JP2021090990A - レーザービームのスポット形状の補正方法 - Google Patents
レーザービームのスポット形状の補正方法 Download PDFInfo
- Publication number
- JP2021090990A JP2021090990A JP2019224048A JP2019224048A JP2021090990A JP 2021090990 A JP2021090990 A JP 2021090990A JP 2019224048 A JP2019224048 A JP 2019224048A JP 2019224048 A JP2019224048 A JP 2019224048A JP 2021090990 A JP2021090990 A JP 2021090990A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- plane image
- image
- unit
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 77
- 238000012937 correction Methods 0.000 title abstract description 36
- 238000012545 processing Methods 0.000 claims abstract description 90
- 238000003384 imaging method Methods 0.000 claims abstract description 43
- 230000001678 irradiating effect Effects 0.000 claims abstract description 13
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 11
- 230000004075 alteration Effects 0.000 claims description 71
- 238000010586 diagram Methods 0.000 description 52
- 230000003287 optical effect Effects 0.000 description 33
- 238000003754 machining Methods 0.000 description 19
- 206010010071 Coma Diseases 0.000 description 12
- 235000004035 Cryptotaenia japonica Nutrition 0.000 description 12
- 102000007641 Trefoil Factors Human genes 0.000 description 12
- 235000015724 Trifolium pratense Nutrition 0.000 description 12
- 201000009310 astigmatism Diseases 0.000 description 12
- 230000006870 function Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000004590 computer program Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010801 machine learning Methods 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0085—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with both a detector and a source
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0025—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
- G02B27/0068—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration having means for controlling the degree of correction, e.g. using phase modulators, movable elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/10—Mirrors with curved faces
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136277—Active matrix addressed cells formed on a semiconductor substrate, e.g. of silicon
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/12—Function characteristic spatial light modulator
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/50—Phase-only modulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
Description
本発明の実施形態1に係るレーザービームのスポット形状の補正方法を図面に基づいて説明する。まず、実施形態1に係るレーザービームのスポット形状の補正方法を実施するレーザー加工装置1の構成を説明する。図1は、実施形態1に係るレーザービームのスポット形状の補正方法を実施するレーザー加工装置の構成例を示す斜視図である。実施形態1に係る図1に示すレーザー加工装置1は、被加工物200に対してパルス状のレーザービーム21を照射し、被加工物200をレーザー加工する装置である。
