナトリウム溶液、水酸化カリウム溶液がより好ましい。市販されている膨潤液としては、例えば、アトテックジャパン社製の「スウェリング・ディップ・セキュリガンスP」、「スウェリング・ディップ・セキュリガンスSBU」等が挙げられる。膨潤液による膨潤処理は、特に限定されないが、例えば、30℃〜90℃の膨潤液に絶縁層を1分間〜20分間浸漬することにより行うことができる。絶縁層の樹脂の膨潤を適度なレベルに抑える観点から、40℃〜80℃の膨潤液に絶縁層を5分間〜15分間浸漬させることが好ましい。 The swelling solution used for the roughening treatment is not particularly limited, and examples thereof include an alkaline solution and a surfactant solution, preferably an alkaline solution, and the alkaline solution is more preferably a sodium hydroxide solution or a potassium hydroxide solution. preferable. Examples of commercially available swelling liquids include "Swelling Dip Security Guns P" and "Swelling Dip Security Guns SBU" manufactured by Atotech Japan. The swelling treatment with the swelling liquid is not particularly limited, but can be performed, for example, by immersing the insulating layer in the swelling liquid at 30 ° C. to 90 ° C. for 1 minute to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40 ° C to 80 ° C for 5 to 15 minutes.
粗化処理に用いる酸化剤としては、特に限定されないが、例えば、水酸化ナトリウムの水溶液に過マンガン酸カリウム又は過マンガン酸ナトリウムを溶解したアルカリ性過マンガン酸溶液が挙げられる。アルカリ性過マンガン酸溶液等の酸化剤による粗化処理は、60℃〜100℃に加熱した酸化剤溶液に絶縁層を10分間〜30分間浸漬させて行うことが好ましい。また、アルカリ性過マンガン酸溶液における過マンガン酸塩の濃度は5質量%〜10質量%が好ましい。市販されている酸化剤としては、例えば、アトテックジャパン社製の「コンセントレート・コンパクトCP」、「ドージングソリューション・セキュリガンスP」等のアルカリ性過マンガン酸溶液が挙げられる。 The oxidizing agent used for the roughening treatment is not particularly limited, and examples thereof include an alkaline permanganate solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment with an oxidizing agent such as an alkaline permanganate solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60 ° C. to 100 ° C. for 10 to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dozing Solution Security P" manufactured by Atotech Japan.
また、粗化処理に用いる中和液としては、酸性の水溶液が好ましく、市販品としては、例えば、アトテックジャパン社製の「リダクションソリューション・セキュリガントP」が挙げられる。 The neutralizing solution used for the roughening treatment is preferably an acidic aqueous solution, and examples of commercially available products include "Reduction Solution Security Gant P" manufactured by Atotech Japan.
中和液による処理は、酸化剤による粗化処理がなされた処理面を30℃〜80℃の中和液に5分間〜30分間浸漬させることにより行うことができる。作業性等の点から、酸化剤による粗化処理がなされた対象物を、40℃〜70℃の中和液に5分間〜20分間浸漬する方法が好ましい。 The treatment with the neutralizing solution can be performed by immersing the treated surface that has been roughened with the oxidizing agent in the neutralizing solution at 30 ° C. to 80 ° C. for 5 to 30 minutes. From the viewpoint of workability and the like, a method of immersing the object roughened with an oxidizing agent in a neutralizing solution at 40 ° C to 70 ° C for 5 to 20 minutes is preferable.
一実施形態において、粗化処理後の絶縁層表面の二乗平均平方根粗さ(Rq)は、好ましくは500nm以下、より好ましくは400nm以下、さらに好ましくは300nm以下である。下限については特に限定されるものではなく、例えば、1nm以上、2nm以上等とし得る。二乗平均平方根粗さ(Rq)は、非接触型表面粗さ計を用いて測定することができる。 In one embodiment, the root mean square roughness (Rq) of the surface of the insulating layer after the roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, still more preferably 300 nm or less. The lower limit is not particularly limited and may be, for example, 1 nm or more and 2 nm or more. The root mean square roughness (Rq) can be measured using a non-contact surface roughness meter.
