JP2021034568A - Package for optical sensor, multi-cavity wiring board, optical sensor device, and electronic module - Google Patents

Package for optical sensor, multi-cavity wiring board, optical sensor device, and electronic module Download PDF

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JP2021034568A
JP2021034568A JP2019153312A JP2019153312A JP2021034568A JP 2021034568 A JP2021034568 A JP 2021034568A JP 2019153312 A JP2019153312 A JP 2019153312A JP 2019153312 A JP2019153312 A JP 2019153312A JP 2021034568 A JP2021034568 A JP 2021034568A
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recess
optical sensor
light emitting
package
light receiving
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JP7257288B2 (en
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鬼塚　善友
Yoshitomo Onizuka
善友 鬼塚
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Kyocera Corp
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Abstract

To provide a package for an optical sensor that can reduce noise light radiated from a light emitting element to a light receiving element (cross talk) to prevent a reduction in detection accuracy and a malfunction.SOLUTION: A package 100 for an optical sensor is an insulating substrate 101. The insulating substrate 101 has a first surface 102, a first concave part 104 that opens in the first surface 102 and has a light emitting element 106 located therein, a second concave part 105 that opens in the first surface 102, is located side by side with the first concave part 104, and has a light receiving element 107 located therein, and a partition part 108 that is located between the first concave part 104 and the second concave part 105. The partition part 108 has a projection 114 that projects toward the first concave part 104 in plan view of the first surface 102.SELECTED DRAWING: Figure 1

Description

本発明は、センサ素子が搭載される光センサ用パッケージ、多数個取り配線基板、光センサ装置および電子モジュールに関するものである。 The present invention relates to a package for an optical sensor on which a sensor element is mounted, a multi-component wiring board, an optical sensor device, and an electronic module.

従来、携帯端末、スマートフォン等の携帯端末の電子機器において、ユーザーの顔と携帯端末の距離を検知するために、近接センサ装置等の光センサ装置が用いられている。この光センサ装置として、例えば、赤外線発光素子等の発光素子、および赤外線受光素子等の受光素子が基板の搭載部に搭載されたものが用いられる。このような光センサ装置は、例えば基板上に、赤外線発光素子等が搭載される発光素子用の搭載部と、赤外線受光素子等が搭載される受光素子用の搭載部の２つの搭載部が互いに隣接して位置している（特許文献１を参照。）。 Conventionally, in electronic devices of mobile terminals such as mobile terminals and smartphones, optical sensor devices such as proximity sensor devices have been used to detect the distance between the user's face and the mobile terminal. As this optical sensor device, for example, a light emitting element such as an infrared light emitting element and a light receiving element such as an infrared light receiving element mounted on a mounting portion of a substrate are used. In such an optical sensor device, for example, two mounting portions, a mounting portion for a light emitting element on which an infrared light emitting element or the like is mounted and a mounting portion for a light receiving element on which an infrared light receiving element or the like is mounted, are attached to each other. They are located adjacent to each other (see Patent Document 1).

特開2014-232852号公報Japanese Unexamined Patent Publication No. 2014-232852

しかしながら、このような光センサ装置は、例えば携帯端末がスマートフォンの場合、スマートフォンを保護する透光性のカバーの内側に配置される場合があり、光センサ装置は発光素子からの光がカバーを透過して物体を検知する必要がある。このように、光センサ装置がカバーの内側に配置される場合、発光素子からの光はカバーを透過して物体側へ照射されるが、パッケージ内において、一部の光がカバーに反射して受光素子に向かうノイズ光（クロストーク）となり、検知精度が低下したり、誤動作が発生する可能性があった。 However, such an optical sensor device may be arranged inside a translucent cover that protects the smartphone, for example, when the mobile terminal is a smartphone, and the optical sensor device allows light from a light emitting element to pass through the cover. It is necessary to detect the object. When the optical sensor device is arranged inside the cover in this way, the light from the light emitting element passes through the cover and is emitted to the object side, but a part of the light is reflected by the cover in the package. It becomes noise light (cross talk) toward the light receiving element, which may reduce the detection accuracy or cause a malfunction.

本開示の電子部品搭載用パッケージは、絶縁基体であり、該絶縁基体が、第１面と、該第１面側に開口し、発光素子が位置する第１凹部と、前記第１面側に開口し、前記第１凹部に並んで位置し、受光素子が位置する第２凹部と、前記第１凹部と前記第２凹部との間に位置する仕切り部と、を有し、該仕切り部は、前記第１面の平面視において前記第１凹部に向かって突出した凸部を有している。 The electronic component mounting package of the present disclosure is an insulating substrate, and the insulating substrate opens on the first surface, the first surface side, and the first concave portion where the light emitting element is located, and the first surface side. It has a second recess that is open and is located side by side with the first recess and where the light receiving element is located, and a partition that is located between the first recess and the second recess, and the partition has a partition. , Has a convex portion protruding toward the first concave portion in a plan view of the first surface.

本開示の多数個取り配線基板は、上記に記載の光センサ用パッケージが、縦横に位置している。 In the multi-component wiring board of the present disclosure, the optical sensor package described above is located vertically and horizontally.

本開示の光センサ装置は、上記に記載の光センサ用パッケージと、上記に記載の光センサ用パッケージに搭載された発光素子、および受光素子とを有している。 The optical sensor device of the present disclosure includes the above-mentioned optical sensor package, a light emitting element mounted on the above-mentioned optical sensor package, and a light receiving element.

本開示の電子モジュールは、接続パッドを有するモジュール用基板と、前記接続パッドに接合材を介して接続された上記に記載の光センサ装置とを有している。 The electronic module of the present disclosure includes a module substrate having a connection pad and the optical sensor device described above connected to the connection pad via a bonding material.

本開示の光センサ用パッケージによれば、クロストークによる検出精度の低下を抑制し、小型化が可能な光センサ用パッケージを提供できる。 According to the package for an optical sensor of the present disclosure, it is possible to provide a package for an optical sensor that can suppress a decrease in detection accuracy due to crosstalk and can be miniaturized.

本開示の多数個取り配線基板によれば、誤検知を抑制できる光センサ用パッケージを効率よく製造できる多数個取り配線基板を提供できる。 According to the multi-cavity wiring board of the present disclosure, it is possible to provide a multi-cavity wiring board capable of efficiently manufacturing a package for an optical sensor capable of suppressing false detection.

本開示の光センサ装置によれば、検知対象の近接状態を高精度に検出できる光センサ装置を提供できる。 According to the optical sensor device of the present disclosure, it is possible to provide an optical sensor device capable of detecting a proximity state of a detection target with high accuracy.

本開示の電子モジュールによれば、検知対象の近接状態を高精度に検出できる光センサ装置を用いて、動作信頼性が高い電子モジュールを提供できる。 According to the electronic module of the present disclosure, it is possible to provide an electronic module with high operation reliability by using an optical sensor device capable of detecting a proximity state of a detection target with high accuracy.

本開示の光センサ用パッケージ、光センサ装置を示す上面図である。It is a top view which shows the optical sensor package and an optical sensor apparatus of this disclosure. 図１のＡ−Ａ線における光センサ用パッケージ、光センサ装置、電子モジュールの断面図である。It is sectional drawing of the optical sensor package, an optical sensor device, and an electronic module in line AA of FIG. 本開示の光センサ用パッケージ、光センサ装置を示す上面図である。It is a top view which shows the optical sensor package and an optical sensor apparatus of this disclosure. 図３のＢ−Ｂ線における光センサ用パッケージ、光センサ装置、電子モジュールの断面図である。It is sectional drawing of the optical sensor package, an optical sensor device, and an electronic module in line BB of FIG. 図３のＣ−Ｃ線における光センサ用パッケージ、光センサ装置、電子モジュールの断面図である。It is sectional drawing of the optical sensor package, an optical sensor device, and an electronic module in line CC of FIG. 本開示の多数個取り配線基板を示す平面図である。It is a top view which shows the multi-cavity wiring board of this disclosure. 図６のＸ−Ｘ線における断面図である。It is sectional drawing in XX line of FIG.

本開示の光センサ用パッケージ等について、添付の図面を参照しつつ説明する。 The optical sensor package and the like of the present disclosure will be described with reference to the attached drawings.

図１〜図７において、100は配線基板（光センサ用パッケージ）、101は絶縁基体、102
は第１面、103は第１面と反対側の第２面、104は第１凹部、105は第２凹部、106は発光素子、107は受光素子、108は仕切り部、109は接続導体、110は溝部、111は発光部、112は受光部、113は外部接続導体、200は光センサ装置、201は切り欠き部、202は蓋体、300は電
子モジュール、301はモジュール用基板、302はモジュール用基板上に位置する接続パッド、303は接合材である。 In FIGS. 1 to 7, 100 is a wiring board (package for an optical sensor), 101 is an insulating substrate, and 102.
Is the first surface, 103 is the second surface opposite to the first surface, 104 is the first recess, 105 is the second recess, 106 is the light emitting element, 107 is the light receiving element, 108 is the partition, 109 is the connecting conductor. 110 is a groove, 111 is a light emitting part, 112 is a light receiving part, 113 is an external connecting conductor, 200 is an optical sensor device, 201 is a notch, 202 is a lid, 300 is an electronic module, 301 is a module board, and 302 is. The connection pad 303 located on the module substrate is a bonding material.

光センサ用パッケージは平面視で長方形状であり、図１に示したように配線基板100の
第１面102側に、第１凹部104の底部に位置する第１搭載部104ａと、第２凹部105の底部に位置する第２搭載部105ａが位置しており、この第１搭載部104ａに発光素子106が位置し
、第２搭載部105ａに受光素子107が位置するように、それぞれの素子が各搭載部に搭載されている。 The optical sensor package has a rectangular shape in a plan view, and as shown in FIG. 1, on the first surface 102 side of the wiring board 100, a first mounting portion 104a located at the bottom of the first recess 104 and a second recess 104a. The second mounting portion 105a located at the bottom of the 105 is located, the light emitting element 106 is located on the first mounting portion 104a, and the light receiving element 107 is located on the second mounting portion 105a. It is mounted on each mounting part.