図1に示されたレーザー加工装置1の加工対象である被加工物200は、シリコン、サファイア、ガリウムヒ素などの基板201を有する円板状の半導体ウエーハや光デバイスウエーハ等のウエーハである。被加工物200は、図1に示すように、基板201の表面202に格子状に設定された分割予定ライン203と、分割予定ライン203によって区画された領域に形成されたデバイス204と、を有している。デバイス204は、例えば、IC(Integrated Circuit)、又はLSI(Large Scale Integration)等の集積回路、CCD(Charge Coupled Device)、又はCMOS(Complementary Metal Oxide Semiconductor)等のイメージセンサである。
レーザー加工装置1は、図1に示すように、被加工物200を保持面11で保持する保持手段であるチャックテーブル10と、レーザービーム照射手段であるレーザービーム照射ユニット20と、移動ユニット30と、撮像ユニット40と、制御部100とを有する。
本発明の実施形態2に係るレーザービームのスポット形状の補正方法を図面に基づいて説明する。図15は、実施形態2に係るレーザービームのスポット形状の補正方法を実施するレーザー加工装置の構成例を示す斜視図である。図16は、図15に示されたレーザー加工装置のレーザービーム照射ユニットの構成を説明する図である。なお、図15及び図16は、実施形態1と同一部分に同一符号を付して説明を省略する。
本発明の実施形態1及び実施形態2の変形例に係るレーザー加工装置を図面に基づいて説明する。図31は、実施形態1及び実施形態2の変形例に係るレーザービームのスポット形状の補正方法を実施するレーザー加工装置の構成例を示す斜視図である。なお、図31は、実施形態1と同一部分に同一符号を付して説明を省略する。
10 チャックテーブル(保持手段)
20 レーザービーム照射ユニット
21 レーザービーム
22 レーザー発振器
23 集光レンズ
24 空間光変調器
25 凹面鏡
28 ビームプロファイラ(撮像手段)
100 制御部
200 被加工物
211 集光点
212 反射光
241 表示部
251 焦点
252 反射面
400 XY平面像
500 XZ平面像
501 XZ平面像(理想の形状および強度分布を有するレーザービームのXZ平面像)
600 YZ平面像
601 YZ平面像(理想の形状および強度分布を有するレーザービームのYZ平面像)
ST1 記憶ステップ
ST2 凹面鏡配置ステップ
ST3 焦点位置付けステップ
ST4 レーザービーム照射ステップ
ST5 撮像ステップ
ST6 画像形成ステップ
ST7 比較ステップ
ST9 判断ステップ
Claims (4)
- 被加工物を保持する保持手段と、
該保持手段に保持された被加工物にレーザービームを照射するレーザービーム照射手段と、
制御部と、を備え、
該レーザービーム照射手段は、
レーザー発振器と、
該レーザー発振器から発振されたレーザービームを集光する集光レンズと、
該レーザー発振器と該集光レンズとの間に配設された空間光変調器と、
を有するレーザー加工装置において、
該集光レンズによって集光されたレーザービームのスポット形状を補正するレーザービームのスポット形状補正方法であって、
反射面が球面となっている凹面鏡を該レーザービーム照射手段の該集光レンズと対面する位置に位置付ける凹面鏡配置ステップと、
該凹面鏡配置ステップの後、該集光レンズの集光点を該凹面鏡の焦点位置に位置付ける焦点位置付けステップと、
該レーザー発振器を作動し該集光レンズによって集光されたレーザービームを該凹面鏡に照射するレーザービーム照射ステップと、
該凹面鏡の反射面で反射した反射光を撮像手段によって撮像する撮像ステップと、
該撮像ステップで撮像されたレーザービームの形状および強度分布を示すXY平面像から、XZ平面像またはYZ平面像を形成する画像形成ステップと、
該画像形成ステップで形成された画像と、理想の形状および強度分布を有するレーザービームのXZ平面像またはYZ平面像と、を比較する比較ステップと、を有し、
該画像形成ステップで形成されたXZ平面像またはYZ平面像と、該理想の形状および強度分布を有するレーザービームのXZ平面像またはYZ平面像とが一致するように、該空間光変調器の表示部に表示させる位相パターンを変更することを特徴とする、レーザービームのスポット形状の補正方法。 - 該撮像ステップで撮像されたレーザービームの画像がどの収差成分を含んでいるかを判断する判断ステップを更に有し、
該判断ステップで判断された収差成分を打ち消すような位相パターンを該空間光変調器の表示部に表示させることを特徴とする、
請求項1に記載のレーザービームのスポット形状の補正方法。 - 該撮像ステップで撮像されたレーザービームがどの収差成分を含んでいるかを判断する判断ステップと、
該理想の形状および強度分布を有するレーザービームがどの収差成分を含んでいるかを記憶しておく記憶ステップと、
を更に含み、
該撮像ステップで撮像されたレーザービームの収差成分が該理想のレーザービームの収差成分と一致するように、該空間光変調器の表示部に表示させる位相パターンを変更することを特徴とする、請求項1に記載のレーザービームのスポット形状の補正方法。 - 該比較ステップでは、
比較した画像の相違が所定の割合以下であれば合格とし、
所定の割合より大きければ再度スポット形状の補正を行うことを特徴とする、請求項1乃至請求項3のうちいずれか一項に記載のレーザービームのスポット形状の補正方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019224048A JP7336977B2 (ja) | 2019-12-11 | 2019-12-11 | レーザービームのスポット形状の補正方法 |
KR1020200153271A KR20210074179A (ko) | 2019-12-11 | 2020-11-17 | 레이저 빔의 스폿 형상의 보정 방법 |
SG10202011979YA SG10202011979YA (en) | 2019-12-11 | 2020-12-01 | Laser beam spot shape correcting method |
CN202011398871.5A CN112935531A (zh) | 2019-12-11 | 2020-12-04 | 激光束的光斑形状的校正方法 |
US17/113,548 US11621201B2 (en) | 2019-12-11 | 2020-12-07 | Laser beam spot shape correcting method |