工程(V)は、導体層を形成する工程であり、絶縁層上に導体層を形成する。導体層に使用する導体材料は特に限定されない。好適な実施形態では、導体層は、金、白金、パラジウム、銀、銅、アルミニウム、コバルト、クロム、亜鉛、ニッケル、チタン、タングステン、鉄、スズ及びインジウムからなる群から選択される1種以上の金属を含む。導体層は、単金属層であっても合金層であってもよく、合金層としては、例えば、上記の群から選択される2種以上の金属の合金(例えば、ニッケル・クロム合金、銅・ニッケル合金及び銅・チタン合金)から形成された層が挙げられる。中でも、導体層形成の汎用性、コスト、パターニングの容易性等の観点から、クロム、ニッケル、チタン、アルミニウム、亜鉛、金、パラジウム、銀若しくは銅の単金属層、又はニッケル・クロム合金、銅・ニッケル合金、銅・チタン合金の合金層が好ましく、クロム、ニッケル、チタン、アルミニウム、亜鉛、金、パラジウム、銀若しくは銅の単金属層、又はニッケル・クロム合金の合金層がより好ましく、銅の単金属層が更に好ましい。 The step (V) is a step of forming a conductor layer, and a conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer is one or more selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. Contains metal. The conductor layer may be a single metal layer or an alloy layer, and the alloy layer may be, for example, an alloy of two or more metals selected from the above group (for example, nickel-chromium alloy, copper, etc.). Examples include layers formed from nickel alloys and copper-titanium alloys). Among them, from the viewpoint of versatility, cost, ease of patterning, etc. for forming a conductor layer, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or a nickel-chromium alloy, copper, etc. Nickel alloys, copper-titanium alloy alloy layers are preferred, chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper single metal layers, or nickel-chromium alloy alloy layers are more preferred, copper singles. A metal layer is more preferred.
導体層は、単層構造であっても、異なる種類の金属若しくは合金からなる単金属層又は合金層が2層以上積層した複層構造であってもよい。導体層が複層構造である場合、絶縁層と接する層は、クロム、亜鉛若しくはチタンの単金属層、又はニッケル・クロム合金の合金層であることが好ましい。 The conductor layer may have a single-layer structure, a single metal layer made of different types of metals or alloys, or a multi-layer structure in which two or more alloy layers are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of nickel-chromium alloy.
導体層の厚さは、所望のプリント配線板のデザインによるが、一般に3μm〜35μm、好ましくは5μm〜30μmである。 The thickness of the conductor layer is generally 3 μm to 35 μm, preferably 5 μm to 30 μm, depending on the desired printed wiring board design.
一実施形態において、導体層は、メッキにより形成してよい。例えば、セミアディティブ法、フルアディティブ法等の従来公知の技術により絶縁層の表面にメッキして、所望の配線パターンを有する導体層を形成することができ、製造の簡便性の観点から、セミアディティブ法により形成することが好ましい。以下、導体層をセミアディティブ法により形成する例を示す。 In one embodiment, the conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of an insulating layer by a conventionally known technique such as a semi-additive method or a full additive method, and the semi-additive can be manufactured from the viewpoint of ease of manufacture. It is preferably formed by the method. Hereinafter, an example of forming the conductor layer by the semi-additive method will be shown.
まず、絶縁層の表面に、無電解メッキによりメッキシード層を形成する。次いで、形成されたメッキシード層上に、所望の配線パターンに対応してメッキシード層の一部を露出させるマスクパターンを形成する。露出したメッキシード層上に、電解メッキにより金属層を形成した後、マスクパターンを除去する。その後、不要なメッキシード層をエッチング等により除去して、所望の配線パターンを有する導体層を形成することができる。 First, a plating seed layer is formed on the surface of the insulating layer by electroless plating. Next, a mask pattern that exposes a part of the plating seed layer corresponding to a desired wiring pattern is formed on the formed plating seed layer. After forming a metal layer by electrolytic plating on the exposed plating seed layer, the mask pattern is removed. After that, the unnecessary plating seed layer can be removed by etching or the like to form a conductor layer having a desired wiring pattern.
他の実施形態において、導体層は、金属箔を使用して形成してよい。金属箔を使用して導体層を形成する場合、工程(V)は、工程(I)と工程(II)の間に実施することが好適である。例えば、工程(I)の後、支持体を除去し、露出した樹脂組成物層の表面に金属箔を積層する。樹脂組成物層と金属箔との積層は、真空ラミネート法により実施してよい。積層の条件は、工程(I)について説明した条件と同様としてよい。次いで、工程(II)を実施して絶縁層を形成する。その後、絶縁層上の金属箔を利用して、サブトラクティブ法、モディファイドセミアディティブ法等の従来の公知の技術により、所望の配線パターンを有する導体層を形成することができる。 In other embodiments, the conductor layer may be formed using metal leaf. When the conductor layer is formed using the metal foil, it is preferable that the step (V) is carried out between the steps (I) and the step (II). For example, after step (I), the support is removed and a metal leaf is laminated on the surface of the exposed resin composition layer. The laminating of the resin composition layer and the metal foil may be carried out by a vacuum laminating method. The laminating conditions may be the same as the conditions described for step (I). Then, step (II) is carried out to form an insulating layer. After that, the metal foil on the insulating layer can be used to form a conductor layer having a desired wiring pattern by conventional known techniques such as a subtractive method and a modified semi-additive method.