また、配線基板100の第１凹部104の底部、および第２凹部105の底部から第２面103の外表面に位置した外部接続導体113にかけて、接続導体109を含む配線導体（図示せず）が設けられている。第１凹部104の底部に位置する接続導体109に発光素子106が接続され、さ
らに第２凹部105の底部に位置する接続導体109に受光素子107が接続されることにより、
図１〜図３に示すような本開示の光センサ用パッケージ、および光センサ装置200が構成
されている。 Further, from the bottom of the first recess 104 of the wiring board 100 and the bottom of the second recess 105 to the external connecting conductor 113 located on the outer surface of the second surface 103, a wiring conductor (not shown) including the connecting conductor 109 is formed. It is provided. The light emitting element 106 is connected to the connecting conductor 109 located at the bottom of the first recess 104, and the light receiving element 107 is connected to the connecting conductor 109 located at the bottom of the second recess 105.
The package for the optical sensor of the present disclosure as shown in FIGS. 1 to 3 and the optical sensor device 200 are configured.

ここで、発光部111を有する発光素子106は、例えば赤外線、電磁波または超音波等の物理的エネルギーを放射する放射用の素子からなり、受光部112を有する受光素子107は、これらの物理的エネルギーを検知する検知用の素子からなり、発光素子106と受光素子107とが対になって用いられる。配線基板100の第１凹部104の底部に位置する第１搭載部104ａ
に発光素子106が搭載され、また第２凹部105の底部に位置する第２搭載部105ａに受光部1
12が位置するように受光素子107が搭載される。 Here, the light emitting element 106 having the light emitting unit 111 is composed of a radiation element that radiates physical energy such as infrared rays, electromagnetic waves, or ultrasonic waves, and the light receiving element 107 having the light receiving unit 112 has these physical energies. The light emitting element 106 and the light receiving element 107 are used as a pair. First mounting portion 104a located at the bottom of the first recess 104 of the wiring board 100
The light emitting element 106 is mounted on the second mounting portion 105a, and the light receiving portion 1 is mounted on the second mounting portion 105a located at the bottom of the second recess 105.
The light receiving element 107 is mounted so that 12 is located.

光センサ装置200において、第１搭載部104ａに搭載された発光素子106から、例えば赤
外線が外部に向けて放射される。光センサ装置200の外部、つまり赤外線が放射され、対
向する方向の近くに物体（検知対象）が存在している場合、この赤外線が物体で反射され、第２凹部105の底部に位置する受光部112で検知される。これとは反対に、物体が存在していない場合、放射された赤外線は反射されず検知されないため、物体が存在していないと判定される。 In the optical sensor device 200, for example, infrared rays are radiated to the outside from the light emitting element 106 mounted on the first mounting unit 104a. When an object (detection target) exists outside the optical sensor device 200, that is, when infrared rays are emitted and in the opposite direction, the infrared rays are reflected by the object and the light receiving portion located at the bottom of the second recess 105. Detected at 112. On the contrary, when the object does not exist, the emitted infrared rays are not reflected and are not detected, so that it is determined that the object does not exist.

なお、以下の説明においては、主に発光素子106および受光素子107が赤外線発光素子、またはその検知が可能な赤外線受光素子である場合を例に挙げて説明する。発光素子106
は赤外線発光素子等であり、受光素子107は赤外線受光素子等である。一対のセンサ素子
である発光素子106および受光素子107は、ガリウム−ヒ素等の半導体材料からなる平面視が四角形状の素子本体と、これらの素子本体の上面にそれぞれ発光部111、受光部112が設けられており、光電変換による発光または受光が行なわれる機能部品として動作する。接続導体109等の配線導体を介して発光素子106に供給される電力が、発光素子106で光電変
換されることにより赤外線が放射される。物体で反射された赤外線が、受光部112で検知
されて電気信号に変換される。電気信号は配線導体（図示せず）を介して、例えば検知回路やディスプレイ表示用回路等の外部電気回路（図示せず）に送信される。 In the following description, a case where the light emitting element 106 and the light receiving element 107 are infrared light emitting elements or infrared light receiving elements capable of detecting them will be mainly described as an example. Light emitting element 106
Is an infrared light emitting element or the like, and light receiving element 107 is an infrared light receiving element or the like. The light emitting element 106 and the light receiving element 107, which are a pair of sensor elements, have an element body made of a semiconductor material such as gallium-arsenide and having a rectangular plan view, and a light emitting unit 111 and a light receiving unit 112 on the upper surfaces of these element bodies, respectively. It is provided and operates as a functional component that emits light or receives light by photoelectric conversion. Infrared rays are emitted by photoelectric conversion of the electric power supplied to the light emitting element 106 via the wiring conductor such as the connecting conductor 109 by the light emitting element 106. Infrared rays reflected by an object are detected by the light receiving unit 112 and converted into an electric signal. The electric signal is transmitted to an external electric circuit (not shown) such as a detection circuit or a display display circuit via a wiring conductor (not shown).

配線基板100は、発光素子106と受光素子107を搭載するための容器となる部分であり、
また発光素子106に電力を供給するための配線導体、および受光素子107を外部電気回路に電気的に接続するための配線導体を設けるための基体となる部分である。よって、配線基板100には発光用、および受光用の一対のセンサ用素子を搭載するための一対の搭載部と
なる第１凹部104の底部に位置する第１搭載部104ａ、および第２凹部105の底部に位置す
る第２搭載部105ａが設けられている。また、発光部111が設けられた発光素子106は、例
えば低融点ろう材またはワイヤーボンディング等により、第１凹部104の底部に位置する
接続導体109に接続されている。さらに、受光部112が設けられる受光素子107は、例えば
低融点ろう材、または導電性接合材等の接合材を介して、第２凹部105の底部に設けられ
た接続導体109に接続されている。 The wiring board 100 is a portion that serves as a container for mounting the light emitting element 106 and the light receiving element 107.
Further, it is a portion serving as a base for providing a wiring conductor for supplying electric power to the light emitting element 106 and a wiring conductor for electrically connecting the light receiving element 107 to an external electric circuit. Therefore, the first mounting portion 104a and the second recess 105 located at the bottom of the first recess 104, which is a pair of mounting portions for mounting a pair of sensor elements for light emission and light reception on the wiring board 100. A second mounting portion 105a located at the bottom of the is provided. Further, the light emitting element 106 provided with the light emitting unit 111 is connected to the connecting conductor 109 located at the bottom of the first recess 104 by, for example, a low melting point brazing material or wire bonding. Further, the light receiving element 107 provided with the light receiving portion 112 is connected to the connecting conductor 109 provided at the bottom of the second recess 105 via, for example, a low melting point brazing material or a bonding material such as a conductive bonding material. ..

配線基板100は、絶縁基体101となる部分が例えば酸化アルミニウム質焼結体からなる場合であれば、酸化アルミニウムおよび酸化ケイ素等の原料粉末に適当な有機バインダーおよび有機溶剤とともに混練して製作されたセラミックスラリーを、シート状に成形して複数のセラミックグリーンシートを製作し、これらのセラミックグリーンシートを積層した後に還元雰囲気中にて約1600℃の温度で焼成することによって製作することができる。 The wiring substrate 100 was manufactured by kneading a raw material powder such as aluminum oxide and silicon oxide with an appropriate organic binder and an organic solvent when the portion to be the insulating substrate 101 is made of, for example, an aluminum oxide sintered body. It can be produced by molding a ceramic slurry into a sheet to produce a plurality of ceramic green sheets, laminating these ceramic green sheets, and then firing at a temperature of about 1600 ° C. in a reducing atmosphere.

配線基板100は、図４、図５に示したように、複数の配線基板領域121が配列された母基板として形成されてもよい。そして、配線導体がタングステンやモリブデン等からなる場合であれば、露出する配線導体にニッケルや金等のめっき層が被着されたのち、このような母基板の主面に設けられた分割溝に沿って応力を加えて母基板を分割することにより、図１〜図３で示すような光センサ用パッケージを構成する配線基板100が製作される。 As shown in FIGS. 4 and 5, the wiring board 100 may be formed as a mother board in which a plurality of wiring board regions 121 are arranged. If the wiring conductor is made of tungsten, molybdenum, or the like, a plating layer such as nickel or gold is adhered to the exposed wiring conductor, and then the dividing groove provided on the main surface of the mother substrate is formed. By applying stress along the line to divide the mother substrate, the wiring board 100 constituting the optical sensor package as shown in FIGS. 1 to 3 is manufactured.

配線基板100に設けられた第１凹部104、第２凹部105は、例えば次のようにして形成す
ることができる。配線基板100の第１面102となるセラミックグリーンシートの一部に、打ち抜き加工等の方法で、例えば四角形状の孔を形成して、２つの長方形状の孔が形成されたセラミックグリーンシートを製作する。なお、孔は長方形状に限定されず、円形、楕円状、長孔状、矩形状等でもよく、さらに長方形状である場合、角部が面取りされていてもよい。これらの２つの孔が第１搭載部104ａの第１凹部104、および第２搭載部105ａの第
２凹部105となる。また、平面視でこれらの２つの孔の間に仕切り部108となるセラミック
グリーンシートの一部が位置している。そして、第２面103となるセラミックグリーンシ
ートの上に、第１面102となるセラミックグリーンシートを積層して密着させることによ
り、このような光センサ用パッケージとなる配線基板100を製作することができる。 The first recess 104 and the second recess 105 provided on the wiring board 100 can be formed, for example, as follows. A ceramic green sheet in which, for example, rectangular holes are formed by a method such as punching is formed on a part of the ceramic green sheet to be the first surface 102 of the wiring board 100, and two rectangular holes are formed. To do. The hole is not limited to a rectangular shape, and may be a circular shape, an elliptical shape, an elongated hole shape, a rectangular shape, or the like, and if the hole is a rectangular shape, the corner portion may be chamfered. These two holes serve as a first recess 104 of the first mounting portion 104a and a second recess 105 of the second mounting portion 105a. Further, a part of the ceramic green sheet serving as the partition portion 108 is located between these two holes in a plan view. Then, by laminating and adhering the ceramic green sheet to be the first surface 102 on the ceramic green sheet to be the second surface 103, it is possible to manufacture the wiring board 100 to be such a package for an optical sensor. it can.