TW109143133A TW202122194A (zh) | 2019-12-11 | 2020-12-08 | 雷射光束之光點形狀的修正方法 |
DE102020215731.6A DE102020215731A1 (de) | 2019-12-11 | 2020-12-11 | Laserstrahl-spotform-korrigierverfahren |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019224048A JP7336977B2 (ja) | 2019-12-11 | 2019-12-11 | レーザービームのスポット形状の補正方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021090990A true JP2021090990A (ja) | 2021-06-17 |
JP7336977B2 JP7336977B2 (ja) | 2023-09-01 |
Family
ID=76085478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019224048A Active JP7336977B2 (ja) | 2019-12-11 | 2019-12-11 | レーザービームのスポット形状の補正方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11621201B2 (ja) |
JP (1) | JP7336977B2 (ja) |
KR (1) | KR20210074179A (ja) |
CN (1) | CN112935531A (ja) |
DE (1) | DE102020215731A1 (ja) |
SG (1) | SG10202011979YA (ja) |
TW (1) | TW202122194A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024034193A1 (ja) * | 2022-08-12 | 2024-02-15 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
WO2024057780A1 (ja) * | 2022-09-13 | 2024-03-21 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021010936A (ja) * | 2019-07-09 | 2021-02-04 | 株式会社ディスコ | レーザ加工装置 |
CN114095718B (zh) * | 2021-10-29 | 2023-10-24 | 北京市水产科学研究所(国家淡水渔业工程技术研究中心) | 单像素成像***及方法 |
CN114871582B (zh) * | 2022-06-22 | 2024-07-02 | 天津市奥联特钢结构安装工程有限公司 | 一种塑料和金属激光焊接的***和方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11347777A (ja) * | 1998-06-05 | 1999-12-21 | Sumitomo Heavy Ind Ltd | レーザ光プロファイル自動調整装置及び調整方法 |
JP2007253167A (ja) * | 2006-03-20 | 2007-10-04 | Olympus Corp | レーザ加工装置 |
JP2010036189A (ja) * | 2008-07-31 | 2010-02-18 | Miyachi Technos Corp | レーザ加工装置 |
JP2016041437A (ja) * | 2014-08-18 | 2016-03-31 | 株式会社ディスコ | レーザー光線のスポット形状検出方法 |
JP2019144426A (ja) * | 2018-02-21 | 2019-08-29 | 株式会社リコー | 光照射装置、光照射装置を用いた光加工装置、光照射方法、及び光加工方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6433839B1 (en) * | 2000-03-29 | 2002-08-13 | Hourplace, Llc | Methods for generating image set or series with imperceptibly different images, systems therefor and applications thereof |
JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
AU2001292110A1 (en) * | 2000-10-06 | 2002-04-15 | Aoti Operating Company, Inc. | Method to detect surface metal contamination |
JP5848877B2 (ja) | 2011-02-14 | 2016-01-27 | 浜松ホトニクス株式会社 | レーザ光整形及び波面制御用光学系 |
US9952140B2 (en) * | 2012-05-29 | 2018-04-24 | Kla-Tencor Corporation | Small spot size spectroscopic ellipsometer |
US10072921B2 (en) * | 2014-12-05 | 2018-09-11 | Kla-Tencor Corporation | Methods and systems for spectroscopic beam profile metrology having a first two dimensional detector to detect collected light transmitted by a first wavelength dispersive element |
US9921152B2 (en) * | 2016-01-15 | 2018-03-20 | Kla-Tencor Corporation | Systems and methods for extended infrared spectroscopic ellipsometry |