金属箔は、例えば、電解法、圧延法等の公知の方法により製造することができる。金属箔の市販品としては、例えば、JX日鉱日石金属社製のHLP箔、JXUT−III箔、三井金属鉱山社製の3EC−III箔、TP−III箔等が挙げられる。 The metal foil can be produced by a known method such as an electrolysis method or a rolling method. Examples of commercially available metal foils include HLP foils and JXUT-III foils manufactured by JX Nippon Mining & Metals Co., Ltd., 3EC-III foils and TP-III foils manufactured by Mitsui Mining & Smelting Co., Ltd.
<半導体装置>
本発明の半導体装置は、本発明のプリント配線板を含む。本発明の半導体装置は、本発明のプリント配線板を用いて製造することができる。
<Semiconductor device>
The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured by using the printed wiring board of the present invention.
半導体装置としては、電気製品(例えば、コンピューター、携帯電話、デジタルカメラ及びテレビ等)及び乗物(例えば、自動二輪車、自動車、電車、船舶及び航空機等)等に供される各種半導体装置が挙げられる。 Examples of semiconductor devices include various semiconductor devices used in electric products (for example, computers, mobile phones, digital cameras, televisions, etc.) and vehicles (for example, motorcycles, automobiles, trains, ships, aircraft, etc.).
以下、本発明を実施例により具体的に説明する。本発明はこれらの実施例に限定されるものではない。なお、以下において、量を表す「部」及び「%」は、別途明示のない限り、それぞれ「質量部」及び「質量%」を意味する。特に温度の指定が無い場合の温度条件は、室温(25℃)である。 Hereinafter, the present invention will be specifically described with reference to Examples. The present invention is not limited to these examples. In the following, "parts" and "%" representing quantities mean "parts by mass" and "% by mass", respectively, unless otherwise specified. When no temperature is specified, the temperature condition is room temperature (25 ° C.).
<実施例1>
ビフェニル骨格含有アミン化合物(日本化薬社製「BAN」)10部、脂肪族マレイミド化合物(デザイナーモレキュールズ社製「BMI−689」)20部、芳香族マレイミド化合物(日本化薬社製「MIR−3000−70MT」、固形分70%のMEK/トルエン混合溶液)28.6部、イミダゾール系硬化促進剤(四国化成工業社製「1B2PZ」、1−ベンジル−2−フェニルイミダゾール)1部、シランカップリング剤(信越化学工業社製「KBM−573」、N−フェニル−3−アミノプロピルトリメトキシシラン)で表面処理された球形シリカ(アドマテックス社製「SO−C2」、平均粒径0.5μm、比表面積5.8m2/g)60部を混合し、高速回転ミキサーで均一に分散して、樹脂組成物を調製した。
<Example 1>
10 parts of biphenyl skeleton-containing amine compound (“BAN” manufactured by Nippon Kayaku Co., Ltd.), 20 parts of aliphatic maleimide compound (“BMI-689” manufactured by Designer Molecule's), aromatic maleimide compound (“MIR” manufactured by Nippon Kayaku Co., Ltd.) -3000-70MT ", MEK / toluene mixed solution with 70% solid content) 28.6 parts, imidazole-based curing accelerator (" 1B2PZ "manufactured by Shikoku Kasei Kogyo Co., Ltd., 1-benzyl-2-phenylimidazole) 1 part, silane Spherical silica surface-treated with a coupling agent (“KBM-573” manufactured by Shin-Etsu Chemical Industry Co., Ltd., N-phenyl-3-aminopropyltrimethoxysilane) (“SO-C2” manufactured by Admatex Co., Ltd., average particle size 0. 60 parts (5 μm, specific surface area 5.8 m 2 / g) were mixed and uniformly dispersed with a high-speed rotary mixer to prepare a resin composition.
<実施例2>
脂肪族マレイミド化合物(デザイナーモレキュールズ社製「BMI−689」)20部の代わりに脂肪族マレイミド化合物(デザイナーモレキュールズ社製「BMI−1500」)を20部使用した以外は、実施例1と同様にして、樹脂組成物を調製した。
<Example 2>
Example 1 except that 20 parts of the aliphatic maleimide compound (“BMI-1500” manufactured by Designer Molecule) was used instead of 20 parts of the aliphatic maleimide compound (“BMI-689” manufactured by Designer Molecule). The resin composition was prepared in the same manner as in the above.
<実施例3>
脂肪族マレイミド化合物(デザイナーモレキュールズ社製「BMI−689」)20部の代わりに、脂肪族マレイミド化合物(デザイナーモレキュールズ社製「BMI−2500」)を20部使用した以外は、実施例1と同様にして、樹脂組成物を調製した。
<Example 3>
Examples except that 20 parts of the aliphatic maleimide compound (“BMI-2500” manufactured by Designer Molecule) was used instead of 20 parts of the aliphatic maleimide compound (“BMI-689” manufactured by Designer Molecule). A resin composition was prepared in the same manner as in 1.
<実施例4>
脂肪族マレイミド化合物(デザイナーモレキュールズ社製「BMI−689」)20部の代わりに脂肪族マレイミド化合物(デザイナーモレキュールズ社製「BMI−3000J」)を20部使用した以外は、実施例1と同様にして、樹脂組成物を調製した。
<Example 4>
Example 1 except that 20 parts of the aliphatic maleimide compound (“BMI-3000J” manufactured by Designer Molecule) was used instead of 20 parts of the aliphatic maleimide compound (“BMI-689” manufactured by Designer Molecule). The resin composition was prepared in the same manner as in the above.
<実施例5>
芳香族マレイミド化合物(日本化薬社製「MIR−3000−70MT」、固形分70%のMEK/トルエン混合溶液)28.6部の代わりに、芳香族マレイミド化合物(デザイナーモレキュールズ社製「BMI−6100」)を20部使用した以外は、実施例2と同様にして、樹脂組成物を調製した。
<Example 5>
Aromatic maleimide compound (“MIR-3000-70MT” manufactured by Nippon Kayaku Co., Ltd., MEK / toluene mixed solution with 70% solid content) Instead of 28.6 parts, aromatic maleimide compound (“BMI” manufactured by Designer Molecule's Co., Ltd.) A resin composition was prepared in the same manner as in Example 2 except that 20 parts of -6100 ”) were used.
<実施例6>
芳香族マレイミド化合物(日本化薬社製「MIR−3000−70MT」、固形分70%のMEK/トルエン混合溶液)28.6部の代わりに、芳香族マレイミド化合物(デザイナーモレキュールズ社製「BMI−6100」)を20部使用した以外は、実施例3と同様にして、樹脂組成物を調製した。
<Example 6>
Aromatic maleimide compound (“MIR-3000-70MT” manufactured by Nippon Kayaku Co., Ltd., MEK / toluene mixed solution with 70% solid content) Instead of 28.6 parts, aromatic maleimide compound (“BMI” manufactured by Designer Molecule's Co., Ltd.) A resin composition was prepared in the same manner as in Example 3 except that 20 parts of -6100 ”) were used.
<実施例7>
芳香族マレイミド化合物(日本化薬社製「MIR−3000−70MT」、固形分70%のMEK/トルエン混合溶液)の使用量を28.6部から14.3部に変更し、芳香族マレイミド化合物(デザイナーモレキュールズ社製「BMI−6100」)をさらに10部使用した以外は、実施例2と同様にして、樹脂組成物を調製した。
<Example 7>
The amount of aromatic maleimide compound (“MIR-3000-70MT” manufactured by Nippon Kayaku Co., Ltd., MEK / toluene mixed solution with 70% solid content) was changed from 28.6 parts to 14.3 parts, and the aromatic maleimide compound was changed. A resin composition was prepared in the same manner as in Example 2 except that 10 parts (“BMI-6100” manufactured by Designer Moleculars) was used.
<実施例8>
発明協会公開技報公技番号2020−500211号の合成例1に記載の方法で合成された下記式(X)で表されるマレイミド化合物A(Mw/Mn=1.81、v’’=1.47(主に1、2又は3))のMEK溶液(不揮発成分70質量%)を準備した。
<Example 8>
Maleimide compound A (Mw / Mn = 1.81, v'' = 1 represented by the following formula (X) synthesized by the method described in Synthesis Example 1 of Publication No. 2020-500211 of the Japan Institute of Invention and Innovation. A MEK solution (70% by mass of non-volatile components) of .47 (mainly 1, 2 or 3)) was prepared.
芳香族マレイミド化合物(日本化薬社製「MIR−3000−70MT」、固形分70%のMEK/トルエン混合溶液)28.6部の代わりに、芳香族マレイミド化合物(式(X)で表されるマレイミド化合物A、固形分70質量%のMEK溶液)を28.6部使用した以外は、実施例2と同様にして、樹脂組成物を調製した。 Aromatic maleimide compound (“MIR-3000-70MT” manufactured by Nippon Kayaku Co., Ltd., MEK / toluene mixed solution with 70% solid content) Instead of 28.6 parts, it is represented by an aromatic maleimide compound (formula (X)). A resin composition was prepared in the same manner as in Example 2 except that 28.6 parts of maleimide compound A (MEK solution having a solid content of 70% by mass) was used.
<実施例9>
シランカップリング剤(信越化学工業社製「KBM−573」、N−フェニル−3−アミノプロピルトリメトキシシラン)で表面処理された球形シリカ(アドマテックス社製「SO−C2」)の使用量を60部から70部に変更し、ビニルベンジル変性ポリフェニレンエーテル(三菱瓦斯化学社製「OPE−2St 2200」、固形分65%のトルエン溶液)を15.4部さらに使用した以外は、実施例2と同様にして、樹脂組成物を調製した。
<Example 9>
Use amount of spherical silica ("SO-C2" manufactured by Admatex) surface-treated with a silane coupling agent ("KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd., N-phenyl-3-aminopropyltrimethoxysilane). Example 2 except that the amount was changed from 60 parts to 70 parts and 15.4 parts of vinylbenzyl-modified polyphenylene ether (“OPE-2St 2200” manufactured by Mitsubishi Gas Chemical Company, a toluene solution having a solid content of 65%) was further used. Similarly, a resin composition was prepared.
<実施例10>
シランカップリング剤(信越化学工業社製「KBM−573」、N−フェニル−3−アミノプロピルトリメトキシシラン)で表面処理された球形シリカ(アドマテックス社製「SO−C2」)の使用量を60部から70部に変更し、メタクリル変性ポリフェニレンエーテル(サビックイノベーティブプラスチックス社製「SA9000−111」を固形分50%のトルエン溶液としたもの)を20部さらに使用した以外は、実施例2と同様にして、樹脂組成物を調製した。
<Example 10>
Use amount of spherical silica ("SO-C2" manufactured by Admatex) surface-treated with a silane coupling agent ("KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd., N-phenyl-3-aminopropyltrimethoxysilane). Example 2 except that the amount was changed from 60 parts to 70 parts and 20 parts of methacryl-modified polyphenylene ether (“SA9000-111” manufactured by Savik Innovative Plastics as a toluene solution having a solid content of 50%) was further used. The resin composition was prepared in the same manner as in the above.
<実施例11>
シランカップリング剤(信越化学工業社製「KBM−573」、N−フェニル−3−アミノプロピルトリメトキシシラン)で表面処理された球形シリカ(アドマテックス社製「SO−C2」)の使用量を60部から70部に変更し、ジビニルベンゼン/スチレン共重合体(日鉄ケミカル&マテリアル社製「ODV−XET−X04」、固形分65%のトルエン溶液)を15.4部さらに使用した以外は、実施例2と同様にして、樹脂組成物を調製した。
<Example 11>
Use amount of spherical silica ("SO-C2" manufactured by Admatex) surface-treated with a silane coupling agent ("KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd., N-phenyl-3-aminopropyltrimethoxysilane). Except for changing from 60 parts to 70 parts and using 15.4 parts of divinylbenzene / styrene copolymer (“ODV-XET-X04” manufactured by Nittetsu Chemical & Materials Co., Ltd., a toluene solution with a solid content of 65%). , A resin composition was prepared in the same manner as in Example 2.
<比較例1>
脂肪族マレイミド化合物(デザイナーモレキュールズ社製「BMI−689」)20部を使用せず、芳香族マレイミド化合物(日本化薬社製「MIR−3000−70MT」、固形分70%のMEK/トルエン混合溶液)の使用量を28.6部から57.1部に変更した以外は、実施例1と同様にして、樹脂組成物を調製した。
<Comparative Example 1>
20 parts of an aliphatic maleimide compound ("BMI-689" manufactured by Designer Molecule) is not used, and an aromatic maleimide compound ("MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd., MEK / toluene with a solid content of 70%) is not used. A resin composition was prepared in the same manner as in Example 1 except that the amount of the mixed solution) used was changed from 28.6 parts to 57.1 parts.
<比較例2>
脂肪族マレイミド化合物(デザイナーモレキュールズ社製「BMI−689」)の使用量を20部から10部に変更し、ビフェニル骨格含有アミン化合物(日本化薬社製「BAN」)10部の代わりに、ビフェニル骨格不含アミン化合物(日本化薬社製「A−A」)を10部使用した以外は、実施例1と同様にして、樹脂組成物を調製した。
<Comparative Example 2>
The amount of the aliphatic maleimide compound ("BMI-689" manufactured by Designer Molecule) was changed from 20 parts to 10 parts, instead of 10 parts of the biphenyl skeleton-containing amine compound ("BAN" manufactured by Nippon Kayaku Co., Ltd.). , A resin composition was prepared in the same manner as in Example 1 except that 10 parts of a biphenyl skeleton-free amine compound (“AA” manufactured by Nippon Kayaku Co., Ltd.) was used.
<試験例1:比誘電率(Dk)および誘電正接(Df)の測定>
支持体として、離型層を備えたポリエチレンテレフタレートフィルム(リンテック社製「AL5」、厚さ38μm)を用意した。この支持体の離型層上に、実施例及び比較例で得られた樹脂組成物を、乾燥後の樹脂組成物層の厚さが40μmとなるように均一に塗布した。その後、樹脂組成物を80℃〜100℃(平均90℃)で4分間乾燥させて、支持体及び樹脂組成物層を含む樹脂シートAを得た。
<Test Example 1: Measurement of Relative Permittivity (Dk) and Dielectric Dissipation Factor (Df)>
As a support, a polyethylene terephthalate film (“AL5” manufactured by Lintec Corporation, thickness 38 μm) having a release layer was prepared. The resin compositions obtained in Examples and Comparative Examples were uniformly applied onto the release layer of this support so that the thickness of the resin composition layer after drying was 40 μm. Then, the resin composition was dried at 80 ° C. to 100 ° C. (average 90 ° C.) for 4 minutes to obtain a resin sheet A containing a support and a resin composition layer.
得られた樹脂シートAを190℃のオーブンで90分硬化した。オーブンから取り出した樹脂シートAから支持体を剥がすことにより、樹脂組成物層の硬化物を得た。その硬化物を長さ80mm、幅2mmに切り出し評価用硬化物Bとした。 The obtained resin sheet A was cured in an oven at 190 ° C. for 90 minutes. By peeling the support from the resin sheet A taken out from the oven, a cured product of the resin composition layer was obtained. The cured product was cut into a length of 80 mm and a width of 2 mm and used as a cured product B for evaluation.
評価用硬化物Bについて、アジレントテクノロジーズ(AgilentTechnologies)社製「HP8362B」を用いて、空洞共振摂動法により測定周波数5.8GHz、測定温度23℃にて、誘電率の値(Dk値)及び誘電正接の値(Df値)を測定した。2本の試験片にて測定を実施し、その平均を算出した。 For the cured product B for evaluation, the dielectric constant value (Dk value) and the dielectric loss tangent at a measurement frequency of 5.8 GHz and a measurement temperature of 23 ° C. by a cavity resonance perturbation method using "HP8632B" manufactured by Agilent Technologies. (Df value) was measured. Measurements were carried out with two test pieces, and the average was calculated.
<試験例2:ピール強度及び算術平均粗さ(Ra)の測定>
(1)内層基板の用意
内層回路を形成したガラス布基材エポキシ樹脂両面銅張積層板(銅箔の厚さ18μm、基板の厚さ0.4mm、パナソニック社製「R1515A」)の両面をマイクロエッチング剤(メック社製「CZ8101」)にて1μmエッチングして銅表面の粗化処理を行った。
<Test Example 2: Measurement of peel strength and arithmetic mean roughness (Ra)>
(1) Preparation of inner layer substrate Both sides of the glass cloth base material epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic “R1515A”) on which the inner layer circuit is formed are microscopic. The copper surface was roughened by etching 1 μm with an etching agent (“CZ8101” manufactured by MEC).
(2)樹脂シートAのラミネート
バッチ式真空加圧ラミネーター(ニッコー・マテリアルズ社製、2ステージビルドアップラミネーター「CVP700」)を用いて、樹脂組成物層が内層基板と接するように、試験例1で得た樹脂シートAを内層基板の両面にラミネートした。ラミネートは、30秒間減圧して気圧を13hPa以下に調整した後、120℃、圧力0.74MPaにて30秒間圧着させることにより実施した。次いで、100℃、圧力0.5MPaにて60秒間熱プレスを行った。
(2) Lamination of Resin Sheet A Test Example 1 using a batch type vacuum pressurizing laminator (2-stage build-up laminator "CVP700" manufactured by Nikko Materials Co., Ltd.) so that the resin composition layer is in contact with the inner layer substrate. The resin sheet A obtained in 1 above was laminated on both sides of the inner layer substrate. Laminating was carried out by reducing the pressure for 30 seconds, adjusting the atmospheric pressure to 13 hPa or less, and then crimping at 120 ° C. and a pressure of 0.74 MPa for 30 seconds. Then, heat pressing was performed at 100 ° C. and a pressure of 0.5 MPa for 60 seconds.
(3)樹脂組成物層の熱硬化
その後、樹脂シートAがラミネートされた内層基板を、130℃のオーブンに投入して30分間加熱し、次いで190℃のオーブンに移し替えて30分間加熱して、樹脂組成物層を熱硬化させて、絶縁層を形成した。その後、支持体を剥離して、絶縁層、内層基板及び絶縁層をこの順に有する硬化基板Aを得た。
(3) Thermosetting of Resin Composition Layer After that, the inner layer substrate on which the resin sheet A is laminated is put into an oven at 130 ° C. and heated for 30 minutes, then transferred to an oven at 190 ° C. and heated for 30 minutes. , The resin composition layer was heat-cured to form an insulating layer. Then, the support was peeled off to obtain a cured substrate A having an insulating layer, an inner layer substrate, and an insulating layer in this order.
(4)粗化処理
硬化基板Aに、粗化処理としてのデスミア処理を行った。デスミア処理としては、下記の湿式デスミア処理を実施した。
(4) Roughing treatment The cured substrate A was subjected to desmear treatment as a roughening treatment. As the desmear treatment, the following wet desmear treatment was carried out.
(湿式デスミア処理)
硬化基板Aを、膨潤液(アトテックジャパン社製「スウェリング・ディップ・セキュリガントP」、ジエチレングリコールモノブチルエーテル及び水酸化ナトリウムの水溶液)に60℃で5分間浸漬し、次いで、酸化剤溶液(アトテックジャパン社製「コンセントレート・コンパクトCP」、過マンガン酸カリウム濃度約6%、水酸化ナトリウム濃度約4%の水溶液)に80℃で20分間浸漬した。次いで、中和液(アトテックジャパン社製「リダクションソリューション・セキュリガントP」、硫酸水溶液)に40℃で5分間浸漬した後、80℃で15分間乾燥した。
(Wet desmear treatment)
The cured substrate A is immersed in a swelling solution (Atotech Japan's "Swelling Dip Securigant P", an aqueous solution of diethylene glycol monobutyl ether and sodium hydroxide) at 60 ° C. for 5 minutes, and then an oxidizing agent solution (Atotech Japan). It was immersed in "Concentrate Compact CP" manufactured by the same company (an aqueous solution having a potassium permanganate concentration of about 6% and a sodium hydroxide concentration of about 4%) at 80 ° C. for 20 minutes. Then, it was immersed in a neutralizing solution (“Reduction Solution Securigant P” manufactured by Atotech Japan, sulfuric acid aqueous solution) at 40 ° C. for 5 minutes, and then dried at 80 ° C. for 15 minutes.
(5)粗化処理後の絶縁層表面の算術平均粗さ(Ra)の測定
粗化処理後の硬化基板Aの絶縁層表面の算術平均粗さ(Ra)を、非接触型表面粗さ計(ブルカー社製WYKO NT3300)を用いて、VSIモード、50倍レンズにより測定範囲を121μm×92μmとして得られる数値により求めた。それぞれ10点の平均値を求めることにより測定した。
(5) Measurement of Arithmetic Mean Roughness (Ra) of Insulation Layer Surface After Roughing Treatment The arithmetic average roughness (Ra) of the insulation layer surface of the cured substrate A after roughening treatment is measured by a non-contact surface roughness meter. (WYKO NT3300 manufactured by Bruker Co., Ltd.) was used, and the measurement range was determined by a numerical value obtained with a measurement range of 121 μm × 92 μm using a VSI mode and a 50x lens. It was measured by obtaining the average value of 10 points for each.
(6)導体層の形成
セミアディティブ法に従って、硬化基板Aの絶縁層の粗化面に導体層を形成した。すなわち、粗化処理後の基板を、PdCl2を含む無電解めっき液に40℃で5分間浸漬した後、無電解銅めっき液に25℃で20分間浸漬した。次いで、150℃にて30分間加熱してアニール処理を行った後に、エッチングレジストを形成し、エッチングによりパターン形成した。その後、硫酸銅電解めっきを行い、厚さ25μmの導体層を形成し、アニール処理を190℃にて60分間行った。得られた基板を「評価基板B」と称する。
(6) Formation of Conductor Layer A conductor layer was formed on the roughened surface of the insulating layer of the cured substrate A according to the semi-additive method. That is, the roughened substrate was immersed in an electroless plating solution containing PdCl 2 at 40 ° C. for 5 minutes, and then immersed in an electroless copper plating solution at 25 ° C. for 20 minutes. Then, after heating at 150 ° C. for 30 minutes for annealing treatment, an etching resist was formed and a pattern was formed by etching. Then, copper sulfate electrolytic plating was performed to form a conductor layer having a thickness of 25 μm, and annealing treatment was performed at 190 ° C. for 60 minutes. The obtained substrate is referred to as "evaluation substrate B".
(7)めっき導体層のピール強度の測定
絶縁層と導体層のピール強度の測定は、日本工業規格(JIS C6481)に準拠して行った。具体的には、評価基板Bの導体層に、幅10mm、長さ100mmの部分の切込みをいれ、この一端を剥がしてつかみ具で掴み、室温中にて、50mm/分の速度で垂直方向に35mmを引き剥がした時の荷重(kgf/cm)を測定し、剥離強度を求めた。測定には、引っ張り試験機(TSE社製「AC−50C−SL」)を使用した。
(7) Measurement of Peel Strength of Plated Conductor Layer The peel strength of the insulating layer and the conductor layer was measured in accordance with the Japanese Industrial Standards (JIS C6481). Specifically, a notch having a width of 10 mm and a length of 100 mm is made in the conductor layer of the evaluation substrate B, one end of the notch is peeled off, and the conductor layer is grasped by a gripper. The load (kgf / cm) when the 35 mm was peeled off was measured, and the peeling strength was determined. A tensile tester (“AC-50C-SL” manufactured by TSE) was used for the measurement.
実施例及び比較例の樹脂組成物の不揮発成分の使用量、試験例の測定結果を下記表1に示す。 Table 1 below shows the amounts of non-volatile components used in the resin compositions of Examples and Comparative Examples and the measurement results of Test Examples.
以上により、(A)ビフェニル骨格を有するアミン化合物、(B)炭素原子数が7以上の脂肪鎖を有するマレイミド化合物、及び(C)炭素原子数が7以上の脂肪鎖を有さないマレイミド化合物を含む樹脂組成物を使用することにより、比誘電率(Dk)及び誘電正接(Df)が低く、且つめっき導体層のピール強度に優れた硬化物を得ることができることがわかった。 As described above, (A) an amine compound having a biphenyl skeleton, (B) a maleimide compound having a fat chain having 7 or more carbon atoms, and (C) a maleimide compound having no fat chain having 7 or more carbon atoms. It was found that by using the resin composition containing the compound, a cured product having a low relative permittivity (Dk) and a dielectric positive tangent (Df) and excellent peel strength of the plated conductor layer can be obtained.
Claims (21)
(B)炭素原子数が7以上の脂肪鎖を有するマレイミド化合物、及び
(C)炭素原子数が7以上の脂肪鎖を有さないマレイミド化合物
を含む樹脂組成物。 (A) Amine compound having a biphenyl skeleton,
A resin composition containing (B) a maleimide compound having a fat chain having 7 or more carbon atoms, and (C) a maleimide compound having no fat chain having 7 or more carbon atoms.
で表される繰り返し単位を有するアミン化合物を含む、請求項1〜5の何れか1項に記載の樹脂組成物。 The component (A) is the formula (A1) :.
The resin composition according to any one of claims 1 to 5, which comprises an amine compound having a repeating unit represented by.
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JP7460816B1 (en) | 2022-11-11 | 2024-04-02 | 南亞塑膠工業股▲分▼有限公司 | Resin composition |
JP7467014B2 (en) | 2021-03-25 | 2024-04-15 | 信越化学工業株式会社 | Adhesive composition for flexible printed wiring boards (FPCs), and thermosetting resin films, prepregs, and FPC boards containing said composition |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010043254A (en) * | 2008-07-15 | 2010-02-25 | Hitachi Chem Co Ltd | Thermosetting insulating resin composition, and prepreg, film with resin, laminate and multilayer printed wiring board using the same |
JP2016204639A (en) * | 2015-04-17 | 2016-12-08 | 日立化成株式会社 | Resin composition, laminate and multilayer printed board |
JP2017125128A (en) * | 2016-01-14 | 2017-07-20 | 日立化成株式会社 | Method for producing resin film for the production of printed wire board for millimeter wave radar |
JP2018201024A (en) * | 2015-01-13 | 2018-12-20 | 日立化成株式会社 | Resin film for flexible printed wiring board and bonding sheet |
WO2020045489A1 (en) * | 2018-08-30 | 2020-03-05 | 三菱瓦斯化学株式会社 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010043254A (en) * | 2008-07-15 | 2010-02-25 | Hitachi Chem Co Ltd | Thermosetting insulating resin composition, and prepreg, film with resin, laminate and multilayer printed wiring board using the same |
JP2018201024A (en) * | 2015-01-13 | 2018-12-20 | 日立化成株式会社 | Resin film for flexible printed wiring board and bonding sheet |
JP2016204639A (en) * | 2015-04-17 | 2016-12-08 | 日立化成株式会社 | Resin composition, laminate and multilayer printed board |
JP2017125128A (en) * | 2016-01-14 | 2017-07-20 | 日立化成株式会社 | Method for producing resin film for the production of printed wire board for millimeter wave radar |
WO2020045489A1 (en) * | 2018-08-30 | 2020-03-05 | 三菱瓦斯化学株式会社 | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7417345B2 (en) | 2020-12-23 | 2024-01-18 | 信越化学工業株式会社 | Cyclic imide resin compositions, prepregs, copper clad laminates and printed wiring boards |
JP7467014B2 (en) | 2021-03-25 | 2024-04-15 | 信越化学工業株式会社 | Adhesive composition for flexible printed wiring boards (FPCs), and thermosetting resin films, prepregs, and FPC boards containing said composition |
JP7460816B1 (en) | 2022-11-11 | 2024-04-02 | 南亞塑膠工業股▲分▼有限公司 | Resin composition |
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