なお、上記の説明では酸化アルミニウム等の原料粉末に適当な有機バインダー、および有機溶剤とともに混練して製作されたセラミックスラリーから、セラミックグリーンシートを製作し、これら複数のセラミックグリーンシートを積層することにより、このような光センサ用パッケージ構造を製作する例を示したが、配線基板100を有機樹脂材料から構
成してもよい。 In the above description, a ceramic green sheet is produced from a ceramic slurry produced by kneading a raw material powder such as aluminum oxide with an appropriate organic binder and an organic solvent, and these plurality of ceramic green sheets are laminated. Although an example of manufacturing such a package structure for an optical sensor has been shown, the wiring substrate 100 may be made of an organic resin material.

本開示の光センサ用パッケージは、絶縁基体101であり、絶縁基体101が、第１面102と
、第１面102側に開口し、発光素子106が位置する第１凹部104と、第１面102側に開口し、第１凹部104に並んで位置し、受光素子107が位置する第２凹部105と、第１凹部104と第２凹部105との間に位置する仕切り部108とを有し、仕切り部108は、第１面102の平面視において第１凹部104に向かって突出した凸部114を有している。このような構成により、クロストークによる検出精度の低下を抑制し、小型化が可能な光センサ用パッケージを提供できる。つまり、発光素子106から照射された光の一部は、平面視で第１凹部104側に備えられた凸部114により遮蔽されるため、発光素子106からの物体を介さないノイズ光（クロストーク）が、第２凹部105の下側に位置する受光素子107に照射され難く、誤検知や誤動作を抑制できる。 The package for an optical sensor of the present disclosure is an insulating base 101, and the insulating base 101 opens on the first surface 102 and the first surface 102 side, and the first concave portion 104 on which the light emitting element 106 is located and the first surface. It has a second recess 105 that opens to the 102 side, is located side by side with the first recess 104, and where the light receiving element 107 is located, and a partition portion 108 that is located between the first recess 104 and the second recess 105. The partition portion 108 has a convex portion 114 protruding toward the first concave portion 104 in a plan view of the first surface 102. With such a configuration, it is possible to provide a package for an optical sensor that can suppress a decrease in detection accuracy due to crosstalk and can be miniaturized. That is, since a part of the light emitted from the light emitting element 106 is shielded by the convex portion 114 provided on the first concave portion 104 side in a plan view, noise light (cross talk) from the light emitting element 106 does not pass through an object. ) Is difficult to irradiate the light receiving element 107 located below the second recess 105, and erroneous detection and malfunction can be suppressed.

また、第２凹部105側に凹部115を備えており、発光素子106から照射された後、物体で
反射された光が、第２凹部105の下側に位置する受光素子107に照射され易くなり、受光素子107の受光性が向上するため、物体の検知範囲を広いものとすることができる。 Further, the recess 115 is provided on the second recess 105 side, and after being irradiated from the light emitting element 106, the light reflected by the object is easily irradiated to the light receiving element 107 located below the second recess 105. Since the light receiving property of the light receiving element 107 is improved, the detection range of the object can be widened.

このような光センサ用パッケージを図１に示す。光センサ用パッケージは、例えば平面視で長方形状であり、図１に示したように、配線基板100の第１面102側に第１凹部104の
底部に位置する第１搭載部104ａと、第２凹部105の底部に位置する第２搭載部105ａが位
置している。そして、第１搭載部104ａに１つの発光素子106が位置し、第２搭載部105ａ
に１つの受光素子107が位置するように、それぞれの素子が各搭載部に搭載されている。
また、第１凹部104と第２凹部105との間には仕切り部108が位置しており、仕切り部108は第１凹部104側に突出した凸部114と第２凹部105側に凹んだ凹部115を含んでいる。 A package for such an optical sensor is shown in FIG. The optical sensor package has, for example, a rectangular shape in a plan view, and as shown in FIG. 1, has a first mounting portion 104a located at the bottom of the first recess 104 on the first surface 102 side of the wiring board 100, and a first mounting portion 104a. The second mounting portion 105a located at the bottom of the two recesses 105 is located. Then, one light emitting element 106 is located on the first mounting portion 104a, and the second mounting portion 105a
Each element is mounted on each mounting portion so that one light receiving element 107 is located on the surface.
Further, a partition portion 108 is located between the first recess 104 and the second recess 105, and the partition 108 is a recess 114 protruding toward the first recess 104 and a recess recessed toward the second recess 105. Contains 115.

仕切り部108は、第１凹部104と第２凹部105とが並んだ方向に垂直な方向の中央部に凸
部114が位置している。このような構成により、例えば発光素子106の発光部111と、受光
素子107の受光部112とを通る仮想直線上に凸部114が位置するものとなり、より効果的に
ノイズ光が遮蔽されるため、図２に断面視で示したように、発光素子106からの物体を介
さないノイズ光（クロストーク）が、第２凹部105の下側に位置する受光素子107に照射され難い。 In the partition portion 108, the convex portion 114 is located at the central portion in the direction perpendicular to the direction in which the first concave portion 104 and the second concave portion 105 are arranged side by side. With such a configuration, for example, the convex portion 114 is located on a virtual straight line passing through the light emitting unit 111 of the light emitting element 106 and the light receiving unit 112 of the light receiving element 107, and the noise light is more effectively shielded. As shown in a cross-sectional view in FIG. 2, noise light (crosstalk) from the light emitting element 106 that does not pass through an object is unlikely to be applied to the light receiving element 107 located below the second recess 105.

凸部114は、例えば図１に示したように、平面視で曲線状から構成されており、発光素
子106の発光部111と受光素子107の受光部112とを直線で結んだ仮想線と仕切り部108が交
わる領域、つまり仕切り部108の中央部において、凸部114は最も凸部の突出（第１凹部104の仮想外縁Ｌ１と凸部114の外縁との距離）が大きく、仕切り部108の両端部にかけて漸
次凸部114の突出が小さくなるように位置している。また、凹部115は、例えば図１に示したように曲線状で構成されており、平面視で発光素子106の発光部111と受光素子107の受
光部112とを直線で結んだ仮想線と仕切り部108が交わる領域、つまり仕切り部108の中央
部において、最も凹部115の凹み（第２凹部105の仮想外縁Ｌ２と凹部115の外縁との距離
）が大きく、仕切り部108の両端部にかけて漸次凹部115の凹みが小さくなるように位置している。 As shown in FIG. 1, for example, the convex portion 114 is formed in a curved shape in a plan view, and is partitioned from a virtual line connecting the light emitting portion 111 of the light emitting element 106 and the light receiving portion 112 of the light receiving element 107 with a straight line. In the region where the portions 108 intersect, that is, in the central portion of the partition portion 108, the convex portion 114 has the largest protrusion of the convex portion (distance between the virtual outer edge L1 of the first concave portion 104 and the outer edge of the convex portion 114), and the partition portion 108 has the largest protrusion. It is positioned so that the protrusion of the convex portion 114 gradually becomes smaller toward both ends. Further, the recess 115 is formed in a curved shape as shown in FIG. 1, for example, and is partitioned from a virtual line connecting the light emitting portion 111 of the light emitting element 106 and the light receiving portion 112 of the light receiving element 107 with a straight line in a plan view. In the region where the portions 108 intersect, that is, in the central portion of the partition portion 108, the recess of the recess 115 (the distance between the virtual outer edge L2 of the second recess 105 and the outer edge of the recess 115) is the largest, and the recess gradually extends to both ends of the partition 108. It is located so that the dent of 115 becomes smaller.

このような構成により、発光素子106の発光部111と、受光素子107の受光部112との最短距離の領域でより効果的に光が遮蔽されるため、図２に断面視で示したように、発光素子106からの物体を介さない光（クロストーク）が、第２凹部105の下側に位置する受光素子107に照射され難い。仕切り部108の形状は上記の例に限定されず、凸部114や凹部115が複数の直線を結んだ形状で構成されていてもよい。さらに、複数の凸部114と複数の凹部115を含む仕切り部108で構成されていてもよい。なお、配線基板100の外縁に、配線導体を引き回すため等により、切り欠き部201を位置させてもよい。 With such a configuration, light is more effectively shielded in the region of the shortest distance between the light emitting portion 111 of the light emitting element 106 and the light receiving portion 112 of the light receiving element 107, and therefore, as shown in FIG. It is difficult for the light (cross talk) from the light emitting element 106 that does not pass through an object to irradiate the light receiving element 107 located below the second recess 105. The shape of the partition portion 108 is not limited to the above example, and the convex portion 114 and the concave portion 115 may be formed by connecting a plurality of straight lines. Further, it may be composed of a partition portion 108 including a plurality of convex portions 114 and a plurality of concave portions 115. The cutout portion 201 may be positioned on the outer edge of the wiring board 100 in order to route the wiring conductor or the like.

また、仕切り部108は、第１凹部104側に傾斜している。このような構成により、クロストークによる検出精度の低下を効果的に抑制し、小型化が可能な光センサ用パッケージを提供できる。つまり、発光素子106から照射された光の一部は、第１凹部104側に傾斜している仕切り部108によって、仕切り部108が発光素子106に近いものとなり、より効果的に
遮蔽されるため、発光素子106からの物体を介さない光（クロストーク）が、第２凹部105の下側に位置する受光素子107に照射され難く、誤検知や誤動作を抑制できる。 Further, the partition portion 108 is inclined toward the first recess 104 side. With such a configuration, it is possible to provide a package for an optical sensor that can effectively suppress a decrease in detection accuracy due to crosstalk and can be miniaturized. That is, a part of the light emitted from the light emitting element 106 is more effectively shielded by the partition portion 108 inclined toward the first concave portion 104 because the partition portion 108 becomes closer to the light emitting element 106. The light (crosstalk) from the light emitting element 106 that does not pass through an object is unlikely to be applied to the light receiving element 107 located below the second recess 105, and erroneous detection and malfunction can be suppressed.

図３に平面図で示したように、第１凹部104の底部に位置する第１搭載部104ａには、発光素子106が搭載されており、図４、図５に断面視で示したように、発光素子106の発光部111から光が照射される。照射された光は、カバーを透過して物体側へ照射されるが、光
センサ用パッケージの内部において、一部の光がカバーに反射して受光素子107に向かう
クロストーク（ノイズ光）となる場合があった。しかし、クロストークが、この第１凹部104側に傾斜した仕切り部108でより効果的に遮蔽されるため、発光素子106からの物体を
介さない光（クロストーク）が、第２凹部105の下側に位置する受光素子107に照射され難く、誤検知や誤動作を効果的に抑制できる。 As shown in the plan view of FIG. 3, the light emitting element 106 is mounted on the first mounting portion 104a located at the bottom of the first recess 104, and as shown in cross-sectional views in FIGS. 4 and 5. , Light is emitted from the light emitting unit 111 of the light emitting element 106. The emitted light passes through the cover and is emitted to the object side, but inside the optical sensor package, some of the light is reflected by the cover and becomes crosstalk (noise light) toward the light receiving element 107. There was a case. However, since the crosstalk is more effectively shielded by the partition portion 108 inclined toward the first recess 104, the light (crosstalk) from the light emitting element 106 that does not pass through the object is under the second recess 105. It is difficult for the light receiving element 107 located on the side to be irradiated, and false detection and malfunction can be effectively suppressed.

通常、ノイズ光（クロストーク）を抑制するためには、仕切り部108の遮蔽効果を高め
るために、平面視で発光素子106と受光素子107との距離を大きくしたり、発光素子106が
搭載される第１凹部104の深さを大きくする構造が採用されるが、このように第１凹部104側に傾斜した仕切り部108を位置させたことにより、第１凹部104の深さを大きくしなくても、同様の効果を得られる。つまり、図４で示したように、発光素子106の発光部111から照射された光の一部が、第１凹部104側に傾斜した仕切り部108で遮蔽されるため、カバーに反射したクロストークが、受光素子107の受光部112に照射され難いためである。そして、発光素子106の発光部111と受光素子107の受光部112とを直線で結んだ仮想線と仕切り部108が交わる領域、つまり仕切り部108の中央部において、凸部114は最も仕切り部108の傾斜が大きければ、発光素子106の発光部111と、受光素子107の受光部112との最短距離の領域でより効果的に光が遮蔽されるため、図４に断面視で示したように、発光素子106から
の物体を介さない光（クロストーク）が、第２凹部105の下側に位置する受光素子107に照射され難い。なお、仕切り部108の形状は上記の例に限定されず、凸部114が複数の直線を結んだ形状で構成されていてもよい。 Normally, in order to suppress noise light (crosstalk), in order to enhance the shielding effect of the partition portion 108, the distance between the light emitting element 106 and the light receiving element 107 is increased in a plan view, or the light emitting element 106 is mounted. A structure is adopted in which the depth of the first recess 104 is increased, but by locating the partition portion 108 inclined toward the first recess 104 in this way, the depth of the first recess 104 is not increased. However, the same effect can be obtained. That is, as shown in FIG. 4, a part of the light emitted from the light emitting portion 111 of the light emitting element 106 is shielded by the partition portion 108 inclined toward the first concave portion 104, so that the crosstalk reflected on the cover However, it is difficult to irradiate the light receiving portion 112 of the light receiving element 107. Then, in the region where the virtual line connecting the light emitting portion 111 of the light emitting element 106 and the light receiving portion 112 of the light receiving element 107 with a straight line and the partition portion 108 intersect, that is, the central portion of the partition portion 108, the convex portion 114 is the most partition portion 108. If the inclination of the light emitting element 106 is large, the light is more effectively shielded in the region of the shortest distance between the light emitting portion 111 of the light emitting element 106 and the light receiving portion 112 of the light receiving element 107. It is difficult for the light (crosstalk) from the light emitting element 106 that does not pass through an object to be applied to the light receiving element 107 located below the second recess 105. The shape of the partition portion 108 is not limited to the above example, and the convex portion 114 may be formed by connecting a plurality of straight lines.

また、本開示の光センサ用パッケージは、仕切り部108が、第１凹部104と第２凹部105
とが並んだ方向に垂直な方向の両端部から中央部にかけて漸次突出が大きくなっている。このような構成により、例えば、ノイズ光が発光素子106の発光部111から受光素子107の
受光部112に照射され難い仕切り部108の両端部側から、仕切り部108の中央部に近い位置
になるにつれて、ノイズ光が発光素子106の発光部111から受光素子107の受光部112に照射されることをより効果的に抑制することができる。 Further, in the package for the optical sensor of the present disclosure, the partition portion 108 has a first recess 104 and a second recess 105.
The protrusion gradually increases from both ends in the direction perpendicular to the direction in which and are lined up to the center. With such a configuration, for example, noise light is difficult to be emitted from the light emitting portion 111 of the light emitting element 106 to the light receiving portion 112 of the light receiving element 107 from both ends of the partition portion 108 to a position close to the central portion of the partition portion 108. As a result, it is possible to more effectively suppress the noise light from being emitted from the light emitting unit 111 of the light emitting element 106 to the light receiving unit 112 of the light receiving element 107.

また、仕切り部108は、中央部の傾斜が大きく、中央部から両端部にかけて漸次傾斜が
小さい。このような構成により、クロストークによる検出精度の低下をより効果的に抑制し、小型化が可能な光センサ用パッケージを提供できる。つまり、発光素子106から照射
された光の一部は、平面視で第１凹部104側に備えられた凸部114のうち、仕切り部108の
中央部の傾斜が大きい領域でより効果的に遮蔽されるため、発光素子106からの物体を介
さない光（クロストーク）が、第２凹部105の下側に位置する受光素子107により効果的に照射され難くなる。図４で示したように、発光素子106の発光部111から照射された光の一部が傾斜した仕切り部108で遮蔽されるため、光のカバーへの入射角度θ１が大きくなり
、カバーに反射したクロストークが、受光素子107の受光部112に照射され難い。よって、誤検知や誤動作を抑制できる。 Further, the partition portion 108 has a large inclination at the central portion and a small gradual inclination from the central portion to both end portions. With such a configuration, it is possible to provide a package for an optical sensor that can more effectively suppress a decrease in detection accuracy due to crosstalk and can be miniaturized. That is, a part of the light emitted from the light emitting element 106 is more effectively shielded in the region where the central portion of the partition portion 108 has a large inclination among the convex portions 114 provided on the first concave portion 104 side in a plan view. Therefore, it becomes difficult for the light (crosstalk) from the light emitting element 106 that does not pass through the object to be effectively irradiated by the light receiving element 107 located below the second recess 105. As shown in FIG. 4, since a part of the light emitted from the light emitting portion 111 of the light emitting element 106 is shielded by the inclined partition portion 108, the incident angle θ1 to the cover of the light becomes large and is reflected by the cover. It is difficult for the crosstalk to be applied to the light receiving portion 112 of the light receiving element 107. Therefore, false detection and malfunction can be suppressed.

また、図５に示したように、仕切り部108が、中央部から両端部にかけて漸次傾斜が小
さくなっており、発光素子106の発光部111からの光を、傾斜が小さい領域の方向を介して、効率よく物体（検知対象）に照射することができる。ここで、図５で示したように、発光部111から傾斜が小さい領域の方向に照射される光の一部は、カバーへの入射角度θ２
が小さくなり、カバーに反射してクロストークとなるが、平面視で図３に示したように、発光素子106の発光部111から受光素子107の受光部112へ向かう方向ではなく、受光素子107に照射され難い方向であるため、誤検知や誤動作となるクロストークとなり難い。よっ
て、仕切り部108の中央部の傾斜が大きい領域の方向では、クロストークによる誤検知、
誤動作を抑制でき、さらに仕切り部108の両端部にかけて傾斜が小さい領域の方向では、
発光素子106の発光部111からの光を効率よく物体に照射することができ、物体から返ってくる光の強度を高めることができるため、小型化しても、検知精度の低下や誤動作が発生する可能性が低減された光センサ用パッケージを提供できる。 Further, as shown in FIG. 5, the partition portion 108 gradually decreases in inclination from the central portion to both ends, and the light from the light emitting portion 111 of the light emitting element 106 is directed through the direction of the region where the inclination is small. , It is possible to efficiently irradiate an object (detection target). Here, as shown in FIG. 5, a part of the light emitted from the light emitting unit 111 in the direction of the region having a small inclination is incident on the cover at an angle of incidence θ2.
Becomes smaller and is reflected by the cover to cause crosstalk, but as shown in FIG. 3 in a plan view, the light receiving element 107 is not in the direction from the light emitting portion 111 of the light emitting element 106 toward the light receiving portion 112 of the light receiving element 107. Since the direction is difficult to irradiate, crosstalk that causes false detection or malfunction is unlikely to occur. Therefore, in the direction of the region where the inclination of the central portion of the partition portion 108 is large, false detection due to crosstalk,
Malfunctions can be suppressed, and in the direction of the region where the inclination is small toward both ends of the partition 108,
Since the light from the light emitting unit 111 of the light emitting element 106 can be efficiently irradiated to the object and the intensity of the light returned from the object can be increased, the detection accuracy is lowered and the malfunction occurs even if the size is reduced. It is possible to provide a package for an optical sensor with reduced possibility.

また、本開示の態様の光センサ用パッケージは、平面視において、第１凹部104の幅が
、第２凹部105の幅よりも大きい。このような構成により、ノイズ光が、第２凹部105の両側の壁部により遮蔽されやすいものとなり、発光素子106から、受光素子107が搭載される第２凹部105に照射されるのをより抑制することができる。 Further, in the package for an optical sensor according to the present disclosure, the width of the first recess 104 is larger than the width of the second recess 105 in a plan view. With such a configuration, noise light is easily shielded by the walls on both sides of the second recess 105, and the light emitting element 106 is further suppressed from being irradiated to the second recess 105 on which the light receiving element 107 is mounted. can do.

また、第１凹部104側に傾斜した仕切り部108は、容易に実現可能である。つまり、第１凹部104の幅Ｗ１を、第２凹部105の幅Ｗ２よりも大きくし、光センサ用パッケージとなる配線基板100を製造する際に、母基板120への金型やカッター刃等の挿入時による応力により、壁幅が大きく剛性の高い第２凹部105側から、壁幅が小さく剛性の低い第１凹部104側に仕切り部108が傾斜し易くなり、中央部の傾斜が大きく、中央部から両端部にかけて漸
次傾斜が小さい構成の仕切り部108を、容易に実現できる。なお、壁幅とは、平面視で各
凹部の長辺側に沿った内側面から配線基板100の長辺側の外側面までの幅を示す。 Further, the partition portion 108 inclined toward the first recess 104 side can be easily realized. That is, when the width W1 of the first recess 104 is made larger than the width W2 of the second recess 105 and the wiring board 100 to be the package for the optical sensor is manufactured, the mold, the cutter blade, etc. to the mother board 120 are used. Due to the stress at the time of insertion, the partition portion 108 tends to incline from the second concave portion 105 side, which has a large wall width and high rigidity, to the first concave portion 104 side, which has a small wall width and low rigidity. A partition portion 108 having a structure in which the inclination is gradually reduced from the portion to both ends can be easily realized. The wall width indicates the width from the inner side surface along the long side side of each concave portion to the outer side surface on the long side side of the wiring board 100 in a plan view.

光センサ用パッケージとなる配線基板100は、生産性や、各種電子部品を搭載するとき
の作業性等を良好に確保するために、例えば図６で示すような、それぞれが光センサ用パッケージとなる複数の配線基板領域121（配線基板100となる領域）が、母基板120に配列
された多数個取り配線基板の形態で製作される。母基板120を配線基板領域121の境界122
に沿って分割することにより、個片の光センサ用パッケージが製作される。 The wiring board 100, which is a package for an optical sensor, is a package for an optical sensor, as shown in FIG. 6, for example, in order to ensure good productivity and workability when mounting various electronic components. A plurality of wiring board areas 121 (areas to be the wiring board 100) are manufactured in the form of a large number of wiring boards arranged on the mother board 120. Boundary 122 of wiring board area 121 with mother board 120
By dividing along the above, individual packages for optical sensors are manufactured.

このような母基板120は、配線基板領域121の境界122に沿って分割溝124が位置している。分割溝124に沿って曲げ応力が加えられ、破断が生じることにより母基板120の分割が行なわれる。母基板120となるセラミックグリーンシート積層体の第１面102に位置する第１凹部104、および第２凹部105を囲繞する配線基板領域121の境界に、金型やカッター刃等
を押圧することにより、第１面102に分割溝124が位置した構成となる。セラミックグリーンシート積層体へのカッター刃の挿入にともない、配線基板領域121の境界は、刃先の両
側に押圧されて切り開かれる。その結果、配線基板領域121の外縁部が変形する。 In such a mother substrate 120, the dividing groove 124 is located along the boundary 122 of the wiring board region 121. Bending stress is applied along the dividing groove 124 to cause breakage, so that the mother substrate 120 is divided. By pressing a mold, a cutter blade, or the like against the boundary between the first recess 104 located on the first surface 102 of the ceramic green sheet laminate serving as the mother substrate 120 and the wiring board area 121 surrounding the second recess 105. , The split groove 124 is located on the first surface 102. As the cutter blade is inserted into the ceramic green sheet laminate, the boundary of the wiring board area 121 is pressed and cut open on both sides of the blade edge. As a result, the outer edge of the wiring board area 121 is deformed.

なお、母基板120となるセラミックグリーンシート積層体の仕切り部108の第１面102に
バインダー等を塗布しておき、バインダー中の溶剤が仕切り部108となるセラミックグリ
ーンシート積層体を軟化させることにより、この部分が、バインダーが塗布されていないセラミックグリーンシート積層体よりも変形し易くなるようにしておけば、刃先の押圧による配線基板領域121の外縁部の変形が促進されて、第１凹部104側に傾斜した仕切り部108を、さらに容易に実現できる。 A binder or the like is applied to the first surface 102 of the partition portion 108 of the ceramic green sheet laminate to be the mother substrate 120, and the solvent in the binder softens the ceramic green sheet laminate to be the partition portion 108. If this portion is made more easily deformed than the ceramic green sheet laminate to which the binder is not applied, the deformation of the outer edge portion of the wiring board region 121 due to the pressing of the cutting edge is promoted, and the first recess 104 The partition portion 108 inclined to the side can be realized more easily.

母各配線基板領域121の長辺側へのカッター刃の挿入時においては、カッター刃を挿入
する間隔が狭く、セラミックグリーンシート積層体へのカッター刃の挿入にともなう、配線基板領域121の外縁部の変形が起こり易い。つまり、第１凹部104、および第２凹部105
のそれぞれにおいて、刃先に押圧されて開口部の幅が狭くなるように変形する。さらに、平面視において、第１凹部104の幅が、第２凹部105の幅よりも大きいことから、母基板120へのカッター刃の挿入により、壁幅が大きく剛性の高い第２凹部105側から、壁幅が小さく剛性の低い第１凹部104側に仕切り部108が傾斜するように、仕切り部108が変形し易く
なる。 When the cutter blade is inserted into the long side of each wiring board area 121, the interval for inserting the cutter blade is narrow, and the outer edge of the wiring board area 121 is inserted as the cutter blade is inserted into the ceramic green sheet laminate. Is prone to deformation. That is, the first recess 104 and the second recess 105
Each of the above is pressed by the cutting edge and deformed so that the width of the opening becomes narrower. Further, since the width of the first recess 104 is larger than the width of the second recess 105 in a plan view, the wall width is large and the rigidity is high from the side of the second recess 105 by inserting the cutter blade into the mother substrate 120. The partition portion 108 is easily deformed so that the partition portion 108 is inclined toward the first concave portion 104 having a small wall width and low rigidity.

そして、各配線基板領域121において、長辺の両側からカッター刃による応力を受ける
ことにより、中央部の傾斜が大きく、中央部から両端部にかけて漸次傾斜が小さい構成の仕切り部108を容易に実現できる。よって、クロストークによる検出精度の低下をより効
果的に抑制でき、小型化が可能な光センサ用パッケージを容易に製作できる。 Then, in each wiring board region 121, by receiving stress from both sides of the long side by the cutter blade, it is possible to easily realize the partition portion 108 having a structure in which the inclination of the central portion is large and the inclination is gradually small from the central portion to both ends. .. Therefore, it is possible to more effectively suppress the decrease in detection accuracy due to crosstalk, and it is possible to easily manufacture a package for an optical sensor that can be miniaturized.

例えば、図６で示したように、各配線基板領域121の長辺側の境界に、仕切り部108を跨ぐように貫通孔123（配線基板100における溝部110となる部分）を位置させておけば、母
基板120へのカッター刃の挿入により、各配線基板領域121の第２凹部105側の境界におい
て、刃先の押圧による応力が仕切り部108の方向に作用し易い。一方、各配線基板領域121の第１凹部104側の境界には、貫通孔123が位置しているため、刃先の押圧による応力が仕切り部108の方向に作用し難い。このようにして、傾斜した仕切り部108をさらに容易に実現できる。なお、配線基板領域121の外縁部を変形させる方法は、上記に限定されず、例
えば突出治具を第２凹部105に押し込んだり、圧縮エアーを第２凹部105に吹き込んで仕切り部108を第１凹部104側に傾斜させるようにしてもよい。 For example, as shown in FIG. 6, if a through hole 123 (a portion of the wiring board 100 that becomes a groove 110) is positioned so as to straddle the partition portion 108 at the boundary on the long side side of each wiring board region 121. By inserting the cutter blade into the mother substrate 120, the stress due to the pressing of the cutting edge tends to act in the direction of the partition portion 108 at the boundary on the second concave portion 105 side of each wiring board region 121. On the other hand, since the through hole 123 is located at the boundary of each wiring board region 121 on the side of the first recess 104, it is difficult for the stress due to the pressing of the cutting edge to act in the direction of the partition portion 108. In this way, the inclined partition 108 can be realized more easily. The method of deforming the outer edge portion of the wiring board region 121 is not limited to the above, and for example, a protruding jig is pushed into the second recess 105, or compressed air is blown into the second recess 105 to make the partition portion 108 the first. It may be inclined toward the recess 104 side.

また、本開示の光センサ用パッケージは、第２凹部105の深さＤ２が、第１凹部104の深さＤ１よりも大きい。このような構成により、効率よく物体に光を照射でき、クロストークによる検出精度の低下を抑制できる。つまり、図２等で示したように、第１凹部104側
の深さＤ１よりも、第２凹部105側の深さＤ２が大きいため、断面視において、発光素子106が受光素子107よりも第１面102側に位置する構成となり、第１凹部104の底部に搭載さ
れた発光素子106と、カバーとの距離が小さくなり、発光素子106の発光部111から照射さ
れる光の強度が弱まることが抑制されて、効率よく物体に照射できる。さらに、断面視において、受光素子107が発光素子106よりも第２面103側に位置する構成となり、発光素子106から照射された光のうち、物体を介さない光（クロストーク）が受光素子107に照射さ
れることが抑制され、物体から反射した光を効率よく受光素子107で受けることができる
。よって、検出精度の低下を抑制できる。 Further, in the optical sensor package of the present disclosure, the depth D2 of the second recess 105 is larger than the depth D1 of the first recess 104. With such a configuration, it is possible to efficiently irradiate an object with light and suppress a decrease in detection accuracy due to crosstalk. That is, as shown in FIG. 2 and the like, since the depth D2 on the second recess 105 side is larger than the depth D1 on the first recess 104 side, the light emitting element 106 is the second light receiving element 107 in the cross-sectional view. The configuration is such that the light emitting element 106 mounted on the bottom of the first recess 104 is located on the one side 102 side, the distance between the light emitting element 106 and the cover is reduced, and the intensity of the light emitted from the light emitting unit 111 of the light emitting element 106 is weakened. Can be suppressed and the object can be efficiently irradiated. Further, in the cross-sectional view, the light receiving element 107 is located on the second surface 103 side of the light emitting element 106, and among the light emitted from the light emitting element 106, the light (cross talk) that does not pass through an object is the light receiving element 107. Is suppressed, and the light reflected from the object can be efficiently received by the light receiving element 107. Therefore, it is possible to suppress a decrease in detection accuracy.

図２、図４、図５で示したように第２凹部105の深さが第１凹部104の深さよりも大きい構成とするには、例えば中間層となるセラミックグリーンシートを準備しておき、この中間層となるセラミックグリーンシートにおいて、深さが大きい第２凹部105を有する第２
搭載部105ａとなる領域に、第１面102となるセラミックグリーンシートに設けた第２凹部105用の孔と連通するように他の孔を形成しておき、第１面102となるセラミックグリーンシートと、第２面103となるセラミックグリーンシートとの間に、この中間層となるセラ
ミックグリーンシートを位置させればよい。これにより、第２凹部105の深さＤ２が、第
１凹部104の深さＤ１よりも大きい構成の配線基板100を製作することができる。 As shown in FIGS. 2, 4 and 5, in order to make the depth of the second recess 105 larger than the depth of the first recess 104, for example, a ceramic green sheet to be an intermediate layer is prepared. In the ceramic green sheet serving as the intermediate layer, the second recess 105 having a large depth is provided.
Another hole is formed in the area to be the mounting portion 105a so as to communicate with the hole for the second recess 105 provided in the ceramic green sheet to be the first surface 102, and the ceramic green sheet to be the first surface 102. The ceramic green sheet to be the intermediate layer may be positioned between the ceramic green sheet to be the second surface 103 and the ceramic green sheet to be the second surface 103. As a result, the wiring board 100 having a configuration in which the depth D2 of the second recess 105 is larger than the depth D1 of the first recess 104 can be manufactured.

また、図４、図５で示したように、第２凹部105の深さＤ２が、第１凹部104の深さＤ１よりも深い領域については、仕切り部108が存在しないため、第２凹部105が変形しない。よって、第２凹部105の第２面103側の絶縁基体101の厚みが小さくなっても、第２凹部105の底部の平坦度を保つことができ、第２搭載部105ａへの受光素子107の搭載性が良好となる。 Further, as shown in FIGS. 4 and 5, in the region where the depth D2 of the second recess 105 is deeper than the depth D1 of the first recess 104, the partition portion 108 does not exist, so that the second recess 105 Does not deform. Therefore, even if the thickness of the insulating substrate 101 on the second surface 103 side of the second recess 105 is reduced, the flatness of the bottom of the second recess 105 can be maintained, and the light receiving element 107 to the second mounting portion 105a can be maintained. Good mountability.

なお、図２等では、配線基板100の第１面102側に接続導体109が位置する第１搭載部104ａ、第２搭載部105ａが露出するように構成された例を示したが、これに限定されず、例
えば配線基板100の厚み方向において、第２面103側から第１面102側に貫通する２つの孔
を設けておき、これらの孔の第２面103側に、接続導体109が位置する各搭載部（図示せず）を位置させて、発光素子106の発光部111、および受光素子107の受光部112が、第１面102側の開口部から露出するように構成してもよい。さらに、絶縁基体101の貫通する孔を１つとして、配線基板100の第１面102側に接続導体109が位置する第１凹部104を位置させるとともに、１つの孔の第２面103側に、接続導体109が位置する搭載部（図示せず）を位置させておき、第１凹部104に発光素子106を搭載するとともに、第２面103側の搭載部（図
示せず）に受光素子107を搭載した構成としてもよい。このように、第２面103側の搭載部に受光素子107を搭載することにより、断面視において、受光素子107が発光素子106より
も第２面103側に位置する構成と同様の効果を得られる。なお、配線基板100の第２面103
側に受光素子107の搭載部を位置させる場合、平面視で第２面103側の搭載部と、第１面102側の第１凹部104が重なるように、広い面積で搭載部を位置させてもよい。これにより、物体との距離を検知する機能だけでなく、照度センサ等の他の機能を有する、比較的大きく多機能な受光素子107を搭載することが可能となる。 In FIG. 2 and the like, an example is shown in which the first mounting portion 104a and the second mounting portion 105a in which the connecting conductor 109 is located on the first surface 102 side of the wiring board 100 are exposed. Not limited to this, for example, in the thickness direction of the wiring board 100, two holes penetrating from the second surface 103 side to the first surface 102 side are provided, and the connecting conductor 109 is provided on the second surface 103 side of these holes. Even if each of the positioned mounting portions (not shown) is positioned so that the light emitting portion 111 of the light emitting element 106 and the light receiving portion 112 of the light receiving element 107 are exposed from the opening on the first surface 102 side. Good. Further, with one hole through which the insulating substrate 101 penetrates, the first recess 104 in which the connecting conductor 109 is located is positioned on the first surface 102 side of the wiring board 100, and the first recess 104 on the second surface 103 side of one hole is positioned. A mounting portion (not shown) in which the connecting conductor 109 is located is positioned, the light emitting element 106 is mounted in the first recess 104, and the light receiving element 107 is mounted in the mounting portion (not shown) on the second surface 103 side. It may be installed. In this way, by mounting the light receiving element 107 on the mounting portion on the second surface 103 side, the same effect as that of the configuration in which the light receiving element 107 is located on the second surface 103 side of the light emitting element 106 can be obtained in a cross-sectional view. Be done. The second surface 103 of the wiring board 100
When the mounting portion of the light receiving element 107 is positioned on the side, the mounting portion is positioned over a wide area so that the mounting portion on the second surface 103 side and the first recess 104 on the first surface 102 side overlap in a plan view. May be good. This makes it possible to mount a relatively large and multifunctional light receiving element 107 having other functions such as an illuminance sensor as well as a function of detecting a distance to an object.

本開示の多数個取り配線基板（母基板120）は、上記のいずれかに記載の光センサ用パ
ッケージ（配線基板100）が、縦横に位置している。このような構成により、誤検知や誤
動作を抑制できる光センサ用パッケージを効率よく製作できる。多数個取り配線基板に位置した各配線基板100においては、平面視で第１凹部104側に凸部114を備え、第２凹部105側に凹部115を備えた、第１凹部104と第２凹部105との仕切り部108とを有している。つまり、光センサ用パッケージとなる配線基板100を縦横に位置させることにより、母基板120となるセラミックグリーンシート積層体に、同時集約的に発光素子106を搭載する第１凹
部104、および受光素子107を搭載する第２凹部105等を設けることができる。 In the multi-component wiring board (mother board 120) of the present disclosure, the optical sensor package (wiring board 100) according to any one of the above is located vertically and horizontally. With such a configuration, it is possible to efficiently manufacture a package for an optical sensor that can suppress erroneous detection and malfunction. In each wiring board 100 located on the multi-cavity wiring board, the first concave portion 104 and the second concave portion are provided with the convex portion 114 on the first concave portion 104 side and the concave portion 115 on the second concave portion 105 side in a plan view. It has a partition 108 with 105. That is, by locating the wiring board 100 as the package for the optical sensor vertically and horizontally, the first recess 104 and the light receiving element 107 in which the light emitting element 106 is simultaneously and intensively mounted on the ceramic green sheet laminate serving as the mother substrate 120. A second recess 105 or the like on which the device is mounted can be provided.

また、仕切り部108を第１凹部104側に傾斜させるために、母基板120となるセラミック
グリーンシート積層体に、配線基板100を個片とするための分割溝124を位置させるのと同時に、各配線基板100に、第１凹部104側に傾斜した仕切り部108を設けることができるた
め、配線基板100の生産性を向上できる。 Further, in order to incline the partition portion 108 toward the first recess 104 side, at the same time as positioning the dividing groove 124 for individualizing the wiring board 100 in the ceramic green sheet laminate serving as the mother substrate 120, each Since the wiring board 100 can be provided with the partition portion 108 inclined toward the first recess 104 side, the productivity of the wiring board 100 can be improved.

例えば、図６で示したように、各配線基板領域121の長辺側の境界に、仕切り部108を跨ぐように貫通孔123（配線基板100における溝部110となる部分）を位置させておけば、母
基板120へのカッター刃の挿入により、各配線基板領域121の第２凹部105側の境界では、
刃先の押圧による応力が仕切り部108の方向に作用し易い。一方、各配線基板領域121の第１凹部104側の境界には、貫通孔123が位置しているため、刃先の押圧による応力が仕切り部108の方向に作用し難い。よって、第１凹部104側に傾斜した仕切り部108をさらに容易
に実現できるという効果がある。 For example, as shown in FIG. 6, if the through hole 123 (the portion of the wiring board 100 that becomes the groove 110) is positioned so as to straddle the partition portion 108 at the boundary on the long side side of each wiring board region 121. By inserting the cutter blade into the mother substrate 120, at the boundary on the second recess 105 side of each wiring board region 121,
The stress due to the pressing of the cutting edge tends to act in the direction of the partition 108. On the other hand, since the through hole 123 is located at the boundary of each wiring board region 121 on the side of the first recess 104, it is difficult for the stress due to the pressing of the cutting edge to act in the direction of the partition portion 108. Therefore, there is an effect that the partition portion 108 inclined toward the first recess 104 side can be realized more easily.

なお、母基板120となるセラミックグリーンシート積層体のうち、仕切り部108を含むセラミックグリーンシートと、仕切り部108を含むセラミックグリーンシートの第２面103側に位置する他のセラミックグリーンシートとの間に、平面視で仕切り部108と重なる位置
に内部配線導体（図示せず）を位置させておけば、内部配線導体となる導体ペースト中の溶剤が、仕切り部108を含むセラミックグリーンシート積層体を軟化させることにより、
この軟化した部分が、内部配線導体が位置していないセラミックグリーンシート積層体よりも変形し易くなる。よって、刃先の押圧等による配線基板領域121の外縁部の変形を促
進させることができるため、第１凹部104側に傾斜した仕切り部108を、容易に実現できる。 Of the ceramic green sheet laminate serving as the mother substrate 120, between the ceramic green sheet including the partition portion 108 and the other ceramic green sheet located on the second surface 103 side of the ceramic green sheet including the partition portion 108. If the internal wiring conductor (not shown) is positioned so as to overlap the partition portion 108 in a plan view, the solvent in the conductor paste that becomes the internal wiring conductor can form a ceramic green sheet laminate containing the partition portion 108. By softening
This softened portion is more easily deformed than the ceramic green sheet laminate in which the internal wiring conductor is not located. Therefore, since the deformation of the outer edge portion of the wiring board region 121 due to the pressing of the cutting edge or the like can be promoted, the partition portion 108 inclined toward the first recess 104 side can be easily realized.

本開示の光センサ装置200は、上記のいずれかに記載の光センサ用パッケージ（配線基
板100）と、光センサ用パッケージに搭載された発光素子106、および受光素子107とを有
している。このような構成により、検知対象の近接状態を高精度に検出できる光センサ装置200を提供できる。つまり、発光素子106から照射された光の一部は、平面視で第１凹部104側に備えられた凸部114により遮蔽されるため、発光素子106からの物体を介さない光
（クロストーク）が、第２凹部105の下側に位置する受光素子107に照射され難く、誤検知や誤動作を抑制できる。 The optical sensor device 200 of the present disclosure includes the optical sensor package (wiring substrate 100) described in any of the above, the light emitting element 106 mounted on the optical sensor package, and the light receiving element 107. With such a configuration, it is possible to provide an optical sensor device 200 capable of detecting a proximity state of a detection target with high accuracy. That is, a part of the light emitted from the light emitting element 106 is shielded by the convex portion 114 provided on the first concave portion 104 side in a plan view, so that the light from the light emitting element 106 does not pass through an object (crosstalk). However, it is difficult for the light receiving element 107 located below the second recess 105 to be irradiated, and erroneous detection and malfunction can be suppressed.

このような光センサ用パッケージを用いた光センサ装置200を図１〜図５に示す。光セ
ンサ用パッケージは、例えば図１、図３に示したように平面視で長方形状であり、配線基板100の第１面102側に、第１凹部104の底部に位置する第１搭載部104ａと、第２凹部105
を有する第２搭載部105ａが位置している。そして、第１搭載部104ａに１つの発光素子106が位置し、第２搭載部105ａに１つの受光素子107が位置するように、それぞれの素子が
各搭載部内に搭載されている。また、第１凹部104と第２凹部105との間には仕切り部108
が位置しており、仕切り部108は第１凹部104側に突出した凸部114と第２凹部104側に凹んだ凹部115を含んでいる。 The optical sensor device 200 using such an optical sensor package is shown in FIGS. 1 to 5. As shown in FIGS. 1 and 3, for example, the optical sensor package has a rectangular shape in a plan view, and the first mounting portion 104a located at the bottom of the first recess 104 on the first surface 102 side of the wiring board 100. And the second recess 105
The second mounting portion 105a is located. Then, each element is mounted in each mounting portion so that one light emitting element 106 is located in the first mounting portion 104a and one light receiving element 107 is located in the second mounting portion 105a. Further, a partition portion 108 is provided between the first recess 104 and the second recess 105.
Is located, and the partition portion 108 includes a convex portion 114 protruding toward the first concave portion 104 and a concave portion 115 recessed toward the second concave portion 104.

図１に示したように、仕切り部108の両側面（第１凹部104側と第２凹部105側の両側面
）が傾斜していない構成である場合、平面視で第１凹部104の第１搭載部104ａに搭載された発光素子106の発光部111から第１凹部104の内側面までの距離が、仕切り部108の凸部114に向かう方向が最も短い。つまり、発光素子106の発光部111から照射された光の一部が
仕切り部108で遮蔽され易くなるため、光のカバーへの入射角度θが大きくなり、カバー
に反射したクロストークが、受光素子107の受光部112に照射され難い。よって、誤検知や誤動作が抑制された光センサ装置200を実現できる。 As shown in FIG. 1, when both side surfaces of the partition portion 108 (both sides of the first recess 104 side and the second recess 105 side) are not inclined, the first of the first recess 104 in a plan view. The distance from the light emitting portion 111 of the light emitting element 106 mounted on the mounting portion 104a to the inner surface of the first concave portion 104 is the shortest in the direction toward the convex portion 114 of the partition portion 108. That is, since a part of the light emitted from the light emitting portion 111 of the light emitting element 106 is easily shielded by the partition portion 108, the incident angle θ of the light to the cover becomes large, and the crosstalk reflected by the cover is generated by the light receiving element. It is difficult to irradiate the light receiving part 112 of 107. Therefore, it is possible to realize the optical sensor device 200 in which erroneous detection and malfunction are suppressed.

さらに、図３に示したように、仕切り部108の中央部の傾斜が大きく、中央部から両端
部にかけて漸次傾斜が小さい構成であれば以下のような効果をする。つまり、発光素子106から照射された光の一部が、平面視で第１凹部104側に備えられた凸部114のうち、仕切
り部108の中央部の傾斜が大きい領域でより効果的に遮蔽され、仕切り部108の中央部から両端部にかけて漸次傾斜が小さい領域により、発光素子106の発光部111からの光を、傾斜が小さい領域の方向を介して、効率よく物体（検知対象）に照射することができる。よって、仕切り部108の中央部の傾斜が大きい領域の方向では、クロストークによる誤検知、
誤動作を抑制でき、さらに仕切り部108の両端部にかけて傾斜が小さい領域の方向では、
発光素子106の発光部111からの光を効率よく物体に照射することができ、物体から返ってくる光の強度を高めることができるため、小型化しても、検知精度が低下や誤動作が発生する可能性が低減された光センサ装置200を実現できる。 Further, as shown in FIG. 3, if the central portion of the partition portion 108 has a large inclination and the gradual inclination is small from the central portion to both end portions, the following effects are obtained. That is, a part of the light emitted from the light emitting element 106 is more effectively shielded in the region where the central portion of the partition portion 108 has a large inclination among the convex portions 114 provided on the first concave portion 104 side in a plan view. Then, the light from the light emitting portion 111 of the light emitting element 106 is efficiently irradiated to the object (detection target) through the direction of the region where the inclination is small by the region having a gradually small inclination from the central portion to both ends of the partition portion 108. can do. Therefore, in the direction of the region where the inclination of the central portion of the partition portion 108 is large, false detection due to crosstalk,
Malfunctions can be suppressed, and in the direction of the region where the inclination is small toward both ends of the partition 108,
Since the light from the light emitting unit 111 of the light emitting element 106 can be efficiently applied to the object and the intensity of the light returned from the object can be increased, the detection accuracy is lowered and malfunction occurs even if the size is reduced. It is possible to realize an optical sensor device 200 with reduced possibility.

また、第２凹部105側に凹部115を備えており、発光素子106から照射されたのち、物体
で反射されて返ってきた光が、第２凹部105の下側に位置する受光素子107に照射され易くなり、受光素子107の受光性が向上するため、物体の検知範囲を広いものとすることがで
きる。 Further, the recess 115 is provided on the second recess 105 side, and after being irradiated from the light emitting element 106, the light reflected by the object and returned irradiates the light receiving element 107 located below the second recess 105. Since the light receiving element 107 is more easily received and the light receiving property of the light receiving element 107 is improved, the detection range of the object can be widened.

また、光センサ用パッケージの第１凹部104、および第２凹部105を含む第１面102には
、蓋体202が位置していてもよい。蓋体202は、透光性のガラスや樹脂等からなり、第１凹部104の上面、および第２凹部105の上面に光が透過する窓部が位置している。さらに、第
１凹部104の上面、および第２凹部105の上面を除く領域に、光が透過しない遮蔽膜（例えば、カーボンブラックを主成分とする膜）が位置していてもよい。このような構成により、カバーに反射したクロストークをより効果的に抑制できる。なお、蓋体202の下面に位
置した遮蔽膜は光を吸収するため、発光素子106の発光部111からの光が弱まらないように、また受光素子107の受光性が低下しないように、平面視で第１凹部104の内側、および第２凹部105の内側に、光の照射や受光を妨げないように設けることが望ましい。 Further, the lid 202 may be located on the first surface 102 including the first recess 104 and the second recess 105 of the optical sensor package. The lid 202 is made of translucent glass, resin, or the like, and a window portion through which light is transmitted is located on the upper surface of the first recess 104 and the upper surface of the second recess 105. Further, a shielding film (for example, a film containing carbon black as a main component) that does not transmit light may be located in a region other than the upper surface of the first recess 104 and the upper surface of the second recess 105. With such a configuration, crosstalk reflected on the cover can be suppressed more effectively. Since the shielding film located on the lower surface of the lid 202 absorbs light, the light from the light emitting portion 111 of the light emitting element 106 is not weakened, and the light receiving property of the light receiving element 107 is not deteriorated. It is desirable to provide the inside of the first recess 104 and the inside of the second recess 105 in a plan view so as not to interfere with the irradiation or reception of light.

本開示の電子モジュール300は、接続パッド302を有するモジュール用基板301と、接続
パッド302に接合材303を介して接続された上記記載の光センサ装置200とを有している。
このような構成により、検知対象の近接状態を高精度に検出できる光センサ装置200を用
いて、動作信頼性が高い電子モジュール300を提供できる。つまり、クロストークによる
検出精度の低下を抑制し、小型化が可能な光センサ用パッケージが用いられ、誤検知や誤動作が抑制された光センサ装置200を用いて、動作信頼性に優れた電子モジュール300を実現できる。 The electronic module 300 of the present disclosure includes a module substrate 301 having a connection pad 302, and the optical sensor device 200 described above connected to the connection pad 302 via a bonding material 303.
With such a configuration, it is possible to provide the electronic module 300 with high operation reliability by using the optical sensor device 200 capable of detecting the proximity state of the detection target with high accuracy. In other words, an electronic module with excellent operation reliability is used by using an optical sensor package that suppresses deterioration of detection accuracy due to crosstalk and can be miniaturized, and by using an optical sensor device 200 that suppresses false detections and malfunctions. Can achieve 300.

図１に示したように、仕切り部108は平面視で曲線状から構成されており、発光素子106の発光部111と、受光素子107の受光部112とを直線で結んだ仮想線と、仕切り部108が交わる領域の中央部において、凸部114が最も凸部の突出幅（第１凹部104の仮想外縁Ｌ１と凸部114の外縁との距離）が大きく、仕切り部108の両端部にかけて漸次凸部114の突出幅が
小さくなるように位置しているため、図２で示したように、発光素子106から照射された
光の一部が、平面視で第１凹部104側に備えられた凸部114により遮蔽され、発光素子106
からの物体を介さない光（クロストーク）が、第２凹部105の下側に位置する受光素子107に照射され難く、誤検知や誤動作が抑制された電子モジュール300を実現できる。 As shown in FIG. 1, the partition portion 108 is formed in a curved shape in a plan view, and is divided into a virtual line connecting the light emitting portion 111 of the light emitting element 106 and the light receiving portion 112 of the light receiving element 107 with a straight line. In the central portion of the region where the portions 108 intersect, the convex portion 114 has the largest protrusion width (distance between the virtual outer edge L1 of the first concave portion 104 and the outer edge of the convex portion 114), and gradually extends toward both ends of the partition portion 108. Since the convex portion 114 is located so as to have a small protruding width, as shown in FIG. 2, a part of the light emitted from the light emitting element 106 is provided on the first concave portion 104 side in a plan view. Shielded by the protrusion 114, the light emitting element 106
It is difficult to irradiate the light receiving element 107 located below the second recess 105 with light (crosstalk) that does not pass through an object from the above, and it is possible to realize an electronic module 300 in which erroneous detection and malfunction are suppressed.

また、仕切り部108が、第１凹部104側に傾斜していれば、クロストークによる検出精度の低下を効果的に抑制し、小型化が可能な電子モジュール300を提供できる。つまり、発
光素子106から照射された光の一部が、第１凹部104側に傾斜している仕切り部108によっ
て、より効果的に遮蔽されるため、発光素子106からの物体を介さない光（クロストーク
）が、第２凹部105の下側に位置する受光素子107に照射され難く、誤検知や誤動作が抑制された電子モジュール300を実現できる。 Further, if the partition portion 108 is inclined toward the first recess 104 side, it is possible to effectively suppress a decrease in detection accuracy due to crosstalk and provide an electronic module 300 capable of miniaturization. That is, a part of the light emitted from the light emitting element 106 is more effectively shielded by the partition portion 108 inclined toward the first recess 104, so that the light from the light emitting element 106 does not pass through the object ( Crosstalk) is less likely to irradiate the light receiving element 107 located below the second recess 105, and an electronic module 300 in which erroneous detection and malfunction are suppressed can be realized.

また、仕切り部108は、中央部の傾斜が大きく、中央部から両端部にかけて漸次傾斜が
小さい構造としてもよい。このような構成により、クロストークによる検出精度の低下をより効果的に抑制し、受光素子107の受光性が向上した、物体の検知範囲が広く、小型化
が可能な電子モジュール300を実現できる。 Further, the partition portion 108 may have a structure in which the inclination of the central portion is large and the gradual inclination is small from the central portion to both end portions. With such a configuration, it is possible to realize an electronic module 300 that can more effectively suppress a decrease in detection accuracy due to crosstalk, improve the light receiving property of the light receiving element 107, have a wide object detection range, and can be miniaturized.

さらに、電子モジュール300は、平面視において、第１凹部104の幅Ｗ１が、第２凹部105の幅Ｗ２よりも大きくてもよい。また、電子モジュール300は、第２凹部105の深さＤ２
が、第１凹部104の深さＤ１よりも大きくてもよい。 Further, in the electronic module 300, the width W1 of the first recess 104 may be larger than the width W2 of the second recess 105 in a plan view. Further, the electronic module 300 has a depth D2 of the second recess 105.
However, it may be larger than the depth D1 of the first recess 104.

なお、本開示の光センサ用パッケージ、多数個取り配線基板、光センサ装置および電子モジュールは、上記実施の形態に限られるものではなく、様々な変更が可能である。例えば、発光素子として赤外線発光素子を挙げたが、これに限定されず、各種半導体レーザー素子を用いてもよい。また、受光素子として、シリコンフォトダイオード、ＧａＡｓフォトダイオード、ＩｎＧａＡｓフォトダイオード、ゲルマニウムフォトダイオード等の各種フォトダイオードを用いてもよい。発光素子および受光素子は、検知対象の種類、計測するパラメータ等により適切に選定される。 The optical sensor package, the multi-component wiring board, the optical sensor device, and the electronic module of the present disclosure are not limited to the above-described embodiment, and various modifications can be made. For example, an infrared light emitting element is mentioned as a light emitting element, but the present invention is not limited to this, and various semiconductor laser elements may be used. Further, as the light receiving element, various photodiodes such as a silicon photodiode, a GaAs photodiode, an InGaAs photodiode, and a germanium photodiode may be used. The light emitting element and the light receiving element are appropriately selected according to the type of detection target, the parameters to be measured, and the like.

さらに、受光素子107に照度センサを一体化した素子を用いてもよい。これにより、近
接センサ機能とともに、照度を検知して電子機器の省電力のために、液晶画面のバックラ
イトを制御する照度センサ機能を有する近接照度一体型の光センサ装置等とすることができる。その他、実施形態で示した細部は、発明の趣旨を逸脱しない範囲で適宜変更可能である。 Further, an element in which an illuminance sensor is integrated with the light receiving element 107 may be used. As a result, it is possible to obtain an optical sensor device integrated with proximity illuminance having an illuminance sensor function of detecting the illuminance and controlling the backlight of the liquid crystal screen in order to save power of the electronic device in addition to the proximity sensor function. In addition, the details shown in the embodiment can be appropriately changed without departing from the spirit of the invention.

100・・・光センサ用パッケージ（配線基板）
101・・・絶縁基体
102・・・第１面
103・・・第２面
104・・・第１凹部
104ａ・・第１搭載部
105・・・第２凹部
105ａ・・第２搭載部
106・・・発光素子
107・・・受光素子
108・・・仕切り部
109・・・接続導体
110・・・溝部
111・・・発光部
112・・・受光部
113・・・外部接続導体
114・・・凸部
115・・・凹部
120・・・母基板
121・・・配線基板領域
122・・・境界
123・・・貫通孔
124・・・分割溝
200・・・光センサ装置
201・・・切り欠き部
202・・・蓋体
300・・・電子モジュール
301・・・モジュール用基板
302・・・接続パッド
303・・・接合材
Ｌ１・・・第１凹部の仮想外縁
Ｌ２・・・第２凹部の仮想外縁
Ｗ１・・・第１凹部の幅
Ｗ２・・・第２凹部の幅
Ｄ１・・・第１凹部の深さ
Ｄ２・・・第２凹部の深さ
100 ・ ・ ・ Package for optical sensor (wiring board)
101 ・ ・ ・ Insulation substrate
102 ・ ・ ・ First side
103 ・ ・ ・ Second side
104 ... 1st recess
104a ... 1st mounting part
105 ・ ・ ・ Second recess
105a ... 2nd mounting part
106 ・ ・ ・ Light emitting element
107 ・ ・ ・ Light receiving element
108 ・ ・ ・ Partition
109 ・ ・ ・ Connecting conductor
110 ・ ・ ・ Groove
111 ・ ・ ・ Light emitting part
112 ・ ・ ・ Light receiving part
113 ・ ・ ・ External connecting conductor
114 ・ ・ ・ Convex part
115 ・ ・ ・ Recess
120 ・ ・ ・ Mother board
121 ・ ・ ・ Wiring board area
122 ・ ・ ・ Boundary
123 ・ ・ ・ Through hole
124 ・ ・ ・ Dividing groove
200 ・ ・ ・ Optical sensor device
201 ・ ・ ・ Notch
202 ・ ・ ・ Lid
300 ・ ・ ・ Electronic module
301 ・ ・ ・ Module board
302 ・ ・ ・ Connection pad
303 ... Joining material L1 ... Virtual outer edge of the first recess L2 ... Virtual outer edge of the second recess W1 ... Width of the first recess W2 ... Width of the second recess D1 ... First Depth of recess D2 ・ ・ ・ Depth of second recess

Claims (8)

絶縁基体であり、
該絶縁基体は、
第１面と、
該第１面側に開口し、発光素子が位置する第１凹部と、
前記第１面側に開口し、前記第１凹部に並んで位置し、受光素子が位置する第２凹部と、前記第１凹部と前記第２凹部との間に位置する仕切り部と、を有し、
該仕切り部は、前記第１面の平面視において前記第１凹部に向かって突出した凸部を有する光センサ用パッケージ。 It is an insulating substrate
The insulating substrate is
The first side and
A first recess that opens to the first surface side and where the light emitting element is located,
It has a second recess that opens to the first surface side, is located side by side with the first recess, and a light receiving element is located, and a partition portion that is located between the first recess and the second recess. And
The partition portion is a package for an optical sensor having a convex portion protruding toward the first concave portion in a plan view of the first surface. 前記仕切り部は、前記第１凹部と前記第２凹部とが並んだ方向に垂直な方向の中央部に前記凸部が位置している、請求項１に記載の光センサ用パッケージ。 The package for an optical sensor according to claim 1, wherein the partition portion is located at a central portion in a direction perpendicular to the direction in which the first concave portion and the second concave portion are arranged. 前記仕切り部は、両端部から前記中央部にかけて漸次突出が大きくなっていることを特徴とする、請求項２に記載の光センサ用パッケージ。 The package for an optical sensor according to claim 2, wherein the partition portion gradually increases in protrusion from both end portions to the central portion. 平面視において、前記第１凹部の幅が、前記第２凹部の幅よりも大きいことを特徴とする、請求項１乃至請求項３のいずれかに記載の光センサ用パッケージ。 The package for an optical sensor according to any one of claims 1 to 3, wherein the width of the first recess is larger than the width of the second recess in a plan view. 前記第２凹部の深さが、前記第１凹部の深さよりも大きい、ことを特徴とする請求項１乃至請求項４のいずれかに記載の光センサ用パッケージ。 The package for an optical sensor according to any one of claims 1 to 4, wherein the depth of the second recess is larger than the depth of the first recess. 請求項１乃至請求項５のいずれかに記載の光センサ用パッケージが、縦横に位置していることを特徴とする、多数個取り配線基板。 A multi-component wiring board, characterized in that the optical sensor package according to any one of claims 1 to 5 is located vertically and horizontally. 請求項１乃至請求項５のいずれかに記載の光センサ用パッケージと、該光センサ用パッケージに搭載された発光素子、および受光素子とを有していることを特徴とする光センサ装置。 An optical sensor device comprising the package for an optical sensor according to any one of claims 1 to 5, a light emitting element mounted on the package for the optical sensor, and a light receiving element. 接続パッドを有するモジュール用基板と、前記接続パッドに接合材を介して接続された請求項７に記載の光センサ装置とを有することを特徴とする電子モジュール。
The electronic module according to claim 7, further comprising a module substrate having a connection pad and the optical sensor device according to claim 7, which is connected to the connection pad via a bonding material.
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