JP6880184B2 (ja) * | 2016-11-10 | 2021-06-02 | エーエスエムエル ネザーランズ ビー.ブイ. | スタック差を使用した設計及び補正 |
-
2019
- 2019-12-11 JP JP2019224048A patent/JP7336977B2/ja active Active
-
2020
- 2020-11-17 KR KR1020200153271A patent/KR20210074179A/ko unknown
- 2020-12-01 SG SG10202011979YA patent/SG10202011979YA/en unknown
- 2020-12-04 CN CN202011398871.5A patent/CN112935531A/zh active Pending
- 2020-12-07 US US17/113,548 patent/US11621201B2/en active Active
- 2020-12-08 TW TW109143133A patent/TW202122194A/zh unknown
- 2020-12-11 DE DE102020215731.6A patent/DE102020215731A1/de active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11347777A (ja) * | 1998-06-05 | 1999-12-21 | Sumitomo Heavy Ind Ltd | レーザ光プロファイル自動調整装置及び調整方法 |
JP2007253167A (ja) * | 2006-03-20 | 2007-10-04 | Olympus Corp | レーザ加工装置 |
JP2010036189A (ja) * | 2008-07-31 | 2010-02-18 | Miyachi Technos Corp | レーザ加工装置 |
JP2016041437A (ja) * | 2014-08-18 | 2016-03-31 | 株式会社ディスコ | レーザー光線のスポット形状検出方法 |
JP2019144426A (ja) * | 2018-02-21 | 2019-08-29 | 株式会社リコー | 光照射装置、光照射装置を用いた光加工装置、光照射方法、及び光加工方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024034193A1 (ja) * | 2022-08-12 | 2024-02-15 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
WO2024057780A1 (ja) * | 2022-09-13 | 2024-03-21 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202122194A (zh) | 2021-06-16 |
DE102020215731A1 (de) | 2021-06-17 |
US20210183714A1 (en) | 2021-06-17 |
JP7336977B2 (ja) | 2023-09-01 |
US11621201B2 (en) | 2023-04-04 |
KR20210074179A (ko) | 2021-06-21 |
SG10202011979YA (en) | 2021-07-29 |
CN112935531A (zh) | 2021-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7336977B2 (ja) | レーザービームのスポット形状の補正方法 | |
JP7386672B2 (ja) | レーザー加工装置及び位相パターンの調整方法 | |
JP7285694B2 (ja) | レーザー加工装置の光軸調整方法 | |
CN112091412B (zh) | 反射率测量装置和激光加工装置 | |
JP7285637B2 (ja) | 板状物の加工方法 | |
JP2021167001A (ja) | レーザービームの位置を確認する確認方法、被加工物の加工方法、およびレーザー加工装置 | |
JP7450413B2 (ja) | レーザー加工装置およびレーザー加工装置の調整方法 | |
TW202110562A (zh) | 雷射加工裝置之光軸確認方法 | |
JP7199256B2 (ja) | 出力測定ユニットの合否判定方法 | |
US20210202278A1 (en) | Laser processing apparatus | |
JP7442322B2 (ja) | レーザー加工装置およびレーザー加工方法 | |
JPH0982784A (ja) | 基板の処理方法 | |
CN115837512A (zh) | 激光加工装置 | |
JP2021141135A (ja) | レーザ処理方法及び改質装置 | |
JP2021169107A (ja) | レーザー加工装置 | |
JP2024001782A (ja) | レーザ光の集光点位置検出方法 | |
JP2023181852A (ja) | 加工装置 | |
JP2021041445A (ja) | レーザー加工装置 | |
JP2503492B2 (ja) | レ−ザ加工装置 | |
JP2020142289A (ja) | レーザー加工装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221021 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230808 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230809 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230822 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7336977 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |