JP2021044422A - ウェーハの加工方法 - Google Patents
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Abstract
Description
11a 表面
11b 裏面
11c レーザー加工溝
11d 切削溝
11e 熱影響層(熱歪み層)
11f レーザー加工溝(レーザー分割溝)
11g 熱影響層(熱歪み層)
13 ストリート(分割予定ライン)
15 デバイス
17 機能層(デバイス層)
19 保護部材
21 デバイスチップ
10 レーザー加工装置
12 チャックテーブル(保持テーブル)
12a 保持面
14 レーザー照射ユニット
16 レーザービーム
20 切削装置
22 チャックテーブル(保持テーブル)
22a 保持面
24 切削ユニット
26 スピンドル
28 切削ブレード
40 研削装置
42 チャックテーブル(保持テーブル)
42a 保持面
44 研削ユニット
46 スピンドル
48 マウント
50 研削ホイール
52 ホイール基台
54 研削砥石
60 プラズマ処理装置
62 処理空間
64 チャンバー
64a 底壁
64b 上壁
64c 第1側壁
64d 第2側壁
64e 第3側壁
66 開口
68 ゲート
70 開閉機構
72 エアシリンダ
74 ピストンロッド
76 ブラケット
78 排気口
80 排気機構
82 下部電極
84 上部電極
86 保持部
88 支持部
90 開口
92 絶縁部材
94 高周波電源
96 テーブル
98 流路
100 吸引源
102 冷却流路
104 冷媒導入路
106 冷媒循環機構
108 冷媒排出路
110 ガス噴出部
112 支持部
114 開口
116 絶縁部材
118 高周波電源
120 昇降機構
122 支持アーム
124 噴出口
126 流路
128 流路
130 第1ガス供給源
132 第2ガス供給源
134 制御部(制御ユニット、制御装置)
140 ガス
Claims (3)
- 複数のストリートによって区画された複数の領域に配置された複数のデバイスを構成する機能層を表面側に有するウェーハの加工方法であって、
該ウェーハの表面側に、該ウェーハに対して吸収性を有するレーザービームを該ストリートに沿って照射することにより、該ストリートに沿って該機能層を除去しつつ、該ストリートに沿ってレーザー加工溝を形成するレーザー加工ステップと、
該レーザー加工溝の幅よりも薄い切削ブレードで該ウェーハの表面側を該ストリートに沿って切削することにより、該ウェーハの仕上げ厚さを超える深さの切削溝を、該ストリートに沿って該レーザー加工溝の内側に形成する切削溝形成ステップと、
該切削溝形成ステップの実施後、該ウェーハの表面側に保護部材を貼着する保護部材貼着ステップと、
該保護部材を介して該ウェーハを研削装置のチャックテーブルによって保持し、該ウェーハの裏面側を研削して該ウェーハの厚さが該仕上げ厚さとなるまで該ウェーハを薄化することにより、該切削溝を該ウェーハの裏面側に露出させて該ウェーハを複数のデバイスチップに分割する研削ステップと、
該ウェーハの裏面側にプラズマ状態のガスを供給し、複数の該デバイスチップの裏面側及び側部に形成されている加工歪みを除去する加工歪み除去ステップと、を備え、
該加工歪み除去ステップでは、該レーザー加工溝の周辺に形成されている熱影響層を除去することを特徴とするウェーハの加工方法。 - 複数のストリートによって区画された複数の領域に配置された複数のデバイスを構成する機能層を表面側に有するウェーハの加工方法であって、
該ウェーハの表面側に、該ウェーハに対して吸収性を有するレーザービームを該ストリートに沿って照射することにより、該ストリートに沿って該機能層を除去しつつ、該ストリートに沿って該ウェーハの仕上げ厚さを超える深さのレーザー加工溝を形成するレーザー加工ステップと、
該レーザー加工ステップの実施後、該ウェーハの表面側に保護部材を貼着する保護部材貼着ステップと、
該保護部材を介して該ウェーハを研削装置のチャックテーブルによって保持し、該ウェーハの裏面側を研削して該ウェーハの厚さが該仕上げ厚さとなるまで該ウェーハを薄化することにより、該レーザー加工溝を該ウェーハの裏面側に露出させて該ウェーハを複数のデバイスチップに分割する研削ステップと、
該ウェーハの裏面側にプラズマ状態のガスを供給し、複数の該デバイスチップの裏面側及び側部に形成されている加工歪みを除去する加工歪み除去ステップと、を備え、
該加工歪み除去ステップでは、該レーザー加工溝の周辺に形成されている熱影響層を除去することを特徴とするウェーハの加工方法。 - 複数のストリートによって区画された複数の領域に配置された複数のデバイスを構成する機能層を表面側に有するウェーハの加工方法であって、
該ウェーハに対して吸収性を有するレーザービームを該ストリートに沿って照射することにより、該ストリートに沿って該機能層を除去しつつ、該ストリートに沿ってレーザー加工溝を形成して該ウェーハを複数のデバイスチップに分割するレーザー加工ステップと、
該レーザー加工ステップの実施後、該ウェーハの表面側に保護部材を貼着する保護部材貼着ステップと、
該保護部材貼着ステップの実施後、該ウェーハの裏面側にプラズマ状態のガスを供給し、該レーザー加工溝の周辺に形成されている熱影響層を除去する熱影響層除去ステップと、を備えることを特徴とするウェーハの加工方法。
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CN202010933777.9A CN112490190A (zh) | 2019-09-12 | 2020-09-08 | 晶片的加工方法 |
TW109130897A TWI846946B (zh) | 2019-09-12 | 2020-09-09 | 晶圓加工方法 |
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JP2018156973A (ja) * | 2017-03-15 | 2018-10-04 | 株式会社ディスコ | ウェーハの加工方法 |
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SG10202008650UA (en) | 2021-04-29 |
US20210082763A1 (en) | 2021-03-18 |
DE102020211446A1 (de) | 2021-03-18 |
TW202111793A (zh) | 2021-03-16 |
CN112490190A (zh) | 2021-03-12 |
US11456213B2 (en) | 2022-09-27 |
KR20210031604A (ko) | 2021-03-22 |
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